Device and method for controlling the amount of conductive adhesive applied to microsystem

Abstract

The present invention provides a device and method for controlling the amount of conductive glue applied to a microsystem, and relates to the technical field of microsystems. The present invention includes a glue dispenser, a glue amount measuring unit, a time-pressure glue dispensing controller, and a computer control system; the glue dispenser is used to dispense glue dots on a substrate; the glue amount measuring unit is used to obtain the real-time glue amount of the measured glue dots and send it to the computer control system; the computer control system is used to compare the real-time glue amount and the standard glue amount, and when the two are inconsistent, the conductive glue amount-air pressure-time model is called up, and the glue dispensing air pressure and / or the solenoid valve opening time of the glue dispenser are corrected by the time-pressure glue dispensing controller. Since both the air pressure and the valve opening time can control the glue dispensing speed of the glue dispenser, real-time control of the glue dispensing amount can be achieved, reducing the fluctuation of the glue dispensing amount.

Description

Technical Field

[0001] The present invention relates to the technical field of microsystems, and in particular to a device and method for controlling the amount of conductive adhesive applied to a microsystem. Background Art

[0002] Microsystem technology refers to the use of semiconductor technology to integrate a complete system with certain functions on a single chip or stacked chips, thereby achieving system miniaturization, functional integration, and cost reduction.

[0003] In the packaging process of microsystems, chip mounting is often required. The chip mounting process requires conductive glue to be applied to the adapter board. Therefore, the amount of conductive glue will affect the height of the chip. For high-frequency components, the height of the chip will affect the actual electrical performance of the component. Therefore, controlling the amount of conductive glue is very important for controlling component performance and ensuring component consistency. The original dispensing equipment, due to the lack of a closed-loop feedback control unit, causes the glue dots to be large or small, and as the amount of glue in the needle tube decreases, the air pressure continues to drop, which will also affect the size of the applied glue dots.

[0004] In view of this, it is necessary to provide a technical solution that can reduce the fluctuation of the amount of conductive adhesive. Summary of the invention

[0005] 1. Technical issues to be solved

[0006] In view of the deficiencies in the prior art, the present invention provides a device and method for controlling the amount of conductive adhesive applied to a microsystem, which solves the technical problem of fluctuations in the amount of conductive adhesive.

[0007] (II) Technical solution

[0008] To achieve the above objectives, the present invention is implemented through the following technical solutions:

[0009] A device for controlling the amount of conductive glue applied to a microsystem, comprising a glue dispenser, a glue amount measuring unit, a time-pressure glue dispensing controller and a computer control system;

[0010] The glue dispenser is used to dispense glue dots on the substrate;

[0011] The glue quantity measuring unit is used to obtain the real-time glue quantity of the measured glue point and send it to the computer control system;

[0012] The computer control system is used to compare the real-time glue quantity and the standard glue quantity. When the two are inconsistent, the conductive glue quantity-air pressure-time model is called up, and the dispensing air pressure and / or solenoid valve opening time of the dispenser are corrected through the time-pressure dispensing controller.

[0013] Preferably, the dispensing amount measuring unit is specifically used for:

[0014] Scan the surface of the conductive adhesive with a laser array, use the laser triangulation method, and use the focal plane as the reference plane to calculate the height difference between the conductive adhesive and the substrate to obtain the real-time adhesive amount of the measured adhesive point;

[0015]

[0016] Among them, V sum To characterize the volume value of the real-time glue amount of the measured glue point;

[0017] The large rectangular area scanned by the laser array needs to completely cover the surface area of ​​the glue point to be measured; the large rectangle is divided into a number of small rectangles, i and j represent the small rectangles located in the i-th row and j-th column respectively;

[0018] H i,j Two-dimensional matrix data representing the surface height of the measured glue dots;

[0019] H st Indicates the surface height of the substrate;

[0020] (Δx ij ,Δy ij ) represents the row spacing and column spacing during laser array scanning.

