LED chip electroluminescence high-speed detection system

Abstract

The application provides an LED chip electroluminescence high-speed detection system, and a core component is a caterpillar-shaped conductive module; the caterpillar-shaped conductive module is composed of two identical toothed ring cylindrical driving wheels and a flexible conductive chain ring which is equal in width to the height of the driving wheels and can be engaged with the driving wheels; the caterpillar-shaped conductive module is horizontally arranged on the surface of an LED chip array to be detected; the cylindrical shaft of the driving wheel of the caterpillar-shaped conductive module is parallel to the LED chip array to be detected, so that the caterpillar-shaped conductive module and the LED chip array to be detected are in contact with the maximum contact area; in the detection process, the flexible conductive chain ring of the caterpillar-shaped conductive module can be in large-area contact with the LED chip array to be detected, so that multiple LED chips generate electroluminescence phenomenon; and frequent movement in the vertical direction is not needed, so that the detection efficiency can be effectively improved.

Description

Technical Field

[0001] This invention belongs to the field of LED chip testing technology, and in particular to a high-speed detection system for electroluminescence of LED chips, especially a high-speed detection method and system for electroluminescence of Micro-LED chips. Background Technology

[0002] With the continuous development and maturation of LED technology, the efficiency and brightness of LEDs are constantly improving, leading to an increasingly wider range of applications. When LEDs are used in array displays, screen components, and even semiconductor lighting, the human eye's sensitivity to color wavelengths and brightness means that unsorted LEDs can produce unevenness, affecting visual perception. Both wavelength and brightness inconsistencies create discomfort, something LED display manufacturers want to avoid and that is unacceptable to consumers. Therefore, LEDs must be tested before being used in display devices. Current testing methods mostly involve probe testing, or contact testing. However, probe testing requires contact with the LED electrodes, which can damage them. As LED chip sizes shrink, the number of LED chips required for a single display increases, and probe testing cannot meet the efficiency requirements for large-scale LED chip testing. For example, an 8K TV requires approximately 90 million Micro-LED chips; even with a defect rate of 0.5%, testing nearly 500,000 chips would require a significant amount of time. To improve the efficiency of probe testing, sampling inspection is often the only option. However, for such a large number of LED chips, the reliability of sampling inspection is often unsatisfactory. Therefore, improving existing LED testing technologies is essential. Summary of the Invention

[0003] To address the shortcomings and deficiencies of existing technologies, particularly the low detection efficiency of LED chips, especially highly integrated Micro-LED chips, this invention proposes a high-speed detection system for LED chip electroluminescence. Its core component is a track-shaped conductive module, which consists of two identical toothed cylindrical drive wheels and a flexible conductive chain link with a width equal to the height of the drive wheels that meshes with them. The track-shaped conductive module is placed flat on the surface of the LED chip array under test, with the cylindrical shaft of the drive wheels parallel to the array, maximizing the contact area between the track-shaped conductive module and the LED chip array. During detection, the flexible conductive chain link of the track-shaped conductive module can make large-area contact with the LED chip array, causing multiple LED chips to produce electroluminescence. This eliminates the need for frequent vertical movement, effectively improving detection efficiency.

[0004] The present invention specifically adopts the following technical solution:

[0005] A high-speed detection system for electroluminescence of LED chips, characterized in that: a power supply module is provided and a voltage is applied between the LED chip array under test and the first conductive layer through a track-shaped conductive module;

[0006] The track-shaped conductive module consists of multiple toothed cylindrical drive wheels and a flexible conductive chain that meshes with the drive wheels.

[0007] During the testing process, the track-shaped conductive module is placed flat on the surface of the LED chip array under test, and the cylindrical shaft of the drive wheel is parallel to the LED chip array under test, so that the track-shaped conductive module and the LED chip array under test make contact with the LED chip array under test with the maximum contact area; when the flexible conductive chain ring makes contact with the LED chip array under test with the maximum contact area, multiple LED chips simultaneously produce electroluminescence; without the need for frequent vertical movement, the testing efficiency can be effectively improved.

