A conveying device for PCB board gluing

Abstract

The application relates to the manufacturing field of PCB (Printed Circuit Board), and discloses a conveying device for PCB gluing, which comprises a mounting rack, a leveling mechanism, a clamping mechanism and a gluing mechanism, wherein the leveling mechanism, the clamping mechanism and the gluing mechanism are arranged on the mounting rack. The leveling mechanism is used for taking out the PCB and leveling the placement position of the PCB, so that the bottom of the PCB is flush with the horizontal direction, thereby improving the gluing effect of the PCB. After the PCB is leveled, the clamping mechanism clamps the two sides of the PCB, so that the PCB is stably placed. Then the PCB is conveyed to the gluing mechanism through the clamping device, the gluing mechanism applies force in the same direction to the two sides of the PCB, so that the PCB moves in a single direction, and the two sides of the PCB are glued in the movement process of the PCB.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of PCB manufacturing, in particular to a conveying device for PCB gluing. BACKGROUND

[0002] At present, the PCB is one of the important components of the electronic industry, and almost every electronic device is equipped with such electronic components. Since the PCB can realize the electrical connection between the components in the circuit, thereby simplifying the assembly and welding work of the electronic product, and reducing the wiring workload in the traditional way. Therefore, attention should be paid to the gluing quality during the gluing process of the PCB.

[0003] In the related art, the PCB is generally lifted to the gluing position to glue the surfaces on both sides of the PCB. However, during the lifting process, the PCB may be inclined, thereby affecting the gluing effect in the later gluing process of the PCB. SUMMARY

[0004] In order to reduce the inclination of the PCB during transportation and maintain the gluing effect of the PCB, the present application provides a conveying device for PCB gluing.

[0005] The conveying device for PCB gluing provided by the present application adopts the following technical scheme:

[0006] A conveying device for PCB gluing, comprising a mounting frame, a leveling mechanism, a clamping mechanism and a gluing mechanism, the leveling mechanism, the clamping mechanism and the gluing mechanism are all arranged on the mounting frame, the leveling mechanism is used for leveling the PCB, the clamping mechanism is used for clamping the PCB and driving the PCB to move to the gluing mechanism, and the gluing mechanism is used for gluing the PCB; the leveling mechanism comprises a first leveling piece, a leveling rod and a second leveling piece, the first leveling piece is connected to one side of the PCB, the second leveling piece is connected to the other side of the PCB, the leveling rod is rotatably arranged on one side of the mounting frame, the center of the rotation shaft of the leveling rod is arranged at the center line position of the leveling rod, and the first leveling piece and the second leveling piece are arranged on both sides of the leveling rod.

[0007] By adopting the above technical scheme, the PCB may be inclined during feeding, the first leveling piece and the second leveling piece are used to level both sides of the PCB respectively, so that the PCB is placed accurately, for example, the upper side of the PCB is placed horizontally, so that the gluing effect of the PCB is better during the later gluing process. Moreover, since the leveling rod is connected to the first leveling piece and the second leveling piece, the distance of the upward movement of the first leveling piece is equal to the distance of the downward movement of the second leveling piece; thereby reducing the frequency of leveling the PCB.

[0008] Optionally, the leveling mechanism further comprises a sensing member, the sensing member is used for emitting a laser to irradiate on the PCB and judging the rotating direction of the PCB according to the landing point of the laser.

[0009] By adopting the above technical scheme, in the use process of the sensing member, the landing point position of the laser of the sensing member is compared with the standard distance between the sensing member and the PCB, and then the rotating direction of the PCB is judged. For example, the distance between the sensing member and the PCB is r, the side length of the PCB is set as L, when the distance between the landing point position of the laser and the position of the sensor is greater than r and less than r+L / 2, it can be initially judged that the side of the PCB close to the sensor is lower than the side of the PCB away from the sensor, so that the PCB is counterclockwise rotated. When the distance between the landing point position of the laser and the position of the sensor is greater than r+L / 2 and less than r+L, it can be initially judged that the side of the PCB away from the sensor is lower than the side of the PCB close to the sensor, so that the PCB is clockwise rotated.

