A semiconductor DFN packaging method and packaging device

Abstract

The present invention relates to the field of semiconductor packaging technology, and discloses a semiconductor DFN packaging method and a packaging device thereof, which solves the problem that a semiconductor is transported to the bottom of a dispensing head by a power part, and the power part needs to be manually controlled and needs to be repeatedly started and stopped, which easily causes deviations in the semiconductor transportation position, affects the dispensing quality of the semiconductor, and is not conducive to protecting the power part. The method comprises the following steps: a staff member places a feeding plate on the top of an operating table, and starts a dual-axis motor 1 according to the size of the feeding plate. The dual-axis motor 1 drives a rotating shaft to rotate, and the rotating shaft drives two pulleys to rotate. Through the connection relationship between the two connecting belts, the other two pulleys are rotated, and then the internal threaded barrel is driven to rotate. The design realizes fixed clamping of the semiconductor, avoids displacement of the semiconductor when the feeding plate moves, and thereby improves the dispensing quality of the semiconductor by the dispensing head.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor packaging, and in particular relates to a semiconductor DFN packaging method and a packaging device thereof. Background Art

[0002] Semiconductor packaging refers to the process of processing tested wafers into independent chips according to product models and functional requirements. Packaging is the process of cutting wafers from the front-end wafer process into small chips through a dicing process, and then attaching the cut chips to the corresponding islands of the substrate (lead frame) frame with glue. Ultra-fine metal (gold, tin, copper, and aluminum) wires or conductive resins are used to connect the bonding pads of the chip to the corresponding pins of the substrate to form the required circuit semiconductor.

[0003] According to patent number CN113725129B4, a semiconductor packaging device is disclosed. This patent uses a cooling plate to cool the packaging position when the semiconductor is extruded, effectively increasing the cooling rate of the colloid and preventing the colloid from contacting and adhering to other components during subsequent storage. However, the semiconductor is transported to the bottom of the dispensing head by a power part. Since the power part needs to be manually controlled and needs to be repeatedly started and stopped, it is easy to cause deviations in the semiconductor transportation position, affecting the dispensing quality of the semiconductor, and is not conducive to the protection of the power part. Summary of the Invention

[0004] In view of the above situation, in order to overcome the defects of the prior art, the present invention provides a semiconductor DFN packaging method and a packaging device thereof, which effectively solves the problem in the above background technology that the semiconductor is transported to the bottom of the dispensing head through a power part. Since the power part needs to be manually controlled and needs to be controlled to start and stop repeatedly, it is easy to cause deviations in the semiconductor transportation position, affecting the dispensing quality of the semiconductor, and is not conducive to the protection of the power part.

[0005] To achieve the above object, the present invention provides the following technical solution: A semiconductor DFN packaging method comprises the following steps:

[0006] Step 1: The staff places the feeding plate on the top of the operating table. According to the size of the feeding plate, the double-axis motor 1 is started. The double-axis motor 1 drives the rotating shaft to rotate, and the rotating shaft drives the two pulleys to rotate. Through the connection relationship between the two connecting belts, the other two pulleys will rotate, which in turn drives the internal threaded barrel to rotate;

[0007] Step 2: Through the threaded connection relationship between the internal threaded barrel and the T-shaped threaded rod and the connection relationship between the balance plate and the telescopic rod, the T-shaped threaded rod is facilitated to move inside the internal threaded barrel, and then the T-shaped threaded rod drives the balance plate to move, and the balance plate drives the clamping wheel to move, so that the side wall of the clamping wheel is clamped with the outer wall of the feed plate, thereby realizing the movable clamping of the feed plate, ensuring the linear movement of the feed plate, improving the movement stability of the semiconductor, and thus improving the dispensing quality of the semiconductor;

[0008] Step 3: Before placing the semiconductor inside the placement plate, the staff first pushes the moving cylinder close to the inner wall of the placement plate according to the size of the semiconductor. The moving cylinder drives the clamping plate to move, and then the moving cylinder drives the slider to slide in the stabilizing groove inside the stabilizing plate. The slider then squeezes the connecting spring and compresses the connecting spring.

[0009] Step 4: Place the semiconductor between the two clamping plates, with the semiconductor located inside the placement plates. Then release the moving cylinder. Under the reverse force of the connecting spring, the moving cylinder drives the clamping plates closer together, and then the clamping plates drive the suction cups to contact the side walls of the semiconductor, thereby clamping the semiconductor.

