A wafer curing water cooling platform

Abstract

The invention discloses a wafer curing water-cooling platform, including a carrier and a lifting mechanism, wherein the carrier is arranged on a fixed frame, and the lifting mechanism is fixed to the lower part of the carrier, and is used to lift the wafer placed on the carrier; the carrier includes a water-cooling cavity, the bottom of which is sealed and connected by a sealing plate, and its sides are respectively provided with a water inlet pipe and a water outlet pipe; a wafer placement area is arranged at the front center of the water-cooling cavity, and a plurality of concentric circular grooves are evenly arranged on the wafer placement area, and two straight grooves are vertically arranged on the wafer placement area, and the two straight grooves are perpendicular to each other through the center of the circle, and a hole for the lifting mechanism claw to extend is arranged in the middle position of the wafer placement area; the interior of the water-cooling cavity is hollow, and water is injected through the water inlet pipe, and the water outlet pipe is drained, and the interior of the water-cooling cavity is circulating water, and the wafer of the carrier is water-cooled or heated by the internal circulating water. The device can effectively control the temperature of wafer curing.

Description

Technical Field

[0001] The invention relates to a wafer curing temperature control device, in particular to a wafer curing water cooling platform, and belongs to the technical field of wafer packaging. Background Art

[0002] At present, ultraviolet (UV) curing is usually used for wafer curing during the curing stage. However, the use of single UV curing will cause the temperature of the wafer surface to gradually rise, and the surface temperature of the wafer is difficult to control. If the temperature is not well controlled, it will affect the curing effect of the wafer and increase the defective rate of the product. Therefore, air cooling control is currently used for temperature control of wafer curing. However, the wafer has very high requirements for environmental cleanliness during the curing process. Air cooling curing will cause dust pollution on the wafer surface and increase the defective rate of the wafer. Summary of the invention

[0003] The object of the present invention is to provide a wafer curing water cooling platform, which can effectively control the temperature of wafer curing.

[0004] To achieve the above object, the technical solution adopted by the present invention is a wafer curing water cooling platform, comprising a carrier and a lifting mechanism, wherein the carrier is arranged on a fixed frame, and the lifting mechanism is fixed to the lower part of the carrier, and is used to lift the wafer placed on the carrier;

[0005] The carrier includes a water-cooling cavity, the bottom of which is sealed by a sealing plate, and the sides of which are respectively provided with a water inlet pipe and a water outlet pipe;

[0006] A wafer placement area is provided at the front center of the water-cooling chamber, a plurality of concentric circular grooves are evenly spaced on the wafer placement area, and two straight grooves are vertically provided on the wafer placement area, the two straight grooves are perpendicular to each other through the center of the circle, and a hole for the lifting mechanism claw to extend is provided in the middle of the wafer placement area;

[0007] The interior of the water cooling cavity is hollow, water is injected through a water inlet pipe, and water is discharged through a water outlet pipe. The interior of the water cooling cavity is filled with circulating water, and the wafer on the carrier is water-cooled or heated by the internal circulating water.

[0008] In this patent, the temperature of the solidified wafer is mainly controlled by water cooling. Generally, the temperature of the water cooling platform needs to be controlled at 30℃-50℃. If the temperature sensor senses that the temperature of the water cooling platform is not within the temperature range, the temperature will be controlled within the required temperature range through an external circulation pump (the circulation pump is an external device and is not an innovation point of this patent, so the relevant drawings are not provided, and only its auxiliary function is described), thereby ensuring that the temperature of the water cooling platform is within the required range.

[0009] Preferably, the two mutually perpendicular linear grooves evenly break the plurality of circular grooves, so that the linear grooves and the circular grooves are interconnected to form a vacuum-breaking groove. The vacuum-breaking groove is used to quickly break the vacuum of the product. When the wafer needs to be taken away, the vacuum-breaking groove is formed by the linear grooves and the circular grooves on the carrier, which can well break the vacuum of the product, so that the robot arm can take the wafer away without damaging the product due to the vacuum not being broken.

