Cooling devices and servers

Abstract

The embodiments of the present application provide a heat dissipation device and a server, and relate to the technical field of heat dissipation devices. The heat dissipation device includes a flow regulating component, and the flow regulating component includes a thermal expansion structure and an regulating structure. The thermal expansion structure is connected to the tube wall of the second refrigerant pipeline, and a accommodating cavity is formed between the thermal expansion structure and the tube wall of the second refrigerant pipeline. The regulating structure includes a fixed part and a movable part, the fixed part is fixedly connected to the tube wall of the second refrigerant pipeline, and the movable part is movably connected to the fixed part. The movable part is used to: cooperate with the shape change of the thermal expansion structure, change the position of the movable part in the second refrigerant pipeline, so as to adjust the flow rate of the refrigerant in the second refrigerant pipeline. In the embodiment of the present application, the flow regulating component can adjust the flow rate of the refrigerant in the second refrigerant pipeline according to the heat dissipated to the outside by the heating element of the server, thereby improving the heat dissipation performance of the heat dissipation device, simplifying the structure of the heat dissipation device, and reducing the cost of the heat dissipation device.

Description

Technical Field

[0001] The present application relates to the technical field of heat dissipation devices, and in particular to a heat dissipation device and a server. Background Art

[0002] The heat dissipation device generally includes a radiator, which can exchange heat with the heat-generating components in the server.

[0003] In the related art, the heat dissipation capacity of the radiator cannot change with the change of the heat dissipated by the heating element, which affects the heat dissipation performance of the heat dissipation device. Summary of the Invention

[0004] The purpose of the present application is to provide a heat dissipation device and a server, so that the heat dissipation capacity of the radiator can change with the change of the heat dissipated by the heating element, thereby improving the heat dissipation performance of the heat dissipation device.

[0005] In order to achieve the above objectives, this application provides the following technical solutions:

[0006] In one aspect, embodiments of the present application provide a heat dissipation device. The heat dissipation device includes a radiator, a first refrigerant pipeline, a second refrigerant pipeline, and a flow control assembly. The radiator has a radiator inlet and a radiator outlet. The first refrigerant pipeline is connected to the radiator inlet, and the second refrigerant pipeline is connected to the radiator outlet. The second refrigerant pipeline has a through hole formed in its wall. The flow control assembly includes a thermal expansion structure and a control structure. The thermal expansion structure is connected to the wall of the second refrigerant pipeline, forming a receiving cavity between the thermal expansion structure and the wall of the second refrigerant pipeline. The thermal expansion structure can expand or contract with changes in the temperature of the refrigerant to change the size of the receiving cavity. The receiving cavity is connected to the second refrigerant pipeline via the through hole. The control structure includes a fixed portion and a movable portion. The fixed portion is fixedly connected to the wall of the second refrigerant pipeline, and the movable portion is movably connected to the fixed portion. The movable portion is movable within the receiving cavity and the second refrigerant pipeline. The movable portion is configured to adjust the flow rate of the refrigerant in the second refrigerant pipeline by changing its position within the second refrigerant pipeline in response to changes in the shape of the thermal expansion structure.

[0007] In an embodiment of the present application, a flow control assembly includes a thermal expansion structure and a control structure. The thermal expansion structure senses changes in the refrigerant temperature within the second refrigerant line and expands or contracts accordingly to adjust the size of the accommodating cavity. The movable portion of the control structure changes shape in accordance with the thermal expansion structure, changing its position within the second refrigerant line. This adjusts the flow rate of the refrigerant within the second refrigerant line, and thus, the heat dissipation capacity of the radiator.

[0008] It can be understood that when the temperature of the refrigerant in the second refrigerant pipeline decreases, the heat dissipated to the outside by the heating element decreases, the accommodating cavity decreases, and the movable part can reduce the flow rate of the refrigerant in the second refrigerant pipeline to reduce the heat dissipation capacity of the radiator, reduce the waste of cold air, and allow more refrigerant to flow into the radiator that exchanges heat with other heating elements; when the temperature of the refrigerant in the second refrigerant pipeline increases, the heat dissipated to the outside by the heating element increases, the accommodating cavity increases, and the movable part can increase the flow rate of the refrigerant in the second refrigerant pipeline to increase the heat dissipation capacity of the radiator and meet the heat dissipation needs of the heating element.

[0009] Specifically, the embodiment of the present application provides a flow control assembly comprising a thermal expansion structure and a control structure, enabling the flow rate of the refrigerant in the second refrigerant pipeline to be dynamically adjusted in accordance with the temperature of the refrigerant in the second refrigerant pipeline. This not only reduces cooling waste, but also enables the heat sink to meet the heat dissipation requirements of different heating elements, thereby improving the heat dissipation performance of the heat sink. Furthermore, the need for electrical devices is eliminated, simplifying the structure of the heat sink and reducing the cost of the detection device.

[0010] In some embodiments, the tube wall of the second refrigerant pipeline includes a first portion of the tube wall, a through hole is provided on the first portion of the tube wall, and a accommodating cavity is formed between the thermal expansion structure and the first portion of the tube wall. The first portion of the tube wall forms a first edge of the through hole, and the fixed portion is connected to the first edge. The movable portion is rotatably connected to the fixed portion, and the movable portion is used to rotate around a first axis, and the extension direction of the first axis intersects with the extension direction of the second refrigerant pipeline. One end of the movable portion away from the fixed portion abuts against the thermal expansion structure. The movable portion is used to: cooperate with the shape change of the thermal expansion structure, change the abutment position of one end of the movable portion away from the fixed portion and the thermal expansion structure, so as to change the position of the movable portion in the second refrigerant pipeline. The first portion of the tube wall is provided to form the first edge of the through hole, the fixed portion is connected to the first edge, and the movable portion is rotatably connected to the fixed portion, so that the movable portion can pass through the through hole and rotate around the first axis, thereby playing a role in regulating the refrigerant flow in the second refrigerant pipeline. In addition, a movable part is provided with a rotatable connection to the fixed part, so that the movable part can rotate in accordance with the shape change of the thermal expansion structure, thereby adjusting the refrigerant flow in the second refrigerant pipeline, that is, the flow of the refrigerant in the second refrigerant pipeline can be dynamically adjusted following the temperature of the refrigerant in the second refrigerant pipeline. The structure is simple, and the cost of the heat dissipation device is reduced on the basis of improving the heat dissipation performance of the heat dissipation device.

[0011] In some embodiments, the movable portion includes a connecting portion, a first extension portion, and a second extension portion. The connecting portion is rotatably connected to the fixed portion, and the connecting portion is configured to rotate about a first axis. The first extension portion is located within the accommodating cavity. One end of the first extension portion is connected to the connecting portion, and the end of the first extension portion distal from the connecting portion can abut against the thermal expansion structure. The second extension portion is located within the second refrigerant pipeline, and one end of the second extension portion is connected to the connecting portion. This arrangement, on the one hand, enables the first extension portion to cooperate with the thermal expansion structure, thereby limiting the position of the second extension portion; on the other hand, enables the thermal expansion structure to exert a force on the first extension portion during contraction, thereby causing the first extension portion to drive the second extension portion to rotate, thereby changing the position of the second extension portion within the second refrigerant pipeline and regulating the refrigerant flow within the second refrigerant pipeline. By configuring the movable portion to include the connecting portion, the first extension portion, and the second extension portion, self-regulation of the refrigerant flow rate as the refrigerant temperature changes can be achieved without the need for a complex mechanical structure, thereby improving the heat dissipation performance of the heat dissipation device and reducing the cost of the heat dissipation device.

[0012] In some embodiments, the end surface of the first extension portion distal to the connection portion is a first curved surface that curves away from the connection portion. This configuration reduces friction between the end surface of the first extension portion distal to the connection portion and the thermal expansion structure, thereby reducing the risk of the first extension portion and the thermal expansion structure becoming stuck, thereby preventing the second extension portion from moving within the second refrigerant pipe, and improving the reliability of the heat dissipation device.

[0013] In some embodiments, a first angle is formed between the first extension and the second extension. The first angle is an acute angle or a right angle, and the orientation of the opening of the first angle is substantially the same as the flow direction of the refrigerant in the second refrigerant line. This configuration allows the refrigerant in the second refrigerant line to exert a flow force on the second extension, causing it to rotate toward the through hole. As a result, when the temperature of the refrigerant rises, the second extension, in conjunction with the deformation of the thermal expansion structure, can be rotated toward the through hole under the action of the flow force, thereby reducing obstruction to the refrigerant, increasing the flow rate of the refrigerant in the second refrigerant line, and improving the heat dissipation capacity of the radiator.

[0014] In some embodiments, the second extension portion is a plate-shaped structure, which can improve the blocking effect of the second extension portion on the refrigerant in the second refrigerant pipeline, thereby improving the flow limiting effect of the second extension portion on the refrigerant in the second refrigerant pipeline.

[0015] In some embodiments, the first extension portion is a plate-shaped structure or a columnar structure. This configuration can improve the flexibility of the heat dissipation device and meet different usage requirements.

[0016] In some embodiments, the first portion of the tube wall includes a limiting portion, which is arranged opposite to the first edge. When the temperature of the refrigerant in the second refrigerant pipeline increases, the accommodating cavity increases, the movable portion rotates in the first direction, the end of the first extension portion away from the connection portion moves in the direction away from the limiting portion, and the end of the second extension portion away from the connection portion moves in the direction close to the limiting portion. When the temperature of the refrigerant in the second refrigerant pipeline decreases, the accommodating cavity decreases, the movable portion rotates in the second direction, the end of the first extension portion away from the connection portion moves in the direction close to the limiting portion, and the end of the second extension portion away from the connection portion moves in the direction away from the limiting portion. The first direction is opposite to the second direction. Such an arrangement enables the movable portion to rotate in the first direction or the second direction, thereby enabling the flow rate of the refrigerant in the second refrigerant pipeline to be automatically adjusted according to the temperature of the refrigerant in the second refrigerant pipeline, without the need for an electrical device, thereby simplifying the structure of the heat dissipation device and reducing the cost of the heat dissipation device.

