Cleaning apparatus, cleaning method, wafer cleaning method, and method for manufacturing silicon wafer

Abstract

The present invention provides a washing device including a washing solution generating section, a main pipe, at least one washing section, and at least one drain section. The main pipe is connected to the washing solution generating section that generates a washing solution and through which the washing solution flows. The washing section is connected to the main pipe and has a washing valve section and a washing space. By opening the washing valve section, the washing solution is supplied to the washing space. The drain section is connected to the main pipe and has a drain valve section. By opening the drain valve section, the washing solution is drained. When washing is performed in at least one of the at least one washing section, the sum of the flow rate of the at least one washing section and the flow rate of the at least one drain section is a predetermined value. When washing is not performed in any of the at least one washing section, the sum of the flow rate of the at least one washing section and the flow rate of the at least one drain section is a predetermined value.

Description

TECHNICAL FIELD

[0001] The present application relates to a washing apparatus, a washing method, a wafer washing method, and a method of manufacturing a silicon wafer, particularly, to a washing apparatus, a washing method, a wafer washing method, and a method of manufacturing a silicon wafer that supply a washing solution in a case where a valve is frequently opened and closed. BACKGROUND

[0002] The conventional semiconductor wafer manufacturing generally includes a step of performing washing after (or in) a wafer polishing process or an etching process. For example, in order to remove abrasive grains or a residue of a polishing liquid adhering to a wafer surface in the wafer polishing process or the like, SC1 (Standard Clean 1) or SC2 (Standard Clean 2), or a combination of hydrofluoric acid and water containing ozone is used for washing, but an oxide film is formed on the wafer surface because water containing ozone is used at this time.

[0003] Further, for example, in the manufacturing of a solar cell, in order to suppress the light reflectance of a silicon wafer surface, anisotropic etching is performed with respect to the silicon wafer by means of an alkaline solution, and a concavo-convex texture is formed. In order to remove a gel-like silicon dissolution product or a residue (metal or organic matter, or the like) generated in the etching process, for example, washing is performed with a washing solution such as ozone water. By the reaction with the ozone water, the adhering matter on the silicon wafer that is difficult to be removed is gradually washed away as the reaction proceeds. Thereafter, the oxide film generated by the ozone water is removed by means of hydrofluoric acid.

[0004] However, the ozone concentration in water easily decreases due to the decomposition of ozone itself in water, and in addition, the ozone concentration of the ozone water also changes due to the reaction with the adhering matter of the silicon wafer. Therefore, there is a problem that the silicon wafer is washed unevenly. Further, if washing is performed with an excessive amount of ozone water in order to avoid uneven washing, the oxide film formed on the silicon wafer surface by the ozone water is difficult to remove. Therefore, in order to obtain a silicon wafer with high cleanliness, how to control the concentration of the ozone water is one of the important problems.

[0005] Document 1 (Japanese Patent Application Publication No. 2014-090087) discloses a method of manufacturing a solar cell that monitors the ozone concentration at the outlet of a washing tank, feeds back the concentration information to an ozone generator, and is able to maintain the ozone water concentration constant.

[0006] The ozone generator continuously generates ozone by discharge or electrical decomposition of an electrode, and maintains the concentration of the ozone water. If the total flow rate of the ozone water is maintained constant, the above-described background technology can be applied, but in a case where the flow rate of the ozone water frequently changes, for example, in a case where the outlet of the washing tank is frequently opened and closed, the ozone concentration is unstable, and there is a problem that it is difficult to reduce the amplitude of the variation. SUMMARY

[0007] The present application has an object to provide a washing device, a washing method, a wafer washing method, and a silicon wafer manufacturing method, which can maintain the concentration and flow rate of a washing solution (e.g., ozone water) for washing constant even when a washing valve portion is frequently opened and closed, in view of the above-described circumstances.

[0008] To achieve the above object, the present application provides a washing device characterized by comprising a washing solution generating portion, a main pipe, at least one washing portion, and at least one drain portion, the washing solution generating portion generates a washing solution of a predetermined concentration, the main pipe is connected to the washing solution generating portion and allows the washing solution to flow therethrough, the at least one washing portion is connected to the main pipe and comprises a washing valve portion and a washing space, the washing solution is supplied to the washing space by opening the washing valve portion, the at least one drain portion is connected to the main pipe and comprises a drain valve portion, the washing solution is drained by opening the drain valve portion, the sum of the flow rate of the at least one washing portion and the flow rate of the at least one drain portion is a predetermined value when washing is performed in at least one of the at least one washing portion, and the sum of the flow rate of the at least one washing portion and the flow rate of the at least one drain portion is the predetermined value when no washing is performed in any of the at least one washing portion.