[0010] Optionally, the sensing member is provided with two groups, one group of the sensing member is vertically arranged and the laser irradiation direction is vertical, and the other group of the sensing member is horizontally arranged and the laser irradiation direction is horizontal.

[0011] By adopting the above technical scheme, by arranging the vertical sensing member and the horizontal sensing member, the background system analyzes the landing point data of the two groups of sensing members, and then judges the placement of the PCB, so as to further reduce the adjustment frequency of the leveling member and improve the accuracy of single adjustment of the PCB.

[0012] Optionally, the leveling mechanism comprises a leveling mounting plate, the first leveling member is slidably arranged on one side of the leveling mounting plate, the second leveling member is slidably arranged on the other side of the mounting plate, one side of the second leveling member is connected with a second adjusting member, the second adjusting member is connected to the leveling mounting plate, and the second adjusting member is used for adjusting the distance between the second leveling member and the connection of the second adjusting member to the leveling mounting plate.

[0013] By adopting the above technical scheme, the second adjusting member can adopt a steel spring, when the first leveling member slides, the leveling rod promotes the movement of the second leveling member, at this time, the second leveling member abuts against the steel spring to promote the deformation of the steel spring and store elastic potential energy; after adjusting the PCB, the elastic potential energy of the second adjusting member is released to promote the leveling rod to be horizontal, so as to reduce the frequency of adjusting the leveling rod for many times, and the horizontal placement of the leveling rod can be maintained.

[0014] Optionally, one side of the first leveling member is connected with a first driving assembly, the first driving assembly comprises a first driving motor, a first driving screw and a first driving connecting piece, the first driving motor is installed on the leveling mounting plate, the output end of the first driving motor is connected with the first driving screw, the first driving connecting piece is connected with the first driving screw, and the first leveling member is connected with the first driving connecting piece.

[0015] By adopting the above technical scheme, the position of the first leveling member is accurately adjusted by adopting the mode of the servo motor and the screw rod to adjust the position of the PCB board, so that the position of the PCB board is accurately placed, and the subsequent gluing effect is maintained.

[0016] Optionally, the gluing mechanism comprises a gluing assembly, the gluing mechanism is provided with two groups of gluing assemblies, and the two groups of gluing assemblies have a spacing therebetween, the spacing being used for PCB board transmission, when the PCB board is transmitted, the two sides of the PCB board are respectively pressed against one group of the gluing assemblies.

[0017] By adopting the above technical scheme, when the PCB board is glued, the two sides of the PCB board are glued.

[0018] Optionally, the two groups of gluing assemblies are rotationally arranged on the mounting rack, and the rotation directions of the two groups of gluing assemblies are opposite.

[0019] By adopting the above technical scheme, in the gluing process of the PCB board, the rotation directions of the gluing assemblies on the two sides of the PCB board are opposite, therefore, the directions of the forces acting on the two sides of the PCB board are the same, so that the PCB board moves in one direction, and the good gluing effect is maintained, and the situation that a single area of the PCB board is glued too thick does not occur.

[0020] Optionally, the clamping mechanism comprises a clamping mounting member, a first clamping driving assembly and a clamping assembly, the clamping assembly is connected with the clamping mounting member, and the first clamping driving assembly is used to drive the clamping assembly to move vertically.

[0021] By adopting the above technical scheme, the PCB board is transported to between the two groups of gluing assemblies in the upward direction from below, when the two groups of gluing assemblies drive the PCB board to move upward, the movement direction and the force direction of the PCB board are the same, and the PCB board will not be disturbed in movement. For example, when the PCB board moves upward in the process, the gluing assembly gives the PCB board a downward force, the PCB board may first move upward and then move downward under the force, and then the gluing thickness of a certain area of the PCB board is greater than that of other positions. Therefore, the first clamping driving assembly drives the clamping assembly to move vertically, so that the transportation direction of the PCB board and the gluing transportation direction are the same, and the good gluing effect is maintained.

