Inspection apparatus, position adjustment unit, and position adjustment method

Abstract

This invention provides an inspection apparatus that, instead of relying on the operator's sense of touch, allows for highly precise adjustment of the initial alignment of the probe relative to the electrode pads. The apparatus uses a contact that makes electrical contact with the electrode of the object being inspected to check its electrical characteristics. The apparatus includes: a position adjustment unit having a contact, a position adjustment section for adjusting the position of the contact tip, and a load detection section for detecting the contact load value between the contact and the electrode; a position derivation section that derives the initial position of the contact in a specific direction based on the relationship between the contact displacement of the contact in a specific direction and the contact load value between the contact and the electrode; and a movement execution unit that moves the position of the contact tip based on the initial position derived by the position derivation section in the specific direction.

Description

Technical Field

[0001] The present invention relates to an inspection apparatus, a position adjustment unit, and a position adjustment method, for example, an inspection apparatus applicable to inspecting the electrical characteristics of semiconductor integrated circuits on a semiconductor wafer. Background Technology

[0002] For example, there is an inspection apparatus that inspects the electrical characteristics of specific devices in a semiconductor integrated circuit (device) formed on a semiconductor wafer (see Patent Document 1).

[0003] This inspection device comes in various types, such as Figure 5 and Figure 6 As shown, there is an inspection device equipped with a position adjustment unit, which allows the operator to manually fine-tune the position of the tip of the probe.

[0004] like Figure 7 As shown, the position adjustment unit 9 of the existing inspection device has: an X knob 91 for fine-tuning the X-direction position of the probe 97; a Y knob 92 for fine-tuning the Y-direction position; and a Z knob 93 for fine-tuning the Z-direction position. The operator operates the X knob 91, Y knob 92, and Z knob 93 to fine-tune the position of the probe 97 by making contact between the tip of the probe 97 and the electrode pad of the device.

[0005] The following is for reference Figure 8 This section briefly explains the method for initially setting the probe position relative to the electrode pads of the device.

[0006] First, the operator uses a microscope or camera to identify the electrode pads 80 and probes 97 of the device. The operator operates the X knob 91 and Y knob 92 to align the probes 97 in the XY plane (see reference). Figure 8 (A)).

[0007] For example, Figure 8 (A) is a top view of the upper surface of electrode pad 80 from above. This is when the tip of probe 97 is not located approximately in the center of electrode pad 80 (see reference). Figure 8 (A-1) The operator operates the X knob 91 and the Y knob 92 to move the tip of the probe 97 in a two-dimensional direction, so that the tip of the probe 97 is approximately at the center of the electrode pad 80 (refer to...). Figure 8 (A-2)

[0008] Next, the operator operates the Z knob 93 to lower the tip of probe 97 in the Z direction. At this point, the tip of probe 97 is lowered until it contacts the electrode pad 80 (refer to...). Figure 8(B-1)). Then, the operator operates the Z knob 93 to gradually lower the position of the probe 97 until the tip of the probe 97 slides on the surface of the electrode pad 80 (see reference). Figure 8 (B-2)).

[0009] Existing technical documents

[0010] Patent documents

[0011] [Patent Document 1]: Japanese Patent Application Publication No. 2003-142536 Summary of the Invention

[0012] The problem the invention aims to solve

[0013] In recent years, the wiring patterns on semiconductor wafers and the electrode pads of devices have become increasingly miniaturized. Consequently, the alignment of probes, which are responsible for transmitting and receiving electrical signals, has become more challenging. Therefore, there is a need for an inspection device that can perform probe alignment with high precision using a simpler operating method than before.

[0014] However, as mentioned above, the initial setting method for the probe position depends entirely on the operator's intuition, especially regarding the alignment of the probe in the Z direction, which requires capturing movements of about a few micrometers (μm).

[0015] For example, failure to properly align the probe in the Z direction can be a major cause of probe breakage and electrode pad damage, and it can also affect the quality of device inspection.

[0016] Therefore, there is a need for an inspection device, a position adjustment unit, and a position adjustment method that can precisely adjust the initial alignment of the probe relative to the electrode pad without relying on the operator's sense of touch.