[0009] In one aspect, the number of the at least one washing portion and the at least one drain portion is equal, and they are arranged one-to-one, and the opening and closing operations of the washing valve portion and the drain valve portion are synchronized and the opening and closing states thereof are opposite with respect to the washing portion and the drain portion arranged one-to-one.

[0010] In one aspect, the number of the at least one washing portion and the at least one drain portion is equal, and they are arranged one-to-one, and the flow rate of the washing valve portion and the flow rate of the drain valve portion are the same with respect to the washing portion and the drain portion arranged one-to-one.

[0011] In one aspect, the at least one washing portion and the at least one drain portion are arranged one-to-one and divided into a plurality of groups, and the groups are arranged in parallel with each other.

[0012] In one aspect, the washing device further comprises a return pipe connected to the at least one drain portion to return the washing solution drained from the at least one drain portion to the washing solution generating portion.

[0013] In one aspect, the washing valve portion and the corresponding drain valve portion are combined to form a three-way valve.

[0014] Further, the present application provides a washing method characterized by comprising a generation step in which a washing solution generation unit generates a washing solution of a predetermined concentration, a supply step in which a main pipe supplies the washing solution to at least one washing unit and at least one drain unit, and a flow rate control step in which, when washing is performed in at least one of the at least one washing unit, the sum of the flow rate of the at least one washing unit and the flow rate of the at least one drain unit is controlled to a predetermined value, and when no washing is performed in any of the at least one washing unit, the sum of the flow rate of the at least one washing unit and the flow rate of the at least one drain unit is controlled to the predetermined value.

[0015] In one aspect, the number of the at least one washing unit and the at least one drain unit is equal, and they are arranged one-to-one. The at least one washing unit has a washing valve unit and a washing space, and the washing solution is supplied to the washing space by opening the washing valve unit. The at least one drain unit has a drain valve unit, and the washing solution is drained by opening the drain valve unit. In the flow rate control step, the opening and closing operations of the washing valve unit and the drain valve unit are synchronized and the opening and closing states thereof are opposite with respect to the washing unit and the drain unit arranged one-to-one.

[0016] In one aspect, the number of the at least one washing unit and the at least one drain unit is equal, and they are arranged one-to-one. The at least one washing unit has a washing valve unit and a washing space, and the washing solution is supplied to the washing space by opening the washing valve unit. The at least one drain unit has a drain valve unit, and the washing solution is drained by opening the drain valve unit. In the flow rate control step, the flow rate of the washing valve unit and the flow rate of the drain valve unit are the same with respect to the washing unit and the drain unit arranged one-to-one.

[0017] Further, the present application provides a wafer washing method for washing a silicon wafer by the above washing method.

[0018] Further, the present application provides a method for manufacturing a silicon wafer including the above wafer washing method.

[0019] When washing is performed in at least one of the aforementioned at least one washing section, the total value of the flow rate of the aforementioned at least one washing section and the flow rate of the aforementioned at least one drain section is controlled to a predetermined value, and when washing is not performed in any of the aforementioned at least one washing section, the total value of the flow rate of the aforementioned at least one washing section and the flow rate of the aforementioned at least one drain section is controlled to the aforementioned predetermined value. Thus, if the main pipe is observed, the flow rate of the washing solution flowing out of the main pipe is always maintained at a predetermined value, and furthermore, if the washing solution generating section is observed, the washing solution having the flow rate of the same predetermined value is supplied to flow into the main pipe. By thus configuring, even if the washing valve section is frequently opened and closed, if the washing solution generating section is observed, the flow rate output is constant, and thus if the generation speed of the washing material (for example, ozone) is maintained constant, the concentration of the washing solution (for example, ozone water) used for washing can be maintained constant.

[0020] Thus, according to the present application, even in the case where the washing valve section is frequently opened and closed, the effect that the concentration of the washing solution used for washing of the wafer can be easily maintained constant (for example, the variation is 1% or less of the predetermined value) can be achieved, and furthermore, the processing of the wafer can be stabilized.

