A grinding algorithm and device based on three-dimensional scanner

Abstract

The present invention discloses a grinding algorithm based on a three-dimensional scanner, which belongs to the field of mechanical processing. Preparation work, calibration of the three-dimensional scanner coordinate system; robot teaching scanning position and scanning posture; scanning the workpiece to obtain three-dimensional data; using the three-dimensional data to fit the surface equation of the workpiece attached to the area to be polished, and calculating the boundary, area and height of the area to be polished; planning the path according to the area of ​​the area to be polished and the polishing process parameters, calculating the path control points, and calculating the grinding posture of the robot near each path control point according to the surface equation; calculating the number of grindings according to the height, and the robot grinding along the grinding path and adjusting to the grinding posture; evaluating the grinding effect after grinding. It can realize plane grinding and curved surface grinding of the area to be polished of the workpiece, wherein plane grinding can achieve high precision and high stability, and curved surface grinding can achieve a smooth transition grinding effect between the grinding area and the workpiece body.

Description

Technical Field

[0001] The invention belongs to the technical field of mechanical processing, and in particular to a grinding algorithm based on a three-dimensional scanner. Background Art

[0002] At present, in various metal material processing fields, the grinding process is mostly still at the stage of manual operation, and the mechanization and automation level of grinding is very low. In particular, the grinding of large-size parts basically remains at the stage of manual hammering and grinding wheel grinding. The on-site working environment is harsh, the labor intensity of workers is high, and the metal dust generated by grinding is harmful to the health of workers. Robots are urgently needed to replace manual labor in this field.

[0003] In the prior art, the following methods are usually used: For workpieces with very small tolerances, such as kitchen and bathroom faucets, all grinding points on the workpiece can be manually marked through the robot teaching path method, and a fixed grinding path is formed after being stored in the robot controller. The disadvantage of this method is that for the same type of workpieces to be polished, the grinding path is solidified and cannot be changed after being stored in the robot arm, and because this grinding method completely follows the pre-set grinding path (i.e., the teaching path) when grinding the workpiece, this requires that the tolerance of the workpiece to be polished is very small. Once the tolerance exceeds the limit, the pre-set grinding path will deviate from the area to be polished, and it is easy to damage the workpiece body during grinding.

[0004] For workpieces with smaller tolerances, a method of manually teaching the grinding path combined with automatic path correction is used. This method requires pre-setting the grinding path (i.e., the teaching path) according to the type of workpiece, and then performing automatic path correction according to the area to be polished during the actual polishing process. The disadvantages of the above method are: for ultra-large workpieces (more than two meters long) with a tolerance of more than 1mm, the teaching grinding path method requires a lot of tedious manual teaching work, and the pressure-type flexible grinding tool has a small scope of application and cannot be used to polish workpieces made of special materials; when this manual teaching method is applied to workpieces with a large number of points to be polished, accurate manual teaching is required for each polishing point, which will consume a lot of man-hours, and once there is a problem with the manual teaching, there will be problems with the subsequent polishing process, and the entire polishing process has very high requirements for manual labor.

[0005] In summary, it is necessary to develop a fully automatic path planning grinding algorithm that can be applied to workpieces with poor surface consistency, large tolerance (greater than 1 mm) and oversized sizes. Summary of the invention

[0006] In order to overcome the above technical defects, the present invention provides a grinding algorithm and device based on a three-dimensional scanner to solve the problems involved in the background technology.

[0007] In a first aspect, the present invention provides a polishing algorithm based on a three-dimensional scanner, comprising the following steps:

[0008] Step 1: Preparation, calibrate the 3D scanner coordinate system;

[0009] Step 2: The robot teaches the scanning position and scanning posture;

[0010] Step 3, scanning the workpiece to obtain data;

[0011] Step 4, fit the plane or surface equation where the polishing area is located, and calculate the boundary, area and height of the polishing area;

[0012] Step 5: Calculate the grinding posture and the grinding path control points;

[0013] Step 6: Automatically plan the grinding path and grind along the path;

[0014] Step 7: Evaluate the polishing effect.

[0015] Preferably or optionally, the step 4 further comprises the following steps:

[0016] Step 41, fitting the surface equation or plane equation of the polishing area according to the three-dimensional data obtained by the three-dimensional scanner;

[0017] Step 42: Calculate the boundary and height of the polishing area, calculate the minimum circumscribed rectangle or circle of the boundary, and calculate the area of ​​the rectangle or circle.