[0021] Preferably, the height of any point on the measured glue spot surface relative to the focal plane is obtained as follows:

[0022] A laser beam is used to illuminate the substrate / tested glue point at a certain incident angle. The laser is reflected on the surface of the substrate / tested glue point. The reflected laser is focused into an image at another angle using a receiving lens. The light spot is imaged on the CCD image sensor.

[0023] When the object to be measured changes from the substrate to the measured glue point along the laser direction, the light spot on the CCD image sensor moves, and its displacement x, corresponding to the axial movement distance x of the object to be measured, satisfies:

[0024]

[0025] Among them, θ is the angle between the incident light and the outgoing light when the object to be measured is the measured glue point, a is the distance between the focus on the focal plane where the laser is aligned and the center of the receiving lens, and b is the vertical distance from the center of the receiving lens to the center of the front of the CCD image sensor.

[0026] Preferably, the conductive adhesive amount-air pressure-time model is expressed as:

[0027] V=V0+A1T+B1P+A2T 2 +B2P 2

[0028] Wherein, V is the volume representing the amount of conductive adhesive;

[0029] V0, A1, B1, A2, and B2 are all adjustment parameters;

[0030] T is the solenoid valve opening time;

[0031] P is the dispensing pressure.

[0032] Preferably, the computer control system is specifically used for:

[0033] When the real-time glue quantity is inconsistent with the standard glue quantity, calculate

[0034]

[0035]

[0036] Among them, ΔP and ΔT represent the correction values ​​of dispensing air pressure and solenoid valve opening time respectively;

[0037] ΔV represents the difference between the real-time glue amount and the standard glue amount;

[0038] λ is an empirical parameter ranging from 0 to 1; when λ=0, the valve opening time adjustment mode is executed by the time-pressure dispensing controller; when λ=1, the air pressure adjustment mode is executed; otherwise, the time-pressure adjustment mode is executed.

[0039] Preferably, the working principle of the glue dispenser is that the compressed gas flowing out from the pressure source acts on the needle tube through the air pressure stabilizing device, the air pipe, and the solenoid valve, and the colloid in the needle tube flows out from the needle head under the combined action of the air pressure inside and outside the tube.

[0040] A method for controlling the amount of conductive adhesive applied to a microsystem, using the device for controlling the amount of conductive adhesive applied to a microsystem as described above, the method comprising:

[0041] S1. Use a glue dispenser to dispense glue dots on the substrate;

[0042] S2. Use the glue volume measurement unit to scan the glue point volume, obtain the conductive glue volume V1~VN of N adjacent glue points, and take the real-time average value V avg Send to computer control system;

[0043] S3, during the dispensing process, the air pressures P1~PN of the N adjacent glue points counted by the time-pressure dispensing controller are taken as the real-time average value P avg , sent to the computer control system; count the solenoid valve opening time T1~TN of N glue points, and take the real-time average value T avg , sent to the computer control system;

[0044] S4. Use computer control system to calculate V avg And the standard glue volume V for storage st The difference ΔV=|V st -V avg |, call up the conductive glue volume-air pressure-time model V=F(T,P), and use the time-pressure dispensing controller to adjust P avg and / or T avg Provide feedback and corrections;

[0045] S5. For the remaining unfinished dispensing tasks, repeat S1 to S4 until the dispensing tasks are completed.

[0046] Preferably, the process of obtaining the volume of the conductive glue of any glue point measured in S2 is as follows:

[0047] Scan the surface of the conductive adhesive with a laser array, use the laser triangulation method, and use the focal plane as the reference plane to calculate the height difference between the conductive adhesive and the substrate to obtain the real-time adhesive amount of the measured adhesive point;

[0048]

[0049] Among them, V sum To characterize the volume value of the real-time glue amount of the measured glue point;

[0050] The large rectangular area scanned by the laser array needs to completely cover the surface area of ​​the glue point to be measured; the large rectangle is divided into a number of small rectangles, i and j represent the small rectangles located in the i-th row and j-th column respectively;

[0051] H i,j Two-dimensional matrix data representing the surface height of the measured glue dots;

[0052] H st Indicates the surface height of the substrate;

[0053] (Δx ij ,Δy ij ) represents the row spacing and column spacing during laser array scanning.