[0021] Further, in the present application, the unused washing solution discharged from the drain section is returned to the washing solution generating section via the return pipe, and thus the concentration of the washing solution is the same, so the water usage amount of the washing solution generating section can be reduced. Thus, the effect of saving water resources can also be achieved. BRIEF DESCRIPTION OF DRAWINGS

[0022] Figure 1 is a schematic view of a washing device of the first embodiment of the present application.

[0023] Figure 2 is a schematic view of a conventional known washing device.

[0024] Figure 3 is a graph showing the ozone water concentration and the ozone water flow rate of the present application and the prior art.

[0025] Figure 4 is a schematic view of a washing device of the second embodiment of the present application.

[0026] Figure 5 is a schematic view of a washing device of the third embodiment of the present application.

[0027] Figure 6 is a schematic view of a washing device of the fourth embodiment of the present application.

[0028] Figure 7 is a schematic view of a washing device of the fifth embodiment of the present application. DETAILED DESCRIPTION

[0029] In the following detailed description, other ranges relating to the application of the device and system of the present application will be clearly indicated. In addition, with respect to the following detailed description and specific embodiments, the device and system are illustrated by way of example as being for the purpose of explanation, and should not be construed as limiting the scope of the present application.

[0030] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art. For example, terms such as those defined in a generally used dictionary are to be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and the present application, and should not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

[0031] With respect to the embodiments of the present application, the description is made with reference to the accompanying drawings.

[0032] [First Embodiment]

[0033] Referring to Figure 1 . Figure 1 is a schematic view of a washing device of the first embodiment of the present application. As Figure 1 indicated, the washing device 1 for washing wafers S of the first embodiment of the present application mainly includes a washing solution generating section 2, a main pipe 3, three washing sections 4, 4', 4", three drain sections 7, 7', 7", and a drain pipe 9. The three washing sections 4, 4', 4" and the three drain sections 7, 7', 7" are directly connected to the main pipe 3, i.e., the main pipe 3 is directly communicated with the six pipes.

[0034] The washing solution generating section 2 generates a washing solution F of a predetermined concentration. In the first embodiment, an ozone generator can be provided in the washing solution generating section 2, whereby ozone water of a predetermined concentration is generated to become the washing solution. The main pipe 3 is connected to the washing solution generating section 2, and the washing solution F flows inside. A concentration meter 20 that detects and measures the concentration of the washing solution F is provided between the washing solution generating section 2 and the main pipe 3.

[0035] Each of the washing sections 4, 4', 4" has a washing valve section 5, 5', 5" and a washing space 6, 6', 6", and when the washing valve section 5, 5', 5" is opened, the washing solution F is supplied to the corresponding washing space 6, 6', 6", and the used (after the wafer S) washing solution F is discharged to the drain pipe 9. A flow meter 30 that detects and measures the flow rate of the washing solution F is provided between each of the washing valve sections 5, 5', 5" and the washing space 6, 6', 6".

[0036] Each of the drain portions 7, 7', 7" has a drain valve portion 8, 8', 8", and when the drain valve portion 8, 8', 8" is opened, the washing solution F that is not used in the washing is discharged to the drain piping 9.

[0037] In the first embodiment, the washing portion 4 constitutes an upper portion of a rotary wafer washing device, and when the washing valve portion 5 is opened, the washing solution F is supplied to a space (washing space 6) of the upper portion of the rotary wafer washing device, for washing the upper surface of the wafer S (for example, a silicon wafer).

[0038] Further, the washing portion 4' constitutes a lower portion of the same rotary wafer washing device, and when the washing valve portion 5' is opened, the washing solution F is supplied to a space (washing space 6') of the lower portion of the rotary wafer washing device, for washing the lower surface of the wafer S. Further, the washing portion 4" is a dip-type wafer washing device, and when the washing valve portion 5" is opened, the washing solution F is supplied to a space (washing space 6") in the dip-type wafer washing device, for washing the surface of the wafer S. Further, the used washing solution F is discharged to the drain piping 9.

[0039] Next, the washing method of the washing device 1 will be described. In the first embodiment, the washing method includes a generation step (generation process), a supply step (supply process), and a flow control step (flow control process).