[0010] Step 5: Then start the dual-axis motor 2 to rotate forward, and the dual-axis motor 2 drives the screw rod to rotate. Through the threaded connection relationship between the screw rod and the internal thread block and the sliding connection relationship between the sliding rod and the sliding port 1, the internal thread block drives the sliding rod to slide on the inner wall of the sliding port 2, and then the sliding rod drives the connecting rod to move, and the connecting rod drives the piston plate to slide on the inner wall of the moving cylinder, thereby discharging the gas inside the cavity through the air hole;

[0011] Step 6: Then start the second dual-axis motor to rotate in the opposite direction, which will move the two internal thread blocks away from each other, and then the piston plate will move in the opposite direction inside the moving cylinder, which will then suck the gas between the suction cup and the semiconductor, so that the suction cup can adsorb and connect to the semiconductor, thereby improving the clamping stability of the semiconductor and preventing the semiconductor from shifting while following the movement of the feed plate, thereby improving the installation stability of the semiconductor and improving the dispensing quality of the semiconductor;

[0012] Step 7: Then start the motor, which drives the half gear to rotate. Through the meshing connection between the half gear and the gear teeth, the gear teeth drive the feeding plate to move horizontally, and then the feeding plate will move linearly on the operating table. The feeding plate will drive the placement plate and the semiconductor to move synchronously, so that the semiconductor can be moved intermittently, and then the semiconductor will be moved intermittently to the bottom of the dispensing head;

[0013] Step 8: Start the electric push rod, which will drive the dispensing head to move down, making it easier for the dispensing head to dispense glue to the semiconductor, improving the dispensing quality of the dispensing head on the semiconductor and preventing the semiconductor from shifting during the dispensing process. This design facilitates the dispensing work of the dispensing head and the installation of the semiconductor on the placement board when the semiconductor stops.

[0014] Step 9: After the dispensing is completed, the feed plate will move horizontally, and then the next semiconductor will be moved to the bottom of the dispensing head. This design effectively provides time for the dispensing head to perform the dispensing operation on the semiconductor, and realizes the dispensing head to perform intermittent dispensing operation on the semiconductor, avoiding the semiconductor from shifting during movement, thereby improving the dispensing quality of the semiconductor.

[0015] The present invention further provides a semiconductor DFN packaging device, comprising an operating table, wherein an accommodating cavity is defined within the operating table, support columns are symmetrically provided at the top of the operating table, the tops of the four support columns are connected by a support plate, an electric push rod is installed at the middle position of the bottom end of the support plate, and a dispensing head is connected to the bottom end of the electric push rod, a feeding plate is provided at the top of the operating table, placement plates are equidistantly installed within the feeding plate, semiconductors are provided within the placement plates, and fixing mechanisms connected to the semiconductors are provided on the inner walls of the placement plates, fixing plates are symmetrically provided at the top of the operating table, the fixing plates are connected to the side walls of the support columns, a stabilizing mechanism connected to the side walls of the feeding plate is provided between the two fixing plates, and a conveyor connected to the feeding plate is provided within the accommodating cavity;

[0016] The conveyor includes an opening, gear teeth, a motor and a half gear. The bottom end of the feed plate is equidistantly installed with gear teeth located above the opening. The top of the operating table is provided with an opening connected to the accommodating cavity. The inner wall of the accommodating cavity is installed with a motor, and the motor output shaft is connected to a half gear that meshes with the gear teeth.

[0017] Preferably, the stabilizing mechanism includes an internal threaded barrel, a T-shaped threaded rod, a telescopic rod, a balance plate, a driver and a clamping wheel group. The internal threaded barrel is rotatably mounted on the fixed plate, and the interior of the internal threaded barrel is inserted with a T-shaped threaded rod. A balance plate is provided at one end of the T-shaped threaded rod, and a clamping wheel group is provided at equal distances on the side of the balance plate close to the feed plate. The two internal threaded barrels are connected by a driver.

[0018] Preferably, the driver includes a dual-axis motor, a rotating shaft, a pulley and a connecting belt. A dual-axis motor is provided in the middle position of the inner bottom end of the accommodating cavity. The output shaft of the dual-axis motor is connected to the rotating shaft. The rotating shaft extends to the outside of the operating table. The internal threaded cylinder and one end of the rotating shaft are both provided with pulleys, and the adjacent pulleys are connected by a connecting belt.

[0019] Preferably, telescopic rods are symmetrically provided on the fixing plates, and one end of the telescopic rods is connected to the side wall of the balance plate.

[0020] Preferably, the clamping wheel group includes a groove, a rotating shaft and a clamping wheel. Grooves are evenly spaced on one side of the balance plate close to the feed plate. Clamping wheels are provided inside the grooves. The clamping wheels are connected to the grooves through a rotating shaft, and the side walls of the clamping wheels are in contact with the outer wall of the feed plate.

[0021] Preferably, the fixing mechanism includes a moving cylinder, a clamping plate, a slider, a stabilizing plate, a stabilizing groove, a connecting spring, a mounting seat, a suction cup and a suction group. Moving cylinders are provided on both sides of the semiconductor, the inner wall of the placement plate is provided with stabilizing plates located on both sides of the moving cylinder, a stabilizing groove is provided on the side of the stabilizing plate close to the moving cylinder, sliders extending to the inside of the stabilizing groove are provided on both sides of the moving cylinder, the inner wall of the stabilizing groove is provided with a connecting spring connected to the side wall of the slider, a clamping plate is provided on the end of the moving cylinder close to the semiconductor, a mounting seat is installed equidistantly on one side of the clamping plate, a suction cup is provided on one end of the mounting seat, and a suction group connected to the moving cylinder is provided inside the placement plate.