[0054] Preferably, the height of any point on the measured glue spot surface relative to the focal plane is obtained as follows:

[0055] A laser beam is used to illuminate the substrate / tested glue point at a certain incident angle. The laser is reflected on the surface of the substrate / tested glue point. The reflected laser is focused into an image at another angle using a receiving lens. The light spot is imaged on the CCD image sensor.

[0056] When the object to be measured changes from the substrate to the measured glue point along the laser direction, the light spot on the CCD image sensor moves, and its displacement x, corresponding to the axial movement distance x of the object to be measured, satisfies:

[0057]

[0058] Among them, θ is the angle between the incident light and the outgoing light when the object to be measured is the measured glue point, a is the distance between the focus on the focal plane where the laser is aligned and the center of the receiving lens, and b is the vertical distance from the center of the receiving lens to the center of the front of the CCD image sensor.

[0059] Preferably, the conductive adhesive amount-air pressure-time model is expressed as:

[0060] V=V0+A1T+B1P+A2T 2 +B2P 2

[0061] Wherein, V is the volume representing the amount of conductive adhesive;

[0062] V0, A1, B1, A2, and B2 are all adjustment parameters;

[0063] T is the solenoid valve opening time;

[0064] P is the dispensing pressure;

[0065] When the real-time glue quantity is inconsistent with the standard glue quantity, the computer control system is used to calculate

[0066]

[0067]

[0068] Among them, ΔP and ΔT represent the correction values ​​of dispensing air pressure and solenoid valve opening time respectively;

[0069] λ is an empirical parameter ranging from 0 to 1; when λ=0, the valve opening time adjustment mode is executed by the time-pressure dispensing controller; when λ=1, the air pressure adjustment mode is executed; otherwise, the time-pressure adjustment mode is executed.

[0070] (III) Beneficial effects

[0071] The present invention provides a device and method for controlling the amount of conductive adhesive applied to a microsystem. Compared with the prior art, the device and method have the following beneficial effects:

[0072] The present invention includes a glue dispenser, a glue dispensing amount measuring unit, a time-pressure glue dispensing controller and a computer control system; the glue dispenser is used to dispense glue dots on a substrate; the glue dispensing amount measuring unit is used to obtain the real-time glue amount of the measured glue dots and send it to the computer control system; the computer control system is used to compare the real-time glue amount and the standard glue amount, and when the two are inconsistent, the conductive glue amount-air pressure-time model is called up, and the glue dispensing air pressure and / or the solenoid valve opening time of the glue dispenser are corrected by the time-pressure glue dispensing controller. Since both the air pressure and the valve opening time can control the glue dispensing speed of the glue dispenser, real-time control of the glue dispensing amount can be achieved, reducing the fluctuation of the glue dispensing amount. BRIEF DESCRIPTION OF THE DRAWINGS

[0073] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0074] Figure 1 A schematic diagram of the structure of a device for controlling the amount of conductive adhesive applied to a microsystem provided by an embodiment of the present invention;

[0075] Figure 2 A schematic diagram of a geometric optical path of a laser triangulation ranging method provided by an embodiment of the present invention;

[0076] Figure 3 A schematic diagram of measuring volume of a conductive adhesive provided by an embodiment of the present invention;

[0077] Figure 4 A closed-loop flow chart of a computer control system for feedback controlling the amount of conductive adhesive provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0078] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention are clearly and completely described. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0079] The embodiment of the present application solves the technical problem of fluctuation in the amount of conductive adhesive by providing a device for controlling the amount of conductive adhesive applied to a microsystem.