[0018] Preferably or optionally, the step 41 further comprises the following steps:

[0019] Step 411, randomly downsampling the data;

[0020] Step 412: Fitting a surface equation or a plane equation using the downsampled data;

[0021] Step 413, repeat steps 11 to 12 to obtain multiple surface equations or plane equations.

[0022] Step 414: Use the data before downsampling to check all the fitted surface equations or plane equations one by one to obtain the equation with the best fitting degree, and use this equation as the surface equation or plane equation of the polishing area.

[0023] Preferably or optionally, the step 42 further comprises the following steps:

[0024] Step 421, filter out data points whose z-axis coordinate values ​​are greater than a threshold value in the three-dimensional data obtained by the three-dimensional scanner, and calculate the boundary and height of the polishing area;

[0025] Step 422, calculating the minimum circumscribed rectangle or the minimum circumscribed circle according to the polishing area boundary;

[0026] Step 423: Calculate the area of ​​the minimum circumscribed rectangle or the minimum circumscribed circle.

[0027] Preferably or optionally, the step 5 further comprises the following steps:

[0028] Step 51, planning a grinding wheel grinding path according to a circumscribed rectangle or a circumscribed circle of the area to be ground;

[0029] Step 52: Calculate the normal vector of the surface or plane in the neighborhood of the control point according to the equation of the surface or plane where the area to be polished is located, and calculate the robot polishing posture in the neighborhood of the control point, that is, the posture of the robot when it runs to the control point.

[0030] Preferably or optionally, the step 51 further comprises:

[0031] Step 511, calculating the optimal path required for the grinding wheel to cover the area of ​​the circumscribed rectangle according to the area of ​​the circumscribed rectangle or the area of ​​the circumscribed circle;

[0032] Step 512: divide the optimal path into a plurality of straight path segments, each path segment being the shortest connection between two corresponding path control points.

[0033] Preferably or optionally, the step 52 comprises:

[0034] According to the equation of the surface where the area to be polished is located, the normal vectors in the path control point and the neighborhood are calculated, a normal vector histogram is drawn, the dominant normal vector in the control point area is determined, and the polishing posture of the robot in the control point neighborhood is calculated based on the normal vector.

[0035] Preferably or optionally, the step 7 further comprises the following steps:

[0036] Scan the polishing area and calculate the residual height in the area based on the 3D data obtained by the 3D scanner. If the height is greater than the threshold, repeat steps 4 to 7.

[0037] In a second aspect, the present invention further provides a grinding device based on a three-dimensional scanner, the device comprising:

[0038] A first preset unit, adapted to calibrate a three-dimensional scanner coordinate system;

[0039] The second preset unit is suitable for teaching the robot a scanning position and a scanning posture;

[0040] A first input unit, adapted to scan a workpiece to obtain data;

[0041] The first calculation unit is adapted to fit the surface equation of the polishing area and calculate the boundary, area and height of the polishing area;

[0042] A second calculation unit, adapted to calculate a grinding posture and a grinding path control point;

[0043] A first output unit is adapted to automatically plan a grinding path and grind along the path;

[0044] The first judging unit is suitable for evaluating the polishing effect.

[0045] In a third aspect, the present invention also provides a three-dimensional scanner-based polishing server, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor implements the steps of the three-dimensional scanner-based polishing method when executing the program.

[0046] In a fourth aspect, a computer-readable storage medium is provided, wherein when the program is executed by a processor, the steps of the polishing method based on a three-dimensional scanner are implemented.

[0047] The present invention relates to a grinding algorithm and device based on a three-dimensional scanner, which has the following beneficial effects compared with the prior art: the present invention can realize plane grinding and curved surface grinding of the area to be ground of a workpiece, wherein plane grinding can achieve high precision and high stability, curved surface grinding can achieve a smooth transition grinding effect between the grinding area and the workpiece body, and scanning the entire workpiece and fully automatic path planning can meet the production rhythm at the same time; the present invention can be applied to different types of workpieces, including large and small workpieces, and is particularly suitable for situations where the consistency of large workpieces is very poor or the tolerance is very large. BRIEF DESCRIPTION OF THE DRAWINGS

[0048] Figure 1 It is a flow chart of a grinding algorithm based on a three-dimensional scanner in Example 1 of the present invention.

