Capacitor structure and manufacturing method, circuit board

Abstract

This invention discloses a capacitor structure and its manufacturing method, as well as a circuit board. The capacitor structure includes a threaded component, a circuit board body, and a first dielectric layer. The threaded component itself is insulated. A first electrode layer plated on its outer periphery acts as one electrode of the capacitor. A second electrode layer plated on the wall of a first via opposite the outer periphery of the threaded component acts as the other electrode of the capacitor. The first dielectric layer between the threaded component and the wall of the first via acts as the capacitor dielectric. By screwing the threaded component into or out of the threaded hole, the depth of screwing in can be adjusted to regulate different capacitance values. This capacitor structure, by using a threaded component and vias to form the capacitor, allows the capacitor to be directly integrated onto the PCB, increasing the compactness of the PCB structure. Furthermore, the structure is relatively simple, avoiding embedded structures and reducing the difficulty of PCB manufacturing.

Description

Technical Field

[0001] This invention relates to the field of capacitors, and in particular to a capacitor structure and manufacturing method, and a circuit board. Background Technology

[0002] As the wiring density of PCBs (Printed Circuit Boards) increases, space on PCBs becomes increasingly precious, and wiring becomes more complex. To improve the utilization of PCB space, technologies such as embedded capacitors and resistors can be used to directly integrate components with the PCB, saving more crimping space and reducing the crimping process, thereby improving efficiency and reducing costs.

[0003] Existing embedded capacitor technology involves adding dielectric material between the first surface of the power layer and the first surface of the ground layer, and then laminating the printed circuit board to form an inter-plate capacitor. However, this method presents many problems during PCB manufacturing, such as delamination and bubbling, making PCB fabrication quite difficult. Summary of the Invention

[0004] The purpose of this invention is to at least solve one of the technical problems existing in the prior art, and to propose a capacitor structure that can be integrated on a PCB and is relatively easy to manufacture.

[0005] Furthermore, the present invention also proposes a circuit board having the above-described capacitor structure.

[0006] The present invention also proposes a method for manufacturing the above-mentioned capacitor structure.

[0007] According to a first aspect of the present invention, a capacitor structure is provided, comprising:

[0008] A threaded component, wherein the threaded component is made of insulating material and a first electrode layer is plated on the outer periphery of the threaded component;

[0009] A circuit board body, wherein a first via is provided on the circuit board body, and a second electrode layer is plated on the wall surface of the first via; and

[0010] A first dielectric layer is filled in the first through hole in an annular shape. A threaded hole is provided on the inner side of the first dielectric layer, and the threaded component is threadedly engaged with the threaded hole.

[0011] The aforementioned capacitor structure has at least the following advantages: This capacitor structure, by using threaded components and vias to form the capacitor, allows for direct integration onto the PCB, increasing the compactness of the PCB structure. Furthermore, the structure is relatively simple, avoiding embedded structures and reducing the difficulty of PCB manufacturing. Specifically, the threaded component itself is insulated, and the first electrode layer plated on its outer periphery acts as one electrode of the capacitor. The second electrode layer plated on the wall of the first via, opposite the outer periphery of the threaded component, acts as the other electrode of the capacitor. The first dielectric layer between the threaded component and the wall of the first via acts as the capacitor dielectric. Different capacitance values ​​can be adjusted by screwing the threaded component into or out of the threaded hole to change the screw depth. Additionally, the threaded component itself has a self-locking function, preventing slippage after being fixed in position, thus increasing the reliability of the capacitor structure. Moreover, the disassembly and assembly operations are simple, facilitating the replacement of different threaded components and allowing for the switching of different types of capacitors.

[0012] According to the capacitor structure of the first aspect of the present invention, the capacitor structure further includes a first line and a second line, wherein the first line is connected to the wall of the first via, the wall of the first via is provided with a notch, the notch is a non-electroplated area, an electrical connection portion is provided above the first via, the threaded component passes through the electrical connection portion and contacts the electrical connection portion, the electrical connection portion is connected to the second line, and the second line passes through the notch and is connected to the electrical connection portion.

[0013] According to the capacitor structure of the first aspect of the present invention, the threaded component, the wall of the first via, the first dielectric layer, the first line and the second line constitute a capacitor unit, and the capacitor structure includes at least two capacitor units. On the circuit board body, the first line and the second line of each capacitor unit are connected in series.