[0040] First, in the generation step, the washing solution F of a predetermined concentration is generated by the washing solution generation portion 2. Next, in the supply step, the washing solution F is supplied to at least one of the washing portions 4, 4', 4" and at least one of the drain portions 7, 7', 7" by the main piping 3.

[0041] Finally, in the flow control step, when the washing is performed in at least one of the washing portions 4, 4', 4" (for example, when the washing is performed by the washing portion 4), the total value of the flow rate of the washing portion 4, 4', 4" and the flow rate of the drain portion 7, 7', 7" is controlled to be a predetermined value, and when the washing is not performed in any of the washing portions 4, 4', 4", the total value of the flow rate of the washing portion 4, 4', 4" and the flow rate of the drain portion 7, 7', 7" is controlled to be the same predetermined value as before.

[0042] By the flow control step, regardless of whether the washing is performed at the washing portions 4, 4', 4", the total value of the flow rate of the washing solution F flowing out of the main piping 3 is the same, when viewed with respect to the main piping 3.

[0043] Next, the detailed operation of the flow control step of the washing portions 4, 4', 4" and the drain portions 7, 7', 7" of the first embodiment will be described using Table 1 below.

[0044] [Table 1]

[0045]

[0046] Table 1: Synchronous state of the washing valve section and the drain valve section.

[0047] As shown in Table 1, in the first embodiment, the number of the washing sections 4, 4', 4" and the number of the drain sections 7, 7', 7" are the same, and they are arranged one-to-one. Here, "one-to-one" means that one washing section and one drain section form a small group system, for example, a structure that controls the flow or the opening and closing action in linkage with each other. In the first embodiment, as shown in Table 1, the washing section 4 and one drain section 7 are arranged as a group, the washing section 4' and the drain section 7' are arranged as a group, and the washing section 4" and the drain section 7" are arranged as a group. That is, one drain section is combined with one washing section in a non-repeated manner.

[0048] As shown in Table 1, with respect to the washing sections 4, 4', 4" and the drain sections 7, 7', 7" arranged one-to-one, the flow of the washing section and the drain section of the same group is the same, and the opening and closing action of the washing valve section 5, 5', 5" and the drain valve section 8, 8', 8" is synchronized, and the opening and closing state is opposite. Here, "the opening and closing action is synchronized, and the opening and closing state is opposite" means that, for example, the washing valve section 5 is opened at the same time as the drain valve section 8 is closed, and the washing valve section 5 is closed at the same time as the drain valve section 8 is opened. As a method of synchronizing the washing valve section 5, 5', 5" and the drain valve section 8, 8', 8", a generally known method can be used. For example, a valve that performs the opening and closing action by means of an electric signal can be used for the washing valve section 5, 5', 5" and the drain valve section 8, 8', 8", and with respect to the pair of valves, the control section (not shown) of the valves respectively outputs a signal that opens the valve and a signal that closes the valve at the same time, and the opening and closing action of the pair of valves can be synchronized.

[0049] Hereinafter, the flow control step will be further described using the group of the washing section 4 and the drain section 7 as an example. In detail, when the washing section 4 performs washing by means of the washing section 4, the washing valve section 5 is opened, and the washing solution F is supplied with respect to the washing space 6, at this time, the drain valve section 8 of the drain section 7 arranged one-to-one with the washing section 4 is closed in synchronization. When the washing section 4 does not perform washing, the washing valve section 5 is closed, at this time, the drain valve section 8 of the drain section 7 arranged one-to-one with the washing section 4 is opened in synchronization, and the unused washing solution F is drained. Among them, the flow of the washing solution F passing through the washing valve section 5 when it is opened and the flow of the washing solution passing through the drain valve section 8 when it is opened are the same, that is, the flow of the washing section 4 and the flow of the drain section 7 are the same.

[0050] Likewise, if the washing valve section 5' of the washing section 4' and the drain valve section 8' of the drain section 7' are observed, the opening and closing operations thereof are synchronized with each other, the opening and closing states thereof are opposite to each other, and the flow rate of the washing solution F passing through the washing valve section 5' at the time of opening and the flow rate of the washing solution passing through the drain valve section 8' at the time of opening are the same (i.e., the flow rates of the washing section 4' and the drain section 7' are the same). Further, if the washing valve section 5" of the washing section 4" and the drain valve section 8" of the drain section 7" are observed, the opening and closing operations thereof are synchronized with each other, the opening and closing states thereof are opposite to each other, and the flow rate of the washing solution F passing through the washing valve section 5" at the time of opening and the flow rate of the washing solution passing through the drain valve section 8" at the time of opening are the same (i.e., the flow rates of the washing section 4" and the drain section 7" are the same).