[0080] The technical solution in the embodiment of the present application is to solve the above technical problems, and the overall idea is as follows:

[0081] The embodiment of the present invention includes a glue dispenser, a glue dispensing amount measuring unit, a time-pressure glue dispensing controller and a computer control system; the glue dispenser is used to dispense glue dots on a substrate; the glue dispensing amount measuring unit is used to obtain the real-time glue amount of the measured glue dots and send it to the computer control system; the computer control system is used to compare the real-time glue amount and the standard glue amount, and when the two are inconsistent, the conductive glue amount-air pressure-time model is called up, and the glue dispensing air pressure and / or the solenoid valve opening time of the glue dispenser are corrected by the time-pressure glue dispensing controller. Since both the air pressure and the valve opening time can control the glue dispensing speed of the glue dispenser, real-time control of the glue dispensing amount can be achieved, reducing the fluctuation of the glue dispensing amount.

[0082] In order to better understand the above technical solution, the above technical solution will be described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0083] Example:

[0084] First, as Figure 1 As shown, an embodiment of the present invention provides a device for controlling the amount of conductive glue applied to a microsystem, including a dispenser 1, a dispense amount measuring unit 2, a time-pressure dispense controller 3 and a computer control system 4.

[0085] The glue dispenser 1 is used to dispense glue dots 6 on a substrate 5. Specifically, under the control of a time-pressure glue dispenser controller 3, the glue dispenser opens the air pressure valve to control the conductive glue to be applied on the substrate to form isolated glue dots that are approximately circular.

[0086] Exemplarily, the glue dispenser 1 comprises a needle tube suction head. When dispensing glue, the conductive glue is squeezed out of the needle head and falls onto the substrate due to the upper air pressure. The air pressure value on the upper part of the needle tube is adjustable. Its working principle is that the compressed gas flowing out from the pressure source acts on the needle tube through the air pressure stabilizing device, the air pipe, and the solenoid valve, and the colloid in the needle tube flows out of the needle head under the combined action of the air pressure inside and outside the tube.

[0087] The glue quantity measuring unit 2 is used to obtain the real-time glue quantity of the measured glue point 6 and send it to the computer control system 4; specifically, it includes the following two steps:

[0088] Step 1: The height of any point on the surface of the measured glue point 6 relative to the focal plane needs to be obtained, such as Figure 2 As shown, the acquisition process is as follows:

[0089] A laser beam is irradiated on the substrate 5 / the glue point 6 to be measured at a certain incident angle, and the laser is reflected on the surface of the substrate 5 / the glue point 6 to be measured, and is received by a receiving lens (corresponding to the receiving lens) at another angle. Figure 2 The lens 2) in the middle focuses the reflected laser light into an image, and the light spot is imaged on the CCD image sensor;

[0090] When the object to be measured changes from the substrate 5 to the measured glue point 6 along the laser direction, the light spot on the CCD image sensor moves, and its displacement x, corresponding to the axial movement distance x of the object to be measured, satisfies:

[0091]

[0092] Wherein, θ is the angle between the incident light and the outgoing light when the object to be measured is the measured glue point 6, a is the distance between the focus on the focal plane where the laser is aligned and the center of the receiving lens, and b is the vertical distance from the center of the receiving lens to the center of the front of the CCD image sensor.

[0093] Step 2: Obtain the real-time glue amount of the measured glue point 6 according to the height of each point on the surface of the measured glue point 6 relative to the focal plane, specifically including:

[0094] The glue quantity measuring unit 2 scans the surface of the conductive glue by means of the laser array 7, and uses the laser triangulation method to calculate the height difference between the conductive glue and the substrate with the focal plane as the reference plane, so as to obtain the real-time glue quantity of the measured glue point 6;

[0095]

[0096] Among them, V sum The volume value representing the real-time glue amount of the measured glue point 6;

[0097] like Figure 3 As shown, the large rectangular area scanned by the laser array 7 needs to completely cover the surface area of ​​the measured glue point 6; the large rectangle is divided into a number of small rectangles, i and j represent the small rectangles located in the i-th row and j-th column respectively;

[0098] H i,j The two-dimensional matrix data representing the surface height of the measured glue point 6 is composed of the height x of a point on the surface of the measured glue point 6 relative to the focal plane;

[0099] H st represents the surface height of the substrate 5;

[0100] Δx ij ,Δy ij Indicates the row pitch and column pitch when the laser array 7 is scanning.