[0010] Preferably, a plurality of offset detection vacuum holes are arranged on the outer circumference of the wafer placement area. When the wafer is offset, the offset detection vacuum holes will alarm to prompt that the wafer is offset.

[0011] Preferably, a plurality of wafer adsorption vacuum holes are evenly spaced on the wafer placement area. In order to better fix the wafer, wafer adsorption vacuum holes are provided on the wafer placement area to adsorb the wafer and prevent the wafer from shifting during the curing process.

[0012] Preferably, a plurality of arc-shaped bosses are formed on the wafer placement area through circular grooves and linear grooves, the wafer adsorption vacuum holes are arranged on the bosses, and the wafer adsorption vacuum holes and the offset detection vacuum holes are respectively controlled by solenoid valves arranged at the bottom of the sealing plate.

[0013] Preferably, a water injection area is provided on the back of the carrier, and a plurality of fin-shaped convex strips, a middle partition and a receiving portion are integrally provided in the water injection area, so that the middle partition divides the water injection area into two water circulation areas, and the lifting mechanism passes through the middle partition, and the offset detection vacuum hole and the wafer adsorption vacuum hole are respectively provided on the fin-shaped convex strips and the receiving portion. Because a water injection area is provided in the water-cooling cavity, the offset detection vacuum hole and the wafer adsorption vacuum hole can only be provided on the fin-shaped convex strips and the receiving portion.

[0014] Preferably, the protruding heights of the fin-shaped convex strips, the middle partition and the accommodating portion are consistent with the surface height of the carrier, and the sealing plate is sealed and connected to the back of the carrier to form a water-cooling cavity.

[0015] In this technical solution, a plurality of fin-shaped convex strips are provided in the water cooling cavity for drainage, so that the water flow in the water cooling cavity is more evenly distributed and the heat dissipation is uniformly achieved. The wafer on the water cooling platform can be cooled or heated faster and more evenly.

[0016] Preferably, a cavity extending to the interior of the accommodating portion is provided on the side of the carrier, and a temperature sensor is provided in the cavity. The temperature sensor is used to sense the water temperature in the water-cooling cavity to ensure that the water temperature is controlled within a required range.

[0017] Preferably, two illuminometers are arranged on the carrier to collect data of the irradiation light generated by the UV lamp and sense the illuminance of the wafer curing surface.

[0018] Preferably, a leakage liquid receiving box is fixedly connected to the bottom of the carrier, the leakage liquid receiving box is drawer-shaped and extends out of the carrier, and the bottom surface of the leakage liquid receiving box has an inclined portion.

[0019] Preferably, a liquid leakage sensor is arranged in the leakage liquid receiving box, and a liquid leakage port is provided on the lower slope surface of the inclined portion of the leakage liquid receiving box;

[0020] The leakage liquid receiving box is provided with a supporting groove for supporting the water inlet pipe and the water outlet pipe, and the portion of the leakage liquid receiving box extending out of the carrier is provided with a cover plate.

[0021] In order to prevent liquid leakage in the water-cooling cavity, a leakage box is set at the bottom of the carrier. A leakage sensor is set in the leakage box to sense whether there is a leakage. If there is a leakage, an alarm will be sounded. The staff can collect the leaked liquid through the leakage port to ensure the safety of the equipment.

[0022] Preferably, the lifting mechanism comprises a servo motor, a lifting electric cylinder and a PIN, the servo motor is connected to the lifting electric cylinder, a carrier plate is fixedly provided at the output end of the lifting electric cylinder, and the PIN is fixed on the carrier plate.

[0023] Preferably, three PINs are provided and distributed in a triangle, and an anti-static suction cup is provided at the free end of each PIN.

[0024] This patent controls the lifting of the lifting cylinder through a servo motor, thereby driving the lifting of the PIN. In this patent, PIN represents a support column. The free end of the PIN is provided with an anti-static suction cup for adsorbing the wafer. The suction or blowing is controlled by an external solenoid valve to adsorb or release the anti-static suction cup, thereby controlling the adsorption or release of the wafer.

