Mounting device and mounting method

Abstract

The embodiment of the present application discloses a mounting device and a mounting method. The mounting device comprises a bracket, a tray movably arranged on the bracket, the tray comprising a first bearing part and a second bearing part, the first bearing part being used for bearing a first upper electrode part of a semiconductor device, the second bearing part being arranged around a peripheral part of the first bearing part and coinciding with the center of gravity thereof, the second bearing part being used for bearing a second upper electrode part, a first sensor being arranged at the center of gravity of the first bearing part and collecting a center of gravity offset of the first upper electrode part and / or the second upper electrode part, and a driving assembly being connected to the tray, driving the tray to lift and drive the tray to adjust the bearing position of the first upper electrode part and / or the second upper electrode part according to the center of gravity offset. The embodiment of the present application improves the success rate of mounting and cleaning of the semiconductor device and ensures the working time of the semiconductor device.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of semiconductor processing, and particularly relates to a mounting device and a mounting method. BACKGROUND

[0002] Semiconductor equipment, such as etching equipment, is an indispensable equipment machine in implementing semiconductor manufacturing processes, microelectronic IC manufacturing processes, and micro-nano manufacturing processes. Etching is a major process of pattern processing associated with photolithography. The upper electrode is installed in the etching cavity of the etching equipment, and the installation of the upper electrode is the key to ensuring the stable progress of the etching process.

[0003] At present, the installation of the upper electrode of the semiconductor equipment is generally performed manually. Due to the human installation technology in the installation process, not only the cleaning and maintenance success rate of the equipment is affected, the service life of the semiconductor equipment is affected, but also the temperature field and ionization distribution in the semiconductor equipment chamber are uneven, which causes problems in product yield. SUMMARY

[0004] The following is a summary of the subject matter of the detailed description of the present application. This summary is not intended to limit the scope of protection of the claims.

[0005] A first aspect of the embodiments of the present application provides a mounting device, comprising: a bracket; a tray movably arranged on the bracket, the tray comprising a first bearing part and a second bearing part, the first bearing part being used for bearing a first upper electrode part of a semiconductor equipment, the second bearing part being arranged around a peripheral part of the first bearing part and coinciding with a gravity center of the first bearing part, the second bearing part being used for bearing a second upper electrode part of the semiconductor equipment; a first sensor arranged at the gravity center of the first bearing part and collecting a gravity center offset of the bearing first upper electrode part and the second upper electrode part; and a driving assembly connected to the tray, driving the tray to ascend and descend, and driving the tray to adjust the bearing position of the first upper electrode part and the second upper electrode part according to the gravity center offset collected by the first sensor.

[0006] In some embodiments, the tray further comprises a metering part, the metering part weighing and displaying the weight of the first upper electrode part and the second upper electrode part.

[0007] In some embodiments, the driving assembly comprises: a driving motor connected to the tray; a first control unit communicatively connected to the driving motor and the first sensor, controlling the driving motor to drive the tray to move; and a plurality of limiters, the plurality of limiters being respectively arranged on the semiconductor equipment to limit the ascending and descending range of the tray, the driving motor driving the tray to ascend and descend within the ascending and descending range.

[0008] In some embodiments, the first sensor comprises a displacement sensor.

[0009] In some embodiments, the mounting device further comprises at least one second sensor disposed on the semiconductor device and close to the mounting position of the first upper electrode part for calibrating the mounting position of the first upper electrode part; and / or at least one third sensor disposed below the second sensor and close to the mounting position of the second upper electrode part for calibrating the mounting position of the second upper electrode part.

[0010] In some embodiments, the semiconductor device is provided with a first mounting hole and a second mounting hole, the first upper electrode part is provided with a first fastener matching the first mounting hole, and the second upper electrode part is provided with a second fastener matching the second mounting hole, wherein the second sensor is disposed on one side of the first mounting hole and has a preset distance from the first mounting hole.

[0011] In some embodiments, the preset distance is 2-10 mm.

[0012] In some embodiments, the number of the second sensor and the third sensor is multiple, corresponding to the mounting position.

[0013] In some embodiments, the second sensor and the third sensor are photoelectric sensors.

[0014] In some embodiments, the bracket comprises a circular ring, and the orthographic projection of the tray is located in the center area of the plane where the circular ring is located.

