Method for manufacturing high central brightness light source

Abstract

The present invention relates to the field of light source technology and discloses a method for manufacturing a high central brightness light source, comprising the following manufacturing steps: 1) an inner area and an outer area are provided on a substrate, an isolation area is provided between the outer area and the inner area, and the width of the isolation area is greater than 0.7 mm; 2) a plurality of inner light-emitting chips are solid-crystaled on the inner area, with an inner gap between adjacent inner light-emitting chips; a plurality of outer light-emitting chips are solid-crystaled on the outer area, with an outer gap between adjacent outer light-emitting chips, and the outer gap is greater than the inner gap; 3) a dam is provided on the periphery of the light-emitting area; 4) fluorescent glue is filled in the enclosed area, and the fluorescent glue covers the light-emitting area; by solid-crystaling a plurality of inner light-emitting chips in the inner area and a plurality of outer light-emitting chips in the outer light-emitting area, and at the same time, the gap between adjacent light-emitting chips in the inner area is smaller than the gap between adjacent light-emitting chips in the outer area, so that the light source manufactured in this way has the advantages of strong central illumination and strong central light.

Description

Technical Field

[0001] The present invention relates to the technical field of light sources, and in particular to a method for manufacturing a light source with high central brightness. Background Art

[0002] The light source is a light-emitting element in various lamps. It includes a substrate and a light-emitting chip arranged on the substrate. The light-emitting chip is electrically connected to the substrate. Fluorescent glue is then applied on the substrate. The fluorescent glue wraps multiple light-emitting chips inside, and the light emitted by the light-emitting chip is transmitted through the fluorescent glue.

[0003] A dam is protruding on the substrate, which surrounds the substrate to form a light-emitting area. A light-emitting chip is set at the bottom of the light-emitting area, and fluorescent glue is applied in the light-emitting area. The light emitted by the light-emitting chip will be transmitted through the fluorescent glue.

[0004] In the prior art, multiple light-emitting chips are evenly arranged on the light-emitting area. During the light-emitting process of the multiple light-emitting chips, the central illumination and central light intensity of the light source are low, resulting in low central brightness of the entire light source. Summary of the Invention

[0005] The present invention provides a method for manufacturing a light source with high central brightness, aiming to solve the problem of low central brightness of the light source in the prior art.

[0006] The present invention is achieved by a method for manufacturing a high central brightness light source, comprising the following manufacturing steps:

[0007] 1) Providing a substrate having a light-emitting area thereon, the light-emitting area comprising an inner area and an outer area surrounding the inner area, the inner area being located in the middle of the light-emitting area, an annular isolation area being disposed between the outer area and the inner area, the isolation area being arranged around the outer periphery of the inner area, and the width of the isolation area being greater than 0.7 mm;

[0008] 2) bonding a plurality of inner light-emitting chips on the inner region, with inner spacing between adjacent inner light-emitting chips along the radial direction of the inner region; bonding a plurality of outer light-emitting chips on the outer region, with outer spacing between adjacent outer light-emitting chips along the radial direction of the outer region, wherein the outer spacing is larger than the inner spacing;

[0009] 3) a dam is provided on the periphery of the light-emitting area, the dam surrounds the periphery of the light-emitting area, the dam surrounds and encloses to form an enclosed area, and the light-emitting area is located inside the enclosed area;

[0010] 4) Filling the enclosed area with fluorescent glue, which covers the light-emitting area and the inner light-emitting chip and the outer light-emitting chip.

[0011] Furthermore, the center position of the inner region coincides with the center position of the light-emitting region, and in the manufacturing step 2), the inner light-emitting chip is arranged at the center position of the inner region.

[0012] Furthermore, in the manufacturing step 2), the plurality of inner light-emitting chips are arranged in a circular shape to form an inner light-emitting ring, and the inner light-emitting ring surrounds the outer periphery of the center position of the inner area; in the inner light-emitting ring, there is an inner light-emitting gap between adjacent inner light-emitting chips.

[0013] Furthermore, in the manufacturing step 2), the plurality of inner light-emitting chips form a plurality of inner light-emitting rings, and the plurality of inner light-emitting rings are nested and arranged in sequence.