[0017] In some embodiments, along the extension direction of the second refrigerant pipeline, the maximum distance between the first edge and the limiting portion is a first distance. The first distance is less than the length of the first extension portion. And / or, the first distance is less than the length of the second extension portion. This configuration enables the limiting portion to limit the first extension portion and / or the second extension portion, preventing the first extension portion from entering the second refrigerant pipeline through the through hole and / or the second extension portion from entering the accommodating cavity through the through hole when the movable portion rotates, thereby improving the reliability of the heat dissipation device.

[0018] In some embodiments, the surface of the thermal expansion structure on the side closest to the second refrigerant line is a second curved surface, and the second curved surface is curved in a direction away from the second refrigerant line. The maximum distance between the second curved surface and the first portion of the pipe wall is less than the length of the first extension portion. The surface of the thermal expansion structure on the side closest to the second refrigerant line is set as the second curved surface (that is, the inner surface of the thermal expansion structure is set as the second curved surface), and the second curved surface is curved in a direction away from the second refrigerant line, so that the end of the first extension portion away from the connecting portion can cooperate with the shape change of the thermal expansion structure and slide on the inner surface of the thermal expansion structure, thereby allowing the second extension portion to move within the second refrigerant line to adjust the flow rate of the refrigerant in the second refrigerant line. Furthermore, the maximum distance between the second curved surface and the first portion of the tube wall is set to be smaller than the length of the first extension portion, so that when the thermal expansion structure expands or contracts in response to changes in the refrigerant temperature, the ends of the first extension portion away from the connection portion can abut against the inner surface of the thermal expansion structure. That is, the first extension portion can cooperate with the shape change of the thermal expansion structure to limit the second extension portion and can also drive the second extension portion to rotate, thereby improving the reliability of the flow regulating assembly and thus improving the reliability of the heat dissipation device.

[0019] In some embodiments, the thermal expansion coefficient of at least part of the thermal expansion structure is greater than 1. This configuration allows the size of the accommodating cavity to change with the temperature of the refrigerant in the second refrigerant pipeline, eliminating the need for a complex mechanical structure and reducing the cost of the heat dissipation device.

[0020] In some embodiments, the material of the thermal expansion structure includes aluminum. This configuration can reduce the cost of the heat dissipation device, reduce the weight of the thermal expansion structure, and improve the applicability of the thermal expansion structure.

[0021] In a second aspect, an embodiment of the present application provides a server, which includes a heating element and the above-mentioned heat dissipation device, wherein the heat dissipation device is used to exchange heat with the heating element.

[0022] The server provided in the embodiment of the present application includes the heat dissipation device as described above, and thus has all the beneficial effects described above, which will not be described in detail here. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] To more clearly illustrate the technical solutions of this application, the following briefly introduces the drawings required for use in some embodiments of this application. Obviously, the drawings described below are only drawings of some embodiments of this application, and those skilled in the art can also derive other drawings based on these drawings. Furthermore, the drawings described below are schematic diagrams and are not intended to limit the actual dimensions of the products, actual processes of the methods, actual timing of signals, and the like involved in the embodiments of this application.

[0024] Figure 1A A structural diagram of a server provided in some embodiments of the present application;

[0025] Figure 1B A partial structural diagram of a server according to some embodiments of the present application;

[0026] Figure 1C A partial structural diagram of a server according to some other embodiments of the present application;

[0027] Figure 1D A partial structural diagram of a server according to some other embodiments of the present application;

[0028] Figure 1E A partial structural diagram of a server according to some other embodiments of the present application;

[0029] Figure 2 A partial structural diagram of a server provided in some embodiments of the present application;

[0030] Figure 3A for Figure 2 A partial magnified view of the middle Q region in some embodiments;

[0031] Figure 3B for Figure 2 Partially enlarged views of the middle Q region in other embodiments;

[0032] Figure 4A for Figure 2 Partially enlarged views of the middle Q region in some further embodiments;

[0033] Figure 4B for Figure 2 Partially enlarged views of the middle Q region in some further embodiments. DETAILED DESCRIPTION

[0034] The following will be combined with the accompanying drawings to clearly and completely describe the technical solutions in some embodiments of the present application. Obviously, the embodiments described are only some embodiments of the present application, not all embodiments. Based on the embodiments provided in this application, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of this application.

[0035] Unless the context requires otherwise, throughout the specification and claims, the term "comprise" and its other forms, such as the third person singular form "comprises" and the present participle form "comprising", are to be interpreted as open and inclusive, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific example" or "some examples" are intended to indicate that the specific features, structures, materials or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present application. The schematic representation of the above terms does not necessarily refer to the same embodiment or example. In addition, the specific features, structures, materials or characteristics may be included in any one or more embodiments or examples in any appropriate manner.

[0036] In the following, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of this application, unless otherwise specified, "plurality" means two or more.

[0037] “At least one of A, B and C” has the same meaning as “at least one of A, B or C” and both include the following combinations of A, B and C: A only, B only, C only, the combination of A and B, the combination of A and C, the combination of B and C, and the combination of A, B and C.

[0038] “A and / or B” includes the following three combinations: A only, B only, and a combination of A and B.

[0039] As used herein, "parallel", "perpendicular", and "equal" include the situations described and situations similar to the situations described, and the range of the similar situations is within an acceptable deviation range, wherein the acceptable deviation range is as determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the specific quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, wherein the acceptable deviation range of approximate parallelism can be, for example, a deviation within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, wherein the acceptable deviation range of approximate perpendicularity can also be, for example, a deviation within 5°. "Equal" includes absolute equality and approximate equality, wherein the acceptable deviation range of approximate equality can be, for example, that the difference between the two equals is less than or equal to 5% of either one.

[0040] In some examples, embodiments of the present application provide an electronic device (not shown), which may include a cabinet and a server 200. The server 200 may be disposed within the cabinet. It is understood that the server 200 may be a device having processing, computing, and communication functions, and the cabinet may be used to accommodate the server 200.

[0041] In some examples, there may be multiple servers 200, and multiple servers 200 may be stacked and arranged in the same cabinet. In other examples, there may be multiple cabinets, and multiple servers 200 may be stacked and arranged in different cabinets. It is understood that when there are multiple cabinets, the number of servers 200 arranged in different cabinets may be the same or different. The embodiments of the present application do not further limit electronic equipment and cabinets, and the following example illustrates the server 200.

[0042] Figure 1A A structural diagram of a server provided for some embodiments of the present application. Figure 1B This is a partial structural diagram of the server of some embodiments of the present application.

[0043] In some examples, such as Figure 1A and Figure 1B As shown, the server 200 may include a heating element 210 and a heat dissipation device 100 ( Figure 1A Not shown, see Figure 1B), the heat dissipation device 100 can be used to exchange heat with the heating element 210.

[0044] In some examples, the heating element 210 can be a processor. For example, the heating element 210 can be a central processing unit (full name in English: Central Processing Unit, English abbreviation: CPU), a graphics processing unit (full name in English: Graphics Processing Unit, English abbreviation: GPU), a complex programmable logic device (full name in English: Complex Programmable Logic Device, English abbreviation: CPLD) or a field programmable gate array (full name in English: Field Programmable Gate Array, English abbreviation: PFGA), etc. In other examples, the heating element 210 can also be an electronic component other than a processor, such as a hard disk. The embodiments of the present application do not further limit the type of the heating element 210.

[0045] In some examples, the server 200 may include a heating element 210. In other examples, such as Figure 1A As shown, the server 200 may also include multiple heating elements 210. It is understandable that when the server 200 includes multiple heating elements 210, the types of the multiple heating elements 210 may be the same or different.

[0046] It is understandable that the heating element 210 can emit a large amount of heat when in operation. Therefore, it is necessary to provide a heat dissipation device 100 to exchange heat with the heating element 210 to dissipate heat from the heating element 210, thereby preventing the temperature of the heating element 210 from being too high and ensuring that the temperature of the heating element 210 is within the operating temperature range, thereby improving the operational reliability of the heating element 210.

[0047] In some examples, the server 200 may include a shell that may enclose a receiving space, wherein the plurality of heating elements 210 are disposed in the receiving space, and the portion of the heat dissipation device 100 that exchanges heat with the heating elements 210 is also disposed in the receiving space.

[0048] It can be understood that when the server 200 includes multiple heating elements 210 , the heat dissipation device 100 can exchange heat with the multiple heating elements 210 .

[0049] As the power consumption of high-performance servers 200 continues to increase, the power consumption density of electronic devices is becoming increasingly higher. Traditional high-power air-cooled heat sinks have disadvantages such as high cost and low heat dissipation efficiency. Compared to air-cooled heat sinks, liquid-cooled heat sinks are not only less expensive but also have better heat dissipation efficiency than air-cooled heat sinks. The embodiments of this application use a liquid-cooled heat sink 100 as an example for illustration.

[0050] It is understandable that the liquid cooling heat sink is a heat sink 100 in which a refrigerant can circulate in the heat sink 100, so that the heat sink 100 can dissipate heat from the heating element 210. For example, the refrigerant can be water or Freon.

[0051] Figure 1C This is a partial structural diagram of a server according to some other embodiments of the present application.

[0052] In some examples, such as Figure 1B and Figure 1C As shown, the heat dissipation device 100 may include a radiator 130, a first refrigerant line 110, and a second refrigerant line 120. The radiator 130 may have a radiator inlet 131 and a radiator outlet 132. The first refrigerant line 110 may be in communication with the radiator inlet 131, and the second refrigerant line 120 may be in communication with the radiator outlet 132.