[0025] Preferably, the PIN is cylindrical and has a hollow hole in the center. A suction cup mounting groove is built into the free end of the PIN. The anti-static suction cup is installed in the suction cup mounting groove. The upper port of the suction cup mounting groove is open, and the lower port is narrowed and integrally formed with the upper port of the hollow hole. The lower port of the hollow hole has an L-shaped lower port, and the L-shaped lower port is connected to an air pipe joint for connecting to an external solenoid valve.

[0026] In this patent, the center of the PIN has a cavity for ventilation. The upper end of the cavity is connected to the anti-static suction cup, and the lower end has an L-shaped lower port connected to the air pipe joint. The air pipe joint is connected to an external solenoid valve. The airflow in the center of the PIN is controlled by the solenoid valve to achieve adsorption or release of the anti-static suction cup.

[0027] Beneficial effects of the invention: The water-cooling platform of the patent has a water-cooling cavity, which is filled with water. The surface of the water-cooling platform is heated or cooled by controlling the temperature of the liquid, thereby ensuring the constant temperature requirement during the wafer curing process. By designing the internal structure of the water-cooling cavity, the water-cooling platform has a better and more uniform temperature control effect. The carrier of the patent also makes structural innovations for wafer placement, making the wafer more stable during the curing process and achieving a better curing effect.

[0028] By controlling the temperature of the liquid to heat or cool the surface of the water cooling platform, the environment for wafer curing is always kept in a constant temperature environment. The temperature of wafer curing is controlled by water cooling, which ensures the cleanliness of the wafer during curing, has a good temperature control effect, and the liquid is recycled, which is not only energy-saving but also environmentally friendly. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the technical solution of the present invention, the drawings required to be used in the embodiments or the description of the prior art are briefly introduced below.

[0030] Figure 1 It is a schematic diagram of the structure of the present invention (with wafer);

[0031] Figure 2 This is a schematic diagram of the water cooling platform structure of the present invention (without wafers);

[0032] Figure 3 for Figure 3 A schematic diagram of the side structure of

[0033] Figure 4 is a schematic diagram of the structure of the carrier;

[0034] Figure 5 for Figure 4 A top view of

[0035] Figure 6 for Figure 4 Bottom view of

[0036] Figure 7 is a schematic diagram of the structure of the carrier;

[0037] Figure 8 Schematic diagram of the internal structure of the platform;

[0038] Fig. 9 It is a schematic diagram of the local structure of the present invention;

[0039] Fig.10 It is a structural schematic diagram of the jacking mechanism;

[0040] Fig.11 It is a schematic diagram of the structure of PIN;

[0041] Fig.12 It is the main view of PIN;

[0042] Fig.13 for Fig.12 Cross-section of the middle AA; DETAILED DESCRIPTION

[0043] In order to enable persons skilled in the art to better understand the technical solutions in the present application, the technical solutions in the present application will be clearly and completely described below in conjunction with embodiments.

[0044] The present invention discloses a wafer curing water cooling platform, comprising a carrier 1 and a lifting mechanism 2, wherein the carrier 1 is arranged on a fixing frame 3, and the lifting mechanism 2 is fixed to the lower part of the carrier 1 and is used to lift a wafer 4 placed on the carrier 1;

[0045] The carrier 1 includes a water-cooling cavity 5, the bottom of which is sealed by a sealing plate 6, and the sides of which are respectively provided with a water inlet pipe 7 and a water outlet pipe 8;

[0046] A wafer placement area 9 is provided at the front center of the water-cooling chamber 5, and a plurality of concentric circular grooves 10 are evenly spaced on the wafer placement area 9, and two straight grooves 11 are vertically provided on the wafer placement area 9, and the two straight grooves 11 are perpendicular to each other through the center of the circle, and a hole 12 for the claw of the lifting mechanism 2 to extend is provided in the middle position of the wafer placement area 9;

[0047] The water cooling cavity 5 is hollow inside, water is injected through the water inlet pipe 7 and drained through the water outlet pipe 8 , and the water cooling cavity 5 is filled with circulating water, and the wafer 4 on the carrier 1 is water-cooled or heated by the internal circulating water.

