Device and method for realizing preformed tin ring fast installation based on inter-board connector

Abstract

A device and method for realizing preformed tin ring rapid installation based on an inter-board connector, during installation, first, a first comb type limiting part and a second comb type limiting part are used to center align and fix all pins of the inter-board connector; then, a tin ring mounting seat is installed on a tin ring mounting baffle, and tin rings are filled into corresponding tin ring mounting holes of the tin ring mounting seat; then, the tin ring mounting seat is taken out from the tin ring mounting baffle, and a tin ring mounting cover is installed on the tin ring mounting seat to lock the tin rings; finally, the tin ring mounting seat with the tin rings is installed on the inter-board connector, the tin ring mounting cover is slid, and the tin rings are automatically detached and assembled on the pins of the inter-board connector, so that the tin rings are rapidly installed on the inter-board connector. The device for realizing tin ring rapid installation on the inter-board connector provided by the application realizes preformed tin ring rapid installation on the inter-board connector, realizes hot air welding of the inter-board connector, improves inter-board connector welding efficiency, improves tin penetration welding effect, and provides guarantee for realizing 100% wetting of the inter-board connector pad hole.

Description

Technical Field

[0001] This invention belongs to the field of board-to-board connectors and PCB soldering, specifically relating to a device and method for rapid installation of pre-formed solder rings based on board-to-board connectors. Background Technology

[0002] As aerospace electronic products gradually move towards integration, miniaturization, and modularization, the integration level of electronic products is becoming higher and higher. As a bridge for electrical interconnection between circuit boards, board-to-board connectors are widely used in stacked electronic units of aerospace products, replacing traditional wires for electrical connection and greatly reducing the size, weight, and assembly complexity of electrical enclosures.

[0003] While inter-board connectors offer practical advantages, they also present new challenges to electronic assembly production: to ensure superior electrical performance of gold-plated connectors, the solder joint height must be controlled within 1mm, and solder contamination is not permitted on other parts; inter-board connector pins are dense, numerous, and long, making it difficult to install each pin into the corresponding pad hole on the PCB; the high pin density and small pin pitch (only 1.24mm between pins) make it difficult for even the finest soldering iron tip to penetrate deep into the inner row of pins on the inter-board connector, and even if soldering is completed, solder contamination at the mating area is likely; most PCB mounting holes corresponding to inter-board connectors have large grounding conditions, making it difficult to achieve 100% wetting of through-hole pads during soldering.

[0004] Research has shown that hot air soldering can solve various problems in the soldering process of board-to-board connectors and improve the soldering quality between board-to-board connectors and PCBs. However, hot air soldering has a problem that restricts actual production: how to quickly install pre-formed solder rings onto board-to-board connectors. Therefore, it is urgent to conduct research and explore an installation device to achieve rapid installation of pre-formed solder rings onto board-to-board connectors. Summary of the Invention

[0005] The purpose of this invention is to provide a device and method for rapid installation of pre-formed solder rings based on inter-board connectors, which can realize the rapid installation of pre-formed solder rings on inter-board connectors.

[0006] To achieve the above objectives, the present invention provides the following technical solution:

[0007] A device for rapid installation of pre-formed solder rings based on inter-board connectors includes a solder ring mounting baffle, a solder ring mounting cover, and a solder ring mounting base;

[0008] The tin ring mounting baffle is made of aluminum plate with a cavity at the bottom. The shape, size and depth of the cavity are consistent with the tin ring mounting seat. The tin ring mounting baffle has a slope on three circumferential sides and one horizontal side. Inside the tin ring mounting baffle, the angles between the three circumferential sides and the horizontal side are all obtuse angles.

[0009] The solder ring mounting base is machined with solder ring mounting holes, the number and layout of which are consistent with the pins of the inter-board connector; the solder ring mounting base can be placed in the bottom cavity of the solder ring mounting baffle;

[0010] The solder ring mounting cover is machined with solder ring control holes, the number and layout of which are consistent with the pins of the inter-board connector; the solder ring mounting cover can be installed on the solder ring mounting surface of the solder ring mounting base, and the solder ring mounting cover can slide left and right along the solder ring mounting base.

[0011] Preferably, each solder ring mounting hole consists of an inner ring hole and an outer ring hole. The inner ring hole is a through hole with a diameter of D1, which is equal to the diameter of a single pin of the board connector. The outer ring hole is a non-through hole. The outer ring hole and the inner ring hole form a ring structure with a depth of H1 for placing the pre-formed solder ring. H1 is the height of the pre-formed solder ring. The diameter of the outer ring hole is in the range of D3 + 0.2 mm, where D3 is the diameter of the pre-formed solder ring.

[0012] Preferably, the substrate of the tin ring mounting base is an epoxy glass cloth board.