[0053] As can be seen from the above, the heat dissipation device 100 can be used to exchange heat with the heating element 210. For example, the heat sink 130 of the heat dissipation device 100 can be used to exchange heat with the heating element 210. In some examples, the heat sink 130 can be a plate heat sink. In other examples, the heat sink 130 can also be an immersion heat sink.

[0054] In some examples, when the server 200 includes multiple heating elements 210, the number of heat sinks 130 may be the same as the number of heating elements 210, and one heat sink 130 is used to exchange heat with one heating element 210. In other examples, when the server 200 includes multiple heating elements 210, the number of heat sinks 130 may be less than the number of heating elements 210, and one heat sink 130 is used to exchange heat with a portion (one, two, or more) of the multiple heating elements 210.

[0055] In some examples, such as Figure 1B As shown, the heat sink 130 may be in contact with the heating element 210 , so that the heat sink 130 can exchange heat with the heating element 210 .

[0056] In other examples, such as Figure 1C As shown, the server 200 may further include a heat conducting medium 220, which is located between the heating element 210 and the radiator 130 to improve the heat conduction efficiency between the heating element 210 and the radiator 130, that is, the heat exchange efficiency between the radiator 130 and the heating element 210, thereby improving the heat dissipation performance of the heat dissipation device 100. For example, the heat conducting medium 220 may be a thermally conductive adhesive.

[0057] For example, Figure 1B and Figure 1C As shown, the radiator 130 has a radiator inlet 131, and the first refrigerant pipe 110 is connected to the radiator inlet 131, so that the refrigerant in the first refrigerant pipe 110 can flow into the radiator 130 through the radiator inlet 131 along the direction of the first arrow g1. It can be understood that the refrigerant in the radiator 130 can absorb the heat emitted by the heating element 210.

[0058] For example, Figure 1B and Figure 1C As shown, the radiator 130 further has a radiator outlet 132 , and the second refrigerant line 120 is connected to the radiator outlet 132 , so that the refrigerant in the radiator 130 can flow into the second refrigerant line 120 through the radiator outlet 132 along the direction of the second arrow g2 .

[0059] It can be understood that since the refrigerant in the radiator 130 flows into the second refrigerant pipeline 120 after exchanging heat with the heating element 210, the temperature of the refrigerant in the second refrigerant pipeline 120 can be higher than the temperature of the refrigerant in the first refrigerant pipeline 110.

[0060] In some examples, the refrigerant pipelines (including the first refrigerant pipeline 110 and the second refrigerant pipeline 120) can be made of metal or alloy. In other examples, the refrigerant pipelines (including the first refrigerant pipeline 110 and the second refrigerant pipeline 120) can also be made of non-metallic materials, such as PVC (Polyvinyl Chloride) or PE (Polyethylene). It is understood that the materials of the first refrigerant pipeline 110 and the second refrigerant pipeline 120 can be the same or different.

[0061] Figure 1D This is a partial structural diagram of a server according to some other embodiments of the present application.

[0062] In some examples, such as Figure 1D As shown, the heat dissipation device 100 may further include a condenser 170 , which may include a condenser inlet 171 and a condenser outlet 172 . The condenser inlet 171 may communicate with the second refrigerant line 120 , and the condenser outlet 172 may communicate with the first refrigerant line 110 .

[0063] It should be noted that the radiator 130 of the heat dissipation device 100 and a portion of the pipe section connected to the radiator 130 (for example, a portion of the first refrigerant pipe 110 and a portion of the second refrigerant pipe 120) can be located in the accommodation space enclosed in the shell of the server 200. It can be understood that the portion of the heat dissipation device 100 located in the server is included in the server. In other words, the server also includes the radiator and a portion of the pipe section connected to the radiator, so that the radiator 130 can exchange heat with the heating element 210 located in the accommodation space; and the condenser 170 of the heat dissipation device 100 is located outside the accommodation space enclosed by the shell of the server 200. In other words, the server does not include the condenser 170 and the portion of the pipe section outside the condenser 170.

[0064] It is understandable that the condenser 170 can cool the refrigerant. For example, Figure 1D As shown, the condenser outlet 172 is in communication with the first refrigerant pipe 110, so that the refrigerant after the temperature of the condenser 170 is reduced can flow into the first refrigerant pipe 110 through the condenser outlet 172. The first refrigerant pipe 110 is in communication with the radiator inlet 131, so that the refrigerant in the first refrigerant pipe 110 (that is, the refrigerant after the temperature of the condenser 170) can flow into the radiator 130 through the radiator inlet 131 to exchange heat with the heating element 210.

[0065] For example, Figure 1D As shown, the radiator outlet 132 is in communication with the second refrigerant pipe 120, so that the refrigerant heated by heat exchange in the radiator 130 can flow into the second refrigerant pipe 120 through the radiator outlet 132. The second refrigerant pipe 120 is in communication with the condenser inlet 171, so that the refrigerant in the second refrigerant pipe 120 (that is, the refrigerant heated by heat exchange) can flow into the condenser 170 through the condenser inlet 171 and be cooled again by the condenser 170.

[0066] That is, by providing the first refrigerant pipeline 110 and the second refrigerant pipeline 120 , the refrigerant is circulated between the condenser 170 and the radiator 130 , so that the radiator 130 can exchange heat with the heating element 210 .

[0067] In some examples, the first refrigerant pipe 110 can be respectively connected to the radiator inlets 131 of multiple radiators 130, and the second refrigerant pipe 120 can be respectively connected to the radiator outlets 132 of multiple radiators 130, so that multiple different radiators 130 can be connected in parallel, reducing the mutual influence between different radiators 130 and improving the heat dissipation performance of the heat dissipation device 100.

[0068] It is understandable that, taking the heat generating element 210 as an example, the greater the CPU load, the greater the power consumption and the more heat dissipated. Conversely, the smaller the CPU load, the lower the power consumption and the less heat dissipated. The CPU loads of different servers 200 often vary, which means that the heat dissipated by the heat generating elements 210 in different servers 200 often varies.

[0069] When a server 200 includes multiple heating elements 210, since the types of the multiple heating elements 210 can be different (such as CPU and GPU), the loads of different heating elements 210 in a server 200 can be different, that is, the heat dissipated to the outside by different heating elements 210 in a server 200 can be different.

[0070] That is, no matter the multiple different heating elements 210 belong to the same server 200 or belong to different servers 200 , the heat emitted by the different heating elements 210 may be different.

[0071] Figure 1E This is a partial structural diagram of a server according to some other embodiments of the present application.

[0072] For example, Figure 1E As shown, the heating element 210 may include a first heating element 210a and a second heating element 210b. It should be noted that the first heating element 210a and the second heating element 210b may belong to the same server 200 or to two different servers 200. The first heating element 210a and the second heating element 210b are only used to distinguish between the two different heating elements 210 and do not further limit the heating element 210.

[0073] For example, Figure 1E As shown, the heat dissipation device 100 may include a first heat sink 130a and a second heat sink 130b. The first heat sink 130a is used to exchange heat with the first heating element 210a, and the second heat sink 130b is used to exchange heat with the second heating element 210b. It should be noted that the first heat sink 130a and the second heat sink 130b are only used to distinguish the two heat sinks 130 that exchange heat with the first heating element 210a and the second heating element 210b, and do not further define the heat sinks 130.

[0074] For example, Figure 1EAs shown, the first refrigerant line 110 may include a first main line 111 and a first branch line 112, and the radiator inlet 131 is connected to the first main line 111 through the first branch line 112. The second refrigerant line 120 may include a second main line 121 and a second branch line 122, and the radiator outlet 132 is connected to the second main line 121 through the second branch line 122.

[0075] For example, Figure 1E As shown, the radiator inlet 131a of the first radiator 130a and the radiator inlet 131b of the second radiator 130b can be respectively connected to the first main line 111 through different first branch pipes 112; the radiator outlet 132a of the first radiator 130a and the radiator outlet 132b of the second radiator 130b can be respectively connected to the second main line 121 through different second branch pipes 122, so that the first radiator 130a and the second radiator 130b can be connected in parallel, that is, the first radiator 130a and the second radiator 130b can exchange heat with the first heating element 210a and the second heating element 210b respectively.

[0076] It is understandable that the temperature and flow rate of the refrigerant flowing through the first radiator 130a are the same or approximately the same as the temperature and flow rate of the refrigerant flowing through the second radiator 130b, so that the heat dissipation capabilities of the first radiator 130a and the second radiator 130b are the same or approximately the same. However, the heat dissipated by the first heating element 210a and the second heating element 210b is often different. In other words, the first radiator 130a and the second radiator 130b cannot specifically adjust their heat dissipation capabilities based on the heat dissipated by the first heating element 210a and the second heating element 210b, thereby affecting the heat dissipation performance of the heat dissipation device 100.

[0077] In some implementations, such as Figure 1E As shown, the heat dissipation device 100 may include a detection unit 181 , a processing unit 182 , a control unit 183 and a solenoid valve 184 .

[0078] For example, the detection unit 181 can be used to detect the temperature of the heating element 210 (e.g., the first heating element 210a and the second heating element 210b) and convert the temperature into an electrical signal. The processing unit 182 can be electrically connected to the detection unit 181 to receive the electrical signal from the detection unit 181 and issue an execution instruction based on the electrical signal from the detection unit 181. The control unit 183 can be electrically connected to the processing unit 182 to receive the execution instruction from the processing unit 182. The solenoid valve 184 can be electrically connected to the control unit 183, and the control unit 183 can control the flow of the solenoid valve 184 based on the execution instruction.

[0079] For example, Figure 1E As shown, the solenoid valve 184 may include a first solenoid valve 184a and a second solenoid valve 184b. In some examples, the first solenoid valve 184a may be disposed on the first branch pipe 112 connected to the radiator inlet 131a. In other examples, the first solenoid valve 184a may also be disposed on the second branch pipe 122 connected to the radiator outlet 132a. It is understood that the first solenoid valve 184a can respond to execution instructions from the control unit 183 to adjust the flow rate of the refrigerant flowing through the first radiator 130a (e.g., adjust the flow rate of the refrigerant flowing into the first radiator 130a, or adjust the flow rate of the refrigerant flowing out of the first radiator 130a), thereby regulating the heat dissipation capacity of the first radiator 130a.

