Display module and display device

Abstract

Embodiments of the present disclosure provide a display module and a display device, and relate to the technical field of display, which are used for preventing the flexible circuit board from peeling off the display panel and improving the stability of the structure of the display module. The display module comprises a display panel, a flexible circuit board and an adhesive structure. The display panel has a light-emitting side and a backlight side opposite to the light-emitting side. The flexible circuit board comprises a main body part, a neck part and a connecting part. The neck part is located between the main body part and the connecting part, and one end of the main body part away from the neck part is connected with the edge of the display panel. The connecting part, the neck part and at least part of the main body part are located on the backlight side of the display panel. The adhesive structure is located between the main body part and the display panel, and at least part of the adhesive structure is located in the edge area of the main body part close to the neck part. The above module is used for displaying images.

Description

Technical Field

[0001] This disclosure relates to the field of display technology, and in particular to a display module and display device. Background Technology

[0002] With the continuous development of science and technology, more and more display devices are being widely used in people's daily lives and work, bringing great convenience to people's daily lives and work, and becoming an indispensable tool for people today. Summary of the Invention

[0003] The purpose of this disclosure is to provide a display module and display device for preventing flexible circuit boards from peeling off the display panel and improving the stability of the display module structure.

[0004] To achieve the above objectives, the embodiments of this disclosure provide the following technical solutions:

[0005] On one hand, a display module is provided. The display module includes a display panel, a flexible circuit board, and an adhesive structure. The display panel has a light-emitting side and a backlight side opposite to the light-emitting side. The display panel includes a protective cover, a display substrate, and a heat dissipation film. The display substrate is located between the protective cover and the heat dissipation film, and the protective cover is located on the side of the display substrate facing the light-emitting side. The heat dissipation film includes an adhesive layer, at least one buffer layer, and at least one heat dissipation layer. The at least one buffer layer is located between the adhesive layer and the at least one heat dissipation layer, and the adhesive layer is located on the side of the at least one buffer layer closer to the protective cover. The flexible circuit board includes a main body, a neck portion, and a connecting portion. The neck portion is located between the main body and the connecting portion, and the end of the main body away from the neck portion is connected to the edge of the display panel. The connecting portion, the neck portion, and at least a portion of the main body are located on the backlight side of the display panel. The adhesive structure is located between the main body and the at least one heat dissipation layer, and at least a portion of the adhesive structure is located in the edge region of the main body near the neck portion.

[0006] In the aforementioned display module, the adhesive structure is located between the main body and the at least one heat dissipation layer, and at least a portion of the adhesive structure is located in the edge region of the main body near the neck. That is, by providing an adhesive structure in the edge region of the main body of the flexible circuit board near the neck, the adhesion between the edge region and the display panel can be increased. This prevents repeated pulling at the edge region from causing warping of the main body near the neck, which could lead to the peeling off of the display panel. This, in turn, helps to secure the flexible circuit board and the display panel, improving the stability of the display module structure.

[0007] In some embodiments, the adhesive structure includes a first adhesive structure. The first adhesive structure includes a first portion. The first portion is located in an edge region of the body portion near the neck portion. The extension direction of the neck portion is a first direction, and the ratio of the dimension of the first portion along the first direction to the dimension of the body portion along the first direction is greater than or equal to 10% and less than or equal to 50%.

[0008] In some embodiments, the direction parallel to the display panel and perpendicular to the first direction is the second direction. At least one end of the first portion extends beyond the neck portion along the second direction.

[0009] In some embodiments, the dimension of the first portion along the second direction is greater than the dimension of the neck portion along the first direction.

[0010] In some embodiments, the two ends of the first portion along the first direction are flush with the two ends of the edge region of the body portion near the neck along the first direction.

[0011] In some embodiments, the first adhesive structure further includes a second portion. The second portion is located on the side of the first portion away from the neck, and the second portion is connected to the first portion. The sum of the dimensions of the first portion and the second portion along the first direction is greater than or equal to 50% and less than or equal to 90% of the dimension of the main body portion along the first direction. Alternatively, the sum of the dimensions of the first portion and the second portion along the first direction is equal to 100% of the dimension of the main body portion along the first direction.

[0012] In some embodiments, the orthographic projections of both the first portion and the second portion onto the display surface of the display panel overlap with the orthographic projection of the main body portion onto the display surface of the display panel.

[0013] In some embodiments, the first adhesive structure further includes a third portion. The third portion is connected to the first portion to form a frame-like structure extending along the edge of the body portion.

[0014] In some embodiments, the adhesive structure further includes a second adhesive structure. The second adhesive structure is located inside the frame structure, and the second adhesive structure and the frame structure are spaced apart.

[0015] In some embodiments, the adhesive structure further includes a third adhesive structure. The third adhesive structure is located on the side of the first portion away from the neck, and is spaced apart from the first portion.

[0016] In some embodiments, the third adhesive structure includes a plurality of fourth portions, which are spaced apart along the first direction.

[0017] In some embodiments, the main body includes a first side edge near the neck portion comprising: a first line segment, a second line segment, and a third line segment. The second line segment connects to the neck portion, and the first line segment and the third line segment are located on opposite sides of the second line segment. The extension direction of the neck portion is a first direction. A direction parallel to the display panel and perpendicular to the first direction is a second direction. At least one of the first line segment and the third line segment extends along the second direction and has a length greater than or equal to 2 mm.

[0018] In some embodiments, both the first line segment and the third line segment extend along the second direction. The first side also includes a fourth line segment connecting the first line segment and the second line segment, the middle portion of the fourth line segment protruding towards the second side. The second side is the opposite side of the first side in the main body. The fourth line segment defines a groove structure, the dimension of which along the second direction is greater than or equal to the dimension along the first direction.

[0019] In some embodiments, the second line segment extends along the second direction. The angle between the first line segment and the side of the neck extending along the first direction is an obtuse angle.

[0020] In some embodiments, the neck portion includes a transition portion adjacent to the body portion. The transition portion includes a mesh structure.

[0021] In some embodiments, the transition portion includes a first transition portion and a second transition portion. The first transition portion is closer to the main body portion than the second transition portion. The width of the first transition portion gradually decreases along a third direction. The third direction points from the end of the first transition portion closer to the main body portion to the end of the first transition portion farther from the main body portion.

[0022] In some embodiments, the at least one buffer layer includes a first buffer layer and a second buffer layer. The first buffer layer is located between the adhesive layer and the second buffer layer. The elastic modulus of the second buffer layer is greater than that of the first buffer layer. And / or, the at least one heat dissipation layer includes a first heat dissipation layer and a second heat dissipation layer. The second heat dissipation layer is located on the side of the first heat dissipation layer away from the adhesive layer.

[0023] In some embodiments, the display module further includes a shielding film. The shielding film is located on the side of the main body portion away from the display panel. The orthographic projection of the shielding film onto the display surface of the display panel covers the orthographic projection of the main body portion onto the display surface of the display panel. Furthermore, at least one boundary of the shielding film onto the orthographic projection of the main body portion onto the display surface of the display panel is located outside the orthographic projection of the main body portion onto the display surface of the display panel.

[0024] In some embodiments, the shielding film, when projected orthographically onto the display surface of the display panel, includes a first boundary near the neck portion. This first boundary is located outside the orthographic projection of the main body portion onto the display surface of the display panel.

[0025] In some embodiments, the orthographic projection of the shielding film onto the display surface of the display panel includes a second boundary; the second boundary is connected to the first boundary and forms an obtuse angle. The second boundary is located outside the orthographic projection of the main body onto the display surface of the display panel.

[0026] In some embodiments, the shielding film includes: a first insulating layer, a shielding layer, and a second insulating layer. The shielding layer is located between the first insulating layer and the second insulating layer, and the first insulating layer is closer to the body portion relative to the shielding layer. The thickness of the second insulating layer is greater than or equal to the thickness of the first insulating layer.

[0027] In some embodiments, the display module further includes a driver chip. The driver chip is located on the backlight side of the display panel; the driver chip is used to drive the display panel. The first insulating layer includes a first via. The driver chip passes through the first via and contacts the shielding layer. In a direction parallel to the display surface of the display panel, a portion of the shielding layer protrudes from the main body and the first insulating layer, such that a portion of the shielding layer contacts the heat dissipation film.

[0028] In some embodiments, the display module further includes a thermally conductive structure. The thermally conductive structure includes a first thermally conductive structure and a second thermally conductive structure. The driver chip contacts the shielding layer through the first thermally conductive structure. The shielding layer contacts the heat dissipation film through the second thermally conductive structure.

[0029] On the other hand, a display device is provided. The display device includes a display module as described in any of the above embodiments.

[0030] The above-described display device has the same structure and beneficial technical effects as the display module provided in some of the above embodiments, and will not be described again here. Attached Figure Description

[0031] To more clearly illustrate the technical solutions in this disclosure, the accompanying drawings used in some embodiments of this disclosure will be briefly introduced below. Obviously, the drawings described below are only drawings of some embodiments of this disclosure, and those skilled in the art can obtain other drawings based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams and are not intended to limit the actual size of the product, the actual flow of the method, the actual timing of the signals, etc. involved in the embodiments of this disclosure.

[0032] Figure 1 This is a structural diagram of a display device according to some embodiments;

[0033] Figure 2A This is a structural diagram of a display module according to some embodiments;

[0034] Figure 2B This is a structural diagram of the light-emitting side of a display module according to some embodiments;

[0035] Figure 2C This is a structural diagram of the backlight side of a display module according to some embodiments;

[0036] Figure 2D This is a structural diagram of a display module in the thickness direction according to some embodiments;

[0037] Figure 2E for Figure 2C A cross-sectional view along the M-M' direction;

[0038] Figure 3A This is a diagram showing the bonding structure and flexible circuit board connection according to some embodiments;

[0039] Figure 3B This is a diagram of the bonding structure and flexible circuit board connection according to some other embodiments;

[0040] Figure 3C This is a diagram of the bonding structure and flexible circuit board connection according to some other embodiments;

[0041] Figure 3D This is a diagram of the bonding structure and flexible circuit board connection according to some other embodiments;

[0042] Figure 3E This is a diagram of the bonding structure and flexible circuit board connection according to some other embodiments;

[0043] Figure 3F This is a diagram of the bonding structure and flexible circuit board connection according to some other embodiments;

[0044] Figure 3G This is a diagram of the bonding structure and flexible circuit board connection according to some other embodiments;

[0045] Figure 3H This is a diagram of the bonding structure and flexible circuit board connection according to some other embodiments;

[0046] Figure 3I This is a diagram of the bonding structure and flexible circuit board connection according to some other embodiments;

[0047] Figure 4A This is a connection diagram of the main body and the neck of a flexible circuit board according to some embodiments;

[0048] Figure 4B This is a connection diagram of the main body and neck portion in a flexible circuit board according to some other embodiments;

[0049] Figure 4C This is a connection diagram of the main body and the neck of a flexible circuit board according to some other embodiments;

[0050] Figure 4D This is a connection diagram of the main body and the neck of a flexible circuit board according to some other embodiments;

[0051] Figure 4E This is a connection diagram of the main body and the neck of a flexible circuit board according to some other embodiments;

[0052] Figure 4F This is a connection diagram of the main body and the neck of a flexible circuit board according to some other embodiments;

[0053] Figure 4G This is a connection diagram of the main body and the neck of a flexible circuit board according to some other embodiments;

[0054] Figure 5A for Figure 2C Another cross-sectional view along the M-M' direction;

[0055] Figure 5B for Figure 2C Another cross-sectional view along the M-M' direction;

[0056] Figure 5C for Figure 2C Another cross-sectional view along the M-M' direction;

[0057] Figure 6A This is a structural diagram of the backlight side of a display module according to some other embodiments;

[0058] Figure 6B for Figure 6A A cross-sectional view along the N-N' direction;

[0059] Figure 6C for Figure 6A Another cross-sectional view along the N-N' direction;

[0060] Figure 6Dfor Figure 6A Another cross-sectional view along the N-N' direction;

[0061] Figure 6E for Figure 6A A cross-sectional view along the I-I' direction;

[0062] Figure 6F This is a structural diagram of the backlight side of a display module according to some other embodiments;

[0063] Figure 6G for Figure 6F A cross-sectional view along the F-F' direction;

[0064] Figure 7A An exploded view of a display module according to some embodiments;

[0065] Figure 7B This is an exploded view of a display module according to some other embodiments. Detailed Implementation

[0066] The technical solutions in some embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments provided in this disclosure are within the scope of protection of this disclosure.

[0067] Unless the context otherwise requires, throughout the specification and claims, the term "comprise" and its other forms, such as the third-person singular "comprises" and the present participle "comprising," are interpreted as open-ended and encompassing, meaning "including, but not limited to." In the description of the specification, terms such as "one embodiment," "some embodiments," "exemplary embodiments," "example," "specific example," or "some examples" are intended to indicate that a particular feature, structure, material, or characteristic associated with that embodiment or example is included in at least one embodiment or example of this disclosure. The illustrative representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics mentioned may be included in any suitable manner in any one or more embodiments or examples.

[0068] Hereinafter, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of this disclosure, unless otherwise stated, "a plurality of" means two or more.

[0069] In describing some embodiments, the term "connection" and its derived expressions may be used. For example, the term "connection" may be used in describing some embodiments to indicate that two or more components have direct physical or electrical contact with each other. Similarly, the term "coupled" may be used in describing some embodiments to indicate that two or more components have direct physical or electrical contact. However, the term "coupled" or "communicatively coupled" may also refer to two or more components that do not have direct contact with each other but still cooperate or interact with each other. The embodiments disclosed herein are not necessarily limited to the content of this document.

[0070] "At least one of A, B and C" has the same meaning and includes the following combinations of A, B and C: only A, only B, only C, combinations of A and B, combinations of A and C, combinations of B and C, and combinations of A, B and C.

[0071] The use of “applies to” in this article implies an open and inclusive language that does not exclude devices that are applicable to or configured to perform additional tasks or steps.

[0072] In addition, the use of “based on” implies openness and inclusivity, because processes, steps, calculations or other actions “based on” one or more of the stated conditions or values ​​may in practice be based on additional conditions or values ​​beyond those stated.

[0073] As used herein, “about,” “approximately,” or “approximately” includes the stated value and the average value within an acceptable range of deviation from the given value, wherein the acceptable range of deviation is determined by a person skilled in the art taking into account the measurement under discussion and the error associated with the measurement of the given quantity (i.e., the limitations of the measurement system).

[0074] As used herein, “parallel,” “perpendicular,” and “equal” include the described situation and situations that are similar to the described situation, within an acceptable deviation range, which is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, “parallel” includes absolute parallelism and approximate parallelism, where the acceptable deviation range for approximate parallelism can be, for example, within 5°; “perpendicular” includes absolute perpendicularity and approximate perpendicularity, where the acceptable deviation range for approximate perpendicularity can also be, for example, within 5°. “equal” includes absolute equality and approximate equality, where the acceptable deviation range for approximate equality can be, for example, the difference between the two equals being less than or equal to any one of 30%, 20%, 10%, or 5%.

