Optical element driving device, imaging optical module and electronic device

Abstract

An optical element driving device, an imaging optical module and an electronic device are disclosed. The optical element driving device includes a fixed body, a carrier, a support mechanism and an electromagnetic driving assembly. The carrier accommodates at least one optical element and has at least one degree of freedom relative to the fixed body. The support mechanism is connected to the carrier and the fixed body, so that the carrier has the degree of freedom. The electromagnetic driving assembly is used to drive the carrier to move relative to the fixed body. The electromagnetic driving assembly includes a driving coil, a driving magnet and a ferromagnetic element. The driving coil is arranged on the carrier. The driving magnet is arranged on the fixed body and opposite to the driving coil. The ferromagnetic element is embedded in the carrier and includes a magnetic conducting part and an electric connecting part formed in one body. The magnetic conducting part faces at least one of the driving coil and the driving magnet. The electric connecting part is exposed on the surface of the carrier and electrically connected to the driving coil. The imaging optical module has the optical element driving device, and the electronic device has the imaging optical module.

Description

TECHNICAL FIELD

[0001] The present application relates to an optical element driving device, an imaging optical module and an electronic device, in particular, an optical element driving device and an imaging optical module suitable for an electronic device. BACKGROUND

[0002] With the advancement of semiconductor process technology, the performance of electronic photosensitive elements is improved, and the pixel size can be smaller. Therefore, optical lenses with high imaging quality are indispensable. In addition, with the rapid development of technology, the application range of mobile devices equipped with optical lenses is more extensive, and the requirements for optical lenses are more diverse.

[0003] In recent years, electronic products have developed towards thinness and lightness, but traditional optical lenses have been difficult to meet the needs of miniaturization and high imaging quality. Today's image capturing devices have functions such as automatic focusing, optical image stabilization, and zooming. However, in order to achieve these various functions, the structure of the image capturing device becomes relatively complex and its size increases, thereby increasing the size of the electronic device. In the limited space, it is difficult for the general optical lens to configure a driving mechanism that can effectively drive the optical element through the limited component space, so the overall size of the optical lens must be sacrificed to increase the internal space for setting the driving element to achieve the effective driving force required to move the optical element. SUMMARY

[0004] In view of the above-mentioned problems, the present application discloses an optical element driving device, an imaging optical module and an electronic device, which can reduce the number of parts of the driving mechanism in a limited module internal space, and still achieve the effective driving force required to move the optical element, so as to control the overall size of the optical module and achieve the miniaturization of the electronic device.

[0005] The present application provides an optical element driving device, comprising a fixed body, a carrier, a support mechanism member and an electromagnetic driving assembly. The carrier is used to accommodate at least one optical element, and the carrier has at least one degree of freedom relative to the fixed body. The support mechanism member is connected to the carrier and the fixed body, so that the carrier has the at least one degree of freedom. The electromagnetic driving assembly is used to drive the carrier to act relative to the fixed body. The electromagnetic driving assembly comprises a driving coil, a driving magnet and a ferromagnetic element. The driving coil is arranged on the carrier. The driving magnet is arranged on the fixed body and is arranged opposite to the driving coil. The ferromagnetic element is embedded in the carrier, and the ferromagnetic element has the at least one degree of freedom relative to the fixed body. The ferromagnetic element is integrally formed and comprises a magnetic conducting part and a first electrical connection part. The magnetic conducting part faces at least one of the driving coil and the driving magnet. The first electrical connection part is exposed on the surface of the carrier, and the first electrical connection part is electrically connected with the driving coil.

[0006] The present invention provides an imaging optical module, comprising the aforementioned optical element driving device and an imaging assembly, wherein the imaging assembly comprises optical elements arranged in sequence along an imaging light path.

[0007] The present invention provides an electronic device comprising the aforementioned imaging optical module and an electronic photosensitive element, wherein the electronic photosensitive element is disposed on the imaging surface of the imaging optical module.

[0008] The optical element drive device, imaging optical module, and electronic device disclosed herein utilize a conductive ferromagnetic element mounted on a carrier to guide the magnetic field distribution of the electromagnetic drive assembly, thereby enhancing driving force. This also improves the spatial distribution of the drive coils, which is limited by electrical requirements, thereby increasing design freedom. Furthermore, the ferromagnetic element simultaneously functions as a magnetic conductor and a circuit connection, reducing the number of parts in the optical element drive device and improving production efficiency.

[0009] The above description of the content of the present invention and the following description of the embodiments are intended to demonstrate and explain the spirit and principle of the present invention, and to provide further explanation of the scope of the patent application of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative work. In the drawings:

[0011] Figure 1 A three-dimensional schematic diagram of an imaging optical module and an electronic photosensitive element according to a first embodiment of the present invention is shown.

[0012] Figure 2 Draw Figure 1 Schematic diagram of the exploded imaging optical module and electronic photosensitive element.

[0013] Figure 3 Draw Figure 2 Schematic diagram of the exploded imaging components and electronic photosensitive elements in the image sensor.

[0014] Figure 4 Draw Figure 1 A three-dimensional cross-sectional schematic diagram of the imaging optical module.

[0015] Figure 5 Draw Figure 2 A three-dimensional schematic diagram of one of the ferromagnetic components.

[0016] Figure 6 Draw Figure 2 A three-dimensional schematic diagram of a ferromagnetic element embedded in a mounting portion.

[0017] Figure 7 Draw Figure 2 A three-dimensional schematic diagram showing that the first reed is connected to the mounting portion and electrically connected to the ferromagnetic element.

[0018] Figure 8 Draw Figure 7 An enlarged schematic diagram of area EL1.

[0019] Figure 9 Draw Figure 7 FIG. 1 is an enlarged schematic diagram of the first reed and the ferromagnetic element in the region EL1 .

[0020] Figure 10 Draw Figure 2 A three-dimensional schematic diagram showing that the driving coil and the first reed are both arranged on the mounting portion and electrically connected to the ferromagnetic element.

[0021] Figure 11 Draw Figure 10 Schematic diagram of the connection relationship between a set of driving coils, columnar structures and ferromagnetic elements.

[0022] Figure 12 A schematic three-dimensional diagram of a mounting portion, a driving coil, a first reed, and a ferromagnetic element of an imaging optical module according to a second embodiment of the present invention is shown.

[0023] Figure 13 Draw Figure 12 Schematic diagram of the ferromagnetic element in FIG.

[0024] Figure 14 Draw Figure 12 A three-dimensional schematic diagram of the ferromagnetic component and the mounting portion.

[0025] Figure 15 Draw Figure 14 An enlarged schematic diagram of area EL3.

[0026] Figure 16 Draw Figure 12 Schematic diagram of the connection relationship between the driving coil, columnar structure and ferromagnetic element.

[0027] Figure 17 Draw Figure 12 An enlarged schematic diagram of area EL2.

[0028] Figure 18 Draw Figure 12 FIG. 1 is an enlarged schematic diagram of the first reed and the ferromagnetic element in the region EL2 .

[0029] Figure 19A three-dimensional schematic diagram of a mounting portion, a driving coil, a first reed, and a ferromagnetic element of an imaging optical module according to a third embodiment of the present invention is shown.

[0030] Figure 20 Draw Figure 19 A three-dimensional schematic diagram of one of the ferromagnetic components.

[0031] Figure 21 Draw Figure 19 A three-dimensional schematic diagram of the ferromagnetic component and the mounting portion.

[0032] Figure 22 Draw Figure 19 Schematic diagram of the connection relationship between a set of driving coils, columnar structures and ferromagnetic elements.

[0033] Figure 23 Draw Figure 19 A three-dimensional schematic diagram of the mounting portion, the first reed and the ferromagnetic element.