[0022] Optionally, the clamping assembly is provided with two groups, and the two groups of clamping assemblies are respectively arranged on the two sides of the clamping mounting, and the two groups of clamping assemblies are respectively used for clamping the two sides of the PCB.

[0023] By adopting the above technical scheme, the two sides of the PCB are clamped, so that the PCB is not easy to tilt due to unilateral stress during transportation.

[0024] Optionally, the clamping mechanism further comprises a second clamping driving assembly, and the second clamping driving assembly is used for driving the two groups of clamping assemblies to move towards each other.

[0025] By adopting the above technical scheme, the two groups of clamping assemblies move towards each other, so that the clamping assemblies can clamp PCBs of different sizes, improving the adaptability of the overall device.

[0026] In summary, the present application includes at least one of the following beneficial technical effects:

[0027] 1. The PCB may tilt during the feeding process. The first and second leveling members are used to level the two sides of the PCB, so that the PCB is placed accurately, for example, the upper side of the PCB is placed horizontally, which improves the gluing effect during the later gluing process. Moreover, since the leveling rods are connected to the first and second leveling members, the distance of the upward movement of the first leveling member is equal to the distance of the downward movement of the second leveling member, thereby reducing the frequency of leveling the PCB.

[0028] 2. During use, the laser landing point position of the sensing member is compared with the standard distance between the sensing member and the PCB, and then the rotation direction of the PCB is determined.

[0029] 3. During the gluing process of the PCB, the rotation directions of the two gluing assemblies on the two sides of the PCB are opposite, so the directions of the forces acting on the two sides of the PCB are the same, thereby promoting the one-way movement of the PCB, thereby maintaining good gluing effect, and avoiding the situation that a single area on the surface of the PCB is glued too thick. BRIEF DESCRIPTION OF DRAWINGS

[0030] Figure 1 is a structural schematic diagram of the overall device of the embodiment of the present application;

[0031] Figure 2 is a structural schematic diagram of the overall device of the embodiment of the present application;

[0032] Figure 3 is a structural schematic diagram of the leveling mechanism of the embodiment of the present application;

[0033] Figure 4 is a structural schematic diagram of the clamping mechanism and the leveling mechanism of the embodiment of the present application;

[0034] Figure 5 is a structural schematic diagram of the clamping mechanism of the embodiment of the application;

[0035] Figure 6 is a structural schematic diagram of the gluing mechanism of the embodiment of the application.

[0036] Mark explanation: 1, mounting rack; 2, leveling mechanism; 21, suction cup assembly; 211, first suction cup part; 212, second suction cup part; 22, leveling assembly; 221, leveling mounting plate; 222, first leveling part; 223, leveling rod; 224, second leveling part; 3, clamping mechanism; 31, clamping mounting part; 312, first clamping drive assembly; 3121, first clamping connecting part; 3122, first clamping drive part; 3123, first clamping output part; 3124, first clamping fixed part; 313, clamping assembly; 3131, clamping mounting seat; 3132, opening and closing air claw; 314, second clamping drive assembly; 3141, second clamping drive part; 3142, second clamping output part; 3143, second clamping connecting part; 4, gluing mechanism; 41, gluing mounting seat; 42, gluing drive assembly; 421, gluing drive part; 422, gluing output part; 423, gluing connecting part; 43, gluing assembly; 431, gluing gear part; 432, gluing rotating shaft; 433, gluing part; 44, transmission assembly; 441, first transmission gear; 442, transmission connecting part; 443, second transmission gear; 5, drive mechanism; 51, first drive assembly; 511, first drive motor; 512, first drive lead screw; 513, first drive connecting part; 52, second drive assembly; 521, second mounting plate; 522, second adjusting part. DETAILED DESCRIPTION

[0037] The following will be described in detail in combination with the accompanying Figure 1 - the accompanying Figure 6 The application will be further described in detail.

[0038] The embodiment of the application discloses a conveying device for PCB gluing.