[0051] According to the above-described structure, if the main pipe 3 is observed, the flow rate of the washing solution F flowing out of the main pipe 3 is always maintained at a predetermined value, and further, if the washing solution generating section 2 is observed, the washing solution F having the same flow rate as the above-described predetermined value is supplied to flow into the main pipe 3. Since the structure is thus constituted, even if the washing valve sections 5, 5', 5" are frequently opened and closed, the flow rate output from the washing solution generating section 2 is constant, and therefore, if the generation speed of the washing material (e.g., ozone) is maintained constant, it is possible to maintain the concentration of the washing solution (e.g., ozone water) for washing constant.

[0052] To further explain the effects that can be achieved by the first embodiment compared to the prior art, first, reference will be made to Figure 2 . Figure 2 is a schematic diagram of the prior washing device. Figure 2 The prior washing device shown in the drawing is such that the flow path through which the unused washing solution is discharged to the drain pipe 300 is only one, and does not have the drain sections which are disposed one-to-one with the respective washing sections 200.

[0053] Next, reference will be made to Figure 3 . Figure 3 is a chart showing the ozone water concentration and the ozone water flow rate of the present application and the prior art. As shown in the chart of the prior art Figure 3 , in the case where the valve sections of the respective washing sections 200 are frequently opened and closed, if the washing solution generating section 100 is observed, in the case where the control by the feedback control has been performed, the amplitude of the variation of the ozone water flow rate is ± 5%, i.e., the ozone water flow rate varies between 1.05 times the predetermined flow rate and 0.95 times the predetermined flow rate. At this time, if the washing solution generating section 100 is observed, the amplitude of the variation of the ozone water concentration is ± 5%, i.e., the ozone water concentration varies between 1.05 times the predetermined concentration and 0.95 times the predetermined concentration.

[0054] Further, as shown in Figure 3The washing device 1 of the first embodiment of the present application has the above-described configuration, and controls the flow rate by the flow rate control step described above, so if the washing solution generating section 2 is observed, the variation in the flow rate of the ozone water output can be made to be ± 1% or less. Thus, it is not necessary to adjust the ozone generation rate in total, and furthermore, the variation in the ozone water concentration can be suppressed to be ± 1% or less.

[0055] Thus, according to the present application, even in the case where the washing valve section is frequently opened and closed, the effect that the concentration of the washing solution for the washing of the wafer can be easily kept constant (for example, the variation is ± 1% or less of a predetermined value) can be achieved, and furthermore, the processing of the wafer can be stabilized.

[0056] [Second Embodiment]

[0057] Next, the second embodiment of the present application will be described with reference to Figure 4 . Figure 4 is a schematic view of a washing device of the second embodiment of the present application. In the second embodiment, the washing device 1 mainly includes a washing solution generating section 2, a main pipe 3, three washing sections 4, 4', 4" and three drain sections 7, 7', 7". Each of the washing sections 4, 4', 4" has a washing valve section 5, 5', 5" and a washing space 6, 6', 6", and when the washing valve section 5, 5', 5" is opened, the washing solution is supplied to the corresponding washing space 6, 6', 6", and the used washing solution is drained to a drain pipe 9. Each of the drain sections 7, 7', 7" has a drain valve section 8, 8', 8", and when the drain valve section 8, 8', 8" is opened, the washing solution not used in the washing is drained to the drain pipe 9.

[0058] The second embodiment differs from the first embodiment mainly in that, in the main pipe 3 of the first embodiment, six pipes are directly connected to the main pipe 3, on the other hand, in the second embodiment, the main pipe is directly connected to only three pipes. As shown in Figure 4 In the second embodiment, the washing sections 4, 4', 4" and the drain sections 7, 7', 7" are arranged one to one with each other and divided into three groups, and each group is arranged in parallel with each other with respect to the main pipe 3. In detail, the washing section 4 and the drain section 7 constitute one group, the washing section 4' and the drain section 7' constitute one group, and the washing section 4" and the drain section 7" constitute one group, and each group is connected to the main pipe 3 by one pipe, and the three pipes are arranged in parallel with respect to the main pipe 3.