[0013] Preferably, each tin ring control hole is a through hole with a diameter of D3, where D3 is the diameter of the pre-formed tin ring.

[0014] Preferably, the solder ring mounting cover can slide left and right 0.2mm on the solder ring mounting base.

[0015] Preferably, the substrate for the tin ring mounting cover is an epoxy glass cloth board.

[0016] Preferably, it also includes a first comb-shaped limiting component and a second comb-shaped limiting component;

[0017] The first comb-shaped limiting component has several comb tooth grooves machined at equal intervals, and each comb tooth groove is parallel to the other.

[0018] The second comb-shaped limiting component has several comb tooth grooves machined at equal intervals, and each comb tooth groove is parallel to the other.

[0019] During installation, the first comb-shaped limiting component and the second comb-shaped limiting component are inserted into the inter-board connector from the left and right sides. The first comb-shaped limiting component and the second comb-shaped limiting component form a cross structure, which is used to shape the pins of the inter-board connector so that the spacing between all pins of the inter-board connector is the same and perpendicular to the plastic encapsulation body.

[0020] Preferably, the acute angle between the first comb-shaped limiting component and the second comb-shaped limiting component forming a cross structure is 50°-60°.

[0021] Preferably, both the first comb-shaped limiting component and the second comb-shaped limiting component are machined with comb-shaped screw grooves on both sides. When shaping the pins of the inter-board connector, the fasteners of the inter-board connector are located in the comb-shaped screw grooves.

[0022] The method for rapid installation of pre-formed solder rings using the above-mentioned device includes:

[0023] Place the solder ring mounting base into the bottom cavity of the solder ring mounting baffle, and pour the pre-formed solder ring into the solder ring mounting base through the three sloping sides of the solder ring mounting baffle.

[0024] The pre-formed solder ring is manually placed on the solder ring mounting hole of the solder ring mounting base, and any excess pre-formed solder ring is placed on the horizontal surface of the solder ring mounting baffle.

[0025] Remove the solder ring mounting base from the solder ring mounting baffle, and install the solder ring mounting cover on the solder ring mounting surface of the solder ring mounting base, so that the solder ring control hole of the solder ring mounting cover is not aligned with the solder ring mounting hole of the solder ring mounting base, thereby achieving the purpose of locking the solder ring.

[0026] Inverted solder ring mount: Place the inverted solder ring mount on top of the inter-board connector, and ensure that the solder ring mounting holes of the solder ring mount correspond one-to-one with the pins of the inter-board connector;

[0027] Slide the solder ring mounting cover so that the solder ring control hole of the solder ring mounting cover is aligned with the solder ring mounting hole of the solder ring mounting base. The pre-formed solder ring falls off and is fitted onto the corresponding pin, completing the quick installation of the pre-formed solder ring.

[0028] Compared with the prior art, the present invention has the following beneficial effects:

[0029] The device for quick installation of solder rings on board-to-board connectors provided by this invention solves the quality problems such as low efficiency, easy omission, over-installation, and incorrect installation that existed when operators manually installed pre-formed solder rings in the past. It realizes the rapid installation of pre-formed solder rings on board-to-board connectors, which enables hot air soldering of board-to-board connectors, improves the soldering efficiency of board-to-board connectors, improves the solder penetration effect, and provides a guarantee for achieving 100% wetting of board-to-board connector pad holes. Attached Figure Description

[0030] Figure 1 This is a structural diagram of the device of the present invention;

[0031] Figure 2 This is an assembly diagram of the first comb-shaped limiting component, the second comb-shaped limiting component, and the inter-plate connector of the device of the present invention;

[0032] Figure 3This is an assembly diagram of the tin ring mounting baffle and tin ring mounting base of the device of the present invention;

[0033] Figure 4 This is an assembly diagram of the solder ring mounting cover and solder ring mounting base of the device of the present invention, wherein (a) the solder ring control hole of the solder ring mounting cover is not aligned with the solder ring mounting hole of the solder ring mounting base, and (b) the solder ring control hole of the solder ring mounting cover is aligned with the solder ring mounting hole of the solder ring mounting base. Detailed Implementation

[0034] The technical solution of the present invention will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are merely some embodiments of the present invention, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0035] Please see Figure 1-4 A device for rapid installation of pre-formed solder rings based on inter-board connectors includes a solder ring mounting baffle 1, a solder ring mounting cover 2, a solder ring mounting seat 3, a first comb-shaped limiting component 4, and a second comb-shaped limiting component 5. The five components of the device should be able to be assembled independently between the solder ring mounting baffle and the solder ring mounting seat, between the solder ring mounting seat and the solder ring mounting cover, and between the first comb-shaped limiting component and the second comb-shaped limiting component.

