Light source module and projector

Abstract

The present application provides a light source module, which includes a heat sink, a laser assembly, a circuit board assembly, a conductive material and a plurality of fasteners. The circuit board assembly includes a circuit board, and a receiving opening of the circuit board corresponds to a light emitter of the laser assembly. The fasteners sequentially pass through a third fastener hole of the circuit board assembly, a second fastener hole of the laser assembly and a first fastener hole of the heat sink, so as to fasten the circuit board assembly and the laser assembly to the heat sink. The receiving opening exposes the light emitter, and two plated through holes of the circuit board correspond to two conductive pads of the laser assembly. The conductive material connects the two conductive pads and the two plated through holes, so as to electrically connect the laser assembly and the circuit board assembly. The present application provides a projector including the light source module, which can reduce production cost.

Description

TECHNICAL FIELD

[0001] The present invention relates to a light source module and a projector, and particularly relates to a light source module with lower production cost and a projector using the same. BACKGROUND

[0002] At present, the way to fix the laser light emitter on the printed circuit board is to weld a female connector on the printed circuit board and a male connector on the laser assembly. Then, the printed circuit board is locked on the heat sink by a set of screws and the laser assembly is locked on the heat sink by another set of screws. After that, the external connector on the printed circuit board is connected by a wire, and the laser light emitter is powered to generate a light beam through the current passing through the circuit on the printed circuit board, the female connector, the male connector and the laser light emitter. However, the above setting method needs to use one male connector and one female connector. In addition, in order to prevent the printed circuit board and the laser assembly from being loose and to avoid poor contact, two sets of screws are used to lock the printed circuit board and the laser assembly on the heat sink, respectively. In this way, the above setting method needs to spend more connector cost and screw positioning processing cost.

[0003] The background section is included only to provide understanding of the present invention and is not to be used to construe the prior art. The content of the background section does not constitute the known art that is already known to those skilled in the art. SUMMARY

[0004] The present invention provides a light source module with lower production cost.

[0005] The present invention also provides a projector including the above light source module, which can reduce the production cost.

[0006] Other objects and advantages of the present invention can be further understood from the technical features disclosed by the present invention.

[0007] To achieve one, part, or all of the above objectives or other objectives, one embodiment of the present invention provides a light source module, which includes a heat sink, a laser assembly, a circuit board assembly, a conductive material, and a plurality of locking members. The heat sink has a plurality of first locking holes. The laser assembly includes a light emitter and two conductive pads. The two conductive pads couple the light emitters, and the laser assembly has a plurality of second locking holes. The circuit board assembly includes a circuit board, and the circuit board has a receiving opening, two electroplated through holes, and a plurality of third locking holes. The receiving opening connects the two electroplated through holes. The receiving opening of the circuit board corresponds to the light emitter of the laser assembly. The locking member passes through the third locking hole of the circuit board assembly, the second locking hole of the laser assembly, and the first locking hole of the heat sink in sequence, thereby locking the circuit board assembly and the laser assembly to the heat sink. The receiving opening of the circuit board exposes the light emitter, and the two electroplated through holes correspond to the two conductive pads respectively. The conductive material connects the two conductive pads and the two electroplated through holes, thereby electrically connecting the laser assembly to the circuit board assembly.

[0008] To achieve one, some, or all of the above objectives, or other objectives, one embodiment of the present invention provides a projector comprising an illumination module, a light valve, and a projection lens. The illumination module is configured to provide an illumination beam and includes a light source module. The light source module is configured to provide a laser beam, wherein the illumination beam includes a laser beam. The light source module includes a heat sink, a laser assembly, a circuit board assembly, a conductive material, and a plurality of locking members. The heat sink has a plurality of first locking holes. The laser assembly includes an emitter and two conductive pads. The two conductive pads are coupled to the emitter, and the laser assembly has a plurality of second locking holes. The circuit board assembly includes a circuit board, which has a receiving opening, two plated through-holes, and a plurality of third locking holes. The receiving opening connects the two plated through-holes. The receiving opening of the circuit board corresponds to the emitter of the laser assembly. The locking member passes through the third locking hole of the circuit board assembly, the second locking hole of the laser assembly, and the first locking hole of the heat sink, respectively, to secure the circuit board assembly and the laser assembly to the heat sink. The receiving opening of the circuit board exposes the emitter, and the two plated through-holes correspond to the two conductive pads, respectively. Conductive material connects the two conductive pads to the two plated through-holes, electrically connecting the laser assembly to the circuit board assembly. A light valve is positioned in the path of the illumination beam to convert the illumination beam into an image beam. A projection lens is positioned in the path of the image beam to project the image beam out of the projector.