[0059] In the second embodiment, the concentration meter and the flow rate meter are arranged in the same manner as in the first embodiment, but in order to make the drawing simple, the concentration meter and the flow rate meter are not shown in Figure 4The flow control step, the synchronization state of the washing valve section and the drain valve section of the second embodiment are the same as those of the first embodiment, and thus are not described herein. Thus, the second embodiment can achieve the same effects as the first embodiment through the above-described configuration.

[0060] Further, if the main pipe 3 is observed, the number of pipes connected to the main pipe 3 is reduced by connecting the washing section and the drain section of each group in parallel, and the washing section and the drain section of the same group are connected to the same branch pipe, and thus, when a problem occurs in a pipe, the corresponding pipe can be easily found. Thus, the second embodiment further achieves the effects of facilitating maintenance of the pipes and finding of problems in the pipes, compared to the first embodiment.

[0061] [Third Embodiment]

[0062] Reference Figure 5 . Figure 5 is a schematic view of a washing device of the third embodiment of the present application. In the third embodiment, the washing device 1 mainly includes a washing solution generating section 2, a main pipe 3, three washing sections 4, 4', 4" and three drain sections 7, 7', 7" and a return pipe 10. Each washing section 4, 4', 4" has a washing valve section 5, 5', 5" and a washing space 6, 6', 6", respectively. When the washing valve section 5, 5', 5" is opened, the washing solution is supplied to the corresponding washing space 6, 6', 6", and the used washing solution is discharged to the drain pipe 9.

[0063] Each drain section 7, 7', 7" has a drain valve section 8, 8', 8", respectively. The return pipe 10 is connected to at least one drain section 7, 7', 7" (all of them in this embodiment), and when the drain valve section 8, 8', 8" is opened, the washing solution discharged from the drain section 7, 7', 7" is returned to the washing solution generating section 2.

[0064] In detail, the third embodiment mainly differs from the first embodiment in that the washing solution unused in the washing and discharged from the drain section 7, 7', 7" is not discharged to the drain pipe 9, but is returned to the washing solution generating section 2 by the return pipe 10 and is reused.

[0065] In the third embodiment, the arrangement of the concentration meter and the flow meter is the same as that of the first embodiment, but is not illustrated in the Figure 5 schematic view in order to simplify the drawing. Further, the flow control step, the synchronization state of the washing valve section and the drain valve section of the third embodiment are the same as those of the first embodiment, and thus are not described herein. Thus, the third embodiment can achieve the same effects as the first embodiment through the above-described configuration.

[0066] Further, the unused washing solution discharged from the drain section is returned to the washing solution generating section via the return pipe, whereby the water usage amount of the washing solution generating section can be reduced. Thus, the third embodiment also achieves the effect of water resource saving compared to the first embodiment.

[0067] [Fourth Embodiment]

[0068] Reference Figure 6 . Figure 6 is a schematic diagram of a washing device of the fourth embodiment of the present application. In the fourth embodiment, the washing device 1 mainly includes a washing solution generating section 2, a main pipe 3, three washing sections 4, 4', 4" and three drain sections 7, 7', 7" and a return pipe 10. Each washing section 4, 4', 4" has a washing valve section 5, 5', 5" and a washing space 6, 6', 6", respectively. When the washing valve section 5, 5', 5" is opened, the washing solution is supplied to the corresponding washing space 6, 6', 6" and the used washing solution is discharged to the drain pipe 9. Each drain section 7, 7', 7" has a drain valve section 8, 8', 8", respectively. The return pipe 10 is connected to at least one of the drain sections 7, 7', 7" (in this embodiment, all of them) and when the drain valve section 8, 8', 8" is opened, the washing solution discharged from the drain section 7, 7', 7" is returned to the washing solution generating section 2.

[0069] Further, as shown in Figure 6 , in the fourth embodiment, the washing sections 4, 4', 4" and the drain sections 7, 7', 7" are arranged one-to-one with each other and are divided into three groups, and each group is arranged in parallel with each other with respect to the main pipe 3. In detail, the washing section 4 and the drain section 7 constitute one group, the washing section 4' and the drain section 7' constitute one group, and the washing section 4" and the drain section 7" constitute one group, and each group is connected to the main pipe 3 by one pipe, and the three pipes are arranged in parallel with respect to the main pipe 3.