[0022] Preferably, a cavity is provided inside the clamping plate, and an air hole communicating with the cavity is provided between the mounting seat and the suction cup.

[0023] Preferably, a receiving groove is provided inside the placement plate, a first sliding opening communicating with the receiving groove is provided at the inner bottom end of the placement plate, and a second sliding opening is provided on the movable cylinder.

[0024] Preferably, the suction group includes a dual-axis motor 2, a screw rod, an internal thread block, a sliding rod, a cavity, a piston plate and a connecting rod. The dual-axis motor 2 is installed in the middle position of the inner bottom end of the accommodating groove, the output shaft of the dual-axis motor 2 is connected to the screw rod, the screw rod is sleeved with an internal thread block, the internal thread block is threadedly connected to the screw rod, the internal thread block is provided with a sliding rod that passes through the sliding port 1 and the sliding port 2 and extends to the inside of the moving cylinder, the inside of the moving cylinder is provided with a piston plate, a connecting rod is provided on one side of the piston plate, and the connecting rod is connected to one end of the sliding rod.

[0025] Compared with the prior art, the present invention has the following beneficial effects:

[0026] (1) During operation, by providing an operating table, a receiving cavity, a support column, a support plate, an electric push rod, a dispensing head, a feeding plate, a placement plate, a semiconductor and a conveyor, it is convenient for the feeding plate to drive the placement plate and the semiconductor to perform intermittent movement, thereby facilitating the semiconductor to move to the bottom of the dispensing head, thereby facilitating the dispensing head to perform intermittent dispensing operation on the semiconductor, and providing convenience for the installation and removal of the semiconductor. At the same time, with the function of the stabilizing mechanism and the fixing mechanism, it is convenient to clamp the feeding plate movably, facilitate the feeding plate to perform linear movement, and provide stability for the dispensing head to dispensing the semiconductor. At the same time, this design realizes the fixed clamping of the semiconductor, avoids the displacement of the semiconductor when the feeding plate moves, and thereby improves the dispensing quality of the semiconductor by the dispensing head;

[0027] (2) Through the design of the internal threaded barrel, T-shaped threaded rod, telescopic rod, balance plate, driver and clamping wheel group, it is convenient to clamp the feed plates of different sizes, improve the moving stability of the feed plates, and cooperate with the function of the clamping wheel group to realize the movable clamping of the feed plates, providing convenience for the linear movement of the feed plates, and then facilitating the intermittent linear movement of the semiconductor by the feed plates, effectively providing convenience for the dispensing operation of the dispensing head on the semiconductor;

[0028] (3) Through the design of the moving cylinder, clamping plate, slider, stabilizing plate, stabilizing groove, connecting spring, mounting seat, suction cup and suction group, it is convenient to clamp semiconductors of different sizes, and at the same time realize the adsorption and fixation of the semiconductor, thereby improving the connection stability between the placement plate and the semiconductor, and facilitating the movement of the feeding plate to avoid the displacement of the semiconductor, thereby improving the movement synchronization of the semiconductor and the feeding plate, and thereby improving the dispensing quality of the dispensing head on the semiconductor. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] The accompanying drawings are used to provide further understanding of the present invention and constitute a part of the specification. They are used to explain the present invention together with the embodiments of the present invention and do not constitute a limitation of the present invention.

[0030] In the attached figure:

[0031] Figure 1 Schematic diagram of the structure of the semiconductor DFN packaging device of the present invention;

[0032] Figure 2 For the present invention Figure 1 Schematic diagram of the top-down structure;

[0033] Figure 3 This is a schematic diagram of the top view of the fixing mechanism of the present invention;

[0034] Figure 4 For the present invention Figure 3 Schematic diagram of the enlarged structure at A in the middle;

[0035] Figure 5 For the present invention Figure 1 Schematic diagram of the side section structure;

[0036] Figure 6 For the present invention Figure 5 Schematic diagram of the enlarged structure at B in the middle;

[0037] In the figure: 1. operating table; 2. receiving chamber; 3. support column; 4. support plate; 5. electric push rod; 6. dispensing head; 7. feeding plate; 8. placing plate; 9. semiconductor; 10. opening; 11. gear; 12. motor; 13. half gear; 14. moving cylinder; 15. clamping plate; 16. slider; 17. stabilizing plate; 18. stabilizing groove; 19. connecting spring; 20. mounting seat; 21. suction cup; 22. Internally threaded barrel; 23. T-shaped threaded rod; 24. Telescopic rod; 25. Balance plate; 26. Clamping wheel; 27. Dual-axis motor 1; 28. Rotating shaft; 29. Pulley; 30. Connecting belt; 31. Receiving groove; 32. Dual-axis motor 2; 33. Screw; 34. Internally threaded block; 35. Slide 1; 36. Slide rod; 37. Cavity; 38. Air hole; 39. Piston plate; 40. Slide 2; 41. Connecting rod. DETAILED DESCRIPTION

[0038] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments; based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0039] Depend on Figures 1 to 6 The present invention provides a semiconductor DFN packaging method, comprising the following steps:

[0040] Step 1: The staff places the feeding plate 7 on the top of the operating table 1. According to the size of the feeding plate 7, the double-axis motor 1 27 is started. The double-axis motor 1 27 drives the rotating shaft 28 to rotate. The rotating shaft 28 drives the two pulleys 29 to rotate. Through the connection relationship between the two connecting belts 30, the other two pulleys 29 are rotated, which in turn drives the internal threaded barrel 22 to rotate.