[0014] According to the capacitor structure of the first aspect of the present invention, the threaded component, the wall surface of the first via, the first dielectric layer, the first line and the second line constitute a capacitor unit. The capacitor structure includes at least two capacitor units arranged in layers, with a gap between adjacent capacitor units in each layer. The first line of each capacitor unit is electrically connected by a via provided on the circuit board body, and the second line of each capacitor unit is electrically connected by a via provided on the circuit board body, so that the capacitor units are connected in parallel.

[0015] According to the capacitor structure of the first aspect of the present invention, the threaded component, the wall of the first via, the first dielectric layer, the first line, and the second line constitute a capacitor unit. The capacitor structure includes at least one capacitor unit and at least one electronic component arranged in layers. There is a gap between adjacent capacitor units and electronic components, between two adjacent capacitor units, or between two adjacent electronic components. The first line of each capacitor unit and the first end line of each electronic component are electrically connected by vias provided on the circuit board body. The current direction of the first end line is consistent with that of the first line. The second line of each capacitor unit and the second end line of each electronic component are electrically connected by vias provided on the circuit board body. The current direction of the second end line is consistent with that of the second line, so that each capacitor unit and the electronic component are connected in parallel.

[0016] According to the capacitor structure of the first aspect of the present invention, the threaded component, the wall of the first via, the first dielectric layer, the first line and the second line constitute a capacitor unit. The capacitor structure includes at least two capacitor units. On the circuit board body, the first lines of each capacitor unit are interconnected, and the second lines of each capacitor unit are interconnected, so that the capacitor units are connected in parallel.

[0017] According to the capacitor structure of the first aspect of the present invention, a second dielectric layer is provided on the outer periphery of the wall of the first via, and the first dielectric layer and the second dielectric layer wrap around the wall of the first via.

[0018] According to the capacitor structure of the first aspect of the present invention, the wall surface of the first through hole is internally threaded.

[0019] According to a second aspect of the present invention, a circuit board is provided, comprising the capacitor structure described in any of the above embodiments.

[0020] According to a third aspect of the present invention, a method for manufacturing a capacitor structure is provided, comprising:

[0021] A threaded component made of insulating material is selected, and the metal material required for the capacitor electrode is plated on the outer periphery of the threaded component to form a first electrode layer.

[0022] The first via is fabricated on the circuit board body;

[0023] The metal material required for the capacitor electrode is plated on the wall surface of the first via to form a second electrode layer;

[0024] The material required to form the capacitor dielectric is filled into the first via and a first via plug is formed.

[0025] A threaded hole is machined on the first plug and a first dielectric layer is formed on the outer side;

[0026] Screw the threaded part into the threaded hole.

[0027] The above-mentioned method for manufacturing the capacitor structure has at least the following advantages: by using a threaded component and processing a first via on the circuit board body to form a capacitor, the capacitor can be directly integrated on the PCB, increasing the compactness of the PCB structure. The manufacturing method is relatively simple, avoiding embedded structures and reducing the difficulty of PCB manufacturing. Specifically, the threaded component is made of insulating material, and a first electrode layer is plated on its outer periphery as one electrode of the capacitor. After the threaded component is screwed in, a second electrode layer is plated on the wall of the first via opposite to the outer periphery of the threaded component as the other electrode of the capacitor. A first dielectric layer is filled between the threaded component and the wall of the first via as the capacitor dielectric, thereby forming a capacitor structure. Different capacitance values ​​can be adjusted by screwing the threaded component into or out of the threaded hole and adjusting the depth of the screwing in.

[0028] According to the method for manufacturing a capacitor structure according to a third aspect of the present invention, when plating the metal material required for the capacitor electrode on the wall surface of the first via, a notch is reserved for not being electroplated; the manufacturing method further includes electroplating the circuit board body to create a first line, a second line, and an electrical connection portion, wherein the first line is connected to the wall surface of the first via, the electrical connection portion is located above the first via, the electrical connection portion is connected to the second line, the second line passes through the notch and connects to the electrical connection portion, and the threaded component passes through the electrical connection portion and contacts the electrical connection portion.

[0029] According to a third aspect embodiment of the present invention, the method for manufacturing a capacitor structure further includes: processing a second via on the circuit board body, filling the second via with a dielectric to form a second plug, processing the first via on the second plug, and forming a second dielectric layer on the outside.

