Pre-treated wafer carrier loading device and method

Abstract

The present invention provides a loading device and method for a pre-processed wafer carrier, wherein a wafer ring loading mechanism, a wafer loading mechanism, a cover loading mechanism and a robotic arm are arranged on the periphery of a first displacement mechanism; the first displacement mechanism has a first base, a plurality of assembly carrying parts are arranged on a carrier, and a plurality of clamps are arranged on the periphery of each assembly carrying part; the movable end of the robotic arm is provided with an image capture component and a loading and unloading mechanism; the wafer ring loading mechanism places a wafer ring on the first base, the wafer loading mechanism places a wafer in the wafer ring, and the cover loading mechanism overlaps a cover on the wafer to form an assembly; the robotic arm calibrates the loading and unloading mechanism to correctly correspond to a to-be-assembled assembly carrying part on the carrier, the loading and unloading mechanism unlocks the clamps, moves the assembly from the first base to the to-be-assembled assembly carrying part, and then locks the clamps to fix the assembly on the carrier.

Description

Technical Field

[0001] The present invention relates to a loading device and method for a pre-treated wafer carrier, and more particularly to a loading device and method that utilizes a simple mechanism and operation to stack and assemble a wafer ring, a wafer, and a cover, and precisely move and fix them to different positions on a carrier. Background Art

[0002] The typical integrated circuit (IC) manufacturing process can be divided into three main parts: silicon wafer fabrication, IC production, and IC packaging. After the silicon ingot is cut into wafers, they must undergo a complex process of laser treatment, crystal growth, etching, and mechanical grinding to complete the IC production. During this manufacturing process, when the wafers undergo testing, cleaning, vapor deposition, drying, or soaking in organic solvents, in order to effectively secure the wafers for processing and to simultaneously process a large number of wafers to improve processing efficiency, multiple wafers are usually fixed on a large-area carrier. This carrier simultaneously supports each wafer for processing operations mentioned above.

[0003] The basic structure of a common carrier is a large-area convex (or concave) arc-shaped disk structure. A plurality of hollow portions for accommodating wafers are provided on the carrier, and a plurality of clamps for fixing wafers are provided on the periphery of each hollow portion. When each wafer is fixed by the clamp on the top of the hollow portion (the outer convex surface of the convex arc surface or the inner concave surface of the concave arc surface), the part to be processed of each wafer can be exposed to the outside through the hollow portion. Therefore, the carrier can accommodate multiple wafers and move them to different processing procedures at the same time, so as to effectively increase the efficiency of the overall wafer processing.

[0004] As automated machining becomes increasingly popular, the use of various automatic machines to perform wafer placement operations on carriers has become an inevitable trend, saving a significant amount of manpower, reducing production costs, and improving processing efficiency. However, since wafers themselves are extremely fragile and require extremely high processing precision, not only are extremely high requirements placed on the operational accuracy of the relevant transfer mechanisms when placing and taking wafers, but when multiple transfer mechanisms are used to separately perform the assembly or stacking of wafers and related components, each transfer mechanism must also be precisely connected. Otherwise, the overall assembly accuracy and quality of the finished product can be easily affected, and even the semi-finished product can be damaged. Therefore, how to effectively calibrate each transfer mechanism so that it not only maintains excellent accuracy when a single transfer mechanism performs different object displacement actions, but also forms an excellent relative activity correlation between different transfer mechanisms to ensure the operational connection accuracy of each transfer mechanism when displacing the same object has become a major issue that all relevant industry players urgently need to work on. Summary of the Invention

[0005] In view of the above-mentioned application requirements of the existing transfer mechanism for transferring wafers to the carrier, the inventors have studied and improved methods to meet these requirements, and finally produced the present invention.

[0006] To achieve the above object, the technical solution adopted by the present invention is:

[0007] A loading device for a pre-treated wafer carrier, characterized by comprising:

[0008] a first displacement mechanism connected to and driven by a control module, the first displacement mechanism comprising a first base body capable of reciprocating movement, and a wafer pre-treatment portion being provided on the first base body;

[0009] A wafer ring loading mechanism is provided adjacent to the first displacement mechanism and is connected to and driven by the control module. The wafer ring loading mechanism includes a wafer ring feeder that supports a wafer ring. A wafer ring displacement assembly is provided adjacent to the wafer ring feeder. The wafer ring displacement assembly is capable of carrying and releasing the wafer ring and moving the wafer ring between the wafer ring feeder and the wafer pre-treatment portion of the first base body.

[0010] A wafer loading mechanism disposed adjacent to the first displacement mechanism, connected to and driven by the control module, comprises a wafer feeder for supporting wafers, and a wafer transfer assembly disposed adjacent to the wafer feeder. The wafer transfer assembly comprises a wafer carrier, and the wafer carrier is driven by the wafer transfer assembly to carry the wafer between the wafer feeder and the wafer pre-treatment portion of the first base body;

[0011] A cover loading mechanism disposed adjacent to the first displacement mechanism, connected to and driven by the control module, comprises a cover feeding base for supporting a cover, and a cover displacement assembly disposed adjacent to the cover feeding base. The cover displacement assembly is capable of carrying and releasing the cover and moves between the cover feeding base and the wafer pre-treatment portion of the first base body;

[0012] A carrier plate having at least one assembly-carrying portion on its surface and a plurality of clamps disposed around each assembly-carrying portion;

[0013] A mechanical arm is connected to and driven by the control module. The mechanical arm has a movable end that can move between the first base and the carrier. At least one loading and unloading mechanism is provided on the movable end.

[0014] The loading device for the pre-treated wafer carrier is characterized in that: an image capture component capable of obtaining an image is also provided on the movable end of the robotic arm; the loading and unloading mechanism is respectively provided with a clamping component capable of opening and closing relative to clamp the assembly, a plurality of clamp operating components corresponding to and unlocking each clamp, and a plurality of distance measuring elements capable of measuring distance.

[0015] The aforementioned pre-treated wafer carrier loading device, wherein: the plurality of distance measuring elements are laser light sources capable of generating distance measuring laser beams, and are respectively arranged at at least three points around the loading and unloading mechanism.

[0016] The loading device for the pre-treated wafer carrier is characterized in that: a second displacement mechanism connected to and driven by the control module is provided next to the first displacement mechanism, and the second displacement mechanism has a second base body that can be displaced back and forth, and a pivot assembly that can support the carrier is provided on the second base body.

[0017] The loading device of the pre-treated wafer carrier is as follows: the wafer pre-treatment portion is a hollow hole, a supporting seat is provided in the hollow hole, a groove is provided on the top surface of the supporting seat, and a plurality of air suction holes for sucking air are provided on both sides of the groove; a supporting seat lifting assembly is provided at the bottom of the supporting seat, and the supporting seat lifting assembly can drive the supporting seat to move up and down.

[0018] The loading device of the pre-treatment type wafer carrier is described, wherein: the first base body is arranged on a plurality of first guide rails extending in parallel, the top surface of the first base body is provided with a plurality of jacket slides that can be relatively moved back and forth on the periphery of the wafer pre-treatment part, the top side of each jacket slide has a backlight surface, and a concave arc portion is provided on the side of each jacket slide facing the wafer pre-treatment part; and an imaging unit capable of capturing images is provided above and beside the first guide rail.

[0019] The loading device of the pre-treated wafer carrier is characterized in that: a nozzle is provided above the wafer feed seat, the nozzle has a nozzle hole that can spray air downward, and the top surface of the wafer bracket is provided with a plurality of exhaust holes that can suck air.

[0020] The loading device of the pre-treated wafer carrier is as follows: a wafer ring lifting assembly is provided below the wafer ring feeding seat, and the wafer ring lifting assembly can drive the wafer ring feeding seat to perform lifting and lowering movements; the wafer ring displacement assembly has a wafer ring displacement slide that can be lifted and lowered, and a wafer ring displacement guide rail that can be reset and moved is provided on the wafer ring displacement slide, and a clamping assembly that can clamp the wafer ring is provided on the wafer ring displacement guide rail; a wafer lifting assembly is provided below the wafer feeding seat, and the wafer lifting assembly can drive the wafer feeding seat to perform lifting and lowering movements; the wafer displacement assembly has a plurality of parallel The first guide rail comprises a wafer transfer rail, and a wafer transfer slide which is arranged on each of the wafer transfer rails and can be moved back and forth. A telescopic component which can be lifted vertically is provided on the wafer transfer slide, and the wafer holder is provided at the movable end of the telescopic component. A cover lifting component is provided under the cover feeding seat, and the cover lifting component can drive the cover feeding seat to perform lifting and lowering movements. The cover transfer component has a cover transfer slide which can be lifted and lowered, and a cover transfer guide rail which can be moved back and forth laterally is provided on the cover transfer slide, and a clamping claw group which can clamp the cover is provided on the cover transfer guide rail.

[0021] The loading device of the pre-treated wafer carrier is characterized in that: the outer periphery of the wafer ring is provided with an outer ring flange, the inner periphery of the wafer ring is provided with an inner ring flange; the center of the cover is provided with a ring convex portion; and the wafer feeding seat is provided with a wafer box that can accommodate wafers in intervals.

