Optimized graphical customization method of chip card modules and resulting modules

Abstract

The invention relates to a method for manufacturing a standard chip card module (1) with metallized contacts (P1-P6) which define a graphic pattern comprising visible portions formed by lines, segments or dots, wherein a first portion (2A, 12A) thereof completely traverses the metallized contacts (P1-P6) in their thickness and wherein a second portion (2B, 12B) thereof is only superficially formed on the upper outer surface of the metallized contacts (P1-P6), characterized in that the second portion (2A, 12A) is realized as a continuation of the first portion to form the graphic pattern. The invention also relates to the module obtained.

Description

Technical Field

[0001] This invention relates to an optimized personalization graphique method for chip card modules.

[0002] Specifically, the present invention relates to a method for manufacturing a standard chip card module having metallized contacts, the metallized contacts defining a pattern consisting of at least lines, segments, or dots, wherein a first portion of the lines, segments, or dots of the module completely traverses the metallized contacts, and a second portion of the lines, segments, or dots is formed only on the upper surface portion of the metallized contacts.

[0003] This invention primarily relates to chip cards for banking, telecommunications, and identity purposes. This context requires careful consideration. To date, chip card module designs have been associated with chip card and module manufacturers (Gemalto / Thalez DIS, Idemia, G&D have their own overall appearance and design for the electrical contact pad shape) or open tools, and have undergone years of improvement, particularly for enhanced reliability.

[0004] Chip card integrated circuit modules conforming to ISO 7816 or 7810 standards typically include six or eight electrical contact pads disposed on an insulating substrate. The integrated circuit chip is moved to one side of the insulating substrate, usually located below the substrate. (In some cases, at mandatory electrical contact areas standardized according to ISO 7816 or 7810, there may be a structure opposite to the contact pads under the perforated insulating substrate.) Background Technology

[0005] The applicant's prior patent EP0589732 (B1) is known, which describes a method for laser marking a chip card module to mark an identifier on a surface metallized or passivated noble metal portion above a lower copper layer of the contact pad. This allows for the maintenance of the overall passivation and the preservation of the corrosion barrier without affecting the overall passivation.

[0006] The applicant's patent EP1073997 (A1) is also known, describing a graphic customization of a chip card module, specifically featuring the character "Mickey Mouse". The contact pads consist of a clever combination of non-metallic and metallic portions on the insulating substrate of the chip card module, such that the dividing lines of the contact pads coincide with the lines or outlines of "Mickey Mouse's" head.

[0007] Custom modules, particularly those from SPS, are known to have small patterns or logos formed by drilling or perforation, which are implemented inside the conventional metal contacts above the dielectric substrate. Thus, each specific module from the manufacturer can carry or display the customer's logo within a predefined contact pad area. Therefore, the manufacturer's modules can differ between customers only in terms of the different logos requested by each customer or specific to each customer. However, the outline of the contact pads and the overall appearance of the manufacturer's module are still maintained between customers. The results obtained through graphic customization are close to those of patent EP0589732 (B1), the difference being that in the SPS module, lines can completely penetrate the thickness of the metallization.

[0008] In the fall of 2019, Apple introduced its own custom-designed bank cards with corresponding modules, pioneering a new trend of modular graphic customization. Now, many banks want their own unique designs that are associated with their own brand.

[0009] A central contact located within the surface of an insulating substrate surrounding the contact pad is connected via a conductive via that passes through the insulating substrate and connects to a metallized interconnect region on the hidden opposite side of the substrate. The chip is typically moved to the side of the insulating substrate opposite to the metallized pad and connected to the interconnect region.

[0010] This new module is particularly expensive due to the metallization on each opposite side of the substrate and the conductive vias that pass through the substrate.

[0011] Technical issues

[0012] Current solutions combine overall pad etching with conductive vias, but this is costly and more complex. Furthermore, these solutions lead to a reduction in the size of the integrated circuit chip that can be contained in the dedicated space behind the central contact pad. Additionally, these solutions impose more limitations on the reliability management of mechanical strength.

[0013] The inventors discovered that certain module designs or styles, including company logos or graphic customizations (such as an octagon in the center of a contact pad), are currently impossible to achieve using standard electroplating techniques on both sides of a substrate.