[0017] Methods for solving problems

[0018] To address the problem, the first invention is characterized in that, in an inspection apparatus for inspecting the electrical characteristics of an object by using a contact that makes electrical contact with an electrode of the object being inspected, the apparatus comprises: (1) a position adjustment unit having a contact, a position adjustment section for adjusting the position of the tip of the contact, and a load detection section for detecting the contact load value between the contact and the electrode; (2) a position derivation section for deriving an initial position of the contact in a specific direction based on the relationship between the contact displacement of the contact in a specific direction and the contact load value between the contact and the electrode; and (3) a movement execution section for moving the tip position of the contact based on the initial position in the specific direction derived by the position derivation section.

[0019] The second feature of the present invention is that the position adjustment unit for adjusting the position of the tip of the contact that makes electrical contact with the electrode of the test object includes: (1) a position adjustment unit that adjusts the position of the tip of the contact; (2) a load detection unit that detects the contact load value between the contact and the electrode; (3) a position derivation unit that derives the initial position of the contact in a specific direction based on the relationship between the contact displacement of the contact in a specific direction and the contact load value of the contact and the electrode; and (4) a movement execution unit that moves the tip position of the contact based on the initial position in the specific direction derived by the position derivation unit.

[0020] The third feature of the present invention is a position adjustment method for adjusting the tip position of a contact that is in electrical contact with an electrode by means of a position adjustment unit, the position adjustment unit having: a contact; a position adjustment part that adjusts the tip position of the contact; and a load detection part that detects the contact load value between the contact and the electrode of the object being inspected. In the position adjustment method, (1) a position derivation part derives an initial position of the contact in a specific direction based on the relationship between the contact displacement of the contact in a specific direction and the contact load value of the contact and the electrode; and (2) a movement execution part moves the tip position of the contact based on the initial position in the specific direction derived by the position derivation part.

[0021] The effects of the invention

[0022] According to the present invention, the initial alignment of the probe relative to the electrode pad can be adjusted with high precision. Attached Figure Description

[0023] Figure 1 This is a configuration diagram showing the structure of the position adjustment unit in the implementation method.

[0024] Figure 2 This is a configuration diagram showing the configuration of the fine-tuning process in the Z direction in the implementation method.

[0025] Figure 3 This is a flowchart illustrating the initial setting process of the probe position performed by the position adjustment unit in the embodiment.

[0026] Figure 4 This is a graph showing the relationship between the output value of the load converter and the displacement of the probe in the Z direction in the implementation method.

[0027] Figure 5 This is a structural diagram showing the approximate appearance of the inspection device according to the embodiment.

[0028] Figure 6 This is a top view of the position adjustment unit of the inspection device in the embodiment, viewed from above.

[0029] Figure 7This is a configuration diagram showing the structure of the position adjustment unit mounted in an existing inspection device.

[0030] Figure 8 These are top views showing the state of contact between the probe and the electrode pad in an existing inspection apparatus, viewed from above, and side views showing the state of contact between the probe and the electrode pad in an existing inspection apparatus, viewed from the side. Detailed Implementation

[0031] (A) Implementation Method

[0032] Hereinafter, embodiments of the inspection device, position adjustment unit, and position adjustment method of the present invention will be described in detail with reference to the accompanying drawings.

[0033] (A-1) Configuration of the Embodiment

[0034] (A-1-1) Inspection device

[0035] The inspection device in this embodiment has essentially the same or corresponding configuration as existing inspection devices. Therefore, in this embodiment, it is also used... Figure 5 as well as Figure 6 Explain the composition of the inspection device.

[0036] Figure 5 This is a schematic diagram showing the configuration of the inspection device according to the embodiment. Figure 6 This is a top view of the position adjustment unit of the inspection device in the embodiment, viewed from above.

[0037] exist Figure 5 In this embodiment, the inspection device 1 has a frame 20, within which are a plurality of position adjustment units 10, a worktable 21, and a worktable drive unit 22. Furthermore, the inspection device includes a microscope 23.

[0038] Inspection device 1 inspects the electrical characteristics of a semiconductor integrated circuit (device) formed on a semiconductor wafer, which is placed on the upper surface of stage 21.

[0039] exist Figure 5 The image shows the state in which most of the components of the inspection device 1 are housed in the frame 20 and the frame 20 of the inspection device 1 is placed on the worktable 5.

[0040] The interior of the frame 20 of the inspection device 1 is a space, and a plate member 25 is provided inside the frame 20. The frame 20 is divided into an upper section 26, which is the upper interior space, and a lower section 27, which is the lower interior space, through the plate member 25.