[0022] A method for placing a pre-treated wafer carrier is provided, using the aforementioned pre-treated wafer carrier placing device, and is characterized by comprising:

[0023] A "carrier, wafer ring, wafers, and cover are positioned" process is to place an empty carrier at a preset assembly position, and place each wafer ring, wafer, and cover at a preset feeding position;

[0024] a "wafer ring loading mechanism moves a wafer ring into the first displacement mechanism" process, wherein the wafer ring loading mechanism moves a wafer ring from the feed position and supports the wafer pre-treatment portion of the first base;

[0025] a "wafer loading mechanism moves a wafer into the wafer ring" process, wherein the wafer loading mechanism moves a wafer onto the first displacement mechanism for alignment, and then places the wafer into the wafer ring;

[0026] a process of "a cover placement mechanism overlaying a cover on the wafer in the wafer ring to form an assembly", wherein the cover placement mechanism moves a cover into the wafer ring and overlays the cover on the wafer, thereby overlaying the wafer ring, wafer, and cover to form an assembly;

[0027] In a "loading and unloading mechanism moves and locks the assembly onto the assembly carrying portion to be assembled" process, the control module drives the loading and unloading mechanism on the robot arm to move the assembly from the first base and lock it onto the assembly carrying portion to be assembled.

[0028] A method for placing a pre-treated wafer carrier is provided, using the aforementioned pre-treated wafer carrier placing device, and is characterized by comprising:

[0029] A "carrier, wafer ring, wafers, and cover are positioned" process is to place an empty carrier at a preset assembly position, and place each wafer ring, wafer, and cover at a preset feeding position;

[0030] a "wafer ring loading mechanism moves a wafer ring into the first displacement mechanism" process, wherein the wafer ring loading mechanism moves a wafer ring from the feed position and supports the wafer pre-treatment portion of the first base;

[0031] a "wafer loading mechanism moves a wafer into the wafer ring" process, wherein the wafer loading mechanism moves a wafer onto the first displacement mechanism for alignment, and then places the wafer into the wafer ring;

[0032] a process of "a cover placement mechanism overlaying a cover on the wafer in the wafer ring to form an assembly", wherein the cover placement mechanism moves a cover into the wafer ring and overlays the cover on the wafer, thereby overlaying the wafer ring, wafer, and cover to form an assembly;

[0033] a "loading and unloading mechanism calibration loading and unloading operating surface" procedure, wherein the control module drives the loading and unloading mechanism on the robot arm to adjust its position so that each distance measuring element measures equal distances around a portion of a component to be assembled at a position on the carrier. The loading and unloading mechanism aligns a predetermined loading and unloading operating surface with the component to be assembled, and the tilt angle of the loading and unloading operating surface is calibrated. The control module stores information about the calibrated loading and unloading operating surface.

[0034] a "image capture component inspecting the image of the periphery of the assembly carrier portion to be assembled on the carrier and correcting the imaging plane" procedure, wherein the control module drives the image capture component on the robot arm to inspect the image of the periphery of the assembly carrier portion to be assembled and each fixture according to the inclination angle and direction of the aforementioned corrected loading and unloading operation surface, and adjusts the image capture component to a position where a preset imaging plane correctly corresponds to the assembly carrier portion to be assembled and each fixture, thereby correcting the position of the imaging plane of the image capture component, and the control module stores the information of the corrected imaging plane. At the same time, the control module uses the information of the corrected imaging plane to further correct the relative position of the loading and unloading operation surface so that the loading and unloading operation surface can accurately correspond to the position of the assembly carrier portion to be assembled and each fixture;

[0035] In a "loading and unloading mechanism moves and locks the assembly onto the assembly carrying portion to be assembled" process, the control module drives the loading and unloading mechanism on the robot arm to move the assembly from the first base and lock it onto the assembly carrying portion to be assembled.

[0036] The method for placing a pre-treated wafer carrier, wherein the process of "the loading and unloading mechanism moves and locks the assembly onto the assembly support portion to be assembled" comprises:

[0037] a step of "unlocking each clamp by the loading and unloading mechanism" in which the control module first drives the loading and unloading mechanism on the robot arm to move above the assembly support portion to be assembled, and then uses each clamp operating assembly to release each clamp;

[0038] a step of "a loading and unloading mechanism moving the assembly onto the assembly support portion to be assembled", wherein the control module drives the loading and unloading mechanism on the robot arm to move above the wafer pre-treatment portion of the first base, clamps the assembly using the clamping assembly, and then moves the assembly onto the assembly support portion to be assembled;

[0039] In a step of "locking each clamp by the loading and unloading mechanism to fix the assembly", each clamp operating assembly locks each clamp so that the assembly can be fixed on the assembly supporting portion to be assembled.

[0040] The method for placing a pre-treated wafer carrier is as follows: after the step of "the loading and unloading mechanism locks each clamp to fix the assembly", there is also a step of "the loading and unloading mechanism disengages the assembly and the carrier rotates". After each clamping component loosens the assembly, the control module drives the pivot component to drive the carrier to pivot, so that the assembly supporting part that has fixed the assembly pivots to a side position, and the vacant assembly supporting part on the other side is moved to the original position to be assembled to form another assembly supporting part to be assembled.

[0041] The method for placing a pre-treated wafer carrier, wherein the "loading and unloading mechanism calibration loading and unloading operation surface" procedure has the following steps:

[0042] a step of "the robotic arm drives the loading and unloading mechanism to approach the carrier at a preset loading and unloading reference value, and uses distance measuring elements to measure the distance to the edge of the supporting portion of the assembly to be assembled," wherein the control module drives the loading and unloading mechanism on the robotic arm to move above the carrier at a direction and angle of the preset loading and unloading reference value; and uses the distance measuring elements to detect the distance to the periphery of the supporting portion of the assembly to be assembled;

[0043] a step of "controlling the loading and unloading mechanism to adjust the position so that the distances measured by the distance measuring elements are equal, thereby correcting the tilt angle of the loading and unloading working surface thereof," wherein the control module drives the loading and unloading mechanism on the robot arm to adjust the position so that the distances detected by the distance measuring elements to the periphery of the assembly support portion to be assembled are equal, thereby ensuring that the loading and unloading working surface of the loading and unloading mechanism is aligned and parallel to the assembly support portion to be assembled, thereby correcting the tilt angle of the loading and unloading working surface of the loading and unloading mechanism; and the control module stores information about the corrected loading and unloading working surface;

[0044] The process of "the image capturing component inspecting the image of the periphery of the supporting portion of the assembly to be assembled on the carrier and correcting the imaging surface" comprises:

[0045] a step of "the robotic arm drives the image capture component to approach the carrier at an angle equal to the calibrated loading and unloading working surface, and obtains position images of the assembly support portion to be assembled and each fixture", wherein the control module drives the image capture component on the robotic arm to move above the assembly support portion to be assembled in a direction and at an angle equal to the calibrated loading and unloading working surface, and uses the image capture component to obtain images of the periphery of the assembly support portion to be assembled, thereby confirming the position of the assembly support portion to be assembled and each fixture;

[0046] A step of "the control module adjusts the position of the image capture component so that it correctly corresponds to the support portion of the assembly to be assembled, thereby correcting the position of its imaging surface, and using the information of the corrected imaging surface to correct the loading and unloading operation surface so that it is positively and accurately corresponding to the support portion of the assembly to be assembled". The control module drives the image capture component on the robotic arm to adjust its position so that the image capture component remains correctly corresponding to the support portion of the assembly to be assembled and each clamp, thereby correcting the position of the imaging surface of the image capture component; and the control module stores the information of the corrected imaging surface and can calculate the corrected position information of the loading and unloading mechanism, so as to facilitate the loading and unloading mechanism to be driven by the robotic arm to move to a position that is positively, accurately and flushly corresponding to the support portion of the assembly to be assembled.

[0047] The method for placing a pre-treated wafer carrier, wherein the process of "the wafer placing mechanism moves a wafer into the wafer ring" comprises:

[0048] a step of "the wafer loading mechanism moves the wafer onto the first displacement mechanism and aligns the wafer," wherein the wafer carrier moves the wafer above the wafer pre-treatment portion of the first base, and the imaging unit captures an image of the wafer to check whether the wafer is positioned correctly. Furthermore, the two jacket slides with backlight surfaces are brought into contact with each other, so that the two concave arc portions combine to form a circular hole corresponding to the wafer pre-treatment portion. The control module then drives the wafer carrier to correct its position via the wafer displacement assembly, so that the wafer is aligned to a position correctly corresponding to the center of the wafer ring;

[0049] The first step of "the first displacement mechanism moves the wafer into the wafer ring" is to separate the two jacket slides, and then the support seat lifting assembly drives the support seat to rise, so that the wafer holder is separated from the wafer in the groove; then the wafer displacement assembly drives the wafer holder to move out from above the first seat body; and then the support seat lifting assembly drives the support seat to descend, so that the wafer moves down into the wafer ring.

[0050] The method for placing a pre-treated wafer carrier, wherein the process of "the wafer placing mechanism moves a wafer into the wafer ring" comprises:

[0051] a step of "a wafer loading mechanism carries a wafer and levels the wafer during the transfer process" in which the control module drives the wafer transfer assembly to drive the wafer carrier to support a wafer from the wafer feeder, bring the wafer close to the air jet head, and use the air jet holes of the air jet head to blow air onto the wafer to level the wafer and keep it stably in the correct position on the wafer carrier;

[0052] a step of "the wafer loading mechanism moves the wafer onto the first displacement mechanism and aligns the wafer," wherein the wafer carrier moves the wafer above the wafer pre-treatment portion of the first base body, and the imaging unit captures an image of the wafer to check whether the wafer is positioned correctly. The two jacket slides with backlight surfaces are brought into contact with each other, so that the two concave arc portions are combined to form a circular hole corresponding to the wafer pre-treatment portion. The control module then drives the wafer carrier to correct its position via the wafer displacement assembly, so that the wafer is aligned to a position correctly corresponding to the center of the wafer ring;

[0053] The first step of "the first displacement mechanism moves the wafer into the wafer ring" is to separate the two jacket slides, and then the support seat lifting assembly drives the support seat to rise, so that the wafer holder is separated from the wafer in the groove; then the wafer displacement assembly drives the wafer holder to move out from above the first seat body; and then the support seat lifting assembly drives the support seat to descend, so that the wafer moves down into the wafer ring.