[0009] Based on the above, the embodiments of the present invention have at least one of the following advantages or effects. In the design of the light source module of the present invention, the locking piece passes through the third locking hole of the circuit board assembly, the second locking hole of the laser assembly, and the first locking hole of the heat sink in sequence, thereby locking the circuit board assembly and the laser assembly to the heat sink. Thereby, the light source module of the present invention can reduce the tapping processing cost on the heat sink and the cost of using the locking piece. Furthermore, the accommodating opening of the circuit board exposes the light emitter, and the conductive material connects the two conductive pads and the two plated through holes, thereby electrically connecting the laser assembly to the circuit board assembly. Thereby, the light source module of the present invention does not need to use male connectors and female connectors, so the production cost is lower. In addition, a projector using the light source module of the present invention can effectively reduce production costs.

[0010] In order to make the above features and advantages of the present invention more clearly understood, embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 is a schematic diagram of a projector according to an embodiment of the present invention.

[0012] Figure 2A yes Figure 1 A three-dimensional schematic diagram of a light source module of a projector.

[0013] Figure 2B yes Figure 2A A three-dimensional exploded schematic diagram of the light source module.

[0014] Figure 2C yes Figure 2A A partial side view schematic diagram of a light source module. DETAILED DESCRIPTION

[0015] The foregoing and other technical aspects, features, and benefits of the present invention will be more clearly understood in the following detailed description of a preferred embodiment with reference to the accompanying drawings. Directional terms (e.g., up, down, left, right, front, or back, etc.) mentioned in the following embodiments refer only to the directions in the accompanying drawings. Therefore, the directional terms used are for illustrative purposes only and are not intended to limit the present invention.

[0016] Figure 1 is a schematic diagram of a projector according to an embodiment of the present invention. Figure 1In this embodiment, the projector 10 includes an illumination module 12, a light valve 14, and a projection lens 16. The illumination module 12 is configured to provide an illumination beam L1 and includes a light source module 100. The light source module 100 is configured to provide a laser beam L', and the illumination beam L1 includes a laser beam L'. The light valve 14 is disposed in the transmission path of the illumination beam L1 to convert the illumination beam L1 into an image beam L2. The projection lens 16 is disposed in the transmission path of the image beam L2 from the light valve 14 to project the image beam L2 out of the projector 10.

[0017] Specifically, the light valve 14 used in this embodiment is a reflective light modulator, such as a Liquid Crystal-On-Silicon (LCoS) panel or a digital micro-mirror device (DMD). In one embodiment, the light valve 14 is a transmissive light modulator, such as a transparent liquid crystal panel, an electro-optical modulator, a magneto-optical modulator, or an acousto-optic modulator (AOM). However, this embodiment does not limit the form or type of the light valve 14. The detailed steps and implementation of the method by which the light valve 14 modulates the illumination beam L1 into the image beam L2 are sufficient to provide sufficient teachings, suggestions, and implementations based on common knowledge in the art, and are therefore not further described. Furthermore, the projection lens 16 may include, for example, a combination of one or more optical lenses having a refractive power, such as various combinations of non-planar lenses, such as biconcave lenses, biconvex lenses, meniscus lenses, convex-concave lenses, plano-convex lenses, and plano-concave lenses. In one embodiment, the projection lens 16 may also include a planar optical lens, which converts the image beam L2 from the light valve 14 into a projection beam by reflection or transmission, and projects the beam out of the projector 10. The present embodiment does not limit the form or type of the projection lens 16.

[0018] Figure 2A yes Figure 1 A three-dimensional schematic diagram of a light source module of a projector. Figure 2B yes Figure 2A A three-dimensional exploded schematic diagram of the light source module. Figure 2C yes Figure 2A For the convenience of explanation, Figure 2A and Figure 2B The conductive material is omitted.