[0014] Furthermore, along the radial direction from the inside to the outside of the inner area, the inner luminous interval of the inner luminous ring gradually increases.

[0015] Furthermore, in the manufacturing step 2), the plurality of outer light-emitting chips are arranged in a circular shape to form an outer light-emitting ring, and the outer light-emitting ring is arranged in a circular direction along the outer area; in the outer light-emitting ring, there is an outer light-emitting gap between adjacent outer light-emitting chips.

[0016] Furthermore, in the manufacturing step 2), the plurality of outer light-emitting chips form a plurality of outer light-emitting rings, and the plurality of outer light-emitting rings are nested and arranged in sequence.

[0017] Furthermore, along the radial direction from the inside to the outside of the outer area, the outer light-emitting interval of the outer light-emitting ring gradually decreases, and the outer light-emitting interval is larger than the inner light-emitting interval.

[0018] Furthermore, in the manufacturing step 4), before the fluorescent glue is arranged in the light-emitting area, a light-isolating layer is protruded from the bottom of the isolation area to block light transmission therethrough, the light-isolating layer having an upper end surface arranged away from the substrate, and the upper end surface of the light-isolating layer is respectively higher than the inner light-emitting chip and the outer light-emitting chip;

[0019] The upper end surface of the light-isolating layer is recessed downward to form a plurality of adjacent recessed annular grooves, the recessed annular grooves being arranged around the isolation area, and the bottoms of the recessed annular grooves being higher than the inner light-emitting chip and the outer light-emitting chip respectively;

[0020] Arranging a light-transmitting layer on the light-isolating layer, wherein the bottom of the light-transmitting layer is embedded in a plurality of concave annular grooves of the light-isolating layer, and the top of the light-transmitting layer extends upward;

[0021] After the light-isolating layer and the light-transmitting layer are arranged, fluorescent glue is applied in the light-emitting area. The fluorescent glue clamps the light-isolating layer and the light-transmitting layer, and the top of the light-transmitting layer is higher than the fluorescent glue arrangement.

[0022] Furthermore, the light transmittance of the light-transmitting layer is lower than the light transmittance of the fluorescent glue, and the light transmittance of the light-transmitting layer gradually increases from both sides of the light-transmitting layer to the middle of the light-transmitting layer;

[0023] The fluorescent glue includes an inner glue covering the inner area and an outer glue covering the outer area. A granular inner diffusion layer is coated between the outer periphery of the inner glue and the inner side of the light-transmitting layer. A granular outer diffusion layer is coated between the inner periphery of the outer glue and the outer side of the light-transmitting layer.

[0024] Compared with the prior art, the manufacturing method of the high central brightness light source provided by the present invention, when faced with the need to use a high central brightness light source, is achieved by solidifying multiple inner light-emitting chips in the inner area and multiple outer light-emitting chips in the outer light-emitting area, and at the same time, the interval between adjacent light-emitting chips in the inner area is smaller than the interval between adjacent light-emitting chips in the outer area, so that the light source manufactured in this way has the advantages of strong central illumination and strong central light. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 1 is a schematic top view of a high central brightness light source provided by the present invention;

[0026] Figure 2 is a schematic cross-sectional view of a high central brightness light source provided by the present invention;

[0027] Figure 3 It is a main schematic diagram of the combination of the light-isolating layer, the light-transmitting layer and the inner diffusion layer provided by the present invention. DETAILED DESCRIPTION

[0028] The following will be combined with the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts shall fall within the scope of protection of the present invention.

[0029] Throughout this specification, references to terms such as "one embodiment," "example," or "specific example" indicate that the specific features, structures, materials, or characteristics described in conjunction with that embodiment or example are included in at least one embodiment or example of the present invention. In this specification, schematic representations of these terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0030] Reference Figure 1-3 The figure shows a preferred embodiment of the present invention.