[0054] The main advantage of the present invention is to provide a loading device and method for a pre-processed wafer carrier, wherein a wafer ring loading mechanism, a wafer loading mechanism, a cover loading mechanism and a second displacement mechanism are provided on the circumferential side of a first displacement mechanism, and a robotic arm is provided between the first displacement mechanism and the second displacement mechanism; the first displacement mechanism has a first base body that can be moved back and forth, a wafer pre-processing portion is provided on the first base body, a movable carrier is provided on the second displacement mechanism, a plurality of assembly carrying portions are provided on the carrier, and a plurality of clamps are provided on the circumference of each assembly carrying portion, an image capture component and a loading and unloading mechanism are provided on the movable end of the robotic arm; the wafer ring loading mechanism can place a wafer ring in the wafer pre-processing portion, the wafer loading mechanism places a wafer in the wafer ring, and then the cover loading mechanism places a cover in the wafer ring and overlaps the wafer An assembly is formed on the wafer, so that the peripheral side of the wafer is firmly clamped between the wafer ring and the peripheral edge of the cover, so that the wafer can maintain good flatness in the assembly. The robotic arm can drive the loading and unloading mechanism and the image capture component to correct their loading and unloading working surface and imaging surface respectively, so that the loading and unloading mechanism can positively and accurately correspond to the assembly supporting part to be assembled at a position to be assembled on the carrier. The loading and unloading mechanism can first unlock each clamp, and then move the assembly from the first base to the assembly supporting part to be assembled. Then the loading and unloading mechanism locks each clamp to fix the assembly on the assembly supporting part to be assembled, and the carrier rotates to move another assembly supporting part to the position to be assembled. With the above-mentioned simple and low-cost structure, combined with a well-planned and smooth action process, the construction cost of the equipment can be effectively reduced and the assembly efficiency can be improved.

[0055] Another advantage of the present invention is to provide a loading device and method for a pre-processed wafer carrier, wherein a plurality of distance measuring elements are provided around a loading and unloading mechanism. When the loading and unloading mechanism approaches the assembly support portion to be assembled in a direction and at an angle corresponding to a preset loading and unloading reference value, the position of the loading and unloading mechanism can be adjusted so that each distance measuring element measures an equal distance around the assembly support portion to be assembled, thereby correcting the inclination angle of the loading and unloading working surface of the loading and unloading mechanism so that the loading and unloading mechanism can correspond parallel to (have the same inclination angle) the assembly support portion to be assembled. The image capture component can approach the assembly support portion to be assembled in the same direction and inclination angle as the corrected loading and unloading working surface and directly capture an image. The position of the image capture component is then adjusted so that it accurately corresponds to the assembly support portion to be assembled, thereby correcting the position of the image capture component's imaging surface. At the same time, the position of the loading and unloading mechanism is corrected using information on the position of the corrected imaging surface so that its loading and unloading working surface can accurately and directly correspond to the assembly support portion to be assembled and its surrounding components.

[0056] Another advantage of the present invention is that it provides a loading device and method for a pre-treated wafer carrier. The top surface of the first base body is provided with a jacket slide with a backlight surface and relatively displaceable on the peripheral side of the wafer pre-treatment portion. A concave arc portion is provided on the side of each jacket slide facing the wafer pre-treatment portion, and an imaging unit is provided next to the first displacement mechanism. When the imaging unit obtains the image of the wafer moved above the wafer ring, the jacket slides can be fitted together to combine the concave arc portions into a hole with a backlight effect, so that the wafer can be easily guided to correspond to the wafer ring, so as to facilitate the subsequent operation of accurately placing the wafer into the wafer ring.

[0057] In order to provide a more detailed understanding of the above-mentioned objects, effects and features of the present invention, the following description is made with reference to the following drawings: BRIEF DESCRIPTION OF THE DRAWINGS

[0058] Figure 1 It is a three-dimensional exploded view of the overall structure and related components of the present invention.

[0059] Figure 2 It is a partial structural diagram of the present invention; it reveals the structure of the first seat body and related supporting seats and other parts.

[0060] Figure 3 Tie Figure 1 A partial enlarged view of part A; it reveals the structure of the image capture component and loading and unloading mechanism assembled on the robotic arm.

[0061] Figure 4 It is an operational flow chart of the present invention.

[0062] Figure 5 It is a schematic diagram of the state in which the wafer ring, wafer and cover are respectively placed in the feeding position of the present invention.

[0063] Figure 6 This is an action diagram of the wafer loading mechanism of the present invention driving each wafer cassette to pivot toward the first displacement mechanism.

[0064] Figure 7 FIG1 is an action diagram (1) of the wafer ring displacement assembly of the present invention for displacing the wafer ring.

[0065] Figure 8 FIG2 is an action diagram of the wafer ring displacement assembly of the present invention displacing the wafer ring. FIG2 is an action diagram of the wafer ring displacing assembly of the present invention.

[0066] Figure 9 FIG3 is an action diagram of the wafer ring displacement assembly of the present invention displacing the wafer ring.

[0067] Figure 10 FIG4 is an action diagram of the wafer ring displacement assembly of the present invention displacing the wafer ring.

[0068] Figure 11FIG1 is an action diagram of the wafer transfer assembly of the present invention for transferring a wafer (1).

[0069] Figure 12 FIG2 is an action diagram of the wafer transfer assembly of the present invention for transferring a wafer. ...

[0070] Figure 13 This is an action diagram of the present invention using a nozzle to spray air to level the wafer on the wafer holder.

[0071] Figure 14 FIG3 is an action diagram of the wafer transfer assembly of the present invention for transferring a wafer.

[0072] Figure 15 FIG4 is an action diagram of the wafer transfer assembly of the present invention for transferring a wafer.

[0073] Figure 16 This is an action diagram of the present invention using an imaging unit to inspect the wafer on the first seat and using two sleeve slides to correct the position of the wafer.

[0074] Figure 17 This is an action diagram of the support seat of the present invention rising to support the wafer.

[0075] Figure 18 It is an action diagram of moving out the wafer holder of the present invention.

[0076] Figure 19 This is an action diagram of the support seat of the present invention descending to place the wafer in the wafer ring.

[0077] Figure 20 This is an action diagram of the first seat body of the present invention moving to a position beside the covering loading mechanism.

[0078] Figure 21 1 is an action diagram of the cover displacement assembly of the present invention displacing the cover (1).

[0079] Figure 22 2 is an action diagram of the cover displacement assembly of the present invention displacing the cover.

[0080] Figure 23 3 is an action diagram of the cover displacement assembly of the present invention displacing the cover.

[0081] Figure 24 4 is an action diagram of the cover displacement assembly of the present invention displacing the cover.

[0082] Figure 25 This is an action diagram of the clamping jaw group of the cover displacement assembly of the present invention being separated from the cover.

[0083] Figure 26 This is a schematic diagram of the present invention in a state where the cover displacement assembly completes cover placement and the robotic arm has not yet moved.

[0084] Figure 27 This is an operation diagram of the loading and unloading mechanism of the present invention using a distance measuring element to align the supporting portion of the assembly to be assembled on the carrier plate to calibrate the inclination angle of the loading and unloading working surface.

[0085] Figure 28 This is an action diagram of the present invention using an image capturing component to capture an image of the supporting portion of an assembly to be assembled, and thereby correcting the position of the imaging surface.

[0086] Figure 29 This is an action diagram of the present invention using the loading and unloading mechanism to unlock the clamps around the bearing portion of the assembly to be assembled.

[0087] Figure 30 This is the action diagram (1) of the present invention using the loading and unloading mechanism to move the wafer ring from the first base to the assembly support portion to be assembled.

[0088] Figure 31 This is the action diagram (2) of the present invention using the loading and unloading mechanism to move the wafer ring from the first base to the assembly support portion to be assembled.

[0089] Figure 32 This is an action diagram of the present invention using the assembly and disassembly mechanism to lock the clamps around the bearing portion of the assembly to be assembled.

[0090] Figure 33 This is an action diagram of the loading and unloading mechanism of the present invention after it is separated from the loading plate and the loading plate pivots.