[0041] Step 2: Through the threaded connection relationship between the internal threaded barrel 22 and the T-shaped threaded rod 23 and the connection relationship between the balancing plate 25 and the telescopic rod 24, it is convenient to move the T-shaped threaded rod 23 inside the internal threaded barrel 22, and then the T-shaped threaded rod 23 will drive the balancing plate 25 to move, and the balancing plate 25 will drive the clamping wheel 26 to move, so that the side wall of the clamping wheel 26 is clamped with the outer wall of the feeding plate 7, realizing the movable clamping of the feeding plate 7, ensuring that the feeding plate 7 moves in a straight line, improving the movement stability of the semiconductor 9, and thus improving the dispensing quality of the semiconductor 9;

[0042] Step 3: Before placing the semiconductor 9 inside the placement plate 8, the staff first pushes the movable cylinder 14 toward the inner wall of the placement plate 8 according to the size of the semiconductor 9. The movable cylinder 14 drives the clamping plate 15 to move, and the movable cylinder 14 drives the slider 16 to slide in the stabilizing groove 18 inside the stabilizing plate 17. The slider 16 then squeezes the connecting spring 19, compressing the connecting spring 19.

[0043] Step 4: Place the semiconductor 9 between the two clamping plates 15 so that the semiconductor 9 is located inside the placement plate 8. Then, release the movable cylinder 14. Under the reverse force of the connecting spring 19, the movable cylinder 14 drives the clamping plates 15 closer together, and the clamping plates 15 drive the suction cup 21 to contact the side wall of the semiconductor 9, thereby clamping the semiconductor 9.

[0044] Step 5: Then start the second dual-axis motor 32 to rotate forward, and the second dual-axis motor 32 drives the screw rod 33 to rotate. Through the threaded connection between the screw rod 33 and the internal thread block 34 and the sliding connection between the slide rod 36 and the first slide 35, the internal thread block 34 drives the slide rod 36 to slide on the inner wall of the second slide 40. Then, the slide rod 36 drives the connecting rod 41 to move, and the connecting rod 41 drives the piston plate 39 to slide on the inner wall of the movable cylinder 14, thereby discharging the gas inside the cavity 37 through the air hole 38.

[0045] Step 6: Then start the dual-axis motor 2 32 to rotate in the opposite direction, which will move the two internal thread blocks 34 away from each other, and then make the piston plate 39 move in the opposite direction inside the movable cylinder 14, and then suck the gas between the suction cup 21 and the semiconductor 9, so that the suction cup 21 can adsorb and connect the semiconductor 9, thereby improving the clamping stability of the semiconductor 9, and preventing the semiconductor 9 from shifting in the process of following the movement of the feeding plate 7, thereby improving the installation stability of the semiconductor 9 and improving the dispensing quality of the semiconductor 9;

[0046] Step 7: Then start the motor 12, which drives the half gear 13 to rotate. Through the meshing connection between the half gear 13 and the gear teeth 11, the gear teeth 11 drive the feeding plate 7 to move horizontally, and then the feeding plate 7 moves linearly on the operating table 1. The feeding plate 7 drives the placement plate 8 and the semiconductor 9 to move synchronously, so that the semiconductor 9 can be moved intermittently, and then the semiconductor 9 can be moved intermittently to the bottom of the dispensing head 6;

[0047] Step 8: Start the electric push rod 5, which will drive the dispensing head 6 to move downward, thereby facilitating the dispensing operation of the dispensing head 6 on the semiconductor 9, improving the dispensing quality of the dispensing head 6 on the semiconductor 9, and preventing the semiconductor 9 from offsetting during the dispensing process. This design facilitates the dispensing work of the dispensing head 6 and the installation of the semiconductor 9 on the placement plate 8 when the semiconductor 9 stops.

[0048] Step nine: When the dispensing is completed, the feed plate 7 will move horizontally, and then the next semiconductor 9 will be moved to the bottom of the dispensing head 6. This design effectively provides time for the dispensing operation of the dispensing head 6 on the semiconductor 9, and realizes the intermittent dispensing operation of the dispensing head 6 on the semiconductor 9, avoiding the displacement of the semiconductor 9 during movement, thereby improving the dispensing quality of the semiconductor 9.

