Manufacturing method of flexible printed circuit board, flexible printed circuit board, anti-shake assembly and camera module

Abstract

A manufacturing method, a flexible circuit board, an image stabilization component, and a camera module are disclosed. The method includes: providing a circuit board comprising a first metal layer, a first dielectric layer, a second metal layer, a second dielectric layer, a third metal layer, a third dielectric layer, and a fourth metal layer stacked sequentially. The circuit board includes a connection area and a flexible area. The first metal layer of the flexible area forms a first circuit including multiple spaced metal traces, and the second metal layer of the flexible area forms a second circuit including multiple spaced metal traces. The projection of the first circuit on the first dielectric layer coincides with the projection of the second circuit on the first dielectric layer. The fourth metal layer, the third dielectric layer, the third metal layer, and the second dielectric layer of the flexible area are removed to expose the second circuit and a portion of the first dielectric layer. The exposed portion of the first dielectric layer is removed to separate the multiple metal traces of the first circuit and the multiple metal traces of the second circuit, thereby forming a flexible circuit board.

Description

Technical Field

[0001] This application relates to the field of electronic technology, and in particular to a method for manufacturing a flexible circuit board, a flexible circuit board, an image stabilization component, and a camera module. Background Technology

[0002] With the development of portable electronic devices such as smartphones and tablets, electronic devices have become indispensable tools in people's daily lives, enabling them to perform social and entertainment functions. Electronic devices contain circuit boards to realize their functions. These circuit boards can include flexible circuit boards, rigid circuit boards, and rigid-flex boards. In circuit boards with flexible circuit boards, modifications are needed to achieve the elasticity of the flexible circuit board, resulting in a circuit board structure that provides both electrical connection and flexibility. Summary of the Invention

[0003] This application provides a manufacturing method, a flexible circuit board, an image stabilization component, and a camera module, which can form a flexible circuit board structure.

[0004] In a first aspect, embodiments of this application provide a method for manufacturing a flexible circuit board, comprising:

[0005] A circuit board is provided, comprising a first metal layer, a first dielectric layer, a second metal layer, a second dielectric layer, a third metal layer, a third dielectric layer, and a fourth metal layer stacked together. The circuit board includes a connection area and a flexible area. A first circuit is formed on the first metal layer of the flexible area, and the first circuit includes a plurality of spaced metal traces. A second circuit is formed on the second metal layer of the flexible area, and the second circuit includes a plurality of spaced metal traces. The projection of the first circuit on the first dielectric layer coincides with the projection of the second circuit on the first dielectric layer. The first metal layer, the second metal layer, the third metal layer, and the fourth metal layer of the connection area are electrically connected.

[0006] Remove the fourth metal layer, the third dielectric layer, the third metal layer, and the second dielectric layer of the elastic region to expose the second circuit and part of the first dielectric layer.

[0007] The exposed portion of the first dielectric layer is removed to separate multiple metal traces of the first circuit and multiple metal traces of the second circuit.

[0008] Secondly, embodiments of this application also provide a method for manufacturing a flexible circuit board, comprising:

[0009] A circuit board is provided, comprising a first metal layer, a first dielectric layer, a second metal layer, a second dielectric layer, and a third metal layer stacked together. The circuit board includes a connection area and a flexible area. A first circuit is formed on the first metal layer of the flexible area, and the first circuit includes a plurality of spaced metal traces. A second circuit is formed on the second metal layer of the flexible area, and the second circuit includes a plurality of spaced metal traces. The projection of the first circuit on the first dielectric layer coincides with the projection of the second circuit on the first dielectric layer. The first metal layer, the second metal layer, and the third metal layer of the connection area are electrically connected.

[0010] Remove the third metal layer and the second dielectric layer of the elastic region to expose the second circuit.

[0011] The first dielectric layer exposed between the first circuit and the second circuit is removed to separate multiple metal traces of the first circuit and multiple metal traces of the second circuit.

[0012] Thirdly, embodiments of this application also provide a stabilization component, which includes:

[0013] A flexible circuit board, comprising the flexible circuit board as described above, the flexible circuit board being used to carry an image processor;

[0014] A drive mechanism is used to drive the image sensor to move;

[0015] The elastic circuit board provides an elastic force opposite to the direction of motion of the image sensor when it moves.

[0016] Fourthly, embodiments of this application also provide a camera module, which includes:

[0017] A lens is used to capture external light;

[0018] An image sensor is disposed opposite to the lens along the optical axis of the lens; and

[0019] Image stabilization components, including those described above.

[0020] In this embodiment, a circuit board is provided, including a first metal layer, a first dielectric layer, a second metal layer, a second dielectric layer, a third metal layer, a third dielectric layer, and a fourth metal layer stacked together. The circuit board includes a connection area and a flexible area. A first circuit is formed on the first metal layer of the flexible area, and the first circuit includes multiple spaced metal traces. A second circuit is formed on the second metal layer of the flexible area, and the second circuit includes multiple spaced metal traces. The projection of the first circuit on the first dielectric layer coincides with the projection of the second circuit on the first dielectric layer. The first metal layer, the second metal layer, the third metal layer, and the fourth metal layer of the connection area are electrically connected. The fourth metal layer, the third dielectric layer, the third metal layer, and the second dielectric layer of the flexible area are removed to expose the second circuit and a portion of the first dielectric layer. The exposed portion of the first dielectric layer is removed to separate the multiple metal traces of the first circuit and the multiple metal traces of the second circuit. A flexible circuit board is formed. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] To gain a more complete understanding of this application and its beneficial effects, the following description will be provided in conjunction with the accompanying drawings, wherein the same reference numerals in the following description denote the same parts.

[0023] Figure 1 This is a schematic diagram of a camera module provided in an embodiment of this application.

[0024] Figure 2 for Figure 1 The diagram shows an exploded structure of a camera module.

[0025] Figure 3 for Figure 2 The diagram shows an exploded view of the image stabilization component.

[0026] Figure 4 for Figure 2 The diagram shows a partial structure of the image stabilization component.

[0027] Figure 5 for Figure 4 A partial structural diagram of the structure shown.

[0028] Figure 6 for Figure 5 A magnified schematic diagram of part B shown.

[0029] Figure 7This is a flowchart illustrating a method for manufacturing a flexible circuit board according to an embodiment of this application.

[0030] Figure 8 This is a schematic diagram illustrating a method for manufacturing a flexible circuit board according to an embodiment of this application.

[0031] Figure 9 This is a schematic diagram illustrating a method for manufacturing a flexible circuit board according to an embodiment of this application.

[0032] Figure 10 for Figure 3 The diagram shows the structure of the support bracket in the image stabilization assembly.

[0033] Figure 11 for Figure 3 The diagram shows the structure of the moving part in the drive mechanism.

[0034] Figure 12 for Figure 3 Another structural diagram of a portion of the drive mechanism shown.

[0035] Figure 13 for Figure 1 The diagram shows another angle of the camera module.

[0036] Figure 14 for Figure 13 The image shows a cross-sectional view of the camera module along the AA direction.

[0037] Figure 15 Another exploded structural diagram of the camera module provided in the embodiments of this application.

[0038] Figure 16 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application. Detailed Implementation

[0039] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the protection scope of this application.

[0040] Please see Figure 1 and Figure 2 , Figure 1 This is a schematic diagram of a camera module provided in an embodiment of this application. Figure 2 for Figure 1The diagram shows an exploded view of a camera module. This application provides a camera module 10, which can be used to realize functions such as taking photos, recording videos, facial recognition unlocking, or QR code payment on electronic devices. Furthermore, it should be noted that the camera module 10 can be a front-facing camera or a rear-facing camera; this embodiment does not limit this. The structure of the camera module 10 is described in detail below with reference to the accompanying drawings. The camera module 10 may include an image stabilization component 100, an image sensor component 200, and a lens 300.

[0041] The lens 300 can be made of materials such as glass or plastic. The lens 300 may contain multiple layers of lenses. The lens 300 can collect external light, change the propagation path of the light, and focus the light. For example... Figure 2 As shown, the camera module 10 may further include a filter assembly 500, which is positioned between the lens 300 and the image sensor assembly 200 along the optical axis of the lens 300. The filter assembly 500 may include one or more filters 510 and a filter holder 520 supporting the filters 510. The multiple filters 510 mutually correct and filter light, so that when light passes through the lens 300, the multiple filters 510 filter stray light (e.g., infrared light) layer by layer, thereby improving the imaging effect of the camera module 10. For example, the filter 510 may be blue glass or other filter structures, and the blue glass may be fixed to the filter holder 520 by means of dispensing or baking.

[0042] Image sensor assembly 200 can be disposed opposite to lens 300 along the optical axis. Image sensor assembly 200 may include image sensor 210 and image sensor circuit board 220. Lens 300, image sensor 210 and image sensor circuit board 220 can be stacked along a first direction H1, which can be the thickness direction of camera module 10 or the optical axis direction of lens 300. Lens 300 and image sensor 210 can be parallel to each other. Image sensor 210 may be, but is not limited to, a charge-coupled device (CCD), complementary metal-oxide-semiconductor (CMOS) or other similar image sensors. Image sensor 210 is mainly used to receive light collected from lens 300 and convert the light signal into an electrical signal to meet the imaging requirements of camera module 10. Image sensor circuit board 220 can carry image sensor 210 and is electrically connected to image sensor 210 to provide power and control signals to image sensor 210. Components such as the image sensor 210 can be mounted on the image sensor circuit board 220 through processes such as surface mount technology (SMT), die bonding (D / B), and wire bonding (W / B).

[0043] The image stabilization component 100 can be positioned along the optical axis of the lens 300 on the side of the image sensor 210 away from the lens 300. The image stabilization component 100 can be connected to the image sensor 210 to drive its movement. The image stabilization component 100 can improve the imaging effect of the camera module 10 caused by user shake during use, ensuring that the imaging effect of the image sensor 210 meets the user's needs. The image stabilization component 100 can provide a driving force to drive the image sensor 210.