[0036] The tin ring mounting baffle 1 is mainly made of aluminum plate with a milled cavity at the bottom. The shape, size, and depth of the cavity are completely consistent with the tin ring mounting base 3. The entire baffle is high on the outer periphery and tilted to one side on the inside. The tin ring mounting baffle has slopes on three circumferential sides and one horizontal side. Inside the tin ring mounting baffle, the angles between the three circumferential sides and the horizontal plane are all obtuse angles.

[0037] The solder ring mounting base is mainly made by drilling holes (solder ring mounting holes) in the epoxy glass cloth substrate. The number and layout of the solder ring mounting holes are consistent with the pins of the board connector. Each solder ring mounting hole consists of an inner ring hole and an outer ring hole. The inner ring hole is a through hole with a diameter of D1 (D1 is equal to the diameter of the board connector). The outer ring hole is a non-through hole. The outer ring hole and the inner ring hole form a ring structure with a depth of H1, which is used to place the pre-formed solder ring. H1 is the height of the pre-formed solder ring. The diameter of the outer ring hole is in the range of D3+0.2 (unit: mm, where D3 is the diameter of the pre-formed solder ring).

[0038] The solder ring mounting cap is mainly made by drilling holes (solder ring control holes) in the epoxy glass cloth substrate. The number and layout of the solder ring control holes are consistent with the pins of the board connector. Each solder ring control hole is a through hole with a diameter of D3 (D3 is the diameter of the pre-formed solder ring).

[0039] like Figure 2As shown, both the first and second comb-shaped limiting components have several parallel comb-tooth grooves machined at equal intervals. Both the first and second comb-shaped limiting components have comb-shaped threaded grooves machined on both sides. When shaping the pins of the inter-board connector, the inter-board connector fastener is located within the comb-shaped threaded groove. The width of the comb-shaped grooves in the first and second comb-shaped limiting components is D1 (unit: mm, D1 is equal to the pin diameter of the inter-board connector), and the width of the comb-shaped threaded groove is D2 (unit: mm, D2 is the diameter of the inter-board connector fastener). During installation, the first and second comb-shaped limiting components are inserted into the inter-board connector from the left and right sides. The first and second comb-shaped limiting components form a cross-shaped structure, used to shape the pins of the inter-board connector, ensuring that the spacing between all pins of the inter-board connector is the same and perpendicular to the molding body. The acute angle of the cross-shaped structure is 50°-60°, preferably 54°.

[0040] This invention provides an installation method, comprising the following steps:

[0041] Insert the first comb-type limiting component 5 and the second comb-type limiting component 4 horizontally into the inter-board connector, and center-align and fix all pins of the inter-board connector so that the spacing between all pins of the connector is the same and perpendicular to the plastic encapsulation body. Then place the solder ring mounting base 3 in the solder ring mounting baffle 1 (e.g., Figure 3 As shown, the pre-formed solder ring is quickly inserted into the solder ring mounting base 3 using tweezers. The solder ring mounting base is then removed from the solder ring mounting baffle. The solder ring mounting cover 2 is then right-aligned and placed over the solder ring mounting base 3 (at this point, the solder ring control hole of the solder ring mounting cover is not directly aligned with the solder ring mounting hole of the solder ring mounting base). Finally, the solder ring mounting cover 2 and the solder ring mounting base 3 are inverted and inserted into the board connector. The solder ring mounting cover 2 is pushed to align with the solder ring mounting base 3 to the left (so that the solder ring control hole of the solder ring mounting cover is directly aligned with the solder ring mounting hole of the solder ring mounting base), allowing the pre-formed solder ring to be automatically installed onto the pins of the board connector, achieving rapid installation of the solder ring on the board connector. Therefore, this method can quickly complete the installation of pre-formed solder rings on all pins of the board connector in one go, laying the foundation for hot air soldering of the board connector and achieving high-quality, high-efficiency soldering of the board connector.

[0042] Figure 4 In the middle (a), the solder ring control hole of the solder ring mounting cover is not aligned with the solder ring mounting hole of the solder ring mounting base, and in the middle (b), the solder ring control hole of the solder ring mounting cover is aligned with the solder ring mounting hole of the solder ring mounting base.

[0043] It should be noted that, in this invention, the term "comprising" or any other variation thereof is intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus.