[0049] This embodiment further provides a semiconductor DFN packaging device, including an operating table 1, an accommodating cavity 2 is provided inside the operating table 1, support columns 3 are symmetrically provided at the top of the operating table 1, the tops of the four support columns 3 are connected by a support plate 4, an electric push rod 5 is installed at the middle position of the bottom end of the support plate 4, and the bottom end of the electric push rod 5 is connected to a dispensing head 6, a feeding plate 7 is provided at the top of the operating table 1, and placement plates 8 are installed at equal distances inside the feeding plate 7, and semiconductors 9 are provided inside the placement plates 8. The inner wall of the placement plate 8 is provided with a fixing mechanism connected to the semiconductor 9, and the top of the operating table 1 is symmetrically provided with a fixing plate, which is connected to the side wall of the support column 3, and a stabilizing mechanism connected to the side wall of the feeding plate 7 is provided between the two fixing plates. A conveyor connected to the feeding plate 7 is provided inside the accommodating cavity 2;

[0050] The conveyor includes an opening 10, gear teeth 11, a motor 12 and a half gear 13. The bottom end of the feed plate 7 is equidistantly installed with gear teeth 11 above the opening 10. The top of the operating table 1 is provided with an opening 10 connected to the accommodating chamber 2. The inner wall of the accommodating chamber 2 is installed with a motor 12. The output shaft of the motor 12 is connected to the half gear 13 that meshes with the gear teeth 11.

[0051] The staff places the semiconductor 9 inside the placement plate 8 and connects the fixing mechanism to the semiconductor 9. Then, the staff adjusts the stabilizing mechanism to facilitate the placement of the feeding plate 7 on the top of the operating table 1, so that the stabilizing mechanism can clamp the feeding plate 7. Then, the motor 12 is started, and the motor 12 drives the half gear 13 to rotate. Through the meshing connection between the half gear 13 and the gear 11, the gear 11 drives the feeding plate 7 to move horizontally, and then the feeding plate 7 will move linearly on the stabilizing mechanism, and then the feeding plate 7 will drive the placement plate 8 and the semiconductor 9 to move synchronously, so that the semiconductor 9 can be intermittently transmitted, so that the semiconductor 9 can be easily transferred. The conductor 9 moves to the bottom of the dispensing head 6, and the electric push rod 5 is started. The electric push rod 5 will drive the dispensing head 6 to move downward, thereby facilitating the dispensing operation of the dispensing head 6 on the semiconductor 9, thereby improving the dispensing quality of the dispensing head 6 on the semiconductor 9, and avoiding the semiconductor 9 from offsetting during the dispensing process. This design facilitates the dispensing work of the dispensing head 6 when the semiconductor 9 stops. When the dispensing is completed, the feeding plate 7 will move horizontally, and then the next semiconductor 9 will be moved to the bottom of the dispensing head 6, so that the dispensing head 6 can perform the dispensing operation on the semiconductor 9. This design effectively provides time for the dispensing operation of the dispensing head 6 on the semiconductor 9.

[0052] The stabilizing mechanism includes an internal threaded cylinder 22, a T-shaped threaded rod 23, a telescopic rod 24, a balance plate 25, a driver and a clamping wheel group. The internal threaded cylinder 22 is rotatably installed on the fixed plate, and the interior of the internal threaded cylinder 22 is interspersed with a T-shaped threaded rod 23. One end of the T-shaped threaded rod 23 is provided with a balance plate 25. The side of the balance plate 25 close to the feeding plate 7 is evenly spaced with a clamping wheel group. The two internal threaded cylinders 22 are connected by a driver. The driver includes a dual-axis motor 27, a rotating shaft 28, a pulley 29 and a connecting belt 30. A dual-axis motor 27 is provided in the middle position of the inner bottom end of the accommodating chamber 2. The dual-axis motor 27 outputs The output shaft is connected to a rotating shaft 28, which extends to the outside of the operating table 1. One end of the internal threaded cylinder 22 and the rotating shaft 28 is provided with a pulley 29. The two adjacent pulleys 29 are connected by a connecting belt 30. The fixed plate is symmetrically provided with a telescopic rod 24, one end of the telescopic rod 24 is connected to the side wall of the balance plate 25, and the clamping wheel group includes a groove, a rotating shaft and a clamping wheel 26. Grooves are opened at equal distances on the side of the balance plate 25 close to the feed plate 7. The inside of the groove is provided with a clamping wheel 26. The clamping wheel 26 is connected to the groove through a rotating shaft, and the side wall of the clamping wheel 26 is in contact with the outer wall of the feed plate 7.

[0053] By starting the dual-axis motor 27, the dual-axis motor 27 drives the rotating shaft 28 to rotate, and the rotating shaft 28 drives the two pulleys 29 to rotate. Through the connection relationship of the two connecting belts 30, the other two pulleys 29 will rotate, and then the internal threaded cylinder 22 will be driven to rotate. Through the threaded connection relationship between the internal threaded cylinder 22 and the T-shaped threaded rod 23 and the connection relationship between the matching balance plate 25 and the telescopic rod 24, it is convenient to move the T-shaped threaded rod 23 inside the internal threaded cylinder 22, and then the T-shaped threaded rod 23 will drive the balance plate 25 to move, and then the balance plate 25 will drive the clamping wheel 26 to move, and then the side wall of the clamping wheel 26 is clamped with the outer wall of the feeding plate 7, thereby realizing the active clamping of the feeding plate 7, ensuring that the feeding plate 7 moves in a straight line, improving the movement stability of the semiconductor 9, and thus improving the dispensing quality of the semiconductor 9.