[0041] A semiconductor wafer mounting stage 21 and a stage drive unit 22 for driving the stage 21 are provided in the lower section 27 of the frame 20. In addition, multiple position adjustment units 10 are provided in the upper section 26 of the frame 20.

[0042] A circular opening 251 is provided on the plate member 25 disposed within the frame 20, and a plurality of position adjustment units 10 are arranged around the periphery of the opening 251. For example... Figure 6 As shown, each position adjustment unit 10 can make the probe 17 electrically contact the electrode pads of the device on the semiconductor wafer placed on the worktable 21 through the opening 251.

[0043] Before the inspection is carried out, the inspection device 1 performs initial alignment (initial contact) of the probes 17 of each position adjustment unit 10 to make electrical contact with the electrode pads of the device on the semiconductor wafer.

[0044] The inspection device 1 is equipped with a microscope 23 for the operator to observe the fine components on the semiconductor wafer. Alternatively, the inspection device 1 may replace the microscope 23 or, based on the microscope 23, be equipped with a camera (capturing device) such as a CCD camera to display the images captured by the camera on a display unit such as a monitor.

[0045] During inspection, the inspection device 1 provides an electrical signal to the electrode pads of the device via the probe 17 of the position adjustment unit 10. Conversely, when the device outputs an electrical signal, the signal is provided to the inspection device 1 via the probe 17. The inspection device 1 inspects the electrical characteristics of the device based on the value of the electrical signal from the device and / or the value of the electrical signal received from the device.

[0046] (A-1-2) Position Adjustment Unit

[0047] Figure 1 This is a perspective view showing the configuration of the position adjustment unit 10 in the embodiment.

[0048] exist Figure 1 In this unit, the position adjustment unit 10 includes: a main body 100, an X-direction position adjustment part (hereinafter referred to as "X knob") 11, a Y-direction position adjustment part (hereinafter referred to as "Y knob") 12, a Z-direction position adjustment part (hereinafter referred to as "Z knob") 13, a Z knob drive part 18, a load converter 19, an isolator 15, an arm support part 14, an L-arm part 16, and a probe 17.

[0049] The position adjustment unit 10 adjusts the position of the cantilever probe, which has a straight probe 17 mounted on the top of the L-arm 16, so that the probe 17 makes electrical contact with the electrode pads of the device on the semiconductor wafer. The position adjustment unit 10 adjusts the position of the probe 17 by the operator's operation, and is therefore also called a robotic arm.

[0050] Furthermore, the position adjustment unit 10 is not limited to any configuration that includes a cantilever probe. Figure 1 The configuration shown can also be modified, for example, by providing a straight arm instead of the L-arm 16, which supports the probe 17. In summary, the position adjustment unit 10 adjusts the position of the cantilever probe.

[0051] Probe 17 is formed of a conductive material and is a contact that makes electrical contact with the surface of the electrode pads of the device. Probe 17 is a straight contact, with one end supported on the L-arm 16 and the other end (also referred to as the "top portion") in contact with the electrode pads. Therefore, probe 17 is a cantilever probe.

[0052] L-arm 16 is a support member for supporting probe 17. L-arm 16 is formed of conductive material, and one end of L-arm 16 (e.g., the lower end) supports probe 17, while the other end (e.g., the upper end) is connected to wiring (not shown), which transmits electrical signals to the inspection device 1 side.

[0053] The arm support portion 14 is a component that supports the L-arm portion 16. In this case, the arm support portion 14 is provided at one end of the isolator 15. For example, the arm support portion 14 has a groove that supports a component portion extending in the vertical direction (Z direction) of the L-arm portion 16, in which the vertical component of the L-arm portion 16 is embedded and supported.

[0054] The isolator 15 is formed of insulating material. The isolator 15 is located between the arm support 14 and the load converter 19 to prevent power from being supplied to the load converter 19 and the main body 100 during inspection.

[0055] The load converter 19 converts the load (load value) acting on the cantilever probe 17 into an electrical signal and provides the signal value to the control unit 243 of the inspection device 1.

[0056] The load converter 19 only needs to be able to measure the magnitude of the force (load) when the tip of the cantilever probe 17 contacts the electrode pad; for example, a load sensor for detecting load can be used. The load converter 19 is disposed between the main body 100 and the L-arm 16.