[0039] Reference Figure 1 and Figure 2 A conveying device for PCB gluing, comprising a mounting rack 1, a leveling mechanism 2, a clamping mechanism 3 and a gluing mechanism 4. Wherein the leveling mechanism 2, the clamping mechanism 3 and the gluing mechanism 4 are all arranged on the mounting rack 1. The leveling mechanism 2 is used for leveling the PCB, the clamping mechanism 3 is used for clamping the PCB, and the gluing mechanism 4 is used for gluing the PCB.

[0040] Reference Figure 3 and Figure 4The leveling mechanism 2 is arranged on one side of the clamping mechanism 3, and the leveling mechanism 2 comprises a suction disc assembly 21, a leveling assembly 22 and a sensing member. The suction disc assembly 21 is used for adsorbing the PCB, the leveling assembly 22 is used for leveling the PCB, and the sensing member is used for determining the direction in which the PCB rotates.

[0041] Specifically, in the embodiment, the suction disc assembly 21 comprises a first suction disc member 211 and a second suction disc member 212, and the first suction disc member 211 and the second suction disc member 212 are connected to the leveling assembly 22. The leveling assembly 22 comprises a leveling mounting plate 221, a first leveling member 222, a leveling rod 223 and a second leveling member 224. The first leveling member 222 and the second leveling member 224 are both vertically slidingly connected to the leveling mounting plate 221, and the first leveling member 222 and the second leveling member 224 are respectively connected to two sides of the leveling rod 223. Moreover, the leveling rod 223 is pivotally connected to the leveling mounting plate 221, and the center of the pivot of the leveling rod 223 is the middle line position of the leveling rod 223.

[0042] In the embodiment, when the first leveling member 222 moves downward, the second leveling member 224 moves upward, and the first leveling member 222 is connected to the first suction disc member 211, and the second leveling member 224 is connected to the second suction disc member 212. Therefore, when the PCB is adsorbed, the PCB can be adjusted so that one side of the PCB is located at a horizontal position.

[0043] In the embodiment, two groups of sensing members are arranged, and the two groups of sensing members are both arranged on the mounting rack 1. One group of sensing members is vertically arranged, and the other group of sensing members is horizontally arranged. The two groups of sensing members can both emit laser and irradiate on the PCB, and the sensing members can calculate and determine the rotating direction of the PCB according to the landing points of the laser.

[0044] Specifically, in the embodiment, the distance between the vertically arranged sensing member and the upper end of the correctly placed PCB is set as r1, the distance between the horizontally arranged sensing member and one side of the correctly placed PCB is set as r2, and the side length of the PCB is L. When the distance between the landing point of the laser of the vertically arranged sensing member and the vertically arranged sensing member is greater than r1 and less than r1+L / 2, and the distance between the landing point of the laser of the horizontally arranged sensing member and the horizontally arranged sensing member is greater than r2 and less than r2+L / 2, the PCB needs to rotate clockwise relative to the leveling mounting plate 221, that is, the first leveling member 222 rises, and the second leveling member 224 descends. When the distance between the landing point of the laser of the vertically arranged sensing member and the vertically arranged sensing member is greater than r1+L / 2, and the distance between the landing point of the laser of the horizontally arranged sensing member and the horizontally arranged sensing member is greater than r2+L / 2, the PCB needs to rotate counterclockwise relative to the leveling mounting plate 221, that is, the first leveling member 222 descends, and the second leveling member 224 rises.

[0045] Reference Figure 3And Figure 4 In order to maintain the stability of the rotation of the PCB, in the embodiment, a driving mechanism 5 is further included, the driving mechanism 5 includes a first driving assembly 51 and a second driving assembly 52, the first driving assembly 51 is connected to the first leveling member 222, and the second driving assembly 52 is connected to the second leveling member 224. The first driving assembly 51 includes a first driving motor 511, a first driving lead screw 512 and a first driving connecting piece 513, wherein the first driving motor 511 is arranged on the leveling mounting plate 221; the output end of the first driving motor 511 is connected to the first driving lead screw 512, the first driving motor 511 drives the first driving lead screw 512 to rotate, the first driving connecting piece 513 is connected to the first driving lead screw 512, and the first driving connecting piece 513 is connected to one side of the first leveling member 222. The second driving assembly 52 includes a second mounting plate 521 and a second adjusting member 522, wherein the second mounting plate 521 is arranged on one side of the leveling mounting plate 221, the second adjusting member 522 is a rigid spring, one end of the second adjusting member 522 is fixedly arranged on the second mounting plate 521, and the other end of the second adjusting member 522 is connected to the second leveling member 224. Therefore, when the first driving motor 511 drives the first leveling member 222 to move, the second leveling member 224 can move in the opposite direction and the moving distance is the same, and in addition, one motor can be directly used to complete the leveling of the PCB.