[0030] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0031] The present invention will be further described below with reference to the accompanying drawings and embodiments;

[0032] Figure 1 This is a schematic diagram of the vertical cutting mechanism of the capacitor structure in an embodiment of the present invention;

[0033] Figure 2 This is a cross-sectional partial structural diagram of the capacitor structure according to an embodiment of the present invention;

[0034] Figure 3 This is a schematic diagram of the structure of the threaded component according to an embodiment of the present invention;

[0035] Figure 4 This is a schematic diagram of the structure of the first via being processed on the circuit board body according to an embodiment of the present invention;

[0036] Figure 5 This is a schematic diagram of the structure of the present invention, in which a second electrode layer is plated on the first via and a notch is reserved;

[0037] Figure 6 This is a schematic diagram of the structure of filling the first dielectric layer in the first via according to an embodiment of the present invention;

[0038] Figure 7 This is a schematic diagram of the structure of the circuit board body electroplated and the first line, the second line and the electrical connection part made according to an embodiment of the present invention;

[0039] Figure 8 This is a schematic diagram of the structure of a threaded hole processed on the first dielectric layer according to an embodiment of the present invention;

[0040] Figure 9 This is a schematic diagram illustrating the process of fabricating a second dielectric layer on the circuit board body according to an embodiment of the present invention;

[0041] Figure 10 This is a schematic diagram of the structure of the second dielectric layer processed on the circuit board body according to an embodiment of the present invention;

[0042] Figure 11 This is a schematic diagram of the structure of multiple capacitor units connected in series according to an embodiment of the present invention;

[0043] Figure 12 This is a schematic diagram of the structure of two capacitor units connected in parallel according to an embodiment of the present invention;

[0044] Figure 13 This is a cross-sectional view of two capacitor units connected in parallel according to an embodiment of the present invention;

[0045] Figure 14 This is a schematic diagram of a capacitor unit connected in parallel with another electronic component according to an embodiment of the present invention.

[0046] Reference numerals: Threaded part 100, first electrode layer 110, circuit board body 200, first via 210, second electrode layer 211, notch 212, second via 220, third via 230, first dielectric layer 300, threaded hole 310, first hole plug 320, first line 400, second line 500, electrical connection part 600, second dielectric layer 700, second hole plug 710, capacitor unit 800. Detailed Implementation

[0047] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0048] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "axial," "radial," and "circumferential," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, features defined with "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, unless otherwise stated, "a plurality of" means two or more.

[0049] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0050] Reference Figure 1 and Figure 2 According to a first aspect of the present invention, a capacitor structure is provided, including a threaded part 100, a circuit board body 200 and a first dielectric layer 300.

[0051] Among them, reference Figure 3 The threaded component 100 is made of insulating material, and a first electrode layer 110 is plated on its outer periphery. Specifically, the threaded component 100 can be a non-metallic screw made of resin, and the resin material can be polypropylene, tetrafluoroethylene, polystyrene, polycarbonate, or other resin-based materials. The first electrode layer 110 can be made of the metallic material required for capacitor electrodes, such as aluminum.

[0052] The circuit board (PCB) body has a first via 210, and a second electrode layer 211 is plated on the wall of the first via 210. The second electrode layer 211 is a metal material required for the capacitor electrode, and is the same material as the first electrode layer 110 on the surface of the threaded part 100.

[0053] The first dielectric layer 300 is annularly filled within the first via 210. A threaded hole 310 is provided on the inner side of the first dielectric layer 300, and the threaded component 100 is threadedly engaged with the threaded hole 310, thereby positioning the first dielectric layer 300 between the first electrode layer 110 and the second electrode layer 211. The first dielectric layer 300 is the same as or similar to the dielectric of the capacitor, and can be a polymer, such as polypropylene, tetrafluoroethylene, polystyrene, polycarbonate, or other resin materials. It can also be a resin doped with ceramic particles or a resin doped with alumina filler, etc.