[0070] In the fourth embodiment, the concentration meter and the flow meter are arranged in the same manner as in the first embodiment, but are not shown in the Figure 6 for the sake of simplicity of the drawing. Further, the flow control step, the synchronized state of the washing valve section and the drain valve section and the like of the fourth embodiment are the same as those of the first embodiment, so they are not described herein. Thus, the fourth embodiment can achieve the same effects as the first embodiment by the above-described structure.

[0071] Further, the fourth embodiment also has the technical features of the second embodiment and the third embodiment, so compared to the first embodiment, the fourth embodiment can further achieve the effect that the maintenance of the pipes and the discovery of the problems of the pipes are more convenient and the effect of water resource saving.

[0072] [Fifth Embodiment]

[0073] Referring to Figure 7 . Figure 7 is a schematic diagram of a washing device of the 5th embodiment of the present application. In the 5th embodiment, the washing device 1 mainly includes a washing solution generating section 2, a main pipe 3, three washing sections 4, 4', 4", three drain sections 7, 7', 7". In the 5th embodiment, the washing valve sections used in the 1st to 4th embodiments and their corresponding drain valve sections are respectively merged to be three-way valves 11, 11', 11".

[0074] When washing is performed, the three-way valves 11, 11', 11" are opened to the washing sections 4, 4', 4" (washing spaces 6, 6', 6") and closed to the drain sections 7, 7', 7". Thus, the washing solution is supplied to the corresponding washing spaces 6, 6', 6" and the used washing solution is drained to the drain pipe 9. When washing is not performed, the three-way valves 11, 11', 11" are opened to the drain sections 7, 7', 7" and closed to the washing sections 4, 4', 4". Thus, the washing solution not used in washing is drained to the drain pipe 9. However, the 5th embodiment is provided with a return pipe like the 3rd embodiment, and the washing solution not used in washing can also be returned to the washing solution generating section 2 to be reused by means of the return pipe 10.

[0075] In the 5th embodiment, the concentration meter and the flow meter are provided in the same way as in the 1st embodiment, but are not illustrated in Figure 7 for the sake of simplicity of the drawing. In addition, it is particularly noted that in the 5th embodiment, the three-way valves 11, 11', 11" are provided, and thus the flow control step, the synchronized state of the washing valve section and the drain valve section, and the like described in the 1st embodiment can be realized by means of the mechanism. Thus, the 5th embodiment can realize the same effects as the 1st embodiment.

[0076] Further, the 5th embodiment has fewer structural components provided by means of the use of the three-way valves, and thus can further realize the effects of cost reduction and saving of installation space.

[0077] [Other modifications]

[0078] The washing devices and methods of the above 1st to 5th embodiments are exemplified by wafer washing, but the present application is not limited thereto and can also be used for other articles that need to be washed by means of a washing solution of constant concentration. Further, the washing devices and methods of the above 1st to 5th embodiments can also be added to a manufacturing method of wafers (particularly, silicon wafers).

[0079] Further, in the first to fifth embodiments, the three washing sections 4, 4', 4" and the three drainage sections 7, 7', 7" are described, but the present application is not limited thereto, and the number of washing sections and drainage sections can be more or less. In the case where only one set of corresponding washing section and drainage section is provided in the washing device, as long as the above-mentioned flow control step and the synchronized state of the washing valve section and the drainage valve section can be implemented, the effect of stabilizing the concentration of the washing solution can be similarly obtained.

[0080] Further, in the first embodiment, the three washing sections correspond to the upper and lower sections of the rotary wafer washing device and the immersion wafer washing device, but the present application is not limited thereto, and in the first to fifth embodiments, each washing section can correspond to a different washing device, and further, can correspond to different washing positions of the same washing device.

[0081] The present application has been disclosed by the foregoing embodiments as described above, but is not limited thereto. Various changes and modifications can be made by those skilled in the art within the technical field of the present application without departing from the spirit and scope of the present application. Therefore, the scope of the present application should not be limited to the above-mentioned embodiments, but should be defined by the appended claims.