[0101] The computer control system 4 is used to compare the real-time glue quantity and the standard glue quantity. When the two are inconsistent, the conductive glue quantity-air pressure-time model V=F(P, T) is called up, and the dispensing air pressure and / or solenoid valve opening time of the dispenser 1 are corrected through the time-pressure dispensing controller 3.

[0102] The conductive adhesive amount-air pressure-time model can specifically adopt the following model:

[0103] V=V0+A1T+B1P+A2T 2 +B2P 2

[0104] Wherein, V is the volume representing the amount of conductive adhesive;

[0105] V0, A1, B1, A2, and B2 are all adjustment parameters;

[0106] T is the solenoid valve opening time;

[0107] P is the dispensing pressure.

[0108] At this time, the computer control system 4 is specifically used for:

[0109] (1) When the real-time glue quantity is inconsistent with the standard glue quantity, calculate

[0110]

[0111]

[0112] Among them, ΔP and ΔT represent the correction values ​​of dispensing air pressure and solenoid valve opening time respectively;

[0113] ΔV represents the difference between the real-time glue amount and the standard glue amount;

[0114] λ is an empirical parameter ranging from 0 to 1; when λ=0, the valve opening time adjustment mode is executed by the time-pressure dispensing controller 3; when λ=1, the air pressure adjustment mode is executed; otherwise (for example, λ=0.5), the time-pressure adjustment mode is executed.

[0115] (2) When the real-time glue amount is consistent with the standard glue amount, no operation is performed.

[0116] Finally, it should be noted that in the actual operation process, since the valve opening time is relatively stable, while the dispensing air pressure is prone to fluctuations, it is preferred to execute the valve opening time adjustment mode (taking λ=0) through the time-pressure dispensing controller 3, that is, the real-time fluctuating dispensing pressure P is compensated accordingly by adjusting the valve opening time T, thereby maintaining the amount of conductive glue unchanged and reducing the fluctuations in the dispensing process.

[0117] In addition, in addition to the two factors of dispensing pressure and solenoid valve opening time, due to the different structural principles of different dispensers, there are other factors in theory, such as the dynamic characteristics of the pneumatic system (such as valves, air pipes, needles), which also affect the dispensing amount. Therefore, those skilled in the art should know that any variant embodiment covering the above-mentioned control of the dispensing amount by compensating for the dispensing pressure and / or the solenoid valve opening time should be deemed to fall within the protection scope required by this application.

[0118] The embodiment of the present invention can realize real-time collection and statistical analysis of the amount of conductive glue dispensed by using image acquisition and image processing algorithms, and can realize real-time monitoring of the amount of conductive glue. By adjusting the valve opening time and air pressure in real time according to the glue amount model stored in the computer, the changing amount of conductive glue is compensated in real time, which greatly improves the consistency of the amount of conductive glue dispensed and achieves a high-quality glue dispensing process control level. The device reduces the original conductive glue amount change rate from 50% to 10%, providing a solution for precision assembly industries such as semiconductors.

[0119] On the other hand, an embodiment of the present invention provides a method for controlling the amount of conductive adhesive applied to a microsystem, characterized in that the device for controlling the amount of conductive adhesive applied to a microsystem as described above is used, such as Figure 4 As shown, the method includes:

[0120] S1, using glue dispenser 1 to dispense glue dots 6 on substrate 5;

[0121] S2, use the glue volume measurement unit 2 to scan the glue point volume, obtain the conductive glue volume V1~VN of N adjacent glue points, and take the real-time average value V avg Send to computer control system 4;

[0122] S3, during the dispensing process, the air pressures P1 to PN of the N adjacent glue points counted by the time-pressure dispensing controller 3 are taken as the real-time average value P avg , sent to the computer control system 4; count the solenoid valve opening time T1~TN of N glue points, and take the real-time average value T avg , sent to the computer control system 4;

[0123] S4, using computer control system 4 to calculate V avg And the standard glue volume V for storage st The difference ΔV=|V st -V avg |, call up the conductive glue quantity-air pressure-time model V=F(T,P), and use the time-pressure dispensing controller 3 to P avg and / or T avg Provide feedback and corrections;

[0124] S5. For the remaining unfinished dispensing tasks, repeat S1 to S4 until the dispensing tasks are completed.