[0046] With reference to Figure 4 And Figure 5 The clamping mechanism 3 includes a clamping mounting member 31, a first clamping driving assembly 32, a clamping assembly 33 and a second clamping driving assembly 34, wherein the first clamping driving assembly 32 is connected to the clamping mounting member 31 and is used to drive the clamping mounting member 31 to move vertically; the clamping assembly 33 and the second clamping driving assembly 34 are arranged on the clamping mounting member 31, the second clamping driving assembly 34 is connected to the clamping assembly 33, and the second clamping driving assembly 34 is used to drive the clamping assembly 33 to move horizontally, so that the clamping assembly 33 clamps PCBs of different sizes.

[0047] With reference to Figure 4 And Figure 5The first clamping driving assembly 32 comprises a first clamping connecting piece 321, a first clamping driving piece 322, a first clamping output piece 323 and a first clamping fixing piece 324. The first clamping connecting piece 321 is connected to the leveling mounting plate 221 by bolts. The first clamping driving piece 322 is fixedly connected to the clamping mounting piece 31 by bolts. The first clamping driving piece 322 is a gas cylinder. The output end of the first clamping driving piece 322 is connected to the first clamping output piece 323. The first clamping output piece 323 is connected to the first clamping fixing piece 324. The first clamping fixing piece 324 is fixedly connected to the first clamping connecting piece 321. When the first clamping driving piece 322 is driven, the clamping mounting piece 31 moves in a direction away from the first clamping fixing piece 324, thereby driving the clamping assembly 33 to rise.

[0048] With reference to Figure 4 and Figure 5 The second clamping driving assembly 34 is provided in two groups. The clamping assembly 33 is also provided in two groups. The two groups of second clamping driving assemblies 34 are respectively connected to the two groups of clamping assemblies 33. The two groups of second clamping driving assemblies 34 and the two groups of clamping assemblies 33 are symmetrically arranged along the center line of the clamping mounting piece 31 in the length direction.

[0049] With reference to Figure 4 and Figure 5 The second clamping driving assembly 34 comprises a second clamping driving piece 341, a second clamping output piece 342 and a second clamping connecting piece 343. One side of the second clamping driving piece 341 is connected to the clamping mounting piece 31. The output end of the second clamping driving piece 341 is connected to the second clamping output piece 342 through a rotating shaft. The second clamping connecting piece 343 is connected to the second clamping output piece 342 through a screw rod. The second clamping driving piece 341 is a servo motor. This arrangement is to accurately drive the horizontal movement of the clamping assembly 33, so that the two groups of clamping assemblies 33 are set to the size of the PCB.

[0050] With reference to Figure 4 and Figure 5 The clamping assembly 33 comprises a clamping mounting seat 331 and an opening and closing air claw 332. The clamping mounting seat 331 is connected to the second clamping connecting piece 343. The opening and closing air claw 332 is fixedly connected to the clamping mounting seat 331. In this embodiment, the opening and closing air claw 332 comprises an opening and closing air cylinder, a first clamping part and a second clamping part. The opening and closing air cylinder is connected to the clamping mounting seat 331 by bolts. The output end of the opening and closing air cylinder is connected to the first clamping part and the second clamping part. When the opening and closing air cylinder is started, the first clamping part and the second clamping part move away from each other. The interval between the first clamping part and the second clamping part is used for placing the PCB.