[0008] The system includes: a first substrate, a first conductive layer disposed on the first substrate, a track-shaped conductive module, an electrically controlled displacement module, an optical signal measurement module, an electrical signal measurement module, and a power supply module;

[0009] The first substrate is used to place the LED chip array under test;

[0010] The electrically controlled displacement module is used to drive the track-shaped conductive module to move;

[0011] The optical signal measurement module is used to collect optical information, including brightness and luminous flux, of the LED chip under test;

[0012] The electrical signal measurement module is used to collect electrical information, including current and voltage, from the LED chip under test;

[0013] The high-speed detection steps for the electroluminescence of the LED chip array are as follows:

[0014] Step S1: Place the LED chip array to be tested on the surface of the first substrate;

[0015] Step S2: Under the drive of the electrically controlled displacement module, the track-shaped conductive module contacts the LED chip array under test, and directly contacts multiple LEDs that are arbitrarily distributed in a plane on the LED chip array under test with the maximum contact area.

[0016] Step S3: The power supply module applies an electrical signal between the first conductive layer and the track-shaped conductive module to cause multiple LEDs in contact with the maximum contact surface of the track-shaped conductive module to produce electroluminescence. The light signal measurement module records the light emission information of the detected LED chip, and the electrical signal measurement module records the electrical signal of the detected LED chip.

[0017] Step S4: The electric displacement module causes the track-shaped conductive module to roll relative to the LED chip array along the direction perpendicular to the cylindrical axis of the drive wheel of the track-shaped conductive module and maintain continuous contact with the LED chip array under test. The cylindrical axis of the track-shaped conductive module is aligned with another planar LED chip array adjacent to the planar LED chip array that has been tested in step S2. The light signal measurement module records the light emission information of the detected LED chip, and the electrical signal measurement module records the electrical signal of the detected LED chip.

[0018] Step S5: Repeat steps S3 and S4 until all LED chips on the plane that rolls along the direction perpendicular to the cylindrical axis of the drive wheel of the track-shaped conductive module have been detected.

[0019] Step S6: The electronically controlled displacement module drives the track-shaped conductive module to move the track-shaped conductive module to another undetected area on the surface of the LED chip array under test;

[0020] Step S7: Repeat steps S5 and S6 until all LED chips on the surface of the LED chip array have been detected.

[0021] Furthermore, the curved surface of the track-shaped conductive module is covered with a functional layer for transmitting charge carriers or generating induced charges in the LED chips that are in contact with the track-shaped conductive module.

[0022] Furthermore, the width of the track surface of the track-shaped conductive module ranges from 1μm to 50cm.

[0023] The length of the track surface of the track-shaped conductive module ranges from 1 μm to 50 cm.

[0024] Furthermore, the electrically controlled displacement module enables the track-shaped conductive module to selectively roll or move in three-dimensional space.

[0025] Furthermore, the electrical signal applied by the power supply module between the first conductive layer and the track-shaped conductive module is an alternating voltage.

[0026] Furthermore, the first conductive layer is disposed on the upper or lower surface of the first substrate.

[0027] Furthermore, the LED chip array under test is an LED epitaxial wafer forming a light-emitting array, an LED chip array disposed on a substrate, or an LED chip array disposed on a driving backplane.

[0028] Furthermore, the LED chip array under test is placed on the upper surface of the first substrate, and the track-shaped conductive module is placed on top of the LED chip array.

[0029] Furthermore, the LED chip array under test is placed on the lower surface of the first substrate, and the track-shaped conductive module is placed below the LED chip array.

[0030] Furthermore, after the track-shaped conductive module has finished detecting a number of LEDs arranged in a straight line, the power supply module can continue to supply power until all the LED chips to be tested on the LED chip array surface have been detected; the power supply module can also interrupt the power supply after the track-shaped conductive module has finished detecting a number of LEDs arranged in a straight line, and resume the power supply after the track-shaped conductive module rolls to another undetected area.

[0031] The present invention and its preferred embodiment use a track-shaped conductive module driven by the electrically controlled displacement module to contact multiple LED chips on the surface of the LED chip array under test with the maximum contact area, thereby achieving the purpose of efficient detection of LED chips. Attached Figure Description

[0032] The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments:

[0033] Figure 1 This is a schematic diagram of the overall structure of an embodiment of the present invention; it shows that the high-speed detection system for LED chip electroluminescence includes: a first substrate, a first conductive layer disposed on the upper surface of the first substrate, a track-shaped conductive module, an electrically controlled displacement module, an optical signal measurement module, an electrical signal measurement module, and a power supply module. The first conductive layer may also be disposed on the lower surface of the first substrate to enable the power supply module to establish an electrical connection with the LED chip array under test.