[0014] The inventors specifically discovered that certain designs lacked metallic continuity between the center and edges of the module contact pads. The only apparent solution was the one described above for Apple modules, which has inherent drawbacks, including cost.

[0015] Purpose of the invention

[0016] The purpose of this invention is, in particular, to address the aforementioned deficiencies.

[0017] This invention proposes a more effective way to customize challenging and demanding specific designs for modules. Preferably, this objective should be achieved while maintaining a good level of mechanical strength and reliability against bending / torsion of the module.

[0018] The present invention also aims to provide a more environmentally friendly or ethical solution, particularly using less gold associated with conductive vias. Summary of the Invention

[0019] This invention proposes a specific combination of extreme surface etching techniques (a few nanometers) (especially laser) and standard etching (especially copper) over the entire thickness of the pad to achieve patterned and graphic customized patterns for the contact pad.

[0020] Therefore, the subject of this invention is a method for manufacturing a standard chip card module having metallized contacts defining a pattern pattern including visible portions formed by lines, segments, or dots, wherein a first portion completely penetrates the metallized contacts in its thickness, and wherein a second portion is formed only superficially on the upper outer surface of the metallized contacts; the method is characterized in that the second portion is implemented as a continuation of the first portion to form the pattern pattern.

[0021] Therefore, the module's graphic customization was achieved, while mechanical strength was advantageously preserved or improved.

[0022] Mechanical strength and reliability issues are real. From a technical expert's perspective, straight lines etched entirely into the copper (35nm) introduce certain limitations within modules, above the soldering of integrated circuit chips and interconnects, or flip-chip interconnects.

[0023] According to a preferred embodiment, the present invention proposes to etch (or separate) only the contact pads that actually need to be separated, particularly the primary contact pads of ISO 7816-2, using standard processes (chemical or other).

[0024] Protective metallization (nickel, gold, palladium, and / or other precious metals and / or alloys) used on the module (typically on a copper layer) can also be a standard process, particularly an electrochemical process. Conductive vias are no longer needed (or at least their number can be significantly limited, especially to two). This solution is more efficient, consumes less gold, and is more environmentally friendly and ethical.

[0025] According to other preferred features or embodiments:

[0026] - The first portion of the visible portion coincides with the dividing line of the contact pad, and the second portion extends through the contact pad or standardized area;

[0027] - The first part can be obtained by means of contact pad formation methods in techniques such as electrochemical etching, mechanical cutting, metal deposition, especially plasma metal deposition (LIFT), spraying, and conductive material spraying;

[0028] - The second shallow portion can be obtained by means of a shallow surface marking method on the metallized upper surface, the shallow surface marking method being selected from laser etching, electrochemical etching, abrasive jetting, inkjet printing, screen printing, additive or subtractive marking methods;

[0029] - The visible portion of a graphic style is formed by geometric shapes, including lines, segments, straight lines or curves, circles, points, dotted lines, polylines, or regions or surfaces with contrasting surface conditions that differ from adjacent regions.

[0030] The subject of this invention also includes modules corresponding to the method and cards comprising the modules, said modules having visually optimized graphic customization and good bending and / or torsional mechanical strength. Attached Figure Description

[0031] - Figure 1 illustrates a module with ISO 7816-2 mandatory standardization areas (C1-C7) according to a first embodiment;

[0032] - Figure 2 The implementation steps of the separator lines and segments of the contact pad in the module of Figure 1 are shown;

[0033] - Figure 3 The preferred bend line of the module in Figure 1 is shown, and therefore it is a fragilisation line;

[0034] - Figure 4 This illustrates the steps to complete the lines and segments shown in the previous diagram;

[0035] - Figure 5 The final module with graphic customization obtained according to the first embodiment is shown, along with the complete pattern or logo;

[0036] - Figure 6 and Figure 7 The second drawing to be implemented on the module and its arrangement relative to the ISO 7816-2 contact pad are shown respectively;

[0037] - Figure 8 This illustrates the implementation using shallow markings. Figure 7 The implementation steps AD for the separator lines and segments of the module's contact pads;

[0038] - Figure 9 The steps of the method of the present invention according to a possible general embodiment are shown. Detailed Implementation

[0039] As a premise, the same reference numerals in each figure refer to the same or similar components.