[0019] Please also refer to Figure 2A 、 Figure 2B as well as Figure 2C In this embodiment, the light source module 100 includes a heat sink 110, a laser assembly 120, a circuit board assembly 130, a conductive material 140, and a plurality of locking members 150. The heat sink 110 has a plurality of first locking holes 112. The laser assembly 120 includes a light emitter 124 and two conductive pads 126. The two conductive pads 126 are coupled to the light emitter 124, and the laser assembly 120 has a plurality of second locking holes 122. The circuit board assembly 130 includes a circuit board 131, and the circuit board 131 has a receiving opening 134, two plated through holes 136, and a plurality of third locking holes 132. The receiving opening 134 communicates with the two plated through holes 136, and the receiving opening 134 of the circuit board 131 corresponds to the light emitter 124 of the laser assembly 120.

[0020] Specifically, the locking member 150 can sequentially pass through the third locking hole 132 of the circuit board assembly 130, the second locking hole 122 of the laser assembly 120, and the first locking hole 112 of the heat sink 110, thereby securing the circuit board assembly 130 and the laser assembly 120 to the heat sink 110. Here, the number of locking members 150 is specifically two, and there are also two third locking holes 132, two second locking holes 122, and two first locking holes 112. The two third locking holes 132 on the circuit board 131 are, for example, located at the upper and lower sides of the receiving opening 134, respectively. The two second locking holes 122 of the laser assembly 120 correspond to the two third locking holes 132, respectively, and are located at the upper and lower sides of the light emitter 124, respectively. The two first locking holes 112 of the heat sink 110 correspond to the two second locking holes 122, respectively. The locking members 150 are, for example, multiple screws or bolts. In other words, only two first locking holes 112 need to be formed on the heat sink 110, and the circuit board assembly 130 and the laser assembly 120 can be locked to the heat sink 110 via two locking members 150. Compared to the prior art, which requires separate openings for the printed circuit board and the laser assembly, the design of the light source module 100 of this embodiment can effectively reduce the cost of tapping the heat sink 110 and reduce the number of locking members 150 used, thereby reducing operating costs.

[0021] Please refer to Figure 2B and Figure 2CIn this embodiment, the receiving opening 134 of the circuit board 131 exposes the light emitter 124 of the laser assembly 120, and the two plated through holes 136 of the circuit board 131 correspond to the two conductive pads 126 of the laser assembly 120. In particular, the conductive material 140 connects the two conductive pads 126 and the two plated through holes 136, thereby electrically connecting the laser assembly 120 to the circuit board assembly 130. In other words, in this embodiment, the laser assembly 120 is electrically connected via the conductive material 140, and then electrically connected to the circuit board assembly 130. Here, the conductive material 140 is, for example, solder paste, but is not limited thereto. Compared to the prior art of electrical connection using male and female connectors, the light source module 100 of this embodiment can effectively reduce production costs.

[0022] Furthermore, the laser assembly 120 of this embodiment further includes a plate 121, wherein the second locking hole 122 is disposed on the plate 121, and the light emitter 124 and the two conductive pads 126 are disposed on one side of the plate 121. Figure 2B As shown, the size of the plate body 121 is smaller than that of the circuit board 131 , so when the locking member 150 is locked, a portion of the plate body 121 is sandwiched between the circuit board 131 and the heat sink 110 .

[0023] Furthermore, please refer to Figure 2B In this embodiment, the heat sink 110 has a plurality of guide members 118, each located adjacent to the first locking hole 112. The plate 121 of the laser assembly 120 has a plurality of first guide holes 128, each located adjacent to the second locking hole 122. The diameter D1 of each first guide hole 128 is smaller than the diameter D2 of each second locking hole 122. The circuit board 131 of the circuit board assembly 130 has a plurality of second guide holes 138, each located adjacent to the third locking hole 132. The diameter D3 of each second guide hole 138 is smaller than the diameter D4 of each third locking hole 132. When assembling the laser assembly 120 and the circuit board assembly 130 , the guide member 118 of the heat sink 110 passes through the first guide hole 128 of the plate body 121 and the second guide hole 138 of the circuit board 131 in sequence, thereby guiding the laser assembly 120 and the circuit board assembly 130 to be disposed on the heat sink 110 .

[0024] Furthermore, the circuit board assembly 130 of this embodiment further includes a connector 135, which is disposed on and coupled to the circuit board 131. The connector 135 is used to provide power via a wire, and transmits power through two plated through-holes 136 of the circuit board 131, the conductive material 140, and the two conductive pads 126 to the light emitter 124 of the laser assembly 120, causing the light emitter 124 to emit a laser beam. In this embodiment, the light emitter 124 may be, for example, a laser diode or a laser diode array.