[0034] Figure 2 This is a schematic diagram of the working state of an embodiment of the present invention. Figure 1 This indicates that the LED chip array to be tested is located on the upper surface of the first conductive layer, and the track-shaped conductive module is placed horizontally on the LED chip array to be tested. The cylindrical shaft of the drive wheel of the track-shaped conductive module is parallel to the LED chip array to be tested, so that the flexible conductive chain of the track-shaped conductive module contacts multiple LED chips on the LED chip array to be tested with the maximum contact surface.

[0035] Figure 3 This is a schematic diagram of the working state of an embodiment of the present invention. Figure 2 This indicates that during the detection process, the track-shaped conductive module rolls relative to the LED chip array along the direction perpendicular to the cylindrical axis of the drive wheel, eliminating the need for frequent vertical movements and effectively improving the detection speed.

[0036] Figure 4 It is indicated that the distance L between the two equivalent circular bottom surfaces of the track-shaped conductive module ranges from 1μm to 50cm.

[0037] Figure 5It is indicated that the diameter D of the circular cross-section of the track-shaped conductive module ranges from 1μm to 50cm.

[0038] Figure 6 This is a schematic diagram of the working state of an embodiment of the present invention. Figure 3 This indicates that the area covered by the plane that rolls perpendicular to the cylindrical axis of the track-shaped conductive module is smaller than the area of ​​the LED chip array under test.

[0039] Figure 7 This is a three-dimensional schematic diagram of an embodiment of the present invention; it shows that the electrically controlled displacement module is required to selectively directionally roll or move the track-shaped conductive module in three-dimensional space.

[0040] Figure 8 This is a schematic diagram of the overall structure of an embodiment of the present invention. Figure 2 This indicates that the electrical signal applied by the power supply module between the first conductive layer and the track-shaped conductive module is an alternating voltage.

[0041] Figures 9 to 11 This indicates that the tested LED chip array can be, but is not limited to, LED epitaxial wafers (such as...). Figure 9 (representation), an array of LED chips (such as) set on the surface of sapphire. Figure 13 (representation), LED chip arrays disposed on other transitional substrates (such as...) Figure 10 (representation), an LED chip array (such as) mounted on the driver backplane. Figure 11 express).

[0042] Figure 12 This indicates that the LED chip array being tested is placed on the upper surface of the first substrate, and the track-shaped conductive module is placed on top of the LED chip array.

[0043] Figure 13 This means that an LED chip array is placed on the surface of the first substrate.

[0044] Figure 14 This indicates that, driven by the electrically controlled displacement module, the track-shaped conductive module contacts the LED chip array under test, directly contacting any one of the linear LED chip arrays.

[0045] Figure 15 This means that the power supply module applies an electrical signal between the first conductive layer and the track-shaped conductive module, causing multiple LEDs in contact with the maximum contact surface of the track-shaped conductive module to produce electroluminescence. The light signal measurement module records the light emission information of the detected LED chip, and the electrical signal measurement module records the electrical signal of the detected LED chip.

[0046] Figure 16This means that the electronically controlled displacement module causes the track-shaped conductive module to roll relative to the LED chip array along a direction perpendicular to the cylindrical axis of the drive wheel of the track-shaped conductive module, thereby aligning the cylindrical axis of the track-shaped conductive module with the LED chip array. Figure 15 In the steps described above, the linear LED chip array that has been tested is adjacent to another linear LED chip array. The optical signal measurement module records the light emission information of the tested LED chip, and the electrical signal measurement module records the electrical signal of the tested LED chip.

[0047] Figure 17 Indicates repetition Figure 15 , Figure 16 The described steps continue until all LED chips on the plane that rolls perpendicular to the cylindrical axis of the track-shaped conductive module have been detected.

[0048] Figure 18 This means that the electronically controlled displacement module drives the track-shaped conductive module and the LED chip array, causing the track-shaped conductive module to move to another undetected area on the surface of the LED chip array.

[0049] Figure 19 Indicates repetition Figure 17 , Figure 18 The described steps continue until all LED chips on the surface of the LED chip array have been inspected.