[0125] In one embodiment, the process of obtaining the volume of the conductive glue of any one of the measured glue points 6 in S2 is as follows:

[0126] Scan the surface of the conductive adhesive by means of a laser array 7, and use a laser triangulation method to calculate the height difference between the conductive adhesive and the substrate with the focal plane as a reference plane to obtain the real-time adhesive amount of the measured adhesive point 6;

[0127]

[0128] Among them, V sum The volume value representing the real-time glue amount of the measured glue point 6;

[0129] The large rectangular area scanned by the laser array 7 needs to completely cover the surface area of ​​the measured glue point 6; the large rectangle is divided into a number of small rectangles, i and j represent the small rectangles located in the i-th row and j-th column respectively;

[0130] H i,j Two-dimensional matrix data representing the surface height of the measured glue point 6;

[0131] H st represents the surface height of the substrate 5;

[0132] (Δx ij ,Δy ij ) represents the row spacing and column spacing when the laser array 7 is scanning.

[0133] In one embodiment, the height of any point on the surface of the measured glue dot 6 relative to the focal plane is obtained as follows:

[0134] A laser beam is irradiated on the substrate 5 / the glue point 6 to be measured at a certain incident angle, and the laser is reflected on the surface of the substrate 5 / the glue point 6 to be measured. The reflected laser is focused into an image at another angle by a receiving lens, and the light spot is imaged on the CCD image sensor;

[0135] When the object to be measured changes from the substrate 5 to the measured glue point 6 along the laser direction, the light spot on the CCD image sensor moves, and its displacement x, corresponding to the axial movement distance x of the object to be measured, satisfies:

[0136]

[0137] Wherein, θ is the angle between the incident light and the outgoing light when the object to be measured is the measured glue point 6, a is the distance between the focus on the focal plane where the laser is aligned and the center of the receiving lens, and b is the vertical distance from the center of the receiving lens to the center of the front of the CCD image sensor.

[0138] In one embodiment, the conductive adhesive amount-air pressure-time model is expressed as:

[0139] V=V0+a1T+B1P+a2T 2 +B2P 2

[0140] Wherein, V is the volume representing the amount of conductive adhesive;

[0141] V0, A1, B1, A2, and B2 are all adjustment parameters;

[0142] T is the solenoid valve opening time;

[0143] P is the dispensing pressure.

[0144] In one embodiment, when the real-time glue quantity is inconsistent with the standard glue quantity, the computer control system 4 is used to calculate

[0145]

[0146]

[0147] Among them, ΔP and ΔT represent the correction values ​​of dispensing air pressure and solenoid valve opening time respectively;

[0148] λ is an empirical parameter ranging from 0 to 1; when λ=0, the valve opening time adjustment mode is executed by the time-pressure dispensing controller (3); when λ=1, the air pressure adjustment mode is executed; otherwise, the time-pressure adjustment mode is executed.

[0149] It can be understood that the method for controlling the amount of conductive glue applied to a microsystem provided in an embodiment of the present invention corresponds to the device for controlling the amount of conductive glue applied to a microsystem provided in an embodiment of the present invention, and the explanations, examples and beneficial effects of the relevant contents can refer to the corresponding parts in the device for controlling the amount of conductive glue applied to a microsystem, and will not be repeated here.

[0150] In summary, compared with the prior art, the present invention has the following beneficial effects:

[0151] The embodiment of the present invention can realize real-time collection and statistical analysis of the amount of conductive glue dispensed by using image acquisition and image processing algorithms, and can realize real-time monitoring of the amount of conductive glue. By adjusting the valve opening time and air pressure in real time according to the glue amount model stored in the computer, the changing amount of conductive glue is compensated in real time, which greatly improves the consistency of the amount of conductive glue dispensed and achieves a high-quality glue dispensing process control level. The device reduces the original conductive glue amount change rate from 50% to 10%, providing a solution for precision assembly industries such as semiconductors.