[0054] The capacitor structure of this invention, by using a threaded component 100 and vias to form the capacitor, allows the capacitor to be directly integrated onto the PCB, increasing the compactness of the PCB structure and simplifying the structure. It avoids embedded structures and reduces the difficulty of PCB manufacturing. The threaded component 100 itself is insulated. The first electrode layer 110 plated on its outer periphery corresponds to one electrode of the capacitor. The second electrode layer 211 plated on the wall of the first via 210 opposite to the outer periphery of the threaded component 100 corresponds to the other electrode of the capacitor. The first dielectric layer 300 between the threaded component 100 and the wall of the first via 210 corresponds to the capacitor dielectric. Different capacitance values ​​can be adjusted by screwing the threaded component 100 into or out of the threaded hole 310 to adjust the screwing depth. Furthermore, the threaded component 100 has a self-locking function, preventing slippage after being fixed in position, increasing the reliability of the capacitor structure. In addition, the disassembly and assembly operations are simple, facilitating the replacement of different threaded components 100 and allowing for the switching of different types of capacitors.

[0055] For calculating the capacitance value of the capacitor structure in this embodiment of the invention, this capacitor structure is equivalent to two capacitors with radii R and R respectively. A and R B The metal cylindrical surfaces (first electrode layer 110 and second electrode layer 211) serve as electrodes, with the space between the plates filled with a dielectric material (first dielectric layer 300). Assuming the electrodes carry a charge Q (edge ​​effects are negligible, and the electric field has axisymmetry), the electric field strength at the cylindrical surface with radius r between the electrodes is: E = Q / 2πεrl, and the potential difference between the electrodes is: U. AB =∫ RB RA E*dr, capacitance between plates: C=Q / U AB Where Q is the electric charge, d is the distance between the first electrode layer 110 and the second electrode layer 211, ε is the dielectric constant of the first dielectric layer 300, and R... A R is the radius of the inner threaded part 100 (i.e., the radius of the first electrode layer 110). Bl is the radius of the first through hole 210 on the outer side (i.e., the radius of the second electrode layer 211), and l is the direct distance between the first electrode layer 110 and the second electrode layer 211, which is also the distance at which the threaded part 100 is screwed into the threaded hole 310.

[0056] Based on the above formula, the potential difference between the opposite portions of the first electrode layer 110 and the second electrode layer 211 and the charge on the plates can be calculated, thus obtaining the capacitance value.

[0057] Furthermore, since C = ε*S / d, where S is the area of ​​the metal plate, d is the distance between the first electrode layer 110 and the second electrode layer 211, and ε is the dielectric constant of the dielectric, a controllable capacitance value can be achieved by controlling the facing area between the electrodes. Therefore, as the threaded part 100 screws into or out of the plate surface, the facing area between the electrodes is proportional to the capacitance value. Different dielectric fillers have different dielectric constants, and the capacitance value can be adjusted by changing the type of dielectric in the first dielectric layer 300, with the capacitance value being proportional to the dielectric constant.

[0058] In some embodiments, the wall surface of the first via 210 is internally threaded, that is, the first via 210 is machined by tapping. Thus, the second electrode layer 211 electroplated on the wall surface of the first via 210 is also threaded, which can increase the facing area between the first electrode layer 110 and the second electrode layer 211, thereby increasing the capacitance value and expanding the adjustable range of the capacitance value.

[0059] In some embodiments of the present invention, the capacitor structure further includes a first line 400 and a second line 500, through which current is introduced to the electrode layer. The first line 400 connects to the wall of a first via 210, and a notch 212 is provided on the wall of the first via 210. The notch 212 is a non-electroplated area. An electrical connection portion 600 is provided above the first via 210 (the electrical connection portion 600 does not contact the wall of the first via 210). A threaded component 100 passes through and contacts the electrical connection portion 600. The electrical connection portion 600 connects to the second line 500, and the second line 500 passes through the notch 212 and connects to the electrical connection portion 600. The notch 212 prevents the second line 500 from passing through, resulting in a compact structure and avoiding short circuits caused by contact between the second line 500 and the wall of the first via 210. If the first line 400 is connected to the positive terminal of the power supply and the second line 500 is connected to the negative terminal of the power supply, the current flows into the first electrode layer 110 through the first line 400 and from the second electrode layer 211 through the electrical connection part 600 and the second line 500 to the negative terminal of the power supply.

[0060] The notch 212 can extend downwards from the top of the first via 210 by a certain distance or completely penetrate the first via 210. The first line 400 and the second line 500 can be led out in different directions, and the included angle between them can be set as needed.

[0061] In some embodiments, the threaded part 100, the wall of the first through hole 210, the first dielectric layer 300, the first line 400, and the second line 500 constitute a capacitor unit 800. It is understood that the number of capacitor units 800 can be set as needed.