[0075] It should be understood that when a layer or element is referred to as being on another layer or substrate, it can mean that the layer or element is directly on the other layer or substrate, or that there is an intermediate layer between the layer or element and the other layer or substrate.

[0076] This document describes exemplary embodiments with reference to cross-sectional views and / or plan views, which are idealized exemplary drawings. In the drawings, the thickness of layers and regions is enlarged for clarity. Therefore, variations in shape relative to the drawings are contemplated due to, for example, manufacturing techniques and / or tolerances. Thus, exemplary embodiments should not be construed as limited to the shapes of the regions shown herein, but rather include shape deviations due to, for example, manufacturing processes. For example, etched regions shown as rectangular would typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to show the actual shapes of the regions of the device, nor are they intended to limit the scope of the exemplary embodiments.

[0077] Figure 1 This is a structural diagram of a display device according to some embodiments.

[0078] like Figure 1 As shown, some embodiments of this disclosure provide a display device 200, which includes a display module 100.

[0079] For example, the display device 200 also includes a frame, a display driver IC (integrated circuit), and other electronic components.

[0080] For example, the display device 200 can be an electroluminescent display device or a photoluminescent display device. The display device can be a Liquid Crystal Display (LCD); it can also be an electroluminescent display device or a photoluminescent display device. When the display device is an electroluminescent display device, it can be an Organic Light-Emitting Diode (OLED) or a Quantum Dot Light-Emitting Diode (QLED). When the display device is a photoluminescent display device, it can be a Quantum Dot Photoluminescent Display Device. The display device can also be a Mini LED (Mini Light-Emitting Diode) display device or a Micro LED (Micro Light-Emitting Diode) display device.

[0081] In the case where the display device 200 is a liquid crystal display device, in some embodiments, the display device 200 includes a cover glass, a display panel 10, and a backlight assembly. The backlight assembly provides a light source for the display panel, enabling the display panel 10 to display an image. In some examples, the backlight module in the display device 200 may also include an optical film located on the side of the backlight module where the light source is closer to the display panel 10. The optical film may include a reflective sheet, a diffuser plate, a brightness enhancement film (prism sheet), etc., and can be used to improve the brightness and uniformity of light.

[0082] In the case where the display device 200 is an OLED display device, a QLED display device, a Mini LED display device, or a Micro LED display device, in some embodiments, the display panel within the display device 200 includes a light-emitting substrate, which can realize image display.

[0083] For example, the display device 200 described above can be any display device that displays images, whether moving (e.g., video) or fixed (e.g., still images), and whether it is text or images. More specifically, the display device of the described embodiments is contemplated to be implemented in or associated with a variety of electronic devices, such as (but not limited to) mobile phones, wireless devices, personal data assistants (PDAs), handheld or portable computers, GPS receivers / navigators, cameras, MP4 video players, camcorders, game consoles, watches, clocks, calculators, television monitors, flat panel displays, computer monitors, automotive displays (e.g., odometer displays, etc.), navigators, cockpit controllers and / or displays, displays of camera views (e.g., displays of rearview cameras in vehicles), electronic photographs, electronic billboards or signs, projectors, architectural structures, packaging and aesthetic structures (e.g., displays of images of a piece of jewelry), etc.

[0084] The following explanation uses an OLED display device as an example:

[0085] Figure 2A This is a structural diagram of a display module according to some embodiments. Figure 2B This is a structural diagram of the light-emitting side of a display module according to some embodiments. Figure 2C This is a structural diagram of the backlight side of a display module according to some embodiments. Figure 2D This is a structural diagram of a display module in the thickness direction according to some embodiments. Wherein, Figure 2B The flexible circuit board 20 in the display module 100 shown has not yet been bent to the backlight side S2 of the display panel 10. (Figure 2A) Figure 2C and Figure 2D The flexible circuit boards 20 in the display module 100 shown are all bent to the backlight side S2 of the display panel 10.

[0086] like Figures 2A to 2D As shown, some embodiments of this disclosure provide a display module 100. The display module 100 includes a display panel 10 and a flexible circuit board 20.

[0087] The display panel 10 can be an OLED display panel. This disclosure does not limit the type of display panel 10; it can be set according to actual needs.

[0088] For example, such as Figure 2DAs shown, the display panel 10 has a light-emitting side S1 and a backlight side S2 opposite to the light-emitting side S1. The light-emitting side S1 and the backlight side S2 are opposite each other along a third direction Z, which is the direction of the thickness of the display panel 10. It can be understood that the light-emitting side S1 can be the side of the display panel 10 used for displaying light emission. The backlight side S2 can be the side of the display panel 10 away from the light-emitting side S1. That is, if the light-emitting side S1 is located on the front of the display panel 10, then the backlight side S2 is located on the back of the display panel 10.

[0089] Figure 2E for Figure 2C A cross-sectional view along the M-M' direction.

[0090] The display panel 10 includes a protective cover plate 101, a display substrate U, and a heat dissipation film 40. The display substrate U is located between the protective cover plate 101 and the heat dissipation film 40.

[0091] The protective cover 101 is located on the side of the display substrate U facing the light-emitting side S1. The protective cover 101 can be used to protect the display panel 10 (display substrate U) and prevent the display panel 10 (display substrate U) from being scratched.

[0092] For example, the protective cover 101 is a flexible cover. The material of the protective cover 101 includes at least one of transparent polyimide and ultra-thin glass.

[0093] The heat dissipation film 40 includes an adhesive layer 41, at least one buffer layer, and at least one heat dissipation layer. The at least one buffer layer is located between the adhesive layer 41 and the at least one heat dissipation layer, and the adhesive layer 41 is located on the side of the at least one buffer layer closer to the protective cover plate 101.

[0094] Taking a heat dissipation film 40 comprising a buffer layer and a heat dissipation layer as an example, the buffer layer can be a first buffer layer 42, and the heat dissipation layer can be a first heat dissipation layer 43. That is, the heat dissipation film 40 comprising an adhesive layer 41, a first buffer layer 42, and a first heat dissipation layer 43 is illustrated in the following example.

[0095] As set up above, the heat dissipation film 40 can dissipate heat, which helps the heat generated by the display panel 10 to dissipate quickly when it is working. In addition, it can also block light.

[0096] For example, the first heat dissipation layer 43 can be connected to the adhesive structure 30. This fixes the main body 21 to the side of the first heat dissipation layer 43 away from the first buffer layer 42, that is, the main body 21 can be located on the backlight side S2 of the display panel 10.

[0097] In some examples, the heat dissipation film 40 may be super clean foam (SCF).

[0098] In some examples, the adhesive layer 41 can be an EMBO (emulated mesh adhesive) layer, which can be pressed into the adhesive surface with a grid pattern to prevent curling caused by adhesive shrinkage and enhance the tightness of the adhesion between the heat dissipation film 40 and the display panel 10. The grid shape also facilitates the expulsion of air during the bonding process, preventing air bubbles from forming. For example, the adhesive material of the adhesive layer 41 can be acrylic adhesive or silicone.

[0099] In some examples, the thickness of the adhesive layer 41 ranges from 0.03 mm to 0.2 mm. When the thickness of the adhesive layer 41 is equal to or close to 0.03 mm, the adhesive layer 41 is relatively thin, which allows it to fix the heat dissipation film 40 while also facilitating the thinning of the display module 100 and preventing resource waste. When the thickness of the adhesive layer 41 is equal to or close to 0.2 mm, the adhesive layer 41 is thicker, which allows it to better bond and fix the heat dissipation film 40 and the display panel 10 while preventing resource waste.

[0100] In some other embodiments, the thickness of the adhesive layer 41 ranges from 0.05 mm to 0.15 mm. In still other embodiments, the thickness of the adhesive layer 41 ranges from 0.08 mm to 0.12 mm.

[0101] For example, the thickness of the adhesive layer 41 is one of 0.5 mm, 1 mm, 1.5 mm or 2 mm.

[0102] In some examples, the material of the first buffer layer 42 can be foam. The first buffer layer 42 can buffer external forces and prevent the bonding pressure during the bonding process between the heat dissipation film 40 and the display panel 10 from damaging the display panel 10.

[0103] In some examples, the thickness of the first buffer layer 42 ranges from 0.05mm to 0.35mm. When the thickness of the first buffer layer 42 is equal to or close to 0.05mm, it can meet the display module 100's requirements for buffering external forces while also facilitating the thinning of the display module 100 and preventing resource waste. When the thickness of the first buffer layer 42 is equal to or close to 0.35mm, it can meet the thinning requirements of the display module 100 while providing better buffering effect, preventing damage to the display panel 10 caused by the bonding pressure during the bonding process between the heat dissipation film 40 and the display panel 10.

[0104] In some examples, the first heat dissipation layer 43 can be made of copper, aluminum, or silver, giving the heat dissipation film 40 good heat dissipation properties. For example, the first heat dissipation layer 43 can be made of copper.

[0105] The flexible printed circuit (FPC) 20 includes a main body 21, a neck 22, and a connecting part 23. The neck 22 is located between the main body 21 and the connecting part 23.

[0106] In some examples, such as Figure 2C and Figure 2D As shown, the substrate within the flexible circuit board 20 can be a flexible substrate. At least a portion of the flexible circuit board 20 can be bent to the backlight side S2 of the display panel 10 by utilizing the flexibility of the flexible substrate. For example, the connecting portion 23, the neck portion 22, and at least a portion of the main body portion 21 in the flexible circuit board 20 are located on the backlight side S2 of the display panel 10.

[0107] Since the electronic components on the backlight side S2 of the display panel 10 are relatively fewer than those on the light-emitting side S1 of the display panel 10, bending at least a portion of the flexible circuit board 20 to the backlight side S2 of the display panel 10 not only facilitates the wiring layout of the flexible circuit board 20, but also reduces the occupation of the flexible circuit board 20 on the bezel of the light-emitting side S1 of the display panel 10, which is beneficial to achieving a narrow bezel of the display panel 10.

[0108] For example, the flexible substrate within the flexible circuit board 20 can be made of an organic material. For instance, the flexible substrate can be any one of polyimide (PI), polycarbonate (PC), or polyvinyl chloride (PVC).

[0109] In some examples, such as Figure 2B As shown, the end Q1 of the main body 21 away from the neck 22 is connected to the edge Q2 of the display panel 10.

[0110] For example, a bonding process is used to press the end of the main body 21 of the flexible circuit board 20 away from the neck 22 to the display panel 10 to achieve electrical connection between the flexible circuit board 20 and the display panel 10.

[0111] In some examples, such as Figure 2B As shown, the end Q3 of the connecting part 23 away from the neck 22 is connected to the mainboard of the whole machine.

[0112] For example, the connection part 23 can be a board-to-board (BTB) connector. For instance, a board-to-board connector (BTB) consists of a female connector (Rece) and a male connector (plug), which are respectively mounted on the connection part 23 of the flexible circuit board 20 and the overall host, and are connected by mating during use to achieve electrical connection.

[0113] Therefore, by setting one end Q1 of the main body 21 away from the neck 22 to the edge Q2 of the display panel 10, and the other end Q3 of the connecting part 23 away from the neck 22 to the main board of the whole machine, the main board of the whole machine can be connected to the display panel 10 through the flexible circuit board 20 to provide driving signals to the display panel 10.

[0114] However, due to factors such as the assembly of the display module 100 and the lighting test of the display module 100, the flexible circuit board 20 needs to be folded and pressed. Under the action of bending stress, the main body 21 of the flexible circuit board 20 is prone to peeling off from the backlight side S2 of the display panel 10. This reduces the stability of the display module 100 structure and is not conducive to the subsequent operation of the display module 100.

[0115] Furthermore, when the display panel 10 is a flexible display panel, it has the advantage of good flexibility. The display panel 10 (display substrate U) includes a display section, a bending section, and a bonding section, with the bending section located between the display section and the bonding section. The bonding section can be bent to the backlight side S2 of the display panel 10 via the bending section. At this time, the display module 100 may also include a support pad, which is located on the backlight side S2 of the display panel 10. The support pad can be used to support the bonding section and prevent the bending section from breaking. The bonding section of the display panel 10 includes a flexible circuit board 20. That is, when the bonding section is bent to the backlight side S2 of the display panel 10, the entire flexible circuit board 20 is located on the backlight side S2 of the display panel 10. This reduces the occupation of the flexible circuit board 20 on the bezel of the light-emitting side S1 of the display panel 10, which is beneficial for achieving a narrow bezel of the display panel 10.

[0116] However, when the display panel 10 and the flexible circuit board 20 are bonded together, the flexible circuit board 20 peels off from the backlight side S2 of the display panel 10, which causes uneven stress on the backlight side S2 of the display panel 10. This can easily lead to mold problems on the light-emitting side S1 of the display panel 10.

[0117] Furthermore, some embodiments of this disclosure provide a display module 100 that also includes an adhesive structure 30. For example... Figure 2C As shown, the adhesive structure 30 is located between the main body 21 and the display panel 10, and at least a portion of the adhesive structure 30 is located in the edge region of the main body 21 near the neck 22.

[0118] An adhesive structure 30 is provided between the main body 21 and at least one heat dissipation layer, which increases the adhesion between the main body 21 and the at least one heat dissipation layer (the backlight side S2 of the display panel 10). This prevents the main body 21 of the flexible circuit board 20 from peeling off from the at least one heat dissipation layer (the backlight side S2 of the display panel 10) due to the need for folding and pressing, thus improving the stability of the display module 100 structure. Simultaneously, it also prevents uneven stress on the backlight side S2 of the display panel 10 from causing molding problems on the light-emitting side S1 of the display panel 10, thus improving the quality of the display module 100.

[0119] Furthermore, in the display module 100 provided in this embodiment, at least a portion of the adhesive structure 30 is located in the edge region W1 of the main body 21 near the neck 22.

[0120] When the flexible circuit board 20 is pulled up (towards the side away from the display panel), the tensile stress at the junction of the main body 21 and the neck 22 of the flexible circuit board 20 is relatively large. By providing an adhesive structure 30 in the edge region W1 of the main body 21 near the neck 22, the adhesion between the edge region W1 and the display panel 10 is increased. This prevents repeated pulling at the edge region W1 from causing warping of the main body 21 near the neck 22, which could lead to the detachment of the display panel 10. Furthermore, by mitigating the tendency for the edge region W1 to be pulled up, it also relatively prevents other locations from being pulled up and detaching the display panel 10. Therefore, this better secures the flexible circuit board 20 and the display panel 10, improving the stability of the display module 100 structure.

[0121] In some embodiments, such as Figure 2C As shown, the material of the adhesive structure 30 can be a colloid. In some examples, the material of the adhesive structure 30 can be a transparent optical adhesive. For example, it can be any one of polymethyl methacrylate (PMMA), thermoplastic polyurethanes (TPU), thermoplastic rubber (TPE), or thermoplastic polyester elastomer (TPEE), or a combination of two or more of these materials. This disclosure does not limit the scope of the embodiments.