[0057] For example, such as Figure 1As shown, the load transducer 19, serving as a load sensor, has two strain gauges 191 and 192 on its upper surface and two strain gauges 193 and 194 on its lower surface. When pressure is applied when the probe 17 contacts the electrode pad, the load transducer 19 deforms (e.g., flexes), causing the strain gauges 191-194 to also deform, resulting in a change in their resistance values. Therefore, when an input voltage is applied to the load transducer 19, the output voltage corresponds to the change in the resistance values ​​of the strain gauges 191-194. Thus, based on the value of the output voltage from the load transducer 19, the magnitude of the force exerted when the probe 17 contacts the electrode pad is determined.

[0058] The X knob 11, Y knob 12, and Z knob 13 are adjustment knobs for the position adjustment mechanism that finely adjusts the position of the tip of the probe 17. The X knob 11 is the adjustment knob for the fine adjustment mechanism in the X direction, and the Y knob 12 is the adjustment knob for the fine adjustment mechanism in the Y direction.

[0059] Z knob 13 is an adjustment knob for the Z-direction fine adjustment mechanism. Z knob 13 is driven by a Z knob drive unit 18, for example, from a motor. That is, while X knob 11 and Y knob 12 are manually operated by the operator, similar to conventional position adjustment units, Z knob 13 is moved automatically by the Z knob drive unit 18. In other words, the position adjustment unit 10 automatically performs fine adjustments to the Z-direction position of the probe 17.

[0060] Figure 2 This is a configuration diagram showing the configuration of the fine-tuning process in the Z direction in the implementation method.

[0061] exist Figure 2 The Z-direction fine adjustment processing configuration includes a load converter 19, a differential amplifier circuit 241, an A / D converter 242, a control unit 243, a motor control unit 244, and a Z-knob drive unit 18.

[0062] When an input voltage is applied to the load converter 19, the resistance values ​​of the strain gauges 191 to 194 change due to the deformation of the strain gauges, and the output voltage changes accordingly.

[0063] The differential amplifier circuit 241 takes two voltage values ​​output from the load converter 19 as input, amplifies the differential value after differential gain of the two voltage values, and then outputs it to the A / D converter 242.

[0064] The A / D converter 242 converts the output value (analog signal) from the differential amplifier circuit 241 into a digital signal and provides it to the control unit 243.

[0065] The control unit 243 controls the Z-direction displacement of the probe 17 based on the load value output from the load converter 19. The control unit 243 can be a device equipped with a CPU, ROM, RAM, EEPROM, input / output interface, etc. The control unit 243 performs fine-tuning in the Z-direction by executing a processing program (such as a Z-direction adjustment program) stored in the ROM through the CPU.

[0066] The method for fine-tuning the Z-direction during the initial contact of the probe 17 by the control unit 243 will be described in detail in the operation section, but the control unit 243 has the function of a position derivation unit for deriving the initial setting position of the Z-direction.

[0067] The motor control unit 244, under the control of the control unit 243, drives the Z-knob drive unit 18. The control method of the motor control unit 244 is also described in detail in the operation section.

[0068] The Z-knob drive unit 18 can be, for example, a motor, and is controlled by the motor control unit 244 to drive the Z-knob 13. By driving the Z-knob 13 through the Z-knob drive unit 18, the Z-direction position of the probe 17 is moved.

[0069] (A-2) Operation of the implementation method

[0070] Next, the initial setting process of the probe 17 position performed by the position adjustment unit 10 of the embodiment will be described with reference to the accompanying drawings.

[0071] Figure 3 This is a flowchart illustrating the initial setting process of the probe 17 position performed by the position adjustment unit 10 in the embodiment. Figure 4 This is a graph showing the relationship between the output value of the load converter 19 and the displacement of the probe 17 in the Z direction.

[0072] The semiconductor wafer, which is to be inspected, is placed on the worktable 21. The operator operates the worktable drive unit 22 to align the worktable 21 with the appropriate position.

[0073] The operator uses a microscope to identify the electrode pads and probe 17 of the device on the semiconductor wafer. Then, the operator operates the X knob 11 and the Y knob 12 to move the probe 17 in a two-dimensional direction in the XY plane, aligning it so that the tip of the probe 17 is approximately centered on the electrode pad (S101).