[0040] Figure 1B The image shows a setting with Figure 1A A customized module for the logo or trademark of the company (Chase Manhattan Bank). It is based on a first embodiment of the invention. It includes ISO 7816-2 mandatory standardization areas (C1-C7).

[0041] One possible step according to this embodiment is to consider the location of the ISO C1-C7 areas for graphic customization of the module. These ISO standard areas are integral metal areas and cannot be changed to enable electrical contact with the connector of the corresponding contact reader.

[0042] These areas C1-C7 should be located on or contain six contact pads P1-P7; these pads should be electrically insulated to prevent any short circuits between them. Custom designs become easier here because areas C1-C7 fall into the normally separated contact pad locations. However, not all requested graphic custom designs can be based on this rule (see especially...). Figure 7 ).

[0043] exist Figure 2 In the following steps, specific etch lines 2A required for this customization are defined. Lines 2A (including 2AC2, 2AC6) correspond to those lines that should be retained in the conventional etching design (electrochemical, cutting, or otherwise).

[0044] The technological advantages are as follows:

[0045] - The location E that can accommodate integrated circuit chips is unrestricted;

[0046] - The location (not shown) of the chip interconnect vias that pass through the insulating substrate to interconnect chip contacts and contact pads P1-P7 (especially through wire bonding) is easily controlled;

[0047] - Only line 2A may weaken the mechanical strength of the chip at the intended bend ( Figure 3 5D, 5G, 6H, and 6L are used for standard constructions.

[0048] - Improved module reliability (contact pad separators were broken as much as possible to prevent straight lateral and longitudinal extensions within the module's metal layer (e.g.) Figure 3 The lines 5D, 5G, 6H, and 6L cause predetermined fracture lines in the contact pad metal layer, thus the risk of weakening is very small;

[0049] - Metallizing P1-P7 is possible without the need for conductive vias for electronic chip interconnection, and without the need for metallization or metallization carriers on two opposing surfaces of an insulating substrate. This reduces costs.

[0050] - Standard metal plating (or etching) is possible only on the side of the bearing external contact portion of the insulating substrate, which also makes it possible to reduce costs.

[0051] Figure 3 The diagram illustrates the analysis of bending shafts 5D, 5G, 6H, and 6L during bending / torsion mechanical tests performed on the entire metallization (contact pad) thickness of the fully etched module. The mechanical strength of the module presents a significant reliability risk during these mechanical bending / torsion tests.

[0052] Figure 4 The steps for completing the second part 2B, which consists of a partial line, segment, and point, are shown in the diagram. The second part 2B is then completed. Figure 2 The first portion 2A of a line, segment, or point, or its complement thereof. According to another subsequent step, the portion 2B of the line or segment is preferably achieved after gold or palladium plating of the contact pads P1-P7.

[0053] For these second parts 2B, the method of the present invention can provide laser marking using a specific wavelength among IR, UV, red, blue, or green lasers to achieve these 8 line and segment portions and complete the marking corresponding to mark 2 ( Figure 1A )of Figure 1B Pattern 2 graphic customization.

[0054] These 2B lines can have very small depths, only a few nanometers, such as less than 1 nm, 5 nm, or less than 15 nm. In this example, the lines are approximately 5 nm deep. These lines can range from 1 to 15 nm. The minimum thickness of gold on such modules can be 40 nm (the standard thickness can be 70 nm, with a maximum of 110 nm).

[0055] Preferably, the shallow lines 2B do not penetrate the entire thickness of the noble metal (such as gold or palladium) layer; they are... Figure 5 The reliability or mechanical strength of the final module 1 obtained is not affected.

[0056] On the one hand, the combination of these two steps (implementing 2A and 2B) including separating the 2A contact pads P1-P7 and shallow marking 2B is effective in making it easier to achieve graphical customization of the module.

[0057] This invention surprisingly enables the achievement of logo appearances with shapes much larger than those of the prior art, while being more economical and less susceptible to mechanical reliability issues. The area "E" for receiving the electronic chip can be larger. This allows for the reception of chips requiring larger areas or maximum volumes, without being constrained by the dividing lines 2A typically located around the electronic chip.

[0058] Laser technology is now able to etch these second shallow portions (lines, segments, dots) with good precision, resolution, and environmental resistance (without burning the surface or causing a certain degree of exposure to atmospheric corrosion), with a width of about 100 nm and a very small nanometer-scale depth (a few nanometers).

