A high-g overload resistant heterogeneous integrated structure for inertial microsystem components

Abstract

The application discloses a high-overload-resistant heterogeneous integration structure of an inertial microsystem component, which comprises a bottom buffer shell and a top rubber pad arranged in a metal shell of the inertial microsystem component, and an internal cavity formed by the bottom buffer shell and the top rubber pad is used for accommodating an electronic system of the inertial microsystem component; in the application, the bottom surface of the bottom buffer shell is composed of a foamed metal buffer structure and a rubber damping structure, and the foamed metal buffer structure and the rubber damping structure are heterogeneously integrated in a mode that the rubber damping structure surrounds the outer surface of the foamed metal buffer structure. The heterogeneous integration structure of the rubber and the foamed metal realizes the high-overload-resistance and damping characteristics of the inertial microsystem component, and the assembly stability and reliability of the internal electronic system.

Description

Technical Field

[0001] This invention relates to a heterogeneous integrated structure for inertial microsystem components that is resistant to high overload, belonging to the field of reliability design technology for inertial microsystems. Background Technology

[0002] Inertial microsystems (INS) are used in fields such as electromagnetic railguns and hypersonic projectiles. These projectiles have unique aerodynamic shapes and are typically sub-caliber, resulting in extremely limited internal space for electronic components. To ensure the survival and stable performance of INS in the high-overload, high-dynamic environments of electromagnetic railguns and hypersonic projectiles, it is necessary to consider both high-overload protection and vibration isolation, and to adopt a high-density heterogeneous integration design to guarantee their reliability and adaptability in harsh firing environments.

[0003] Chinese invention patent CN 109973585 A, entitled "Composite Protection Structure for Test Control Circuit Resistant to High Overload," proposes a composite protection structure for test control circuits resistant to high overload. It employs a multi-layered shell and a composite buffer structure made of various materials. A sealed air damping cavity exists between the bottom and top plates, and the test control circuit board is supported by multiple vibration-damping pillars made of soft plastic, providing a certain degree of resistance to high overload. However, due to the use of independent structural designs with multiple materials, this invention suffers from a large overall structural size and complex assembly process. Furthermore, the presence of the air damping cavity necessitates a high degree of structural airtightness, making it susceptible to structural deformation and air leakage under high overload impact conditions, which can reduce its resistance to high overload.

[0004] Chinese invention patent CN 111692258 A, entitled "An Impact-Resistant Rubber Vibration Damper," proposes an impact-resistant vibration damper with rubber as the base. The mounting core and mounting base are integrally molded with the inner and outer rubber layers using an interference fit. The design incorporates various rubbers with different moduli and hardnesses to achieve vibration reduction and impact resistance. However, this invention, using only a rubber structure as the core for vibration damping, cannot meet the impact resistance requirements of applications with acceleration overloads of tens of thousands of grams. Furthermore, the suspended and supported structure requires a large installation space.

[0005] Chinese utility model patent CN 216895538 U, entitled "A High Overload Resistance and Limiting Vibration Damper for Micro Inertial Navigation Systems," discloses a high overload resistance and limiting vibration damper for micro inertial navigation systems that employs a uniquely shaped rubber structure. It utilizes upper and lower buffer damping pads and optimizes the system frequency by adjusting Shore hardness and contact area to achieve high overload resistance. The damping pads are designed to match the inertial navigation structure for limiting. This invention has a simple structure, is easy to assemble, and can achieve a certain level of impact resistance and vibration damping. However, due to the use of only a single material and structure, the overload resistance and vibration damping effects are relatively limited.

[0006] Chinese invention patent CN 106153044 A, entitled "A Vibration Damping Structure for a Micro Inertial Measurement Unit," proposes a vibration damping structure that suspends a product in mid-air using an elastic damping ring with grooves. This structure avoids the stiffness difference problem inherent in distributed vibration damping designs through its integral elastic damping structure, reducing the offset between the elastic center and the center of the product being damped. Furthermore, the cross-section of the elastic damping ring is symmetrical with the radial central axis, ensuring that the radial and axial stiffness of the system are the same, reducing the system frequency range, and facilitating the control system's amplification of vibrations. However, this structure is fixed to the product's annular protrusions via the damping ring grooves. During operation, there is a possibility that vibrations could cause relative rotation between the product and the outer casing, affecting the system's operation.