[0025] During assembly, the laser assembly 120 is first placed on the heat sink 110. The receiving opening 134 of the circuit board 131 is aligned with the light emitter 124 of the laser assembly 120, exposing the light emitter 124. A portion of the board 121 of the laser assembly 120 is sandwiched between the circuit board 131 and the heat sink 110. Next, the third locking hole 132 of the circuit board 131 corresponds to the second locking hole 122 of the laser assembly 120 and the first locking hole 112 of the heat sink 110, respectively. The two plated through holes 136 of the circuit board 131 correspond to the two conductive pads 126 of the laser assembly 120. Next, the locking member 150 is inserted sequentially through the third locking hole 132, the second locking hole 122, and the first locking hole 112, securing the circuit board assembly 130 and the laser assembly 120 to the heat sink 110. Next, two plated through-holes 136 on circuit board 131 and two conductive pads 126 of laser assembly 120 are soldered together using conductive material 140, electrically connecting circuit board assembly 130 to laser assembly 120. Finally, power is supplied to connector 135 on circuit board assembly 130 via wires. This power is then transmitted to light emitter 124 of laser assembly 120 via two plated through-holes 136, conductive material 140, and two conductive pads 126, causing light emitter 124 to emit a laser beam.

[0026] In short, the circuit board assembly 130 and the laser assembly 120 of this embodiment utilize the same set of locking holes (i.e., the first locking holes) on the heat sink 110. Therefore, the light source module 100 of this embodiment can reduce the cost of tapping the heat sink 110 and the cost of using the locking member 150. Furthermore, the two plated through-holes 136 on the circuit board 131 and the two conductive pads 126 of the laser assembly 120 are electrically connected via the conductive material 140. Then, when power is supplied to the wire connector 135, current is transmitted through the two plated through-holes 136, the conductive material 140, and the two conductive pads 126 to the light emitter 124 of the laser assembly 120, thereby causing the light emitter 124 to emit a laser beam. Consequently, the light source module 100 of this embodiment eliminates the need for male and female connectors, resulting in lower production costs.

[0027] In summary, the embodiments of the present invention have at least one of the following advantages or effects. In the design of the light source module of the present invention, the locking piece passes through the third locking hole of the circuit board assembly, the second locking hole of the laser assembly, and the first locking hole of the heat sink in sequence, thereby locking the circuit board assembly and the laser assembly to the heat sink. Thereby, the light source module of the present invention can reduce the tapping processing cost on the heat sink and the cost of using the locking piece. Furthermore, the accommodating opening of the circuit board exposes the light emitter, and the conductive material connects the two conductive pads and the two plated through holes, thereby electrically connecting the laser assembly to the circuit board assembly. Thereby, the light source module of the present invention does not need to use male connectors and female connectors, so the production cost is lower. In addition, a projector using the light source module of the present invention can effectively reduce production costs.

[0028] The above description is only a preferred embodiment of the present invention, and it cannot be used to limit the scope of implementation of the present invention. That is, all simple equivalent changes and modifications made in accordance with the claims and the description of the invention still fall within the scope of the patent of the present invention. In addition, any embodiment or claim of the present invention does not need to achieve all the purposes, advantages or features disclosed in the present invention. In addition, the abstract of the specification and the name of the invention are only used to assist in the retrieval of patent documents and are not used to limit the scope of rights of the present invention. In addition, the terms "first", "second", etc. mentioned in this specification or claims are only used to name the name of the element or to distinguish different embodiments or scopes, and are not used to limit the upper or lower limit of the number of elements.

[0029] Reference Signs List

[0030] 10: Projector

[0031] 12: Lighting module

[0032] 14: Light valve

[0033] 16: Projection lens

[0034] 100: Light source module

[0035] 110: Radiator

[0036] 112: First locking hole

[0037] 118: Guide

[0038] 120:Laser components

[0039] 121:Plate body

[0040] 122: Second locking hole

[0041] 124: Luminaire

[0042] 126: Conductive pad

[0043] 128: First guide hole

[0044] 130: Circuit board assembly

[0045] 131: Circuit Board

[0046] 132: The third locking hole

[0047] 134: Accommodation opening

[0048] 135: Connector

[0049] 136:Plated through hole

[0050] 138: Second guide hole

[0051] 140: Conductive material

[0052] 150: Locking hardware

[0053] D1, D2, D3, D4: aperture

[0054] L1: illumination beam

[0055] L': laser beam

[0056] L2: Image beam.