[0059] Figure 5 Another benefit of the laser marking 2B shown is that if a dark central area 10 is required on the module, it is located above the chip's position "E". Feasibility studies indicate that if the dark area 10 is located in the center of the module (and larger than the chip size), defects will occur in reliability testing (ISO 7610 three-roll bending standard test).

[0060] This confirms the benefits of combining two different methods, marking lines 2A and 2B, to form graphic pattern 2.

[0061] Figure 6 and Figure 7 This illustrates an alternative design or pattern (or graphic) that can only be achieved by means of the method of the present invention.

[0062] Figure 6 The pattern or design (graphic) 12 is difficult or even impossible today (incompatible with ISO 7816-2). It includes unbroken circles as constraints for customer implementation.

[0063] In the initial pattern, the normally separated contact areas P1-P7 are short-circuited.

[0064] ISO pads C1 to C7 all have a continuous common metal portion in the area defined between the two outermost concentric circles.

[0065] Therefore, the contact area does not conform to ISO 7816-2, and pattern 12 is, in principle, unacceptable to any manufacturer whose goal is to achieve a custom module in the best possible way (with the advantages of the present invention).

[0066] However, by means of minor optional dimensional adjustments when necessary, and primarily by means of the present invention, pattern 12 can be achieved by combining two different marking methods (one of which is fully (or integrally) electrically separated or insulating contact pads P1-P7). With the help of the present invention, optimized custom designs, drawings, or graphic patterns that meet the customer's constraint of an uninterrupted circle can now be proposed. Here, shallow laser marking on the metallized outer surface does not affect the integrity of the ISO 7816-2 (C1-C7) mandatory area.

[0067] Mechanical reliability is not affected by the circular or round portion 12A (first curve) that separates the contact pads P1-P7. By extending or completing the circular or round portion 12A (first curve) belonging to the custom graphic pattern 12 and separating the contact pads P1-P7 across the entire thickness, mechanical reliability is also not affected by the circular or complementary round portion 12B (second curve) that is superficially introduced into the metallization.

[0068] exist Figure 9 The essential steps 100 and 200 of the method of the present invention will now be described according to a possible general embodiment. This general embodiment covers the two embodiments or examples described above.

[0069] According to preferred features of a general embodiment, a method for manufacturing a standard chip card module 1 having metallized contacts (P1-P7) with defined graphic patterns 2 or 12 is described.

[0070] The pattern 2 or 12 may include visible portions formed, in particular by lines, segments, and dots, and its first portion (2A, 12A) extends completely through the metallized contacts (P1-P6) in its thickness (so that they are electrically insulated from each other), and its second portion (2B, 12B) is formed only superficially by marking on the upper outer surface of the metallized contacts (P1-P6).

[0071] - In step 100 of the example according to the preferred general embodiment, the method according to the embodiment may provide the following feature: forming a first portion of the visible portion of the graphic patterns 2, 12. This step provides adjusting the first portion of the visible portion to the separator lines 2A, 12A of the contact pad (or aligning them) (or conversely: aligning the separator lines passing near the patterned portions with these same patterned portions).

[0072] Adjustments may include making more or less significant enlargement or reduction of the pattern. Without changing the overall appearance of the pattern, the dividing lines on the pads of the module can be redefined or repositioned to coincide with the lines, curves, and dots of the pattern.

[0073] The size can preferably be adjusted (based on the module's format) (optional, depending on the style to be presented) to have the largest possible image for better visibility. Figure 1B In the middle, pattern 2 is adjusted to be between regions C1 and C7.

[0074] The vertical (along the Y-axis) portion (2AC2) of pattern 2 is preferably placed as close as possible to the normalized region C2, while in Figure 2 The vertical (along the Y-axis) portion (2AC6) of pattern 2 is placed as close as possible to region C6. Therefore, portions 2AC2 and 2AC6 will be able to coincide with (or be adjusted to) the portions of the separator contact pads P2 and P5 of separator line 2A, and the portions of the separator pads P5 and P6 of separator line 2A, respectively.

[0075] In contrast, Figure 8 In (B), pattern 12 is positioned such that only one portion is placed between (and near) the normalized regions C2 and C6, while another complementary peripheral portion of pattern 12 may overlap with these same normalized regions C2 and C6 portions.