[0062] In some embodiments of the present invention, in addition to filling the space between the first electrode layer 110 and the second electrode layer 211 with a dielectric, a dielectric can be filled on the outside of the second electrode layer 211 for shielding, reducing external interference to the electrode layer. Specifically, a second dielectric layer 700 is provided on the outer periphery of the wall of the first via 210. The first dielectric layer 300 and the second dielectric layer 700 surround the wall of the first via 210. The second dielectric layer 700 serves as a shielding layer, that is, dielectric is filled on both sides of the second electrode layer 211, such as... Figure 9 and Figure 10 As shown. The second dielectric layer 700 can be made of resin materials such as polypropylene, tetrafluoroethylene, polystyrene, and polycarbonate.

[0063] Similarly, for the first electrode layer 110, since the body of the threaded part 100 can be made of resin, both sides of the first electrode layer 110 are also wrapped with dielectric material.

[0064] When the capacitor structure includes at least two capacitor units 800, multiple capacitor units 800 can form a series or parallel structure. The capacitor structure of this embodiment can more easily connect each capacitor unit 800 in series or in parallel to form various series and parallel structures, increasing the diversity of circuit variations.

[0065] Among them, reference Figure 11 On the circuit board, the first line 400 and the second line 500 of each capacitor unit 800 are connected in series. Specifically, the capacitor units 800 are regularly distributed on the circuit board. The second line 500 of the previous capacitor unit 800 is connected to the first line 400 of the next capacitor unit 800. The first line 400 of the capacitor unit 800 at the beginning and the second line 500 of the capacitor unit 800 at the end are connected to other external lines.

[0066] Reference Figure 12 and Figure 13The capacitor structure includes at least two layered capacitor units 800, with a gap between adjacent layered capacitor units 800 so that the threaded parts 100 and the first vias 210 of the upper and lower capacitor units 800 do not contact each other. The first line 400 of each capacitor unit 800 is electrically connected through vias provided on the circuit board body 200 (the walls of the vias are plated with metal material to conduct current), and the second line 500 of each capacitor unit 800 is electrically connected through vias provided on the circuit board body 200, so that the capacitor units 800 are connected in parallel.

[0067] In the illustrated embodiment, there are two layered capacitor units 800, but those skilled in the art should understand that the number is not limited to that shown in the figure or specific embodiment.

[0068] Reference Figure 14 The capacitor structure includes at least one capacitor unit 800 and at least one electronic component (e.g., a resistor or other component) arranged in layers. In the illustrated embodiment, it has two layers: the upper layer is a capacitor unit 800, and the lower layer has a reserved third via 230. The required electronic component can be installed through a threaded hole structure at the third via 230, or other electronic components can be installed through other reserved structures. There is a gap between adjacent layered capacitor units 800 and electronic components. The first line 400 of each capacitor unit 800 and the first terminal line of each electronic component are electrically connected through vias provided on the circuit board body 200. The current direction of the first terminal line of each electronic component is consistent with that of the first line 400. The second line 500 of each capacitor unit 800 and the second terminal line of each electronic component are electrically connected through vias provided on the circuit board body 200. The current direction of the second terminal line of each electronic component is consistent with that of the second line 500, so that each capacitor unit 800 and electronic component are connected in parallel.

[0069] It is understandable that when the structure is set to three or more layers, there will be gaps between adjacent capacitor units 800 and electronic components, between two adjacent capacitor units 800, or between two adjacent electronic components.

[0070] In some other embodiments, as an alternative to the layered arrangement of the multiple capacitor units 800, the multiple capacitor units 800 can be arranged in parallel (not shown) in a manner similar to a series structure. On the circuit board body 200, the first lines 400 of each capacitor unit 800 are interconnected, and the second lines 500 of each capacitor unit 800 are interconnected, so that the capacitor units 800 are connected in parallel.

[0071] According to a second aspect of the present invention, a circuit board is provided, including the capacitor structure of any of the above embodiments. The circuit board including the above capacitor structure, by using threaded parts 100 and vias to form the capacitor, can directly integrate the capacitor onto the PCB, increasing the compactness of the PCB structure, and the structure is relatively simple, avoiding embedded structures and reducing the difficulty of PCB manufacturing.