[0080] Similarly, in some examples, the second solenoid valve 184b can be disposed on the first branch pipe 112 connected to the radiator inlet 131b. In other examples, the second solenoid valve 184b can also be disposed on the second branch pipe 122 connected to the radiator outlet 132b. It will be appreciated that the second solenoid valve 184b can respond to execution instructions from the control unit 183 to adjust the flow rate of the refrigerant flowing through the second radiator 130b (e.g., adjust the flow rate of the refrigerant flowing into the second radiator 130b, or adjust the flow rate of the refrigerant flowing out of the second radiator 130b), thereby regulating the heat dissipation capacity of the second radiator 130b.

[0081] In this way, the flow rate of the refrigerant flowing through the first radiator 130a and the second radiator 130b can be adjusted according to the heat dissipated to the outside by the first heating element 210a and the second heating element 210b, thereby regulating the heat dissipation capacity of the first radiator 130a and the second radiator 130b to meet the heat dissipation requirements of different heating elements 210.

[0082] However, the above implementation method is relatively complicated and requires matching the refrigerant pipelines (including the first refrigerant pipeline 110 and the second refrigerant pipeline 120) with electrical devices (such as the detection unit 181, the processing unit 182, the control unit 183 and the solenoid valve 184, etc.), which increases the cost of the heat dissipation device 100.

[0083] See also Figure 2 , Figure 2 A partial structural diagram of a server provided for some further embodiments of the present application.

[0084] Based on this, embodiments of the present application provide a heat dissipation device 100. Heat dissipation device 100 may include a radiator 130, a first refrigerant line 110, a second refrigerant line 120, and a flow regulating assembly 140. Radiator 130 may have a radiator inlet 131 and a radiator outlet 132. First refrigerant line 110 may be in communication with radiator inlet 131, and second refrigerant line 120 may be in communication with radiator outlet 132.

[0085] It should be noted that the above embodiments of the present application have provided examples for the radiator 130 , the first refrigerant pipeline 110 , and the second refrigerant pipeline 120 , which will not be described in detail here.

[0086] It is understood that the flow regulating assembly 140 can regulate the flow of the refrigerant. Figure 2 As shown, the flow regulating assembly 140 may be disposed on the second refrigerant line 120 .

[0087] As can be seen from the above, the second refrigerant pipeline 120 may include a second main pipeline 121 and a second branch pipeline 122, and the radiator outlet 132 may be connected to the second main pipeline 121 through the second branch pipeline 122. For example, Figure 2 As shown, the flow regulating component 140 can be arranged on the second branch pipe 122, so as to regulate the flow of the refrigerant flowing out of the radiator 130, that is, it can regulate the heat dissipation capacity of the radiator 130 (for example, the first radiator 130a and the second radiator 130b), meet the heat dissipation requirements of different heating elements 210 (for example, the first heating element 210a and the second heating element 210b), and improve the heat dissipation performance of the heat dissipation device 100.

[0088] It is understandable that since the refrigerant in the radiator 130 flows into the second refrigerant pipe 120 after exchanging heat with the heating element 210, when the temperature of the refrigerant in the second refrigerant pipe 120 is low, it can be determined that the heat dissipated by the heating element 210 is relatively low. In this case, the flow rate of the refrigerant flowing through the radiator 130 can be reduced, thereby reducing the heat dissipation capacity of the radiator 130 and reducing the waste of cooling energy, allowing the refrigerant to flow into the radiator 130 that is exchanging heat with other heating elements 210. For example, when the heat dissipated by the first heating element 210a is relatively low, the flow rate of the refrigerant flowing through the first radiator 130a can be reduced, thereby reducing the heat dissipation capacity of the first radiator 130a and allowing more refrigerant to flow into the second radiator 130b, thereby improving the heat dissipation effect of the second radiator 130b on the second heating element 210b.

[0089] On the contrary, when the temperature of the refrigerant in the second refrigerant pipeline 120 is higher, it can be determined that the heating element 210 dissipates more heat to the outside. At this time, the flow rate of the refrigerant flowing through the radiator 130 can be increased to improve the heat dissipation capacity of the radiator 130 to meet the heat dissipation requirements of the heating element 210.

[0090] That is, the amount of heat dissipated by the heating element 210 can be determined based on the temperature of the refrigerant in the second refrigerant pipe 120. Therefore, the flow regulating component 140 is disposed on the second refrigerant pipe 120 so that the flow regulating component 140 can sense the temperature of the refrigerant in the second refrigerant pipe 120 and regulate the flow of the refrigerant flowing through the second refrigerant pipe 120 according to the temperature of the refrigerant in the second refrigerant pipe 120. In other words, the flow of the refrigerant flowing through the radiator 130 is regulated to adjust the heat dissipation capacity of the radiator 130. This not only reduces the waste of cooling energy, but also enables the heat dissipation device 100 to meet the heat dissipation requirements of different heating elements 210, thereby improving the heat dissipation performance of the heat dissipation device 100.

[0091] Figure 3A for Figure 2 A partial magnified view of the middle Q region in some embodiments. Figure 3B for Figure 2 The partial enlarged view of the middle Q region in some other embodiments. Figure 3A and Figure 3B , an example is given of how the flow regulating component 140 senses the temperature of the refrigerant in the second refrigerant pipe 120 and regulates the refrigerant flow in the second refrigerant pipe 120 according to the temperature of the refrigerant in the second refrigerant pipe 120 .

[0092] In some examples, such as Figure 3A and Figure 3B As shown, a through hole P is defined in the wall 123 of the second refrigerant pipe 120. It is understood that the through hole P can penetrate the wall 123 of the second refrigerant pipe 120, and the second refrigerant pipe 120 can communicate with the outside world through the through hole P. In some examples, the through hole P is defined in the wall 123 of the second branch pipe 122.

[0093] For example, the through hole P may be a circular through hole, a square through hole, or a through hole of other irregular shapes. In some examples, there may be multiple through holes P, and the shapes and areas of the multiple through holes P may be the same or different.

[0094] In some examples, such as Figure 3A and Figure 3BAs shown, the tube wall 123 of the second refrigerant pipeline 120 may include a first tube wall portion 1231 , and the through hole P is opened on the first tube wall portion 1231 . It can be understood that the first tube wall portion 1231 is a portion of the tube wall 123 of the second refrigerant pipeline 120 .

[0095] In some examples, such as Figure 3A and Figure 3B As shown, the flow regulating assembly 140 may include a thermal expansion structure 150 and a regulating structure 160 .

[0096] It is understood that the thermal expansion structure 150 can sense changes in the refrigerant temperature within the second refrigerant pipe 120 and deform accordingly. The adjustment structure 160 is used to adjust the flow rate of the refrigerant within the second refrigerant pipe 120 in coordination with the deformation of the thermal expansion structure 150.

[0097] In some examples, such as Figure 3A and Figure 3B As shown, the thermal expansion structure 150 can be connected to the tube wall 123 of the second refrigerant pipe 120, and an accommodating cavity M can be formed between the thermal expansion structure 150 and the tube wall 123 of the second refrigerant pipe 120. The thermal expansion structure 150 can expand or contract as the temperature of the refrigerant changes, thereby changing the size of the accommodating cavity M. The accommodating cavity M is connected to the second refrigerant pipe 120 via a through hole P.

[0098] In some examples, the thermal expansion structure 150 may be connected to the first portion of the tube wall 1231 , such that an accommodation cavity M may be formed between the thermal expansion structure 150 and the first portion of the tube wall 1231 .

[0099] In some examples, the thermal expansion structure 150 can be fixedly connected to the tube wall 123 of the second refrigerant pipe 120. For example, the thermal expansion structure 150 can be made of metal or alloy. When the tube wall 123 of the second refrigerant pipe 120 is made of metal or alloy, the thermal expansion structure 150 can be fixedly connected to the tube wall 123 of the second refrigerant pipe 120 by welding.

[0100] In other examples, the thermal expansion structure 150 can be detachably connected to the tube wall 123 of the second refrigerant pipe 120. For example, the thermal expansion structure 150 can be detachably connected to the tube wall 123 of the second refrigerant pipe 120 using structures such as bolts, buckles, or slide grooves.

[0101] In some examples, the thermal expansion structure 150 may be bent away from the second refrigerant pipe 120 , so that an accommodation cavity M may be formed between the thermal expansion structure 150 and the pipe wall 123 . In some examples, the accommodation cavity M may be hemispherical or hemi-ellipsoidal.

[0102] It is understood that when the temperature rises, the thermal expansion structure 150 can expand, thereby increasing the size of the accommodating chamber M. Conversely, when the temperature drops, the thermal expansion structure 150 can contract, thereby decreasing the size of the accommodating chamber M. In other words, the higher the temperature of the refrigerant in the second refrigerant pipe 120, the larger the accommodating chamber M, and the lower the temperature of the refrigerant in the second refrigerant pipe 120, the smaller the accommodating chamber M.

[0103] It is understood that the thermal expansion structure 150 can expand or contract within a set temperature range. Depending on the material of the thermal expansion structure 150, the set temperature range may vary. When the temperature exceeds the set temperature range, the thermal expansion structure 150 is unlikely to deform even if the temperature changes.

[0104] It is understood that the temperature of the refrigerant in the second refrigerant pipe 120 is within a set temperature range. For example, the temperature range of the refrigerant in the second refrigerant pipe 120 is 30°C to 60°C. The thermal expansion structure 150 can deform in response to temperature changes within the temperature range of 30°C to 60°C.

[0105] For example, Figure 3A and Figure 3B As shown, the thermal expansion structure 150 can close the through hole P and form an accommodating cavity M between the tube wall 123 (such as the first part of the tube wall 1231) in the area around the through hole P, so that the accommodating cavity M can communicate with the second refrigerant pipeline 120 through the through hole P.