[0034] Figure 24 Draw Figure 23 An enlarged schematic diagram of region EL4.

[0035] Figure 25 Draw Figure 23 FIG. 1 is an enlarged schematic diagram of the first reed and the ferromagnetic element in the area EL4. FIG.

[0036] Figure 26 Draw Figure 19 A three-dimensional schematic diagram of the mounting portion and the other side of the ferromagnetic component.

[0037] Figure 27 Draw Figure 26 Top view of the mounting portion and ferromagnetic components.

[0038] Figure 28 Draw Figure 27 A schematic cross-sectional view of the mounting portion and the ferromagnetic component along the section line 28-28.

[0039] Figure 29 A schematic perspective view of an imaging optical module and an electronic photosensitive element according to a fourth embodiment of the present invention is shown.

[0040] Figure 30 Draw Figure 29 Schematic diagram of the exploded imaging optical module and electronic photosensitive element.

[0041] Figure 31 Draw Figure 29 A three-dimensional cross-sectional schematic diagram of the imaging optical module.

[0042] Figure 32 Draw Figure 30A three-dimensional schematic diagram of one of the ferromagnetic components.

[0043] Figure 33 Draw Figure 30 A three-dimensional schematic diagram of a ferromagnetic element embedded in a carrier.

[0044] Figure 34 Draw Figure 30 A three-dimensional schematic diagram showing that the first reed is connected to the carrier and electrically connected to the ferromagnetic element.

[0045] Figure 35 Draw Figure 33 An enlarged schematic diagram of region EL5.

[0046] Figure 36 Draw Figure 34 A magnified schematic diagram of region EL6.

[0047] Figure 37 Draw Figure 30 A three-dimensional schematic diagram showing that the driving coil and the first reed are both disposed on a carrier and electrically connected to the ferromagnetic element.

[0048] Figure 38 Draw Figure 30 Schematic diagram of the connection relationship between a set of driving coils, columnar structures and ferromagnetic elements.

[0049] Figure 39 and Figure 40 This is a schematic diagram showing the process of forming ferromagnetic components through stamping.

[0050] Figure 41 Draw Figure 40 A magnified schematic diagram of region EL7.

[0051] Figure 42 A schematic diagram illustrating that the magnetic pole direction of the magnet is configured to allow the carrier to move along the imaging light path.

[0052] Figure 43 The diagram shows that the magnetic pole direction of the magnet is configured to allow the carrier to move along a direction perpendicular to the imaging light path.

[0053] Figure 44 A schematic three-dimensional diagram of an electronic device according to a fifth embodiment of the present invention is shown.

[0054] Figure 45 Draw Figure 44 A three-dimensional schematic diagram of the other side of the electronic device.

[0055] Figure 46 Draw Figure 44 A system block diagram of an electronic device.

[0056] Figure 47 Draw Figure 44 Schematic diagram of images captured by an electronic device with an equivalent focal length between 11mm and 14mm.

[0057] Figure 48 Draw Figure 44 Schematic diagram of images captured by an electronic device with an equivalent focal length between 22mm and 30mm.

[0058] Figure 49 Draw Figure 44 Schematic diagram of images captured by an electronic device with an equivalent focal length ranging from 60mm to 300mm.

[0059] Figure 50 Draw Figure 44 Schematic diagram of images captured by an electronic device with an equivalent focal length between 400mm and 600mm.

[0060] Figure Numbers

[0061] 1, 1b, 1c, 1d, 7a, 7b, 7c, 7d, 7e, 7f, 7g, 7h…imaging optical module

[0062] 10, 10d…imaging components

[0063] 11, 11d…Optical elements

[0064] 2. 2D... electronic photosensitive element

[0065] 30, 30b, 30c, 30d...optical element driving device

[0066] 31, 31d…fixed body

[0067] 311, 311d…housing

[0068] 313, 313d…base

[0069] 33, 33b, 33c, 33d…carrier

[0070] 331…Lens barrel

[0071] 333, 333b, 333c…installation

[0072] 3331, 3331b, 3331c, 3331d…columnar structure

[0073] 35, 35d…Supporting components

[0074] 351, 351b, 351c, 351d…first reed

[0075] 3511, 3511b, 3511d…carrier connection portion

[0076] 3513…Fixed body connection

[0077] 3515, 3515b, 3515d…elastic arm

[0078] 3517, 3517c, 3517d… Ferromagnetic component connection

[0079] 353, 353d…Second reed

[0080] 37, 37d…Electromagnetic drive assembly

[0081] 371, 371b, 371c, 371d...driving coils

[0082] 3711, 3711c, 3711d…wire terminals

[0083] 373, 373d…driving magnet

[0084] 3731…Corresponding surface

[0085] 375, 375b, 375c, 375d… ferromagnetic components

[0086] 3751, 3751b, 3751c, 3751d…magnetic conductive parts

[0087] 3753, 3753b, 3753c, 3753d ... first electrical connection portion

[0088] 3755, 3755b, 3755c, 3755d ... second electrical connection portion

[0089] 38b…Electrical barrier layer

[0090] 39c…light-shielding layer

[0091] 7…Electronic devices

[0092] 72…Light-emitting element

[0093] 73…Focus assist module

[0094] 74…System on a Chip

[0095] 75…Display device

[0096] 751…Zoom control key

[0097] 752…Focus and photo taking button

[0098] 753…Video playback button

[0099] 754…Imaging optical module switch button

[0100] 755…Integrated menu button

[0101] 77…Biometric Sensors

[0102] 78…Circuit Board

[0103] 781…Connector

[0104] 79…Electronic components

[0105] 7k…Tips light

[0106] ME…Ferromagnetic components

[0107] SHM… panels

[0108] PU…Punch

[0109] LD…lower die

[0110] DR…Rounded Corners

[0111] BR…Raw Edge

[0112] CB…Carrier

[0113] MG…magnet

[0114] PL…Imaging optical path

[0115] IMG…imaging surface

[0116] LE…Lens

[0117] SE…Shading element

[0118] CP...coil installation position

[0119] CR…Contact area

[0120] ER…Elastic Zone

[0121] FE…Fixed end

[0122] SS…Shear surface

[0123] TS…Tear-off noodles

[0124] CS…Section

[0125] FCE…First Conductor Terminal

[0126] SCE…Second conductor terminal

[0127] GT…Glue Tank

[0128] INS…Inside

[0129] OBJ…object DETAILED DESCRIPTION

[0130] The following detailed description of the features and advantages of the present invention is intended to be sufficient to enable those skilled in the art to understand the technical content of the present invention and implement it accordingly. Furthermore, based on the disclosure of this specification, the scope of the claims, and the accompanying drawings, those skilled in the art can readily understand the relevant objects and advantages of the present invention. The following examples further illustrate the concepts of the present invention but are not intended to limit the scope of the present invention in any way.

[0131] The present invention provides an optical element driving device, which includes a fixed body, a carrier, a supporting mechanism, and an electromagnetic driving assembly. The carrier is used to accommodate at least one optical element, and the carrier has at least one degree of freedom of movement relative to the fixed body. The optical element can be a lens, a mirror, a shading element, a prism, or a filter element, and the carrier can be further defined as a lens carrier, a prism carrier, etc. depending on the type of optical element. In addition, the fixed body can be, for example, a housing, a platform, or another carrier used as a reference by the above-mentioned carrier. The supporting mechanism is connected to the carrier and the fixed body so that the carrier has at least one degree of freedom of movement relative to the fixed body.