[0054] The fixing mechanism includes a moving cylinder 14, a clamping plate 15, a slider 16, a stabilizing plate 17, a stabilizing groove 18, a connecting spring 19, a mounting seat 20, a suction cup 21 and a suction group. Moving cylinders 14 are provided on both sides of the semiconductor 9, and the inner wall of the placement plate 8 is provided with stabilizing plates 17 located on both sides of the moving cylinder 14. Stabilizing grooves 18 are provided on the side of the stabilizing plate 17 close to the moving cylinder 14. Sliders 16 extending into the inside of the stabilizing groove 18 are provided on both sides of the moving cylinder 14. The inner wall of the stabilizing groove 18 is provided with a connecting spring 19 connected to the side wall of the slider 16. A clamping plate 15 is provided on one end of the moving cylinder 14 close to the semiconductor 9, and a mounting seat 20 is equidistantly installed on one side of the clamping plate 15. A suction cup 21 is provided on one end of the mounting seat 20, and a suction group connected to the moving cylinder 14 is provided inside the placement plate 8.

[0055] According to the size of the semiconductor 9, the staff pushes the moving cylinder 14, and the moving cylinder 14 drives the clamping plate 15 to move, and then the moving cylinder 14 drives the slider 16 to slide in the stable groove 18 inside the stable plate 17, and then the slider 16 squeezes the connecting spring 19 and compresses the connecting spring 19. Then the semiconductor 9 is placed between the two clamping plates 15 and the semiconductor 9 is located inside the placement plate 8. Then the moving cylinder 14 is released. Under the reverse force of the connecting spring 19, the moving cylinder 14 drives the clamping plates 15 to approach each other, and then the clamping plates 15 drive the suction cup 21 to contact the side wall of the semiconductor 9, thereby achieving the clamping of the semiconductor 9 and improving the dispensing stability of the semiconductor 9.

[0056] The interior of the clamping plate 15 is provided with a cavity 37, an air hole 38 communicating with the cavity 37 is provided between the mounting seat 20 and the suction cup 21, the interior of the placement plate 8 is provided with a receiving groove 31, the inner bottom end of the placement plate 8 is provided with a slide 35 communicating with the receiving groove 31, the movable cylinder 14 is provided with a slide 40, the suction group includes a dual-axis motor 32, a screw 33, an internal thread block 34, a slide rod 36, a cavity 37, a piston plate 39 and a connecting rod 41, the receiving groove 31 is provided with a plurality of holes 37, and the suction group includes a plurality of holes 37, a plurality of holes 37, a plurality of holes 37, and a plurality of holes 37. A second dual-axis motor 32 is installed in the middle position of the inner bottom end. The output shaft of the second dual-axis motor 32 is connected to a screw rod 33. An internal thread block 34 is sleeved on the screw rod 33. The internal thread block 34 is threadedly connected to the screw rod 33. The internal thread block 34 is provided with a slide rod 36 that passes through the first slide 35 and the second slide 40 and extends into the interior of the movable cylinder 14. A piston plate 39 is provided inside the movable cylinder 14. A connecting rod 41 is provided on one side of the piston plate 39. The connecting rod 41 is connected to one end of the slide rod 36.

[0057] By starting the dual-axis motor 2 32 to rotate forward, the dual-axis motor 2 32 drives the screw rod 33 to rotate, and through the threaded connection relationship between the screw rod 33 and the internal thread block 34 and the sliding connection relationship between the sliding rod 36 and the sliding port 1 35, the internal thread block 34 drives the sliding rod 36 to slide on the inner wall of the sliding port 2 40, and then the sliding rod 36 drives the connecting rod 41 to move, and the connecting rod 41 drives the piston plate 39 to slide on the inner wall of the moving cylinder 14, thereby discharging the gas inside the cavity 37 through the air hole 38. Then, the dual-axis motor 2 32 is started to rotate in the opposite direction, and then the two internal thread blocks 34 will move away from each other, and then the piston plate 39 will move in the opposite direction inside the moving cylinder 14, and then the gas between the suction cup 21 and the semiconductor 9 will be sucked, so that the suction cup 21 can adsorb and connect the semiconductor 9, thereby improving the clamping stability of the semiconductor 9, avoiding the semiconductor 9 from shifting in the process of following the movement of the feeding plate 7, thereby improving the installation stability of the semiconductor 9, and thereby improving the dispensing quality of the semiconductor 9.