[0152] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0153] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A device for controlling the amount of conductive adhesive applied to a microsystem, characterized in that: It comprises a glue dispenser (1), a glue quantity measuring unit (2), a time-pressure glue dispensing controller (3) and a computer control system (4); The glue dispenser (1) is used to dispense glue dots (6) on a substrate (5); The glue quantity measuring unit (2) is used to obtain the real-time glue quantity of the measured glue point (6) and send it to the computer control system (4); The computer control system (4) is used to compare the real-time glue quantity and the standard glue quantity. When the two are inconsistent, the conductive glue quantity-air pressure-time model is retrieved, and the glue dispensing air pressure and / or the solenoid valve opening time of the glue dispenser (1) are corrected through the time-pressure glue dispensing controller (3); the conductive glue quantity-air pressure-time model is expressed as: V=V0+A1T+B1P+A2T 2 +B2P 2 Wherein, V is the volume representing the amount of conductive adhesive; V0, A1, B1, A2, and B2 are all adjustment parameters; T is the solenoid valve opening time; P is the dispensing pressure.

2. The device for controlling the amount of conductive adhesive applied to a microsystem as claimed in claim 1, characterized in that: The dispensing amount measuring unit (2) is specifically used for: Scanning the surface of the conductive adhesive by means of a laser array (7), using a laser triangulation method, and taking the focal plane as a reference plane to calculate the height difference between the conductive adhesive and the substrate, thereby obtaining the real-time adhesive amount of the measured adhesive point (6); Among them, V sum A volume value representing the real-time glue amount of the measured glue point (6); The large rectangular area scanned by the laser array (7) needs to completely cover the surface area of ​​the glue point (6) to be measured; the large rectangle is divided into a plurality of small rectangles, i and j represent the small rectangles located in the i-th row and the j-th column respectively; H i，j Two-dimensional matrix data representing the surface height of the measured glue point (6); H st represents the surface height of the substrate (5); (Δx ij , Δy ij ) represents the row spacing and column spacing when the laser array (7) is scanning.

3. The device for controlling the amount of conductive adhesive applied to a microsystem as claimed in claim 2, characterized in that: The height of any point on the surface of the measured glue point (6) relative to the focal plane is obtained as follows: A laser beam is used to illuminate the substrate (5) / the glue point (6) to be measured at a certain incident angle, and the laser is reflected on the surface of the substrate (5) / the glue point (6) to be measured. The reflected laser is focused into an image at another angle by using a receiving lens, and the light spot is imaged on a CCD image sensor; When the object to be measured is transformed from the substrate (5) to the measured glue point (6) along the laser direction, the light spot on the CCD image sensor moves, and its displacement x' corresponds to the axial movement distance x of the object to be measured, satisfying: Wherein, θ is the angle between the incident light and the outgoing light when the object to be measured is the measured glue point (6), a is the distance between the focus on the focal plane where the laser is aligned and the center of the receiving lens, and b is the vertical distance from the center of the receiving lens to the center of the front of the CCD image sensor.

4. The device for controlling the amount of conductive adhesive applied to a microsystem as claimed in claim 1, characterized in that: The computer control system (4) is specifically used for: When the real-time glue quantity is inconsistent with the standard glue quantity, calculate Among them, ΔP and ΔT represent the correction values ​​of dispensing air pressure and solenoid valve opening time respectively; ΔV represents the difference between the real-time glue volume and the standard glue volume; λ is an empirical parameter ranging from 0 to 1; when λ=0, the valve opening time adjustment mode is executed by the time-pressure dispensing controller (3); when λ=1, the air pressure adjustment mode is executed; otherwise, the time-pressure adjustment mode is executed.