[0132] The electromagnetic drive assembly is used to drive the carrier to move relative to a fixed body, and includes a drive coil, a drive magnet, and a ferromagnetic element. The drive coil is disposed on the carrier. The drive magnet is disposed on the fixed body and is opposite the drive coil. The ferromagnetic element is embedded in the carrier, so that the ferromagnetic element and the carrier share at least one degree of freedom of movement relative to the fixed body. The ferromagnetic element can be integrally molded into the carrier by insert molding. Specifically, for example, the ferromagnetic element can be embedded into the carrier by insert molding. However, the present invention is not limited to this method. In some embodiments, the ferromagnetic element can also be embedded into a thermoplastic carrier by, for example, heat riveting. The ferromagnetic element is integrally molded and includes a magnetic conductive portion and a first electrical connection portion. The magnetic conductive portion faces at least one of the drive coil and the drive magnet. The first electrical connection portion is exposed on the surface of the carrier and is electrically connected to the drive coil. Thus, the ferromagnetic element performs both magnetic conductivity and circuit connection functions, thereby reducing the number of parts in the optical element drive device and improving production efficiency.

[0133] The optical element driving device disclosed in the present invention can guide the magnetic field distribution of the electromagnetic driving component to enhance the driving force by disposing a conductive ferromagnetic element on a carrier, and can also improve the spatial distribution of the driving coil that is limited by electrical requirements, thereby increasing design freedom.

[0134] The driving magnet has a corresponding surface that faces both the magnetic conductive portion and the driving coil, with the magnetic conductive portion being further away from the corresponding surface than the driving coil. Thus, through the above spatial arrangement, the magnetic field distribution of the driving magnet can be guided, thereby increasing the magnetic flux passing through the driving coil.

[0135] The magnetic conductive portion of the ferromagnetic element can be surrounded by the driving coil. Thus, through the above-mentioned spatial arrangement, the magnetic conductive portion can be magnetized by the driving coil, thereby increasing the magnetic field strength of the driving coil.

[0136] The support mechanism may include a conductive reed. The ferromagnetic element may also include a second electrical connection portion electrically connected to the reed. The reed is electrically connected in series with the drive coil via the second and first electrical connections. This prevents direct contact between the drive coil and the reed, which could affect the reed's flatness, thereby improving assembly yield. Furthermore, the spatial arrangement between the reed and the drive coil, which is limited by electrical requirements, can be improved, thereby increasing design freedom.

[0137] The second electrical connection portion may include a contact region and an elastic region. The contact region is in physical contact with the reed, and the elastic region is connected to the contact region and normally applies an elastic force toward the reed. This allows for an electrical connection between the ferromagnetic element and the reed, while preventing warping of the reed caused by soldering, further improving assembly yield.

[0138] The carrier may include a barrel portion and a mounting portion, wherein the optical element is disposed in the barrel portion, and the barrel portion, support mechanism, drive coil, and ferromagnetic element are all disposed in the mounting portion. Thus, the optical element can be preassembled in the barrel portion and then mounted in the mounting portion, thereby improving the production process. However, the present invention is not limited to the above-mentioned two-piece carrier structure. In other embodiments, the carrier may be integrally formed by injection molding, and the carrier includes an inner side surface that directly contacts the optical element. This can reduce assembly tolerances.

[0139] The ferromagnetic element can be integrally formed with a shear surface, a tear surface and a truncation surface by stamping, wherein the tear surface is arranged opposite to the shear surface, and the truncation surface connects the shear surface and the tear surface. The drive coil is not in physical contact with the tear surface. In the stamping method, the ferromagnetic element will simultaneously generate a shear surface, a tear surface opposite to the shear surface, and a truncation surface connected therebetween, wherein the intersection of the shear surface and the truncation surface has a fillet produced by plastic deformation, and the intersection of the tear surface and the truncation surface has burrs produced by tearing. Therefore, by configuring the drive coil to not be in physical contact with the tear surface on the first electrical connection portion, the risk of the drive coil being cut off by burrs can be avoided. Please refer to Figure 39 and Figure 40 , is a schematic diagram illustrating the process of forming the ferromagnetic element ME by stamping, such as Figure 39 and Figure 40 As shown in FIG, a plate SHM is cut by the punch PU and the lower die LD, thereby forming a ferromagnetic element ME. Figure 41 , is a drawing Figure 40 , an enlarged schematic diagram of region EL7 shows that after stamping, the ferromagnetic element ME has a rounded corner DR at the intersection of the shear surface SS and the cross-section surface CS due to plastic deformation, while a burr BR is generated by tearing at the intersection of the tear surface TS and the cross-section surface CS.

[0140] The first electrical connection portion of the ferromagnetic element can be disposed on a columnar structure of the carrier, wherein the tear surface located on the first electrical connection portion faces the columnar structure, and the shear surface located on the first electrical connection portion physically contacts the drive coil. Thus, by covering the tear surface on the carrier, the risk of the drive coil being cut by burrs can be further reduced. The drive coil can include two wire terminals, one of which is wound around the columnar structure and physically contacts the shear surface of the first electrical connection portion to establish an electrical connection. Thus, the electrical connection to the ferromagnetic element is simultaneously completed when the wire terminal is secured to the columnar structure, thereby reducing the number of assembly steps.

[0141] The optical element driving device may further include a light-shielding layer, and the light-shielding layer is arranged on the ferromagnetic element. Furthermore, the ferromagnetic element may have at least a portion not covered by the carrier, and the light-shielding layer is arranged on the portion of the ferromagnetic element not covered by the carrier. Thereby, it is possible to prevent light from being reflected by the ferromagnetic element and affecting the optical properties. For example, in an imaging optical module, light reflected by the ferromagnetic element will produce glare and affect the imaging quality. The light-shielding layer may further be a damping layer with a damping function. In one embodiment, the carrier may have a glue-containing groove at the position where the ferromagnetic element is exposed to the outside, and the light-shielding layer may be a damping arranged in the glue-containing groove, thereby reducing the jitter of the carrier during actuation.

[0142] The optical element driving device may further include an electrical blocking layer, and the electrical blocking layer is disposed on the ferromagnetic element. Furthermore, the ferromagnetic element may have at least a portion uncovered by the carrier, and the electrical blocking layer is disposed on the portion of the ferromagnetic element uncovered by the carrier. This prevents electrical connection to the exposed portion of the ferromagnetic element, thereby ensuring the functionality of the driving device. The electrical blocking layer may further be a damping layer having a damping function. In one embodiment, the electrical blocking layer may also have a light-shielding effect to prevent non-imaging light from reflecting off the ferromagnetic element and entering the electronic photosensitive element, thereby generating glare.

[0143] The present invention provides an imaging optical module, which includes the aforementioned optical element driving device and an imaging component, wherein the imaging component includes the optical element located on the imaging light path.

[0144] The carrier can have the freedom to move along the imaging optical path. In this way, the optical element driving device can make the imaging optical module have the functionality of zooming or focusing. In detail, the setting of the magnetic pole direction will affect the actuation direction of the carrier. For example, please refer to Figure 42 , is a schematic diagram showing that the magnetic pole direction of the magnet MG is configured to provide the carrier CB with movement along the imaging light path PL. When the magnetic pole direction is set parallel to the imaging light path PL, the carrier CB can move along the imaging light path PL to produce a zoom or focus effect.

[0145] The carrier can have the freedom of movement perpendicular to the imaging optical path. In this way, the optical element driving device can enable the imaging optical module to have the function of anti-shake or offset optical axis. In detail, the setting of the magnetic pole direction will affect the movement direction of the carrier. For example, please refer to Figure 43 , is a schematic diagram showing that the magnetic pole direction of the magnet MG is configured to provide the carrier CB with movement along a direction perpendicular to the imaging light path PL. When the magnetic pole direction is set perpendicular to the imaging light path PL, the carrier CB can move along the direction perpendicular to the imaging light path PL to produce an anti-shake or optical axis offset effect.