[0015] In some embodiments, the tray is movably connected to the bracket by at least two support rods.

[0016] In some embodiments, the surface of the first bearing part protrudes from the surface of the second bearing part, wherein the first bearing part is a circular disc, the second bearing part is an annular disc, the centers of the circular disc and the annular disc are the same, and the center coincides with the gravity center.

[0017] In some embodiments, a screw lock is disposed on the bracket, and the screw lock is used to fasten the mounting device to the semiconductor device.

[0018] The second aspect of the embodiment of the present application further provides an installation method, comprising: providing the installation device as described above; supporting the first upper electrode part on the first bearing part and supporting the second upper electrode part on the second bearing part; fixing the installation device to the semiconductor equipment through the support; collecting the center of gravity offset of the first upper electrode part and / or the second upper electrode part on the tray through the first sensor; adjusting the supporting position of the first upper electrode part and / or the second upper electrode part through the driving assembly driving the tray; lifting the tray through the driving assembly to drive the first upper electrode part and the second upper electrode part to the installation position; installing the first upper electrode part and the second upper electrode part; and disassembling the installation device.

[0019] In some embodiments, the method further comprises: collecting installation position information of the first upper electrode part and / or the second upper electrode part, and calibrating whether the installation position is at the predetermined installation position.

[0020] According to the installation device and the installation method provided by the embodiment of the present application, the tray is driven to move by the driving assembly, and the tray is automatically horizontally moved, lifted and lowered, so that the first upper electrode part and the second upper electrode part of the semiconductor equipment supported on the tray are accurately driven to the installation position, thereby performing the installation operation, and further, the accuracy is calibrated through the second sensor and / or the third sensor, which effectively avoids unexpected operation errors, reduces the workload of personnel, saves costs, improves the success rate of cleaning and maintenance of the semiconductor equipment, thereby prolongs the working time of the semiconductor equipment, ensures the service life, and effectively ensures the stable performance of the process based on the semiconductor equipment. In addition, the tray of the installation device in the embodiment of the present application can detect the weight of the first upper electrode part and / or the second upper electrode part through the metering part to judge the service life, which can avoid installing components exceeding the service life to cause the semiconductor equipment to be out of service. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 FIG. 1 is a structural schematic diagram of an installation device according to an embodiment of the present application.

[0022] Figure 2 FIG. 2 is a side structural schematic diagram of a tray according to an embodiment of the present application.

[0023] Figure 3 FIG. 3 is a schematic block diagram of a metering part according to an embodiment of the present application.

[0024] Figure 4 FIG. 4 is a schematic block diagram of a driving assembly according to an embodiment of the present application.

[0025] Figure 5 FIG. 5 is a flow chart of an installation method according to an embodiment of the present application.

[0026] Reference Signs:

[0027] 100: tray; 110: first bearing part; 120: second bearing part; 200: first sensor; 300: driving assembly; 400 first control unit; 500: second control unit; 600: metering part; 700: amplifier; 800: analog-digital converter; 900: bracket; 910: screw lock; 920: fixing ring; 930: support rod. DETAILED DESCRIPTION

[0028] For the purpose of making the objects, technical solutions and advantages of the present application clearer, the present application will be further described in details below with reference to specific embodiments and accompanying drawings. It should be understood that these descriptions are only exemplary but not intended to limit the scope of the present application. In addition, in the following description, the description of well-known structures and techniques has been omitted to avoid unnecessary obscurity of the concept of the present application.

[0029] In the accompanying drawings, schematic diagrams of layer structures according to embodiments of the present application are shown. These diagrams are not drawn to scale, in which certain details are exaggerated for the purpose of clarity, and certain details may be omitted. The shapes of various regions, layers shown in the diagrams, and their relative sizes and positional relationships are only exemplary, and in actuality may deviate due to manufacturing tolerances or technical limitations, and regions / layers with different shapes, sizes, relative positions can be additionally designed by those skilled in the art according to actual needs.

[0030] Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the scope of protection of the present application.

[0031] In addition, the technical features involved in different embodiments of the present application described below can be combined with each other as long as there is no conflict.

[0032] The present application will be described in more detail below with reference to the accompanying drawings. In each of the accompanying drawings, similar elements are denoted by like reference signs. Each part in the accompanying drawings is not drawn to scale for the purpose of clarity.