[0031] The present invention is achieved by a method for manufacturing a high central brightness light source, comprising the following manufacturing steps:

[0032] 1) Providing a substrate 50 having a light-emitting region thereon, the light-emitting region comprising an inner region 10 and an outer region 20 surrounding the inner region 10, wherein the inner region 10 is located in the middle of the light-emitting region, and an annular isolation region 12 is disposed between the outer region 20 and the inner region 10, and the isolation region 12 is arranged around the outer periphery of the inner region 10, and the width of the isolation region 12 is greater than 0.7 mm;

[0033] 2) Multiple inner light-emitting chips 11 are die-bonded on the inner region 10 , with inner spacing 13 between adjacent inner light-emitting chips 11 along the radial direction of the inner region 10 ; multiple outer light-emitting chips 21 are die-bonded on the outer region 20 , with outer spacing 23 between adjacent outer light-emitting chips 21 along the radial direction of the outer region 20 ; the outer spacing 23 is larger than the inner spacing 13 ;

[0034] 3) A dam 22 is provided on the periphery of the light-emitting area. The dam 22 surrounds the periphery of the light-emitting area and forms an enclosed area. The light-emitting area is located inside the enclosed area.

[0035] 4) Fill the enclosed area with fluorescent glue, which covers the light-emitting area and the inner light-emitting chip 11 and the outer light-emitting chip 21 .

[0036] The manufacturing method of the high central brightness light source provided above, when facing the need to use a high central brightness light source, is achieved by solidifying multiple inner light-emitting chips 11 in the inner area 10 and multiple outer light-emitting chips 21 in the outer area 20, and at the same time, the interval between adjacent inner light-emitting chips 11 in the inner area 10 is smaller than the interval between adjacent outer light-emitting chips 21 in the outer area 20, so that the light source manufactured in this way has the advantages of strong central illumination and strong central light.

[0037] In this embodiment, the center of the inner region 10 coincides with the center of the light-emitting region. In manufacturing step 2), an inner light-emitting chip 11 is disposed at the center of the inner region 10. By disposing the inner light-emitting chip 11 at the center, the brightness of the center point of the entire light source is effectively increased.

[0038] In manufacturing step 2), multiple inner light-emitting chips 11 are arranged in a circular pattern to form an inner light-emitting ring. The inner light-emitting ring surrounds the outer periphery of the center of the inner region 10. Within the inner light-emitting ring, inner light-emitting gaps 14 are provided between adjacent inner light-emitting chips 11. This inner light-emitting ring, formed by the circular arrangement of multiple inner light-emitting chips 11, maintains a single high-intensity light source throughout the entire light source center. The spaced arrangement of the inner light-emitting chips 11 saves consumables and resources and effectively utilizes the divergence of light.

[0039] In manufacturing step 2), the plurality of inner light-emitting chips 11 form a plurality of inner light-emitting rings, which are nested in sequence. In this way, the plurality of inner light-emitting rings nested in sequence on the substrate 50 make the central area of ​​the entire light source wider.

[0040] The inner luminous interval 14 of the inner luminous ring gradually increases along the radial direction from the inside to the outside of the inner area 10. In this way, the brightness of the center of the inner area 10 is brighter and the light intensity is stronger than that of other areas of the inner area 10.

[0041] In this embodiment, in manufacturing step 2), multiple outer light-emitting chips 21 are arranged in a circular pattern to form an outer light-emitting ring. The outer light-emitting ring is arranged along the circumferential direction of the outer region 20. Within the outer light-emitting ring, adjacent outer light-emitting chips 21 are separated by inner and outer light-emitting gaps 24. This outer light-emitting ring, formed by the circular arrangement of multiple outer light-emitting chips 21, provides a wider illumination range. The spaced arrangement of the outer light-emitting chips 21 ensures light intensity while conserving consumables and resources and effectively utilizing the divergence of light.

[0042] In manufacturing step 2), multiple outer light emitting chips 21 form multiple outer light emitting rings, and the multiple outer light emitting rings are nested in sequence. In this way, the multiple light emitting chips arranged in the outer area 20 can make the entire manufactured light source have a wide illumination range.