[0146] The present invention provides an electronic device, which includes the aforementioned imaging optical module and an electronic photosensitive element, wherein the electronic photosensitive element is disposed on an imaging surface of the imaging optical module.

[0147] The various technical features of the optical element driving device and the imaging optical module of the present invention can be configured in combination to achieve corresponding effects.

[0148] Based on the above implementation manner, specific embodiments are presented below and described in detail with reference to the accompanying drawings.

[0149] <First embodiment>

[0150] Please refer to Figures 1 to 11 ,in Figure 1 A schematic perspective view of an imaging optical module and an electronic photosensitive element according to a first embodiment of the present invention is shown. Figure 2 Draw Figure 1 Schematic diagram of the decomposition of the imaging optical module and electronic photosensitive element, Figure 3 Draw Figure 2 Schematic diagram of the imaging components and electronic photosensitive elements in the image processing module. Figure 4 Draw Figure 1 A three-dimensional cross-sectional diagram of the imaging optical module, Figure 5 Draw Figure 2 A three-dimensional schematic diagram of one of the ferromagnetic components, Figure 6 Draw Figure 2 A three-dimensional schematic diagram of a ferromagnetic element embedded in a mounting portion, Figure 7 Draw Figure 2A three-dimensional schematic diagram showing that the first reed is connected to the mounting portion and electrically connected to the ferromagnetic element, Figure 8 Draw Figure 7 An enlarged schematic diagram of area EL1, Figure 9 Draw Figure 7 An enlarged schematic diagram of the first reed and the ferromagnetic element in the region EL1, Figure 10 Draw Figure 2 A three-dimensional schematic diagram showing that the driving coil and the first reed are both arranged on the mounting portion and electrically connected to the ferromagnetic element, and Figure 11 Draw Figure 10 Schematic diagram of the connection relationship between a set of driving coils, columnar structures and ferromagnetic elements.

[0151] The imaging optical module 1 includes an imaging component 10 and an optical element driving device 30, wherein the imaging component 10 includes a plurality of optical elements 11. In addition, an electronic photosensitive element 2 is disposed on an imaging surface IMG of the imaging optical module 1. Figure 3 As shown, the optical element 11 includes a plurality of lenses LE and a plurality of light-shielding elements SE, and the lenses LE and the light-shielding elements SE are arranged in sequence along the imaging optical path PL.

[0152] The optical element driving device 30 includes a fixed body 31, a carrier 33, a supporting mechanism 35, and an electromagnetic driving assembly 37. The fixed body 31 includes a housing 311 and a base 313. The housing 311 is mounted on the base 313 to form a receiving space for the carrier 33, the supporting mechanism 35, and the electromagnetic driving assembly 37.

[0153] The carrier 33 includes a barrel portion 331 and a mounting portion 333, wherein the barrel portion 331 is disposed on the mounting portion 333, and the optical element 11 is accommodated in the barrel portion 331. In this embodiment, the optical element 11 is pre-assembled on the barrel portion 331, and then the barrel portion 331 assembled with the optical element 11 is mounted on the mounting portion 333, thereby improving the production process.

[0154] The support mechanism 35 includes two first reeds 351 and a second reed 353. The first reeds 351 are conductive and connected to the mounting portion 333 and the base 313, while the second reed 353 is connected to the mounting portion 333 and the housing 311. This allows the support mechanism 35 to provide the carrier 33 with at least one degree of freedom relative to the fixed body 31. Each first reed 351 includes a carrier connection portion 3511, two fixed body connection portions 3513, and two elastic arms 3515. The carrier connection portion 3511 is connected to the mounting portion 333 of the carrier 33. The fixed body connection portion 3513 is connected to the base 313 of the fixed body 31, and the elastic arms 3515 connect the fixed body connection portion 3513 and the carrier connection portion 3511.

[0155] The electromagnetic driving assembly 37 is used to drive the carrier 33 to move relative to the fixed body 31, and the electromagnetic driving assembly 37 includes two driving coils 371, two driving magnets 373 and two ferromagnetic elements 375 respectively disposed on opposite sides of the mounting portion 333. The two driving coils 371 are formed by the same wire.

[0156] like Figure 2 、 Figure 4 、 Figure 6 and Figure 10 As shown, the driving coil 371 is disposed at the coil mounting position CP of the mounting portion 333 of the carrier 33 , and the driving magnet 373 is disposed on the fixed body 31 and opposite to the driving coil 371 .

[0157] The ferromagnetic element 375 is embedded in the mounting portion 333 of the thermoplastic carrier 33 by, for example, insert injection molding or heat riveting, so that the ferromagnetic element 375 is embedded in the mounting portion 333 of the carrier 33 and has at least one degree of freedom relative to the fixed body 31 as the carrier 33. Figure 5 As shown, the ferromagnetic element 375 is integrally formed and includes a magnetic conductive portion 3751 , a first electrical connection portion 3753 and a second electrical connection portion 3755 .

[0158] The magnetic conductive portion 3751 faces the driving coil 371 and the driving magnet 373. Figure 2 and Figure 4 As shown, the driving magnet 373 has a corresponding surface 3731, which faces the magnetic conductive portion 3751 of the ferromagnetic element 375 and the driving coil 371 at the same time, and the magnetic conductive portion 3751 is farther away from the corresponding surface 3731 of the driving magnet 373 than the driving coil 371, thereby guiding the magnetic field distribution of the driving magnet 373, thereby increasing the magnetic flux passing through the driving coil 371.

[0159] The first electrical connection portion 3753 is disposed on a columnar structure 3331 of the mounting portion 333 and is exposed on the surface of the mounting portion 333. The first electrical connection portion 3753 is electrically connected to the driving coil 371. Figure 11As shown, the driving coil 371 includes a wire terminal 3711. The wire terminal 3711 is wrapped around the columnar structure 3331 of the mounting portion 333 and physically contacts the first electrical connection portion 3753 to establish an electrical connection. This allows the wire terminal 3711 to be secured to the columnar structure 3331 while also being electrically connected to the ferromagnetic element 375, thereby reducing assembly steps. In this embodiment, the magnetic conductive portion 3751 faces the driving coil 371 and the driving magnet 373, and the first electrical connection portion 3753 is electrically connected to the driving coil 371. Thus, the ferromagnetic element 375 serves both as a magnetic conductor and as an electrical connection, thereby reducing the number of parts in the optical element driving device 30 and improving production efficiency.

[0160] The second electrical connection portion 3755 is electrically connected to the first spring 351, and the first spring 351 is electrically connected in series with the drive coil 371 via the second electrical connection portion 3755 and the first electrical connection portion 3753. This can prevent the drive coil 371 from directly contacting the first spring 351 and affecting the flatness of the first spring 351, thereby improving the assembly yield rate and improving the spatial distribution of the first spring 351 and the drive coil 371 that is limited by electrical requirements, thereby increasing design freedom. Figures 7 to 9 As shown, each first reed 351 further includes a ferromagnetic element connection portion 3517 extending from the carrier connection portion 3511, and each second electrical connection portion 3755 includes a contact region CR and an elastic region ER. The ferromagnetic element connection portion 3517 is secured to the fixed end FE of the mounting portion 333 via a heat riveting process. Simultaneously, the second electrical connection portion 3755 is crimped and bent to form the contact region CR and elastic region ER. This creates physical contact between the contact region CR and the first reed 351, while the elastic region ER connects to the contact region CR and constantly applies an elastic force toward the first reed 351. This establishes an electrical connection between the ferromagnetic element 375 and the first reed 351, preventing warping of the first reed that can occur with soldering, and further improving assembly yield. In this embodiment, the ferromagnetic element 375 has a shearing surface, a tearing surface and a truncation surface, wherein the shearing surface, the tearing surface and the truncation surface are formed by the ferromagnetic element 375 through stamping. Figures 39 to 41 The tearing surface TS of the first electrical connection portion 3753 faces the columnar structure 3331 and covers the columnar structure 3331, and the driving coil 371 is in physical contact with the shear surface SS of the first electrical connection portion 3753 but not in physical contact with the tearing surface TS, thereby avoiding the risk of the driving coil 371 being cut off by the burr BR at the intersection of the tearing surface TS and the cutting surface CS.