[0074] After the alignment of the probe 17 in the two-dimensional direction is completed, the operator operates the Z knob 13 to lower the probe 17 in the Z direction, so that the tip of the probe 17 approaches the electrode pad (S102). In addition, the S102 process is performed manually by the operator in order to effectively align the probe 17, but it can also be performed automatically.

[0075] Next, for example, when the operator turns on a switch to start setting, the initial setting process of the Z-direction position of probe 17 begins.

[0076] A specified voltage is applied to the load converter 19, and the load converter 19 is able to detect the load.

[0077] The control unit 243 instructs the motor control unit 244 to lower the probe 17 in the Z direction. Upon receiving the instruction, the motor control unit 244 drives the Z knob drive unit 18, causing the probe 17 to begin lowering in the Z direction (S103).

[0078] At this time, for example, the motor control unit 244 causes the probe 17 to descend in the Z direction at 1 micrometer intervals. The control unit 243 compares the output voltage value of the load converter 19 that detects the contact load between the probe 17 and the electrode pad with a preset pressure dead zone threshold (S104).

[0079] Then, if the output voltage value is less than the pressure dead zone threshold (S104 / Yes), the process returns to S103, and the control unit 243 continues to instruct the motor control unit 244 to lower the probe 17 in the Z direction. On the other hand, if the output voltage value is greater than or equal to the pressure dead zone threshold (S104 / No), the process proceeds to S105.

[0080] Here, the pressure dead zone refers to the range in which the tip of the descending probe 17 is considered to be in an unstable contact state relative to the surface of the electrode pad. That is, it cannot be said that the probe 17 is reliably in contact with the electrode pad, and the pressure (reaction force) caused by the contact load is also an unstable state.

[0081] Therefore, using the pressure dead zone threshold, which is considered to be outside the pressure dead zone region, when the output voltage value of the load converter 19 is less than the pressure dead zone threshold, it is determined that the pressure (reaction force caused by the contact load) is small, and the contact state is unstable. Conversely, when the output voltage value of the load converter 19 is above the pressure dead zone threshold, it is considered that the pressure is large enough that the probe 17 makes reliable contact.

[0082] In S103 and S104, in order to eliminate unstable contact conditions, the probe 17 is gradually lowered, and the output voltage value of the load converter 19 is compared with the pressure dead zone threshold to detect the state of reliable contact between the probe 17 and the electrode pad.

[0083] Furthermore, the operation of the motor control unit 244 and the Z-knob drive unit 18 will be briefly explained. For example, when the Z-knob drive unit 18 is a stepper motor, the motor control unit 244 outputs a pulse signal to the Z-knob drive unit 18 that is proportional to the rotation angle of the Z-knob drive unit 18, which corresponds to the amount of rotation of the Z-knob 13 that causes the probe to descend by 1 micrometer. Thus, for example, the probe 17 can be gradually lowered in increments of 1 micrometer.

[0084] In S105, when the output voltage of the load converter 19 is above the pressure dead zone threshold, the control unit 243 reads the displacement of the probe 17 descending in the Z direction. Figure 4 z1) and the output value of load converter 19 ( Figure 4 f1), and save (z1, f1)(S105).

[0085] Next, the control unit 243 further lowers the Z-direction position of the probe 17 by a preset downward displacement amount (e.g., 50 μm, etc.) (S106). For example, after saving the value of the displacement z1 of the probe 17, the control unit 243 resets the displacement of the probe 17 to zero. Then, the control unit 243 sets the preset downward displacement value and instructs the motor control unit 244 to lower the probe 17 by the downward displacement amount. The motor control unit 244 drives the Z-knob drive unit 18 to lower the probe 177 by the downward displacement amount.

[0086] Then, the control unit 243 reads the displacement of the probe 17, which has decreased by a preset amount of displacement. Figure 4 z2) and the output value of load converter 19 at this time ( Figure 4 f2), and save (z2, f2) (S107).

[0087] Next, the control unit 243 substitutes (z1, f1) and (z2, f2) into equation (1) to derive the initial setting value z0 of the probe 17 in the Z direction relative to the electrode pad (S108).

[0088] z0=z1-f1 / [(f2-f1) / (z2-z1)]…(1)

[0089] Here, we explain equation (1). In equation (1), [(f2-f1) / (z2-z1)] represents the change in load per unit displacement in the Z direction. This is because, in the case of a cantilever probe, the change in load per unit displacement in the Z direction is calculated by utilizing the proportional relationship between the displacement in the Z direction and the reaction force (change in load).