[0007] In existing technologies, shock resistance and vibration reduction for micro-inertial products are mainly achieved through material properties and structural design. These typically use rubber as the matrix, employing hard-soft-hard sandwich structures or damping pads for support and suspension. While a single material or structure can achieve a certain degree of resistance to high overloads or vibration reduction, it's difficult to achieve both simultaneously. Using composite structures increases system volume and installation space, and also complicates assembly. Summary of the Invention

[0008] The purpose of this invention is to propose a heterogeneous integrated structure for inertial microsystem components that is resistant to high overload. By adopting a heterogeneous integrated structure design, the good viscoelastic properties of rubber materials are combined with the plastic energy absorption properties of foam metals, thereby achieving high overload resistance and vibration reduction characteristics of inertial microsystem components, as well as the assembly stability and reliability of internal electronic systems.

[0009] To achieve the above objectives, the technical solution adopted by the present invention is as follows:

[0010] The present invention provides a high-overload-resistant heterogeneous integrated structure for an inertial microsystem component, comprising: a bottom buffer housing placed within a metal housing of the inertial microsystem component;

[0011] The sides of the bottom buffer housing are made of rubber;

[0012] The top of the bottom buffer housing is a top rubber pad;

[0013] The internal cavity formed by the bottom buffer housing and the top rubber pad is used to house the electronic system of the inertial microsystem components;

[0014] The bottom surface of the bottom buffer housing includes a foam metal buffer structure and a rubber vibration damping structure.

[0015] Furthermore, the foam metal buffer structure and the rubber vibration damping structure are heterogeneously integrated by means of the rubber vibration damping structure surrounding and fitting the outer surface of the foam metal buffer structure.

[0016] Furthermore, the foam metal buffer structure is a frustum structure that is smaller at the top and larger at the bottom.

[0017] Furthermore, the bottom surface thickness of the bottom buffer housing is greater than 6mm.

[0018] Furthermore, the bottom surface of the foam metal buffer structure is fixed to the metal shell of the inertial microsystem component using an adhesive.

[0019] Furthermore, based on the internal electronic system structure of the inertial microsystem component, the internal cavity of the bottom buffer shell is designed to match the design.

[0020] Furthermore, based on the requirements for high overload resistance and vibration reduction of the inertial microsystem components, rubber and foam metal with suitable mechanical parameters are selected.

[0021] The beneficial effects of this invention are as follows:

[0022] This invention achieves high overload resistance and vibration reduction characteristics of inertial microsystem components, as well as assembly stability and reliability of internal electronic systems, through a heterogeneous integrated structure of rubber and foam metal. Attached Figure Description

[0023] Figure 1 A diagram illustrating a heterogeneous integrated structure for an inertial microsystem component designed to withstand high overload, provided in an embodiment of the present invention.

[0024] Figure 2 This is a cross-sectional view of a heterogeneous integrated structure for an inertial microsystem component that is resistant to high overload, provided in an embodiment of the present invention.

[0025] The components include: 1. Metal outer casing cover; 2. Top rubber pad; 3. Electronic system; 4. Bottom buffer housing; 5. Metal outer casing; 41. Annular rubber vibration damping structure; 42. Foam metal buffer structure; 43. Adhesive. Detailed Implementation

[0026] The present invention will now be further described. The following embodiments are only used to more clearly illustrate the technical solution of the present invention, and should not be used to limit the scope of protection of the present invention.

[0027] One embodiment of the present invention provides a heterogeneous integrated structure for an inertial microsystem component to resist high overload. Based on the hard-soft-hard sandwich design of the inertial microsystem component, the outer hard structure is the metal shell of the microsystem component, the inner hard structure is the electronic system, and the heterogeneous integrated structure is used as a soft sandwich to surround and protect the internal electronic system of the inertial microsystem component, thereby achieving resistance to high overload and vibration reduction.

[0028] This embodiment provides a heterogeneous integrated structure for an inertial microsystem component that is resistant to high overload. See [link to previous document]. Figure 1This includes a bottom buffer housing 4 housed within a metal housing 5 of the inertial microsystem component;

[0029] The bottom buffer housing has rubber sides to attenuate the vibration and lateral impacts experienced by the inertial microsystem components during launch.

[0030] The internal cavity of the bottom buffer housing 4 is used to house the electronic system 3 of the inertial microsystem components;

[0031] The top of the bottom buffer housing 4 is a top rubber pad 2.

[0032] The internal electronics of the inertial microsystems are surrounded and protected by a bottom buffer housing 4 and a top rubber pad 2. The top rubber pad 2 is covered by a metal outer shell 1.