[0049] Figure 2 The figure is a schematic diagram of the area calculation involved in the first embodiment of the present invention; in the figure, frame 1 shows the area to be polished, and frame 2 shows the reference surface of the workpiece where the area to be polished is located.

[0050] Figure 3 This is a grinding device based on a three-dimensional scanner in Example 2 of the present invention.

[0051] Figure 4 Schematic diagram of the structure of an exemplary electronic device in Embodiment 3 of the present invention.

[0052] The reference numerals are: a first preset unit 11 , a second preset unit 12 , a first input unit 13 , a first calculation unit 14 , a second calculation unit 15 , a first output unit 16 , and a first judgment unit 17 . DETAILED DESCRIPTION

[0053] In the following description, a large number of specific details are provided to provide a more thorough understanding of the present invention. However, it is apparent to those skilled in the art that the present invention can be implemented without one or more of these details. In other examples, in order to avoid confusion with the present invention, some technical features well known in the art are not described.

[0054] Example 1

[0055] See attached Figure 1 , a polishing algorithm based on a 3D scanner, comprising the following steps:

[0056] Step 1: Preparation, calibrate the 3D scanner coordinate system;

[0057] Specifically, the detailed technical solution of step 1 is: the grinding wheel and the 3D scanner (TOOLSCANNER) are installed on the robot end flange (TOOL0), and the end and the flange present a fixed positional relationship, which can be expressed as the rigid body transformation matrix TOOLSCANNER between the two. A tooling for clamping the workpiece to be polished is installed within the robot's motion range. The tooling is relatively fixed to the robot Base position, and the polishing workpiece coordinate system is represented by COORDWobj.

[0058] Step 2: The robot teaches the scanning position and scanning posture;

[0059] Specifically, the detailed technical solution of step 2 is: control the robot to move to each area to be polished (M1, M2, ..., Mn), and mark the starting point PointA1, PointA2, ..., PointAn and the end point PointB1, PointB2, ..., PointBn of the scanning area to be polished, and save the position of each scanning starting point and end point and the scanning posture PosA1, PosA2, ..., PosAn of the robot at this time.

[0060] Step 3, scanning the workpiece to obtain data;

[0061] Specifically, the detailed technical solution of step 3 is: the robot automatically moves to PointA1 recorded in step (4) according to the algorithm instruction, and after reaching the point, the robot automatically turns on the 3D scanner, adjusts to the PosA1 posture and maintains the posture to move to PointB1, and saves the data Data1 obtained by the 3D scanner. Repeat this step until all the polishing areas are scanned, and obtain the data Data1, Data2, ..., DataN of all the areas to be polished.

[0062] Step 4, fit the plane or surface equation where the polishing area is located, and calculate the boundary, area and height of the polishing area;

[0063] Specifically, the detailed technical solution of step 4 is: using the scanned data Data1, Data2, ..., DataN obtained in step 3, fitting the data with the equation of the surface near the area to be polished, screening out the data points whose z-axis coordinate values ​​in the three-dimensional data obtained by the three-dimensional scanner are greater than the threshold, and calculating the boundary and height of the polishing area;

[0064] Among them, since the amount of scan data obtained in step 3 is relatively large, the analysis is particularly time-consuming; and the device needs to respond quickly during the polishing process. Therefore, this embodiment also proposes a preferred fitting method, including the following steps: randomly downsampling the data; fitting the surface equation or plane equation using the downsampled data; repeating steps 11 to 12 to obtain multiple surface equations or plane equations. Use the data before downsampling to check all the fitted surface equations or plane equations one by one to obtain the equation with the best fitting degree, and use this equation as the surface equation or plane equation of the polishing area. Surface equation f(x,y)=ax 2 +by 2 +cxy+dx+ey+k.

[0065] Using the scan data Data1, Data2, ..., DataN obtained in step 3, all points greater than the height threshold are screened out. These points form the point set of the area to be polished, and the boundary and area of ​​the area to be polished are calculated. According to the boundary of the polishing area, the minimum circumscribed rectangle or the minimum circumscribed circle is calculated; the area of ​​the minimum circumscribed rectangle or the minimum circumscribed circle is calculated.