[0076] The generally vertical (along the Y-axis) curved portion (12AC2) of pattern 12 is preferably placed as close as possible to the normalized region C2, while Figure 8 The generally vertical (along the Y-axis) curved portion (12AC6) of pattern 12 on (B) is placed as close as possible to region C6. Therefore, portions 12AC2 and 12AC6 of pattern 12 can be (for graphic styling or drawing purposes) overlap with or be adjusted to these positions with the portion of curved dividing line 12A used to separate contact pads P2 and P5, and another portion used to separate contact pads P5 and P6.

[0077] The dividing lines 12A that partially overlap with the graphic pattern 12 can also be determined such that they do not fall at the predetermined mechanical strength weakening lines of the module. Figure 3 The 5G, 5D, or 6H, 6L modules extend straight across the entire height (along the Y-axis) or the entire width (along the X-axis) of the module.

[0078] Next, align the portion of pattern 12 adjacent to regions C1-C7 (e.g., the inner circle) with the (arc-shaped) dividing line 12A, for example, to create electrical separation or insulation between contact pads P2 and P5, and then between P5 and P6. Figure 8 (C).

[0079] Here, in Figure 2In the middle, the first portion (2A, 12A) of the visible part coincides with the dividing line of the contact pad. (As will be seen later, the shallow second portion (2B, 12B) may extend through or over the contact pad (P1-P6) or the standardized area C1-C7.)

[0080] The first portion (2A, 12A) of the separator can be obtained by means of electrochemical etching, mechanical cutting, plasma metal deposition, deposition of conductive material on an FPC ("Fine Powder Coating") or LIFT ("Laser Induced Forward Transfer") type insulating substrate, contact pad formation methods in various conductive material spraying, sublimation, vacuum evaporation, and jetting methods. In this example, the pad is preferably separated by electrochemical etching.

[0081] According to a preferred embodiment of the invention, the second portion (2B, 12B) is implemented sequentially with the first portion to form graphic pattern 2 or 12. To illustrate this, the method according to a preferred general embodiment may preferably include step 200:

[0082] - In step 200 of the example according to this general embodiment, the method according to this embodiment may provide, as a second feature, a step of forming a second portion 2B, 12B of a visible portion of a graphic pattern 2, 12 continuous with the first portions 2A, 12A and on the outer surface of the contact pad. The second portion 2B or 12B of the patterned portion coincides with the remainder of the pattern 2 or 12 (different from the first patterned portion).

[0083] This step can also be applied to the two examples described above.

[0084] For better visibility, the continuous formation of 2B, 12B is also preferably performed to have a pattern as large as possible, extending beyond the standardized areas C1-C7 toward the outer edge of the module. Therefore, the second portions 2B, 12B of the visible parts of the graphic patterns 2, 12 are shallowly formed or marked on the contact pads, ensuring continuity or extension with the first portions 2A, 12A. The second portion (or even the surface) of the partial lines, partial curves, or dots should not completely separate the individual contact pads of the module across their entire thickness at this second portion.

[0085] exist Figure 4 and Figure 8 In the example, the second parts 2B, 12B may extend through or partially overlap with the contact pads (P1-P6) or the standardized areas C1-C7.

[0086] It can be observed that the vertical lines (along the Y-axis) of the second part 2B and 12B can be the dividing lines 2A and 12A of the contact pads P1-P7 (corresponding to...) Figure 3 The extension of 5D or 5G without affecting or weakening the bending / torsional mechanical strength of the module.

[0087] Similarly, it can be observed that the horizontal lines (along the X-axis) of the second part 2B and 12B can be the dividing lines 2A and 12A of the contact pad (corresponding to...). Figure 3 The extension of 6H or 6L does not affect or weaken the bending / torsional mechanical strength of the module.

[0088] The second part (2B, 12B) on the shallow surface can be obtained by means of various methods known to those skilled in the art for shallowly marking the surface on the metallized upper surface.

[0089] The latter can be selected from laser etching, electrochemical etching, abrasive jetting, inkjet printing, screen printing, additive or subtractive marking methods. In this example, the marking is done by an ablation laser. Its depth can be a few nanometers, particularly 2 to 5 nm, or between 5 and 15 nm.