[0050] Figure 20 This indicates that the curved surface of the track-shaped conductive module can cover a functional layer, which can be a conductive material, a semiconductor material, or an insulating material.

[0051] Figure 21 This indicates that the first conductive layer can also be disposed on the lower surface of the first substrate.

[0052] Figure 22 This indicates that the LED chip array being tested can be placed on the lower surface of the first substrate, with the track-shaped conductive module positioned below it. The track-shaped conductive module should move with the LED chip array, ensuring contact between the track-shaped conductive module and the LED chips on the surface of the LED chip array.

[0053] Figure 23 This indicates that the plane covering the area of ​​the LED chip array under test, which rolls perpendicular to the 400 cylindrical axis of the track-shaped conductive module, is larger than the area of ​​the LED chip array under test. This ensures that all LEDs on the surface of the LED chip array under test will exhibit electroluminescence or hyperluminescence after one roll of the track-shaped conductive module. However, this generates greater power and places more stringent demands on the equipment. Detailed Implementation

[0054] To make the features and advantages of this patent more apparent and understandable, specific embodiments are provided below for detailed explanation:

[0055] To enable those skilled in the art to further understand the method proposed in this invention, specific embodiments are described below. The preferred embodiments provided are for further illustrative purposes only and should not be considered as limiting the scope of the invention to the embodiments described herein, nor should they be construed as restricting the scope of protection of this invention. Non-essential improvements and adjustments made to this invention by those skilled in the art based on the above description are still within the scope of protection of this invention.

[0056] It should be noted that the following detailed descriptions are exemplary and intended to provide further explanation of this application. Unless otherwise specified, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains.

[0057] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0058] In a first embodiment of the present invention, the high-speed detection system for LED chip electroluminescence includes: a first substrate 300, a first conductive layer 200 disposed on the upper surface of the first substrate, a track-shaped conductive module 400, an electrically controlled displacement module 500, an optical signal measurement module 800, an electrical signal measurement module 600, and a power supply module 700 (e.g., Figure 1 (As shown). The first conductive layer 200 can also be disposed on the lower surface of the first substrate 300 to enable the power supply module 700 to establish an electrical connection with the LED chip array 100 under test (e.g.). Figure 21 (As shown). In this embodiment, the first conductive layer is preferably disposed on the upper surface of the first substrate.

[0059] The LED chip array 100 to be tested is located on the upper surface of the first conductive layer 200. A track-shaped conductive module 400 is horizontally placed on the LED chip array 100, with its cylindrical axis parallel to the LED chip array 100, so that the curved surface of the track-shaped conductive module 400 directly contacts one of the multiple LEDs arranged in a straight line on the LED chip array 100 (e.g., ...). Figure 2 As shown). During the detection process, the track-shaped conductive module 400 rolls relative to the LED chip array 100 along a direction perpendicular to the cylindrical axis of the track-shaped conductive module 400. This eliminates the need for frequent vertical movements, effectively improving the detection speed (e.g., Figure 3As shown). The distance L between the two equivalent circular bottom surfaces of the track-shaped conductive module 400 is 100 μm (as shown). Figure 4 As shown). The diameter D of the circular cross-section of the track-shaped conductive module 400 is 10 μm (as shown). Figure 5 (As shown).

[0060] The area covered by the plane that rolls perpendicular to the cylindrical axis of the track-shaped conductive module 400 is smaller than the area of ​​the LED chip array 100 under test (e.g., Figure 6 (As shown).

[0061] The electrically controlled displacement module 500 is required to be able to selectively directionally roll or move the track-shaped conductive module 400 in three-dimensional space (e.g., ...). Figure 7 (As shown).

[0062] The electrical signal applied by the power supply module 700 between the first conductive layer 200 and the track-shaped conductive module 400 is an alternating voltage (e.g., Figure 8 (As shown).

[0063] The tested LED chip array can be, but is not limited to, LED epitaxial wafers 900 (e.g., Figure 9 As shown), an LED chip array 100 disposed on the surface of sapphire (e.g. Figure 13 As shown), an LED chip array disposed on other transitional substrates 1000 (such as... Figure 10 As shown), an LED chip array (such as) is disposed on the driver backplane 1100. Figure 11 (As shown). In this embodiment, the LED chip array 100 is preferably disposed on the surface of sapphire.