[0066] Step 5: Calculate the grinding posture and the grinding path control points;

[0067] Specifically, the detailed technical solution of step 5 is: according to the area, boundary, grinding wheel size and grinding process of the grinding area, the maximum circumscribed rectangle of the grinding area is calculated, the shortest path planning required for the grinding wheel to cover the circumscribed rectangle area is calculated, the path is divided into multiple straight line segments, the control points at both ends of the straight line segments are obtained, and the grinding path is formed;

[0068] Calculate the surface normals near the boundaries of all areas to be polished, project the calculated polishing path control points onto the surface along the direction of the nearest normal, calculate the normal vectors between the path control points and the neighborhood (0, ε), draw a normal vector histogram, determine the dominant normal vector in the control point area, and calculate the robot's polishing posture in the control point neighborhood based on the normal vector. Automatically adjust the polishing path, polishing times, and polishing posture according to the polishing height h, boundary b, and grinding wheel type.

[0069] Step 6: Automatically plan the grinding path and grind along the path;

[0070] Specifically, the detailed technical solution of step 7 is: according to the grinding path, grinding posture, grinding wheel size, grinding process parameters, etc. calculated in step 6, the number of grinding times required on the path and in the posture is planned to grind the workpiece.

[0071] Step 7: Evaluate the polishing effect.

[0072] Specifically, the detailed technical solution of step 7 is: scan the polishing area, calculate the residual height in the area based on the three-dimensional data obtained by the three-dimensional scanner, and if the height is greater than the threshold, repeat steps 4 to 7.

[0073] In the entire polishing process, only the step of "robot teaching scanning position and scanning posture" requires human participation. It can be seen that the present invention can greatly reduce the degree of human participation in the polishing process through the fully automatic path planning polishing algorithm. At the same time, as a submodule of the fully automatic path planning polishing algorithm, the polishing effect evaluation algorithm can ensure that the polishing effect meets expectations. The present invention can be applied to different types of fully automatic path planning polishing applications, and is particularly suitable for polishing applications of large workpieces with large tolerances and poor consistency.

[0074] Example 2

[0075] Based on the same inventive concept as the grinding method based on a three-dimensional scanner in the aforementioned embodiment 1, the present invention also provides a grinding device based on a three-dimensional scanner, such as Figure 3 As shown, the device comprises:

[0076] A first preset unit, adapted to calibrate a three-dimensional scanner coordinate system;

[0077] The second preset unit is suitable for teaching the robot a scanning position and a scanning posture;

[0078] A first input unit, adapted to scan a workpiece to obtain data;

[0079] The first calculation unit is adapted to fit the surface equation of the polishing area and calculate the boundary, area and height of the polishing area;

[0080] A second calculation unit, adapted to calculate a grinding posture and a grinding path control point;

[0081] A first output unit is adapted to automatically plan a grinding path and grind along the path;

[0082] The first judging unit is suitable for evaluating the polishing effect.

[0083] Furthermore, the device also includes:

[0084] A fourth calculation unit is adapted to fit the surface equation or plane equation of the polishing area according to the three-dimensional data obtained by the three-dimensional scanner;

[0085] The fifth calculation unit is adapted to calculate the boundary and height of the polishing area, calculate the minimum circumscribed rectangle of the boundary, and calculate the area of ​​the rectangle.

[0086] Furthermore, the device also includes:

[0087] a sixth computing unit, adapted to perform random downsampling on the data;

[0088] A seventh computing unit, adapted to fit a surface equation or a plane equation using the downsampled data;

[0089] The eighth calculation unit is adapted to repeat steps 11 to 12 to obtain a plurality of surface equations or plane equations.

[0090] The ninth calculation unit is suitable for verifying all the fitted surface equations or plane equations one by one using the data before downsampling to obtain the equation with the best fitting degree, and using this equation as the surface equation or plane equation of the polishing area.

[0091] Furthermore, the device also includes:

[0092] A tenth calculation unit, adapted to screen out data points whose z-axis coordinate values ​​are greater than a threshold value in the three-dimensional data obtained by the three-dimensional scanner, and calculate the boundary and height of the polishing area;

[0093] an eleventh calculation unit, adapted to calculate a minimum circumscribed rectangle or a minimum circumscribed circle according to a polishing area boundary;

[0094] The twelfth calculation unit is adapted to calculate the area of ​​the minimum circumscribed rectangle or the minimum circumscribed circle.

[0095] Furthermore, the device also includes:

[0096] A thirteenth calculation unit is adapted to plan a grinding wheel grinding path according to a circumscribed rectangle or a circumscribed circle of the area to be ground;

[0097] The fourteenth calculation unit is adapted to calculate the normal vector of the surface or plane in the neighborhood of the control point according to the equation of the surface or plane where the area to be polished is located, and calculate the polishing posture in the neighborhood, that is, the posture of the robot when it runs to the control point.