[0122] Figure 3A This is a diagram showing the bonding structure and flexible circuit board connection according to some embodiments.

[0123] like Figure 3AAs shown, the adhesive structure 30 in the display module 100 provided in some embodiments of this disclosure includes a first adhesive structure 31. The first adhesive structure 31 includes a first portion 311. The first portion 311 is located in the edge region W1 of the main body 21 near the neck portion 22. The extension direction of the neck portion 22 is a first direction Y, and the ratio of the dimension D1 of the first portion 311 along the first direction Y to the dimension D2 of the main body 21 along the first direction Y is greater than or equal to 10% and less than or equal to 50%.

[0124] When the ratio of the dimension D1 of the first portion 311 of the first adhesive structure 31 along the first direction Y to the dimension D2 of the main body 21 along the first direction Y is equal to or close to 10%, the size of the first portion 311 is relatively small, which can prevent the first portion 311 from being too large and causing resource waste; at the same time, it ensures the adhesion between the main body 21 and the display panel 10 and prevents the main body 21 from peeling off the display panel 10. When the ratio of the dimension D1 of the first portion 311 of the first adhesive structure 31 along the first direction Y to the dimension D2 of the main body 21 along the first direction Y is equal to or close to 50%, the size of the first portion 311 is relatively large, which can further improve the adhesion between the main body 21 and the display panel 10 and prevent the main body 21 from warping and causing the display panel 10 to peel off; at the same time, it can also prevent the first portion 311 from being too large (for example, the ratio is greater than 50%) and causing resource waste.

[0125] In some examples, the neck 22 extends in the first direction Y, and the ratio of the dimension D1 of the first part 311 along the first direction Y to the dimension D2 of the main body 21 along the first direction Y is greater than or equal to 9% and less than or equal to 30%.

[0126] When the ratio of the dimension D1 of the first portion 311 along the first direction Y to the dimension D2 of the main body 21 along the first direction Y is equal to or close to 9%, the size of the first portion 311 is relatively small. This can prevent the first portion 311 from being too large and causing resource waste, while ensuring the adhesiveness between the main body 21 and the display panel 10. When the ratio of the dimension D1 of the first portion 311 along the first direction Y to the dimension D2 of the main body 21 along the first direction Y is equal to or close to 30%, the size of the first portion 311 is slightly larger. This can improve the adhesiveness between the main body 21 and the display panel 10, while also preventing the first portion 311 from being too large and causing resource waste.

[0127] In some examples, the neck 22 extends in the first direction Y, and the ratio of the dimension D1 of the first part 311 along the first direction Y to the dimension D2 of the main body 21 along the first direction Y is greater than or equal to 8% and less than or equal to 15%.

[0128] When the ratio of the dimension D1 of the first portion 311 along the first direction Y to the dimension D2 of the main body 21 along the first direction Y is equal to or close to 8%, the size of the first portion 311 is smaller. This can prevent the first portion 311 from being too large and causing resource waste, while ensuring the adhesiveness between the main body 21 and the display panel 10. When the ratio of the dimension D1 of the first portion 311 along the first direction Y to the dimension D2 of the main body 21 along the first direction Y is equal to or close to 15%, the size of the first portion 311 is slightly larger. This can improve the adhesiveness between the main body 21 and the display panel 10, while also preventing the first portion 311 from being too large and causing resource waste.

[0129] For example, the extension direction of the neck 22 is a first direction Y, and the ratio of the dimension D1 of the first part 311 along the first direction Y to the dimension D2 of the main body 21 along the first direction Y is equal to one of 10%, 20%, 30%, 40% or 50%.

[0130] In some embodiments, the dimension D2 of the main body 21 along the first direction Y ranges from 50 to 250 mm. For example, the dimension D2 of the main body 21 along the first direction Y is 50 mm. Based on this, the dimension D1 of the first portion 311 along the first direction Y can be greater than or equal to 5 mm.

[0131] When the dimension D1 of the first part 311 along the first direction Y is equal to or close to 5mm, the size of the first part 311 is small, which can prevent the size of the first part 311 from being too large and causing a waste of resources; at the same time, it ensures the adhesion between the main body 21 and the display panel 10 and prevents the main body 21 from peeling off the display panel 10.

[0132] In some examples, the dimension D1 of the first part 311 along the first direction Y is greater than or equal to 10 mm.

[0133] When the dimension D1 of the first part 311 along the first direction Y is equal to or close to 10mm, the size of the first part 311 is slightly smaller, which can improve the adhesion between the main body 21 and the display panel 10 while preventing the size of the first part 311 from being too large and causing waste of resources.

[0134] In some examples, the dimension D1 of the first part 311 along the first direction Y is greater than or equal to 20 mm.

[0135] When the dimension D1 of the first part 311 along the first direction Y is equal to or close to 20mm, the dimension of the first part 311 can be slightly larger, which can better improve the adhesion between the main body 21 and the display panel 10, and at the same time can also prevent the first part 311 from being too large, causing a waste of resources.

[0136] In some examples, based on the aforementioned limitation of the size D1 of the first portion 311 along the first direction Y, the size D1 of the first portion 311 along the first direction Y can be further less than or equal to the size D2 of the main body 21 along the first direction Y. This prevents the first adhesive structure 31 from overflowing from the main body 21 and being exposed to air, which could easily absorb air impurities and affect the quality of the first adhesive structure 31. It also prevents workers from touching the adhesive structure 30 with their fingers during the assembly of the display module 100, thus affecting the assembly of the display module 100. Furthermore, it also helps avoid resource waste.

[0137] In some examples, the dimension D1 of the first part 311 along the first direction Y is one of 5mm, 8mm, 10mm, 15mm, 20mm, 25mm or 30mm.

[0138] Figure 3B This is a diagram of the bonding structure and flexible circuit board connection according to some other embodiments.

[0139] In some embodiments, such as Figure 3A and Figure 3B As shown, the direction parallel to the display panel 10 and perpendicular to the first direction Y is the second direction X. The first portion 311 extends beyond the neck portion 22 at least at one end along the second direction X.

[0140] The first part 311 extends beyond the neck 22 at least at one end along the second direction X, including the following two cases:

[0141] The first type, such as Figure 3A As shown, one end of the first portion 311 extends beyond the neck 22 along the second direction X. This embodiment does not specifically limit the position of the end of the first portion 311 extending beyond the neck 22 along the second direction X. Figure 3A The illustration is based on an example where the first end 31a of the first portion 311 extends beyond the neck 22. It is understood that in other embodiments, the second end 31b of the first portion 311 may also extend beyond the neck 22. In this case, the first end 31a and the second end 31b are positioned opposite each other along a second direction X.

[0142] Taking the first end 31a of the first part 311 extending beyond the neck 22 as an example:

[0143] The first end 31a of the first part 311 extends beyond the neck 22, and the second end 31b is recessed within 50% of the width of the neck 22. This is equivalent to the first end 31a of the first part 311 extending beyond the boundary line O between the neck 22 and the main body 21, and the second end 31b being recessed within 50% of the length of the boundary line O.

[0144] When the flexible circuit board 20 is pulled up (towards the side away from the display panel), the tensile stress at the junction O of the main body 21 and the neck 22 of the flexible circuit board 20 is relatively large. The tensile stress extends along the neck 22 towards the main body 21. As described above, the first portion 311 at this location can increase the adhesion between the main body 21 and the display panel 10, resisting some of the tensile stress at the junction O, thereby reducing the likelihood of the main body 21 being repeatedly pulled up, and thus reducing the problem of the main body 21 peeling off from the display panel 10.

[0145] In some examples, the second end 31b is recessed no more than 80% of the width of the neck 22, that is, the second end 31b is recessed no more than 80% of the length of the boundary line O. For example, the second end 31b is flush with the end of the neck 22 away from the first end 31a.

[0146] As set up above, the first part 311 at this location can be used to better improve the adhesion between the main body 21 and the display panel 10, resist the partial tensile stress at the entire boundary line O location, thereby better reducing the probability of the main body 21 being repeatedly pulled up, and thus reducing the problem of the main body 21 peeling off the display panel 10.

[0147] The second type, such as Figure 3B As shown, both ends of the first part 311 extend beyond the neck 22 along the second direction X. This is equivalent to both ends of the first part 311 extending beyond the boundary line O.

[0148] When the flexible circuit board 20 is pulled up (towards the side away from the display panel), the tensile stress at the junction line O between the main body 21 and the neck 22 of the flexible circuit board 20 is relatively large, as is the tensile stress near the junction line O. The tensile stress extends along the neck 22 towards the main body 21. With the above configuration, the first part 311 can be used to increase the adhesion between the main body 21 and the display panel 10, resisting some of the tensile stress at the junction line O and near the junction line O, thereby more effectively reducing the probability of the main body 21 being repeatedly pulled up, and thus reducing the problem of the main body 21 peeling off the display panel 10.

[0149] In some embodiments, such as Figure 3A As shown, the dimension of the first part 311 along the second direction X is greater than the dimension of the neck 22 along the first direction Y.

[0150] like Figure 3A As shown, with one end of the first portion 311 extending beyond the neck 22 along the second direction X, the size of the first portion 311 along the second direction X is set to be larger than the size of the neck 22 along the first direction Y. This is to ensure that the first portion 311 does not extend beyond one end of the neck 22, and to minimize the inward retraction of the first portion 311 from more than 50% of the width of the neck 22.

[0151] This allows the first part 311 to increase the adhesion between the main body 21 and the display panel 10, resisting some of the tensile stress at the junction line O, thereby more effectively reducing the probability of the main body 21 being repeatedly pulled up, and thus reducing the problem of the main body 21 peeling off the display panel 10.

[0152] Figure 3C This is a diagram of the bonding structure and flexible circuit board connection according to some other embodiments.

[0153] In some other embodiments, such as Figure 3C As shown, the two ends of the first part 311 along the first direction Y are roughly flush with the two ends of the edge region of the main body 21 near the neck 22 along the first direction Y.

[0154] When the flexible circuit board 20 is pulled up (towards the side away from the display panel), the tensile stress at the junction line O between the main body 21 and the neck 22 of the flexible circuit board 20 is relatively large, as is the tensile stress near the junction line O. The tensile stress extends along the neck 22 towards the main body 21. With the above configuration, the first part 311 can be used to increase the adhesion between the main body 21 and the display panel 10, resisting some of the tensile stress on the side of the main body 21 near the neck 22, thereby more effectively reducing the probability of the main body 21 being repeatedly pulled up, and thus reducing the problem of the main body 21 peeling off the display panel 10.

[0155] It should be noted that "approximately flush" includes both absolute flush and near-flush. Due to certain uncontrollable errors (such as manufacturing process errors, equipment precision, measurement errors, etc.), the distance between the two ends of the edge regions near the neck 22 in the first part 311 and the main body 21 along the first direction Y is within an acceptable deviation range, and the two ends of the main body 21 and the first part 311 can be considered approximately flush. The acceptable deviation range can be any one of 30%, 20%, 10%, or 5%.

[0156] In some examples, when the first part 311 and the display panel 10 are bonded together, the adhesive structure 30 may flow to some extent due to the material of the adhesive structure 30.

[0157] Furthermore, the first portion 311 of the adhesive structure 30 can be provided with a gap (recessed) at both ends relative to the edge region near the neck portion 22 of the main body 21 along the first direction Y. This gap is used to compensate for the flow problem of the adhesive structure 30, and to prevent the adhesive structure 30 from overflowing to the outside of the main body 21, which would affect the quality of the display module 100.

[0158] In some examples, the spacing can be less than or equal to 2 mm. When the spacing is equal to or close to 2 mm, sufficient space can be reserved to compensate for the flow of the adhesive structure 30, preventing the adhesive structure 30 from overflowing to the outside of the main body 21 and causing problems that affect the quality of the display module 100. At the same time, it can also prevent the spacing between the first part 311 and the two ends of the main body 21 from being too large, which would affect the adhesion between the edge of the main body 21 and the display panel 10.

[0159] In other examples, the spacing can be less than or equal to 1 mm. When the spacing is equal to or close to 1 mm, space can be reserved to compensate for the flow of the adhesive structure 30, preventing the adhesive structure 30 from overflowing to the outside of the main body 21 and causing problems affecting the quality of the display module 100. At the same time, it can also better prevent the spacing between the first part 311 and the two ends of the main body 21 from being too large, which would affect the adhesion between the edge of the main body 21 and the display panel 10.

[0160] In some other examples, the spacing can be less than or equal to 0.5 mm. When the spacing is equal to or close to 0.5 mm, it can both compensate for the flow problem of the adhesive structure 30 during pressing and prevent adhesion between the edge of the main body and the display panel 10, which is beneficial to improving the quality of the display module 100.

[0161] For example, the spacing can be one of 2mm, 1.5mm, 1mm, 0.8mm, 0.5mm, 0.3mm or 0.1mm.

[0162] Figure 3D This is a diagram of the bonding structure and flexible circuit board connection according to some other embodiments.

[0163] In some embodiments, such as Figure 3D As shown, the first adhesive structure 31 further includes a second portion 312. The second portion 312 is located on the side of the first portion 311 away from the neck portion 22, and the second portion 312 is connected to the first portion 311. The ratio of the sum of the dimensions of the first portion 311 and the second portion 312 along the first direction Y to the dimension of the main body portion 21 along the first direction Y is greater than or equal to 50% and less than or equal to 90%.

[0164] When the sum of the dimensions of the first part 311 and the second part 312 along the first direction Y is equal to or close to the dimension of the main body 21 along the first direction Y, that is, when the ratio of the dimension of the first adhesive structure 31 along the first direction Y to the dimension of the main body 21 along the first direction Y is equal to or close to 50%, the problem of resource waste caused by the excessive size of the first adhesive structure 31 can be prevented. At the same time, the adhesive requirements between the main body 21 and the display panel 10 can also be met, preventing the main body 21 from peeling off the display panel 10, improving the stability of the display module 100 structure, and improving the quality of the display module 100.

[0165] When the sum of the dimensions of the first part 311 and the second part 312 along the first direction Y is equal to or close to the dimension of the main body 21 along the first direction Y, that is, when the ratio of the dimension of the first adhesive structure 31 along the first direction Y to the dimension of the main body 21 along the first direction Y is equal to or close to 90%, the size of the first adhesive structure 31 is larger. This can further increase the adhesion between the main body 21 and the display panel 10, preventing the main body 21 from peeling off the display panel 10, improving the stability of the display module 100 structure, and improving the quality of the display module 100. At the same time, it can also prevent the problem of resource waste caused by the excessive size of the first adhesive structure 31 to a certain extent.

[0166] In some examples, such as Figure 3D As shown, the sum of the dimensions of the first part 311 and the second part 312 along the first direction Y is greater than or equal to 60% and less than or equal to 70% of the dimension of the main body 21 along the first direction Y.