[0048] The two mutually perpendicular linear grooves 11 evenly break the plurality of circular grooves 10, so that the linear grooves 11 and the circular grooves 10 are interconnected to form a vacuum-breaking groove. The function of the vacuum-breaking groove is to quickly break the vacuum of the product. When the wafer needs to be taken away, the external electromagnetic valve controls the blowing of air to the carrier. The vacuum-breaking groove formed by these linear grooves and circular grooves on the carrier can well break the vacuum of the product, so that the robot arm can take the wafer away without damaging the product due to the failure to break the vacuum.

[0049] A plurality of offset detection vacuum holes 13 are arranged on the outer circumference of the wafer placement area 9. When the wafer is offset, the offset detection vacuum holes will alarm to prompt that the wafer is offset.

[0050] The wafer placement area 9 is evenly spaced with a plurality of wafer adsorption vacuum holes 14. In order to better fix the wafer, the wafer adsorption vacuum holes are arranged on the wafer placement area to adsorb the wafer and prevent the wafer from shifting during the curing process.

[0051] The wafer placement area 9 is provided with a plurality of arc-shaped bosses 15 through circular grooves 10 and linear grooves 11 , and the wafer adsorption vacuum holes 14 are arranged on the bosses 15 , and the wafer adsorption vacuum holes 14 and the offset detection vacuum holes 13 are respectively controlled by electromagnetic valves 16 arranged at the bottom of the sealing plate 6 .

[0052] A water injection area 17 is provided on the back side of the carrier 1, and a plurality of fin-shaped protrusions 18, a middle partition 19 and a receiving portion 20 are integrally provided in the water injection area 17, so that the middle partition 19 divides the water injection area 17 into two water circulation areas, and the lifting mechanism 2 passes through the middle partition 19, and the offset detection vacuum hole 13 and the wafer adsorption vacuum hole 14 are respectively provided on the fin-shaped protrusion 18 and the receiving portion 20.

[0053] The protruding heights of the fin-shaped convex strip portion 18 , the middle partition portion 19 and the accommodating portion 20 are consistent with the surface height of the carrier 1 , and the sealing plate 6 is sealed and connected to the back of the carrier 1 to form a water-cooling cavity 5 .

[0054] In this technical solution, a plurality of fin-shaped convex strips are provided in the water cooling cavity for drainage, so that the water flow in the water cooling cavity is more evenly distributed and the heat dissipation is uniformly achieved. The wafer on the water cooling platform can be cooled or heated faster and more evenly.

[0055] The side of the carrier 1 is provided with a cavity extending to the interior of the accommodating portion 20, and the cavity is provided with a temperature sensor 21. The temperature sensor is used to sense the water temperature in the water-cooling cavity to ensure that the water temperature is controlled within a required range.

[0056] Two illuminometers 22 are arranged on the stage 1 to collect data of the irradiation light generated by the UV lamp and sense the illuminance of the wafer curing surface.

[0057] A leakage liquid receiving box 23 is fixedly connected to the bottom of the carrier 1. The leakage liquid receiving box 23 is drawer-shaped and extends out of the carrier. The bottom surface of the leakage liquid receiving box 23 has an inclined portion 24.

[0058] A liquid leakage sensor 25 is provided in the leakage liquid receiving box 23, and a liquid leakage port 26 is provided on the lower slope surface of the inclined portion 24 of the leakage liquid receiving box 23;

[0059] The leakage liquid receiving box 23 is provided with a support groove 27 for supporting the water inlet pipe 7 and the water outlet pipe 8 , and the portion of the leakage liquid receiving box 23 extending out of the carrier 1 is provided with a cover plate 28 .

[0060] In order to prevent liquid leakage in the water-cooling cavity, a leakage box is set at the bottom of the carrier. A leakage sensor is set in the leakage box to sense whether there is a leakage. If there is a leakage, an alarm will be sounded. The staff can collect the leaked liquid through the leakage port to ensure the safety of the equipment.