5. The device for controlling the amount of conductive adhesive applied to a microsystem according to any one of claims 1 to 4, characterized in that: The working principle of the glue dispenser (1) is that the compressed gas flowing out from the pressure source acts on the needle tube through the air pressure stabilizing device, the air pipe, and the solenoid valve, and the colloid in the needle tube flows out from the needle head under the combined action of the air pressure inside and outside the tube.

6. A method for controlling the amount of conductive adhesive applied to a microsystem, characterized in that: Using the device for controlling the amount of conductive adhesive applied to a microsystem as claimed in claim 1, the method comprises: S1, using a glue dispenser (1) to dispense glue dots (6) on a substrate (5); S2, using the glue volume measurement unit (2) to scan the volume of the glue dots, obtain the conductive glue volumes V1 to VN of the adjacent N glue dots, and take the real-time average value V avg Send to computer control system (4); S3, during the dispensing process, the air pressures P1 to PN of the N adjacent glue points counted by the time-pressure dispensing controller (3) are taken as the real-time average value P avg , sent to the computer control system (4); count the solenoid valve opening time T1~TN of N glue points, and take the real-time average value T avg , sent to the computer control system (4); S4. Use computer control system (4) to calculate V avg And the standard glue volume V for storage st The difference ΔV=|V st -V avg |, call up the conductive glue quantity-air pressure-time model V=F(T, P), and use the time-pressure dispensing controller (3) to adjust P avg and / or T avg Provide feedback and corrections; S5. For the remaining unfinished dispensing tasks, repeat S1 to S4 until the dispensing tasks are completed.

7. The method for controlling the amount of conductive adhesive applied to a microsystem as claimed in claim 6, characterized in that: The process of obtaining the volume of the conductive glue of any measured glue point (6) in S2 is as follows: Scanning the surface of the conductive adhesive by means of a laser array (7), using a laser triangulation method, and taking the focal plane as a reference plane to calculate the height difference between the conductive adhesive and the substrate, thereby obtaining the real-time adhesive amount of the measured adhesive point (6); Among them, V sum A volume value representing the real-time glue amount of the measured glue point (6); The large rectangular area scanned by the laser array (7) needs to completely cover the surface area of ​​the glue point (6) to be measured; the large rectangle is divided into a plurality of small rectangles, i and j represent the small rectangles located in the i-th row and the j-th column respectively; H i，j Two-dimensional matrix data representing the surface height of the measured glue point (6); H st represents the surface height of the substrate (5); (Δx ij , Δy ij ) represents the row spacing and column spacing when the laser array (7) is scanning.

8. The method for controlling the amount of conductive adhesive applied to a microsystem as claimed in claim 7, characterized in that: The height of any point on the surface of the measured glue point (6) relative to the focal plane is obtained as follows: A laser beam is used to illuminate the substrate (5) / the glue point (6) to be measured at a certain incident angle, and the laser is reflected on the surface of the substrate (5) / the glue point (6) to be measured. The reflected laser is focused into an image at another angle by using a receiving lens, and the light spot is imaged on a CCD image sensor; When the object to be measured is transformed from the substrate (5) to the measured glue point (6) along the laser direction, the light spot on the CCD image sensor moves, and its displacement x' corresponds to the axial movement distance x of the object to be measured, satisfying: Wherein, θ is the angle between the incident light and the outgoing light when the object to be measured is the measured glue point (6), a is the distance between the focus on the focal plane where the laser is aligned and the center of the receiving lens, and b is the vertical distance from the center of the receiving lens to the center of the front of the CCD image sensor.

9. The method for controlling the amount of conductive adhesive applied to a microsystem as claimed in claim 6, characterized in that: When the real-time glue quantity is inconsistent with the standard glue quantity, the computer control system (4) is used to calculate Among them, AP and ΔT represent the correction values ​​of dispensing air pressure and solenoid valve opening time respectively; λ is an empirical parameter ranging from 0 to 1; when λ=0, the valve opening time adjustment mode is executed by the time-pressure dispensing controller (3); when λ=1, the air pressure adjustment mode is executed; otherwise, the time-pressure adjustment mode is executed.

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