[0167] When the sum of the dimensions of the first portion 311 and the second portion 312 along the first direction Y is equal to or close to the dimension of the main body portion 21 along the first direction Y, that is, when the ratio of the dimension of the first adhesive structure 31 along the first direction Y to the dimension of the main body portion 21 along the first direction Y is equal to or close to 60%, the problem of resource waste caused by the excessive size of the first adhesive structure 31 can be prevented. At the same time, the adhesive requirements between the main body portion 21 and the display panel 10 can also be met, thus preventing the main body portion 21 from peeling off the display panel 10.

[0168] When the sum of the dimensions of the first part 311 and the second part 312 along the first direction Y is equal to or close to 80% of the dimension of the main body 21 along the first direction Y, that is, when the ratio of the dimension of the first adhesive structure 31 along the first direction Y to the dimension of the main body 21 along the first direction Y is equal to or close to 80%, the size of the first adhesive structure 31 is relatively large. This can further increase the adhesion between the main body 21 and the display panel 10, and can prevent the main body 21 from peeling off the display panel 10. At the same time, it can also prevent the problem of resource waste caused by the excessive size of the first adhesive structure 31 to a certain extent.

[0169] In some examples, the sum of the dimensions of the first portion 311 and the second portion 312 along the first direction Y is 50%, 60%, 70%, 80%, or 90% of the dimension of the main body 21 along the first direction Y.

[0170] Figure 3E This is a diagram of the bonding structure and flexible circuit board connection according to some other embodiments.

[0171] In some embodiments, such as Figure 3E As shown, the first adhesive structure 31 also includes a second portion 312. The second portion 312 is located on the side of the first portion 311 away from the neck portion 22, and the second portion 312 is connected to the first portion 311. The sum of the dimensions of the first portion 311 and the second portion 312 along the first direction Y is equal to 100% of the dimension of the main body portion 21 along the first direction Y.

[0172] This configuration ensures that the sum of the dimensions of the first part 311 and the second part 312 along the first direction Y is equal to the dimension of the main body 21 along the first direction Y. In other words, the dimension of the first adhesive structure 31 along the first direction Y is equal to the dimension of the main body 21 along the first direction Y. This better increases the adhesion between the main body 21 and the display panel 10, preventing the main body 21 from detaching from the display panel 10. Simultaneously, it also helps to prevent resource waste caused by an excessively large size of the first adhesive structure 31.

[0173] In some embodiments, such as Figure 3D and Figure 3E As shown, the thickness of the second part 312 can be approximately equal to the thickness of the first part 311.

[0174] It should be noted that "approximately equal" includes both absolute and approximate equality. Due to the existence of certain uncontrollable errors (such as manufacturing process errors, equipment precision, measurement errors, etc.), the thickness of the second part 312 can be considered approximately equal to the thickness of the first part 311 if the difference between their thicknesses is within an acceptable deviation range. The acceptable deviation range can be any one of 30%, 20%, 10%, or 5% of the thickness of the first part 311.

[0175] In some embodiments, such as Figure 3D and Figure 3E As shown, the second part 312 and the first part 311 can be formed as a single unit, so that the second part 312 and the first part 311 can be realized in one step, which helps to simplify the process of the first adhesive structure 31.

[0176] like Figure 3D and Figure 3E As shown, in Figure 3C Based on the first part 311 shown, the first adhesive structure 31 also includes a second part 312. However, this disclosure is not limited to this embodiment, and other methods may also be used. Figure 3A or Figure 3B Based on the first part 311 shown, the first adhesive structure 31 also includes a second part 312. This can be configured according to actual conditions.

[0177] In some embodiments, such as Figure 3D As shown, the orthographic projections of the first part 311 and the second part 312 onto the display surface of the display panel 10 overlap with the orthographic projection of the main body 21 onto the display surface of the display panel 10.

[0178] This arrangement is equivalent to the orthographic projection of the first adhesive structure 31 onto the display surface of the display panel 10 overlapping with the orthographic projection of the main body 21 onto the display surface of the display panel 10. This ensures that the first adhesive structure 31 is present at any position between the main body 21 and the display panel 10. This prevents warping of the main body 21 at various locations and avoids detachment from the display panel 10, further improving the stability of the display module 100 structure and enhancing the overall quality of the display module 100.

[0179] Figure 3F This is a diagram of the bonding structure and flexible circuit board connection according to some other embodiments.

[0180] In some embodiments, such as Figure 3FAs shown, the first adhesive structure 31 also includes a third portion 313. The third portion 33 is connected to the first portion 311 to form a frame-shaped structure extending along the edge of the main body 21. This frame-shaped structure is the first adhesive structure 31. That is, the first adhesive structure 31 provided in this embodiment extends around the edge of the main body 21.

[0181] Because the flexible circuit board 20 is more easily pulled up at the boundary of the main body 21 when it is pulled up (towards the side away from the display panel), the first adhesive structure 31 extending around the edge of the main body 21 helps to increase the adhesion between the edge of the main body 21 and the display panel 10, preventing warping caused by repeated pulling and thus preventing peeling from the display panel 10. This improves the stability of the display module 100 structure and enhances its quality.

[0182] Figure 3G This is a diagram of the bonding structure and flexible circuit board connection according to some other embodiments.

[0183] In some embodiments, such as Figure 3G As shown, the adhesive structure 30 also includes a second adhesive structure 32. The second adhesive structure 32 is located inside the frame structure, and the second adhesive structure 32 and the frame structure are spaced apart. That is, based on the provision of a first adhesive structure 31 extending around the edge of the main body 21, the adhesive structure 30 also includes a second adhesive structure 32. The second adhesive structure 32 is located inside the frame structure.

[0184] The first adhesive structure 31 increases the adhesion between the edge of the main body 21 and the display panel 10. The second adhesive structure 32 increases the adhesion between the middle of the main body 21 and the display panel 10. Therefore, the adhesive structures 30 together increase the adhesion between the main body 21 and the display panel 10. This prevents the main body 21 from warping due to repeated pulling, which could lead to peeling off from the display panel 10. This improves the stability of the display module 100 structure and enhances its overall quality.

[0185] In some embodiments, such as Figure 3G As shown, the thickness of the first adhesive structure 31 can be set to a range of 50μm to 200μm.

[0186] When the thickness of the first adhesive structure 31 is equal to or close to 50 μm, its thinness prevents it from being too thick and affecting the thinness of the display module 100. Simultaneously, it ensures the necessary adhesion between the main body 21 and the display panel 10, preventing the main body 21 from peeling off the display panel 10 and improving the quality of the display module 100. When the thickness of the first adhesive structure 31 is equal to or close to 200 μm, since the adhesion of the adhesive structure 31 is proportional to its thickness, increasing the thickness of the first adhesive structure 31 improves its adhesion. This means it better secures the main body 21 and the display panel 10, preventing the main body 21 from peeling off the display panel 10 and improving the quality of the display module 100. It also helps to prevent the first adhesive structure 31 from being too thick and affecting the thinness of the display module 100.

[0187] In other embodiments, the thickness of the first adhesive structure 31 ranges from 80 μm to 150 μm.

[0188] When the thickness of the first adhesive structure 31 is equal to or close to 80 μm, the thickness of the first adhesive structure 31 is relatively thin. This can prevent the first adhesive structure 31 from being too thick while ensuring the adhesion between the main body 21 and the display panel 10, thus improving the quality of the display module 100. When the thickness of the first adhesive structure 31 is equal to or close to 150 μm, it can better fix the main body 21 and the display panel 10, while also preventing the first adhesive structure 31 from being too thick and affecting the thinness of the display module 100.

[0189] For example, the thickness of the first adhesive structure 31 can be 50μm, 80μm, 100μm, 120μm, 150μm, 200μm or 250μm.

[0190] In some embodiments, such as Figure 3G As shown, the thickness of the second adhesive structure 32 can be set to a range of 30μm to 200μm.

[0191] When the thickness of the second adhesive structure 32 is equal to or close to 30 μm, its thinness prevents it from being too thick and affecting the thinness of the display module 100. Simultaneously, it ensures the necessary adhesion between the main body 21 and the display panel 10, preventing the main body 21 from peeling off the display panel 10 and improving the quality of the display module 100. When the thickness of the second adhesive structure 32 is equal to or close to 200 μm, since the adhesion of the adhesive structure 32 is proportional to its thickness, increasing the thickness of the second adhesive structure 32 improves its adhesion. This means it better secures the main body 21 and the display panel 10, preventing the main body 21 from peeling off the display panel 10 and improving the quality of the display module 100. It also helps to prevent the second adhesive structure 32 from being too thick and affecting the thinness of the display module 100.

[0192] In other embodiments, the thickness of the second adhesive structure 32 ranges from 50 μm to 150 μm.

[0193] When the thickness of the second adhesive structure 32 is equal to or close to 50 μm, the thickness of the second adhesive structure 32 is relatively thin. This can prevent the second adhesive structure 32 from being too thick while ensuring the adhesion between the main body 21 and the display panel 10, thus improving the quality of the display module 100. When the thickness of the second adhesive structure 32 is equal to or close to 150 μm, it can better fix the main body 21 and the display panel 10, while also preventing the second adhesive structure 32 from being too thick and affecting the thinness of the display module 100.

[0194] For example, the thickness of the second adhesive structure 32 can be 30μm, 50μm, 80μm, 100μm, 120μm, 150μm, 200μm or 250μm.

[0195] In some embodiments, such as Figure 3G As shown, the thickness of the first adhesive structure 31 is greater than or equal to the thickness of the second adhesive structure.

[0196] The first method involves making the thickness of the first adhesive structure 31 equal to the thickness of the second adhesive structure 32. This configuration ensures the flatness of the adhesive structure 30 and simplifies its manufacturing process. Simultaneously, it ensures adhesion between the main body 21 and the display panel 10 at all locations, thus improving the quality of the display module 100.

[0197] The second method involves making the thickness of the second adhesive structure 32 less than that of the first adhesive structure 31. This is because when the flexible circuit board 20 is pulled up (towards the side opposite to the display panel), the boundary of the main body 21 of the flexible circuit board 20 is more easily pulled up. Therefore, making the first adhesive structure 31 relatively thicker improves the adhesion between the boundary of the main body 21 and the display panel 10, preventing warping caused by repeated pulling at the edge of the main body 21, which could lead to peeling from the display panel 10. This improves the stability of the display module 100 structure and enhances its overall quality.

[0198] Because the tensile stress in the middle of the main body 21 is less than that at the edges, warping is less likely to occur. Therefore, the second adhesive structure 32 can be made relatively thinner, which satisfies the adhesion requirements between the middle of the main body 21 and the display panel 10 while also saving resources.

[0199] In other embodiments, such as Figure 3G As shown, the thickness of the second adhesive structure 32 is less than the thickness of the first adhesive structure 31. The difference between the thickness of the second adhesive structure 32 and the thickness of the first adhesive structure 31 can be set to be less than 20 μm.

[0200] While better conserving resources, it can prevent the second adhesive structure 32 from not being able to contact the main body 21 and the display panel 10 simultaneously due to the large difference between the thickness of the second adhesive structure 32 and the thickness of the first adhesive structure 31, thus failing to improve the adhesion between the main body 21 and the display panel 10.

[0201] In some other embodiments, such as Figure 3G As shown, the difference in thickness between the second adhesive structure 32 and the first adhesive structure 31 is less than 10 μm. This allows for better resource conservation, preventing the second adhesive structure 32 from failing to simultaneously contact the main body 21 and the display panel 10 due to an excessively large difference in thickness between the two structures, thus failing to improve the adhesion between them.

[0202] For example, the difference between the thickness of the second adhesive structure 32 and the thickness of the first adhesive structure 31 is one of 5 μm, 10 μm, 15 μm or 20 μm.

[0203] In some embodiments, such as Figure 3G As shown, the minimum spacing D3 between the first adhesive structure 31 and the second adhesive structure 32 is greater than or equal to 2 mm.

[0204] When the thickness of the first adhesive structure 31 is equal to the thickness of the second adhesive structure 32, the minimum spacing D3 between the first adhesive structure 31 and the second adhesive structure 32 is set to be greater than or equal to 2mm. The gaps between the various adhesive structures relative to the adhesive structure 30 reduce the amount of material used in the adhesive structure 30, thus saving resources.

[0205] When the thickness of the first adhesive structure 31 is greater than the thickness of the second adhesive structure 32, the minimum distance D3 between the first adhesive structure 31 and the second adhesive structure 32 is greater than or equal to 2mm. Sufficient space can be reserved between the first adhesive structure 31 and the second adhesive structure 32. When the main body 21 and the display panel 10 are bonded, the first adhesive structure 31 can flow into this space, preventing the thickness of the first adhesive structure 31 from being too large, which would affect the flatness of the adhesive structure 30 and thus affect the adhesion between the display panel 10 and the main body 21.

[0206] For example, the minimum spacing D3 can be one of 2mm, 2.5mm or 3mm.

[0207] In some embodiments, such as Figure 3G As shown, the adhesive structure 30 may further include a first auxiliary adhesive structure, which may also be disposed around the second adhesive structure 32. That is, the first auxiliary adhesive structure may be located between the first adhesive structure 31 and the second adhesive structure 32.

[0208] At this time, setting the first auxiliary adhesive structure can further increase the adhesion between the main body 21 and the display panel 10, preventing the main body 21 from peeling off the display panel 10 and affecting the stability of the display module 100 structure.

[0209] In some examples, where the thickness of the first adhesive structure 31 is equal to the thickness of the second adhesive structure 32, the thickness of the first auxiliary adhesive structure can be set to be equal to both the thickness of the first adhesive structure 31 and the thickness of the second adhesive structure 32.

[0210] Based on this, the flatness of the adhesive structure 30 can be guaranteed, and the manufacturing process of the adhesive structure 30 can be simplified. At the same time, it can also ensure the adhesion between the main body 21 and the display panel 10 at various positions, which is beneficial to improving the quality of the display module 100.

[0211] In other examples, such as Figure 3G As shown, when the thickness of the first adhesive structure 31 is greater than the thickness of the second adhesive structure 32:

[0212] The first method involves setting the thickness of the first auxiliary adhesive structure to be equal to the thickness of the first adhesive structure 31. Since the first auxiliary adhesive structure can be located between the first adhesive structure 31 and the second adhesive structure 32, that is, outside the second adhesive structure 32, setting its thickness to be equal to that of the outermost edge of the first adhesive structure 31 can further increase the adhesion between the edge of the main body and the display panel 10.

[0213] The second approach is to set the thickness of the first auxiliary adhesive structure to be equal to the thickness of the second adhesive structure 32. Since the first auxiliary adhesive structure can be located between the first adhesive structure 31 and the second adhesive structure 32, that is, the first auxiliary adhesive structure is located inside the first adhesive structure 31, setting its thickness to be equal to that of the second adhesive structure 32 located inside the first adhesive structure 31 can improve the adhesion between the main body 21 and the display panel 10 to a certain extent while saving resources.