Claims

1. A semiconductor DFN packaging method, characterized in that: The following steps are involved: Step 1: The staff places the feeding plate (7) on the top of the operating table (1), and starts the double-axis motor (27) according to the size of the feeding plate (7). The double-axis motor (27) drives the rotating shaft (28) to rotate, and the rotating shaft (28) drives the two pulleys (29) to rotate. Through the connection relationship of the two connecting belts (30), the other two pulleys (29) are rotated, which in turn drives the internal threaded barrel (22) to rotate; Step 2: Through the threaded connection relationship between the internal threaded barrel (22) and the T-shaped threaded rod (23) and the connection relationship between the matching balance plate (25) and the telescopic rod (24), the T-shaped threaded rod (23) is facilitated to move inside the internal threaded barrel (22), and then the T-shaped threaded rod (23) drives the balance plate (25) to move, and the balance plate (25) drives the clamping wheel (26) to move, so that the side wall of the clamping wheel (26) is clamped with the outer wall of the feeding plate (7), thereby realizing the movable clamping of the feeding plate (7), ensuring that the feeding plate (7) moves in a straight line, improving the moving stability of the semiconductor (9), and thus improving the dispensing quality of the semiconductor (9); Step 3: Before placing the semiconductor (9) inside the placement plate (8), the staff first pushes the moving cylinder (14) toward the inner wall of the placement plate (8) according to the size of the semiconductor (9). The moving cylinder (14) drives the clamping plate (15) to move, and then the moving cylinder (14) drives the slider (16) to slide in the stabilizing groove (18) inside the stabilizing plate (17). Then, the slider (16) squeezes the connecting spring (19) and compresses the connecting spring (19); Step 4: Place the semiconductor (9) between the two clamping plates (15) and position the semiconductor (9) inside the placement plate (8). Then release the moving cylinder (14). Under the reverse force of the connecting spring (19), the moving cylinder (14) drives the clamping plates (15) to approach each other, and then the clamping plates (15) drive the suction cup (21) to contact the side wall of the semiconductor (9), thereby achieving the clamping of the semiconductor (9). Step 5: Then start the dual-axis motor 2 (32) to rotate forward, and the dual-axis motor 2 (32) drives the screw rod (33) to rotate. Through the threaded connection relationship between the screw rod (33) and the internal thread block (34) and the sliding connection relationship between the slide rod (36) and the first slide (35), the internal thread block (34) drives the slide rod (36) to slide on the inner wall of the second slide (40), and then the slide rod (36) drives the connecting rod (41) to move, and the connecting rod (41) drives the piston plate (39) to slide on the inner wall of the moving cylinder (14), and then the gas inside the cavity (37) is discharged through the air hole (38); Step 6: Then start the dual-axis motor 2 (32) to rotate in the opposite direction, which will cause the two internal thread blocks (34) to move away from each other, thereby causing the piston plate (39) to move in the opposite direction inside the moving cylinder (14), and then sucking the gas between the suction cup (21) and the semiconductor (9), so that the suction cup (21) can adsorb and connect the semiconductor (9), thereby improving the clamping stability of the semiconductor (9), preventing the semiconductor (9) from shifting during the movement of the feeding plate (7), thereby improving the installation stability of the semiconductor (9), and improving the dispensing quality of the semiconductor (9); Step 7: Then start the motor (12), the motor (12) drives the half gear (13) to rotate, and through the meshing connection relationship between the half gear (13) and the gear (11), the gear (11) drives the feeding plate (7) to move horizontally, and then the feeding plate (7) will move linearly on the operating table (1), and the feeding plate (7) will drive the placement plate (8) and the semiconductor (9) to move synchronously, so that the semiconductor (9) can be moved intermittently, and then the semiconductor (9) will be moved intermittently to the bottom of the dispensing head (6); Step 8: The electric push rod (5) is started, and the electric push rod (5) drives the dispensing head (6) to move downward, thereby facilitating the dispensing operation of the dispensing head (6) on the semiconductor (9), improving the dispensing quality of the dispensing head (6) on the semiconductor (9), and preventing the semiconductor (9) from deviating during the dispensing process. This design facilitates the dispensing operation of the dispensing head (6) when the semiconductor (9) stops and the installation of the semiconductor (9) on the placement plate (8); Step 9: When the dispensing is completed, the feeding plate (7) will move horizontally, and then the next semiconductor (9) will be moved to the bottom of the dispensing head (6). This design effectively provides time for the dispensing head (6) to perform the dispensing operation on the semiconductor (9), so that the dispensing head (6) can perform intermittent dispensing operation on the semiconductor (9), thereby avoiding the semiconductor (9) from shifting during movement, thereby improving the dispensing quality of the semiconductor (9).

2. A semiconductor DFN packaging device, comprising the semiconductor DFN packaging method according to claim 1, characterized in that: The operating table (1) comprises an operating table (1), wherein an accommodating cavity (2) is provided inside the operating table (1), support columns (3) are symmetrically provided at the top of the operating table (1), the tops of the four support columns (3) are connected by a support plate (4), an electric push rod (5) is installed at the middle position of the bottom end of the support plate (4), and the bottom end of the electric push rod (5) is connected to a glue head (6), a feeding plate (7) is provided at the top of the operating table (1), a placement plate (8) is equidistantly installed inside the feeding plate (7), a semiconductor (9) is provided inside the placement plate (8), and a fixing mechanism connected to the semiconductor (9) is provided on the inner wall of the placement plate (8), a fixing plate is symmetrically provided at the top of the operating table (1), the fixing plate is connected to the side wall of the support column (3), a stabilizing mechanism connected to the side wall of the feeding plate (7) is provided between the two fixing plates, and a conveyor connected to the feeding plate (7) is provided inside the accommodating cavity (2); The conveyor comprises an opening (10), gear teeth (11), a motor (12) and a half gear (13); the bottom end of the feeding plate (7) is equidistantly provided with gear teeth (11) located above the opening (10); the top end of the operating table (1) is provided with an opening (10) connected to the accommodating chamber (2); the inner wall of the accommodating chamber (2) is provided with a motor (12); and the output shaft of the motor (12) is connected to the half gear (13) meshing with the gear teeth (11).