[0033] Figure 1 is a structural schematic diagram of a mounting device according to an embodiment of the present application.

[0034] Figure 2 is a structural schematic diagram of a side of a tray according to an embodiment of the present application.

[0035] Please refer to Figure 1 and Figure 2In an embodiment of the present application, a mounting device is provided, which comprises a bracket 900, a tray 100 movably arranged on the bracket 900, the tray 100 comprising a first bearing part 110 for bearing a first upper electrode part (not shown in the figure) of a semiconductor device and a second bearing part 120 arranged around a peripheral part of the first bearing part 110 and coinciding with the center of gravity of the first bearing part 110, the second bearing part 120 being used for bearing a second upper electrode part (not shown in the figure) of the semiconductor device, a first sensor 200 arranged at the center of gravity of the first bearing part 110 and collecting the center of gravity deviation of the bearing first and second upper electrode parts, and a driving assembly 300 connected to the tray 100 and driving the tray 100 to ascend and descend and adjusting the bearing position of the first and second upper electrode parts according to the center of gravity deviation collected by the first sensor 200.

[0036] Please continue to refer to Figure 1 In an optional embodiment, the bracket 900 of the mounting device is connected with the tray 100, for example, movably connected with the edge of the second bearing part 102 of the tray 100, and the bracket 900, for example, the end face thereof, can be provided with a screw lock 910, so that the mounting device is fastened to the semiconductor device by the screw lock 100 to perform the mounting operation, and after the mounting operation is completed, the mounting device is disassembled by loosening the screw lock 910.

[0037] Please continue to refer to Figure 1 In an optional embodiment, the bracket 900 comprises a circular ring 920, and the orthographic projection of the tray 100 is located in the center region of the plane where the circular ring 920 is located, so that the tray 100 can freely move in the circular ring 920 without obstacles, and the tray 100 can be movably connected to the bracket 900 by at least two supporting rods 930, for example, 2, 4, or 6, without particular limitation, and the supporting rods 930 can be uniformly arranged along the outer edge of the tray 100, for example, the second bearing part 102, and the supporting rods 930 relatively move with respect to the bracket 900 along with the movement of the tray 100.

[0038] Please continue to refer to Figure 1 and Figure 2, the tray 100 is movably arranged on the support 900, the first bearing part 110 of the tray 100 is used for bearing a first upper electrode part (not shown in the figure) of a semiconductor device, and the second bearing part 120 is used for bearing a second upper electrode part (not shown in the figure) of the semiconductor device, the first upper electrode part and the second upper electrode part constitute an upper electrode structure of the semiconductor device, which is installed in a cavity of the semiconductor device, and the upper electrode structure is used for controlling the distribution of plasma in the cavity of the semiconductor device, controlling the semiconductor process, such as a dry etching process. In the embodiment of the application, the second bearing part 120 is arranged around the periphery of the first bearing part 110 and coincides with the center of gravity of the first bearing part 110, for example, the surface of the first bearing part 110 protrudes from the surface of the second bearing part 120, so that the first upper electrode part and the second upper electrode part are simultaneously borne on the surface of the tray 100, which has excellent installation precision, and can be simultaneously or separately assembled, thereby ensuring installation efficiency and installation matching degree, and the semiconductor process effectively ensures the stability of the process by the structure of the tray 100 provided in the embodiment of the application, thereby ensuring the critical dimension of the substrate (not shown in the figure), such as a wafer, and further ensuring the product yield.

[0039] Please continue to refer to Figure 2 In an optional embodiment, the first bearing part 110 is a circular disc, and the second bearing part 120 is an annular disc, the centers of the circular disc and the annular disc are the same, and the center coincides with the center of gravity.

[0040] Please continue to refer to Figure 1 and Figure 2 The first sensor 200 is arranged at the center of gravity of the first bearing part 210, and the first sensor 200 is connected with the first control unit 400 of the driving assembly 300. The first sensor 200 collects the center of gravity offset of the first upper electrode part and / or the second upper electrode part borne, and then the driving assembly 300 controls the tray 200 to perform horizontal adjustment, thereby driving the first upper electrode part and / or the second upper electrode part to displace and adjust the center of gravity, maintain the levelness and the center position.

[0041] Please continue to refer to Figure 2 In an optional embodiment, the first sensor 200 can include a displacement sensor, of course, can also include a gravity sensor and any sensor structure that can collect the center of gravity offset, and is not particularly limited.