[0214] The third approach is to set the thickness of the first auxiliary bonding structure to be less than the thickness of the first bonding structure 31 and greater than the thickness of the second bonding structure 32. Since the first auxiliary bonding structure can be located between the first bonding structure 31 and the second bonding structure 32, setting the thickness of the first auxiliary bonding structure to be less than the thickness of the first bonding structure 31 and greater than the thickness of the second bonding structure 32 is equivalent to the thicknesses of the first bonding structure 31, the first auxiliary bonding structure, and the second bonding structure 32 decreasing sequentially. On the one hand, this can improve the adhesion between the main body 21 and the display panel 10 to a certain extent while saving resources. On the other hand, because the thickness of the bonding structure 30 is gradually varied, it can also prevent the surface unevenness of the bonding structure 30 caused by large thickness differences between the various bonding structures, thus improving the quality of the display module 100.

[0215] Figure 3H This is a diagram of the bonding structure and flexible circuit board connection according to some other embodiments.

[0216] In some embodiments, such as Figure 3H As shown, the adhesive structure 30 also includes a third adhesive structure 33. The third adhesive structure 33 is located on the side of the first portion away from the neck portion 22, and the third adhesive structure 33 is spaced apart from the first portion.

[0217] In addition to the first adhesive structure 31, the adhesive structure 30 also includes a third adhesive structure 33. The third adhesive structure 33 is located on the side of the first portion away from the neck 22. The third adhesive structure 33 increases the adhesion between the side of the first portion away from the neck 22 and the display panel 10, preventing warping caused by repeated pulling at the edge of the main body 21, which could lead to peeling from the display panel 10. This improves the stability of the display module 100 structure and enhances its overall quality.

[0218] in, Figure 3H The illustration is given with the side of the third adhesive structure 33 furthest from the first portion 311 flush with the edge Q2 of the display panel 10. It is understood that in other embodiments, there may be a gap between the side of the third adhesive structure 33 furthest from the first portion 311 and the edge Q2 of the display panel 10. This disclosure does not limit this.

[0219] In some embodiments, such as Figure 3H As shown, the thickness of the first portion 311 of the first adhesive structure 31 is greater than or equal to the thickness of the third adhesive structure 33.

[0220] The first method involves making the thickness of the first portion 311 of the first adhesive structure 31 equal to the thickness of the third adhesive structure 33. This configuration ensures the flatness of the adhesive structure 30 and simplifies its manufacturing process. Simultaneously, it ensures adhesion between the main body 21 and the display panel 10 at all locations, thus improving the quality of the display module 100.

[0221] The second type: the thickness of the first part 311 of the first adhesive structure 31 is greater than the thickness of the third adhesive structure 33.

[0222] Because the flexible circuit board 20 is pulled up (towards the side away from the display panel), the portion of the main body 21 of the flexible circuit board 20 near the neck 22 is more easily pulled up. Therefore, by providing a relatively thick first adhesive structure 31, the adhesion between the main body 21 near the neck 22 and the display panel 10 can be better improved, preventing warping of the main body 21 at this location due to repeated pulling, which could lead to peeling from the display panel 10. This improves the stability of the display module 100 structure and enhances the quality of the display module 100.

[0223] Since the tensile stress on the main body 21 is relatively small at the position away from the neck 22, it is less prone to warping. Therefore, the thickness of the third adhesive structure 33 can be made relatively thin, which can not only meet the adhesion requirements between the middle position of the main body 21 and the display panel 10, but also help to save resources.

[0224] In other embodiments, such as Figure 3H As shown, with the thickness of the third adhesive structure 33 being less than the thickness of the first adhesive structure 31, the difference between the thickness of the third adhesive structure 33 and the thickness of the first adhesive structure 31 can be set to be less than 20 μm.

[0225] While better conserving resources, it can prevent the difference between the thickness of the third adhesive structure 33 and the thickness of the first adhesive structure 31 from being too large, which would prevent the two sides of the third adhesive structure 33 from being able to simultaneously contact the main body 21 and the display panel 10, thus failing to improve the adhesion between the main body 21 and the display panel 10.

[0226] In some other embodiments, such as Figure 3H As shown, the difference in thickness between the third adhesive structure 33 and the first adhesive structure 31 is less than 10 μm. This better prevents the third adhesive structure 33 from failing to simultaneously contact the main body 21 and the display panel 10 due to an excessively large difference in thickness between the two structures, thus failing to improve the adhesion between them. This also helps to conserve resources to a certain extent.

[0227] For example, the difference between the thickness of the third adhesive structure 33 and the thickness of the first adhesive structure 31 is one of 5 μm, 10 μm, 15 μm or 20 μm.

[0228] In some embodiments, such as Figure 3H As shown, the minimum spacing D3 between the first adhesive structure 31 and the third adhesive structure 33 is greater than or equal to 2 mm.

[0229] When the thickness of the first adhesive structure 31 is equal to the thickness of the third adhesive structure 33, the minimum spacing D3 between the first adhesive structure 31 and the third adhesive structure 33 is set to be greater than or equal to 2mm. The gaps between the various adhesive structures relative to the adhesive structure 30 reduce the amount of material used in the adhesive structure 30, thus saving resources.

[0230] When the thickness of the first adhesive structure 31 is greater than the thickness of the third adhesive structure 33, the minimum distance D3 between the first adhesive structure 31 and the third adhesive structure 33 is greater than or equal to 2mm. Sufficient space can be reserved between the first adhesive structure 31 and the third adhesive structure 33. When the main body 21 and the display panel 10 are bonded, the first adhesive structure 31 can flow into this space, preventing the thickness of the first adhesive structure 31 from being too large, which would affect the flatness of the adhesive structure 30 and thus affect the adhesion between the display panel 10 and the main body 21.

[0231] For example, the minimum spacing D3 can be one of 2mm, 2.5mm or 3mm.

[0232] Figure 3I This is a diagram of the bonding structure and flexible circuit board connection according to some other embodiments.

[0233] In some embodiments, such as Figure 3I As shown, the third adhesive structure 33 includes a plurality of fourth parts 331, which are arranged at intervals along the first direction Y.

[0234] and Figure 3H The difference is, Figure 3H This is equivalent to the third adhesive structure 33 including only one fourth part. The third adhesive structure 33 is divided into multiple fourth parts 331. This arrangement can increase the bonding area between the third adhesive structure 33 and the main body 21 and the display panel 10, and improve the adhesion between the main body 21 and the display panel 10. The multiple fourth parts 331 are also spaced apart, which can save resources.

[0235] in, Figure 3H The third adhesive structure 33 includes two fourth parts 331 as an example for illustration. However, the number of fourth parts 331 in this embodiment is not limited and can be set according to actual needs.

[0236] In some embodiments, such as Figure 3I As shown, the thickness of the fourth part 331 is equal, and the thickness of the fourth part 331 is equal to the thickness of the first part 311.

[0237] This design ensures the flatness of the adhesive structure 30 and simplifies its manufacturing process. Simultaneously, it ensures adhesion between the main body 21 and the display panel 10 at all locations, thus improving the quality of the display module 100.

[0238] In other embodiments, such as Figure 3I As shown, in the direction from the main body 21 to the neck 22, the thickness component of the fourth portion 331 increases, but the thickness of the fourth portion 331 does not exceed the thickness of the first portion 311 in the first adhesive structure 31. That is, in the direction from the main body 21 to the neck 22, the thickness component of the third adhesive structure 33 increases.

[0239] Since the adhesive strength of the adhesive structure 30 is proportional to its thickness, the aforementioned structure allows the adhesive force of the adhesive structure 30 to gradually increase along the direction from the main body 21 to the neck portion 22. This further prevents warping and peeling of the display panel 10 due to the higher tensile stress on the side of the main body 23 near the neck portion 22. Simultaneously, the gradually varying thickness of the adhesive structure 30 also prevents unevenness on the surface of the adhesive structure 30 caused by significant thickness differences between the various adhesive structures, thus improving the quality of the display module 100.

[0240] Figure 4A This is a connection diagram of the main body and neck of a flexible circuit board according to some embodiments.

[0241] In some embodiments, such as Figure 4A As shown, the main body 21 includes a first side 210 near the neck 22, comprising a first line segment 211, a second line segment 212, and a third line segment 213. The second line segment 212 is connected to the neck 22, and the first line segment 211 and the third line segment 213 are located on either side of the second line segment 212. The extension direction of the neck 22 is a first direction Y. The direction parallel to the display panel 10 and perpendicular to the first direction Y is a second direction X. At least one of the first line segment 211 and the third line segment 213 extends along the second direction X and has a length greater than or equal to 2 mm.

[0242] It is understood that in some embodiments, the main body 21 and the neck 22 can be integrally formed. In this case, the second line segment 212 is the boundary line between the main body 21 and the neck 22.

[0243] At least one of the first segment 211 and the third segment 213 extends along the second direction X, and its length is greater than or equal to 2 mm. This includes the following three cases:

[0244] The first type: such as Figure 4A As shown, the first line segment 211 extends along the second direction X and has a length greater than or equal to 2 mm. Limiting the length of the first line segment 211 helps to increase the width of the left side of the first side 210 of the main body 21, and to a certain extent, increases the length of the first side 210. This also increases the contact area between the main body 21 and the display panel 10. Based on the adhesive structure 30, this further enhances the adhesion between the main body 21 and the display panel 10, preventing the main body 21 from warping due to repeated pulling at this location, which could lead to peeling from the display panel 10. This improves the stability of the display module 100 structure and enhances the quality of the display module 100.

[0245] The second type: such as Figure 4AAs shown, the third line segment 213 extends along the second direction X and has a length greater than or equal to 2 mm. Limiting the length of the third line segment 213 helps to increase the width of the right side of the first side 210 of the main body 21, and to a certain extent, increases the length of the first side 210. This also increases the contact area between the main body 21 and the display panel 10. Based on the adhesive structure 30, this further enhances the adhesion between the main body 21 and the display panel 10, preventing the main body 21 from warping due to repeated pulling at this location, which could lead to peeling from the display panel 10. This improves the stability of the display module 100 structure and enhances the quality of the display module 100.

[0246] The third type: such as Figure 4A As shown, both the first line segment 211 and the third line segment 213 extend along the second direction X, and their lengths are greater than or equal to 2 mm. Limiting the lengths of the first line segment 211 and the third line segment 213 helps to increase the length of both sides of the first side 210 of the main body 21. It also increases the contact area between the main body 21 and the display panel 10. Based on the adhesive structure 30, this further enhances the adhesion between the main body 21 and the display panel 10, preventing the main body 21 from warping due to repeated pulling at this location, which could lead to peeling from the display panel 10. This improves the stability of the display module 100 structure and enhances the quality of the display module 100.

[0247] When at least one of the first segment 211 and the third segment 213 extends along the second direction X and its length is equal to or close to 2 mm, it is equivalent to at least one end of the main body 21 expanding outward relative to the neck 22. This can help the adhesive structure 30 increase the adhesion between the main body 21 and the display panel 10, prevent warping at the first side 210 position due to the large tensile stress received at the position of the second segment 212, and improve the quality of the display module 100.

[0248] For example, at least one of the first line segment 211 and the third line segment 213 extends along the second direction X and has a length of 2mm, 3mm, 4mm, 5mm, 6mm, 7mm, 8mm, 9mm or 10mm.

[0249] In some embodiments, such as Figure 4A As shown, the length of the first line segment 211 is approximately equal to the length of the third line segment 213.

[0250] The length of the first line segment 211 is set to be approximately equal to the length of the third line segment 213, so that the neck 22 is connected to the middle position (second line segment 212) of the first edge 210 of the main body 21. The structure of the flexible circuit board 20 is relatively regular, which helps to simplify the manufacturing process of the flexible circuit board 20.

[0251] Figure 4B This is a connection diagram of the body and neck of a flexible circuit board according to some other embodiments.

[0252] In other embodiments, such as Figure 4B As shown, the length of the first line segment 211 is greater than the length of the third line segment 213.

[0253] Since other components are located on the backlight surface of the display panel 10, for example, on the right side of the display panel 10, that is, at the position corresponding to the third line segment 213, other components are located there. The length of the first line segment 211 is greater than the length of the third line segment 213. The shorter length of the third line segment 213 allows the neck 22 of the flexible circuit board 20 to avoid other components, preventing them from affecting the quality of the display module 100. The longer length of the first line segment 211 ensures the relative area between the main body 21 and the display panel 10, which helps the adhesive structure 30 to increase the adhesion between this part of the main body 21 and the display panel 10, preventing the main body 21 from peeling off the display panel 10 and improving the quality of the display module 100.

[0254] In some embodiments, such as Figure 4A and Figure 4B As shown, based on the premise that the length of the first line segment 211 is greater than or equal to the length of the third line segment 213: the length of the first line segment 211 is greater than or equal to 8mm.

[0255] When the length of the first line segment 211 is equal to or close to 8mm, the contact area requirement between the main body 21 and the display panel 10 can be met, so that an adhesive structure 30 can be provided between the main body 21 and the display panel 10 to increase the adhesion between the main body 21 and the adhesive structure 30. At the same time, it can also prevent the length of the first line segment 211 from being too long, which would affect the layout of the flexible circuit board 20.

[0256] For example, the length of the first line segment 211 is equal to one of 8mm, 10mm, 12mm or 15mm.

[0257] Figure 4C This is a connection diagram of the main body and the neck of a flexible circuit board according to some other embodiments.

[0258] In some other embodiments, such as Figure 4C As shown, the length of the first line segment 211 is less than the length of the third line segment 213.

[0259] Since other components are disposed on the backlight surface of the display panel 10, for example, on the left side of the display panel 10, that is, on the side corresponding to the first line segment 211, the length of the first line segment 211 is set to be less than the length of the third line segment 213. The shorter length of the first line segment 211 allows the neck 22 of the flexible circuit board 20 to avoid other components, preventing any impact on the quality of the display module 100. The longer length of the third line segment 213 ensures sufficient relative area between the main body 21 and the display panel 10, which helps the adhesive structure 30 increase the adhesion between this part of the main body 21 and the display panel 10, preventing the main body 21 from peeling off the display panel 10 and improving the quality of the display module 100.

[0260] In some embodiments, such as Figure 4A and Figure 4C As shown, when the length of the first line segment 211 is less than the length of the third line segment 213: the length of the third line segment 213 is greater than or equal to 8mm.

[0261] When the length of the third segment 213 is equal to or close to 8mm, the contact area requirement between the main body 21 and the display panel 10 can be met, so that an adhesive structure 30 can be provided between the main body 21 and the display panel 10 to increase the adhesion between the main body 21 and the adhesive structure 30. At the same time, it can also prevent the length of the first segment 211 from being too long, which would affect the layout of the flexible circuit board 20.

[0262] For example, the length of the third segment 213 is equal to one of 8mm, 10mm, 12mm or 15mm.

[0263] Figure 4D This is a connection diagram of the main body and the neck of a flexible circuit board according to some other embodiments.