3. The semiconductor DFN packaging device according to claim 2, wherein: The stabilizing mechanism comprises an internal threaded barrel (22), a T-shaped threaded rod (23), a telescopic rod (24), a balancing plate (25), a driver and a clamping wheel group. The internal threaded barrel (22) is rotatably mounted on the fixed plate, the interior of the internal threaded barrel (22) is inserted with a T-shaped threaded rod (23), one end of the T-shaped threaded rod (23) is provided with a balancing plate (25), and a clamping wheel group is evenly spaced on one side of the balancing plate (25) close to the feeding plate (7). The two internal threaded barrels (22) are connected via a driver.

4. The semiconductor DFN packaging device according to claim 3, wherein: The driver comprises a dual-axis motor (27), a rotating shaft (28), a pulley (29) and a connecting belt (30). The dual-axis motor (27) is provided at the middle position of the inner bottom end of the accommodating chamber (2). The output shaft of the dual-axis motor (27) is connected to the rotating shaft (28). The rotating shaft (28) extends to the outside of the operating table (1). The internal threaded cylinder (22) and one end of the rotating shaft (28) are both sleeved with pulleys (29). Two adjacent pulleys (29) are connected by a connecting belt (30).

5. The semiconductor DFN packaging device according to claim 3, wherein: Telescopic rods (24) are symmetrically provided on the fixing plates, and one end of the telescopic rods (24) is connected to the side wall of the balance plate (25).

6. The semiconductor DFN packaging device according to claim 3, wherein: The clamping wheel assembly comprises a groove, a rotating shaft and a clamping wheel (26). Grooves are uniformly spaced on one side of the balancing plate (25) close to the feeding plate (7). Clamping wheels (26) are provided inside the grooves. The clamping wheels (26) are connected to the grooves via the rotating shaft, and the side walls of the clamping wheels (26) are in contact with the outer wall of the feeding plate (7).

7. The semiconductor DFN packaging device according to claim 2, wherein: The fixing mechanism comprises a moving cylinder (14), a clamping plate (15), a slider (16), a stabilizing plate (17), a stabilizing groove (18), a connecting spring (19), a mounting seat (20), a suction cup (21) and a suction group. The moving cylinder (14) is provided on both sides of the semiconductor (9). The inner wall of the placement plate (8) is provided with stabilizing plates (17) located on both sides of the moving cylinder (14). The stabilizing plates (17) are provided with stabilizing grooves (18) on one side close to the moving cylinder (14). The moving cylinder Both sides of the (14) are provided with sliders (16) extending into the interior of the stabilizing groove (18), the inner wall of the stabilizing groove (18) is provided with a connecting spring (19) connected to the side wall of the slider (16), the end of the moving cylinder (14) close to the semiconductor (9) is provided with a clamping plate (15), a mounting seat (20) is installed at an equal distance on one side of the clamping plate (15), and a suction cup (21) is provided at one end of the mounting seat (20), and a suction group connected to the moving cylinder (14) is provided inside the placement plate (8).

8. The semiconductor DFN packaging device according to claim 7, wherein: A cavity (37) is provided inside the clamping plate (15), and an air hole (38) communicating with the cavity (37) is provided between the mounting seat (20) and the suction cup (21).

9. The semiconductor DFN packaging device according to claim 7, wherein: The placement plate (8) is provided with a receiving groove (31) inside, the inner bottom end of the placement plate (8) is provided with a first sliding opening (35) connected to the receiving groove (31), and the moving cylinder (14) is provided with a second sliding opening (40).

10. The semiconductor DFN packaging device according to claim 7, wherein: The suction group comprises a second double-axis motor (32), a screw rod (33), an internal thread block (34), a slide rod (36), a cavity (37), a piston plate (39) and a connecting rod (41). The second double-axis motor (32) is installed at the middle position of the inner bottom end of the accommodating groove (31). The output shaft of the second double-axis motor (32) is connected with the screw rod (33). The screw rod (33) is sleeved with an internal thread block (34). The internal thread block (34) is threadedly connected to the screw rod (33). The internal thread block (34) is provided with a slide rod (36) that passes through the first slide (35) and the second slide (40) and extends to the inside of the moving cylinder (14). The inside of the moving cylinder (14) is provided with a piston plate (39). A connecting rod (41) is provided on one side of the piston plate (39). The connecting rod (41) is connected to one end of the slide rod (36).

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