[0043] Along the radial direction of outer region 20, the outer light interval 24 of the outer light ring gradually decreases, and the inner and outer light interval 24 is larger than the inner light interval 14. This ensures that the brightness of the outer area of ​​the light source is not too low. Compared with the outer light ring, the light-emitting chips of the inner light ring are closer together, which can make the center of the entire light source brighter.

[0044] In this embodiment, in manufacturing step 4), before the fluorescent glue is arranged in the light-emitting area, a light-isolating layer 70 is provided on the bottom of the isolation area 12 to block light transmission. The light-isolating layer 70 has an upper end surface facing away from the substrate 50, and the upper end surface of the light-isolating layer 70 is arranged higher than the inner light-emitting chip 11 and the outer light-emitting chip 21.

[0045] The upper end surface of the light-isolating layer 70 is recessed downward to form a plurality of adjacent recessed annular grooves. The recessed annular grooves are arranged around the isolation region 12. The bottoms of the recessed annular grooves are respectively higher than the inner light-emitting chip 11 and the outer light-emitting chip 21.

[0046] A light-transmitting layer 80 is arranged on the light-isolating layer 70 , wherein the bottom of the light-transmitting layer 80 is embedded in a plurality of concave annular grooves of the light-isolating layer 70 , and the top of the light-transmitting layer 80 extends upward;

[0047] After the light-isolating layer 70 and the light-transmitting layer 80 are arranged, fluorescent glue is applied to the light-emitting area. The fluorescent glue holds the light-isolating layer 70 and the light-transmitting layer 80 in place, and the top of the light-transmitting layer 80 is higher than the fluorescent glue. In this way, the light-isolating layer 70 protruding from the bottom of the isolation area 12 prevents light irradiated from the outer area 20 from irradiating the inner area 10, and light irradiated from the inner area 10 from irradiating the outer area 20. At the same time, the upper end surface of the light-isolating layer 70 is higher than the inner light-emitting chip 11 and the outer light-emitting chip 21, ensuring a sufficient longitudinal distance for light isolation and protecting the inner light-emitting chip 11 and the outer light-emitting chip 21. The upper end surface of the light-isolating layer 70 is recessed downwardly with multiple recessed annular grooves with bottoms higher than the inner light-emitting chip 11 and the outer light-emitting chip 21. The light-transmitting layer 80 is arranged on these grooves, allowing the light source of the outer area 20 to irradiate without affecting the inner area 10. The fluorescent glue secures the light-isolating layer 70 and the light-transmitting layer 80 together.

[0048] The light transmittance of the light-transmitting layer 80 is lower than that of the fluorescent glue, and the light transmittance of the light-transmitting layer 80 gradually increases from both sides of the light-transmitting layer 80 to the middle of the light-transmitting layer 80;

[0049] The fluorescent glue includes an inner glue 302 covering the inner area 10 and an outer glue 301 covering the outer area 20. A granular inner diffusion layer 801 is coated between the outer periphery of the inner glue 302 and the inner side of the light-transmitting layer 80, and a granular outer diffusion layer is coated between the inner periphery of the outer glue 301 and the outer side of the light-transmitting layer 80.

[0050] Since the light transmittance of the fluorescent glue is greater than that of the light-transmitting layer 80, the fluorescent glue does not affect the light that can be emitted from the light-transmitting layer 80. The light transmittance passes through the coated inner diffusion layer 801 and the outer diffusion layer, making the illumination range of the entire light source wider.

[0051] The above contents are merely examples and explanations of the present invention. Those skilled in the art may make various modifications or additions to the described specific embodiments or replace them in similar ways. As long as they do not deviate from the invention or exceed the scope defined by the claims, they should all fall within the scope of protection of the present invention.