[0044] Based on optical image stabilization technology, sensors such as gyroscopes or accelerometers within the camera module 10 or in the same electronic device can detect lens 300 shaking to generate a shaking signal. This shaking signal is then transmitted to the electronic device and / or the processing chip of the camera module 10. The processing chip of the electronic device and / or the camera module 10 can calculate the amount of displacement that the image stabilization component 100 needs to compensate for, so that the image stabilization component 100 can compensate for the lens 300 according to the shaking direction and displacement of the lens 300, thereby improving the imaging effect of the camera module 10 caused by shaking during user use.

[0045] In this regard, please combine Figure 2Please see Figure 3 and Figure 4 , Figure 3 for Figure 2 The diagram shown is an exploded view of one type of image stabilization component. Figure 4 for Figure 2 The diagram shows a partial structural design of the image stabilization assembly. The image stabilization assembly 100 may include a support plate 110, a drive mechanism 120, and a base plate 130.

[0046] The base plate 130 can serve as a carrier for the anti-shake component 100, and the support plate 110 and the drive mechanism 120 are directly or indirectly mounted on the base plate 130.

[0047] The carrier plate 110 can serve as the circuit board for the image sensor 210 and support the image sensor 210; that is, the carrier plate 110 is the image sensor circuit board 220. The carrier plate 110 can also serve as the carrier for the circuit board of the image sensor 210; that is, the image sensor circuit board 220 and the image sensor 210 are mounted on the carrier plate. Please refer to... Figure 5 , Figure 5 for Figure 4 The diagram shows a partial structural schematic. The support plate 110 may include a movable member 111 and a fixed member 112 spaced apart. The fixed member 112 of the support plate 110 can be connected to and fixed to the base plate 130. The movable member 111 can support the image sensor 210 (or image sensor assembly 200), and the image sensor 210 can be directly or indirectly connected to the movable member 111. The fixed member 112 can be sleeved on the outer periphery of the movable member 111, and a gap can be formed between the fixed member 112 and the movable member 111 to allow the movable member 111 to move relative to the fixed member 112. The image sensor 210 (or image sensor assembly 200) can be directly or indirectly connected to the movable member 111 and move synchronously with the movement of the movable member 111.

[0048] It is understood that the movable component 111 may be provided with a first electrical connection terminal, which can be electrically connected to the image sensor 210. The fixed component 112 may be provided with a second electrical connection terminal, which can be electrically connected to the drive adapter board 700 of the camera module 10 or an external circuit outside the camera module 10. When the first electrical connection terminal and the second electrical connection terminal are electrically connected through an electrical connector, the image sensor 210 can be electrically connected to the drive adapter board 700 through the first electrical connection terminal, the electrical connector, and the second electrical connection terminal. The drive adapter board 700 can lead the electrical signal of the image sensor 210 to the image stabilization component 100 and electrically connect it to the circuit board, power supply, and other components of the camera module 10 or electronic device.

[0049] It is understood that since the fixing member 112 can be connected to the base plate 130 and fixed in place, the drive adapter plate 700, which is electrically connected to the second electrical connection end of the fixing member 112, does not need to move with the moving member 121 or the movable member 111. The drive adapter plate 700 does not need to be bent and welded. The welding process of the drive adapter plate 700 in this embodiment is simple and the size is small.

[0050] The support plate 110 can be disposed opposite to the drive mechanism 120 in the optical axis direction of the lens 300. The drive mechanism 120 can be disposed on one side of the support plate 110. For example, as Figure 3 As shown, the drive mechanism 120 can be disposed on the side of the support plate 110 away from the base plate 130, so that the drive mechanism 120 can drive the support plate 110 to move above the support plate 110. Alternatively, the drive mechanism 120 can be disposed on the lower side of the support plate 110, for example, on the lower side of the support plate 110 and the image sensor assembly 200, so that the drive mechanism 120 can drive the support plate 110 to move below the support plate 110 and the image sensor assembly 200. This embodiment does not specifically limit the location of the drive mechanism 120.

[0051] The image stabilization component 100 may further include one or more elastic circuit boards 113. These elastic circuit boards 113 may be disposed between the movable member 111 and the fixed member 112, for example, between the outer periphery of the movable member 111 and the inner periphery of the fixed member 112. The first end a1 of each elastic circuit board 113 may be connected to the fixed member 112 and fixed in place, while the second end a2 may be connected to the movable member 111 and move with it. The one or more elastic circuit boards 113 can provide an elastic force opposite to the direction of movement of the movable member 111 to restrain its movement. The elastic force provided by the elastic circuit boards 113 and the driving force provided by the driving mechanism 120 can work together on the movable member 111, allowing it to remain stably in a certain position, thereby making the image stabilization control of the movable member 111 and the image sensor 210 more precise.

[0052] For example, such as Figure 5As shown, the image stabilization component 100 may include four flexible circuit boards 113, each of which can be a set of trace suspension assemblies (TSA). Multiple sets of trace suspension assemblies are arranged around the moving member 121. In related technologies, the fixed and moving parts of the support plate are connected via an FPC module. When the image sensor moves, the reaction force generated by the FPC module is very large, and the consistency after bending is difficult to guarantee. This makes the image sensor prone to tilting during movement, thus affecting the production yield of the camera module. In this embodiment, the fixed member 112 and the moving member 111 are connected via multiple sets of trace suspension assemblies, and the flexible circuit boards 113 employ TSA technology, which can improve the production yield of the camera module.

[0053] To simplify the circuit setup of the image stabilization component 100, camera module 10, or electronic device, one or more flexible circuit boards 113 can be conductive electrical connectors made of a conductive material. That is, one end of the flexible circuit board 113 is used for electrical connection to the image sensor 210, and the other end is used for electrical connection to external circuitry, thus connecting the image sensor 210 to the external circuitry. For example, the flexible circuit board 113 can be electrically connected to the pads (PADs) of the image sensor circuit board 220 via thermoforming or similar methods. In other words, each flexible circuit board 113 can include a connection area and a flexible area, for example... Figure 5 The diagram shows a connection area C and a flexible area D. Connection area C may be provided with pads and traces that are connected to the flexible area. Flexible area D includes multiple spaced metal suspension wires to form a flexible structure.

[0054] For example, the movable member 111 may be provided with a first electrical connection terminal that is directly or indirectly electrically connected to the image sensor 210, and the fixed member 112 may be provided with a second electrical connection terminal that is directly or indirectly electrically connected to an external circuit. The flexible circuit board 113 can be directly or indirectly electrically connected to the second electrical connection terminal and the first electrical connection terminal through the connection area C, so that the external circuit can be directly or indirectly electrically connected to the image sensor 210 through the second electrical connection terminal, the flexible circuit board 113, and the first electrical connection terminal.

[0055] It is understood that the first electrical connection terminal may be, but is not limited to, a pad structure on the movable member 111, and the second electrical connection terminal may be, but is not limited to, a pad structure on the fixed member 112. External circuitry may be, but is not limited to, electrically connected to the second electrical connection terminal via a drive adapter board 700.

[0056] It is understood that the external circuit can provide power to the image sensor 210 and can also transmit control signals to the image sensor 210 so that the control chip of the camera module 10 and the control chip of the electronic device 1 can control the image sensor 210.

[0057] In the image stabilization component 100 of this application embodiment, the external circuit can be electrically connected to the image sensor 210 through the flexible circuit board 113. The flexible circuit board 113 can be used as both an elastic damping component and an electrical connector. The flexible circuit board 113 is reused, and the image stabilization component 100 does not need to set up an additional flexible circuit board to power the image sensor 210. Thus, the flexible circuit board 113 of this application embodiment can simplify the circuit setting of the image stabilization component 100 and realize the miniaturized design of the image stabilization component 100.

[0058] Please combine Figure 6 , Figure 6 for Figure 5 The diagram shows an enlarged view of part B. Each group of suspension wires may include multiple suspension wires 1132, which are arranged side by side. These multiple suspension wires 1132 not only physically connect the fixed component 112 and the movable component 111, but also provide electrical connections between the fixed component 112 and the movable component 111. The multiple suspension wires 1132 in each group can be spaced apart, meaning that adjacent suspension wires 1132 are isolated from each other, ensuring that the transmission of power or signals by the multiple suspension wires 1132 is not affected.

[0059] It is understood that the projection of the first end a1 of each elastic circuit board 113 onto the movable member 111 can be offset from its second end a2, for example, the two can be distributed on different sides of the movable member 111. Each elastic circuit board 113 is connected to one side of the fixed member 112 and the other side of the movable member 111 corresponding to that side. Each elastic circuit board 113 can form a torsion spring structure, and the multiple elastic circuit boards 113 exert a greater pulling force on the movable member 111, which can improve the stability of the movable member 111.

[0060] It is understandable that, such as Figure 5 As shown, each elastic circuit board 113 may include a first elastic part b1, a first corner part b2, and a second elastic part b3 connected in sequence. The first elastic part b1 may be connected to the fixed member 112, and the second elastic part b3 may be connected to the movable member 111. The first line connecting the first elastic part b1 and the first corner part b2 and the second line connecting the first corner part b2 and the second elastic part b3 may form a preset angle, which may be, but is not limited to, ninety degrees. The elastic circuit board 113 of this embodiment includes the above three parts. The elastic circuit board 113 can form a torsion spring structure with a large amplitude. The elastic circuit board 113 exerts a greater pulling force on the movable member 111, and the elastic circuit board 113 can further ensure the stability of the movable member 111.

[0061] To further improve the stability of the movable component 111, multiple flexible circuit boards 113 on the support plate 110 can be sequentially arranged around the outer periphery of the movable component 111. For example, as Figure 5 As shown. Multiple flexible circuit boards 113 can be arranged clockwise around the outer periphery of the movable member 111, and the multiple flexible circuit boards 113 can be arranged clockwise in the order of first end, second end, first end, second end... Of course, the multiple flexible circuit boards can also be arranged counterclockwise around the outer periphery of the movable member 111, in which case the multiple flexible circuit boards 113 can be arranged counterclockwise in the order of first end, second end, first end, second end...