[0061] The lifting mechanism 2 includes a servo motor 29 , a lifting cylinder 30 and a PIN 31 . The servo motor 29 is connected to the lifting cylinder 30 . A carrier plate 32 is fixedly disposed at the output end of the lifting cylinder 30 . The PIN 31 is fixed on the carrier plate 32 .

[0062] There are three PINs 31 distributed in a triangle, and an anti-static suction cup 33 is provided at the free end of each PIN 31 .

[0063] This patent controls the lifting of the lifting cylinder through a servo motor, thereby driving the lifting of the PIN. In this patent, PIN represents a support column. The free end of the PIN is provided with an anti-static suction cup for adsorbing the wafer. The suction or blowing is controlled by an external solenoid valve to adsorb or release the anti-static suction cup, thereby controlling the adsorption or release of the wafer.

[0064] The PIN 31 is cylindrical and has a hollow hole 34 at its center. A suction cup mounting groove 35 is built into the free end of the PIN 31. The anti-static suction cup 33 is installed in the suction cup mounting groove 35. The upper end of the suction cup mounting groove 35 is open, and the lower end is narrowed and integrally formed with the upper end of the hollow hole 34. The lower end of the hollow hole 34 has an L-shaped lower end 36, and the L-shaped lower end 36 is connected to an air pipe joint 37 for connecting to an external solenoid valve.

[0065] In this patent, the center of the PIN has a cavity for ventilation. The upper end of the cavity is connected to the anti-static suction cup, and the lower end has an L-shaped lower port connected to the air pipe joint. The air pipe joint is connected to an external solenoid valve. The airflow in the center of the PIN is controlled by the solenoid valve to achieve adsorption or release of the anti-static suction cup.

[0066] In this patent, the temperature environment for wafer curing is 30℃-50℃, so the working temperature of the carrier for placing the wafer also needs to be maintained at 30℃-50℃. Therefore, water cooling is used in this patent to control the temperature of the liquid. To this end, the carrier of this patent has a water-cooling cavity for water injection. At the same time, a water inlet pipe and a water outlet pipe are arranged on the carrier. The water inlet pipe and the water outlet pipe are controlled by an external circulation pump, and the water pump has the function of heat preservation and temperature regulation. At the same time, the water injected into the water-cooling cavity is filtered out of impurities in the liquid by the pump. Therefore, the water entering the water-cooling cavity is a clean liquid without impurities. If the temperature sensor senses that the water temperature is lower than 30℃, the circulation pump starts to work to heat the water. If the water temperature is higher than 50℃, the circulation pump starts to work to cool the water. This patent uses liquid water to control the temperature of the horizontal platform, which is not only energy-saving but also environmentally friendly.

[0067] The described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

Claims

1. A wafer curing water cooling platform, characterized in that: It comprises a carrier (1) and a lifting mechanism (2), wherein the carrier (1) is arranged on a fixing frame (3), and the lifting mechanism (2) is fixed to the lower part of the carrier (1) and is used for lifting a wafer (4) placed on the carrier (1); The carrier (1) comprises a water-cooling cavity (5), the bottom of the water-cooling cavity (5) is sealed via a sealing plate (6), and the sides thereof are respectively provided with a water inlet pipe (7) and a water outlet pipe (8); A wafer placement area (9) is provided at the center of the front side of the water-cooling chamber (5); a plurality of concentric circular grooves (10) are evenly spaced on the wafer placement area (9); and two straight grooves (11) are vertically provided on the wafer placement area (9); the two straight grooves (11) are perpendicular to each other through the center of the circle; and a hole (12) for the claw of the lifting mechanism (2) to extend is provided in the middle of the wafer placement area (9); The water cooling cavity (5) is hollow inside, water is injected through a water inlet pipe (7), and water is discharged through a water outlet pipe (8), and the inside of the water cooling cavity (5) is filled with circulating water, and the wafer (4) on the carrier (1) is water-cooled or heated by the internal circulating water; A water injection area (17) is provided on the back of the carrier (1), and a plurality of fin-shaped convex strips (18), a middle partition (19) and a receiving portion (20) are integrally provided in the water injection area (17), the middle partition (19) divides the water injection area (17) into two water circulation areas, and the lifting mechanism (2) passes through the middle partition (19), and the offset detection vacuum hole (13) and the wafer adsorption vacuum hole (14) are respectively provided on the fin-shaped convex strips (18) and the receiving portion (20); The protruding heights of the fin-shaped convex strip portion (18), the middle partition portion (19) and the accommodating portion (20) are consistent with the surface height of the carrier (1), and the sealing plate (6) is sealed and connected to the back of the carrier (1) to form a water-cooling cavity (5).