[0042] Please continue to refer to Figures 1 to 3In some optional embodiments, the driving assembly 300 comprises, for example, a driving motor (not shown in the figure) connected to the tray 100, a first control unit 400 in communication with the driving motor and the first sensor 200, and the first control unit 400 controls the driving motor to drive the tray 100 to move. A plurality of limiters (not shown in the figure) are arranged on the semiconductor device, for example, to limit the lifting range of the tray 100, and the driving motor drives the tray 100 to lift within the lifting range, for example, to automatically lift.

[0043] The mounting device of the embodiments of the present application controls the driving motor to drive the tray 100 to lift or lower through the first control unit 400, changes the previous manual lifting and lowering of the mounting device to automatic lifting and lowering, and drives the tray 100 to drive the upper electrode structure to displace and adjust the gravity center through the cooperation of the first sensor 200 and the driving assembly 300. The embodiments of the present application improve the success rate of installation and cleaning of the semiconductor device and ensure the working time of the semiconductor device.

[0044] In an optional embodiment, the driving motor can be a servo motor, and the first control unit 400, for example, a PLC controller, is used to control the driving motor to act.

[0045] In an optional embodiment, the plurality of limiters (not shown in the figure) can be a plurality of position sensors, for example, comprising two position sensors arranged oppositely up and down, and the distance between the up and down position sensors limits the lifting range, and the tray 100 moves within the lifting range to ensure that the upper electrode structure reaches the installation position.

[0046] The tray 100 of the mounting device of the present application can keep the horizontal degree between the tray 100 and the upper electrode structure, and adjust the height through the driving assembly 300 to make the operation more accurate. The damage to the product is reduced, which can reduce the workload of personnel and save costs.

[0047] Please continue to refer to Figure 1 and Figure 4 In an optional embodiment, the tray 100 of the mounting device can further comprise a metering part 600, which can be located on the surface of the tray 100, for example, on the second bearing part 120, and the metering part 600 weighs and displays the weight of the first upper electrode part and the second upper electrode part. The metering part 600 can detect the weight of the upper electrode structure in real time, and the first time to find that the weight of the upper electrode structure is not enough to replace in time, which avoids installing the upper electrode structure exceeding the service life and further affecting the semiconductor process.

[0048] Please continue to refer to Figure 4 In an optional embodiment, the metering unit 600 comprises a pressure sensor 610, a display screen 620 connected to the pressure sensor 610, and used for displaying the weight of the upper electrode structure collected by the pressure sensor 610.

[0049] Please continue to refer to Figure 4 In an optional embodiment, the metering unit 600 can further comprise an amplifier 700, which is arranged between the pressure sensor 610 and the display screen 620, and used for amplifying the data acquired by the pressure sensor 610.

[0050] Please continue to refer to Figure 4 In an optional embodiment, the metering unit 600 can further comprise an analog-to-digital converter 800, which is arranged between the amplifier 700 and the display screen 620 of the metering unit 600, and used for converting the analog signal acquired by the pressure sensor 610 into a digital signal.

[0051] Please continue to refer to Figure 4 When an object is placed on the pressure sensor 610, pressure is applied to the pressure sensor 610, the pressure sensor 610 elastically deforms, so that the impedance changes, and at the same time, the excitation voltage changes, and outputs a changed analog signal. The signal is amplified by the amplifier 700 and output to the analog-to-digital converter 800. The converted digital signal is output to, for example, the second control unit 500, for example, a central processing unit, for operation control.

[0052] The mounting device in the embodiment of the application further comprises: at least one second sensor (not shown in the figure) arranged on the semiconductor device and close to the mounting position of the first upper electrode unit, used for calibrating the mounting position of the first upper electrode unit; and / or at least one third sensor (not shown in the figure), the third sensor is arranged on the semiconductor device and can be arranged below the second sensor, the third sensor is close to the mounting position of the second upper electrode unit, used for calibrating the mounting position of the second upper electrode unit.