[0062] In two adjacent elastic circuit boards 113, the second end a2 of one elastic circuit board 113 (e.g., the preceding elastic circuit board 113) and the projection of the first end a1 of the other elastic circuit board 113 (e.g., the following elastic circuit board 113) onto the movable member 111 can be adjacent and located on the same side of the movable member 111. It can be understood that "adjacent" here means that the distance between the first end a1 of the preceding elastic circuit board 113 and the second end a2 of the following elastic circuit board 113 can be within a small preset range, so that the elastic torque of the two adjacent elastic circuit boards 113 can cover the entire side of the movable member 111, resulting in better stability of the movable member 111.

[0063] When the fixing member 112 is a rectangular frame structure and the movable member 111 is a rectangular plate structure, the corresponding bearing plate 110 may include four elastic circuit boards 113. Thus, each elastic circuit board 113 is connected to one side of the fixing member 112 and the adjacent side of the movable member 111 corresponding to that side. Each elastic circuit board 113 may include a set of suspension wires. On the one hand, the set of suspension wires can provide traction force for the movement of the movable member 111 and improve the stability of the movable member 111. On the other hand, the set of suspension wires can also prevent the movement amplitude of the movable member 111 from being too large, causing the elastic circuit board 113 to separate from the movable member 111.

[0064] It should be noted that the above is merely an exemplary connection method between the flexible circuit board 113 and the movable member 111 and the fixed member 112 in this application embodiment. The specific connection method of the flexible circuit board 113 is not limited to the above description. For example, the flexible circuit board 113 can also be directly connected to one side of the fixed member 112 and the corresponding side of the movable member 111. This application embodiment does not limit the specific connection method of the flexible circuit board 113.

[0065] It should be noted that the specific structure of the image stabilization component 100 in this application embodiment is not limited to the description of the above embodiment. For example, the image stabilization component 100 may also have elastic circuit boards on both the upper and lower sides of the support plate 110 to further improve the stability of the image sensor 210.

[0066] To manufacture the aforementioned flexible circuit board, this application provides a method for manufacturing a flexible circuit board. Please refer to the following documentation. Figure 7 , Figure 7 This is a flowchart illustrating a method for manufacturing a flexible circuit board according to an embodiment of this application. The method for manufacturing the flexible circuit board includes:

[0067] 101. A circuit board is provided, including a first metal layer, a first dielectric layer, a second metal layer, a second dielectric layer, a third metal layer, a third dielectric layer, and a fourth metal layer stacked together. The circuit board includes a connection area and a flexible area. A first circuit is formed on the first metal layer of the flexible area, and the first circuit includes multiple spaced metal traces. A second circuit is formed on the second metal layer of the flexible area, and the second circuit includes multiple spaced metal traces. The projection of the first circuit on the first dielectric layer coincides with the projection of the second circuit on the first dielectric layer. The first metal layer, the second metal layer, the third metal layer, and the fourth metal layer of the connection area are electrically connected.

[0068] The multiple spaced metal traces in the first circuit and the multiple spaced metal traces in the second circuit are used to form the flexible suspension wire circuit as described above.

[0069] 102. Remove the fourth metal layer, the third dielectric layer, the third metal layer and the second dielectric layer of the elastic region to expose the second circuit and part of the first dielectric layer.

[0070] 103. Remove the exposed portion of the first dielectric layer to separate multiple metal traces of the first circuit and multiple metal traces of the second circuit.

[0071] It is understood that the connection area of ​​the flexible circuit board made by the above method includes four layers of metal structure, the elastic area includes two layers of metal structure, and the metal structure of the elastic area is a suspension wire circuit with elasticity as described above.

[0072] In some embodiments, to improve the lifespan of the flexible circuit board, before removing the first dielectric layer exposed between the first and second circuits, the method further includes: forming a first protective layer on the surface of the first and / or second circuits. This gold plating layer can be formed on the surface of the first and / or second circuits using a gold plating process, such as nickel-palladium-gold plating or nickel-gold plating, to achieve anti-oxidation treatment and improve the lifespan of the flexible circuit board. Furthermore, the portions of the connection areas exposed to air can also be protected. These connection areas include soldered and non-soldered areas. A second protective layer is provided in the non-soldered areas, and a third protective layer is provided in the soldered areas. An ink layer can be provided on the surface of the non-soldered areas to protect them. The pads in the soldered areas can be gold-plated to achieve anti-oxidation treatment, further improving the lifespan of the flexible circuit board.

[0073] In some embodiments, the first dielectric layer exposed between the first circuit and the second circuit can be removed by a laser cutting process or a reactive ion etching (RIE) process.

[0074] To ensure the elasticity of the elastic zone and the structural strength, the rigidity of the first metal layer can be greater than that of the second metal layer. For example, the first metal layer can be a copper alloy layer, and the second metal layer can be a copper layer. The rigidity of the copper alloy is greater than that of the copper layer.

[0075] In some embodiments, vias can be used to connect the first, second, third, and fourth metal layers of the connection area, thereby achieving electrical connection between the first, second, third, and fourth metal layers.

[0076] Figure 8 This is a schematic diagram illustrating a method for manufacturing a flexible circuit board according to an embodiment of this application.

[0077] First, a circuit board 3000 is provided, including a first metal layer 310, a first dielectric layer 320, a second metal layer 330, a second dielectric layer 340, a third metal layer 350, a third dielectric layer 360, and a fourth metal layer 370 stacked together. The circuit board 3000 includes a connection area 301 and a flexible area 302. A first circuit 311 is formed on the first metal layer 310 of the flexible area 301. The first circuit 311 includes multiple spaced metal traces, such as... Figure 5 The elastic area D of the elastic circuit board shown in the diagram contains multiple spaced metal traces. These spaced metal traces do not form suspended wires, and a first dielectric layer is disposed between them. The second metal layer 330 of the elastic area 302 forms a second circuit 331, which includes multiple spaced metal traces. The projection of the first circuit 311 onto the first dielectric layer 320 coincides with the projection of the second circuit 331 onto the first dielectric layer 320. The first metal layer 310, second metal layer 330, third metal layer 350, and fourth metal layer 370 of the connection area 301 can be connected via vias 390 and via traces. Furthermore, to improve the connection strength between the layers, the layers can be connected via adhesives 380.

[0078] The first metal layer 310 can be a copper alloy layer, the second metal layer 330, the third metal layer 350 and the fourth metal layer 370 can be copper layers, and the first dielectric layer 320, the second dielectric layer 340 and the third dielectric layer 360 can be insulating layers. For example, the first dielectric layer 320, the second dielectric layer 340 and the third dielectric layer 360 can be polyimide (PI) film layers.

[0079] Then, the fourth metal layer 370, the third dielectric layer 360, the third metal layer 350, and the second dielectric layer 340 of the elastic region 302 are removed, exposing the second circuit 331 and part of the first dielectric layer 320. The fourth metal layer 370, the third dielectric layer 360, the third metal layer 350, and the second dielectric layer 340 of the elastic region 302 can be removed by laser cutting.

[0080] Finally, the exposed portion of the first dielectric layer 320 is removed using laser cutting or reactive ion etching (RIE) to separate multiple metal traces of the first circuit 311 and multiple metal traces of the second circuit 331. This results in the first circuit 311 and the second circuit 331 forming the aforementioned suspended wire structure, enabling the elastic region 302 to possess elasticity. For example, the exposed portion of the first dielectric layer 320 can be removed using laser cutting or reactive ion etching. This can result in... Figure 5 The flexible circuit board 113 shown includes a connection area C and a flexible area D.

[0081] It is understood that the number and size of the metal traces shown in the figure are exemplary, and the number and size of the metal traces can be designed according to actual needs when forming the first circuit 311 and the second circuit 331.

[0082] In some embodiments, the circuit board 3000 described above can be manufactured by the following method, which includes:

[0083] A first metal layer is provided, and a first dielectric layer is laid on the first metal layer;

[0084] A second metal layer is laid on the side of the first dielectric layer that is away from the first metal layer, and a second circuit is formed on the second metal layer.

[0085] A second dielectric layer is laid on the side of the second metal layer that is opposite to the first dielectric layer;

[0086] A third metal layer is laid on the side of the second dielectric layer that is opposite to the second metal layer;

[0087] A third dielectric layer is laid on the side of the third metal layer that is opposite to the second dielectric layer;

[0088] A fourth metal layer is laid on the side of the third dielectric layer that is opposite to the third metal layer;

[0089] A first circuit is formed in the first metal layer to form the circuit board provided above.

[0090] Specifically, the aforementioned circuit board 3000 can be manufactured using the following method, which includes:

[0091] A first metal layer is provided, and a first dielectric layer with adhesive on both sides is laid on the first metal layer;

[0092] A second metal layer is laminated onto the side of the first dielectric layer that is away from the first metal layer, and a via is provided in the second metal layer to connect the second metal layer and the first metal layer.

[0093] The second circuit is etched into the second metal layer using an etching process.

[0094] An adhesive is laid on the side of the second metal layer away from the first dielectric layer, and the second dielectric layer and the third metal layer are pressed onto the second metal layer on which the adhesive is laid;

[0095] Vias are provided in the third metal layer to connect the third metal layer and the second metal layer, and the traces of the third metal layer are realized by etching process.

[0096] An adhesive is laid on the side of the third metal layer away from the second dielectric layer, and the third dielectric layer and the fourth metal layer are pressed together to the third metal layer on which the adhesive is laid.

[0097] A via is provided in the fourth metal layer to connect the fourth metal layer and the third metal layer, and the trace of the fourth metal layer is realized by etching process;

[0098] The first circuit is etched into the first metal layer by an etching process to form the circuit board provided above.

[0099] To illustrate the fabrication method of the flexible circuit board provided in this application embodiment, please continue reading. Figure 9 , Figure 9 This is a schematic diagram illustrating a method for manufacturing a flexible circuit board according to an embodiment of this application.