[0106] It can be understood that since the thermal expansion structure 150 can close the through hole P, the refrigerant in the second refrigerant pipeline 120 is prevented from leaking through the through hole P, thereby improving the reliability of the heat dissipation device 100.

[0107] In some examples, at least a portion of the thermally expandable structure 150 has a coefficient of thermal expansion greater than 1.

[0108] It can be understood that the thermal expansion coefficient of at least part of the thermal expansion structure 150 is set to be greater than 1, so that at least part of the thermal expansion structure 150 can expand when the temperature of the refrigerant increases and contract when the temperature of the refrigerant decreases, thereby changing the size of the accommodating cavity M.

[0109] That is, the thermal expansion coefficient of at least part of the thermal expansion structure 150 is set to be greater than 1, so that the size of the accommodating cavity M can change with the change of the refrigerant temperature in the second refrigerant pipeline 120, without the need for a complex mechanical structure, thereby reducing the cost of the heat dissipation device 100.

[0110] For example, the thermal expansion coefficient of the thermal expansion structure 150 is different from the thermal expansion coefficient of the tube wall 123. In some examples, the thermal expansion coefficient of the thermal expansion structure 150 can be greater than the thermal expansion coefficient of the tube wall 123.

[0111] In some examples, the material of the thermal expansion structure 150 includes aluminum.

[0112] It is understood that the material of the thermal expansion structure 150 may include aluminum or aluminum alloy. For example, the thermal expansion coefficient of aluminum and aluminum alloy at 20°C is about 23.2×10 -6 / K.

[0113] It can be understood that the material used to set the thermal expansion structure 150 includes aluminum. Since the thermal expansion coefficient of aluminum is greater than 1, the size of the accommodating cavity M can change with the change of the refrigerant temperature in the second refrigerant pipeline 120, and it can also reduce the cost of the thermal expansion structure 150, reduce the weight of the thermal expansion structure 150, and improve the applicability of the thermal expansion structure 150.

[0114] It is understandable that the regulating structure 160 can adjust the flow of the refrigerant in the second refrigerant pipe 120 in accordance with the shape change of the thermal expansion structure 150. Figure 3A and Figure 3B , the adjustment structure 160 is illustrated by way of example.

[0115] In some examples, such as Figure 3A and Figure 3B As shown, the adjustment structure 160 may include a fixed portion 161 and a movable portion 162, the fixed portion 161 is fixedly connected to the tube wall 123 of the second refrigerant pipeline 120, and the movable portion 162 is movably connected to the fixed portion 161, and the movable portion 162 can move within the accommodating cavity M and the second refrigerant pipeline 120.

[0116] For example, since the through hole P is opened on the first portion of the tube wall 1231 , that is, the first portion of the tube wall 1231 can form the edge of the through hole P. In some examples, the fixing portion 161 can be fixedly connected to the edge of the through hole P (that is, the first portion of the tube wall 1231 ).

[0117] In some examples, the fixing portion 161 may be cylindrical or approximately cylindrical. For example, the extending direction of the fixing portion 161 may intersect with the extending direction of the second refrigerant pipe 120 (the second branch pipe 122 ).

[0118] It is understood that the fixing portion 161 is fixedly connected to the tube wall 123, that is, the fixing portion 161 is relatively fixed to the tube wall 123. In some examples, the fixing portion 161 and the tube wall 123 can be relatively fixed by welding, and in other examples, the fixing portion 161 and the tube wall 123 can also be relatively fixed by using a buckle or a sliding groove structure.

[0119] The movable portion 162 is movably connected to the fixed portion 161, that is, the movable portion 162 can move relative to the fixed portion 161. In some examples, the movable portion 162 can rotate relative to the fixed portion 161. In other examples, the movable portion 162 can also slide relative to the fixed portion 161.

[0120] In some examples, the movable portion 162 can pass through the through hole P and be located in the accommodating chamber M and the second refrigerant pipeline 120. In this way, the movable portion 162 is movably connected to the fixed portion 161, so that the movable portion 162 can move in the accommodating chamber M and the second refrigerant pipeline 120.

[0121] In some examples, the movable portion 162 is used to change the position of the movable portion 162 in the second refrigerant pipe 120 in accordance with the shape change of the thermal expansion structure 150 , so as to adjust the flow rate of the refrigerant in the second refrigerant pipe 120 .

[0122] For example, when the temperature of the refrigerant in the second refrigerant pipe 120 increases, the accommodating chamber M can be enlarged. The movable portion 162 is movably connected to the fixed portion 161, so that the movable portion 162 can move away from the second refrigerant pipe 120 under the action of the flow force of the refrigerant in the second refrigerant pipe 120 and in conjunction with the shape change of the thermal expansion structure 150, thereby reducing the flow resistance of the refrigerant in the second refrigerant pipe 120, increasing the flow velocity of the refrigerant in the second refrigerant pipe 120, and thus increasing the flow rate of the refrigerant in the second refrigerant pipe 120.

[0123] For example, when the temperature of the refrigerant in the second refrigerant pipeline 120 decreases, the accommodating chamber M can be reduced. The movable portion 162 is movably connected to the fixed portion 161, so that the movable portion 162 can move toward the second refrigerant pipeline 120 under the action of the deformation force of the thermal expansion structure 150 (the force applied to the movable portion 162 when the thermal expansion structure 150 contracts), thereby increasing the flow resistance of the refrigerant in the second refrigerant pipeline 120, reducing the flow velocity of the refrigerant in the second refrigerant pipeline 120, and thus reducing the flow rate of the refrigerant in the second refrigerant pipeline 120.

[0124] In the embodiment of the present application, a flow regulating assembly 140 is provided, which includes a thermal expansion structure 150 and an adjusting structure 160. The thermal expansion structure 150 can sense changes in the refrigerant temperature within the second refrigerant pipeline 120 and expand or contract accordingly to adjust the size of the accommodating cavity M. The movable portion 162 of the adjusting structure 160 can change its position within the second refrigerant pipeline 120 in response to changes in the shape of the thermal expansion structure 150, thereby adjusting the flow rate of the refrigerant within the second refrigerant pipeline 120, and thus adjusting the heat dissipation capacity of the radiator 130.

[0125] It can be understood that when the temperature of the refrigerant in the second refrigerant pipeline 120 decreases, the heat dissipated to the outside by the heating element 210 decreases, the accommodating cavity M decreases, and the movable part 162 can reduce the flow rate of the refrigerant in the second refrigerant pipeline 120 to reduce the heat dissipation capacity of the radiator 130, reduce the waste of cold air, and allow more refrigerant to flow into the radiator 130 that exchanges heat with other heating elements 210; when the temperature of the refrigerant in the second refrigerant pipeline 120 increases, the heat dissipated to the outside by the heating element 210 increases, the accommodating cavity M increases, and the movable part 162 can increase the flow rate of the refrigerant in the second refrigerant pipeline 120 to increase the heat dissipation capacity of the radiator 130 and meet the heat dissipation requirements of the heating element 210.

[0126] That is, the embodiment of the present application provides a flow regulating assembly 140 including a thermal expansion structure 150 and a regulating structure 160, so that the flow rate of the refrigerant in the second refrigerant pipeline 120 can be dynamically adjusted according to the temperature of the refrigerant in the second refrigerant pipeline 120. This not only reduces the waste of cooling capacity, but also enables the heat sink 100 to meet the heat dissipation requirements of different heating elements 210, thereby improving the heat dissipation performance of the heat sink 100. Furthermore, no electrical device is required, which simplifies the structure of the heat sink 100 and reduces the cost of the heat sink 100.

[0127] In some examples, such as Figure 3A and Figure 3B As shown, the first portion of the tube wall 1231 forms a first edge P1 of the through hole P, and the fixing portion 161 can be connected to the first edge P1.

[0128] In some examples, the fixed portion 161 can be disposed adjacent to the first edge P1, allowing the fixed portion 161 to be connected to the first edge P1. The movable portion 162 is movably connected to the fixed portion 161, allowing the movable portion 162 to pass through the through hole P and move within the accommodating chamber M and the second refrigerant pipe 120. The following examples illustrate the manner in which the movable portion 162 and the fixed portion 161 are movably connected, as well as the cooperative relationship between the movable portion 162 and the thermal expansion structure 150.

[0129] In some examples, such as Figure 3A and Figure 3B As shown, the movable portion 162 is rotatably connected to the fixed portion 161, and the movable portion 162 is used to rotate around the first axis. The extension direction of the first axis (such as Figure 3A and Figure 3B The sixth direction D6 in FIG. 1 is the same as the extending direction of the second refrigerant pipe 120 (as shown in FIG. Figure 3A and Figure 3B One end of the movable portion 162 away from the fixed portion 161 abuts against the thermal expansion structure 150 .

[0130] It can be understood that the first axis is a virtual axis whose extension direction intersects the extension direction of the second refrigerant pipe 120. In some examples, when the second refrigerant pipe 120 has multiple extension directions, the extension direction of the first axis intersects the extension direction of the pipe section of the second refrigerant pipe 120 (e.g., the second branch pipe 122) in which the first through hole P is defined. In some examples, the extension direction of the first axis is perpendicular or approximately perpendicular to the extension direction of the second refrigerant pipe 120.

[0131] It can be understood that the refrigerant in the second refrigerant pipe 120 can flow along the extension direction of the second refrigerant pipe 120. Therefore, the movable portion 162 is configured to rotate around the first axis, and the extension direction of the first axis intersects with the extension direction of the second refrigerant pipe 120, so that the movable portion 162 can rotate around the direction intersecting with the flow direction of the refrigerant, thereby enabling the movable portion 162 to play a role in regulating the refrigerant flow in the second refrigerant pipe 120.