[0264] In some other embodiments, such as Figure 4D As shown, both the first line segment 211 and the third line segment 213 extend along the second direction X. The first side 210 also includes a fourth line segment 214, which connects the first line segment 211 and the second line segment 212. The middle portion of the fourth line segment 214 protrudes towards the second side 215. The second side 215 is the opposite side of the first side 210 in the main body 21. The fourth line segment 214 defines a groove structure C, and the dimension C1 of the groove structure C along the second direction X is greater than or equal to the dimension C2 of the groove structure C along the first direction Y.

[0265] The first side 210 of the main body 21 also includes a fourth line segment 214, the middle part of which protrudes toward the second side 215 to form a groove structure C. The fourth line segment 214 connects the first line segment 211 and the second line segment 212. That is, the groove structure C is provided on the side of the first line segment 211 near the second line segment 212.

[0266] The groove structure C at this location can alleviate the tensile stress on the first line segment 211 and the second line segment 212, thereby preventing the first line segment 211 and the second line segment 212 in the main body 21 from being repeatedly pulled up and warping, which could lead to the problem of peeling off from the display panel 10. This is beneficial to improving the stability of the display module 100 structure and improving the quality of the display module 100.

[0267] The dimension C1 of the groove structure C along the second direction X is set to be greater than or equal to the dimension C2 of the groove structure C along the first direction Y. That is, the width C1 of the groove structure C is set to be greater than or equal to the depth C2 of the groove structure C. Figure 4B The illustration takes the example where the width C1 of the groove structure C is equal to the depth C2 of the groove structure C. It can be understood that in some other embodiments, the width C1 of the groove structure C can be set to be greater than the depth C2 of the groove structure C.

[0268] In some embodiments, combined with Figure 4D As shown, the width C1 of the groove structure C is greater than or equal to 5 mm. Setting the width C1 of the groove structure C to be larger, which is equivalent to occupying a larger proportion of the first side 210 of the main body 21 in the second direction X, can better alleviate the tensile stress at the positions of the first line segment 211 and the second line segment 212.

[0269] In some embodiments, combined with Figure 4D As shown, the depth C2 of the groove structure C is greater than or equal to 2 mm. Setting the depth C2 of the groove structure C to be smaller can reduce its proportion of the main body 21 in the first direction Y, preventing it from affecting the dimensions within the main body 21 and thus the routing and component layout within the main body 21. Simultaneously, it can also prevent the groove structure C from being too deep, which would cause greater stress on the bottom of the groove structure C and potentially affect the quality of the main body 21.

[0270] In some embodiments, combined with Figure 4D As shown, the cross-sectional shape of the groove structure C can be U-shaped, meaning the bottom of the groove structure C is connected to its sidewall via an arc-shaped surface. This can also reduce the tensile stress on the groove structure C, preventing it from affecting the quality of the flexible circuit board 20.

[0271] However, the specific shape of the C-section of the groove structure is not limited in the embodiments disclosed herein; only a U-shape is used as an example for illustration. It is understood that in some other embodiments, the shape of the C-section of the groove structure can be a semi-circle.

[0272] In some embodiments, based on the provision of the fourth line segment 214, the length of the first line segment 211 can be greater than or equal to the width C1 of the groove structure C. By utilizing the groove structure C to reduce the tensile stress at the positions of the first line segment 211 and the second line segment 212, the first line segment 211 can satisfy the contact area between the main body 21 and the display panel 10. This allows the adhesive structure 30 to increase the adhesion between the main body 21 and the display panel 10, preventing the main body 21 from peeling off the display panel 10 and improving the quality of the display module 100. For example, the length of the first line segment 211 can be greater than or equal to 5 mm in this case.

[0273] in, Figure 4D The illustration takes the placement of the fourth line segment 214 between the first line segment 211 and the second line segment 212 as an example. However, this disclosure is not limited to this. It is understood that in some embodiments, the fourth line segment 214 can be placed between the third line segment 213 and the second line segment 212. In this case, the structure of the second line segment 212 can be the same as the structure of the corresponding first line segment 211, which will not be described again here.

[0274] Figure 4E This is a connection diagram of the main body and the neck of a flexible circuit board according to some other embodiments.

[0275] In some other embodiments, such as Figure 4E As shown, the second line segment 212 extends along the second direction X. The angle α between the first line segment 211 and the side of the neck 22 extending along the first direction Y is an obtuse angle.

[0276] and Figures 4A to 4D The difference is, Figures 4A to 4D The first line segment 211 and the third line segment 213 shown are both arranged along the second direction X, which can relatively simplify the manufacturing process of the first side 210 in the flexible circuit board 20. Figure 4E Taking the example of the first line segment 211 forming an angle with the second direction X, that is, the first side 210 of the flexible circuit board 20 includes a hypotenuse (first line segment 211) and a straight side (second line segment 212 and third line segment 213). With this arrangement, the size of the main body 21 in the flexible circuit board 20 can be relatively reduced, thereby better avoiding other components on the backlight surface of the display panel 10 and avoiding problems such as mutual short circuits or crosstalk.

[0277] In some examples, the included angle is 90° < α ≤ 170°. When the included angle α is equal to or close to 90°, the first line segment 211 is nearly horizontal, which better ensures the size of the main body 21, thereby allowing the adhesive structure 30 to better fix the main body 21 and the display panel 10. Simultaneously, it can also avoid some components located on the backlight side of the display panel 10 to a certain extent. When the included angle α is equal to or close to 170°, it can better avoid components located on the backlight side of the display panel 10. It also meets the size requirements of the main body 21, and the adhesive structure 30 can be used to fix the main body 21 and the display panel 10.

[0278] In another example, the included angle is 120° < α ≤ 150°. When the included angle α is equal to or close to 120°, some components mounted on the backlight side of the display panel 10 can be avoided to a certain extent while ensuring the size of the main body 21. When the included angle α is equal to or close to 150°, the size requirements of the main body 21 can be met while better avoiding components mounted on the backlight side of the display panel 10.

[0279] For example, the included angle α is one of 150°, 155°, 160°, 165° or 170°.

[0280] In some embodiments, such as Figure 4E As shown, with the angle α between the first line segment 211 and the side extending along the first direction Y in the neck portion 22 being an obtuse angle, a portion of the adhesive structure 30 can extend along the extension direction of the first line segment 211. This helps increase the adhesion between the main body portion 21 and the display panel 10 near the first line segment 211, preventing the main body portion 21 from peeling off the display panel 10 and improving the quality of the display module 100.

[0281] Figure 4F This is a connection diagram of the main body and the neck of a flexible circuit board according to some other embodiments.

[0282] In some other embodiments, such as Figure 4F As shown, the neck portion 22 includes a transition portion 220 near the main body portion 21. The transition portion 220 includes a mesh structure T.

[0283] That is, a mesh structure T is provided on the side of the neck 22 near the main body 21, which increases the flexibility of the side of the neck 22 near the main body 21. As a result, the mesh structure T can reduce the tensile stress on the main body 21, thereby helping to prevent the main body 21 from peeling off the display panel 10 and improving the quality of the display module 100.

[0284] In some embodiments, such as Figure 4FAs shown, the neck portion 22 may include a flexible substrate and a wiring layer located on one side of the flexible substrate. The wiring layer includes grid wiring, which is located in the transition portion 220, forming a grid structure T.

[0285] This disclosure does not limit the specific signals transmitted in the mesh routing; the settings can be adjusted according to actual conditions. In some examples, this disclosure can avoid using high-frequency signal routing in the mesh routing to prevent high-frequency signal crosstalk.

[0286] In some embodiments, such as Figure 4F As shown, the ratio of the line width of the grid lines to the gap between adjacent grid lines in the grid structure T ranges from 1:3 to 1:9.

[0287] When the ratio of the line width of the grid lines in the grid structure T to the gap between adjacent grid lines is equal to or close to 1:3, the gap between adjacent grid lines is smaller, which is beneficial for setting up a larger number of grid traces. At the same time, it can also increase the flexibility of the neck 22 near the main body 21. Thus, the grid structure T can be used to reduce the tensile stress on the main body 21, thereby helping to prevent the main body 21 from peeling off the display panel 10 and improving the quality of the display module 100.

[0288] When the ratio of the line width of the grid lines in the grid structure T to the gap between adjacent grid lines is equal to or close to 1:9, the gap between adjacent grid lines is larger, which helps to increase the flexibility of the neck 22 near the main body 21. Therefore, the grid structure T can be used to reduce the tensile stress on the main body 21, thereby helping to prevent the main body 21 from peeling off the display panel 10 and improving the quality of the display module 100. At the same time, it can also meet the display module 100's requirement for the number of grid traces.

[0289] In other embodiments, such as Figure 4F As shown, the ratio of the line width of the grid lines to the gap between adjacent grid lines in the grid structure T ranges from 1:4 to 1:7.

[0290] When the ratio of the line width of the grid lines in the grid structure T to the gap between adjacent grid lines is equal to or close to 1:4, a smaller gap between adjacent grid lines is beneficial for setting up a larger number of grid lines. At the same time, it can also increase the flexibility of the side of the neck 22 near the main body 21.

[0291] When the ratio of the line width of the grid lines in the grid structure T to the gap between adjacent grid lines is equal to or close to 1:7, a larger gap between adjacent grid lines helps to better increase the flexibility of the neck 22 near the main body 21. At the same time, it can also meet the display module 100's requirement for the number of grid traces.

[0292] For example, the ratio of the line width of the grid lines to the gap between adjacent grid lines in the grid structure T is one of 1:3, 1:4, 1:5, 1:6, 1:7, 1:8 or 1:9.

[0293] In some embodiments, such as Figure 4F As shown, the transition portion 220 includes a first transition portion 221 and a second transition portion 222. The first transition portion 221 is closer to the main body portion 21 than the second transition portion 222. The width of the first transition portion 221 on the side closer to the main body portion 21 is greater than the width of the first transition portion 221 on the side farther from the main body portion 21.

[0294] Since the width of the neck portion 22 is generally smaller than the width of the main body portion 21, making the side of the first transition portion 221 that contacts the main body portion 21 wider can increase the connection area between the first transition portion 221 and the main body portion 21, which can further disperse the tensile stress received at this location and prevent stress concentration that could lead to cracks or warping.

[0295] In other embodiments, such as Figure 4F As shown, the width of the first transition portion 221 gradually decreases along a third direction. The third direction extends from the end of the first transition portion 221 closest to the main body portion 21 to the end of the first transition portion 221 furthest from the main body portion 21.

[0296] Setting the width of the first transition section 221 to gradually change can help to distribute tensile stress more evenly, which is beneficial to more effectively preventing stress concentration, cracks, or warping.

[0297] In some embodiments, such as Figure 4F As shown, the first transition portion 221 includes a first side 221a and a second side 221b that are opposite each other along the second direction X. The first side 221a is connected to the first line segment 211, and the second side 221b is connected to the third line segment 213.

[0298] The angle at which the first side 221a intersects the first line segment 211 is an acute angle, and the angle at which the second side 221b intersects the third line segment 213 is also an acute angle. This ensures that the width of the first transition portion 221 on the side closer to the main body portion 21 is greater than the width of the first transition portion 221 on the side farther from the main body portion 21. The wider width on the side of the first transition portion 221 that contacts the main body portion 21 increases the connection area between the first transition portion 221 and the main body portion 21, which can further disperse the tensile stress at this location, preventing stress concentration that could lead to cracks or warping.

[0299] For example, the angle between the first side 221a and the first line segment 211 is 45°, and the angle between the second side 221b and the third line segment 213 is 45°. This can both increase the width of the side where the first transition portion 221 contacts the main body portion 21 and simplify the manufacturing process.

[0300] Figure 4G This is a connection diagram of the main body and the neck of a flexible circuit board according to some other embodiments.

[0301] In some other examples, such as Figure 4G As shown, both the first side 221a and the second side 221b are curved edges. The neck portion 22 is connected to the main body portion 21 via the curved edge, or the connection point between the neck portion 22 and the main body portion 21 can be rounded. The curved edge can further disperse the tensile stress at this location, thereby helping to reduce the tensile stress applied to the main body portion 21. This helps to prevent the main body portion 21 from peeling off the display panel 10, improving the quality of the display module 100.

[0302] Figure 5A for Figure 2C A cross-sectional view along the M-M' direction.

[0303] In some embodiments, such as Figure 5A As shown, the display module 100 also includes a heat dissipation film 40. The heat dissipation film 40 is located between the display panel 10 and the flexible circuit board 20. The heat dissipation film 40 includes an adhesive layer 41, a first buffer layer 42, and a first heat dissipation layer 43. The first buffer layer 42 is located between the adhesive layer 41 and the first heat dissipation layer 43; the adhesive layer 41 is closer to the display panel 10 than the first buffer layer 42.

[0304] As shown in the above structure, the adhesive layer 41 on one side of the heat dissipation film 40 is connected to the display panel 10, and the first heat dissipation layer 43 on the other side of the heat dissipation film 40 can be connected to the adhesive structure 30. This allows the heat dissipation film 40 to be attached to the backlight side S2 of the display panel 10, which can play a role in heat dissipation and help the heat generated by the display panel 10 during operation to dissipate quickly. In addition, it can also play a role in light shielding.

[0305] Figure 5A for Figure 2C Another cross-sectional view along the M-M' direction.

[0306] In other embodiments, such as Figure 5A As shown, in the heat dissipation film 40 provided in this embodiment, at least one buffer layer includes a first buffer layer 42 and a second buffer layer 44. That is, the heat dissipation film 40 in this embodiment may include two buffer layers. The two buffer layers may be the first buffer layer 42 and the second buffer layer 44, respectively.

[0307] Based on this, the heat dissipation film 40 includes an adhesive layer 41, a first buffer layer 42, a second buffer layer 44, and a first heat dissipation layer 43. The adhesive layer 41 is closer to the display panel 10 than the first buffer layer 42. The first buffer layer 42 is located between the adhesive layer 41 and the second buffer layer 44. The elastic modulus of the second buffer layer 44 is greater than that of the first buffer layer 42.

[0308] As shown in the above structure, the adhesive layer 41 on one side of the heat dissipation film 40 is connected to the display substrate U, and the first heat dissipation layer 43 on the other side of the heat dissipation film 40 can be connected to the adhesive structure 30. The first buffer layer 42 and the second buffer layer 44 are located between the adhesive layer 41 and the first heat dissipation layer 43, and the second buffer layer 44 is located between the first buffer layer 42 and the first heat dissipation layer 43. That is, the second buffer layer 44 is farther away from the display substrate U than the first buffer layer 42. Based on this, the elastic modulus of the second buffer layer 44 is set to be greater than that of the first buffer layer 42, and the second buffer layer 44 has better elasticity and recovery performance than the first buffer layer 42. When the display module 100 is subjected to an external impact, the second buffer layer 44 can first resist part of the stress, and then the remaining part of the stress can be applied to the first buffer layer 42, which can buffer this part of the stress to prevent damage to the display panel 10.