[0100] S1. Provide a first metal layer 410, which is a copper alloy layer.

[0101] S2. A first dielectric layer 420, on which adhesive 450 is disposed on both sides, is attached to the surface of the first metal layer 410. The first dielectric layer 420 is a PI layer, and the PI layer has adhesive on both sides.

[0102] S3. A second metal layer 430 is pressed onto the side of the first dielectric layer 420 away from the first metal layer 410, wherein the second metal layer is the first copper layer.

[0103] S4. A via 431 is provided in the second metal layer 430 by drilling to connect the second metal layer 430 and the first metal layer 410.

[0104] S5. A second circuit 432 is formed on the second metal layer 430 by an etching process. The second circuit 432 can be the second circuit as described above. The second circuit 432 includes multiple spaced metal traces, and can ultimately form a circuit as described above. Figure 5 Metal traces are arranged at intervals in the elastic area D of the elastic circuit board.

[0105] S6. Apply adhesive 433 to the side of the second metal layer 430 that is away from the first dielectric layer 420.

[0106] S7. Press the second dielectric layer 440 and the third metal layer 450 onto the second metal layer 430 on which the adhesive 433 is laid, wherein the second dielectric layer 440 can be a PI layer and the third metal layer 450 can be a copper layer.

[0107] S8. A via 451 is provided in the third metal layer 450 by drilling to connect the third metal layer 450 and the second metal layer 430.

[0108] S9. The third metal layer 450 is traced through an etching process.

[0109] S10. Apply adhesive 452 to the side of the third metal layer 450 that is away from the second dielectric layer 440.

[0110] S11. Press the third dielectric layer 460 and the fourth metal layer 470 onto the third metal layer 450 on which the adhesive 452 is laid, wherein the third dielectric layer 460 can be a PI layer and the fourth metal layer 470 can be a copper layer.

[0111] S12. A via 471 is provided in the fourth metal layer 470 by drilling to connect the fourth metal layer 470 and the third metal layer 450.

[0112] S13. The fourth metal layer 470 and the first metal layer 410 are traced by etching process. The first circuit 411 is etched in the first metal layer 410. The first circuit 411 includes multiple spaced metal traces. The first circuit 411 and the second circuit 432 are correspondingly arranged. The projection of the first circuit 411 on the first dielectric layer 420 coincides with the projection of the second circuit 432 on the first dielectric layer 420.

[0113] S14, the fourth metal layer 471 is provided with a welding area and a non-welding area, and an ink layer 472 is laid on the non-welding area.

[0114] It is understandable that steps S1 to S14 can form the circuit board 3000 provided above.

[0115] S15~S16, the fourth metal layer 470, the third dielectric layer 460, the third metal layer 450 and the second dielectric layer 440 of the elastic region 402 are removed by laser cutting to remove the cover.

[0116] S17. Gold plating is performed on the solder pads of the soldering area of ​​the fourth metal layer 470 and the exposed portion of the second circuit 432 of the second metal layer 430. A gold plating layer 490 is formed on the surface of the solder pads and the surface of the second circuit 432.

[0117] S18. A laser cutting process or a reactive ion etching (RIE) process removes a portion of the exposed first dielectric layer 420 to separate multiple metal traces of the first circuit 411 and multiple metal traces of the second circuit 432. This results in the first circuit 411 and the second circuit 432 forming the aforementioned suspended wire structure, thereby making the elastic region 302 elastic. For example, the exposed portion of the first dielectric layer 420 can be removed by laser cutting or reactive ion etching. This can result in... Figure 5 The flexible circuit board 113 shown includes a connection area C and a flexible area D.

[0118] It is understood that the number and size of the metal traces shown in the figure are exemplary, and the number and size of the metal traces can be designed according to actual needs when forming the first circuit 411 and the second circuit 432.

[0119] It should be noted that the number of metal layers in the connection area can be set according to actual needs. In some embodiments, the manufacturing method of the flexible circuit board may include:

[0120] A circuit board is provided, including a first metal layer, a first dielectric layer, a second metal layer, a second dielectric layer, and a third metal layer stacked together. The circuit board includes a connection area and a flexible area. A first circuit is formed on the first metal layer of the flexible area, and the first circuit includes multiple spaced metal traces. A second circuit is formed on the second metal layer of the flexible area, and the second circuit includes multiple spaced metal traces. The projection of the first circuit on the first dielectric layer coincides with the projection of the second circuit on the first dielectric layer. The first metal layer, the second metal layer, and the third metal layer of the connection area are connected.

[0121] Remove the third metal layer and the second dielectric layer in the elastic region to expose the second circuit.

[0122] The first dielectric layer exposed between the first circuit and the second circuit is removed to separate multiple metal traces of the first circuit and multiple metal traces of the second circuit.

[0123] The specific manufacturing method is similar to that of the flexible circuit board with four metal layers mentioned above, and will not be repeated here.

[0124] The method for manufacturing a flexible circuit board provided in this application embodiment can produce a flexible circuit board with electrical functions and elasticity, which can be applied to the above-mentioned image stabilization mechanism and camera module to improve the image stabilization performance of the image stabilization mechanism and camera module.

[0125] It should be noted that the manufacturing method of the flexible circuit board and the application of the flexible circuit board to the image stabilization component and camera module provided in this application are only exemplary, and can also be applied to other electronic components that need to achieve both electrical connection and flexible function.

[0126] Please continue reading Figure 3 The image stabilization assembly 100 may also include a support bracket 140, which is disposed between the base plate 130 and the movable member 111. The support bracket 140 can raise the movable member 111. The elastic circuit board 113 can generate an elastic restoring force to attach the movable member 111 to the support bracket 140. The support bracket 140 is connected to the base plate 130. The moving member 121, the movable member 111 and the image sensor 210 can remain relatively stationary during movement, which can prevent the image sensor 210 from tilting during movement, improve the image stabilization effect and improve the image quality of the captured image.

[0127] Please combine Figure 10 , Figure 10 for Figure 3 The diagram shows the structure of the elevation bracket in the image stabilization assembly. The elevation bracket 140 includes an elevation base plate 142 and at least three protrusions 144. All protrusions 144 are spaced apart on the side of the elevation base plate 142 facing the movable member 111, and the surfaces of all protrusions 144 facing the movable member 111 are on the same plane. At least three protrusions 144 abut against the movable member 111. The surfaces of the at least three protrusions 144 define a plane, ensuring that the movable member 111, mounted on the at least three protrusions 144, is on a single plane, thus guaranteeing the stability of the movable member 111. Furthermore, since the movable member 111 is mounted on the elevation bracket 140 via the multiple protrusions 144, when the movable member 111 moves relative to the elevation bracket 140, it does not need to move relative to the entire elevation base plate 142, but only relative to the multiple protrusions 144, reducing the influence of the elevation bracket 140 on the movement of the movable member 111. The surface of each protrusion 144 can be a smooth surface, and the surface of the movable part 111 that contacts the multiple protrusions 144 can also be a smooth surface, so that the movable part 111 can move conveniently relative to the multiple protrusions 144.

[0128] The raised support 140 can be formed using an etching process, resulting in excellent flatness. For example, the surface of each protrusion 144 of the raised support 140 that abuts against the movable member 111 can be formed using an etching process, thus giving each protrusion 144 a surface with excellent flatness and smoothness. Alternatively, if the raised substrate 142 does not have protrusions 144 and directly abuts against the movable member 111, the surface of the raised substrate 142 that abuts against the movable member 111 can be formed using an etching process, thus giving the surface of the raised substrate 142 a surface with excellent flatness and smoothness.

[0129] Multiple protrusions 144 can be disposed in different areas of the raised substrate 142. For example, multiple protrusions 144 can be disposed at different edge positions of the raised substrate 142, or multiple protrusions 144 can be disposed at different positions in the middle of the raised substrate 142.

[0130] Optionally, a super-slip structure can be provided between the raised bracket 140 and the movable part 111, and the coefficient of friction of the super-slip structure can reach 10. -3 The raised bracket 140 and the movable part 111 are slidably connected by a super-slip structure, which improves the sliding effect between the raised bracket 140 and the movable part 111, reduces the power consumption of the drive mechanism 120, and lowers the requirements of the drive mechanism 120. The super-slip structure can be installed on either the raised bracket 140 or the movable part 111. With the super-slip structure between the raised bracket 140 and the movable part 111, the smoothness requirement of the surface of the movable part 111 facing the raised bracket 140 can be reduced. For example, the surface of the movable part 111 facing the raised bracket 140 may not require a coating, and the smoothness requirement of the surface of the raised bracket 140 facing the movable part can be reduced. In some examples, the raised bracket 140 has multiple protrusions 144 on the side facing the movable part 111, and at least three of the protrusions 144 can have a super-slip structure on their surfaces facing the movable part 111. The protrusions 144 can be formed without etching, reducing the difficulty and cost of forming the protrusions 144, while also improving the sliding effect between the protrusions 144 and the movable part 111.

[0131] It should be noted that, since the elevating bracket 140 raises the movable part 111 while the height of the fixed part 112 remains unchanged, and the movable part 111 and the fixed part 112 are connected by the flexible circuit board 113, in order to better set the movable part 121, the movable part 121 can be set on the side of the movable part 111 away from the base plate 130, so as not to affect the setting of the fixed part 112 and the movable part 111.

[0132] Optionally, the movable component 111 includes a stacked metal layer and an insulating layer. The side of the insulating layer facing away from the substrate is used to support the image sensor of the camera module, and the metal layer is disposed on the side of the insulating layer facing the substrate. A metal layer, such as titanium copper, can be disposed on the bottom surface of the movable component 111, thereby giving the movable component 111 good elasticity. An insulating layer is disposed on the metal layer to facilitate the placement of the image sensor on the insulating layer.