[0064] The detected LED chip array is placed on the upper surface of the first conductive layer 200, and the track-shaped conductive module 400 is placed on top of the LED chip array (e.g., Figure 12 (As shown).

[0065] An LED chip array is placed on the surface of a first substrate. In the figure, 100 represents the LED chip array, 200 represents the first conductive layer, and 300 represents the first substrate (e.g., ...). Figure 13 (As shown).

[0066] Driven by the electrically controlled displacement module 500, the track-shaped conductive module 400 contacts the LED chip array 100 under test, directly contacting any linear LED chip array (such as...). Figure 14 (As shown).

[0067] The power supply module 700 applies an electrical signal between the first conductive layer 200 and the track-shaped conductive module 400, causing multiple LEDs arranged in a straight line and in contact with the track-shaped conductive module 400 to produce electroluminescence. The light signal measurement module 800 records the light emission information of the detected LED chip, and the electrical signal measurement module 600 records the electrical signal of the detected LED chip (e.g., ...). Figure 15 (As shown).

[0068] The electronically controlled displacement module 500 causes the track-shaped conductive module 400 to roll relative to the LED chip array 100 along a direction perpendicular to its cylindrical axis, thereby aligning the track-shaped conductive module 400 with the LED chip array 100. Figure 15 In the described steps, for the linear LED chip array that has already been tested, another linear LED chip array adjacent to it, the optical signal measurement module 800 records the light emission information of the tested LED chip, and the electrical signal measurement module 600 records the electrical signal of the tested LED chip (such as...). Figure 16 (As shown).

[0069] repeat Figure 15 , Figure 16 The described steps continue until all LED chips on the plane rolling perpendicular to the cylindrical axis of the track-shaped conductive module 400 have been detected (e.g. Figure 17 (As shown).

[0070] The electrically controlled displacement module 500 drives the track-shaped conductive module 400 and the LED chip array 100, causing the track-shaped conductive module 400 to move to another undetected area on the surface of the LED chip array (such as...). Figure 18 (As shown).

[0071] repeat Figure 17 , Figure 18 The described steps continue until all LED chips on the surface of the LED chip array have been detected (e.g., Figure 19 (As shown).

[0072] In the second embodiment of the present invention, the curved surface of the track-shaped conductive module 400 can be covered with a functional layer, which can be a conductive material, a semiconductor material, or an insulating material. 401 in the figure represents the functional layer. The functional layer needs to function as a carrier transporter or to induce charges in the LED chip that is in contact with the track-shaped conductive module (e.g., ...). Figure 20 (As shown).

[0073] In the third embodiment of the present invention, the detected LED chip array can be placed on the lower surface of the first substrate 300, and the track-shaped conductive module 400 is placed below the LED chip array. The track-shaped conductive module should move with the LED chip array, and it is necessary to ensure that the track-shaped conductive module is in contact with the LED chips on the surface of the LED chip array (e.g., Figure 22 (As shown).

[0074] In the fourth embodiment of the present invention, the plane covering the area of ​​the LED chip array 100 under test, which rolls perpendicular to the cylindrical axis of the track-shaped conductive module 400, is larger than the area of ​​the LED chip array 100 under test. This ensures that all LEDs on the surface of the LED chip array under test will exhibit electroluminescence or hyperluminescence after one roll of the track-shaped conductive module. However, the power generated is greater, placing more stringent requirements on the equipment (e.g., ...). Figure 23 (As shown).

[0075] The preferred embodiments of the present invention have been described in detail above. However, the present invention is not limited to the specific details of the above embodiments. Within the scope of the technical concept of the present invention, various equivalent transformations (such as quantity, shape, position, etc.) can be made to the technical solution of the present invention, and these equivalent transformations all fall within the protection scope of the present invention.

[0076] The above descriptions of the embodiments are merely illustrative of the methods and core ideas of the present invention. Furthermore, the above are only preferred embodiments of the present invention and are not intended to limit the invention in any other way. Any person skilled in the art may make changes or modifications to the disclosed technical content to create equivalent embodiments. However, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of the present invention without departing from the scope of the present invention's technical solution shall still fall within the protection scope of the present invention.