[0161] The driving magnet 373 of this embodiment can have different magnetic pole direction configurations according to different functional requirements, so that the carrier 33 can have the freedom to move along the imaging optical path PL, thereby allowing the imaging optical module 1 to have the functionality of zooming or focusing, or the carrier 33 can have the freedom to move perpendicular to the imaging optical path PL, thereby allowing the imaging optical module 1 to have the function of anti-shake or offset optical axis. Its configuration can be similar to the corresponding Figure 42 and Figure 43 Description.

[0162] <Second embodiment>

[0163] Please refer to Figures 12 to 18 ,in Figure 12 A schematic perspective view of a mounting portion, a driving coil, a first reed, and a ferromagnetic element of an imaging optical module according to a second embodiment of the present invention is shown. Figure 13 Draw Figure 12 A three-dimensional schematic diagram of the ferromagnetic element in Figure 14 Draw Figure 12 A three-dimensional schematic diagram of the ferromagnetic element and the mounting portion, Figure 15 Draw Figure 14 An enlarged schematic diagram of area EL3, Figure 16 Draw Figure 12 Schematic diagram of the connection relationship between the driving coil, columnar structure and ferromagnetic element, Figure 17 Draw Figure 12 is an enlarged schematic diagram of region EL2, and Figure 18 Draw Figure 12 FIG. 1 is an enlarged schematic diagram of the first reed and the ferromagnetic element in the region EL2 .

[0164] The imaging optical module 1b of this embodiment has similar structural features to the imaging optical module 1 of the first embodiment. The primary difference lies in the structural features of the drive coil, first reed, and ferromagnetic element disposed on the mounting portion of this embodiment, which differ from those of the first embodiment. The similar structural features between the imaging optical modules of the two embodiments refer to the fact that, aside from the mounting portion, drive coil, first reed, and ferromagnetic element, all other components of the imaging optical modules of the two embodiments share the same structural features, and therefore, detailed description thereof will not be given.

[0165] Specifically, each of the two ferromagnetic elements 375b is integrally formed and includes a magnetic conducting portion 3751b, two first electrical connecting portions 3753b, and two second electrical connecting portions 3755b. The magnetic conducting portion 3751b and the two first electrical connecting portions 3753b are located at the side adjacent to the mounting portion 333b, and the two second electrical connecting portions 3755b are located between the first electrical connecting portions 3753b. The first electrical connecting portions 3753b are respectively arranged on the columnar structures 3331b at the four corners of the mounting portion 333b and exposed on the surface of the mounting portion 333b, and the tear surface TS of the first electrical connecting portions 3753b faces the columnar structures 3331b and covers the columnar structures 3331b.

[0166] The drive coil 371b is arranged on the coil mounting position CP at the side of the mounting portion 333b and corresponds to the two magnetic conducting portions 3751b. Each drive coil 371b includes a first wire terminal FCE and a second wire terminal SCE. The first wire terminal FCE is wound on one columnar structure 3331b of the mounting portion 333b and in physical contact with the shear surface SS of one first electrical connecting portion 3753b of one ferromagnetic element 375b, and the second wire terminal SCE is wound on another columnar structure 3331b of the mounting portion 333b and in physical contact with the shear surface SS of one first electrical connecting portion 3753b of another ferromagnetic element 375b. Moreover, the drive coil 371b is in physical contact with the shear surface SS of the first electrical connecting portion 3753b but not in physical contact with the tear surface TS, so that the risk of the drive coil 371b being cut off by the burr BR at the intersection of the tear surface TS and the cut-off surface CS can be avoided.

[0167] In addition, the first reed 351b of the present embodiment is electrically connected to the second electrical connecting portion 3755b of the ferromagnetic element 375b by the carrier connecting portion 3511b, and does not have the structure of the ferromagnetic element connecting portion as in the first embodiment. Specifically, as shown in Figure 12 、 Figure 17 and Figure 18 the carrier connecting portion 3511b is press-fitted to the second electrical connecting portion 3755b at the fixed end FE of the mounting portion 333b by the hot riveting process, so that the ferromagnetic element 375b and the first reed 351b are electrically connected.

[0168] Furthermore, in this embodiment, the optical element driving device 30b further includes an electrical blocking layer 38b. The ferromagnetic element 375b has a portion that is not covered by the mounting portion 333b of the carrier 33b, and the uncovered portion of the ferromagnetic element 375b is exposed on the surface of the mounting portion 333b facing the base. The electrical blocking layer 38b is disposed on the uncovered portion of the ferromagnetic element 375b to prevent the elastic arm portion 3515b of the first reed 351b from electrically connecting with the ferromagnetic element 375b during deformation, thereby ensuring the functionality of the driving device. Furthermore, the electrical blocking layer 38b also has a light-shielding effect, preventing non-imaging light from reflecting off the ferromagnetic element 375b and entering the electronic photosensitive element, thereby generating glare.

[0169] <Third embodiment>

[0170] Please refer to Figures 19 to 28 ,in Figure 19 A three-dimensional schematic diagram of a mounting portion, a driving coil, a first reed, and a ferromagnetic element of an imaging optical module according to a third embodiment of the present invention is shown. Figure 20 Draw Figure 19 A three-dimensional schematic diagram of one of the ferromagnetic components, Figure 21 Draw Figure 19 A three-dimensional schematic diagram of the ferromagnetic element and the mounting portion, Figure 22 Draw Figure 19 Schematic diagram of the connection relationship between one set of driving coils, columnar structure and ferromagnetic elements, Figure 23 Draw Figure 19 A three-dimensional schematic diagram of the mounting portion, the first reed and the ferromagnetic element in FIG. Figure 24 Draw Figure 23 An enlarged schematic diagram of region EL4, Figure 25 Draw Figure 23 An enlarged schematic diagram of the first reed and the ferromagnetic element in the region EL4, Figure 26 Draw Figure 19 A three-dimensional diagram of the mounting portion and the other side of the ferromagnetic component, Figure 27 Draw Figure 26 A top view of the mounting portion and ferromagnetic components, and Figure 28 Draw Figure 27 A schematic cross-sectional view of the mounting portion and the ferromagnetic component along the section line 28-28.

[0171] The imaging optical module 1c of the present embodiment and the imaging optical module 1 of the first embodiment have similar structural features, and the main difference is that the structural features of the drive coil, the first spring plate, and the ferromagnetic element configured on the mounting portion of the present embodiment are different from those of the first embodiment. The imaging optical modules of the two embodiments have similar structural features, which means that the elements of the imaging optical modules of the two embodiments, except for the mounting portion, the drive coil, the first spring plate, and the ferromagnetic element, have the same structural features, and thus will not be described again.

[0172] Specifically, each of the two ferromagnetic elements 375c of the present embodiment is integrally formed and includes a magnetic conduction portion 3751c, a first electrical connection portion 3753c, and a second electrical connection portion 3755c. The first electrical connection portion 3753c is disposed on a columnar structure 3331c of the mounting portion 333c and exposed on the surface of the mounting portion 333c, and the tear surface TS of the first electrical connection portion 3753c faces the columnar structure 3331c and covers the columnar structure 3331c.