[0133] Please continue reading. Figure 3 and Figure 4The drive mechanism 120 may include a movable member 121 and multiple deformable members 122. The movable member 121 may be directly or indirectly connected to the movable member 111, thereby the movable member 121, the movable member 111, and the image sensor 210 (or image sensor assembly 200) disposed on the movable member 111 can form an integral unit. One end of each deformable member 122 may be directly or indirectly connected to the fixed member 112, and the other end may be directly or indirectly connected to the movable member 121. When energized, the multiple deformable members 122 can deform to drive the overall movement of the movable member 121, the movable member 111, and the image sensor 210, so that the movable member 121, the movable member 111, and the image sensor 210 can move synchronously. For example, multiple deformable components 122 can deform when energized to drive the moving component 121, the movable component 111, and the image sensor 210 to move along the optical axis perpendicular to the lens 300 or rotate around the optical axis of the lens 300. The image sensor 210 can rotate in the X-axis, Y-axis, or XOY plane under the action of the image stabilization component 100.

[0134] It is understandable that the optical axis direction of lens 300 can be a first direction H1, which can be a vertical direction, such as the Z-axis direction in a coordinate system. The optical axis direction perpendicular to lens 300 can be a second direction, which can be any horizontal direction in a horizontal plane, such as the X-axis or Y-axis direction in a coordinate system. The optical axis direction surrounding lens 300 can be any direction in a plane perpendicular to the optical axis of lens 300, such as any direction in the XOY plane in a coordinate system.

[0135] It is understood that the multiple deformable elements 122 are made of shape memory alloys (SMA). When energized, the shape memory alloy can be heated and deformed, causing the length of the multiple deformable elements 122 to change. When energized or when different currents are transmitted to the multiple deformable elements 122, the length of the multiple deformable elements 122 can change. Since one end of each deformable element 122 is fixed with the fixing member 112 of the support plate 110 and the other end moves with the moving member 121, the multiple deformable elements 122 with changed lengths can drive the moving member 121 to move. The moving member 121 can also drive the moving member 111 and the image sensor 210 that are directly or indirectly connected to it to move.

[0136] In the image stabilization assembly 100 of this application embodiment, the driving mechanism 120 includes a movable member 121 and multiple deformable members 122. The movable member 121 is connected to the movable member 111 of the support plate 110. One end of each deformable member 122 is connected to the movable member 121, and the other end is connected to the fixed member 112 of the support plate 110. Thus, when the multiple deformable members 122 deform, they can drive the movable member 121 to move. The movable member 121 can drive the movable member 111 and the image sensor 210 disposed on the movable member 111 to move. Therefore, the image stabilization assembly 100 can realize the image stabilization function of the image sensor 210. At the same time, both ends of the deformable member 122 are connected to the fixed member 112 and the movable member 121 respectively. The deformable member 122 does not need to occupy the space of the movable member 111, and the deformable member 122 will not affect the distribution of circuits on the movable member 111, thereby reducing the impact of the deformable member 122 on the circuits on the movable member 111. Furthermore, the moving part 121 and the support plate 110 are independent of each other. In the production and assembly process, the moving part 121 and the support plate 110 can be produced modularly to improve their adaptability. It should be noted that the moving part 121 and the support plate 110 can also be produced together using the same production process. The embodiments of this application do not limit the specific preparation process of the moving part 121 and the support plate 110.

[0137] The drive mechanism 120 may further include multiple movable ends 123 and multiple fixed ends 124. The multiple movable ends 123 may be disposed on the moving member 121, and the multiple fixed ends 124 may be disposed on the fixed member 112. One end of a deformable member 122 may be directly or indirectly connected to a movable end 123, and the other end may be directly or indirectly connected to a fixed end 124. When the length of the deformable member 122 changes in the energized state, the movable end 123 connected to the deformable member 122 may move along with the moving member 121 as the length of the deformable member 122 changes, while the fixed end 124 connected to the deformable member 122 remains fixed along with the fixed member 112 and does not move.

[0138] It is understood that one or more movable ends 123 can be spaced apart and connected to the movable member 121, and two or more of the multiple movable ends 123 can also be arranged adjacently (or connected to each other) without spacing. Similarly, one or more fixed ends 124 can be spaced apart and connected to the fixed member 112 (e.g., spaced apart on the front of the fixed member 112), and two or more of the multiple fixed ends 124 can also be arranged adjacently (or connected to each other) without spacing. This application embodiment does not specify the specific arrangement of the multiple movable ends 123 and the multiple fixed ends 124.

[0139] For example, such as Figure 4As shown, the drive mechanism 120 may include two movable ends 123 spaced apart and two fixed ends 124 spaced apart. For example, the two movable ends 123 and the two fixed ends 124 may form a quadrilateral structure, with the two movable ends 123 located on one diagonal of the quadrilateral structure and the two fixed ends 124 located on the other diagonal, forming the four vertices of the quadrilateral structure. In this case, the image stabilization component 100 may also be provided with four deformation elements 122, which may correspond to the four sides of the quadrilateral structure. Based on the characteristic that quadrilateral structures are easily deformable, when a deformation element 122 deforms, it is more easily affected by the movable ends 123 and fixed ends 124 located at the vertices, causing the quadrilateral structure to change and thus more easily driving the movable part 111 and the image sensor 210 mounted on the movable part 111 to move.

[0140] It is understood that one or more movable ends 123 can be integrally formed on the movable part 121, and one or more fixed ends 124 can also be integrally formed on the fixed part 112. When the deformable part 122 is connected to the movable end 123 or the fixed end 124 by means of winding, snap-fitting, welding, etc., compared with the solution of directly connecting the deformable part 122 to the fixed part 112, in the process of connecting the deformable part 122 with the movable end 123 and the fixed end 124, it is not easy to damage the fixed part 112, and it is not easy to damage the circuit wiring on the fixed part 112.

[0141] It is understood that the number of movable ends 123 and fixed ends 124 can be equal to half the number of deformable parts 122, so that one movable end 123 can connect to the ends of two deformable parts 122, and one fixed end 124 can also connect to the ends of two deformable parts 122. Thus, the drive mechanism 120 of this application embodiment can be provided with fewer movable ends 123 and fixed ends 124.

[0142] It is understood that the image stabilization component 100, camera module 10, or electronic device may also include a drive control chip, which may be disposed on the fixing member 112 of the carrier plate 110 and form a drive circuit that causes the deformable member 122 to deform. Alternatively, a separate drive circuit may be disposed on the fixing member 112, and the drive control chip may be electrically connected to the drive circuit on the fixing member 112 through the aforementioned drive adapter plate 700. At least one of the plurality of movable ends 123 and the plurality of fixed ends 124 may be a conductive device, so that the drive circuit may be electrically connected to the deformable member 122 through the plurality of movable ends 123, or through the plurality of fixed ends 124, or simultaneously through the plurality of movable ends 123 and the plurality of fixed ends 124, thereby the drive control chip may provide drive current to the deformable member 122.

[0143] It is understandable that the movable end 123 and the fixed end 124 can have a certain height so that the movable end 123 and the fixed end 124 can isolate the support plate 110 from the moving part 121 and the deformable part 122. Thus, when multiple deformable parts 122 deform, they are less likely to come into contact with the support plate 110, which can avoid the deformation interference of the support plate 110 on the deformable parts 122; at the same time, it can also prevent the circuit on the support plate 110 from coming into contact with the deformable parts 122 and short-circuiting.

[0144] Optionally, the drive mechanism 120 may also include a shim 150, which is disposed between the movable member 121 and the active member 111. The shim 150 can raise the movable member 121, thereby raising the movable end 123 connected to the movable member 121, thus separating the movable member 121 from the fixed member 112.

[0145] The image stabilization component 100 can be provided with multiple movable ends 123 and fixed ends 124. The deformable component 122 is connected to the fixed component 112 of the carrier plate 110 and the moving component 121 of the drive mechanism 120 through the movable end 123 and the fixed end 124. The connection process of the deformable component 122 is simpler and will not affect the circuit wiring on the fixed component 112. At the same time, the movable end 123 and the fixed end 124 can be used as conductive devices to power the deformable component 122, which can simplify the power supply circuit layout of the deformable component 122 and realize the miniaturization design of the image stabilization component 100.

[0146] Multiple deformable elements 122 may be arranged around the movable element 121 to better control the movement of the movable element 121. For example, please refer to... Figure 11 , Figure 11 for Figure 3 The diagram shows the structure of the moving component in the drive mechanism. The moving component 121 may include a central portion 1215, a first extension 1217, and a second extension 1218. The central portion 1215 may be approximately a rectangular frame structure. The first extension 1217 and the second extension 1218 are located at two opposite corners of the central portion 1215. The central portion 1215 is located above the movable component 111. The first extension 1217 extends from one corner of the central portion 1215 to above the fixed component 112, and the second extension 1218 extends from the other corner of the central portion 1215 to above the fixed component 112. The first extension 1217 and the second extension 1218 may extend in a direction away from each other. Each of the first extension 1217 and the second extension 1218 has a movable end 123.

[0147] The fixed member 112 can be a rectangular frame structure, and the movable member 111 can be located in the hollow area of ​​the fixed member 112. When the drive mechanism 120 includes two movable ends 123 and two fixed ends 124, the two movable ends 123 can be disposed on the first extension 1217 and the second extension 1218 of the moving member 121, and the two fixed ends 124 can be disposed on the two opposite ends of the fixed member 112. Each movable end 123 is located between the two fixed ends 124, and each fixed end 124 is located between the two movable ends 123. Thus, the two movable ends 123 can be located on the diagonal of the moving member 121, and the two fixed ends 124 can be located on the diagonal of the moving member 121.

[0148] The image stabilization assembly 100 includes four deformable elements 122, which are located on the four sides of the fixed member 112. Specifically, each deformable element 122 is positioned relative to one side of the fixed member 112, and one end of each deformable element 122 is connected to a movable end 123, while the other end is connected to a fixed end 124. It is understood that the four deformable elements 122 cooperate to move the movable member 121, for example, allowing the movable member 121 to move along a direction perpendicular to the optical axis of the lens 300 or to rotate around the optical axis of the lens 300.