Claims

1. A light source module, characterized in that: The light source module includes a heat sink, a laser assembly, a circuit board assembly, a conductive material and a plurality of locking components, wherein: The radiator has a plurality of first locking holes; The laser assembly includes a light emitter and two conductive pads, the two conductive pads are coupled to the light emitter, and the laser assembly has a plurality of second locking holes; The circuit board assembly includes a circuit board having a receiving opening, two electroplated through holes, and a plurality of third locking holes, wherein the receiving opening communicates with the two electroplated through holes; The accommodating opening of the circuit board corresponds to the light emitter of the laser assembly, the multiple locking members sequentially pass through the multiple third locking holes of the circuit board assembly, the multiple second locking holes of the laser assembly, and the multiple first locking holes of the heat sink, the circuit board assembly and the laser assembly are locked on the heat sink, the accommodating opening of the circuit board exposes the light emitter, the two plated through holes correspond to the two conductive pads, respectively, and the conductive material connects the two conductive pads and the two plated through holes, so that the laser assembly is electrically connected to the circuit board assembly.

2. The light source module according to claim 1, wherein: The laser assembly further comprises: The plate body, the light emitter and the two conductive pads are configured on one side of the plate body, and a portion of the plate body is sandwiched between the circuit board and the heat sink, and the plate body has the plurality of second locking holes.

3. The light source module according to claim 2, wherein: The heat sink has a plurality of guide members, the plate body of the laser assembly has a plurality of first guide holes, and the circuit board of the circuit board assembly has a plurality of second guide holes. The plurality of guide members of the heat sink respectively pass through the plurality of first guide holes of the plate body and the plurality of second guide holes of the circuit board in sequence, thereby guiding the laser assembly and the circuit board assembly to be arranged on the heat sink.

4. The light source module according to claim 3, wherein: The plurality of guide members are respectively located beside the plurality of first locking holes, the plurality of first guide holes are respectively located beside the plurality of second locking holes, and the plurality of second guide holes are respectively located beside the plurality of third locking holes.

5. The light source module according to claim 3, wherein: The apertures of the plurality of first guide holes are respectively smaller than the apertures of the plurality of second locking holes, and the apertures of the plurality of second guide holes are respectively smaller than the apertures of the plurality of third locking holes.

6. The light source module according to claim 1, wherein: The circuit board assembly further comprises: The connector is configured on the circuit board and coupled to the circuit board.

7. The light source module according to claim 6, wherein: The connector is used to provide power through wires and transmit the power to the light emitter of the laser assembly via the two plated through holes of the circuit board, the conductive material, and the two conductive pads, so that the light emitter emits a laser beam.

8. The light source module according to claim 1, wherein: The conductive material includes solder paste.

9. The light source module according to claim 1, wherein: The plurality of fastening elements include a plurality of screws or a plurality of bolts.

10. A projector, characterized in that: The projector includes a lighting module, a light valve and a projection lens; wherein, The lighting module is used to provide an illumination beam and includes a light source module; The light source module is used to provide a laser beam, the illumination beam includes the laser beam, and the light source module includes a heat sink, a laser component, a circuit board component, a conductive material and a plurality of locking components, wherein, The radiator has a plurality of first locking holes; The laser assembly includes a light emitter and two conductive pads, the two conductive pads are coupled to the light emitter, and the laser assembly has a plurality of second locking holes; The circuit board assembly includes a circuit board having a receiving opening, two electroplated through holes, and a plurality of third locking holes, wherein the receiving opening communicates with the two electroplated through holes; The accommodating opening of the circuit board corresponds to the light emitter of the laser assembly, the multiple locking members sequentially pass through the multiple third locking holes of the circuit board, the multiple second locking holes of the laser assembly, and the multiple first locking holes of the heat sink, the circuit board assembly and the laser assembly are locked on the heat sink, the accommodating opening of the circuit board exposes the light emitter, the two plated through holes correspond to the two conductive pads, and the conductive material connects the two conductive pads and the two plated through holes, thereby electrically connecting the laser assembly to the circuit board assembly; The light valve is disposed on a transmission path of the illumination light beam to convert the illumination light beam into an image light beam; and The projection lens is arranged on the transmission path of the image light beam to project the image light beam out of the projector.

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