2. The wafer curing water cooling platform according to claim 1, characterized in that: The two mutually perpendicular straight grooves (11) evenly divide the plurality of circular grooves (10), so that the straight grooves (11) and the circular grooves (10) are interconnected to form vacuum-breaking grooves.

3. The wafer curing water cooling platform according to claim 1, characterized in that: A plurality of offset detection vacuum holes (13) are arranged on the outer circumference of the wafer placement area (9).

4. The wafer curing water cooling platform according to claim 2 or 3, characterized in that: A plurality of wafer adsorption vacuum holes (14) are evenly spaced on the wafer placement area (9).

5. The wafer curing water cooling platform according to claim 4, characterized in that: A plurality of arc-shaped bosses (15) are formed on the wafer placement area (9) via circular grooves (10) and linear grooves (11); the wafer adsorption vacuum holes (14) are arranged on the bosses (15); and the wafer adsorption vacuum holes (14) and the offset detection vacuum holes (13) are respectively controlled by electromagnetic valves (16) arranged at the bottom of the sealing plate (6).

6. The wafer curing water cooling platform according to claim 1, characterized in that: A cavity extending into the interior of the accommodating portion (20) is provided on the side of the carrier (1), and a temperature sensor (21) is provided in the cavity.

7. The wafer curing water cooling platform according to claim 1, characterized in that: Two illuminometers (22) are arranged on the carrier (1).

8. The wafer curing water cooling platform according to claim 1, characterized in that: A leaking liquid receiving box (23) is also fixedly connected to the bottom of the carrier (1); the leaking liquid receiving box (23) is drawer-shaped and extends out of the carrier (1); and the bottom surface of the leaking liquid receiving box (23) is provided with an inclined portion (24).

9. The wafer curing water cooling platform according to claim 8, characterized in that: A liquid leakage sensor (25) is arranged in the liquid leakage receiving box (23), and a liquid leakage port (26) is provided on the lower slope surface of the inclined portion (24) of the liquid leakage receiving box (23); The leakage liquid receiving box (23) is provided with a support groove (27) for providing support for the water inlet pipe (7) and the water outlet pipe (8), and the portion of the leakage liquid receiving box (23) extending out of the carrier (1) is provided with a cover plate (28).

10. The wafer curing water cooling platform according to any one of claims 6 to 9, characterized in that: The lifting mechanism (2) comprises a servo motor (29), a lifting electric cylinder (30) and a PIN (31); the servo motor (29) is connected to the lifting electric cylinder (30); a carrier plate (32) is fixedly provided at the output end of the lifting electric cylinder (30); and the PIN (31) is fixed on the carrier plate (32).

11. The wafer curing water cooling platform according to claim 10, characterized in that: The PINs (31) are provided in three numbers and distributed in a triangle, and an anti-static suction cup (33) is provided at the free end of each PIN (31).

12. The wafer curing water cooling platform according to claim 11, characterized in that: The PIN (31) is cylindrical and has a hollow hole (34) at its center. A suction cup mounting groove (35) is built into the free end of the PIN (31). The anti-static suction cup (33) is mounted in the suction cup mounting groove (35). The upper end of the suction cup mounting groove (35) is open, and the lower end is narrowed and integrally formed with the upper end of the hollow hole (34). The lower end of the hollow hole (34) has an L-shaped lower end (36). The L-shaped lower end (36) is connected to an air pipe joint (37) for connecting to an external electromagnetic valve.

Images