[0091] Explanation of reference numerals: 1 first displacement mechanism; 11 first guide rail; 12 first seat; 121 wafer pre-treatment portion; 13 supporting seat; 131 groove channel; 132 suction hole; 133 supporting seat lifting assembly; 15 jacket slide; 151 concave arc portion; 16 imaging unit; 2 wafer ring loading mechanism; 21 wafer ring feeding seat; 22 wafer ring lifting assembly; 23 wafer ring displacement assembly; 231 wafer ring displacement guide rail; 232 wafer ring displacement slide; 233 clamping assembly; 2a wafer ring; 20a assembly; 21a outer ring flange; 22a inner ring flange; 3 wafer loading mechanism; 31 wafer feeding seat; 32 wafer lifting assembly; 33 wafer displacement assembly; 331 wafer displacement guide rail; 332 wafer displacement 333 telescopic assembly; 34 wafer holder; 341 exhaust hole; 35 nozzle; 351 nozzle; 3a wafer; 30a wafer cassette; 4 cover loading mechanism; 41 cover feeder; 42 cover lifting assembly; 43 cover displacement assembly; 431 cover displacement guide rail; 432 cover displacement slide; 433 clamping jaw assembly; 4a cover; 41a annular protrusion; 5 second displacement mechanism; 51 second guide rail; 52 second base; 53 pivot assembly; 50 carrier; 501 assembly support portion; 502 fixture; 6 robotic arm; 61 image capture assembly; 611 image pickup assembly; 62 loading and unloading mechanism; 621 distance measuring element; 6211 laser beam; 622 clamping assembly; 623 fixture operation assembly; A Figure 1Image capture components and loading and unloading mechanism parts; P1 carrier, wafer ring, wafer, cover are respectively positioned; P2 wafer ring loading mechanism moves a wafer ring to the first displacement mechanism; P3 wafer loading mechanism moves a wafer to the wafer ring; P4 cover loading mechanism superimposes a cover on the wafer in the wafer ring to form an assembly; P5 loading and unloading mechanism corrects the loading and unloading operation surface; P6 image capture component inspects the image of the periphery of the assembly carrying part to be assembled on the carrier and corrects the imaging surface; P7 loading and unloading mechanism moves and locks the assembly to the assembly carrying part to be assembled On; S11 the carrier is moved to the operating position on the second displacement mechanism; S12 the wafer cassette containing the wafer is placed on the wafer loading mechanism; the wafer ring and the cover are placed on the wafer ring loading mechanism and the cover loading mechanism respectively; S13 the wafer loading mechanism drives the wafer cassette to pivot so that its opening faces the first displacement mechanism; S21 the wafer ring loading mechanism moves a wafer ring and positions it in the first displacement mechanism; S31 the wafer loading mechanism carries a wafer and guides the wafer level during the movement; S32 the wafer loading mechanism moves the wafer to the first displacement mechanism and guides the wafer; S33 the The first displacement mechanism moves the wafer into the wafer ring; S41 the cover loading mechanism moves a cover into the wafer ring and overlaps the cover on the wafer to form an assembly; S51 the robot arm drives the loading and unloading mechanism to approach the carrier at a preset loading and unloading reference value, and uses a distance measuring element to measure the distance to the edge of the supporting portion of the assembly to be assembled; S52 the control module adjusts the position of the loading and unloading mechanism so that the measuring distances of each distance measuring element are equal, thereby correcting the tilt angle of its loading and unloading operation surface; S61 the robot arm drives the image capture component to approach the carrier at the same tilt angle as the corrected loading and unloading operation surface, and obtains the image capture component. The position image of the assembly carrier and each clamp to be assembled; S62 control module adjusts the position of the image capture component so that it correctly corresponds to the assembly carrier to be assembled, thereby correcting the position of its imaging surface, and uses the information of the corrected imaging surface to correct the loading and unloading operation surface so that it is positive and accurately corresponds to the assembly carrier to be assembled; S71 loading and unloading mechanism unlocks each clamp; S72 loading and unloading mechanism moves the assembly to the assembly carrier; S73 loading and unloading mechanism locks each clamp to fix the assembly; S74 loading and unloading mechanism disengages from the assembly, and the carrier rotates. DETAILED DESCRIPTION

[0092] Please refer to Figures 1 to 3As shown, the main structure of the present invention includes: a first displacement mechanism 1, a wafer ring loading mechanism 2, a wafer loading mechanism 3, a cover loading mechanism 4, a second displacement mechanism 5 and a robotic arm 6. The first displacement mechanism 1 is connected to and driven by a control module (which can be a computer with computing functions, not shown). The first displacement mechanism 1 has a plurality of parallel first guide rails 11 and a first base body 12 disposed on each of the first guide rails 11 and movable back and forth. A wafer pre-treatment portion 121 (which can be a hollow hole) is provided on the first base body 12. A support seat 13 is provided within the wafer pre-treatment portion 121. The support seat 13 is driven by a support seat lifting assembly 133 to be raised and lowered. A groove 131 is recessed on the top surface of the support seat 13, and a plurality of air suction holes 132 are provided on both sides of the groove 131 for sucking air.

[0093] In a feasible embodiment, a plurality of relatively reciprocatingly movable jacket slides 15 are provided on the top surface of the first base body 12 around the wafer pre-treatment portion 121. The top side of each jacket slide 15 has a backlight surface, and a concave arc portion 151 is provided on one side of each jacket slide 15 facing the wafer pre-treatment portion 121. In addition, an image capturing unit 16 capable of capturing an image is provided above the first guide rail 11.

[0094] The wafer ring loading mechanism 2 is arranged on one side of the first guide rail 11, connected to and driven by the control module (not shown), and the wafer ring loading mechanism 2 has a wafer ring feeder 21 for supporting multiple stacked wafer rings 2a, and a wafer ring lifting assembly 22 supported below the wafer ring feeder 21. The wafer ring lifting assembly 22 can drive the wafer ring feeder 21 to move up and down. A wafer ring displacement assembly 23 is provided on the side of the wafer ring feeder 21. The wafer ring displacement assembly 23 has a liftable wafer ring displacement slide 232, and a wafer ring displacement guide rail 231 that can be laterally displaced back and forth is provided on the wafer ring displacement guide rail 231. A group of clamping assemblies 233 that can open and close relative to each other are provided on the wafer ring displacement guide rail 231.

[0095] In a feasible embodiment, an outer ring flange 21 a is provided above the outer periphery of the wafer ring 2 a , and an inner ring flange 22 a is provided below the inner periphery of the wafer ring 2 a .

[0096] The wafer loading mechanism 3 is arranged on one side of the first guide rail 11, connected to and driven by the control module (not shown), and the wafer loading mechanism 3 has a wafer feeding seat 31 for supporting a plurality of wafers 3a, and a wafer lifting assembly 32 supported below the wafer feeding seat 31, the wafer lifting assembly 32 can drive the wafer feeding seat 31 to move up and down, and an air nozzle 35 is provided above the wafer feeding seat 31, the air nozzle 35 has an air injection hole 351 for spraying air downward; A wafer transfer assembly 33 is provided next to the wafer feeding seat 31. The wafer transfer assembly 33 has a plurality of wafer transfer rails 331 parallel to the first guide rail 11, and a wafer transfer slide 332 arranged on each of the wafer transfer rails 331 and capable of moving back and forth. A telescopic assembly 333 that can be lifted vertically is provided on the wafer transfer slide 332. A wafer holder 34 is provided at the movable end of the telescopic assembly 333. A plurality of exhaust holes 341 for extracting air are provided on the top surface of the wafer holder 34.

[0097] In a feasible embodiment, the outer diameter of the wafer 3a is slightly smaller than the inner diameter of the wafer ring 2a, and a preset fixed number of wafers 3a can be pre-spaced and accommodated in a wafer box 30a, and then the wafer box 30a is placed on the wafer feeder 31 to facilitate the movement of each wafer 3a.

[0098] The cover loading mechanism 4 is arranged on one side of the first guide rail 11, connected to and driven by the control module (not shown), and the cover loading mechanism 4 has a cover feeding seat 41 for supporting multiple stacked covers 4a, and a cover lifting component 42 supported under the cover feeding seat 41, and the cover lifting component 42 can drive the cover feeding seat 41 to move up and down. A cover displacement component 43 is provided on the side of the cover feeding seat 41, and the cover displacement component 43 has a liftable cover displacement slide 432, and a cover displacement guide rail 431 that can be displaced laterally back and forth is provided on the cover displacement slide 432, and a group of clamping jaws 433 that can open and close relative to each other is provided on the cover displacement guide rail 431.

[0099] In a feasible embodiment, the cover 4 a is a sheet-shaped body with an outer diameter close to the outer diameter of the wafer 3 a , and a ring-shaped protrusion 41 a that can be clamped by the clamping jaw assembly 433 is provided at the center of the cover 4 a .

[0100] The second displacement mechanism 5 is laterally arranged beside one end of the first guide rail 11, connected to and driven by the control module (not shown), and has a plurality of second guide rails 51 extending in parallel, and a second base 52 arranged on each of the second guide rails 51 and capable of reciprocating movement. A pivot assembly 53 is provided on the second base 52, and a carrier 50 can be combined and placed on the pivot assembly 53.

[0101] In a feasible embodiment, the carrier 50 is a disk-shaped structure with a convex arc surface, and a plurality of assembly supporting parts 501 (which may be a hollow part) are provided on the surface of the carrier 50, and a plurality of clamps 502 are respectively provided on the side of each assembly supporting part 501 (hollow part).

[0102] The robotic arm 6 is arranged between the first displacement mechanism 1 and the second displacement mechanism 5, connected to and driven by the control module (not shown), and an image capture component 61 and a loading and unloading mechanism 62 are provided at the movable end of the robotic arm 6; the image capture component 61 has an imaging component 611 that can capture images, and the loading and unloading mechanism 62 has two clamping components 622 that can be opened and closed relative to each other, a plurality of clamp operating components 623 corresponding to each clamp 502 and a plurality of ranging elements 621, and the plurality of ranging elements 621 can be laser light sources respectively arranged at at least three points around the loading and unloading mechanism 62 and capable of generating a ranging laser beam 6211.

[0103] Please refer to Figure 4 As shown, the operating method of the present invention includes: a "positioning the carrier, wafer ring, wafer, and cover" procedure P1; a "wafer ring loading mechanism moves a wafer ring into the first displacement mechanism" procedure P2; a "wafer loading mechanism moves a wafer into the wafer ring" procedure P3; a "cover loading mechanism superimposes a cover on the wafer in the wafer ring to form an assembly" procedure P4; a "loading and unloading mechanism calibrates the loading and unloading operation surface" procedure P5; a "image capturing component inspects the image of the periphery of the assembly support portion to be assembled on the carrier and calibrates the imaging surface" procedure P6; and a "loading and unloading mechanism moves and locks the assembly onto the assembly support portion to be assembled" procedure P7; wherein:

[0104] The "Place the carrier, wafer ring, wafers, and cover in their respective positions" P1 procedure is to place an empty carrier 50 in a preset assembly position and place each wafer ring 2a, wafer 3a, and cover 4a in a preset feeding position; it sequentially includes the following steps: "The carrier is moved to the operating position on the second displacement mechanism" S11, "The wafer cassette containing the wafers is placed on the wafer loading mechanism; the wafer ring and cover are placed on the wafer ring loading mechanism and the cover loading mechanism respectively" S12, and "The wafer loading mechanism drives the wafer cassette to pivot so that its opening faces the first displacement mechanism" S13.