[0309] In some embodiments, the material of the second buffer layer 44 may be any one of polyimide (PI), thermoplastic polyurethanes (TPU), thermoplastic rubber (TPE), or thermoplastic polyester elastomer (TPEE), or a combination of two or more of these materials. This disclosure does not limit this to any particular material, or other materials with an elastic modulus greater than that of the foam may also be used.

[0310] In some embodiments, the thickness of the second buffer layer 44 ranges from 0.02 mm to 0.2 mm. When the thickness of the second buffer layer 44 is equal to or close to 0.02 mm, it can meet the display module 100's requirements for buffering and recovering from external forces while also facilitating the thinning of the display module 100 and preventing waste of resources. When the thickness of the second buffer layer 44 is equal to or close to 0.2 mm, it can meet the requirements for thinning the display module 100 while providing better buffering and recovery effects, preventing external forces from damaging the display panel 10.

[0311] In some other embodiments, the thickness of the second buffer layer 44 ranges from 0.05 mm to 0.18 mm. In still other embodiments, the thickness of the second buffer layer 44 ranges from 0.08 mm to 0.15 mm.

[0312] For example, the thickness of the second buffer layer 44 is one of 0.05mm, 0.08mm, 0.1mm, 0.12mm, 0.15mm, 0.18mm or 0.2mm.

[0313] Figure 5B for Figure 2C Another cross-sectional view along the M-M' direction.

[0314] In some embodiments, such as Figure 5B As shown, in the heat dissipation film 40 provided in this embodiment, at least one heat dissipation layer includes a first heat dissipation layer 43 and a second heat dissipation layer 45. That is, in this embodiment, the heat dissipation film 40 may include two heat dissipation layers, namely the first heat dissipation layer 43 and the second heat dissipation layer 45.

[0315] Based on this, the heat dissipation film 40 includes an adhesive layer 41, a first buffer layer 42, a first heat dissipation layer 43, and a second heat dissipation layer 45. The adhesive layer 41 is closer to the display panel 10 than the first buffer layer 42. The second heat dissipation layer 45 is located on the side of the first heat dissipation layer 43 away from the adhesive layer 41.

[0316] As shown in the above structure, the adhesive layer 41 on one side of the heat dissipation film 40 is connected to the display substrate U, and the second heat dissipation layer 45 on the other side of the heat dissipation film 40 can be connected to the adhesive structure 30. The first buffer layer 42 and the first heat dissipation layer 43 are located between the adhesive layer 41 and the second heat dissipation layer 45. The second heat dissipation layer 45 is used to dissipate heat from the display module 100 first, and then the first heat dissipation layer 43 is used to dissipate heat from the display module 100. That is, the first heat dissipation layer 43 and the second heat dissipation layer 45 can be used together to dissipate heat from the display module 100, so that the heat dissipation film 40 has a better heat dissipation effect.

[0317] In some examples, the material of the second heat dissipation layer 45 can be graphite.

[0318] Figure 5C for Figure 2C Another cross-sectional view along the M-M' direction.

[0319] In some embodiments, such as Figure 5CAs shown, in the heat dissipation film 40 provided in this embodiment: at least one heat dissipation layer includes a first heat dissipation layer 43 and a second heat dissipation layer 45. At least one buffer layer includes a first buffer layer 42 and a second buffer layer 44. That is, the heat dissipation film 40 in this embodiment may include two buffer layers and two heat dissipation layers. The two buffer layers are the first buffer layer 42 and the second buffer layer 44, respectively. The two heat dissipation layers are the first heat dissipation layer 43 and the second heat dissipation layer 45, respectively.

[0320] Based on this, the heat dissipation film 40 includes an adhesive layer 41, a first buffer layer 42, a second buffer layer 44, a first heat dissipation layer 43, and a second heat dissipation layer 45. The second buffer layer 44 is located between the first buffer layer 42 and the first heat dissipation layer 43. The elastic modulus of the second buffer layer 44 is greater than that of the first buffer layer 42. The second heat dissipation layer 45 is located on the side of the first heat dissipation layer 43 away from the adhesive layer 41.

[0321] As shown in the above structure, the adhesive layer 41 on one side of the heat dissipation film 40 is connected to the display substrate U, and the second heat dissipation layer 45 on the other side of the heat dissipation film 40 can be connected to the adhesive structure 30. The first buffer layer 42, the second buffer layer 44, and the first heat dissipation layer 43 are located between the adhesive layer 41 and the second heat dissipation layer 45. When the display module 100 is subjected to an external impact, the second buffer layer 44 can first resist part of the stress, and then the remaining stress can be applied to the first buffer layer 42. The first buffer layer 42 buffers this part of the stress, preventing damage to the display panel 10 (display substrate U). Furthermore, the first heat dissipation layer 43 and the second heat dissipation layer 45 can be used together to dissipate heat from the display module 100, giving the heat dissipation film 40 a better heat dissipation effect.

[0322] Figure 6A This is a structural diagram of the backlight side of a display module according to some other embodiments.

[0323] In some embodiments, such as Figure 6A As shown, the display module 100 also includes a shielding film 50. The shielding film 50 is located on the side of the main body 21 away from the display panel 10. The orthographic projection of the shielding film 50 onto the display surface of the display panel 10 covers the orthographic projection of the main body 21 onto the display surface of the display panel 10. The shielding film 50 can be used to shield against external electromagnetic influences, ensuring the display quality of the display module 100.

[0324] In some embodiments, such as Figure 6A As shown, the shielding film 50 is provided on the basis of the orthographic projection of the main body 21 on the display surface of the display panel 10 covering the orthographic projection of the main body 21 on the display surface of the display panel 10, and at least one side boundary B of the orthographic projection of the shielding film 50 on the display surface of the display panel 10 is located outside the orthographic projection of the main body 21 on the display surface of the display panel 10.

[0325] By setting at least one boundary B of the shielding film 50's orthographic projection onto the display surface of the display panel 10, located outside the orthographic projection of the main body 21 onto the display surface of the display panel 10, the shielding film 50 is set to extend outward relative to the main body 21. This prevents the shielding film 50 from failing to cover the entire orthographic projection of the main body 21 onto the display surface of the display panel 10 under uncontrollable errors (such as manufacturing process errors, equipment precision errors, measurement errors, etc.). This allows for better shielding against external electromagnetic influences by the shielding film 50, ensuring the display quality of the display module 100.

[0326] In some embodiments, such as Figure 6A As shown, the shielding film 50, projected onto the display surface of the display panel 10, includes a first boundary B1 near the neck portion 22. The first boundary B1 is located outside the projection of the main body portion 21 onto the display surface of the display panel 10.

[0327] The first boundary B1 of the shielding film 50 projected onto the display surface of the display panel 10 is located outside the projection of the main body 21 onto the display surface of the display panel 10. That is, the shielding film 50 extends outward on the side near the neck 22, and the projection of the shielding film 50 onto the display surface of the display panel 10 can also cover part of the projection of the neck 22 onto the display surface of the display panel 10.

[0328] Since the shielding film 50 is located on the side of the flexible circuit board 20 away from the display panel 10, and the shielding film 50 is projected onto the display surface of the display panel 10, it can also cover part of the neck portion 22 projected onto the display surface of the display panel 10. Furthermore, the shielding film 50 can be used to fix the main body 21, preventing the main body 21 from easily peeling off the display panel 10, thus improving the quality of the display module 100.

[0329] In other embodiments, such as Figure 6A As shown, the orthographic projection of the shielding film 50 onto the display surface of the display panel 10 includes a second boundary B2. The second boundary B2 is connected to the first boundary B1 and forms an obtuse angle. The second boundary B is located outside the orthographic projection of the main body portion 21 onto the display surface of the display panel 10.

[0330] In this embodiment, the second boundary B2 of the shielding film 50 also extends outward relative to the main body 21. The second boundary B2 is connected to the first boundary B1 at an obtuse angle. The area P formed by the second boundary B2 and the first boundary B1 can be extended outward relative to the corner J of the main body 21 near the neck 22.

[0331] When the flexible circuit board 20 is repeatedly pulled up, the edge of the main body 21 near the neck 22 and the end position of that edge experience greater tensile stress. With the shielding film 50 provided as described above, the area P formed by the second boundary B2 and the first boundary B1 of the shielding film 50 can be used to fix the corner J of the main body 21, further preventing the main body 21 from easily peeling off the display panel 10 and improving the quality of the display module 100.

[0332] In some embodiments, such as Figure 6A As shown, the minimum distance between the first boundary B1 projected onto the display surface of the display panel 10 and the corresponding edge of the main body 21 projected onto the display surface of the display panel 10 is 2mm to 15mm.

[0333] When the minimum spacing is equal to or close to 2mm, the outward expansion of the shielding film 50 is small, which can effectively prevent resource waste while shielding against external electromagnetic influences and fixing the main body 21. When the minimum spacing is equal to or close to 15mm, the outward expansion of the shielding film 50 is large, which can better prevent resource waste, shield against external electromagnetic influences, fix the main body 21, and improve the quality of the display module 100.

[0334] In some other embodiments, the minimum distance between the orthographic projection of the first boundary B1 onto the display surface of the display panel 10 and the orthographic projection of the corresponding edge of the main body 21 onto the display surface of the display panel 10 ranges from 3.5 mm to 10 mm. In still other embodiments, the minimum distance between the orthographic projection of the first boundary B1 onto the display surface of the display panel 10 and the orthographic projection of the corresponding edge of the main body 21 onto the display surface of the display panel 10 ranges from 5 mm to 8 mm.

[0335] For example, the minimum distance between the first boundary B1 projected onto the display surface of the display panel 10 and the corresponding edge of the main body 21 projected onto the display surface of the display panel 10 is one of 2mm, 3mm, 4mm, 5mm, 6mm, 7mm, 8mm, 9mm or 10mm.

[0336] Figure 6B for Figure 6A A cross-sectional view along the N-N' direction.

[0337] In some embodiments, the shielding film 50 includes a first insulating layer 51, a shielding layer 52, and a second insulating layer 53. The shielding layer 52 is located between the first insulating layer 51 and the second insulating layer 53, and the first insulating layer 51 is closer to the flexible circuit board 20 relative to the shielding layer 52.

[0338] The first insulating layer 51 is closer to the flexible circuit board 20 than the shielding layer 52, and can be used to insulate the flexible circuit board 20 from the shielding layer 52, preventing short circuits between the flexible circuit board 20 and the shielding layer 52. Simultaneously, the first insulating layer 51 can also be used to bond and fix the flexible circuit board 20 and the shielding layer 52 respectively.

[0339] In some examples, the first insulating layer 51 may be an insulating adhesive layer.

[0340] In some examples, the thickness of the first insulating layer 51 ranges from 10 μm to 100 μm. When the thickness of the first insulating layer 51 is equal to or close to 10 μm, it can satisfy the need for fixing and bonding the shielding layer 52 and the flexible circuit board 20. At the same time, the thinner thickness of the first insulating layer 51 can also help to make the display module 100 thinner and lighter, and avoid wasting resources. When the thickness of the first insulating layer 51 is equal to or close to 100 μm, it can prevent waste of resources. At the same time, because the first insulating layer 51 is thicker, the adhesion of the first insulating layer 51 is stronger, which can better fix and bond the shielding layer 52 and the flexible circuit board 20.

[0341] In other examples, the thickness of the first insulating layer 51 ranges from 20 μm to 50 μm.

[0342] For example, the thickness of the first insulating layer 51 is one of 10 μm, 20 μm, 30 μm, 40 μm or 50 μm.

[0343] The second insulating layer 53 is located on the side of the shielding layer 52 away from the first insulating layer 51, and is located on the outermost side inside the shielding film 50. The second insulating layer 53 can be used to protect the shielding layer 52.

[0344] In some examples, the material of the first insulating layer 51 may be the same as that of the second insulating layer 53, both being insulating adhesive layers. In other examples, the material of the first insulating layer 51 may be different from that of the second insulating layer 53. This disclosure does not limit the specific materials used.

[0345] In some examples, the thickness of the second insulating layer 53 ranges from 20 μm to 100 μm. When the thickness of the second insulating layer 53 is equal to or close to 20 μm, it can satisfy the requirement of fixing the protective shielding layer 52. At the same time, the thinner thickness of the second insulating layer 53 can also help to make the display module 100 thinner and lighter, and avoid wasting resources. When the thickness of the second insulating layer 53 is equal to or close to 100 μm, it can prevent waste of resources. At the same time, because the second insulating layer 53 is thicker, the adhesion of the second insulating layer 53 is stronger, which can better fix and adhere the shielding layer 52.

[0346] In other examples, the thickness of the first insulating layer 51 ranges from 30 μm to 50 μm.

[0347] For example, the thickness of the first insulating layer 51 is one of 10 μm, 20 μm, 30 μm, 40 μm or 50 μm.

[0348] In some embodiments, such as Figure 6B As shown, with the second insulating layer 53 being further away from the display panel 10 relative to the first insulating layer 51, the thickness of the second insulating layer 53 is set to be greater than or equal to the thickness of the first insulating layer 51.

[0349] The first type: such as Figure 6A As shown, the thickness of the second insulating layer 53 is equal to the thickness of the first insulating layer 51.

[0350] Setting the two insulating layers in the shielding film 50 to have equal thickness can simplify the manufacturing process of the shielding film 50.

[0351] The second type: the thickness of the second insulating layer 53 is greater than the thickness of the first insulating layer 51.

[0352] The outer second insulating layer 53 is made thicker to better protect the shielding layer 52 and the display module 100. The inner first insulating layer 51 is made thinner to save insulating layer resources while still allowing for bonding of the flexible circuit board 20 and the shielding layer 52.

[0353] Figure 6C for Figure 6A Another cross-sectional view along the N-N' direction. Figure 6D for Figure 6A Another cross-sectional view along the N-N' direction.

[0354] In some embodiments, such as Figures 6B to 6D As shown, when the shielding film 50 includes a first insulating layer 51, a shielding layer 52, and a second insulating layer 53, at least one of the first insulating layer 51, the shielding layer 52, and the second insulating layer 53 can be provided at least one boundary of the orthographic projection of the main body 21 onto the display surface of the display panel 10, located outside the orthographic projection of the main body 21 onto the display surface of the display panel 10. The outwardly extending film layer in the shielding film 50 can be used to fix the main body 21, preventing the main body 21 from easily peeling off the display panel 10 and improving the quality of the display module 100.

[0355] in, Figure 6B The following is an illustration of the expansion of the second insulating layer 53. Figure 6C The diagram is illustrated using the example of the outer expansion of the shielding layer 52. Figure 6DThe diagram illustrates the metal structure of the first insulating layer 51 being expanded outwards. However, this embodiment is not limited to this; any two layers of the shielding film 50 may also be expanded outwards, or all three layers may be designed to be expanded outwards.

[0356] Figure 6E for Figure 6A A cross-sectional view along the I-I' direction.