Claims

1. A high-speed electroluminescence detection system for LED chip array, characterized in that: a power supply module is arranged to apply voltage between the LED chip array to be detected and a first conductive layer through a caterpillar conductive module; the caterpillar conductive module is composed of a plurality of toothed ring cylindrical driving wheels and a flexible conductive chain ring engaged with the driving wheels; the curved surface of the caterpillar conductive module is covered with a functional layer for transmitting carriers or generating induced charges in the LED chips in contact with the caterpillar conductive module; the power supply module applies an alternating voltage between the first conductive layer and the caterpillar conductive module; during the detection process, the caterpillar conductive module is placed on the surface of the LED chip array to be detected, the cylindrical shaft of the driving wheel is parallel to the LED chip array to be detected, so that the caterpillar conductive module contacts the LED chip array to be detected with the maximum contact area; when the flexible conductive chain ring contacts the LED chip array to be detected with the maximum contact area, it simultaneously causes a plurality of LED chips to generate electroluminescence phenomenon; the system comprises a first substrate, a first conductive layer arranged on the first substrate, a caterpillar conductive module, an electrically controlled displacement module, a light signal measurement module, an electric signal measurement module, and a power supply module; the first substrate is used to place the LED chip array to be detected; the electrically controlled displacement module is used to drive the caterpillar conductive module to move; the light signal measurement module is used to collect the light emission information of the LED chip to be detected, including brightness and luminous flux; the electric signal measurement module is used to collect the electrical information of the LED chip to be detected, including current and voltage; the high-speed electroluminescence detection steps of the LED chip array are as follows: step S1: placing the LED chip array to be detected on the surface of the first substrate; step S2: the caterpillar conductive module contacts the LED chip array to be detected under the driving of the electrically controlled displacement module to contact a plurality of LEDs distributed in any plane on the LED chip array to be detected with the maximum contact area; step S3: the power supply module applies an electrical signal between the first conductive layer and the caterpillar conductive module to cause a plurality of LEDs in contact with the maximum contact surface of the caterpillar conductive module to generate electroluminescence phenomenon, the light signal measurement module records the light emission information of the detected LED chip, and the electric signal measurement module records the electrical signal of the detected LED chip; step S4: the caterpillar conductive module is caused to roll relative to the LED chip array in a direction perpendicular to the cylindrical shaft of the driving wheel of the caterpillar conductive module and continuously contacts the LED chip array to be detected through the electrically controlled displacement module, so that the cylindrical shaft of the caterpillar conductive module is aligned with another LED chip array distributed in a plane adjacent to the LED chip array that has been tested in step S2, the light signal measurement module records the light emission information of the detected LED chip, and the electric signal measurement module records the electrical signal of the detected LED chip; step S5: repeating steps S3 and S4 until all the LED chips on the plane rolling in a direction perpendicular to the cylindrical shaft of the driving wheel of the caterpillar conductive module are detected. ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ Step S6: the electrically controlled displacement module drives the track-shaped conductive module to move to another undetected area on the surface of the LED chip array to be detected; Step S7: repeat step S5 and step S6 until all the LED chips on the surface of the LED chip array are detected.

2. The high-speed LED chip electroluminescence detection system according to claim 1, wherein: the width of the track surface of the track-shaped conductive module ranges from 1 μm to 50 cm; the length of the track surface of the track-shaped conductive module ranges from 1 μm to 50 cm. The electrically controlled displacement module selectively moves the track-shaped conductive module in three-dimensional space.

3. The LED chip electroluminescence high speed detection system according to claim 1, characterized in that: The first conductive layer is arranged on the upper surface or lower surface of the first substrate.

4. The LED chip electroluminescence high speed detection system according to claim 1, characterized in that: The LED chip array to be detected is an LED epitaxial wafer forming a light-emitting array or an LED chip array arranged on a substrate.

5. The LED chip electroluminescence high speed detection system according to claim 1, characterized in that: The LED chip array to be detected is arranged on the upper surface of the first substrate, and the track-shaped conductive module is arranged above the LED chip array.

6. The LED chip electroluminescence high speed detection system according to claim 1, characterized in that: The LED chip array to be detected is arranged on the lower surface of the first substrate, and the track-shaped conductive module is arranged below the LED chip array.

7. The LED chip electroluminescence high speed detection system according to claim 1, characterized in that: ​

Images