[0173] The two drive coils 371c are disposed on the coil mounting positions CP on both sides of the mounting portion 333c and correspond to the two magnetic conduction portions 3751c, respectively, and the two drive coils 371c are formed by the same wire. Each drive coil 371c includes a wire terminal 3711c, which is wound on the columnar structure 3331c of the mounting portion 333c and in physical contact with the first electrical connection portion 3753c to achieve electrical connection. In this way, the electrical connection with the ferromagnetic element 375c can be completed at the same time as the fixation of the wire terminal 3711c on the columnar structure 3331c, thereby reducing the assembly process. Moreover, the shear surface SS of the drive coil 371c is in physical contact with the first electrical connection portion 3753c, but not with the tear surface TS, so that the risk of the drive coil 371c being cut off by the burr BR at the intersection of the tear surface TS and the cut-off surface CS can be avoided.

[0174] In addition, the ferromagnetic element connecting portion 3517c of the first spring plate 351c of the present embodiment is fixed to the fixed end FE of the mounting portion 333c by the hot riveting process, and simultaneously presses the second electrical connection portion 3755c to fix the second electrical connection portion 3755c to the fixed end FE of the mounting portion 333c by the crimping method, so as to achieve electrical connection between the ferromagnetic element 375c and the first spring plate 351c.

[0175] Moreover, in this embodiment, the optical element driving device 30c further includes a light shielding layer 39c. The ferromagnetic element 375c has a portion that is not covered by the mounting portion 333c of the carrier 33c, and the uncovered portion of the ferromagnetic element 375c is exposed on the surface of the mounting portion 333c facing the object side. The light shielding layer 39c is covered on the uncovered portion of the ferromagnetic element 375c, so as to avoid affecting the appearance and reduce the glare caused by the non-imaging light entering the electronic photosensitive element through the reflection of the ferromagnetic element 375c. In addition, the light shielding layer 39c is further a damping layer with a damping function. Specifically, the mounting portion 333c may have a glue groove GT at the position where the ferromagnetic element 375c is exposed to the outside, and the light shielding layer 39c may be a damping arranged in the glue groove GT, thereby reducing the jitter of the carrier 33c during operation.

[0176] <Fourth embodiment>

[0177] Please refer to Figures 29 to 38 ,in Figure 29 A schematic perspective view of an imaging optical module and an electronic photosensitive element according to a fourth embodiment of the present invention is shown. Figure 30 Draw Figure 29 Schematic diagram of the decomposition of the imaging optical module and electronic photosensitive element, Figure 31 Draw Figure 29 A three-dimensional cross-sectional diagram of the imaging optical module, Figure 32 Draw Figure 30 A three-dimensional schematic diagram of one of the ferromagnetic components, Figure 33 Draw Figure 30 A three-dimensional schematic diagram of a ferromagnetic element embedded in a carrier, Figure 34 Draw Figure 30 A three-dimensional schematic diagram showing that the first reed is connected to the carrier and electrically connected to the ferromagnetic element, Figure 35 Draw Figure 33 An enlarged schematic diagram of region EL5, Figure 36 Draw Figure 34 An enlarged schematic diagram of region EL6, Figure 37 Draw Figure 30 A three-dimensional schematic diagram showing that the driving coil and the first reed are both disposed on a carrier and electrically connected to the ferromagnetic element, and Figure 38 Draw Figure 30 Schematic diagram of the connection relationship between a set of driving coils, columnar structures and ferromagnetic elements.

[0178] The imaging optical module 1d of the present embodiment and the imaging optical module 1 of the first embodiment have similar structural features, and the main difference is that the structural features of the carrier and the driving coil, the first spring and the ferromagnetic element arranged on the carrier of the present embodiment are different from the structural features of the carrier, the driving coil, the first spring and the ferromagnetic element of the first embodiment. The imaging optical modules of the two embodiments have similar structural features, which means that the elements of the imaging optical modules of the two embodiments, except for the carrier, the driving coil, the first spring and the ferromagnetic element, have the same structural features.

[0179] The imaging optical module 1d comprises an imaging assembly 10d and an optical element driving device 30d, wherein the imaging assembly 10d comprises a plurality of optical elements 11d arranged in sequence along an imaging light path PL. In addition, an electronic photosensitive element 2d is arranged on an imaging surface IMG of the imaging optical module 1d.

[0180] The optical element driving device 30d comprises a fixed body 31d, a carrier 33d, a support mechanism 35d and an electromagnetic driving assembly 37d, wherein the fixed body 31d comprises a housing 311d and a base 313d. The housing 311d is arranged on the base 313d and forms a containing space for arranging the carrier 33d, the support mechanism 35d and the electromagnetic driving assembly 37d.

[0181] The carrier 33d of the present embodiment is integrally formed by injection molding, wherein the carrier 33d comprises an inner side surface INS, and the inner side surface INS is in direct contact with the optical element 11d, thereby reducing the assembly tolerance.

[0182] The support mechanism 35d comprises two first springs 351d and a second spring 353d, wherein the first spring 351d has electrical conductivity and is connected to the carrier 33d and the base 313d, and the second spring 353d is connected to the carrier 33d and the housing 311d, so that the support mechanism 35d enables the carrier 33d to have at least one degree of freedom relative to the fixed body 31d. Each first spring 351d comprises a carrier connecting portion 3511d, two fixed body connecting portions 3513d and two elastic arm portions 3515d, wherein the carrier connecting portion 3511d is connected to the carrier 33d. The fixed body connecting portion 3513d is connected to the base 313d of the fixed body 31d, and the elastic arm portion 3515d connects the fixed body connecting portion 3513d and the carrier connecting portion 3511d.

[0183] The electromagnetic driving assembly 37d is used to drive the carrier 33d to act relative to the fixed body 31d, and the electromagnetic driving assembly 37d comprises two driving coils 371d, two driving magnets 373d and two ferromagnetic elements 375d arranged on opposite sides of the carrier 33d respectively, and the two driving coils 371d are formed by the same wire.

[0184] like Figure 30 、 Figure 31 、 Figure 33 and Figure 37 As shown, the driving coil 371d is disposed at the coil mounting position CP of the carrier 33d, and the driving magnet 373d is disposed on the fixed body 31d and opposite to the driving coil 371d.

[0185] The ferromagnetic element 375d is embedded in the thermoplastic carrier 33d by, for example, insert injection molding or heat riveting, so that the ferromagnetic element 375d is embedded in the carrier 33d and has at least one degree of freedom relative to the fixed body 31d as the carrier 33d. Figure 32 As shown, the ferromagnetic element 375d is integrally formed and includes a magnetic conductive portion 3751d, a first electrical connection portion 3753d and a second electrical connection portion 3755d.

[0186] The magnetic conductive portion 3751d faces the driving coil 371d. Figure 38 As shown, the magnetic conductive portion 3751d of the ferromagnetic element 375d of this embodiment is surrounded by the driving coil 371d, so that the magnetic conductive portion 3751d can be magnetized by the driving coil 371d, thereby increasing the magnetic field strength of the driving coil 371d.

[0187] The first electrical connection portion 3753d is disposed on a columnar structure 3331d of the carrier 33d and exposed on the surface of the carrier 33d, and the first electrical connection portion 3753d is electrically connected to the driving coil 371d. Figure 38 As shown, the driving coil 371d includes a wire terminal 3711d. The wire terminal 3711d is wrapped around the columnar structure 3331d of the carrier 33d and physically contacts the first electrical connection portion 3753d to establish an electrical connection. This allows the wire terminal 3711d to be secured to the columnar structure 3331d while also being electrically connected to the ferromagnetic element 375d, thereby reducing assembly steps. In this embodiment, the magnetic conductive portion 3751d faces the driving coil 371d, and the first electrical connection portion 3753d is electrically connected to the driving coil 371d. Thus, the ferromagnetic element 375d serves both as a magnetic conductor and as an electrical connection, thereby reducing the number of parts in the optical element driving device 30d and improving production efficiency.