[0044] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A device for rapid installation of pre-formed solder rings based on inter-board connectors, characterized in that: Includes a solder ring mounting baffle (1), a solder ring mounting cover (2), and a solder ring mounting base (3); The tin ring mounting baffle (1) is made of aluminum plate and has a cavity at the bottom. The shape, size and depth of the cavity are consistent with the tin ring mounting seat (3). The tin ring mounting baffle has a slope on three circumferential sides and one side is horizontal. Inside the tin ring mounting baffle, the angle between the three circumferential sides and the horizontal plane is an obtuse angle. The solder ring mounting base (3) is machined with solder ring mounting holes, and the number and layout of the solder ring mounting holes are consistent with the pins of the inter-board connector; the solder ring mounting base (3) can be placed in the bottom cavity of the solder ring mounting baffle; The solder ring mounting cover (2) is machined with solder ring control holes, and the number and layout of the solder ring control holes are consistent with the pins of the board connector; the solder ring mounting cover (2) can be installed on the solder ring mounting surface of the solder ring mounting base (3), and the solder ring mounting cover (2) can slide left and right along the solder ring mounting base (3); Each solder ring mounting hole consists of an inner ring hole and an outer ring hole. The inner ring hole is a through hole with a diameter of D1, which is equal to the diameter of a single pin of the board connector. The outer ring hole is a non-through hole. The outer ring hole and the inner ring hole form a ring structure with a depth of H1, which is used to place the pre-formed solder ring. H1 is the height of the pre-formed solder ring. The diameter of the outer ring hole ranges from D3+0.2mm, where D3 is the diameter of the pre-formed solder ring in mm. It also includes a first comb-shaped limiting component (4) and a second comb-shaped limiting component (5); the first comb-shaped limiting component (4) and the second comb-shaped limiting component (5) form a cross structure for shaping the pins of the inter-board connector so that the spacing between all pins of the inter-board connector is the same and perpendicular to the plastic encapsulation body.

2. The device for rapid installation of pre-formed solder rings based on inter-board connectors according to claim 1, characterized in that: The substrate of the tin ring mounting base (3) is an epoxy glass cloth board.

3. The device for rapid installation of pre-formed solder rings based on inter-board connectors according to claim 1, characterized in that: Each tin ring control hole is a through hole with a diameter of D3, where D3 is the diameter of the pre-formed tin ring.

4. The device for rapid installation of pre-formed solder rings based on inter-board connectors according to claim 3, characterized in that: The solder ring mounting cover (2) can slide left and right 0.2mm on the solder ring mounting base (3).

5. The device for rapid installation of pre-formed solder rings based on inter-board connectors according to claim 4, characterized in that: The substrate of the tin ring mounting cover (2) is epoxy glass cloth board.

6. The device for rapid installation of pre-formed solder rings based on inter-board connectors according to claim 4, characterized in that: The first comb-type limiting component (4) has several comb tooth grooves machined at equal intervals, and each comb tooth groove is parallel to the other. The second comb-type limiting component (5) has several comb tooth grooves machined at equal intervals, and each comb tooth groove is parallel to the other. During installation, insert the first comb-shaped limiting component (4) and the second comb-shaped limiting component (5) into the inter-board connector from the left and right sides.

7. The device for rapid installation of pre-formed solder rings based on inter-board connectors according to claim 6, characterized in that: The acute angle between the first comb-shaped limiting component (4) and the second comb-shaped limiting component (5) forming a cross structure is 50°-60°.

8. The device for rapid installation of pre-formed solder rings based on inter-board connectors according to claim 6, characterized in that: Both the first comb-shaped limiting component (4) and the second comb-shaped limiting component (5) are machined with comb-shaped screw grooves on both sides. When the pins of the inter-board connector are being shaped, the fasteners of the inter-board connector are located in the comb-shaped screw grooves.

9. A method for rapid installation of pre-formed tin rings using the apparatus according to any one of claims 1-8, characterized in that... include: Place the solder ring mounting base into the bottom cavity of the solder ring mounting baffle, and pour the pre-formed solder ring into the solder ring mounting base through the three sloping sides of the solder ring mounting baffle. The pre-formed solder ring is manually placed on the solder ring mounting hole of the solder ring mounting base, and any excess pre-formed solder ring is placed on the horizontal surface of the solder ring mounting baffle. Remove the solder ring mounting base from the solder ring mounting baffle, and install the solder ring mounting cover on the solder ring mounting surface of the solder ring mounting base, so that the solder ring control hole of the solder ring mounting cover is not aligned with the solder ring mounting hole of the solder ring mounting base, thereby achieving the purpose of locking the solder ring. Inverted solder ring mount: Place the inverted solder ring mount on top of the inter-board connector, and make sure that the solder ring mounting holes of the solder ring mount correspond one-to-one with the pins of the inter-board connector. Slide the solder ring mounting cover so that the solder ring control hole of the solder ring mounting cover is aligned with the solder ring mounting hole of the solder ring mounting base. The pre-formed solder ring falls off and is fitted onto the corresponding pin, completing the quick installation of the pre-formed solder ring.

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