[0072] According to a third aspect of the present invention, a method for manufacturing a capacitor structure is provided, comprising the following steps:

[0073] S100, reference Figure 3 A threaded part 100 made of insulating material is selected, and the metal material required for the capacitor electrode is plated on the outer periphery of the threaded part 100 to form the first electrode layer 110.

[0074] The insulating material can be a resin-based material such as polypropylene, tetrafluoroethylene, polystyrene, or polycarbonate. The first electrode layer 110 can be made of a metal material required for capacitor electrodes, such as aluminum. The top of the threaded part 100 is plated with a metal material for circuit connection and conduction.

[0075] S200, reference Figure 4 A first via 210 is machined on the circuit board body 200.

[0076] S300, reference Figure 5 The first via 210 is metallized, and the metal material required for the capacitor electrode is plated on the wall of the first via 210 to form a second electrode layer 211. The material of the second electrode layer 211 is the same as that of the first electrode layer 110.

[0077] In some embodiments, when the metal material required for the capacitor electrode is plated on the wall surface of the first via 210, a notch 212 is reserved and not electroplated. Specifically, the first via 210 with the notch 212 can be formed by depositing copper on the first via 210, then removing the copper layer at the location where the notch 212 needs to be made by laser or drilling, and finally electroplating.

[0078] S400, reference Figure 6 The first via 210 is plugged by filling the first via 210 with the material required to form the capacitor dielectric, thus forming the first via plug 320. The material of the first via plug 320 is the same as or similar to the dielectric of the capacitor. It can be a polymer, such as polypropylene, tetrafluoroethylene, polystyrene, polycarbonate, or other resin materials. It can also be a resin doped with ceramic particles or a resin doped with alumina filler.

[0079] S410, reference Figure 7Electroplating is performed on the circuit board body 200 to create a first line 400, a second line 500, and an electrical connection part 600. The first line 400 is connected to the wall of the first via 210. The electrical connection part 600 is located above the first via 210 and does not contact the wall of the first via 210. The electrical connection part 600 is connected to the second line 500. The second line 500 passes through the notch 212 and connects to the electrical connection part 600. The threaded part 100 passes through the electrical connection part 600 and contacts the electrical connection part 600.

[0080] S500, reference Figure 8 A threaded hole 310 is machined on the first plug 320 and a first dielectric layer 300 is formed on the outside, and the threaded hole 310 passes through the electrical connection portion 600.

[0081] S600, reference Figure 1 Screw the threaded part 100 into the threaded hole 310.

[0082] The capacitor structure fabrication method of this embodiment, by using a threaded component 100 and processing a first via 210 on the circuit board body 200 to form a capacitor, can directly integrate the capacitor onto the PCB, increasing the compactness of the PCB structure. Furthermore, the fabrication method is relatively simple, avoiding embedded structures and reducing the difficulty of PCB fabrication. Specifically, the threaded component 100 is made of insulating material, and its outer periphery is plated with a first electrode layer 110 as one electrode of the capacitor. After the threaded component 100 is screwed into the threaded hole 310, a second electrode layer 211 is plated on the wall surface of the first via 210 opposite to the outer periphery of the threaded component 100 as the other electrode of the capacitor. A first dielectric layer 300 is filled between the threaded component 100 and the wall surface of the first via 210 as the capacitor dielectric, thereby forming the capacitor structure. Different capacitance values ​​can be adjusted by screwing the threaded component 100 into or out of the threaded hole 310 and adjusting the depth of screwing in the threaded component 100.

[0083] In some embodiments of the present invention, in addition to the first electrode layer 110 and the second electrode layer 211 being filled with a dielectric material, the outer side of the second electrode layer 211 may be filled with a dielectric material for shielding. (Refer to...) Figure 9 and Figure 10 Specifically, in step S200, before processing the first via 210, a second via 220 is processed on the circuit board body 200. A dielectric material is filled into the second via 220 to form a second via plug 710. Then, the first via 210 is processed on the second via plug 710, and a second dielectric layer 700 is formed on its outer side. Subsequent steps are the same. In this way, the second electrode layer 211 on the wall of the first via 210 can be wrapped between the first dielectric layer 300 and the second dielectric layer 700. The second dielectric layer 700 can be made of resin materials such as polypropylene, tetrafluoroethylene, polystyrene, or polycarbonate.

[0084] The capacitor structure and manufacturing method, other components of the circuit board, and operation according to embodiments of the present invention are known to those skilled in the art and will not be described in detail here.