[0132] In some examples, the extension direction of the first axis is the same as or approximately the same as the extension direction of the fixing portion 161. In some examples, the first axis coincides with or approximately coincides with the central axis of the fixing portion 161.

[0133] It can be understood that one end of the movable portion 162 away from the fixed portion 161 abuts against the thermal expansion structure 150, so that the movable portion 162 can cooperate with the shape change of the thermal expansion structure 150, change the position of the movable portion 162 in the second refrigerant pipeline 120, and play a role in regulating the refrigerant flow in the second refrigerant pipeline 120.

[0134] In some examples, such as Figure 3A and Figure 3BAs shown, one end of the movable portion 162, which is away from the fixed portion 161, abuts against the inner surface of the thermal expansion structure 150 (i.e., the surface of the thermal expansion structure 150 on the side closest to the second refrigerant pipe 120). It can be understood that because the movable portion 162 is rotatably connected to the fixed portion 161, the end of the movable portion 162 abutting against the thermal expansion structure 150 can slide on the inner surface of the thermal expansion structure 150, thereby changing the position of the movable portion 162 within the second refrigerant pipe 120.

[0135] In some examples, the movable portion 162 is used to change the contact position between one end of the movable portion 162 away from the fixed portion 161 and the thermal expansion structure 150 in accordance with the shape change of the thermal expansion structure 150 , thereby changing the position of the movable portion 162 in the second refrigerant pipeline 120 .

[0136] For example, when the temperature of the refrigerant in the second refrigerant line 120 remains unchanged (or the temperature change is minimal), the size of the accommodating chamber M remains substantially unchanged, and one end of the movable portion 162, away from the fixed portion 161, abuts against the thermal expansion structure 150, enabling the thermal expansion structure 150 to limit the movable portion 162. In this case, even if the portion of the movable portion 162 located within the second refrigerant line 120 is subject to the flow force of the refrigerant, the limiting action of the thermal expansion structure 150 prevents the movable portion 162 from rotating about the first axis. In other words, when the temperature of the refrigerant in the second refrigerant line 120 remains unchanged (or the temperature change is minimal), the flow rate of the refrigerant in the second refrigerant line 120 remains substantially unchanged.

[0137] For example, when the temperature of the refrigerant in the second refrigerant pipe 120 increases, the accommodating chamber M increases. At this time, the thermal expansion structure 150 cannot limit the movable portion 162, so that the movable portion 162 can rotate around the first axis under the action of the flow force of the refrigerant in the second refrigerant pipe 120.

[0138] It can be understood that when movable portion 162 rotates about the first axis under the influence of the refrigerant flow force, the end of movable portion 162 away from fixed portion 161 can slide along the inner surface of thermal expansion structure 150, away from through-hole P. In other words, the contact position between the end of movable portion 162 away from fixed portion 161 and thermal expansion structure 150 can change. Furthermore, the portion of movable portion 162 located within second refrigerant line 120 can move toward through-hole P, thereby reducing the flow resistance of the refrigerant within second refrigerant line 120, increasing the flow velocity of the refrigerant within second refrigerant line 120, and increasing the refrigerant flow rate within second refrigerant line 120, thereby enhancing the heat dissipation capacity of radiator 130.

[0139] It is understandable that as the movable portion 162 rotates, the thermal expansion structure 150 can again limit the movable portion 162, so that the movable portion 162 can stop rotating. For example, when the temperature of the refrigerant in the second refrigerant pipeline 120 increases, the movable portion 162 can be moved from Figure 3A Position shown in the figure, turn to Figure 3B The location shown in .

[0140] For example, when the temperature of the refrigerant in the second refrigerant pipe 120 decreases, the accommodating chamber M decreases. At this time, the thermal expansion structure 150 applies a force to one end of the movable portion 162, so that the movable portion 162 can rotate around the first axis.

[0141] It can be understood that when movable portion 162 rotates about the first axis under the contraction force of thermal expansion structure 150, the end of movable portion 162 away from fixed portion 161 can slide along the inner surface of thermal expansion structure 150 toward through-hole P. In other words, the contact position between the end of movable portion 162 away from fixed portion 161 and thermal expansion structure 150 can change. Furthermore, the portion of movable portion 162 located within second refrigerant line 120 can move away from through-hole P, thereby increasing the flow resistance of the refrigerant within second refrigerant line 120, reducing the flow velocity of the refrigerant within second refrigerant line 120, and reducing the refrigerant flow rate within second refrigerant line 120, thereby reducing the heat dissipation capacity of radiator 130.

[0142] It is understandable that as the movable portion 162 rotates, the thermal expansion structure 150 can no longer exert a force on the movable portion 162, so that the movable portion 162 can stop rotating. For example, when the temperature of the refrigerant in the second refrigerant pipe 120 decreases, the movable portion 162 can be Figure 3B Position shown in the figure, turn to Figure 3A The location shown in .

[0143] That is, in the embodiment of the present application, the movable portion 162 is arranged to be rotatably connected with the fixed portion 161, so that the movable portion 162 can rotate in conjunction with the shape change of the thermal expansion structure 150, and change the abutment position of one end of the movable portion 162 away from the fixed portion 161 and the thermal expansion structure 150, so as to change the position of the movable portion 162 in the second refrigerant pipeline 120, thereby being able to play a role in regulating the refrigerant flow in the second refrigerant pipeline 120, thereby improving the heat dissipation performance of the heat dissipation device 100.

[0144] It can be understood that the movable part 162 is rotatably connected to the fixed part 161, so that the flow rate of the refrigerant in the second refrigerant pipeline 120 can be dynamically adjusted following the temperature of the refrigerant in the second refrigerant pipeline 120. The structure is simple, and the cost of the heat dissipation device 100 is reduced on the basis of improving the heat dissipation performance of the heat dissipation device 100.

[0145] The embodiment of the present application takes the movable portion 162 and the fixed portion 161 as an example of a rotation connection, and continues to refer to Figure 3A and Figure 3B , the structure of the movable portion 162 is illustrated by way of example.

[0146] like Figure 3A and Figure 3B As shown, in some examples, the movable portion 162 includes a connecting portion 1623, a first extending portion 1621, and a second extending portion 1622. The connecting portion 1623 is rotatably connected to the fixed portion 161, and the connecting portion 1623 is configured to rotate around a first axis.

[0147] In some examples, the connecting portion 1623 may be a hollow cylindrical structure or a substantially cylindrical structure. Figure 3A and Figure 3B As shown, the fixing portion 161 can be located within the connecting portion 1623 , so that the connecting portion 1623 can be rotatably connected to the fixing portion 161 , and the connecting portion 1623 can rotate around the first axis.

[0148] In other examples, a sliding groove may be provided on the fixing portion 161 , and the connecting portion 1623 is embedded in the sliding groove, so that the connecting portion 1623 can be rotatably connected to the fixing portion 161 and can rotate around the first axis.

[0149] In some examples, such as Figure 3A and Figure 3B As shown, the first extension portion 1621 is located in the accommodating chamber 24. One end of the first extension portion 1621 is connected to the connecting portion 1623, and the end of the first extension portion 1621 away from the connecting portion 1623 can abut against the thermal expansion structure 150. The second extension portion 1622 is located in the second refrigerant pipeline 120, and one end of the second extension portion 1622 is connected to the connecting portion 1623.

[0150] It can be understood that one end of the first extension portion 1621 is connected to the connecting portion 1623, and one end of the second extension portion 1622 is also connected to the connecting portion 1623, so that the connecting portion 1623 can drive the first extension portion 1621 and the second extension portion 1622 to rotate around the first axis, and enable the first extension portion 1621 and the second extension portion 1622 to be relatively fixed.

[0151] It can be understood that the second extension portion 1622 is located in the second refrigerant pipeline 120 , so adjusting the position of the second extension portion 1622 can adjust the refrigerant flow in the second refrigerant pipeline 120 .

[0152] In some examples, the second extension portion 1622 may be a plate-shaped structure to enhance the flow-limiting effect of the second extension portion 1622 on the refrigerant in the second refrigerant line 120 .

[0153] In some examples, the first extension portion 1621 may be a plate-like structure or a columnar structure to meet different usage requirements and improve the applicability of the heat dissipation device 100 .

[0154] It can be understood that the first extension portion 1621 can cooperate with the shape change of the thermal expansion structure 150 to limit the second extension portion 1622 and also drive the second extension portion 1622 to rotate.

[0155] In some examples, such as Figure 3A and Figure 3B As shown, the first portion of the tube wall 1231 includes a limiting portion 1232 , and the limiting portion 1232 is arranged opposite to the first edge P1 .

[0156] It can be understood that the through hole P has a second edge disposed opposite to the first edge P1 , and the thermal expansion structure 150 is spaced apart from the second edge to form a limiting portion 1232 .

[0157] For example, when the temperature of the refrigerant in the second refrigerant pipeline 120 does not change (or the temperature change is small), the size of the accommodating chamber M remains basically unchanged, and the end of the first extension portion 1621 away from the connecting portion 1623 abuts against the thermal expansion structure 150, so that the thermal expansion structure 150 can limit the first extension portion 1621, that is, the thermal expansion structure 150 can limit the second limiting portion 1622.

[0158] At this time, even if the second extension portion 1622 is subjected to the flow force of the refrigerant, it cannot rotate around the first axis due to the limiting effect of the thermal expansion structure 150, that is, the position of the second extension portion 1622 in the second refrigerant pipeline 120 cannot be changed, so that the flow rate of the refrigerant in the second refrigerant pipeline 120 remains basically unchanged.

[0159] For example, when the temperature of the refrigerant in the second refrigerant pipe 120 increases, the accommodating chamber M increases, as shown in FIG. Figure 3BAs shown, the movable portion 162 rotates along the first direction D1, the end of the first extending portion 1621 away from the connecting portion 1623 moves away from the limiting portion 1232, and the end of the second extending portion 1622 away from the connecting portion 1623 moves toward the limiting portion 1232.