[0357] In some embodiments, such as Figure 6A and Figure 6E As shown, the display module 100 also includes a driver chip 60. The driver chip 60 is located on the backlight side S2 of the display panel 10. The driver chip 60 is used to drive the display panel 10. The first insulating layer 51 includes a first via K. The driver chip 60 passes through the first via K and contacts the shielding layer 52. In a direction parallel to the display surface of the display panel 10, a portion of the shielding layer 52 protrudes from the flexible circuit board 20 and the first insulating layer 51, so that a portion of the shielding layer 52 contacts the heat dissipation film 40.

[0358] With this configuration, when the display module 100 is working, the driver chip 60 drives the display panel 10, generating heat. Since the driver chip 60 passes through the first via K and contacts the shielding layer 52, and part of the shielding layer 52 contacts the heat dissipation film 40, the heat generated by the driver chip 60 is conducted to the shielding layer 52, which then transfers this heat to the heat dissipation film 40. This allows the heat dissipation film 40 to cool the driver chip 60, preventing excessive heat from affecting its performance and lifespan.

[0359] in, Figure 6E The illustration is based on an example where the shielding layer 52 is expanded outwards while the first insulating layer 51 is not expanded outwards. This allows a portion of the shielding layer 52 to contact the heat dissipation film 40. In this case, the second insulating layer 53 can be expanded outwards. The degree of expansion of the second insulating layer 53 has no effect on the contact between a portion of the shielding layer 52 and the heat dissipation film 40, and can be flexibly configured. It is understood that when the first insulating layer 51 is also expanded outwards, and when the first insulating layer 51 is provided between the shielding layer 52 and the heat dissipation film 40, the first insulating layer 51 can be provided with a second through-hole, allowing a portion of the shielding layer 52 to contact the heat dissipation film 40 through the second through-hole.

[0360] Figure 6F This is a structural diagram of the backlight side of a display module according to some other embodiments. Figure 6G for Figure 6F A cross-sectional view along the F-F' direction.

[0361] The statement that "the display module 100 also includes a driver chip 60. The driver chip 60 is located on the backlight side S2 of the display panel 10" can include the following two cases:

[0362] The first type: such as Figure 6A As shown, the display panel 10 (display substrate U) includes a display section and a bonding section. The bonding section includes a flexible circuit board 20. The flexible circuit board 20 can be bent to the backlight side of the display panel 10.

[0363] At this point, the driver chip 60 can be fixed to the flexible circuit board 20 using COF (Chip On Film) technology. Furthermore, the driver chip 60 is positioned at one end of the main body 21 near the neck portion 22. Thus, the driver chip 60 bends along with this portion of the main body 21 to the backlight side of the display panel 10. This reduces the occupancy of the driver chip 60 and the flexible circuit board 20 on the bezel of the light-emitting side S1 of the display panel 10, facilitating a narrow bezel for the display panel 10 and increasing the screen-to-body ratio of the display module 100.

[0364] The second type: such as Figure 6F and Figure 6G As shown, the display panel 10 is a flexible display panel. The display panel 10 (display substrate) includes a display portion 11, a bending portion 12, and a bonding portion 13. The bending portion 12 is located between the display portion 11 and the bonding portion 13. The bonding portion 13 includes a flexible circuit board 20. The bonding portion of the display panel 10 can be bent to the backlight side S2 of the display panel 10 by means of the bending portion 12.

[0365] At this time, the driver chip 60 can be fixed on the bonding part using COP (Chip on Panel) technology, and the driver chip 60 is closer to the bending part 12 than the flexible circuit board 20.

[0366] When the bonding portion is bent to the backlight side S2 of the display panel 10 using the bending portion 12, both the flexible circuit board 20 and the driver chip 60 can be bent to the backlight side of the display panel 10 along with this bonding portion. This reduces the area occupied by the driver chip 60 and the flexible circuit board 20 on the bezel of the light-emitting side S1 of the display panel 10, which is beneficial for achieving a narrow bezel on the display panel 10 and increasing the screen-to-body ratio of the display module 100.

[0367] It is understandable that the above Figure 6E by Figure 6A The display module shown is used as an example for illustration, but it is not limited to this. Figure 6E The structure shown can also be applied to Figure 6F The display module 100 shown.

[0368] In some embodiments, such as Figure 6A and Figure 6EAs shown, along the direction parallel to the display surface of the display panel 10, the minimum distance between the driver chip 60 and the first via K is 0.5mm to 2mm. Setting the size of the first via K to be relatively large facilitates the alignment and installation of the driver chip 60.

[0369] When the minimum spacing between the driver chip 60 and the first via K is equal to or close to 0.5mm, it facilitates the alignment and installation of the driver chip 60 while preventing the first via K from being too large, which could easily lead to a short circuit between the shielding layer 52 and the flexible circuit board 20. When the minimum spacing between the driver chip 60 and the first via K is equal to or close to 2mm, it prevents the shielding layer 52 from easily leading to a short circuit between the flexible circuit board 20, while also preventing the first via K from being too small, which would be detrimental to the alignment and installation of the driver chip 60.

[0370] In some other embodiments, the minimum spacing between the driver chip 60 and the first via K along the direction parallel to the display surface of the display panel 10 is 0.8 mm to 1.8 mm. In still other embodiments, the minimum spacing between the driver chip 60 and the first via K along the direction parallel to the display surface of the display panel 10 is 1 mm to 1.5 mm.

[0371] For example, along the direction parallel to the display surface of the display panel 10, the minimum spacing between the driving chip 60 and the first via K is one of 0.2mm, 0.5mm, 0.8mm, 1mm, 1.2mm, 1.5mm, 1.8mm or 2mm.

[0372] In some embodiments, such as Figure 6A and Figure 6E As shown, the display module 100 also includes a heat-conducting structure 70. The heat-conducting structure 70 includes a first heat-conducting structure 71 and a second heat-conducting structure 72. The driver chip 60 contacts the shielding layer 52 through the first heat-conducting structure 71. The shielding layer 52 contacts the heat dissipation film 40 through the second heat-conducting structure 72.

[0373] The first heat-conducting structure 71 indirectly contacts the driver chip 60 and the shielding layer 52, fixing the driver chip 60 and the shielding layer 52 so that the heat generated when the driver chip 60 is working can be conducted to the shielding layer 52 through the first heat-conducting structure 71.

[0374] The shielding layer 52 and the heat dissipation film 40 are indirectly contacted through the second thermally conductive structure 72, fixing the shielding layer 52 and the heat dissipation film 40. This allows heat from the driver chip 60 to be conducted to the shielding layer 52 and then to the heat dissipation film 40 through the second thermally conductive structure 72. Finally, the heat dissipation film 40 is used to dissipate this heat, thereby preventing the driver chip 60 from overheating and affecting its performance and lifespan.

[0375] In some examples, such as Figure 6A and Figure 6E As shown, the materials of the first thermally conductive structure 71 and the second thermally conductive structure 72 can be the same, both being thermally conductive adhesive. It is understood that in other embodiments, the materials of the first thermally conductive structure 71 and the second thermally conductive structure 72 can also be different. This disclosure does not limit this, as long as it can serve the functions of bonding and thermal conduction.

[0376] Figure 7A This is an exploded view of a display module according to some embodiments. Figure 7B This is an exploded view of a display module according to some other embodiments. Wherein, Figure 7A The following is an example of a display module using COF technology. Figure 7B The following is an example of a display module using COP technology.

[0377] In some embodiments, such as Figure 7A and Figure 7B As shown, the display panel 10 also includes a first optical adhesive layer 102 and a polarizer 103.

[0378] A polarizer 103 is located between the display substrate U and the protective cover plate 101. The polarizer 103 can be a circular polarizer. Here, the polarizer 103 can reduce external light emission and prevent the display panel 10 from producing a glare effect.

[0379] A first optical adhesive layer 102 is located between the protective cover plate 101 and the polarizer 103. This allows the protective cover plate 101 and the polarizer 103 to be fixedly bonded together by the first optical adhesive layer 102. The material of the first optical adhesive layer 102 includes a thermosetting resin or a photocurable resin. For example, the material of the first optical adhesive layer 102 is OCA optical adhesive (Optical Clear Adhesive).

[0380] The above description is merely a specific embodiment of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any variations or substitutions conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

Claims

1. A display module, characterized in that, include: The display panel has a light-emitting side and a backlight side opposite to the light-emitting side; The display panel includes a protective cover plate, a display substrate, and a heat dissipation film; The display substrate is located between the protective cover and the heat dissipation film, and the protective cover is located on the side of the display substrate facing the light-emitting side; The heat dissipation film includes an adhesive layer, at least one buffer layer, and at least one heat dissipation layer; the at least one buffer layer is located between the adhesive layer and the at least one heat dissipation layer, and the adhesive layer is located on the side of the at least one buffer layer closer to the protective cover plate; A flexible circuit board includes a main body, a neck, and a connecting portion; the neck is located between the main body and the connecting portion; one end of the main body away from the neck is connected to the edge of the display panel; the connecting portion, the neck, and at least a portion of the main body are located on the backlight side of the display panel. An adhesive structure is located between the main body and the at least one heat dissipation layer, and at least a portion of the adhesive structure is located in the edge region of the main body near the neck. The adhesive structure includes a first adhesive structure and a second adhesive structure; The first adhesive structure includes a first part and a third part; the first part is located in the edge region of the main body near the neck; the third part is connected to the first part to form a frame structure extending along the edge of the main body; The second adhesive structure is located inside the frame structure, and the second adhesive structure and the frame structure are spaced apart.

2. The display module according to claim 1, characterized in that, The direction in which the neck extends is the first direction; The ratio of the dimension of the first portion along the first direction to the dimension of the main body portion along the first direction is greater than or equal to 10% and less than or equal to 50%.

3. The display module according to claim 2, characterized in that, The direction parallel to the display panel and perpendicular to the first direction is the second direction; At least one end of the first portion extends beyond the neck along the second direction.

4. The display module according to claim 3, characterized in that, The dimension of the first portion along the second direction is greater than the dimension of the neck portion along the first direction.

5. The display module according to claim 2, characterized in that, The two ends of the first portion along the first direction are flush with the two ends of the edge region of the main body near the neck along the first direction.

6. The display module according to claim 2, characterized in that, The first adhesive structure also includes a second part; The second part is located on the side of the first part away from the neck, and the second part is connected to the first part; Wherein, the sum of the dimensions of the first part and the second part along the first direction is greater than or equal to 50% and less than or equal to 90% of the dimension of the main body along the first direction; or, the sum of the dimensions of the first part and the second part along the first direction is equal to 100% of the dimension of the main body along the first direction.

7. The display module according to claim 6, characterized in that, The orthographic projections of the first part and the second part onto the display surface of the display panel overlap with the orthographic projection of the main body onto the display surface of the display panel.

8. The display module according to claim 2, characterized in that, The adhesive structure further includes a third adhesive structure; The third adhesive structure is located on the side of the first portion away from the neck, and the third adhesive structure is spaced apart from the first portion.

9. The display module according to claim 8, characterized in that, The third adhesive structure includes a plurality of fourth parts, which are spaced apart along the first direction.

10. The display module according to any one of claims 1 to 9, characterized in that, The main body includes a first side edge near the neck, comprising a first line segment, a second line segment, and a third line segment; the second line segment is connected to the neck, and the first line segment and the third line segment are located on both sides of the second line segment; The direction in which the neck extends is the first direction; The direction parallel to the display panel and perpendicular to the first direction is the second direction; At least one of the first line segment and the third line segment extends along the second direction and has a length greater than or equal to 2 mm.

11. The display module according to claim 10, characterized in that, Both the first line segment and the third line segment extend along the second direction; The first side also includes a fourth line segment, which connects the first line segment and the second line segment, and the middle part of the fourth line segment protrudes toward the second side; the second side is the opposite side of the first side in the main body; The fourth line segment defines a slot structure, wherein the dimension of the slot structure along the second direction is greater than or equal to the dimension of the slot structure along the first direction.

12. The display module according to claim 10, characterized in that, The second line segment extends along the second direction; the angle between the first line segment and the side of the neck extending along the first direction is an obtuse angle.

13. The display module according to any one of claims 1 to 9, characterized in that, The neck region includes a transition portion near the main body. The transition section includes a mesh structure.

14. The display module according to claim 13, characterized in that, The transition portion includes a first transition portion and a second transition portion; the first transition portion is closer to the main body portion than the second transition portion; the width of the first transition portion gradually decreases along a third direction; the third direction points from the end of the first transition portion closer to the main body portion to the end of the first transition portion farther from the main body portion.

15. The display module according to any one of claims 1 to 9, characterized in that, The at least one buffer layer includes a first buffer layer and a second buffer layer; the first buffer layer is located between the adhesive layer and the second buffer layer; the elastic modulus of the second buffer layer is greater than that of the first buffer layer; And / or, The at least one heat dissipation layer includes a first heat dissipation layer and a second heat dissipation layer, wherein the second heat dissipation layer is located on the side of the first heat dissipation layer away from the adhesive layer.

16. The display module according to any one of claims 1 to 9, characterized in that, It also includes a shielding film; the shielding film is located on the side of the main body away from the display panel; the orthographic projection of the shielding film on the display surface of the display panel covers the orthographic projection of the main body on the display surface of the display panel; and at least one boundary of the shielding film on the orthographic projection of the main body on the display surface of the display panel is located outside the orthographic projection of the main body on the display surface of the display panel.

17. The display module according to claim 16, characterized in that, The shielding film, when projected onto the display surface of the display panel, includes a first boundary near the neck portion; the first boundary is located outside the projection of the main body portion onto the display surface of the display panel.

18. The display module according to claim 17, characterized in that, The shielding film's orthographic projection onto the display surface of the display panel includes a second boundary; the second boundary is connected to the first boundary and forms an obtuse angle. The second boundary is located outside the orthographic projection of the main body onto the display surface of the display panel.

19. The display module according to claim 16, characterized in that, The shielding film includes: a first insulating layer, a shielding layer, and a second insulating layer; the shielding layer is located between the first insulating layer and the second insulating layer, and the first insulating layer is closer to the main body relative to the shielding layer; The thickness of the second insulating layer is greater than or equal to the thickness of the first insulating layer.

20. The display module according to claim 19, characterized in that, It also includes a driver chip; the driver chip is located on the backlight side of the display panel; the driver chip is used to drive the display panel; The first insulating layer includes a first via; the driving chip passes through the first via and contacts the shielding layer; In a direction parallel to the display surface of the display panel, a portion of the shielding layer protrudes from the main body and the first insulating layer, so that a portion of the shielding layer contacts the heat dissipation film.

21. The display module according to claim 20, characterized in that, It also includes thermally conductive structures; The thermally conductive structure includes a first thermally conductive structure and a second thermally conductive structure; the driving chip contacts the shielding layer through the first thermally conductive structure. The shielding layer is in contact with the heat dissipation film through a second thermally conductive structure.

22. A display device, characterized in that, The display module includes any one of claims 1 to 21.

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