[0098] Furthermore, the device also includes:

[0099] A fifteenth calculation unit, adapted to calculate an optimal path for the grinding wheel to cover the area of ​​the circumscribed rectangle according to the area of ​​the circumscribed rectangle or the area of ​​the circumscribed circle;

[0100] The sixteenth calculation unit is adapted to divide the optimal path into a plurality of straight path segments, each path segment being the shortest connection line between two corresponding path control points.

[0101] Furthermore, the device also includes:

[0102] The seventeenth calculation unit is suitable for calculating the path control point and the normal vector in the neighborhood range according to the equation of the surface where the area to be polished is located, drawing a normal vector histogram, determining the dominant normal vector in the control point area, and calculating the polishing posture of the robot in the control point neighborhood according to the normal vector.

[0103] Furthermore, the device also includes:

[0104] An eighteenth calculation unit is adapted to scan the polishing area and calculate the residual height in the area according to the three-dimensional data obtained by the three-dimensional scanner. If the height is greater than a threshold, steps 4 to 7 are repeated.

[0105] The various variations and specific examples of the grinding method based on a three-dimensional scanner in the aforementioned embodiment 1 are also applicable to a grinding device based on a three-dimensional scanner in this embodiment. Through the aforementioned detailed description of a grinding method based on a three-dimensional scanner, technical personnel in this field can clearly know the implementation method of a grinding device based on a three-dimensional scanner in this embodiment, so for the sake of brevity of the specification, it will not be described in detail here.

[0106] Example 3

[0107] Based on the same inventive concept as the polishing method based on a three-dimensional scanner in the aforementioned embodiment, the present invention also provides a polishing server based on a three-dimensional scanner, such as Figure 4 As shown, Figure 4 It is an exemplary electronic device in Example 3, including a memory 304, a processor 302, and a computer program stored in the memory 304 and executable on the processor 302. When the processor 302 executes the program, the steps of any one of the above-mentioned three-dimensional scanner-based polishing methods are implemented.

[0108] Among them, Figure 4In the embodiment of the present invention, a bus architecture (represented by bus 300) is shown, which may include any number of interconnected buses and bridges, and bus 300 links various circuits including one or more processors represented by processor 302 and memory represented by memory 304. Bus 300 may also link various other circuits such as peripherals, voltage regulators, and power management circuits, which are well known in the art and are therefore not further described herein. Bus interface 305 provides an interface between bus 300 and receiver 301 and transmitter 303. Receiver 301 and transmitter 303 may be the same element, namely a transceiver, which provides a unit for communicating with various other devices over a transmission medium.

[0109] The processor 302 is responsible for managing the bus 300 and general processing, while the memory 304 may be used to store data used by the processor 302 when performing operations.

[0110] Example 4

[0111] Based on the same inventive concept as the grinding method based on a three-dimensional scanner in the aforementioned embodiment, the present invention also provides a computer-readable storage medium, on which a computer program is stored, and when the program is executed by a processor, the following steps are implemented: Step 1, preparation, calibrate the three-dimensional scanner coordinate system; Step 2, robot teaching scanning position and scanning posture; Step 3, scan the workpiece to obtain data; Step 4, fit the surface equation of the grinding area, calculate the boundary, area and height of the grinding area; Step 5, calculate the grinding posture, calculate the control points of the grinding path; Step 6, automatically plan the grinding path, and grind along the path; Step 7, evaluate the grinding effect.

[0112] The above one or more technical solutions in the embodiments of the present invention have at least one or more of the following technical effects: it can realize plane grinding and curved surface grinding of the area to be polished of the workpiece, wherein plane grinding can achieve high precision and high stability, and curved surface grinding can achieve a smooth transition polishing effect between the polishing area and the workpiece body, while scanning the entire workpiece and fully automatic path planning can meet the production rhythm; the present invention can be applied to different types of workpieces, including large and small workpieces, and is particularly suitable for situations where large workpieces have very poor consistency or very large tolerances.

[0113] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, the present invention will not further describe various possible combinations.