[0090] In S106, the position of probe 17 is lowered by a predetermined amount of descent, but this is to determine the relationship (proportional relationship) between the displacement in the Z direction and the reaction force (load change). Therefore, the value of the descent displacement of probe 17 can be any value.

[0091] Furthermore, the relationship between the displacement in the Z direction and the reaction force (load change) requires that the probe 17 be in stable contact with the electrode pad. Therefore, in order to eliminate unstable contact of the probe 17, in S103 and S104, it is determined that the probe 17 is in stable contact based on the output voltage value of the load converter 19 and the pressure dead zone threshold.

[0092] If the initial setting value z0 of probe 17 in the Z direction is derived, the control unit 243 instructs the motor control unit 244 to lower probe 17 to the initial setting value in the Z direction. Upon receiving this instruction, the motor control unit 244 activates the Z knob drive unit 18, which in turn activates the Z knob 13, thereby lowering probe 17 to the initial setting value z0 in the Z direction and performing initial alignment of probe 17 (S109).

[0093] As described above, the operator operates the X knob 11 and the Y knob 12 to finely adjust the position of the probe 17 on the XY plane. Then, for the Z-direction position of the probe 17, the probe 17 automatically descends to the initial set position derived by the control unit 243. Thus, the initial set position in the Z-direction at the first contact of the probe 17 can be adjusted with high precision.

[0094] (A-3) Effects of the implementation plan

[0095] As described above, according to this embodiment, by automating the alignment of the probe, which depends on the operator's personal sense, the initial alignment of the probe can be adjusted with high precision.

[0096] Furthermore, according to this embodiment, even if the stage (chuck) for placing semiconductor wafers tilts during movement, the probes can be automatically aligned, thus ensuring stable contact with the same precision anywhere.

[0097] Furthermore, according to this embodiment, the relationship between the displacement in the Z direction and the reaction force (load change) can be obtained, so the operator can automatically make contact with any pressure or with any probe overdrive.

[0098] (B) Other implementation methods

[0099] Various modified embodiments have been mentioned in the above embodiments, but the present invention can also be applied to the following modified embodiments.

[0100] (B-1) The relationship between the displacement in the Z direction and the reaction force (load change) can be derived as long as at least two points, namely the Z-direction position and the load (reaction force) value, are known. Therefore, as long as at least two points, namely the Z-direction position and the load (reaction force) value, can be obtained after the probe 17 has made stable contact with the electrode pad, the method described above is not limited to the method described above.

[0101] For example, in the above embodiment, a pre-set descent displacement of 50 μm is illustrated. However, the value of the descent displacement is not limited to 50 μm; any value that allows us to obtain the relationship between the displacement in the Z direction and the reaction force (load change) is acceptable. In this case, since the electrode pads and / or the probe 17 may be damaged when the probe 17 is lowered, it is desirable to take these factors into account when determining the value of the descent displacement.

[0102] Furthermore, for example, in the above embodiment, point 2 illustrates the case where the control unit 243 lowers the probe 17 by a certain amount of displacement in the Z direction, and the load value f2 at that time is determined, but it is not limited to this. For example, the control unit may also lower the probe 17 until the output value from the load converter 19 becomes a preset load value, and determine the Z direction position when the output value becomes the preset load value. In this case, point 2 can be obtained, and therefore the same effect as in the above embodiment can be achieved.

[0103] In addition, if there are at least 2 points, the relationship between the displacement in the Z direction and the reaction force (load change) can be obtained, but the relationship between the Z direction position and the load (reaction force) value can also be 3 points or more.

[0104] (B-2) The position adjustment method in the above-mentioned inspection device 1 can be performed each time the electrical characteristics of the device are inspected. Figure 3 The illustrated process, or any process that can be used in Figure 3 The relationship between the displacement in the Z direction and the reaction force (load change) obtained from the calculation can be omitted from each inspection. Figure 3 The processing.

[0105] In other words, it is possible to perform inspections on each chip being inspected. Figure 3 In the process, the load change value per unit length (the slope of the proportional relationship between the displacement in the Z direction and the load change value) is calculated. Alternatively, if the load change value per unit length has been calculated, the Z-direction position of probe 17 can be finely adjusted using this load change value per unit length.