[0053] In an optional embodiment, the semiconductor device is provided with a first mounting hole (not shown) and a second mounting hole (not shown), the first upper electrode part is provided with a first fastener (not shown) matched with the first mounting hole, the second upper electrode part is provided with a second fastener (not shown) matched with the second mounting hole, the second sensor is arranged on one side, for example, the right side, of the first mounting hole, the shielding effect is good, and the second sensor has a preset distance from the first mounting hole. Of course, the third sensor can be the same as the second sensor, for example, arranged on the right side of the second mounting hole and having a preset distance from the second mounting hole, for example, 2-10 mm, for example, 2 mm, 3 mm, or 5 mm.

[0054] In an optional embodiment, the number of the second sensor and the third sensor is multiple, corresponding to the mounting position, for example, 2, 3, 4, or the like.

[0055] In an optional embodiment, the second sensor and the third sensor are photoelectric sensors.

[0056] Please refer to Figure 5 The application also provides an installation method, which comprises the following steps:

[0057] S1, providing the installation device of the application as described above.

[0058] S2, supporting the first upper electrode part on the first bearing part 110 and supporting the second upper electrode part on the second bearing part 120.

[0059] S3, fixing the installation device to the semiconductor device by the bracket 900.

[0060] S4, collecting the center of gravity offset of the first upper electrode part and the second upper electrode part on the tray 100 by the first sensor 200.

[0061] S5, driving the tray to adjust the support position of the first upper electrode part and the second upper electrode part by the driving assembly 300.

[0062] S6, lifting the tray 100 by the driving assembly 300 to drive the first upper electrode part and the second upper electrode part to the mounting position.

[0063] S7, installing the first upper electrode part and the second upper electrode part.

[0064] S8, disassembling the installation device.

[0065] The first upper electrode part is supported on the first supporting part 110, and the second upper electrode part is supported on the second supporting part 120, and the first upper electrode part and the second upper electrode part form an upper electrode structure of the semiconductor device.

[0066] In an optional embodiment, the mounting device is fixed in the semiconductor device, for example, in a chamber of the semiconductor device. In an optional embodiment, the first upper electrode part and the second upper electrode part are mounted, for example, can be automatically locked or manually locked.

[0067] In an optional embodiment, before the first sensor 200 detects the shift of the center of gravity, of course, before the mounting device is fixed in the semiconductor device, the weight data of the first upper electrode part and / or the second upper electrode part is collected by the pressure sensor 610 of the metering part 600, and the weight data is sent to the second control unit 500.

[0068] In an optional embodiment, the second control unit 500 displays the weight data on the display screen 620 of the metering part 600.

[0069] In an optional embodiment, the sending of the weight data to the second control unit 500 can include amplification of the weight data by the amplifier 700.

[0070] In an optional embodiment, the analog-to-digital converter 800 converts the amplified weight data into a digital signal and sends it to the second control unit 500.

[0071] In an optional embodiment, fixing the mounting device in the semiconductor chamber can include: detecting the mounting position of the first upper electrode part and the second upper electrode part with the second sensor and / or the third sensor, and also adjusting the mounting position by the third control unit (not shown in the figure).

[0072] In an optional embodiment, the mounting position information of the first upper electrode part and / or the second upper electrode part is collected by the second sensor and the third sensor respectively, and whether the mounting position is at the predetermined mounting position is calibrated. That is, whether the first upper electrode part and / or the second upper electrode part is accurately mounted into the chamber of the semiconductor device is judged, for example, whether the first fastener on the first upper electrode part is locked into the first mounting hole of the chamber of the semiconductor device, and whether the second fastener on the second upper electrode part is locked into the second mounting hole of the chamber of the semiconductor device.

[0073] If yes, the second sensor and / or the third sensor are normal, the mounting work is completed, and the mounting device is disassembled.

[0074] If no, the second sensor and / or the third sensor issue an alarm.

[0075] The present application aims to protect a mounting device and a mounting method. The mounting device comprises a bracket 900, a tray 100 movably arranged on the bracket 900, the tray 100 comprising a first bearing part 110 for bearing a first upper electrode part (not shown in the figure) of a semiconductor device and a second bearing part 120 arranged around a peripheral part of the first bearing part 110 and coinciding with a gravity center of the first bearing part 120, the second bearing part 120 being used for bearing a second upper electrode part (not shown in the figure) of the semiconductor device, a first sensor 200 arranged at the gravity center of the first bearing part 110 and collecting a gravity center offset of the bearing first and second upper electrode parts, and a driving assembly 300 connected to the tray 100 and driving the tray 100 to ascend and descend and adjusting bearing positions of the first and second upper electrode parts according to the gravity center offset collected by the first sensor 200.