[0085] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0086] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A capacitive structure, characterized by, The capacitor structure comprises: a threaded part made of insulating material, the outer periphery of the threaded part being plated with a first electrode layer; a circuit board body provided with a first via hole, the wall surface of the first via hole being plated with a second electrode layer; and a first dielectric layer in the shape of a ring filled in the first via hole, the inner side of the first dielectric layer being provided with a threaded hole, the threaded part being threadedly connected with the threaded hole. The capacitor structure further comprises a first line and a second line, wherein the first line is connected with the wall surface of the first via hole, the wall surface of the first via hole is provided with a notch, the notch is a non-electroplating area, the upper side of the first via hole is provided with an electrical connection part, the threaded part passes through and contacts with the electrical connection part, the electrical connection part is connected with the second line, and the second line passes through the notch and is connected with the electrical connection part.

2. The capacitance structure of claim 1, wherein: The threaded part, the wall surface of the first via hole, the first dielectric layer, the first line and the second line constitute a capacitor unit, the capacitor structure comprises at least two capacitor units, and the first line and the second line of each capacitor unit are sequentially connected to form series connection on the circuit board body.

3. The capacitance structure of claim 1, wherein: The threaded part, the wall surface of the first via hole, the first dielectric layer, the first line and the second line constitute a capacitor unit, the capacitor structure comprises at least two capacitor units arranged in layers, adjacent two capacitor units arranged in layers are spaced apart, the first line of each capacitor unit is electrically connected by being provided with a via hole on the circuit board body, and the second line of each capacitor unit is electrically connected by being provided with a via hole on the circuit board body, so that each capacitor unit forms parallel connection.

4. The capacitance structure of claim 1, wherein: The threaded part, the wall surface of the first via hole, the first dielectric layer, the first line and the second line constitute a capacitor unit, the capacitor structure comprises at least one capacitor unit arranged in layers and at least one electronic element, adjacent capacitor units and electronic elements, adjacent two capacitor units, or adjacent two electronic elements are spaced apart, the first line of each capacitor unit and the first end line of each electronic element are electrically connected by being provided with a via hole on the circuit board body, the first end line is consistent with the current direction of the first line, the second line of each capacitor unit and the second end line of each electronic element are electrically connected by being provided with a via hole on the circuit board body, the second end line is consistent with the current direction of the second line, so that each capacitor unit and the electronic element form parallel connection.

5. The capacitance structure of claim 1, wherein: The threaded part, the wall surface of the first via hole, the first dielectric layer, the first line and the second line constitute a capacitor unit, the capacitor structure comprises at least two capacitor units, the first line of each capacitor unit is connected with each other on the circuit board body, and the second line of each capacitor unit is connected with each other, so that each capacitor unit forms parallel connection.

6. The capacitance structure according to any one of claims 1 to 5, characterized in that: The wall surface of the first via hole is provided with a second dielectric layer, and the first dielectric layer and the second dielectric layer wrap the wall surface of the first via hole.

7. The capacitance structure according to any one of claims 1 to 5, characterized in that: The wall surface of the first via hole is internally threaded.

8. A circuit board, characterized by: The capacitor structure according to any one of claims 1 to 7.

9. A method of fabricating a capacitor structure, comprising: Comprise: Selecting a threaded part made of insulating material, plating the outer periphery of the threaded part with a metal material required for a capacitor electrode and forming a first electrode layer; Processing a first via on the circuit board body; Plating the wall surface of the first via with a metal material required for a capacitor electrode and forming a second electrode layer; Filling a material required for a capacitor dielectric in the first via and forming a first plug; Processing a threaded hole on the first plug and forming a first dielectric layer on the outside; Screwing the threaded part into the threaded hole; When plating the wall surface of the first via with a metal material required for a capacitor electrode, leaving a gap un-plated; the manufacturing method further comprises electroplating the circuit board body to manufacture a first circuit, a second circuit and an electrical connection part, and the first circuit is connected to the wall surface of the first via, the electrical connection part is located above the first via, the electrical connection part is connected to the second circuit, the second circuit passes through the gap and is connected to the electrical connection part, and the threaded part passes through the electrical connection part and is in contact with the electrical connection part.

10. The method of claim 9, wherein The manufacturing method further comprises processing a second via on the circuit board body, filling a dielectric in the second via and forming a second plug, processing the first via on the second plug and forming a second dielectric layer on the outside.

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