[0051] With reference to Figure 1 and Figure 6The gluing mechanism 4 comprises a gluing mounting base 41, a gluing driving assembly 42 and a gluing assembly 43. The gluing driving assembly 42 is connected to the gluing assembly 43 and drives the gluing assembly 43 to rotate. The gluing mounting base 41 is mounted on the mounting rack 1, and the gluing driving assembly 42 is arranged on the gluing mounting base 41. In the embodiment, two groups of the gluing assembly 43 are arranged, and the PCB is arranged to pass through the space between the two groups of the gluing assembly 43, so that the surface of the PCB is coated.

[0052] With reference to Figure 1 and Figure 6 , the gluing driving assembly 42 comprises a gluing driving part 421, a gluing output part 422 and a gluing connecting part 423. The gluing driving part 421 is a servo motor. The output end of the gluing driving part 421 is connected to the gluing output part 422. The gluing output part 422 is connected to the gluing connecting part 423. The gluing connecting part 423 is arranged in two groups, and each group of the gluing connecting part 423 is connected to the gluing output part 422.

[0053] With reference to Figure 1 and Figure 6 , in order to maintain the rotation of the gluing assembly 43, the gluing mechanism 4 further comprises a transmission assembly 44. The transmission assembly 44 is arranged in two groups, and each group of the transmission assembly 44 is meshingly connected to the gluing connecting part 423. Specifically, the transmission assembly 44 comprises a first transmission gear 441, a transmission connecting part 442 and a second transmission gear 443. One side of one group of the first transmission gear 441 is meshingly connected to one group of the gluing connecting part 423, and the other side of the other group of the first transmission gear 441 is meshingly connected to the other group of the gluing connecting part 423. Thus, the rotation directions of the two groups of the first transmission gear 441 are opposite.

[0054] With reference to Figure 1 and Figure 6 , the first transmission gear 441 is connected to the transmission connecting part 442 in the rotation shaft, the transmission connecting part 442 is connected to the second transmission gear 443 in the rotation shaft, and the second transmission gear 443 is meshingly connected to the gluing assembly 43. Therefore, the rotation directions of the two groups of the gluing assembly 43 are opposite.

[0055] With reference to Figure 1 and Figure 6The glue applying assembly 43 comprises a glue applying gear part 431, a glue applying rotating shaft 432 and glue applying parts 433. The glue applying gear part 431 is arranged on one side of the glue applying rotating shaft 432, the glue applying rotating shaft 432 is connected to the glue applying gear part 431, and the glue applying parts 433 are attached to the surface of the glue applying rotating shaft 432, so that the glue applying parts 433 rotate in the same direction with the glue applying rotating shaft 432. Since the rotating directions of the two groups of glue applying parts 433 are opposite, when the PCB board passes through the two groups of glue applying parts 433, the two groups of glue applying parts 433 in opposite motion make the PCB board be affected by the auxiliary force, further promoting the vertical movement of the PCB board.

[0056] The embodiment of the application is a kind of for the implementation principle of PCB board glueing transport device: a kind of for the transport device of PCB board glueing includes installation rack 1, leveling mechanism 2, clamping mechanism 3 and glue applying mechanism 4, leveling mechanism 2, clamping mechanism 3 and glue applying mechanism 4 are all arranged on installation rack 1. Wherein, leveling mechanism 2 is used to take out PCB board and the placement position of PCB board is leveled, so that the bottom of PCB board is flush with the horizontal direction, to improve the glue applying effect of PCB board. When the PCB board is leveled, clamping mechanism 3 clamps the two sides of PCB board, so that PCB board is stably placed. Then the PCB board is transported to glue applying mechanism 4 by clamping device, glue applying mechanism 4 applies force in the same direction to the two sides of PCB board, promotes the movement of PCB board along a single direction, in the movement process of PCB board, the two sides of PCB board are glued.

[0057] The above are preferred embodiments of the application, and do not limit the protection scope of the application, so: any equivalent changes made according to the structure, shape, principle of the application should be covered within the protection scope of the application.