[0188] The second electrical connection portion 3755d is electrically connected to the first spring 351d, and the first spring 351d is electrically connected in series with the drive coil 371d via the second electrical connection portion 3755d and the first electrical connection portion 3753d. This can prevent the drive coil 371d from directly contacting the first spring 351d and affecting the flatness of the first spring 351d, thereby improving the assembly yield rate and improving the spatial distribution of the first spring 351d and the drive coil 371d that is limited by electrical requirements, thereby increasing design freedom. Figures 32 to 36 As shown, each first reed 351d further includes a ferromagnetic element connection portion 3517d extending from the carrier connection portion 3511d, and each second electrical connection portion 3755d includes a contact region CR and an elastic region ER. The ferromagnetic element connection portion 3517d is secured to the fixed end FE of the carrier 33d via a heat riveting process. Simultaneously, the second electrical connection portion 3755d is crimped and bent to form the contact region CR and the elastic region ER. This creates physical contact between the contact region CR and the first reed 351d, while the elastic region ER connects to the contact region CR and constantly applies an elastic force toward the first reed 351d. This establishes an electrical connection between the ferromagnetic element 375d and the first reed 351d, preventing warping of the first reed that can occur with soldering, and further improving assembly yield. In this embodiment, the ferromagnetic element 375d has a shearing surface, a tearing surface and a truncation surface, wherein the shearing surface, the tearing surface and the truncation surface are formed by the ferromagnetic element 375d through stamping. Figures 39 to 41 The tear surface TS of the first electrical connection portion 3753d faces the columnar structure 3331d and covers the columnar structure 3331d, and the drive coil 371d is in physical contact with the shear surface SS of the first electrical connection portion 3753d but not with the tear surface TS, thereby avoiding the risk of the drive coil 371d being cut off by the burr BR at the intersection of the tear surface TS and the cut surface CS.

[0189] The driving magnet 373d of this embodiment can have different magnetic pole direction configurations according to different functional requirements, so that the carrier 33d can have the freedom to move along the imaging optical path PL, thereby allowing the imaging optical module 1d to have the functionality of zooming or focusing, or the carrier 33d can have the freedom to move perpendicular to the imaging optical path PL, thereby allowing the imaging optical module 1d to have the function of anti-shake or offset optical axis. Its configuration can be similar to the corresponding Figure 42 and Figure 43 Description.

[0190] <Fifth embodiment>

[0191] Please refer to Figures 44 to 46 ,in Figure 44FIG2 is a perspective diagram of an electronic device according to a fifth embodiment of the present invention. Figure 45 Draw Figure 44 A three-dimensional schematic diagram of the other side of the electronic device, and Figure 46 Draw Figure 44 A system block diagram of an electronic device.

[0192] In this embodiment, electronic device 7 is a mobile device, which may be a computer, a smartphone, a smart wearable device, a drone, or an in-vehicle image recording and display device, etc., but the present invention is not limited thereto. Electronic device 7 includes imaging optical module 7a, imaging optical module 7b, imaging optical module 7c, imaging optical module 7d, imaging optical module 7e, imaging optical module 7f, imaging optical module 7g, imaging optical module 7h, a light emitting element 72, a focus assist module 73, an image signal processor, a display device 75, an image software processor, a biometric sensor 77, and an electronic photosensitive element.

[0193] Imaging optical module 7a, imaging optical module 7b, imaging optical module 7c, imaging optical module 7d, imaging optical module 7e, imaging optical module 7f, imaging optical module 7g and imaging optical module 7h may respectively include the optical element driving device and imaging assembly of the present invention, for example.

[0194] Imaging optical modules 7a, 7b, 7c, 7d, and 7e are all located on the same side of electronic device 7. Imaging optical modules 7f, 7g, and 7h, along with a display device 75, are all located on the other side of electronic device 7. Display device 75 can serve as a user interface, allowing imaging optical modules 7f, 7g, and 7h to function as front-facing cameras for selfie capture, but the present invention is not limited thereto.

[0195] The imaging optical module 7a is a super telephoto imaging device, the imaging optical module 7b is a macro imaging device, the imaging optical module 7c is a wide-angle imaging device, the imaging optical module 7d is an ultra-wide-angle imaging device, the imaging optical module 7e is a telephoto imaging device, the imaging optical module 7f is an ultra-wide-angle imaging device, the imaging optical module 7g is a wide-angle imaging device, and the imaging optical module 7h is a Time of Flight (ToF) imaging device.

[0196] The imaging optical modules 7a, 7b, 7c, 7d, and 7e of this embodiment have different viewing angles, so that the electronic device 7 can provide different magnifications to achieve an optical zoom shooting effect. For example, the ultra-wide-angle imaging device 7d has a maximum viewing angle of 105 to 125 degrees, which can achieve an image with an equivalent focal length between 11mm and 14mm. The image captured in this case can be referred to Figure 47 , is a schematic diagram illustrating an image captured by the electronic device 7 with an equivalent focal length between 11 mm and 14 mm, wherein the captured image includes the entire church, surrounding buildings, and people in the square. Figure 47 The image has a larger viewing angle and depth of field, but is often accompanied by greater distortion. The wide-angle imaging device 7c has a maximum viewing angle of 70 degrees to 90 degrees, which can achieve an image with an equivalent focal length between 22mm and 30mm.

[0197] The images captured in this case can be referred to Figure 48 , illustrates an image captured by electronic device 7 at an equivalent focal length between 22mm and 30mm. The captured image includes the entire church and the figures in front of it. Telephoto imaging device 7e has a maximum viewing angle of 10 to 40 degrees, capable of capturing images with an equivalent focal length between 60mm and 300mm. Telephoto imaging device 7e can be considered to provide a 5x magnification.

[0198] The images captured in this case can be referred to Figure 49 , is a schematic diagram illustrating an image captured by the electronic device 7 with an equivalent focal length between 60 mm and 300 mm, wherein the captured image includes a flock of birds flying in front of the church. Figure 49 The image has a smaller viewing angle and depth of field, so that the telephoto imaging device 7e can be used to shoot moving targets. The optical element driving device drives the imaging component to quickly and continuously automatically focus on the target, so that the target object will not be blurred due to being far away from the focus position; when shooting, the telephoto imaging device 7e can further perform optical zoom on the shooting subject to obtain a clearer image, wherein the magnification of the imaging device is defined as the ratio of the maximum and minimum focal lengths. Taking this imaging device as an example, the magnification is 5 times. The super-telephoto imaging device 7a has a maximum viewing angle of 4 to 8 degrees, which can achieve an image with an equivalent focal length between 400mm and 600mm. The image captured in this case can be referred to Figure 50 , is a schematic diagram illustrating an image captured by the electronic device 7 with an equivalent focal length between 400 mm and 600 mm, wherein the captured image includes an angel image and a cross above a church spire. Figure 50The image has a smaller viewing angle and depth of field, making the imaging component of the super-telephoto imaging device 7a more likely to lose focus due to shaking. Therefore, the optical element driving device can provide a feedback force to correct the shaking while providing a driving force to focus the imaging component of the super-telephoto imaging device 7a on the target object to achieve the effect of optical image stabilization. In addition, the imaging optical module 7h can obtain depth information of the image. The above-mentioned electronic device 7 is taken as an example including a plurality of imaging optical modules 7a, 7b, 7c, 7d, 7e, 7f, 7g, and 7h, but the number and configuration of the imaging optical modules are not intended to limit the present invention. The equivalent focal length corresponding to the above-mentioned imaging optical module is a converted estimated value, which may differ from the actual focal length due to the design of the imaging component and the size of the electronic photosensitive element.