[0090] Regarding the visible portion of the graphic style, in all examples, the visible portion can be formed by any geometric shape, including lines, segments, straight lines or curves, circles, dots, dotted lines, polylines, and surfaces or areas with a contrasting surface condition that is significantly different from adjacent areas. In this example, the marking is preferably performed by a laser controlled by a computer-aided device.

[0091] The contact pad has a certain width of dividing grooves that can be filled with insulators of any color. To ensure the continuity of portions 2A and 12A with 2B and 1B respectively, markings 2B and 12B of the same width as 2A and 12A can be continuously made on the metallization. Preferably, laser marking produces grooves of a shallow depth (a few nanometers) in the noble metal protective layer.

[0092] These shallow grooves cause different refractive indices in the shallow materials, resulting in different surface colors.

[0093] The groove can be colored by printing, particularly inkjet printing, onto insulating or conductive materials. Alternatively, the marking can be added by adding material, preferably a conductive material, to the surface of the contact pad. Shallow marking can also be a conductive deposition of a few nanometers.

[0094] Therefore, a standard chip card module 1 with metallized contacts P1-P6 is obtained, wherein the metallized contacts P1-P6 define a graphic pattern including visible portions formed by lines, segments or dots, wherein the first portions 2A, 12A completely penetrate or separate the metallized contacts (P1-P6) in their layer thickness, and wherein the second portions (2B, 12B) are formed only superficially on the upper outer surface of the metallized contacts (P1-P6).

[0095] The module according to the example of the present invention may be characterized in that the second part 2A, 12A is set as a continuation or extension of the first part to form a custom graphic pattern 2 or 12.

[0096] In contrast, in the prior art, particularly some modules from SPS, customization needs are limited to the surface of the contact pad that is typically located in the center of P5.

[0097] The advantage of this invention is that it enables the use of a device at position “E” opposite to pad P5. Figure 2 or Figure 8 C) Accepts chips with large volume or surface area.

[0098] Therefore, the present invention enables the acquisition of chip cards whose modules have undergone graphic customization optimized for larger size and / or mechanical strength (without the risk of mechanical weakening) after embedding or fixing one of the customized modules described in all the examples into the card body.

Claims

1. Method for manufacturing a standard chip card module (1) with metallized contacts (P1-P6) defining a graphic pattern comprising visible parts formed by lines, segments or dots, wherein a first part (2A, 12A) of which fully traverses the metallized contacts (P1-P6) in their thickness and wherein a second part (2B, 12B) of which is only superficially formed on the upper outer surface of the metallized contacts (P1-P6), characterized in that the second part (2B, 12B) being realized as a continuation of the first part (2A, 12A) to form the graphic pattern.

2. The method according to the preceding claim, characterized in that, The first part (2A, 12A) of the visible parts coincides with the separation lines of the contact pads and the second part (2B, 12B) extends through the contact pads (P1-P6) or the standardized areas (C1-C7).

3. The method according to one of the preceding claims, characterized in that, The first part (2A, 12A) is obtained by means of a contact pad forming method of the techniques of electrochemical etching, mechanical cutting, metal deposition, plasma metal deposition (LIFT), spraying, jetting of conductive material.

4. The method according to one of the preceding claims, characterized in that, The superficial second part (2B, 12B) is obtained by means of a superficial surface marking method on the metallized upper surface selected from the group of methods of laser etching, electrochemical etching, abrasive blasting, inkjet printing, screen printing, additive or subtractive marking.

5. The method according to one of the preceding claims, characterized in that, The visible parts of the graphic pattern are formed by geometric shapes including lines, segments, straight or curved lines, circles, dots, dotted lines, broken lines, or areas or surfaces with contrast whose surface state differs from the adjacent areas.

6. Standard chip card module (1) with metallized contacts (P1-P6) defining a graphic pattern comprising visible parts formed by lines, segments or dots, wherein a first part (2A, 12A) of which fully traverses the metallized contacts (P1-P6) in their thickness and wherein a second part (2B, 12B) of which is only superficially formed on the upper outer surface of the metallized contacts (P1-P6), characterized in that the second part (2B, 12B) being set as a continuation of the first part (2A, 12A) to form the graphic pattern.

7. Chip card comprising a module according to the preceding claim.

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