Claims

1. A polishing method based on a three-dimensional scanner, characterized in that: The steps include: Step 1: Preparation, calibrate the 3D scanner coordinate system: install the grinding wheel and 3D scanner on the end flange of the robot; Step 2, robot teaching scanning position and scanning posture: operate the robot to move to each area to be polished M1, M2, ..., Mn, and mark the starting point PointA1, PointA2, ..., PointAn and the end point PointB1, PointB2, ..., PointBn of the area to be polished, and save the position of each scanning starting point and end point and the robot's scanning posture PosA1, PosA2, ..., PosAn at this time; Step 3, scanning the workpiece to obtain data: the robot automatically moves to the recorded PointA1 according to the algorithm instructions. After reaching the point, the robot automatically turns on the 3D scanner, adjusts to the PosA1 posture and maintains the posture to move to PointB1, and saves the data Data1 obtained by the 3D scanner. Repeat this step until all the polishing areas are scanned, and obtain the data Data1, Data2, ..., DataN of all the areas to be polished. Step 4, fitting the plane or surface equation where the polishing area is located, and calculating the boundary, area and height of the polishing area: according to the three-dimensional data obtained by the three-dimensional scanner, fitting the surface equation of the surface or plane where the polishing area is located, screening out the data points whose z-axis coordinate values ​​in the three-dimensional data obtained by the three-dimensional scanner are greater than the threshold, calculating the boundary and height of the polishing area, and according to the boundary of the polishing area, calculating the minimum circumscribed rectangle or the minimum circumscribed circle, and calculating the area of ​​the minimum circumscribed rectangle or the minimum circumscribed circle; Step 5, calculate the grinding posture and the control points of the grinding path: calculate the maximum circumscribed rectangle of the grinding area according to the area, boundary, grinding wheel size and grinding process of the grinding area, calculate the shortest path required for the grinding wheel to cover the circumscribed rectangle area, divide the shortest path into multiple straight line segments, obtain the control points at both ends of the straight line segments, and form a grinding path; calculate the normal vector of the surface or plane in the neighborhood of the control point according to the equation of the surface or plane where the area to be polished is located, and calculate the grinding posture of the robot in the neighborhood of the control point; Step 6, automatically planning a grinding path, and grinding along the grinding path: according to the grinding path, grinding posture, grinding wheel size, and grinding process parameters, planning the number of grinding times required on the grinding path and in the grinding posture, and grinding the workpiece; Step 7: Evaluate the polishing effect.

2. The grinding method based on a three-dimensional scanner according to claim 1, characterized in that: The method for fitting the surface equation of the curved surface or plane where the polishing area is located in step 4 comprises the following steps: Step 411, randomly downsampling the data; Step 412: Fitting a surface equation or a plane equation using the downsampled data; Step 413, repeating steps 411 to 412 to obtain multiple surface equations or plane equations; Step 414: Use the data before downsampling to check all the fitted surface equations or plane equations one by one to obtain the equation with the best fitting degree, and use this equation as the surface equation of the surface or plane where the polishing area is located.

3. The grinding method based on a three-dimensional scanner according to claim 1, characterized in that: The step 5 also includes: According to the equation of the surface where the area to be polished is located, the normal vector in the neighborhood of the path control point is calculated, a normal vector histogram is drawn, the dominant normal vector in the neighborhood of the path control point is determined, and the polishing posture of the robot in the neighborhood of the control point is calculated based on the dominant normal vector.

4. The grinding method based on a three-dimensional scanner according to claim 1, characterized in that: The step 7 also includes the following steps: Scan the polishing area and calculate the residual height in the area based on the 3D data obtained by the 3D scanner. If the residual height is greater than the threshold, repeat steps 4 to 7.

5. A grinding device based on the grinding method based on a three-dimensional scanner according to any one of claims 1 to 4, characterized in that: The device comprises: A first preset unit is used to calibrate the coordinate system of the three-dimensional scanner; The second preset unit is used for teaching the robot the scanning position and scanning posture; A first input unit, used for scanning a workpiece to obtain data; The first calculation unit is used to fit the surface equation of the polishing area and calculate the boundary, area and height of the polishing area; The second calculation unit is used to calculate the grinding posture and the grinding path control points; A first output unit is used for automatically planning a grinding path and grinding along the grinding path; The first judgment unit is used for evaluating the polishing effect.

6. A polishing server based on a three-dimensional scanner, characterized in that: The method comprises a memory, a processor and a computer program stored in the memory and capable of running on the processor, wherein the processor implements the steps of the method according to any one of claims 1 to 4 when executing the program.

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