[0149] To facilitate understanding of how the image sensor 210 is controlled by the deformable element 122 in this embodiment, an example is given below. Please refer to... Figure 12 , Figure 12 for Figure 3 Another structural diagram of a portion of the drive mechanism shown. The four deformation elements 122 may include a first deformation element 1221, a second deformation element 1222, a third deformation element 1223, and a fourth deformation element 1224.

[0150] When the first deformable element 1221 is energized to shorten and contract, and / or the third deformable element 1223 is energized to lengthen and relax, the first deformable element 1221 and the third deformable element 1223 can drive the moving element 121, the movable element 111, and the image sensor 210 to translate to the right along the X-axis. When the first deformable element 1221 is energized to lengthen and relax, and / or the third deformable element 1223 is energized to shorten and contract, the first deformable element 1221 and the third deformable element 1223 can drive the moving element 121, the movable element 111, and the image sensor 210 to translate to the left along the X-axis.

[0151] When the second deformable element 1222 is energized to shorten and contract, and / or the fourth deformable element 1224 is energized to lengthen and relax, the second deformable element 1222 and the fourth deformable element 1224 can drive the moving element 121, the movable element 111, and the image sensor 210 to translate downward along the Y-axis. When the second deformable element 1222 is energized to lengthen and relax, and / or the fourth deformable element 1224 is energized to shorten and contract, the second deformable element 1222 and the fourth deformable element 1224 can drive the moving element 121, the movable element 111, and the image sensor 210 to translate upward along the Y-axis.

[0152] When the first deformable element 1221 and the third deformable element 1223 are simultaneously energized and shortened, the first deformable element 1221 and the third deformable element 1223 can drive the moving element 121, the movable element 111, and the image sensor 210 to rotate clockwise in the XOY plane along the diagonal of the moving element 121. When the first deformable element 1221 and the third deformable element 1223 are simultaneously energized and lengthened, the first deformable element 1221 can drive the moving element 121, the movable element 111, and the image sensor 210 to rotate counterclockwise in the XOY plane along the diagonal of the moving element 121.

[0153] When the second deformable element 1222 and the fourth deformable element 1224 are simultaneously energized and shortened, the second deformable element 1222 and the fourth deformable element 1224 can drive the moving element 121, the movable element 111, and the image sensor 210 to rotate counterclockwise in the XOY plane along the diagonal of the moving element 121. When the second deformable element 1222 and the fourth deformable element 1224 are simultaneously energized and lengthened, the second deformable element 1222 and the fourth deformable element 1224 can drive the moving element 121, the movable element 111, and the image sensor 210 to rotate clockwise in the XOY plane along the diagonal of the moving element 121.

[0154] In the image stabilization component 100 of this application embodiment, the first deformation element 1221, the second deformation element 1222, the third deformation element 1223, and the fourth deformation element 1224 are arranged around the moving element 121. The multiple deformation elements 122 can symmetrically and uniformly control the movement of the moving element 121, making the movement distance and direction of the moving element 121 more controllable and facilitating the image stabilization component 100 to calculate the image stabilization parameters of the image sensor 210. At the same time, the multiple deformation elements 122 can drive the moving element 121 and the image sensor 210 to achieve translational image stabilization along the X and Y axes, and can also achieve rotational image stabilization in the XOY plane. The adaptability of the image stabilization component 100 can achieve image stabilization compensation in various shaking scenarios, and the camera module 10 can achieve image stabilization compensation in various shaking scenarios, making the camera module 10 more adaptable.

[0155] It should be noted that, in addition to driving the moving member 121, the movable member 111, and the image sensor 210 to move along or rotate around the optical axis of the lens 300, the multiple deformable members 122 in this embodiment can also drive the moving member 121, the movable member 111, and the image sensor 210 to move in other ways. For example, the multiple deformable members 122 can also drive the moving member 121, the movable member 111, and the image sensor 210 to move up and down along the optical axis of the lens 300; or, the multiple deformable members 122 can also drive the moving member 121, the movable member 111, and the image sensor 210 to rotate around the optical axis perpendicular to the lens 300. In this case, the arrangement of the multiple deformable members 122 and the moving member 121 can be changed accordingly. For example, the image stabilization component 100 and the image sensor component 200 can be arranged as a whole along the optical axis of the lens, and a reflector can be arranged between the image stabilization component 100 and the lens 300. The reflector can deflect the light entering from the lens 300 by 90 degrees before it enters the sensor component 200. The embodiments of this application do not limit the specific manner in which the multiple deformable elements 122 drive the moving element 121, the movable element 111, and the image sensor 210 to move.

[0156] Understandably, the structure of the frame of the movable member 121 can be adapted to the size of the movable member 111 of the support plate 110, so that the movable member 121 can carry the movable member 111. The projections of the first extension 1217 and the second extension 1218 of the movable member 121 onto the support plate 110 can be located on the fixed member 112 of the support plate 110, so that the quadrilateral structure formed by the two movable ends 123 and the two fixed ends 124 can be adapted to the size of the fixed member 112, thereby allowing the length of the multiple deformable members 122 to be longer, and the multiple deformable members 122 to drive the movable member 121, the movable member 111 and the image sensor 210 to have a larger movement stroke.

[0157] In this embodiment, the movable member 121 is provided with a first extension 1217 and a second extension 1218. On the one hand, the first extension 1217 and the second extension 1218 can carry two movable ends 123. On the other hand, the first extension 1217 and the second extension 1218 make the deformable member 122 longer, and the deformable member 122 drives the movable member 121, the movable member 111 and the image sensor 210 to have a larger movement stroke, and the image stabilization compensation of the image sensor 210 by the image stabilization component 100 can be greater.

[0158] It is understood that the image stabilization assembly may also include an image stabilization housing 160, which may be mounted on the fixed member 112 and cover the drive mechanism 120 and the movable member 111 to protect them. The image sensor assembly 200 and the filter assembly 500 may also be housed within the image stabilization housing 160. The image stabilization housing 160 has an opening in the middle, facing the lens 300, so that light collected by the lens 300 can pass through the opening to the filter 510 and the image sensor 210.

[0159] The driver adapter board 700 of the camera module 10 can be electrically connected to the deformation element 122 to control the deformation of the deformation element 122, thereby achieving image stabilization of the camera module 10. The driver adapter board 700 can be vertically positioned, either perpendicular or approximately perpendicular to the base plate 130. Vertically positioning the driver adapter board 700 on the base plate 130 reduces the size of the camera module. Designing a separate driver adapter board 700 allows for the placement of the driver IC and other electronic components, facilitating camera module stacking. Furthermore, considering that when the camera module is mounted on the motherboard of an electronic device, a corresponding receiving hole needs to be provided on the motherboard, the smaller the size of the camera module, the smaller the area of ​​the receiving hole on the motherboard, and the larger the area on the motherboard that can accommodate circuitry, thus facilitating efficient circuit layout.

[0160] Optionally, the drive adapter board 700 can be attached to the anti-shake housing 160, that is, one side of the drive adapter board can be attached to the anti-shake housing 160. This allows the anti-shake housing 160 to support the drive adapter board 700 and also makes the structure of the drive adapter board 700 and the anti-shake housing 160 more compact. It should be noted that the fixing member 112 can be provided with multiple soldering pins, and the drive adapter board 700 can be provided with corresponding soldering pins. The soldering pins of the fixing member 112 and the soldering pins of the drive adapter board 700 are soldered together to make the fixing member 112 and the drive adapter board 700 electrically connected.

[0161] Optionally, the camera module 10 may also include a module housing, with the lens 300 mounted inside the module housing. The drive adapter plate 700 can be attached to the module housing, allowing the module housing to support the drive adapter plate 700 and making the structure of the drive adapter plate 700 and the module housing more compact. For example, the module housing can be stacked on top of the image stabilization housing 160, with the drive adapter plate 700 positioned on the same side of both the module housing and the image stabilization housing 160. The sides of the module housing and the image stabilization housing 160 facing the drive adapter plate 700 can be flush, allowing the drive adapter plate 700 to simultaneously adhere to both the module housing and the image stabilization housing 160. Alternatively, the sides of the module housing and the image stabilization housing 160 facing the drive adapter plate 700 may not be flush, with one of the module housing and the image stabilization housing 160 protruding towards the drive adapter plate 700. The drive adapter plate 700 can be attached to the protruding one of the module housing and the image stabilization housing 160. In some other examples, the module housing may cover the anti-shake housing 160, that is, the anti-shake body 160 is set inside the module housing, and correspondingly, the drive adapter plate 700 is attached to the module housing.

[0162] Optionally, the drive adapter board 700 may include a detection unit and a control chip. The detection unit is electrically connected to the deformable element 122 and is used to acquire the resistance value of the deformable element 122. The control chip is electrically connected to the detection unit and is used to control the current through the deformable element 122 based on the resistance value. Utilizing the thermal expansion and contraction characteristics of the deformable element 122 (SMA wire), the detection unit acquires the resistance value of the deformable element 122. The control chip, based on the resistance value acquired by the detection unit, can determine the length of the deformable element 122, and thus the position of the image sensor. It then controls the current to the deformable element 122, changing its length and consequently changing the position of the image sensor, thereby achieving image sensor stabilization. Using the resistance feedback of the deformable element 122 for control eliminates the need for a Hall sensor, resulting in lower cost and a simpler structure. In the same volume of the image stabilization assembly 100, a longer deformable element 122 can be assembled, allowing the image stabilization assembly 100 to provide a larger working stroke and a larger stabilization angle.

[0163] Please continue reading. Figure 2 and Figure 3 Please see Figure 13 and Figure 14 , Figure 13 for Figure 1 The diagram shows another angle of the camera module's structure. Figure 14 for Figure 13 The image shown is a cross-sectional view of the camera module along the AA direction. The camera module 10 of this embodiment may further include a focusing component 600, which may be directly or indirectly connected to the lens 300, and the focusing component 600 may drive the lens 300 to move. For example, the focusing component 600 may drive the lens 300 to move along the optical axis of the lens 300.