[0105] The "wafer ring loading mechanism moves a wafer ring into the first displacement mechanism" P2 program is driven by the control module to drive the wafer ring loading mechanism 2 to move a wafer ring 2a from the feed position and support it in the wafer pre-treatment portion 121 of the first base body 12; it has the "wafer ring loading mechanism moves a wafer ring and positions it in the first displacement mechanism" S21 step.

[0106] In the "wafer loading mechanism moves a wafer into the wafer ring" P3 program, the control module drives the wafer loading mechanism 3 to move a wafer 3a onto the first displacement mechanism 1 for alignment, and then places the wafer 3a into the wafer ring 2a. The program sequentially includes the following steps: "the wafer loading mechanism carries a wafer and levels the wafer during the movement process" S31; "the wafer loading mechanism moves the wafer onto the first displacement mechanism and aligns the wafer" S32; and "the first displacement mechanism moves the wafer into the wafer ring" S33.

[0107] The "cover loading mechanism places a cover on the wafer in the wafer ring to form an assembly" P4 program has the control module drive the cover loading mechanism 4 to move a cover 4a into the wafer ring 2a and overlay it on the wafer 3a, thereby overlaying the wafer ring 2a, wafer 3a, and cover 4a to form an assembly 20a. The peripheral side of the wafer 3a is firmly clamped between the peripheral edges of the wafer ring 2a and the cover 4a, so that the wafer 3a can maintain good flatness in the assembly 20a. It also has the "cover loading mechanism places a cover into the wafer ring and overlays it on the wafer to form an assembly" S41 step.

[0108] The "Loading and unloading mechanism correction loading and unloading working surface" P5 program is driven by the control module to adjust the position of the loading and unloading mechanism 62 on the robot arm 6 so that each distance measuring element 621 measures the same distance around the assembly support portion 501 to be assembled at a position to be assembled on the carrier 50, so that the loading and unloading mechanism 62 can be parallel (with the same tilt angle) and positively correspond to the assembly support portion 501 to be assembled, thereby correcting the tilt angle of the loading and unloading working surface of the loading and unloading mechanism 62, and the control module stores the information of the corrected loading and unloading working surface; it sequentially includes the following steps: "The robot arm drives the loading and unloading mechanism to approach the carrier with a preset loading and unloading reference value, and uses the distance measuring element to measure the distance to the edge of the assembly support portion to be assembled" S51, and "The control module adjusts the position of the loading and unloading mechanism so that the measured distances of each distance measuring element are of the same length, thereby correcting the tilt angle of its loading and unloading working surface" S52.

[0109] The "image capture component inspects the image of the periphery of the assembly carrier portion to be assembled on the carrier and corrects the imaging surface" P6 program, the control module drives the image capture component 61 on the robot arm 6 to inspect the image of the periphery of the assembly carrier portion 501 to be assembled and each clamp 502 according to the inclination angle and direction of the loading and unloading working surface after the correction, and adjusts the position of the image capture component 61 to correctly correspond to the assembly carrier portion 501 to be assembled and its clamp 502, so as to correct the position of the imaging surface of the image capture component 61, and the control module stores the information of the imaging surface after the correction, and the control module uses the information of the imaging surface after the correction to further correct the image capture. Correct the relative position of the loading and unloading operation surface so that the loading and unloading operation surface can accurately correspond to the position of the assembly carrier 501 to be assembled and its clamp 502; it has the following steps in sequence: "The robotic arm drives the image capture component to approach the carrier at the same inclination angle as the corrected loading and unloading operation surface, and obtains the position image of the assembly carrier and each clamp to be assembled" S61 step, "The control module adjusts the position of the image capture component so that it correctly corresponds to the assembly carrier to be assembled, thereby correcting the position of its imaging surface, and using the information of the corrected imaging surface to correct the loading and unloading operation surface so that it is positive and accurately corresponds to the assembly carrier to be assembled" S62 step.

[0110] The "loading and unloading mechanism moves and locks the assembly onto the assembly carrying portion to be assembled" P7 program is driven by the control module to drive the loading and unloading mechanism 62 on the robot arm 6 to move and lock the assembly 20a onto the assembly carrying portion 501 to be assembled; it sequentially includes: "The loading and unloading mechanism unlocks each clamp" S71 step, "The loading and unloading mechanism moves the assembly onto the assembly carrying portion to be assembled" S72 step, "The loading and unloading mechanism locks each clamp to fix the assembly" S73 step, and "The loading and unloading mechanism disengages from the assembly, and the carrier rotates" S74 step.

[0111] The following is combined Figures 5 to 33 , respectively describe the above steps and form a practical and feasible application embodiment:

[0112] First, in the step S11 of "moving the carrier to the working position on the second displacement mechanism", the control module first drives the second displacement mechanism 5 to move the second base 52 to the end of each second guide rail 51 away from the first displacement mechanism 1, so as to place an empty carrier 50 on the second base 52 (such as Figure 5 Then the second base 52 carries the carrier 50 along each second guide rail 51 to a preset operating position close to the first displacement mechanism 1 (such as Figure 6 shown).

[0113] The step S12 of "placing the wafer cassette for accommodating wafers on the wafer loading mechanism; placing the wafer ring and the cover on the wafer ring loading mechanism and the cover loading mechanism respectively" is to stack a plurality of wafer rings 2a on the wafer ring feeding seat 21 of the wafer ring loading mechanism 2 (i.e., the feeding position of the wafer ring 2a), and place a plurality of wafer cassettes 30a containing wafers 3a spaced apart therein on the wafer feeding seat 31 of the wafer loading mechanism 3 (i.e., the feeding position of the wafer 3a), and stack a plurality of covers 4a on the cover feeding seat 41 of the cover loading mechanism 4 (i.e., the feeding position of the cover 4a); then the first base 12 can be moved to a position close to the side of each first guide rail 11 of the wafer ring loading mechanism 2 as needed (e.g., Figure 5 shown).

[0114] The step S13 of "the wafer loading mechanism drives the wafer cassette to pivot so that its opening faces the first displacement mechanism" is to make the wafer feeder 31 rotate the opening of each wafer cassette 30a to the side facing the first displacement mechanism 1 (such as Figure 6 shown).

[0115] In the step S21 of "the wafer ring loading mechanism moves and positions a wafer ring in the first displacement mechanism", the control module drives the wafer ring loading mechanism 2, so that the clamping assembly 233 of the wafer ring displacement assembly 23 clamps a wafer ring 2a on the wafer ring feeding seat 21, and moves the wafer ring 2a into the wafer pre-treatment portion 121 of the first seat body 12 (such as Figure 7 、 Figure 8 、 Figure 9 Then, the clamping assembly 233 is separated from the wafer ring 2a, so that the wafer ring 2a can be used to rest on the edge of the wafer pre-treatment portion 121 using the outer ring flange 21a (as shown); Figure 10 As shown) to form positioning.

[0116] In actual application, the wafer ring lifting assembly 22 can cooperate to drive the wafer ring feeding base 21 to move up and down, so that the wafer ring displacement assembly 23 can more easily clamp the wafer ring 2a at an appropriate position.

[0117] In the step S31 of "the wafer loading mechanism carries a wafer and guides the wafer level during the transfer process", the control module drives the wafer loading mechanism 3 to move the wafer transfer slide 332 of the wafer transfer assembly 33, and the telescopic assembly 333 is extended to allow the wafer holder 34 to extend into a wafer cassette 30a to support a wafer 3a (such as Figure 11 As shown), the wafer 3a is then moved out of the wafer cassette 30a (as shown Figure 12 As shown) and approach the nozzle 35, the nozzle 351 of the nozzle 35 is used to spray air to blow on the wafer 3a (as shown Figure 13 、 Figure 14 As shown), the wafer 3a can be leveled, and then each exhaust hole 341 is exhausted, so that the wafer 3a can be stably positioned in the correct position on the wafer holder 34 and avoid warping.

[0118] In actual application, the wafer lifting assembly 32 can cooperate to drive the wafer feeder 31 to move up and down, so that the wafer holder 34 can more easily support the wafer 3 a in the wafer cassette 30 a at an appropriate position.

[0119] In the step S32 of "the wafer loading mechanism moves the wafer onto the first displacement mechanism and guides the wafer", the control module drives the wafer loading mechanism 3 so that the wafer displacement assembly 33 drives the wafer holder 34 to move the wafer 3a to the upper portion of the wafer pre-treatment portion 121 of the first base 12 (such as Figure 15 As shown), the image of the wafer 3a is obtained by the imaging unit 16 to check whether the position of the wafer 3a is correct. In addition, the two jacket slides 15 with backlight surfaces can be fitted together to combine the two concave arc portions 151 into a circular hole corresponding to the wafer pre-treatment portion 121 (as shown). Figure 16 As shown), the wafer shifting assembly 33 drives the wafer holder 34 to correct the position so that the wafer 3a is guided and located at a position corresponding to the center of the concave arc portion 151 of the second sleeve slide 15 (ie, the center of the wafer ring 2a).

[0120] In the step S33 of "the first displacement mechanism moves the wafer into the wafer ring", the two jacket slides 15 are separated, and the support base lifting assembly 133 drives the support base 13 to rise, and at the same time, the suction holes 132 are evacuated, so that the wafer 3a can be adsorbed on the support base 13. At this time, the suction holes 341 of the wafer holder 34 stop evacuating air, and the wafer holder 34 is separated from the bottom surface of the wafer 3a in the groove 131 (such as Figure 17 Then the telescopic component 333 is retracted, so that the wafer holder 34 is moved out of the first base 12 (as shown); Figure 18 and then the support base lifting assembly 133 drives the support base 13 down, so that the wafer 3a moves down on the inner ring flange 22a of the inner periphery of the wafer ring 2a (as Figure 19 As shown), the wafer 3a remains adsorbed by the support base 13.