[0160] Understandably, when the accommodating cavity M increases in size, the thermal expansion structure 150 no longer limits the first extension portion 1621, allowing the movable portion 162 to rotate in the first direction D1 about the first axis under the influence of the refrigerant flow force within the second refrigerant pipeline 120. Specifically, the end of the first extension portion 1621 away from the connection portion 1623 can slide along the inner surface of the thermal expansion structure 150, away from the limit portion 1232; while the end of the second extension portion 1622 away from the connection portion 1623 can move toward the limit portion 1232. This reduces the flow resistance of the refrigerant within the second refrigerant pipeline 120, increases the refrigerant flow rate within the second refrigerant pipeline 120, and thereby enhances the heat dissipation capacity of the radiator 130.

[0161] It can be understood that as the movable portion 162 rotates, the thermal expansion structure 150 can again limit the first extension portion 1621, so that the first extension portion 1621 can limit the second extension portion 1622, that is, the movable portion 162 can stop rotating.

[0162] For example, when the temperature of the refrigerant in the second refrigerant pipeline 120 decreases, the accommodating chamber M decreases, the movable portion 162 rotates in the second direction D2, the end of the first extension portion 1621 away from the connecting portion 1623 moves toward the direction close to the limiting portion 1232, and the end of the second extension portion 1622 away from the connecting portion 1623 moves toward the direction away from the limiting portion 1232. The first direction D1 is opposite to the second direction D2.

[0163] For example, when the accommodating cavity M is reduced in size, the thermal expansion structure 150 applies a force to one end of the first extension portion 1621, causing the first extension portion 1621 to drive the second extension portion 1622 to rotate in the second direction D2. The end of the first extension portion 1621 away from the connection portion 1623 can slide along the inner surface of the thermal expansion structure 150 toward the stop portion 1232, thereby driving the end of the second extension portion 1622 away from the connection portion 1623 to move away from the stop portion 1232, thereby increasing the flow resistance of the refrigerant in the second refrigerant pipeline 120 and reducing the refrigerant flow rate in the second refrigerant pipeline 120. It can be understood that as the movable portion 162 rotates, the thermal expansion structure 150 can no longer apply the force to the movable portion 162, causing the movable portion 162 to stop rotating.

[0164] That is, in the embodiment of the present application, the first extension portion 1621 is arranged to be located in the accommodating cavity M, and the end of the first extension portion 1621 away from the connecting portion 1623 abuts against the thermal expansion structure 150, and the second extension portion 1622 is located in the second refrigerant pipeline 120. On the one hand, the first extension portion 1621 can cooperate with the thermal expansion structure 150, thereby limiting the second extension portion 1622; on the other hand, when the thermal expansion structure 150 contracts, it can apply a force to the first extension portion 1621, so that the first extension portion 1621 can drive the second extension portion 1622 to rotate, thereby changing the position of the second extension portion 1622 in the second refrigerant pipeline 120, so as to regulate the refrigerant flow in the second refrigerant pipeline 120.

[0165] It can be understood that the movable part 162 is provided to include a connecting part 1623, a first extension part 1621 and a second extension part 1622, so that the movable part 162 can cooperate with the thermal expansion structure 150 to adjust the refrigerant flow in the second refrigerant pipeline 120. Without a complex mechanical structure, the refrigerant flow can be self-adjusted as the refrigerant temperature changes. On the basis of improving the heat dissipation performance of the heat dissipation device 100, the cost of the heat dissipation device 100 is reduced.

[0166] That is, the movable part 162 is set to rotate along the first direction D1 or the second direction D2, which can automatically adjust the flow rate of the refrigerant in the second refrigerant pipeline 120 according to the temperature of the refrigerant in the second refrigerant pipeline 120. There is no need to set up an electrical device, which simplifies the structure of the heat dissipation device 100 and reduces the cost of the heat dissipation device 100.

[0167] In some examples, the stopper 1232 can function as a stopper. In some examples, along the extension direction of the second refrigerant pipe 120, the maximum distance between the first edge P1 and the stopper 1232 is a first distance. The first distance is less than the length of the first extension portion 1621; and / or the first distance is less than the length of the second extension portion 1622.

[0168] It can be understood that the first distance is the maximum distance between the first edge P1 and the edge of the limiting portion 1232 on the side closest to the first edge P1. The first distance is set to be smaller than the length of the first extension portion 1621, and / or the first distance is set to be smaller than the length of the second extension portion 1622, so that the limiting portion 1232 can limit the first extension portion 1621 and / or the second extension portion 1622, thereby preventing the first extension portion 1621 from entering the second refrigerant pipeline 120 through the through hole P and / or the second extension portion 1622 from entering the accommodating chamber M through the through hole P when the movable portion 162 rotates, thereby improving the reliability of the heat dissipation device 100.

[0169] In some examples, when the temperature of the refrigerant in the second refrigerant line 120 increases, the second extension portion 1622 can rotate to a position closing the through hole P.

[0170] In some examples, an end surface of the first extension portion 1621 on a side away from the connection portion 1623 is a first curved surface, and the first curved surface is bent in a direction away from the connection portion 1623 .

[0171] It can be understood that setting the end surface of the first extension portion 1621 away from the connecting portion 1623 to be a first curved surface, and the first curved surface bending in the direction away from the connecting portion 1623 can reduce the friction between the end surface of the first extension portion 1621 away from the connecting portion 1623 and the thermal expansion structure 150, reduce the risk of the first extension portion 1621 and the thermal expansion structure 150 being stuck, and causing the second extension portion 1622 to be unable to move in the second refrigerant pipeline 120, thereby improving the reliability of the heat dissipation device 100.

[0172] In some examples, such as Figure 3A and Figure 3B As shown, a first angle α is formed between the first extension portion 1621 and the second extension portion 1622 . The first angle α is an acute angle, and the direction of the opening of the first angle α is substantially the same as the flow direction of the refrigerant in the second refrigerant pipeline 120 .

[0173] It can be understood that an acute angle and an obtuse angle may be formed between the first extension portion 1621 and the second extension portion 1622 , and the first included angle α is the acute angle formed between the first extension portion 1621 and the second extension portion 1622 .

[0174] In other examples, the first angle α may also be a right angle (not shown), and the direction of the opening of the first angle α is substantially the same as the flow direction of the refrigerant in the second refrigerant pipe 120 .

[0175] It can be understood that a right angle or an obtuse angle may be formed between the first extension portion 1621 and the second extension portion 1622 , and the first included angle α is a right angle formed between the first extension portion 1621 and the second extension portion 1622 .

[0176] In some examples, such as Figure 3A As shown, the refrigerant in the second refrigerant pipe 120 flows in the direction of the third arrow g3, and the direction of the opening at the first angle α can be the same as the direction of the third arrow g3. Since the movable part 162 is rotatably connected to the fixed part 161, the direction of the opening at the first angle α can change with the rotation of the movable part 162. In this way, Figure 3B As shown, the direction of the opening at the first angle α may deviate from the direction of the third arrow g3 . That is, the direction of the opening at the first angle α may be substantially the same as the flow direction of the refrigerant in the second refrigerant pipe 120 .

[0177] It can be understood that the orientation of the opening at the first angle α is substantially aligned with the flow direction of the refrigerant in the second refrigerant pipe 120, so that the refrigerant in the second refrigerant pipe 120 can exert a flow force on the second extension portion 1622 to rotate toward the through hole P. In this way, when the temperature of the refrigerant rises, coupled with the deformation of the thermal expansion structure 150, the second extension portion 1622 can rotate toward the through hole P under the action of the flow force, thereby reducing the flow resistance of the refrigerant in the second refrigerant pipe 120, increasing the flow rate of the refrigerant in the second refrigerant pipe 120, and improving the heat dissipation capacity of the radiator 130.

[0178] In some examples, the surface of the thermal expansion structure 150 near the second refrigerant pipe 120 is a second curved surface that curves away from the second refrigerant pipe 120. The maximum distance between the second curved surface and the first portion of the pipe wall 1231 is less than the length of the first extension portion 1621.

[0179] It can be understood that the surface of the thermal expansion structure 150 on the side closest to the second refrigerant pipe 120 is a second curved surface, that is, the inner surface of the thermal expansion structure 150 is a second curved surface. It can be understood that the second curved surface bends away from the second refrigerant pipe 120. In this way, when the temperature of the refrigerant in the second refrigerant pipe 120 increases and the accommodating cavity M increases, the maximum distance between the second curved surface and the first portion of the pipe wall 1231 can increase, thereby allowing the movable portion 162 to rotate in the first direction D1 under the action of the flow force of the refrigerant in the second refrigerant pipe 120. Conversely, when the temperature of the refrigerant in the second refrigerant pipe 120 decreases and the accommodating cavity M decreases, the maximum distance between the second curved surface and the first portion of the pipe wall 1231 can decrease, allowing the thermal expansion structure 150 to exert a force on the first extension portion 1621, thereby allowing the movable portion 162 to rotate in the second direction D2.

[0180] Through the above arrangement, the end of the first extension portion 1621 away from the connecting portion 1623 can cooperate with the shape change of the thermal expansion structure 150 and slide on the inner surface of the thermal expansion structure 150, so that the second extension portion 1622 can move in the second refrigerant pipeline 120 to adjust the flow rate of the refrigerant in the second refrigerant pipeline 120.

[0181] It is understood that the maximum distance between the second curved surface and the first portion of the tube wall 1231 can change as the thermal expansion structure 150 expands or contracts. The maximum distance between the second curved surface and the first portion of the tube wall 1231 is less than the length of the first extension 1621. In other words, regardless of whether the thermal expansion structure 150 expands or contracts, the maximum distance between the second curved surface and the first portion of the tube wall 1231 is less than the length of the first extension 1621.