[0164] The focusing component 600 can be disposed on the image stabilization component 100, for example, on the image stabilization housing 160 of the image stabilization component 100. The focusing component 600 can be disposed opposite to the image stabilization component 100 in the optical axis direction of the lens 300. The focusing component 600 and the image stabilization component 100 can be stacked along the first direction H1. In some embodiments, a mechanical limiting bracket 410 can also be disposed between the focusing component 600 and the image stabilization component 100.

[0165] The focusing assembly 600 may include a module housing and a focusing drive mechanism. The module housing can serve as a mounting housing for the focusing assembly 600, and the focusing drive mechanism can be disposed within the module housing. The focusing drive mechanism can drive the lens 300 to move to achieve the focusing function. In some embodiments, please refer to... Figure 15 , Figure 15 This is another exploded structural diagram of the camera module provided in an embodiment of this application. The focusing assembly 600 may include a carrier 610, a magnetic component 620, and a conductive component 630.

[0166] The carrier 610 can support the lens 300, and the carrier 610 can be, but is not limited to, the carrier of the lens 300. The magnetic component 620 can generate a magnetic field, and the carrier 610 can be located within the magnetic field. The conductive component 630 can be disposed opposite to the magnetic component 620 in a direction perpendicular to the optical axis of the lens 300. The conductive component 630 can generate a force under the action of the magnetic component 620, and this force can cause the carrier 610 to move up and down along the optical axis of the lens 300.

[0167] It is understood that the magnetic component 620 can be, but is not limited to, a permanent magnet, electromagnet, or other magnetic element capable of generating a magnetic field. The carrier 610 may have a receiving groove, within which the magnetic component 620 can be located. The magnetic component 620 may include one or more sub-magnetic components. For example, the magnetic component 620 may include four sub-magnetic components, which may be evenly spaced around the optical axis of the lens 300 around the carrier 610. Correspondingly, the conductive component 630 may also include multiple sub-conductive components, such that each sub-conductive component can be disposed opposite to one sub-magnetic component. This application does not limit the specific structure of the magnetic component 620 and the carrier 610.

[0168] It is understood that the conductive element 630 may be, but is not limited to, a coil structure. An external power source (such as the power supply of an electronic device or the drive adapter board 700) can energize the coil so that the conductive element 630 can generate a force that drives the bearing element 610 to move up and down along the first direction H1 under the action of the magnetic element 620.

[0169] Optionally, the focusing assembly 600 may further include a bracket 640, which is fixedly connected to the module housing 400 of the camera module 10 and does not move with the magnetic component 620. A conductive component 630 may also be disposed on the bracket 640; for example, the bracket 640 may have a groove in which the conductive component 630 may be disposed. The module housing 400 may cover the support component 610 and the bracket 640, etc., meaning that the support component 610 and the bracket 640, etc., are all disposed within the module housing 400. In some other embodiments, the module housing 400 may also cover the image sensor, meaning the image sensor is also disposed within the module housing 400.

[0170] Optionally, the bracket 640 may also be provided with a limiting groove extending in the first direction H1, and the bearing member 610 may also be provided with a ball structure 650, which can be accommodated in the limiting groove. When the conductive member 630 generates a force under the action of the magnetic member 620, the force can cause the bearing member 610 to move up and down relative to the bracket 640 in the first direction H1 under the rolling action of the ball structure 650.

[0171] Optionally, the focusing assembly 600 may further include a flexible circuit board 660, which may be disposed within a recess in the support 640 to facilitate electrical connection between the flexible circuit board 660 and the conductive element 630. The flexible circuit board 660 can supply power to the conductive element 630 and provide control current. It is understood that an external power source can also be electrically connected to the flexible circuit board 660, allowing the external power source to supply power to the conductive element 630 through the flexible circuit board 660.

[0172] Optionally, the focusing assembly 600 may also include a magnetic sheet 670, which may be disposed in a groove of the bracket 640 and provide an adsorption force for the conductive element 630 so that the conductive element 630 can be fixed on the bracket 640.

[0173] Optionally, the camera module 10 or electronic device may also include a second control chip. This second control chip can be electrically connected to the focusing assembly 600. The second control chip can monitor the motion parameters of the lens 300, and can control the movement of the lens 300 and the carrier 610 in real time based on the monitored motion parameters and the shake parameters of the camera module 10, so as to achieve more accurate shake compensation of the lens 300 and realize closed-loop control of the camera module 10.

[0174] The focusing assembly 600 in this embodiment of the application can make the carrier 610 and the lens 300 move up and down in the vertical direction by the cooperation of the magnetic component 620 and the conductive component 630. The focusing assembly 600 has a simple structure and occupies a small space, which can realize the miniaturization design of the camera module 10.

[0175] In some embodiments, an open-loop focusing component can be selected as needed, in conjunction with a near-closed-loop control chip, to slightly sacrifice focusing speed while maintaining the stability of the focusing component in control. By utilizing the image stabilization component to stabilize the image sensor, better shooting results can be achieved, which can reduce costs and decrease the size of the camera module.

[0176] It is understood that in some other embodiments, the camera module 10 may not have a focusing component 600, and the camera module 10 may be a fixed focal length camera module, which can simplify the structure of the camera module. For example, the camera module may be an auxiliary camera module.

[0177] It should be noted that the specific structure of the camera module 10 in this application embodiment is not limited to the description of the above embodiments. For example, in addition to including the image stabilization component 100, the image sensor component 200, the lens 300, and the focusing component 600, the camera module 10 may also include, but is not limited to, a micro-gimbal component. This application embodiment does not limit the specific structure of the camera module 10.

[0178] Optionally, the camera module may also include a lens stabilization component connected to the lens. This component adjusts the lens's movement to achieve image stabilization. The lens stabilization component can employ a structure similar to the magnetic components, coil structures, and ball bearing structures described in the above embodiments. For example, multiple pairs of magnetic components and coil structures, as well as multiple sets of ball bearing structures, can be used to drive the lens movement to achieve image stabilization. For instance, the lens can be driven to rotate around its axis, or it can be flipped in a plane perpendicular to the lens axis. Lens movement can alter and correct the optical path when the camera module shakes, achieving image stabilization compensation.

[0179] It is understandable that the image stabilization components driving the camera module and the lens image stabilization components driving the lens respectively perform image stabilization on the camera module and the lens, thereby achieving five-axis image stabilization for the camera module, specifically including compensation stabilization along five axes: Pitch (Rx), Yaw (Ry), Roll (Rz), Left / Right (X), and Up / Down (Y). Rx, Ry, and Rz can be stabilized using gyroscope sensors, while X and Y can be stabilized using accelerometer sensors. For example, four-axis image stabilization can be achieved by compensating for translations in the X and Y directions or rotations in the Rx and Ry directions through translation in the X and Y directions. The image stabilization components can achieve X and Y translation and rotation in the X and Y plane by using the tension of four deformable elements (SMA metal wires), thereby compensating for X and Y translations, Rx and Ry rotations, and Rz image stabilization.

[0180] Lenses and lens stabilization components can be fixed by methods such as adhesive bonding and baking, screwing, or snap-fitting.

[0181] It is understandable that in some embodiments, the camera module may not have a lens stabilization component, but can achieve image stabilization through a stabilization component. The size of the camera module can be made very small, which can be used in some places where the size of the camera module is strictly required.

[0182] Optionally, the camera module can be either a regular camera module or a periscope camera module. When the camera module is a periscope camera module, it can also include a module housing and a prism assembly, with the lens mounted inside the module housing. The prism assembly is also mounted inside the module housing, positioned on the side of the lens furthest from the image sensor, and is fixedly connected to the module housing. In related technologies, image stabilization in periscope modules mostly relies on controlling the movement of a prism, which increases the size of the prism stabilization module and complicates its structure. This embodiment uses in-body image stabilization (i.e., image sensor stabilization) to achieve image stabilization of the camera module. The prism can then be fixedly mounted inside the module housing, reducing its size and eliminating the need for a complex prism stabilization structure, thus lowering costs and optimizing the size of the camera module.

[0183] This application also provides an electronic device; please refer to [link / reference]. Figure 16 , Figure 16 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application. The electronic device 1 includes a housing 20 and a camera module 10. The camera module 10 is mounted on the housing 20. The camera module 10 is any of the camera modules 10 described in the above embodiments, and will not be repeated here.

[0184] The electronic device also includes a drive mechanism connected to the camera module, used to move the camera module between the inside and outside of the housing. The camera module can be a pop-up camera module. When the electronic device needs to use the camera module, the drive mechanism moves the camera module from the inside to the outside of the electronic device, at which point the camera module can be used normally. When the electronic device uses an external camera module, the drive mechanism moves the camera module from the outside to the inside of the electronic device, and the camera module enters a standby or power-off state.

[0185] To better understand the electronic device in this embodiment, electronic device 1 will be used as a mobile phone example below. Figure 13 As shown, in addition to the camera module 10 described in the above embodiments, the electronic device 1 may also include a display screen 30, a battery 40, and a motherboard 50. It should be noted that the rear camera of the electronic device can also be the camera module described in the above embodiments. Of course, the electronic device may only have a front camera or a rear camera, or it may be the camera module described in the above embodiments.

[0186] The housing 20 may include a middle frame 21 and a rear shell 22. The display screen 30 may be disposed on one side of the middle frame 21, and the rear shell 22 may be disposed on the other side of the middle frame 21. For example, the display screen 30 and the rear shell 22 may be disposed on opposite sides of the middle frame 21 by means of adhesive bonding, welding, or snap-fitting. The camera module 10 may be disposed between the display screen 30 and the rear shell 22 and may be able to receive light from the external environment.