Claims

1. A washing device, characterized in that, It includes a washing solution generation unit, main piping, at least one washing unit, and at least one drainage unit. The aforementioned washing solution generating section generates a washing solution of a predetermined concentration. The aforementioned main piping is connected to the aforementioned washing solution generation unit to allow the aforementioned washing solution to flow. At least one of the aforementioned washing units is connected to the aforementioned main piping and includes a washing valve and a washing space. By opening the aforementioned washing valve, the aforementioned washing solution is supplied to the aforementioned washing space. At least one of the aforementioned drainage sections is connected to the aforementioned main piping and includes a drain valve. By opening the aforementioned drain valve, the aforementioned washing solution is discharged. When at least one of the aforementioned washing units is washing, the total flow rate of the aforementioned washing unit and the aforementioned drain valve is a predetermined value by controlling the opening and closing of the aforementioned washing valve and the aforementioned drain valve. When none of the aforementioned washing units is washing, the total flow rate of the aforementioned washing unit and the aforementioned drain valve is the predetermined value by controlling the opening and closing of the aforementioned washing valve and the aforementioned drain valve.

2. The washing device as described in claim 1, characterized in that, The number of the aforementioned at least one washing section and the aforementioned at least one drain section are equal, and they are configured in a one-to-one manner. The washing section and the drain section, which are configured one-to-one with each other, have synchronous opening and closing operations and opposite opening and closing states.

3. The washing device as described in claim 1, characterized in that, The number of the aforementioned at least one washing section and the aforementioned at least one drain section are equal, and they are configured in a one-to-one manner. In the aforementioned washing section and the aforementioned drain section, which are configured one-to-one with each other, the flow rate of the aforementioned washing valve section and the flow rate of the aforementioned drain valve section are the same.

4. The washing device as described in claim 1, characterized in that, The aforementioned at least one washing section and the aforementioned at least one drain section are configured one-to-one with each other and are divided into multiple groups, and the groups are arranged in parallel with each other.

5. The washing apparatus according to any one of claims 1 to 4, characterized in that, It also includes a return pipe, which is connected to the aforementioned at least one drainage section, so that the aforementioned washing solution discharged from the aforementioned at least one drainage section returns to the aforementioned washing solution generating section.

6. The washing apparatus according to any one of claims 1 to 4, characterized in that, The aforementioned washing valve and the corresponding aforementioned drain valve merge to form a three-way valve.

7. A washing method, characterized in that, This includes the production process, the supply process, and the flow control process. In the aforementioned production process, the washing solution generation unit generates a washing solution of a predetermined concentration. In the aforementioned supply process, the main piping supplies the aforementioned washing solution to at least one washing section and at least one drainage section. In the aforementioned flow control process, when at least one of the aforementioned washing units is performing washing, the flow rate of the aforementioned at least one washing unit and the flow rate of the aforementioned at least one draining unit are controlled to a predetermined value, and when none of the aforementioned at least one washing unit is performing washing, the flow rate of the aforementioned at least one washing unit and the flow rate of the aforementioned at least one draining unit are controlled to a predetermined value. The aforementioned at least one washing unit includes a washing valve and a washing space. By opening the aforementioned washing valve, the aforementioned washing solution is supplied to the aforementioned washing space. The aforementioned at least one drainage section includes a drain valve, through which the aforementioned washing solution is discharged. The aforementioned flow control process controls the flow rate of at least one washing unit and the flow rate of at least one drain unit by controlling the opening and closing actions of the aforementioned washing valve and the aforementioned drain valve.

8. The washing method as described in claim 7, characterized in that, The number of the aforementioned at least one washing section and the aforementioned at least one drain section are equal, and they are configured in a one-to-one manner. In the aforementioned flow control process, the opening and closing actions of the aforementioned washing section and the aforementioned drain section, which are configured one-to-one with each other, are synchronized and their opening and closing states are opposite.

9. The washing method as described in claim 7, characterized in that, The number of the aforementioned at least one washing section and the aforementioned at least one drain section are equal, and they are configured in a one-to-one manner. In the aforementioned flow control process, the flow rate of the aforementioned washing valve section is the same as that of the aforementioned drain valve section, which are configured one-to-one with the aforementioned washing section and the aforementioned drain section.

10. A method for cleaning a wafer, characterized in that, The silicon wafer is cleaned by the cleaning method according to any one of claims 7 to 9.

11. A method for manufacturing a wafer, characterized in that, The wafer washing method as described in claim 10.

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