[0182] In this way, when the thermal expansion structure 150 expands or contracts with changes in the refrigerant temperature, the end of the first extension portion 1621 away from the connection portion 1623 can abut against the inner surface of the thermal expansion structure 150. That is, the first extension portion 1621 can cooperate with the shape change of the thermal expansion structure 150 to limit the second extension portion 1622 and also drive the second extension portion 1622 to rotate, thereby improving the reliability of the flow regulating assembly 140 and thus improving the reliability of the heat dissipation device 100.

[0183] Figure 4A for Figure 2 Partially enlarged views of the middle Q region in some further embodiments. Figure 4B for Figure 2 Partially enlarged views of the middle Q region in some further embodiments.

[0184] As can be seen from the above, in some examples, the movable portion 162 can be rotatably connected to the fixed portion 161, so that the movable portion 162 can move in the accommodating chamber M and the second refrigerant pipeline 120, thereby regulating the refrigerant flow in the second refrigerant pipeline 120. In other examples, the movable portion 162 can also be slidably connected to the fixed portion 161. Figure 4A and Figure 4B , an example is given of a manner in which the movable portion 162 and the fixed portion 161 are slidably connected to adjust the flow rate of the refrigerant in the second refrigerant pipeline 120 .

[0185] For example, the movable portion 162 can be slidably connected to the fixed portion 161 through structures such as guide rails or sliding grooves.

[0186] For example, when the temperature of the refrigerant in the second refrigerant line 120 remains unchanged (or the temperature change is minimal), the size of the accommodating chamber M remains substantially unchanged, and one end of the movable portion 162, away from the fixed portion 161, abuts against the thermal expansion structure 150, allowing the thermal expansion structure 150 to limit the movable portion 162. In this case, even if the portion of the movable portion 162 located in the second refrigerant line 120 is affected by the flow force of the refrigerant, the thermal expansion structure 150 prevents the movable portion 162 from sliding away from the second refrigerant line 120. In other words, when the temperature of the refrigerant in the second refrigerant line 120 remains unchanged (or the temperature change is minimal), the flow rate of the refrigerant in the second refrigerant line 120 remains substantially unchanged.

[0187] For example, when the temperature of the refrigerant in the second refrigerant pipe 120 increases, the accommodating chamber M increases. At this time, the thermal expansion structure 150 cannot limit the movable portion 162, so that the movable portion 162 can slide in a direction away from the second refrigerant pipe 120 under the action of the flow force of the refrigerant in the second refrigerant pipe 120 (such as Figure 4A and Figure 4B As shown in the third direction D3, the position of the movable portion 162 in the second refrigerant pipe 120 is changed, so that the flow resistance of the refrigerant in the second refrigerant pipe 120 can be reduced, the flow rate of the refrigerant in the second refrigerant pipe 120 is increased, and the heat dissipation capacity of the radiator 130 is increased.

[0188] It can be understood that as the movable portion 162 slides, the thermal expansion structure 150 can again limit the movable portion 162, so that the movable portion 162 can stop sliding. For example, when the temperature of the refrigerant in the second refrigerant pipe 120 increases, the movable portion 162 can Figure 4A Slide to the position shown in Figure 4B The location shown in .

[0189] For example, when the temperature of the refrigerant in the second refrigerant pipe 120 decreases, the accommodating chamber M decreases. At this time, the thermal expansion structure 150 applies a force to one end of the movable portion 162, so that the movable portion 162 can slide in a direction close to the second refrigerant pipe 120 (such as Figure 4A and Figure 4B The fourth direction D4 is shown in FIG, so that the flow resistance of the refrigerant in the second refrigerant pipeline 120 can be increased, and the flow rate of the refrigerant in the second refrigerant pipeline 120 is reduced.

[0190] It is understandable that as the movable portion 162 slides, the thermal expansion structure 150 can no longer exert a force on the movable portion 162, so that the movable portion 162 can stop sliding. For example, when the temperature of the refrigerant in the second refrigerant pipe 120 decreases, the movable portion 162 can be moved from Figure 4B Slide to the position shown in Figure 4A The location shown in .

[0191] The movable part 162 is provided with a sliding connection with the fixed part 161 to realize the adjustment of the flow rate of the refrigerant in the second refrigerant pipeline 120, so that the flow rate of the refrigerant in the second refrigerant pipeline 120 can be dynamically adjusted according to the temperature of the refrigerant in the second refrigerant pipeline 120. There is no need to set up an electrical device, which simplifies the structure of the heat dissipation device 100 and reduces the cost of the heat dissipation device 100.

[0192] In summary, the embodiment of the present application provides a flow regulating assembly 140 including a thermal expansion structure 150 and an adjusting structure 160. The thermal expansion structure 150 can sense changes in the refrigerant temperature within the second refrigerant pipeline 120 and expand or contract accordingly to adjust the size of the accommodating cavity M. The movable portion 162 of the adjusting structure 160 can coordinate with the shape changes of the thermal expansion structure 150 to move within the accommodating cavity M and the second refrigerant pipeline 120, thereby changing the position of the movable portion 162 within the second refrigerant pipeline 120, thereby adjusting the flow rate of the refrigerant in the second refrigerant pipeline 120, and thus adjusting the heat dissipation capacity of the radiator 130.

[0193] That is, the embodiment of the present application provides a flow regulating assembly 140 including a thermal expansion structure 150 and a regulating structure 160, so that the flow rate of the refrigerant in the second refrigerant pipeline 120 can be dynamically adjusted according to the temperature of the refrigerant in the second refrigerant pipeline 120. This not only reduces the waste of cooling capacity, but also enables the heat sink 100 to meet the heat dissipation requirements of different heating elements 210, thereby improving the heat dissipation performance of the heat sink 100. Furthermore, no electrical device is required, which simplifies the structure of the heat sink 100 and reduces the cost of the heat sink 100.

[0194] The above description is merely a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions that a person skilled in the art can conceive within the technical scope disclosed in this application should be included within the scope of protection of the present application. Therefore, the scope of protection of the present application should be based on the scope of protection of the claims.

Claims

1. A heat dissipation device, characterized in that: include: a radiator having a radiator inlet and a radiator outlet; a first refrigerant pipeline and a second refrigerant pipeline, wherein the first refrigerant pipeline is connected to the radiator inlet, and the second refrigerant pipeline is connected to the radiator outlet; a through hole is opened on the wall of the second refrigerant pipeline; and A flow regulating assembly, including a thermal expansion structure and a regulating structure; The thermal expansion structure is connected to the wall of the second refrigerant pipeline, and a receiving cavity is formed between the thermal expansion structure and the wall of the second refrigerant pipeline. The thermal expansion structure can expand or contract as the temperature of the refrigerant changes to change the size of the receiving cavity. The receiving cavity is connected to the second refrigerant pipeline through the through hole. The adjustment structure includes a fixed portion and a movable portion, wherein the fixed portion is fixedly connected to the wall of the second refrigerant pipeline, and the movable portion is movably connected to the fixed portion, and the movable portion can move within the accommodating cavity and the second refrigerant pipeline; The movable portion is used to change the position of the movable portion in the second refrigerant pipeline in accordance with the shape change of the thermal expansion structure, so as to adjust the flow rate of the refrigerant in the second refrigerant pipeline; The tube wall of the second refrigerant pipeline includes a first portion of the tube wall, the through hole is opened in the first portion of the tube wall, and the accommodating cavity is formed between the thermal expansion structure and the first portion of the tube wall; the first portion of the tube wall forms a first edge of the through hole, and the fixing portion is connected to the first edge; The activities include: a connecting portion rotatably connected to the fixing portion, the connecting portion being configured to rotate about a first axis, wherein an extension direction of the first axis intersects an extension direction of the second refrigerant pipeline; A first extension portion is located in the accommodating cavity; one end of the first extension portion is connected to the connecting portion, and an end of the first extension portion away from the connecting portion can abut against the thermal expansion structure; and The second extension portion is located in the second refrigerant pipeline, and one end of the second extension portion is connected to the connecting portion.

2. The heat dissipation device according to claim 1, characterized in that: An end surface of the first extension portion on a side away from the connecting portion is a first curved surface, and the first curved surface is bent in a direction away from the connecting portion.

3. The heat dissipation device according to claim 1 or 2, characterized in that: A first angle is formed between the first extension portion and the second extension portion. The first angle is an acute angle or a right angle, and the direction of the opening of the first angle is substantially the same as the flow direction of the refrigerant in the second refrigerant pipeline.

4. The heat dissipation device according to claim 3, characterized in that: The first portion of the tube wall includes a limiting portion, which is arranged opposite to the first edge; when the temperature of the refrigerant in the second refrigerant pipeline increases, the accommodating cavity increases, the movable portion rotates in the first direction, the end of the first extension portion away from the connecting portion moves in a direction away from the limiting portion, and the end of the second extension portion away from the connecting portion moves in a direction closer to the limiting portion; When the temperature of the refrigerant in the second refrigerant pipeline decreases, the accommodating cavity decreases, the movable portion rotates in the second direction, the end of the first extending portion away from the connecting portion moves toward the limiting portion, and the end of the second extending portion away from the connecting portion moves away from the limiting portion. The first direction is opposite to the second direction.

5. The heat dissipation device according to claim 4, characterized in that: Along the extension direction of the second refrigerant pipeline, the maximum distance between the first edge and the limiting portion is a first distance; the first distance is smaller than the length of the first extension portion; and / or the first distance is smaller than the length of the second extension portion.

6. The heat dissipation device according to claim 1, characterized in that: The surface of the thermal expansion structure close to the second refrigerant pipeline is a second curved surface, and the second curved surface bends in a direction away from the second refrigerant pipeline; the maximum distance between the second curved surface and the first part of the tube wall is less than the length of the first extension portion.

7. The heat dissipation device according to claim 1, wherein: The coefficient of thermal expansion of at least a portion of the thermal expansion structure is greater than 1.

8. A server, characterized in that: include: Heating element; The heat dissipation device according to any one of claims 1 to 7, wherein the radiator is used to exchange heat with the heating element.

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