Claims

1. A conveying device for PCB board gluing, characterized in that, The application relates to a PCB gluing device, which comprises a mounting rack (1), a leveling mechanism (2), a clamping mechanism (3) and a gluing mechanism (4), wherein the leveling mechanism (2), the clamping mechanism (3) and the gluing mechanism (4) are arranged on the mounting rack (1), the leveling mechanism (2) is used for leveling a PCB, the clamping mechanism (3) is used for clamping the PCB and driving the PCB to move to the gluing mechanism (4), and the gluing mechanism (4) is used for gluing the PCB; the leveling mechanism (2) comprises a first leveling piece (222), a leveling rod (224) and a second leveling piece (223), the first leveling piece (222) is connected to one side of the PCB, the second leveling piece (223) is connected to the other side of the PCB, the leveling rod (224) is rotationally arranged on one side of the mounting rack (1), the rotation shaft center of the leveling rod (224) is arranged at the center line position of the leveling rod (224), and the first leveling piece (222) and the second leveling piece (223) are arranged on the two sides of the leveling rod (224) respectively. The leveling mechanism (2) further comprises a sensing piece (23), the sensing piece (23) is used for emitting laser light to irradiate on the PCB and calculating and judging the rotating direction of the PCB according to the landing point of the laser light. The sensing piece (23) is provided with two groups, one group of the sensing piece (23) is vertically arranged and the laser irradiation direction is vertical, and the other group of the sensing piece (23) is horizontally arranged and the laser irradiation direction is horizontal. The leveling mechanism (2) comprises a leveling mounting plate (221), the first leveling piece (222) is slidingly arranged on one side of the leveling mounting plate (221), the second leveling piece (223) is slidingly arranged on the other side of the mounting plate, one side of the second leveling piece (223) is connected with a second adjusting piece (522), and the second adjusting piece (522) is connected to the leveling mounting plate (221). The clamping mechanism (3) comprises a clamping mounting piece (31), a first clamping driving assembly (32) and a clamping assembly (33), the clamping assembly (33) is connected to the clamping mounting piece (31), and the first clamping driving assembly (32) is used for driving the clamping assembly (33) to vertically move. The clamping assembly (33) is provided with two groups, the two groups of clamping assemblies (33) are arranged on the two sides of the clamping mounting piece (31) respectively, and the two groups of clamping assemblies (33) are respectively used for clamping the two sides of the PCB. The clamping mechanism (3) further comprises a second clamping driving assembly (34), and the second clamping driving assembly (34) is used for driving the two groups of clamping assemblies (33) to move towards each other. The first clamping driving assembly (32) comprises a first clamping connecting piece (321), a first clamping driving piece (322), a first clamping output piece (323) and a first clamping fixing piece (324), the first clamping connecting piece (321) is connected to the leveling mounting plate (221) through bolts; the first clamping driving piece (322) is fixedly connected to the clamping mounting piece (31) through bolts, the first clamping driving piece (322) is a gas cylinder, the output end of the first clamping driving piece (322) is connected to the first clamping output piece (323), the first clamping output piece (323) is connected to the first clamping fixing piece (324), and the first clamping fixing piece (324) is fixedly connected to the first clamping connecting piece (321).

2. The conveying device for PCB board gluing according to claim 1, characterized in that, The first leveling piece (222) is connected with a first driving assembly (51) on one side, the first driving assembly (51) comprises a first driving motor (511), a first driving lead screw (512) and a first driving connecting piece (513), the first driving motor (511) is installed on the leveling mounting plate (221), the output end of the first driving motor (511) is connected to the first driving lead screw (512), the first driving connecting piece (513) is connected to the first driving lead screw (512), and the first leveling piece (222) is connected to the first driving connecting piece (513).

3. The conveying device for PCB board gluing according to claim 1, characterized in that, The gluing mechanism (4) comprises gluing assemblies (43), two groups of the gluing assemblies (43) are arranged, and a spacing is formed between the two groups of the gluing assemblies (43) and used for PCB transmission; when the PCB is transmitted, the two sides of the PCB are respectively pressed against one group of the gluing assemblies (43).

4. The conveying device for PCB board gluing according to claim 3, characterized in that, The two groups of the gluing assemblies (43) are rotationally arranged on the mounting rack (1), and the two groups of the gluing assemblies (43) rotate in opposite directions.

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