[0121] In the step S41 of "the cover loading mechanism moves a cover into the wafer ring and stacks it on the wafer to form an assembly", the first base 12 can be moved along the first guide rail 11 to a position close to the side of the cover loading mechanism 4 (such as Figure 20 and then the control module drives the cover loading mechanism 4, so that the cover displacement assembly 43 of the clamping jaw group 433 clamps the cover feed seat 41 on a cover 4a of the annular convex portion 41a (such as Figure 21 、 Figure 22 As shown), and with the lifting and lowering of the cover displacement slide 432 and the horizontal sliding of the cover displacement guide rail 431, the cover 4a can be moved into the wafer pre-treatment portion 121 and superimposed on the wafer 3a (as shown Figure 23 、 Figure 24 Then, the jaw group 433 loosens the annular protrusion 41a (as shown); Figure 25 As shown), the stacked wafer ring 2a, wafer 3a, and cover 4a form an assembly 20a (as shown Figure 26 shown).

[0122] In actual application, the cover lifting assembly 42 can cooperate to drive the cover feeding seat 41 to rise and fall, so that the cover displacement assembly 43 can more easily clamp the cover 4a at an appropriate position.

[0123] In the step S51 of "the robot arm drives the loading and unloading mechanism to approach the carrier at a preset loading and unloading reference value, and uses the distance measuring element to measure the distance to the edge of the assembly support portion to be assembled" the control module drives the loading and unloading mechanism 62 on the robot arm 6 to move to a position to be assembled on the carrier 50 in the direction and angle of the preset loading and unloading reference value; and uses each distance measuring element 621 to detect the distance to the peripheral side of the assembly support portion 501 to be assembled at the position to be assembled (such as Figure 27 shown).

[0124] In a feasible embodiment, the distance measuring element 621 is a laser light source, which can project a laser beam 6211 onto the periphery of the assembly supporting portion 501 to be assembled, so as to detect the distance.

[0125] In step S52 of "the control module adjusts the position of the loading and unloading mechanism so that the measured distances of each distance measuring element are equal, thereby correcting the tilt angle of its loading and unloading working surface", the control module drives the loading and unloading mechanism 62 on the robot arm 6 to adjust its position according to the difference in the distance detected by each distance measuring element 621 (i.e., the projection length of the laser beam 6211), so that the distance (laser beam 6211) detected by each distance measuring element 621 (laser light source) on the circumference of the assembly support portion 501 to be assembled is equal, thereby correcting the tilt angle of the loading and unloading working surface of the loading and unloading mechanism 62 and ensuring that the surface on the bottom side of the loading and unloading mechanism 62 (i.e., the loading and unloading working surface) is parallel to the assembly support portion 501 to be assembled; and the control module can store information about the loading and unloading working surface after correction.

[0126] In the step S61 of "the robot arm drives the image capturing component to approach the carrier at the same inclination angle as the corrected loading and unloading operation surface, and obtains the position image of the assembly carrier portion to be assembled and each clamp", the control module drives the image capturing component 61 on the robot arm 6 to move to the top of the assembly carrier portion 501 to be assembled at the same inclination angle and direction as the corrected loading and unloading operation surface, and uses the imaging component 611 to obtain the image of the periphery of the assembly carrier portion 501 to be assembled (such as Figure 28 As shown), the positions of the assembly carrying portion 501 and each clamp 502 to be assembled are confirmed.

[0127] In the step S62 of "the control module adjusts the position of the image capturing component so that it correctly corresponds to the support portion of the assembly to be assembled, thereby correcting the position of its imaging surface, and using the information of the corrected imaging surface to correct the loading and unloading operation surface so that it is positive and accurately corresponding to the support portion of the assembly to be assembled", the control module drives the image capturing component 61 on the robot 6 to adjust its position according to the image position difference of the support portion 501 to be assembled, thereby correcting the imaging surface of the image capturing component 61 and ensuring that the image capturing component 61 correctly corresponds to the support portion 501 to be assembled and each clamp 502; and the control module can store the information of the corrected imaging surface (such as Figure 28 shown).

[0128] In a feasible embodiment, each fixture 502 is provided with a positioning mark (not shown, it can be a cross scale or other marking structure) at a preset position on the side surface, and a corresponding relative mark (not shown, it can be a cross scale or other marking structure) can be set on the lens of the imaging component 611 of the image capturing component 61; when the image capturing component 61 is adjusted to make the relative mark coincide with the positioning mark, the effect of correcting the position of the imaging surface of the image capturing component 61 can be achieved.

[0129] Since the image capture component 61 takes images at the same inclination angle and direction as the corrected loading and unloading operation surface, after correcting the position of the imaging surface, the control module can use the position of the corrected imaging surface to calculate and store the position information of the loading and unloading mechanism 62 that needs to be corrected again, so that the control module can directly and quickly drive the loading and unloading mechanism 62 to move to a position that is correctly corresponding to the assembly support part 501 to be assembled via the robotic arm 6 again.

[0130] In the step of "unlocking each clamp by the loading and unloading mechanism" S71, the control module first drives the loading and unloading mechanism 62 on the robot arm 6 to move above the assembly supporting portion 501 to be assembled, and then uses each clamp operating component 623 to release each clamp 502 (such as Figure 29 shown).

[0131] In the step S72 of "the loading and unloading mechanism moves the assembly to be assembled onto the assembly supporting portion", the control module drives the loading and unloading mechanism 62 on the robot arm 6 to move to the wafer pre-treatment portion 121 of the first base 12, and uses the clamping component 622 to clamp the assembly 20a (at this time, the suction holes 132 stop suctioning, and the support base 13 releases the adsorption state of the wafer 3a, as shown in FIG. Figure 30 As shown), the assembly 20a is then moved onto the assembly support portion 501 to be assembled (as shown Figure 31 、 Figure 32 shown).

[0132] In the step S73 of "the loading and unloading mechanism locks each clamp to fix the assembly", the control module drives each clamp operating assembly 623 to lock each clamp 502 so that the assembly 20a can be fixed on the assembly supporting portion 501 to be assembled (such as Figure 32 shown).

[0133] In the step S74 of "the loading and unloading mechanism is separated from the assembly, and the carrier plate is rotated", after each clamping assembly 622 releases the assembly 20a, the control module drives the pivot assembly 53 to drive the carrier plate 50 to pivot, so that the assembly supporting portion 501 that has fixed the assembly 20a is pivoted to a side position, and the other vacant assembly supporting portion 501 on the side is moved to the original assembly position to be assembled to form another assembly supporting portion 501 to be assembled (such as Figure 33 As shown), the above steps are repeated to fix each assembly 20a on each assembly supporting portion 501 to be assembled on the carrier 50.

[0134] In summary, the pre-treated wafer carrier loading device and method of the present invention can achieve the effect of using simple mechanism and operation to respectively combine the wafer ring, wafer, and cover, and accurately move and fix them to different positions on a carrier.

Claims

1. A pre-treated wafer carrier loading device, characterized in that: include: a first displacement mechanism connected to and driven by a control module, the first displacement mechanism comprising a first base body capable of reciprocating movement, and a wafer pre-treatment portion being provided on the first base body; A wafer ring loading mechanism is provided adjacent to the first displacement mechanism and is connected to and driven by the control module. The wafer ring loading mechanism includes a wafer ring feeder that supports a wafer ring. A wafer ring displacement assembly is provided adjacent to the wafer ring feeder. The wafer ring displacement assembly is capable of carrying and releasing the wafer ring and moving the wafer ring between the wafer ring feeder and the wafer pre-treatment portion of the first base body. A wafer loading mechanism disposed adjacent to the first displacement mechanism, connected to and driven by the control module, comprises a wafer feeder for supporting wafers, and a wafer transfer assembly disposed adjacent to the wafer feeder. The wafer transfer assembly comprises a wafer carrier, and the wafer carrier is driven by the wafer transfer assembly to carry the wafer between the wafer feeder and the wafer pre-treatment portion of the first base body; A cover loading mechanism disposed adjacent to the first displacement mechanism, connected to and driven by the control module, comprises a cover feeding base for supporting a cover, and a cover displacement assembly disposed adjacent to the cover feeding base. The cover displacement assembly is capable of carrying and releasing the cover and moves between the cover feeding base and the wafer pre-treatment portion of the first base body; A carrier plate having at least one assembly-carrying portion on its surface and a plurality of clamps disposed around each assembly-carrying portion; A mechanical arm is connected to and driven by the control module. The mechanical arm has a movable end that can move between the first base and the carrier. At least one loading and unloading mechanism is provided on the movable end.

2. The pre-treated wafer carrier loading device according to claim 1, wherein: The movable end of the robotic arm is also provided with an image capture component capable of obtaining images; the loading and unloading mechanism is respectively provided with a clamping component capable of opening and closing relative to clamp the assembly, a plurality of clamp operating components corresponding to and unlocking each clamp, and a plurality of distance measuring elements capable of measuring distance.

3. The pre-treated wafer carrier loading device according to claim 2, wherein: The plurality of distance measuring elements are laser light sources capable of generating distance measuring laser beams, and are respectively arranged at at least three points around the loading and unloading mechanism.

4. The pre-treated wafer carrier loading device according to claim 2, wherein: A second displacement mechanism connected to and driven by the control module is provided beside the first displacement mechanism. The second displacement mechanism has a second base body capable of reciprocating displacement. A pivot assembly capable of supporting the carrier is provided on the second base body.