[0106] For example, in Figure 3In the process, after the probe position is initially set, if there is a positional offset for the chip being inspected, or if the types of chips being inspected are different, it is preferable to calculate the slope for each chip being inspected. On the other hand, for example, when chips of the same type are being inspected, the slope can be used directly. Therefore, in this case, the Z-direction position of probe 17 can be set without recalculating the slope.

[0107] (B-3) Equation (1) is the load change per unit length derived from (z1, f1) and (z2, f2), and the proportional formula of the load change per unit length is the formula for the value of Z when F = 0 through the point (z1, f1).

[0108] Equation (1) is one example, but it is not limited to this equation. It can also be an equation that derives the value of Z when F = 0 through the point (z2, f2).

[0109] Symbol Explanation

[0110] 1…Inspection device, 10…Position adjustment unit, 11…X knob, 12…Y knob, 13…Z knob, 14…Arm support, 15…Isolator, 16…L arm, 17…Probe, 18…Z knob drive, 19…Load converter, 20…Frame, 21…Workbench, 22…Workbench drive, 23…Microscope, 25…Panel component, 26…Upper section, 27…Lower section, 80…Electrode pad, 100…Main body, 191…Strain gauge, 192…Strain gauge, 193…Strain gauge, 194…Strain gauge, 241…Differential amplifier circuit, 242…A / D converter, 243…Control unit, 244…Motor control unit, 251…Opening.

Claims

1. An inspection device that uses contacts that are in electrical contact with the electrodes of an object to inspect the electrical characteristics of the object, the inspection device being characterized by comprising: A position adjustment unit includes the contact, a position adjustment part for adjusting the position of the top end of the contact, and a load detection part for detecting the contact load value between the contact and the electrode; The position derivation unit derives the initial position of the contact in a specific direction based on the relationship between the contact displacement of the contact in a specific direction and the contact load values ​​of the contact and the electrode. as well as The moving actuator moves the tip position of the contact based on the initial position in a specific direction derived by the position derivation unit. After the contactor comes into contact with the electrode, the position derivation unit measures at least two measurement results, which include the contact displacement of the contactor in a specific direction and the contact load value at that time. The initial position of the contact in a specific direction is derived using the load change value per unit length and the measurement results, wherein the load change value per unit length is derived using two or more of the measurement results.

2. The inspection device according to claim 1, characterized in that, The contact is a cantilever contact. The position derivation unit derives the initial position of the contact in a specific direction based on the proportional relationship between the contact displacement of the contact in a specific direction and the contact load value of the contact and the electrode.

3. A position adjustment unit for adjusting the position of the tip of a contact that makes electrical contact with an electrode of an object being examined, the position adjustment unit being characterized by having: A position adjustment unit that adjusts the position of the tip of the contact; A load detection unit detects the contact load value between the contact and the electrode; A position derivation unit, based on the relationship between the contact displacement of the contact in a specific direction and the contact load values ​​of the contact and the electrode, derives the initial position of the contact in a specific direction; and The moving actuator moves the tip position of the contact based on the initial position in a specific direction derived by the position derivation unit. After the contactor comes into contact with the electrode, the position derivation unit measures at least two measurement results, which include the contact displacement of the contactor in a specific direction and the contact load value at that time. The initial position of the contact in a specific direction is derived using the load change value per unit length and the measurement results, wherein the load change value per unit length is derived using two or more of the measurement results.

4. A position adjustment method, wherein a position adjustment unit is used to adjust the position of the tip of a contact that is in electrical contact with an electrode of an object being examined, the position adjustment unit comprising: Contact; A position adjustment section that adjusts the position of the tip of the contact; and The load detection unit detects the contact load value between the contact and the electrode. The position adjustment method is characterized in that... The position derivation unit derives the initial position of the contact in a specific direction based on the relationship between the contact displacement of the contact in a specific direction and the contact load values ​​of the contact and the electrode. The moving actuator moves the tip position of the contact based on the initial position in a specific direction derived by the position derivation unit. After the contactor comes into contact with the electrode, the position derivation unit measures at least two measurement results, which include the contact displacement of the contactor in a specific direction and the contact load value at that time. The initial position of the contact in a specific direction is derived using the load change value per unit length and the measurement results, wherein the load change value per unit length is derived using two or more of the measurement results.

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