[0076] It should be understood that the above detailed description of the application is only used for illustrative or explanatory purposes of the principles of the application, and does not constitute a limitation of the application. Therefore, any modification, equivalent replacement, improvement, etc. made without departing from the spirit and scope of the application shall be included in the protection scope of the application. In addition, the appended claims of the present application are intended to cover all variations and modifications falling within the scope and boundary of the appended claims or the equivalent forms of such scope and boundary.

Claims

1. An installation device, characterized in that, include: support; A tray, movably mounted on the support, includes a first support portion and a second support portion. The first support portion is used to support the first upper electrode portion of the semiconductor device. The second support portion is disposed around the periphery of the first support portion and coincides with the center of gravity of the first support portion. The second support portion is used to support the second upper electrode portion of the semiconductor device. A first sensor is disposed at the center of gravity of the first support portion and collects the center of gravity offset of the first upper electrode portion and / or the second upper electrode portion supported by it. A drive assembly, connected to the tray, drives the tray to rise and fall, and, based on the center of gravity offset collected by the first sensor, drives the tray to adjust the supporting position of the first upper electrode and / or the second upper electrode.

2. The installation device according to claim 1, characterized in that, The tray also includes a measuring unit that weighs and displays the weights of the first upper electrode and the second upper electrode.

3. The installation device according to claim 1, characterized in that, The driving component includes: A drive motor is connected to the tray; The first control unit is communicatively connected to the drive motor and the first sensor, and controls the drive motor to drive the tray to move; Multiple limiters are respectively disposed on the semiconductor device to limit the lifting range of the tray, and the drive motor drives the tray to lift within the lifting range.

4. The installation device according to claim 1, characterized in that, The first sensor includes a displacement sensor.

5. The installation device according to claim 1, characterized in that, The mounting device further includes: At least one second sensor is disposed on the semiconductor device and near the mounting position of the first upper electrode portion for calibrating the mounting position of the first upper electrode portion; And / or, at least one third sensor, disposed below the second sensor and near the mounting position of the second upper electrode, for calibrating the mounting position of the second upper electrode.

6. The installation device according to claim 5, characterized in that, The semiconductor device has a first mounting hole and a second mounting hole. The first upper electrode portion has a first fastener that matches the first mounting hole, and the second upper electrode portion has a second fastener that matches the second mounting hole. The second sensor is disposed on one side of the first mounting hole and is at a preset distance from the first mounting hole.

7. The installation device according to claim 6, characterized in that, The preset distance is 2mm to 10mm.

8. The installation device according to claim 5, characterized in that, The number of the second and third sensors is multiple, corresponding to the installation positions.

9. The installation device according to claim 5, characterized in that, The second sensor and the third sensor are photoelectric sensors.

10. The installation device according to claim 1, characterized in that, The support includes a ring, and the orthographic projection of the tray is located in the central region of the plane containing the ring.

11. The installation device according to claim 10, characterized in that, The tray is movably connected to the support via at least two support rods.

12. The installation device according to claim 10, characterized in that, The surface of the first support portion protrudes beyond the surface of the second support portion. The first support portion is a circular disk, and the second support portion is an annular disk. The circular disk and the annular disk have the same center, and the center coincides with the center of gravity.

13. The installation device according to claim 1, characterized in that, The bracket is provided with screw locks, which are used to fasten the mounting device to the semiconductor device.

14. An installation method, characterized in that, include: Provide an installation device according to any one of claims 1-13; The first upper electrode portion is supported on the first support portion, and the second upper electrode portion is supported on the second support portion; The mounting device is fixed to the semiconductor device by the bracket; The first sensor is used to collect the center of gravity offset of the first upper electrode and / or the second upper electrode on the tray. The drive assembly drives the tray to adjust the supporting position of the first upper electrode and / or the second upper electrode; The tray is raised and lowered by the drive assembly to drive the first upper electrode and the second upper electrode to the installation position; The first upper electrode portion and the second upper electrode portion are installed; Disassemble the mounting device.

15. The installation method according to claim 14, characterized in that, The method further includes: Collect the installation position information of the first upper electrode and / or the second upper electrode, and calibrate whether the installation position is in the predetermined installation position.

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