5. The pre-treated wafer carrier loading device according to claim 1, wherein: The wafer pre-treatment portion is a hollow hole, in which a supporting seat is provided. A groove is recessed on the top surface of the supporting seat, and a plurality of air suction holes are provided on both sides of the groove for sucking air. A supporting seat lifting assembly is provided at the bottom of the supporting seat, which can drive the supporting seat to move up and down.

6. The pre-treated wafer carrier loading device according to claim 2, wherein: The wafer pre-treatment portion is a hollow hole, in which a supporting seat is provided. A groove is recessed on the top surface of the supporting seat, and a plurality of air suction holes are provided on both sides of the groove for sucking air. A supporting seat lifting assembly is provided at the bottom of the supporting seat, which can drive the supporting seat to move up and down.

7. The pre-treated wafer carrier loading device according to claim 1, wherein: The first base is arranged on a plurality of first guide rails extending in parallel. The top surface of the first base is provided with a plurality of jacket slides that can be relatively moved back and forth on the periphery of the wafer pre-treatment part. The top side of each jacket slide has a backlight surface, and a concave arc portion is provided on the side of each jacket slide facing the wafer pre-treatment part; and an imaging unit capable of capturing images is provided above and beside the first guide rail.

8. The pre-treated wafer carrier loading device according to claim 2, wherein: The first base is arranged on a plurality of first guide rails extending in parallel. The top surface of the first base is provided with a plurality of jacket slides that can move back and forth relative to each other on the periphery of the wafer pre-treatment portion. The top side of each jacket slide has a backlight surface, and a concave arc portion is provided on the side of each jacket slide facing the wafer pre-treatment portion; and an imaging unit that can capture images is provided above and beside the first guide rail.

9. The pre-treated wafer carrier loading device according to claim 6, wherein: The first base is arranged on a plurality of first guide rails extending in parallel. The top surface of the first base is provided with a plurality of jacket slides that can be relatively moved back and forth on the periphery of the wafer pre-treatment part. The top side of each jacket slide has a backlight surface, and a concave arc portion is provided on the side of each jacket slide facing the wafer pre-treatment part; and an imaging unit capable of capturing images is provided above and beside the first guide rail.

10. The pre-treated wafer carrier loading device according to claim 7, wherein: A nozzle is arranged above the wafer feeding seat. The nozzle has nozzle holes capable of spraying air downwards. The top surface of the wafer bracket is provided with a plurality of exhaust holes capable of sucking air.

11. The pre-treated wafer carrier loading device according to claim 8, wherein: A nozzle is arranged above the wafer feeding seat. The nozzle has nozzle holes capable of spraying air downwards. The top surface of the wafer bracket is provided with a plurality of exhaust holes capable of sucking air.

12. The pre-treated wafer carrier loading device according to claim 9, wherein: A nozzle is arranged above the wafer feeding seat. The nozzle has nozzle holes capable of spraying air downwards. The top surface of the wafer bracket is provided with a plurality of exhaust holes capable of sucking air.

13. The pre-treated wafer carrier loading device according to claim 7, 8 or 9, wherein: A wafer ring lifting assembly is provided below the wafer ring feeding seat, and the wafer ring lifting assembly can drive the wafer ring feeding seat to perform lifting and lowering movements. The wafer ring displacement assembly has a wafer ring displacement slide that can be lifted and lowered, and a wafer ring displacement guide rail that can be reset and moved toward the wafer ring displacement slide is provided on the wafer ring displacement slide, and a clamping assembly that can clamp the wafer ring is provided on the wafer ring displacement guide rail; a wafer lifting assembly is provided below the wafer feeding seat, and the wafer lifting assembly can drive the wafer feeding seat to perform lifting and lowering movements. The wafer displacement assembly has a plurality of wafer displacement rails parallel to the first guide rail. The cover is provided with a guide rail, and a wafer transfer slide which is arranged on each wafer transfer rail and can be moved back and forth, a telescopic component which can be lifted and lowered vertically is provided on the wafer transfer slide, and the wafer holder is provided at the movable end of the telescopic component; a cover lifting component is provided under the cover feeding seat, and the cover lifting component can drive the cover feeding seat to perform lifting and lowering movements, the cover transfer component has a cover transfer slide which can be lifted and lowered, a cover transfer guide rail which can be moved back and forth laterally is provided on the cover transfer slide, and a clamping claw group which can clamp the cover is provided on the cover transfer guide rail.

14. The pre-treated wafer carrier loading device according to claim 1, 2 or 3, wherein: The outer periphery of the wafer ring is provided with an outer ring flange, and the inner periphery of the wafer ring is provided with an inner ring flange; a ring convex portion is provided in the center of the cover; and a wafer box capable of accommodating wafers at intervals is provided on the wafer feeding seat.

15. A method for placing a pre-treated wafer carrier, using the pre-treated wafer carrier placing device according to claim 1, characterized in that: include: A "carrier, wafer ring, wafers, and cover are positioned" procedure involves placing an empty carrier at a predetermined assembly position and placing each wafer ring, wafer, and cover at a predetermined feed position. a "wafer ring loading mechanism moves a wafer ring into the first displacement mechanism" process, wherein the wafer ring loading mechanism moves a wafer ring from the feed position and supports it in the wafer pre-treatment portion of the first base; a "wafer loading mechanism moves a wafer into the wafer ring" process, wherein the wafer loading mechanism moves a wafer onto the first displacement mechanism for alignment, and then places the wafer into the wafer ring; a process in which a cover is placed by the cover loading mechanism overlying a wafer in the wafer ring to form an assembly, wherein the cover loading mechanism moves a cover into the wafer ring and overlying the cover on the wafer, thereby overlying the wafer ring, wafer, and cover to form an assembly; In a "loading and unloading mechanism moves and locks the assembly onto the assembly carrier to be assembled" process, the control module drives the loading and unloading mechanism on the robot arm to move the assembly from the first base and lock it onto the assembly carrier to be assembled.

16. A method for placing a pre-treated wafer carrier, using the pre-treated wafer carrier placing device according to claim 4, characterized in that: include: A "carrier, wafer ring, wafers, and cover are positioned" procedure involves placing an empty carrier at a predetermined assembly position and placing each wafer ring, wafer, and cover at a predetermined feed position. a "wafer ring loading mechanism moves a wafer ring into the first displacement mechanism" process, wherein the wafer ring loading mechanism moves a wafer ring from the feed position and supports it in the wafer pre-treatment portion of the first base; a "wafer loading mechanism moves a wafer into the wafer ring" process, wherein the wafer loading mechanism moves a wafer onto the first displacement mechanism for alignment, and then places the wafer into the wafer ring; a process in which a cover is placed by the cover loading mechanism overlying a wafer in the wafer ring to form an assembly, wherein the cover loading mechanism moves a cover into the wafer ring and overlying the cover on the wafer, thereby overlying the wafer ring, wafer, and cover to form an assembly; a "Loading and Unloading Mechanism Calibration Loading and Unloading Working Surface" procedure, in which the control module drives the loading and unloading mechanism on the robot arm to adjust its position so that each distance measuring element measures equal distances around a portion of a component to be assembled at a position on the carrier. The loading and unloading mechanism aligns a predetermined loading and unloading working surface with the component to be assembled, and the tilt angle of the loading and unloading working surface is calibrated. The control module stores information about the calibrated loading and unloading working surface. a "image capture component inspecting the image of the periphery of the support portion of the assembly to be assembled on the carrier and correcting the imaging plane" procedure, wherein the control module drives the image capture component on the robot arm to inspect the image of the periphery of the support portion of the assembly to be assembled and each fixture according to the inclination angle and direction of the corrected loading and unloading operation surface, and adjusts the image capture component to a position where a preset imaging plane correctly corresponds to the support portion of the assembly to be assembled and each fixture, thereby correcting the position of the imaging plane of the image capture component, and the control module stores information on the corrected imaging plane. At the same time, the control module uses the information on the corrected imaging plane to further correct the relative position of the loading and unloading operation surface so that the loading and unloading operation surface can accurately correspond to the position of the support portion of the assembly to be assembled and each fixture; In a "loading and unloading mechanism moves and locks the assembly onto the assembly support portion to be assembled" process, the control module drives the loading and unloading mechanism on the robot arm to move the assembly from the first base and lock it onto the assembly support portion to be assembled.

17. The method for placing a pre-treated wafer carrier according to claim 16, wherein: The process of "the loading and unloading mechanism moves the assembly and locks it on the assembly support portion to be assembled" has the following features: A "loading and unloading mechanism unlocks each clamp" step, wherein the control module first drives the loading and unloading mechanism on the robot arm to move above the assembly support portion to be assembled, and each clamp operating assembly is used to release each clamp; a step of "a loading and unloading mechanism moving the assembly onto the assembly support portion to be assembled", wherein the control module drives the loading and unloading mechanism on the robot arm to move above the wafer pre-treatment portion of the first base, clamps the assembly using the clamping assembly, and then moves the assembly onto the assembly support portion to be assembled; In a step of "locking each clamp by the loading and unloading mechanism to fix the assembly", each clamp operating assembly locks each clamp so that the assembly can be fixed on the assembly supporting portion to be assembled.

18. The method for placing a pre-treated wafer carrier according to claim 17, wherein: After the step of "the loading and unloading mechanism locks each clamp to fix the assembly", there is also a step of "the loading and unloading mechanism disengages the assembly and the carrier rotates". After each clamping component loosens the assembly, the control module drives the pivoting component to drive the carrier to pivot, so that the assembly supporting part that has fixed the assembly pivots to a side position, and the vacant assembly supporting part on the other side is moved to the original position to be assembled to form another assembly supporting part to be assembled.