Claims

1. A method for manufacturing a high central brightness light source, characterized in that: The manufacturing steps include: 1) Providing a substrate having a light-emitting area, the light-emitting area comprising an inner area and an outer area surrounding the inner area, the inner area being located in the middle of the light-emitting area, an annular isolation area being disposed between the outer area and the inner area, the isolation area being arranged around the outer periphery of the inner area, and the width of the isolation area being greater than 0.7 mm; 2) A plurality of inner light-emitting chips are die-bonded on the inner region, with inner spacing between adjacent inner light-emitting chips along the radial direction of the inner region; a plurality of outer light-emitting chips are die-bonded on the outer region, with outer spacing between adjacent outer light-emitting chips along the radial direction of the outer region, and the outer spacing is larger than the inner spacing; 3) Arranging a dam on the periphery of the light-emitting area, the dam surrounds the periphery of the light-emitting area, the dam surrounds and encloses to form an enclosed area, and the light-emitting area is located inside the enclosed area; 4) Filling the enclosed area with fluorescent glue, wherein the fluorescent glue covers the light-emitting area and covers the inner light-emitting chip and the outer light-emitting chip; The center position of the inner region coincides with the center position of the light-emitting region, and in the manufacturing step 2), the inner light-emitting chip is arranged at the center position of the inner region; In the manufacturing step 2), the plurality of inner light-emitting chips are arranged in a ring shape to form an inner light-emitting ring, and the inner light-emitting ring surrounds the outer periphery of the center position of the inner area; in the inner light-emitting ring, inner light-emitting gaps are formed between adjacent inner light-emitting chips; In the manufacturing step 4), before the fluorescent glue is arranged in the light-emitting area, a light-isolating layer is protruded from the bottom of the isolation area to block light transmission therethrough, the light-isolating layer having an upper end surface arranged away from the substrate, and the upper end surface of the light-isolating layer is respectively higher than the inner light-emitting chip and the outer light-emitting chip; The upper end surface of the light-isolating layer is recessed downward to form a plurality of adjacent recessed annular grooves, the recessed annular grooves being arranged around the isolation area, and the bottoms of the recessed annular grooves being higher than the inner light-emitting chip and the outer light-emitting chip respectively; Arranging a light-transmitting layer on the light-isolating layer, wherein the bottom of the light-transmitting layer is embedded in a plurality of concave annular grooves of the light-isolating layer, and the top of the light-transmitting layer extends upward; After the light-isolating layer and the light-transmitting layer are arranged, fluorescent glue is applied to the light-emitting area. The fluorescent glue sandwiches the light-isolating layer and the light-transmitting layer, and the top of the light-transmitting layer is higher than the fluorescent glue arrangement. The light transmittance of the light-transmitting layer is lower than the light transmittance of the fluorescent glue, and the light transmittance of the light-transmitting layer gradually increases along the direction from the two sides of the light-transmitting layer to the middle of the light-transmitting layer; The fluorescent glue includes an inner glue covering the inner area and an outer glue covering the outer area. A granular inner diffusion layer is coated between the outer periphery of the inner glue and the inner side of the light-transmitting layer. A granular outer diffusion layer is coated between the inner periphery of the outer glue and the outer side of the light-transmitting layer.

2. The method for manufacturing a high central brightness light source according to claim 1, wherein: In the manufacturing step 2), the plurality of inner light-emitting chips form a plurality of inner light-emitting rings, and the plurality of inner light-emitting rings are nested in sequence.

3. The method for manufacturing a high central brightness light source according to claim 2, wherein: Along the radial direction from the inside to the outside of the inner area, the inner luminous interval of the inner luminous ring gradually increases.

4. The method for manufacturing a high central brightness light source according to any one of claims 1 to 3, wherein: In the manufacturing step 2), the plurality of outer light-emitting chips are arranged in a circumferential shape to form an outer light-emitting ring, and the outer light-emitting ring is arranged circumferentially along the circumferential direction of the outer area; in the outer light-emitting ring, outer light-emitting gaps are provided between adjacent outer light-emitting chips.

5. The method for manufacturing a high central brightness light source according to any one of claims 1 to 3, wherein: In the manufacturing step 2), the plurality of outer light-emitting chips form a plurality of outer light-emitting rings, and the plurality of outer light-emitting rings are nested in sequence.

6. The method for manufacturing a high central brightness light source according to claim 5, wherein: Along the radial direction from the inside to the outside of the outer area, the outer light-emitting interval of the outer light-emitting ring gradually decreases, and the outer light-emitting interval is larger than the inner light-emitting interval.

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