[0187] The back cover 22 can be the battery cover of the electronic device 1. Its material can be glass, metal, hard plastic, or other electrochromic materials. The back cover 22 has a certain structural strength and is mainly used to protect the electronic device 1. Correspondingly, the middle frame 21 can also be made of glass, metal, hard plastic, etc. The middle frame 21 also has a certain structural strength and is mainly used to support and fix the camera module 10 and other functional components installed between the middle frame 21 and the back cover 22. For example, the battery 40, motherboard 50, and antenna of the electronic device 1. Furthermore, since the middle frame 21 and the back cover 22 are generally directly exposed to the external environment, the materials of the middle frame 21 and the back cover 22 can preferably have certain wear-resistant, corrosion-resistant, and scratch-resistant properties, or a layer of wear-resistant, corrosion-resistant, and scratch-resistant functional material can be coated on the outer surface of the middle frame 21 and the back cover 22 (i.e., the outer surface of the electronic device 1).

[0188] The display screen 30 may include a display module and circuitry for responding to touch operations on the display module. The display screen 30 may use an organic light-emitting diode (OLED) screen for image display or a liquid crystal display (LCD) screen for image display. Furthermore, the display screen 30 may be a flat panel screen, a curved screen, or a quad-curved screen; this embodiment does not limit the specific form factor.

[0189] It should be noted that, for mobile phones, the aforementioned flat screen refers to the display screen 30 being flat in shape as a whole; the aforementioned dual-curved screen refers to the left and right edges of the display screen 30 being curved, while other areas remain flat. This not only reduces the black borders of the display screen 30 and increases the visible area of ​​the display screen 30, but also enhances the aesthetics and grip of the electronic device 1; the aforementioned quad-curved screen refers to the top, bottom, left, and right edges of the display screen 30 being curved, while other areas remain flat. This not only further reduces the black borders of the display screen 30 and increases the visible area of ​​the display screen 30, but also further enhances the aesthetics and grip of the electronic device 1.

[0190] The motherboard 50 can be housed within the casing 20, and can serve as the main control circuit board for the electronic device 1. The motherboard 50 may integrate a processor, and may also integrate one or more functional components such as a headphone jack, accelerometer, gyroscope, and motor. The processor on the motherboard 50 can control the display screen 30 and the camera module 10.

[0191] The battery 40 can be housed within the casing 20 and electrically connected to the motherboard 50 to power the electronic device 1. The motherboard 50 may contain a battery management circuit. This circuit distributes the voltage supplied by the battery 40 to the various electronic components within the electronic device 1.

[0192] It is understood that the above is only an exemplary example of electronic device 1. Electronic device 1 in this application embodiment may also include components such as sensors, sound-to-electric conversion devices, and antenna modules. These components can be referred to in the description of related technologies, and will not be repeated here.

[0193] It is understood that the electronic devices provided in the embodiments of this application may be mobile terminal devices such as mobile phones and tablets, or devices with camera modules such as gaming devices, augmented reality (AR) devices, virtual reality (VR) devices, in-vehicle computers, laptops, data storage devices, audio playback devices, video playback devices, wearable devices, and monitoring devices. Wearable devices may be smartwatches, smart glasses, etc.

[0194] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0195] The image stabilization components, camera modules, and electronic devices provided in the embodiments of this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the above embodiments are only for the purpose of helping to understand the methods and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A method for manufacturing a flexible circuit board, characterized in that, The flexible circuit board is applied to a stabilization assembly, which includes a support plate. The support plate includes a movable member and a fixed member spaced apart. The fixed member is sleeved on the outer periphery of the movable member, forming a gap between them. The flexible circuit board is disposed between the movable member and the fixed member. The flexible circuit board includes a first end, a middle portion, and a second end connected sequentially. The first end is connected to the fixed member, and the second end is connected to the movable member. The method includes: A circuit board is provided, comprising a first metal layer, a first dielectric layer, a second metal layer, a second dielectric layer, a third metal layer, a third dielectric layer, and a fourth metal layer stacked together. The circuit board includes a connection area and a flexible area. A first circuit is formed on the first metal layer of the flexible area, and the first circuit includes a plurality of spaced metal traces. A second circuit is formed on the second metal layer of the flexible area, and the second circuit includes a plurality of spaced metal traces. The projection of the first circuit on the first dielectric layer coincides with the projection of the second circuit on the first dielectric layer. The first metal layer, the second metal layer, the third metal layer, and the fourth metal layer of the connection area are electrically connected. Remove the fourth metal layer, the third dielectric layer, the third metal layer, and the second dielectric layer of the elastic region to expose the second circuit and part of the first dielectric layer. The exposed portion of the first dielectric layer is removed to separate multiple metal traces of the first circuit and multiple metal traces of the second circuit. The connection area includes the first end and the second end, and the elastic area includes the middle part.

2. The method for manufacturing a flexible circuit board according to claim 1, characterized in that, The process includes, prior to removing the first dielectric layer exposed between the first and second circuits: A first protective layer is formed on the surface of the first circuit and / or the second circuit.

3. The method for manufacturing a flexible circuit board according to claim 1, characterized in that, The removal of the first dielectric layer exposed between the first circuit and the second circuit includes: The first dielectric layer exposed between the first circuit and the second circuit is removed by laser cutting or reactive ion etching.

4. The method for manufacturing a flexible circuit board according to claim 1, characterized in that, The rigidity of the first metal layer is greater than that of the second metal layer.

5. The method for manufacturing a flexible circuit board according to claim 4, characterized in that, The first metal layer is a copper alloy layer, and the second metal layer is a copper layer.

6. The method for manufacturing a flexible circuit board according to claim 1, characterized in that, The method further includes: The first, second, third, and fourth metal layers of the connection area are made conductive by setting vias.

7. The method for manufacturing a flexible circuit board according to claim 1, characterized in that, The method further includes: The fourth metal layer of the connection area includes a welding area and a non-welding area, a second protective layer is provided in the non-welding area, and a third protective layer is provided in the welding area.

8. The method for manufacturing a flexible circuit board according to any one of claims 1-7, characterized in that, The provided circuit board includes: A first metal layer is provided, and a first dielectric layer is laid on the first metal layer; A second metal layer is laid on the side of the first dielectric layer away from the first metal layer, and the second circuit is formed on the second metal layer. The second dielectric layer is laid on the side of the second metal layer that is opposite to the first dielectric layer; A third metal layer is laid on the side of the second dielectric layer that is opposite to the second metal layer; A third dielectric layer is laid on the side of the third metal layer that is opposite to the second dielectric layer; The fourth metal layer is laid on the side of the third dielectric layer opposite to the third metal layer; The first circuit is formed on the first metal layer to form the provided circuit board.

9. The method for manufacturing a flexible circuit board according to any one of claims 1-7, characterized in that, The provided circuit board includes: A first metal layer is provided, and a first dielectric layer with adhesive on both sides is laid on the first metal layer; A second metal layer is laminated onto the side of the first dielectric layer away from the first metal layer, and a via is provided in the second metal layer to connect the second metal layer and the first metal layer. The second circuit is etched into the second metal layer using an etching process; An adhesive is laid on the side of the second metal layer away from the first dielectric layer, and the second dielectric layer and the third metal layer are pressed onto the second metal layer on which the adhesive is laid; A via is provided in the third metal layer to connect the third metal layer and the second metal layer. The wiring of the third metal layer is achieved through an etching process; An adhesive is laid on the side of the third metal layer opposite to the second dielectric layer, and the third dielectric layer and the fourth metal layer are pressed together onto the third metal layer on which the adhesive is laid; A via is provided in the fourth metal layer to connect the fourth metal layer and the third metal layer. The wiring of the fourth metal layer is achieved through an etching process; The first circuit is etched into the first metal layer by an etching process to form the provided circuit board.

10. A method for manufacturing a flexible circuit board, characterized in that, The flexible circuit board is applied to a stabilization assembly, which includes a support plate. The support plate includes a movable member and a fixed member spaced apart. The fixed member is sleeved on the outer periphery of the movable member, forming a gap between them. The flexible circuit board is disposed between the movable member and the fixed member. The flexible circuit board includes a first end, a middle portion, and a second end connected sequentially. The first end is connected to the fixed member, and the second end is connected to the movable member. The method includes: A circuit board is provided, comprising a first metal layer, a first dielectric layer, a second metal layer, a second dielectric layer, and a third metal layer stacked together. The circuit board includes a connection area and a flexible area. A first circuit is formed on the first metal layer of the flexible area, and the first circuit includes a plurality of spaced metal traces. A second circuit is formed on the second metal layer of the flexible area, and the second circuit includes a plurality of spaced metal traces. The projection of the first circuit on the first dielectric layer coincides with the projection of the second circuit on the first dielectric layer. The first metal layer, the second metal layer, and the third metal layer of the connection area are electrically connected. Remove the third metal layer and the second dielectric layer of the elastic region to expose the second circuit; Remove the first dielectric layer exposed between the first circuit and the second circuit to separate multiple metal traces of the first circuit and multiple metal traces of the second circuit. The connection area includes the first end and the second end, and the elastic area includes the middle part.

11. A flexible circuit board, characterized in that, It is manufactured by the method of manufacturing a flexible circuit board as described in any one of claims 1-10.

12. A stabilization component, characterized in that, include: The support plate includes movable parts and fixed parts arranged at intervals, wherein the fixed parts are sleeved on the outer periphery of the movable parts and a gap is formed between them; A flexible circuit board, comprising the flexible circuit board as described in claim 11, wherein the flexible circuit board is disposed between the movable member and the fixed member, the flexible circuit board comprising a first end, a middle portion and a second end connected in sequence, the first end being connected to the fixed member and the second end being connected to the movable member, the flexible circuit board being used to carry an image processor; Drive mechanism, used to drive the movement of image sensor; The elastic circuit board provides an elastic force opposite to the direction of motion of the image sensor when it moves.

13. A camera module, characterized in that, include: A lens is used to capture external light; An image sensor is disposed opposite to the lens along the optical axis of the lens; as well as Image stabilization components, including the image stabilization components as described in claim 12.

Images