[0199] When a user photographs an object OBJ, electronic device 7 utilizes imaging optical module 7a, imaging optical module 7b, imaging optical module 7c, imaging optical module 7e, or imaging optical module 7f to focus and capture the image. Light-emitting element 72 is activated for fill light. Focus assist module 73 uses object distance information of object OBJ to quickly achieve focus. Furthermore, an image signal processor performs image optimization processing to further enhance the image quality produced by the imaging component. Focus assist module 73 may utilize an infrared or laser focus assist system to achieve rapid focus.

[0200] Furthermore, the electronic device 7 can also utilize the imaging optical module 7f, the imaging optical module 7g, or the imaging optical module 7h for capturing images. When the imaging optical module 7f, the imaging optical module 7g, or the imaging optical module 7h is capturing images, a prompt light 7k may illuminate to alert the user that the electronic device 7 is capturing images. The display device 75 may utilize a touch screen or physical capture buttons such as a zoom control key 751 and a focus / photographing key 752, in conjunction with the diverse functions of the image software processor for capturing and processing images. Images processed by the image software processor may be displayed on the display device 75. The user may also replay previously captured images using the image playback button 753 on the display device 75, select the appropriate imaging optical module for capturing images using the imaging optical module switching button 754, and adjust the shooting conditions for the current scene using the integrated menu button 755.

[0201] Further, the electronic device 7 also includes a circuit board 78, and the circuit board 78 carries a plurality of electronic elements 79. The imaging optical modules 7a, 7b, 7c, 7d, 7e, 7f, 7g, 7h are electrically connected to the electronic elements 79 through connectors 781 on the circuit board 78, wherein the electronic elements 79 can include a signal transmission module, and the image can be transmitted to other electronic devices or cloud storage through the signal transmission module. The signal transmission module can be a wireless fidelity (WiFi) module, a Bluetooth module, an infrared module, a network service module, or an integrated module of the above-mentioned signal transmission modules, and the present application is not limited thereto.

[0202] The electronic elements 79 can also include a storage unit, a random access memory for storing image signals, a gyroscope, and a position locator for facilitating navigation or positioning of the electronic device 7. In the present embodiment, the image signal processor, the image software processor, and the random access memory are integrated into a single-chip system 74, but the present application is not limited to this configuration. In some other embodiments, the electronic elements can also be integrated into the imaging optical module or can be arranged on one of the plurality of circuit boards. In addition, the biometric sensor 77 can provide functions such as starting and unlocking the electronic device 7.

[0203] The optical element driving device and the imaging optical module of the present application are not limited to be applied to a smart phone. The optical element driving device and the imaging optical module can also be applied to a mobile focusing system as needed, and have the characteristics of excellent aberration correction and good imaging quality. For example, the optical element driving device and the imaging optical module can be applied to various electronic devices such as three-dimensional (3D) image acquisition, digital cameras, mobile devices, digital tablets, smart televisions, network monitoring equipment, driving recorders, reversing display devices, multi-lens devices, recognition systems, motion game consoles, and wearable devices. The above-mentioned electronic devices are only exemplary to illustrate the practical application examples of the present application, and are not limited to the application range of the optical element driving device and the imaging optical module of the present application.

[0204] Although the present application is disclosed with the above-mentioned embodiments, these embodiments are not intended to limit the present application. Any modifications and improvements made without departing from the spirit and scope of the present application are within the scope of the patent protection of the present application. For the scope of protection of the present application, please refer to the scope defined in the appended claims.

Claims

1. An optical element driving device, characterized in that: Include: a fixed body; a carrier for accommodating at least one optical element, wherein the carrier has at least one degree of freedom of movement relative to the fixed body; a supporting mechanism connected to the carrier and the fixed body so as to allow the carrier to have the at least one degree of freedom; and an electromagnetic drive assembly for driving the carrier to move relative to the fixed body, and the electromagnetic drive assembly comprises: a driving coil, disposed on the carrier; a driving magnet, disposed on the fixed body and opposite to the driving coil; and a ferromagnetic element embedded in the carrier, the ferromagnetic element having the at least one degree of freedom of movement relative to the fixed body, the ferromagnetic element being integrally formed and comprising a magnetic conductive portion and a first electrical connection portion, the magnetic conductive portion facing at least one of the drive coil and the drive magnet, the first electrical connection portion being exposed on a surface of the carrier and electrically connected to the drive coil; The magnetic conductive portion of the ferromagnetic element is surrounded by the driving coil; The supporting mechanism comprises a reed, and the reed is conductive; The ferromagnetic element further includes a second electrical connection portion, the second electrical connection portion is electrically connected to the reed, and the reed is electrically connected in series with the driving coil via the second electrical connection portion and the first electrical connection portion.

2. The optical element driving device according to claim 1, wherein The driving magnet has a corresponding surface, and the corresponding surface faces the magnetic conductive portion and the driving coil at the same time; The magnetic conductive portion is farther away from the corresponding surface than the driving coil.

3. The optical element driving device according to claim 1, wherein The second electrical connection portion includes: a contact area in physical contact with the reed; and An elastic area is connected to the contact area and normally applies an elastic force to the contact area toward the spring.

4. The optical element driving device according to claim 1, wherein The ferromagnetic element is integrally formed on the carrier by insert injection molding.

5. The optical element driving device according to claim 1, wherein The vector comprises: a lens barrel portion, wherein the at least one optical element is disposed in the lens barrel portion; and A mounting portion, wherein the lens barrel portion, the supporting mechanism, the driving coil and the ferromagnetic element are all disposed on the mounting portion.

6. The optical element driving device according to claim 1, wherein: The carrier is integrally formed by injection molding, and the carrier includes an inner side surface, and the inner side surface is in direct contact with the at least one optical element.

7. The optical element driving device according to claim 1, wherein: The ferromagnetic element is formed by stamping, and the ferromagnetic element is formed with: a shear plane; a tearing surface, disposed opposite to the shearing surface; and a cross-section connecting the shear surface and the tearing surface; Wherein, the driving coil is not in physical contact with the tearing surface.

8. The optical element driving device according to claim 7, wherein: The first electrical connection portion of the ferromagnetic element is disposed on a columnar structure of the carrier; The portion of the tearing surface located at the first electrical connection portion faces the columnar structure, and the portion of the shearing surface located at the first electrical connection portion is in physical contact with the driving coil.

9. The optical element driving device according to claim 1, wherein: At least a portion of the ferromagnetic element is not covered by the carrier; The optical element driving device further includes a light shielding layer, and the light shielding layer is disposed on at least a portion of the ferromagnetic element.

10. The optical element driving device according to claim 1, wherein At least a portion of the ferromagnetic element is not covered by the carrier; Wherein, the optical element driving device further includes an electrical blocking layer, and the electrical blocking layer is disposed on the at least a portion of the ferromagnetic element.

11. An imaging optical module, characterized in that: Include: The optical element driving device according to claim 1; and An imaging assembly includes the at least one optical element, wherein the at least one optical element is located on an imaging light path.

12. The imaging optical module according to claim 11, wherein: The carrier has the freedom to move along the imaging optical path.

13. The imaging optical module according to claim 11, wherein: The carrier has the freedom to move perpendicular to the imaging optical path.

14. An electronic device, characterized in that: Include: The imaging optical module according to claim 11; and An electronic photosensitive element is disposed on an imaging surface of the imaging optical module.

Images