[0033] It should be noted that, based on the internal electronic system structure of the inertial microsystem component, the internal cavity of the bottom buffer shell is designed to match the structure, and the overall structure of the bottom buffer shell is designed to fit the metal shell of the microsystem component, thereby achieving the enclosed assembly of the electronic system.

[0034] See Figure 2 The bottom surface of the bottom buffer housing 4 includes a foam metal buffer structure 42 and a rubber vibration damping structure;

[0035] In this embodiment, the heterogeneous integration of the foam metal buffer structure and the rubber vibration damping structure on the bottom surface of the bottom buffer shell adopts a ring structure.

[0036] As a preferred embodiment, the foam metal buffer structure 42 is a frustum structure with a smaller top and a larger bottom, and the outer ring is an annular rubber vibration damping structure 41 that fits the frustum structure.

[0037] Because the foam metal is compressed from top to bottom, its smaller structural size easily triggers the compression process and begins to absorb energy. As the compression progresses, the foam metal structure becomes larger, enhancing its plastic deformation energy absorption. This allows it to match the peak curve of high overload impacts, better achieving high overload buffering. After a high overload impact, the foam metal completes plastic deformation energy absorption. Due to the compression of its axial dimension, its radial dimension increases, thus exerting a squeezing effect on the surrounding annular rubber. Because the foam metal is smaller at the top and larger at the bottom, matching the outer rubber ring with a slope, the squeezing of the rubber by the foam metal causes the rubber to move upward and has a squeezing tendency. Therefore, the internal electronics system of the inertial microsystem component will not experience assembly loosening due to the compression of the foam metal. During the flight phase, after the foam metal is compressed, there is no longer any contact between it and the electronic system of the microsystem component. The rubber structure of the top rubber pad and the bottom buffer shell completely surrounds the electronic parts. Through the viscoelastic properties of the material and the thickness design, good vibration damping is achieved.

[0038] It should be noted that, since the plastic deformation process of the foam metal requires a certain stroke to absorb the high overload impact energy, the bottom thickness of the bottom buffer shell is usually not less than 6mm.

[0039] As a preferred embodiment, the bottom surface of the foam metal buffer structure is fixed to the metal shell of the inertial microsystem component using adhesive 43, which further reduces the risk of displacement collision after the foam metal is compressed.

[0040] It should be noted that by adjusting the mechanical parameters of the rubber material and the foam metal, such as Young's modulus, Poisson's ratio, and yield strength, different requirements for high overload resistance and vibration reduction can be met.

[0041] The above description is only a preferred embodiment of the present invention. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. A heterogeneous integrated structure for high overload resistance of an inertial microsystem component, characterized in that, include: A bottom buffer housing housed within the metal casing of the inertial microsystem component; The sides of the bottom buffer housing are made of rubber; The top of the bottom buffer housing is a top rubber pad; The internal cavity formed by the bottom buffer housing and the top rubber pad is used to house the electronic system of the inertial microsystem components; The bottom surface of the bottom buffer shell includes a foam metal buffer structure and a rubber vibration damping structure; the foam metal buffer structure and the rubber vibration damping structure are heterogeneously integrated by means of the rubber vibration damping structure surrounding and fitting the outer surface of the foam metal buffer structure. The foam metal buffer structure is a frustum structure with a smaller top and a larger bottom. After a high overload impact, the foam metal buffer structure undergoes plastic deformation to absorb energy, its axial dimension is compressed, and its radial dimension increases, thereby exerting a squeezing effect on the surrounding annular rubber. During the flight phase of the carrier, after the foam metal buffer structure is compressed, it no longer has contact with the electronic system of the microsystem component. The rubber structure of the top rubber pad and the bottom buffer shell completely surrounds the electronic system.

2. The heterogeneous integrated structure for high overload resistance of an inertial microsystem component according to claim 1, characterized in that, The bottom thickness of the bottom buffer housing is greater than 6mm.

3. The heterogeneous integrated structure for high overload resistance of an inertial microsystem component according to claim 1, characterized in that, The bottom surface of the foam metal buffer structure is fixed to the metal shell of the inertial microsystem component with an adhesive.

4. The heterogeneous integrated structure for high overload resistance of an inertial microsystem component according to claim 1, characterized in that, Based on the internal electronic system structure of the inertial microsystem component, the internal cavity of the bottom buffer shell is designed to match the structure.

5. The heterogeneous integrated structure for high overload resistance of an inertial microsystem component according to claim 1, characterized in that, Based on the requirements for high overload resistance and vibration reduction of inertial microsystem components, rubber and foam metal with suitable mechanical parameters are selected.

Images