19. The method for placing a pre-treated wafer carrier according to claim 16, wherein: The "Loading and unloading mechanism calibration loading and unloading working surface" procedure has the following features: a step of "the robotic arm drives the loading and unloading mechanism to approach the carrier at a preset loading and unloading reference value, and uses distance measuring devices to measure the distance to the edge of the supporting portion of the assembly to be assembled" wherein the control module drives the loading and unloading mechanism on the robotic arm to move above the carrier at a direction and angle corresponding to the preset loading and unloading reference value; and uses the distance measuring devices to detect the distance to the periphery of the supporting portion of the assembly to be assembled; a step of "controlling the loading and unloading mechanism to adjust the position so that the distances measured by each distance measuring element are equal, thereby correcting the tilt angle of the loading and unloading working surface thereof," wherein the control module drives the loading and unloading mechanism on the robot arm to adjust the position so that the distances detected by each distance measuring element to the periphery of the assembly support portion to be assembled are equal, thereby ensuring that the loading and unloading working surface of the loading and unloading mechanism is aligned and parallel to the assembly support portion to be assembled, thereby correcting the tilt angle of the loading and unloading working surface of the loading and unloading mechanism; and the control module stores information about the corrected loading and unloading working surface; The process of "the image capturing component inspecting the image of the periphery of the supporting portion of the assembly to be assembled on the carrier and correcting the imaging surface" has the following features: a step of "the robotic arm drives the image capture component to approach the carrier at an angle equal to the calibrated loading and unloading working surface, and obtains position images of the assembly support portion to be assembled and each fixture." The control module drives the image capture component on the robotic arm to move above the assembly support portion to be assembled at a direction and angle equal to the calibrated loading and unloading working surface, and uses the image capture component to obtain images of the periphery of the assembly support portion to be assembled, thereby confirming the position of the assembly support portion to be assembled and each fixture; A step of "the control module adjusts the position of the image capture component so that it correctly corresponds to the support portion of the assembly to be assembled, thereby correcting the position of its imaging surface, and using the information of the corrected imaging surface to correct the loading and unloading operation surface so that it is positively and accurately corresponding to the support portion of the assembly to be assembled" is carried out. The control module drives the image capture component on the robot arm to adjust its position so that the image capture component remains correctly corresponding to the support portion of the assembly to be assembled and each clamp, thereby correcting the position of the imaging surface of the image capture component; and the control module stores the information of the corrected imaging surface and can calculate the corrected position information of the loading and unloading mechanism, so as to facilitate the robot arm to drive the loading and unloading mechanism to move to a position that is positively, accurately and flush with the support portion of the assembly to be assembled.

20. A method for placing a pre-treated wafer carrier, using the pre-treated wafer carrier placing device according to claim 9, characterized in that: include: A "carrier, wafer ring, wafers, and cover are positioned" procedure involves placing an empty carrier at a predetermined assembly position and placing each wafer ring, wafer, and cover at a predetermined feed position. a "wafer ring loading mechanism moves a wafer ring into the first displacement mechanism" process, wherein the wafer ring loading mechanism moves a wafer ring from the feed position and supports it in the wafer pre-treatment portion of the first base; a "wafer loading mechanism moves a wafer into the wafer ring" process, wherein the wafer loading mechanism moves a wafer onto the first displacement mechanism for alignment, and then places the wafer into the wafer ring; a process in which a cover is placed by the cover loading mechanism overlying a wafer in the wafer ring to form an assembly, wherein the cover loading mechanism moves a cover into the wafer ring and overlying the cover on the wafer, thereby overlying the wafer ring, wafer, and cover to form an assembly; a "Loading and Unloading Mechanism Calibration Loading and Unloading Operating Surface" procedure, in which the control module drives the loading and unloading mechanism on the robot arm to adjust its position so that each distance measuring element measures equal distances around a portion of a component to be assembled at a position on the carrier. The loading and unloading mechanism aligns a predetermined loading and unloading operating surface with the component to be assembled, and the loading and unloading operating surface is calibrated. The control module stores information about the calibrated loading and unloading operating surface. a "image capture component inspecting the image of the periphery of the support portion of the assembly to be assembled on the carrier and correcting the imaging plane" procedure, wherein the control module drives the image capture component on the robot arm to inspect the image of the periphery of the support portion of the assembly to be assembled and each fixture according to the inclination angle and direction of the corrected loading and unloading operation surface, and adjusts the image capture component to a position where a preset imaging plane correctly corresponds to the support portion of the assembly to be assembled and each fixture, thereby correcting the position of the imaging plane of the image capture component, and the control module stores information on the corrected imaging plane. At the same time, the control module uses the information on the corrected imaging plane to further correct the relative position of the loading and unloading operation surface so that the loading and unloading operation surface can accurately correspond to the position of the support portion of the assembly to be assembled and each fixture; In a "loading and unloading mechanism moves and locks the assembly onto the assembly support portion to be assembled" process, the control module drives the loading and unloading mechanism on the robot arm to move the assembly from the first base and lock it onto the assembly support portion to be assembled.

21. The method for placing a pre-treated wafer carrier according to claim 20, wherein: The process of "the wafer loading mechanism moves a wafer into the wafer ring" comprises: a step of "the wafer loading mechanism moves the wafer onto the first displacement mechanism and aligns the wafer," wherein the wafer carrier moves the wafer to above the wafer pre-treatment portion of the first base body, and the imaging unit captures an image of the wafer to check whether the wafer is positioned correctly. Furthermore, the two jacket slides with backlight surfaces are brought into contact with each other, so that the two concave arc portions combine to form a circular hole corresponding to the wafer pre-treatment portion. The control module then drives the wafer carrier to correct its position via the wafer displacement assembly, thereby aligning the wafer to a position correctly corresponding to the center of the wafer ring; The first step of "the first displacement mechanism moves the wafer into the wafer ring" is to separate the two jacket slides, and then the support base lifting assembly drives the support base to rise, so that the wafer holder is separated from the wafer in the groove; then the wafer displacement assembly drives the wafer holder to move out from above the first base body; and then the support base lifting assembly drives the support base to descend, so that the wafer moves down into the wafer ring.

22. A method for placing a pre-treated wafer carrier, using the pre-treated wafer carrier placing device according to claim 12, characterized in that: include: A "carrier, wafer ring, wafers, and cover are positioned" process involves placing an empty carrier at a predetermined assembly position and placing each wafer ring, wafer, and cover at a feed position. a "wafer ring loading mechanism moves a wafer ring into the first displacement mechanism" process, wherein the wafer ring loading mechanism moves a wafer ring from the feed position and supports it in the wafer pre-treatment portion of the first base; a "wafer loading mechanism moves a wafer into the wafer ring" process, wherein the wafer loading mechanism moves a wafer onto the first displacement mechanism for alignment, and then places the wafer into the wafer ring; a process in which a cover is placed by the cover loading mechanism overlying a wafer in the wafer ring to form an assembly, wherein the cover loading mechanism moves a cover into the wafer ring and overlying the cover on the wafer, thereby overlying the wafer ring, wafer, and cover to form an assembly; a "Loading and Unloading Mechanism Calibration Loading and Unloading Operating Surface" program, in which the control module drives the robotic arm to adjust the position of the loading and unloading mechanism so that each distance measuring element measures the same distance around the support portion of the assembly to be assembled at a position on the carrier to be assembled. This allows the loading and unloading mechanism to be aligned with the support portion of the assembly to be assembled, thereby calibrating the loading and unloading operating surface of the loading and unloading mechanism. The control module then stores information about the loading and unloading operating surface. a "image capture component inspecting the image of the periphery of the support portion of the assembly to be assembled on the carrier and correcting the imaging plane" procedure, wherein the control module drives the image capture component on the robot arm to inspect the image of the periphery of the support portion of the assembly to be assembled and each fixture according to the inclination angle and direction of the corrected loading and unloading operation surface, and adjusts the image capture component to a position where a preset imaging plane correctly corresponds to the support portion of the assembly to be assembled and each fixture, thereby correcting the position of the imaging plane of the image capture component, and the control module stores information on the corrected imaging plane. At the same time, the control module uses the information on the corrected imaging plane to further correct the relative position of the loading and unloading operation surface so that the loading and unloading operation surface can accurately correspond to the position of the support portion of the assembly to be assembled and each fixture; A "loading and unloading mechanism moves and locks the assembly onto the assembly support portion to be assembled" process, wherein the control module drives the loading and unloading mechanism on the robot arm to move the assembly from the first base and lock it onto the assembly support portion to be assembled.

23. The method for placing a pre-treated wafer carrier according to claim 22, wherein: The process of "the wafer loading mechanism moves a wafer into the wafer ring" comprises: a step of "the wafer loading mechanism carries a wafer and levels the wafer during the transfer process" in which the control module drives the wafer transfer assembly to drive the wafer carrier to support a wafer from the wafer feeder, bring the wafer close to the air jet head, and use the air jet holes of the air jet head to blow air onto the wafer to level the wafer and keep it stably in the correct position on the wafer carrier; a step of "the wafer loading mechanism moves the wafer onto the first displacement mechanism and aligns the wafer," wherein the wafer carrier moves the wafer above the wafer pre-treatment portion of the first base body, and the imaging unit captures an image of the wafer to check whether the wafer is positioned correctly. The two jacket slides with backlit surfaces engage with each other, so that the two concave arc portions combine to form a circular hole corresponding to the wafer pre-treatment portion. The control module then drives the wafer carrier to correct its position via the wafer displacement assembly, so that the wafer is aligned to a position correctly corresponding to the center of the wafer ring; The first step of "the first displacement mechanism moves the wafer into the wafer ring" is to separate the two jacket slides, and then the support base lifting assembly drives the support base to rise, so that the wafer holder is separated from the wafer in the groove; then the wafer displacement assembly drives the wafer holder to move out from above the first base body; and then the support base lifting assembly drives the support base to descend, so that the wafer moves down into the wafer ring.

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