Silicon wafer turnover device and silicon wafer coating treatment system

Abstract

The present application belongs to the technical field of semiconductor manufacturing and solar photovoltaic cell manufacturing, and discloses a silicon wafer turnover device, which comprises a silicon wafer placing mechanism, the silicon wafer placing mechanism comprising a placing frame and a turnover frame, the turnover frame being turnably arranged in the placing frame and being used for fixing the silicon wafer; the device comprises a turnover mechanism, the output end of the turnover mechanism being connected with the turnover frame to turn the turnover frame; the device comprises a limiting mechanism, the limiting mechanism being connected with the turnover frame and the placing frame to limit the turnover frame before and after turnover. The silicon wafer coating treatment system comprises the above-mentioned silicon wafer turnover device, so that the silicon wafer placed on the turnover frame can be turned through the turnover mechanism, the turnover mechanism provides turnover power, and the limiting mechanism can limit the turnover frame before and after turnover, thereby avoiding the deviation of the turnover frame before and after turnover, and the combined action is that the placing frame does not need to be moved out of the processing process cavity to the conversion cavity to turn the silicon wafer, the setting of the conversion cavity is reduced, the setting of the mechanism is reduced, and thus the cost is reduced.

Description

Technical Field

[0001] This invention relates to the fields of semiconductor manufacturing and solar photovoltaic cell manufacturing technology, and in particular to a silicon wafer flipping device and a silicon wafer coating system. Background Technology

[0002] When using large silicon wafers to fabricate heterojunction solar cells and semiconductors, a very thin film of type I intrinsic amorphous silicon and a film of type P amorphous silicon are deposited on one side of textured N-type crystalline silicon using chemical vapor deposition (CVD). Thin films of type I intrinsic amorphous silicon and a film of type N amorphous silicon are deposited on the other side of the crystalline silicon. This requires the silicon wafer to be flipped between the P and N deposition processes. How to flip the silicon wafer on the carrier plate is crucial to improving deposition efficiency. Current production lines add a conversion chamber between the two processing steps for the flipping process. This method requires additional conversion chambers and multiple sets of equipment within them, resulting in a complex structure, numerous steps, and high cost. Summary of the Invention

[0003] The purpose of this invention is to provide a silicon wafer flipping device and a silicon wafer coating process system, which can achieve flipping without removing the silicon wafer from the processing chamber, reducing the need for conversion chambers and multiple sets of equipment, simplifying the structure and saving costs.

[0004] To achieve this objective, the present invention adopts the following technical solution:

[0005] The silicon wafer flipping device includes:

[0006] A silicon wafer placement mechanism, comprising a placement frame and a flipping frame, wherein the flipping frame is rotatably disposed within the placement frame and is used to fix the silicon wafer;

[0007] A flipping mechanism; the output end of the flipping mechanism is connected to the flipping frame, and the input end of the flipping mechanism can be connected to the output end of an external drive mechanism to flip the flipping frame.

[0008] A limiting mechanism is provided, which connects the flipping frame and the mounting frame to limit the flipping frame in one direction before and after flipping.

[0009] Preferably, the flipping mechanism includes a drive shaft, one end of which is connected to the outer end of the flipping frame. The drive shaft is provided with a drive gear, which can be connected to the output end of an external drive mechanism.

[0010] Preferably, the limiting mechanism has a first connecting part and a second connecting part. The first connecting part is connected to the flipping frame, and the second connecting part is connected to the placement frame. The first connecting part is provided with a first limiting part, and the second connecting part is provided with a second limiting part that cooperates with the first limiting part. When the first connecting part and the second connecting part rotate relative to each other, they are unidirectionally locked and limited by the first limiting part and the second limiting part.

[0011] Preferably, the first adapter and the second adapter are annular seats, each annular seat comprising two semi-annular seats connected end to end, wherein the height of the first end of any one semi-annular seat is higher than the height of its second end; the first end of any one semi-annular seat is connected to the second end of any other semi-annular seat to form the annular seat.

[0012] Preferably, the placement frame is provided with a first fixing plate, the second adapter is disposed on the first fixing plate, and the flip frame is provided with a protruding key, which passes through the first fixing plate and the first adapter in sequence and connects to the second adapter.

[0013] Preferably, the second adapter is connected to the frame of the mounting frame, which is parallel to the first fixing plate, by an elastic element.

[0014] Preferably, the flipping frame includes an active flipping frame and several driven flipping frames, the flipping mechanism is connected to the active flipping frame, and the driven flipping frames are connected to the active flipping frame through a linkage mechanism.

[0015] Preferably, the limiting mechanism is disposed on at least one of the driven flipping frames.

[0016] Preferably, the linkage mechanism includes a linkage, a rotating plate is provided on the linkage, the rotating plate is connected to the driven tilting frame through a transition shaft, the rotating plate is provided with a fixed shaft, and the rotating plate is connected to the driven tilting frame through the fixed shaft.

[0017] A silicon wafer coating processing system includes a vacuum chamber, in which a silicon wafer flipping device as described above is provided, and a spacing adjustment mechanism is also provided. The spacing adjustment mechanism is disposed in the vacuum chamber and has a carrier plate frame for hanging the mounting frame on the silicon wafer flipping device. A flipping output end of an external drive mechanism that matches the flipping mechanism is provided on the inner wall of the vacuum chamber.

[0018] Preferably, the system also includes a traveling mechanism, which includes a traveling rack that extends along the conveying direction of the mounting frame, a traveling gear that is matched on the traveling rack, and the traveling gear that is connected to the output end of an external traveling drive unit.

[0019] The beneficial effects of this invention are:

[0020] By setting a flipping frame, a flipping mechanism, and a limiting mechanism on the mounting frame, the silicon wafers mounted on the flipping frame can be flipped by the flipping mechanism. The flipping mechanism provides power during flipping, while the limiting mechanism can unidirectionally limit the flipping frame before and after flipping to prevent it from deviating. Together, they eliminate the need to move the mounting frame out of the processing cavity to the conversion cavity to flip the silicon wafers, reducing the number of conversion cavities and mechanisms required, thereby reducing costs. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the silicon wafer flipping device of the present invention located inside a vacuum cavity;

[0022] Figure 2 This is a schematic diagram of one angle of the silicon wafer flipping device of the present invention;

[0023] Figure 3 yes Figure 2 Enlarged view of point A in the middle;

[0024] Figure 4 This is a schematic diagram of the silicon wafer flipping device of the present invention from another angle;

[0025] Figure 5 yes Figure 4 Enlarged view at point B in the middle;

[0026] Figure 6 yes Figure 4 Enlarged view at point C;

[0027] Figure 7 This is a schematic diagram of the silicon wafer flipping device of the present invention when the first limiting part and the second limiting part are in the limiting position;

[0028] Figure 8 This is a schematic diagram showing the first limiting part and the second limiting part of the silicon wafer flipping device of the present invention separately;

[0029] Figure 9 This is a partial schematic diagram of the silicon wafer flipping device of the present invention installed in the coating process system.

[0030] In the picture:

[0031] 1-Silicon wafer placement mechanism; 11-Placement frame; 111-First fixing plate; 112-Second fixing plate; 12-Flipping frame; 121-Protruding key; 13-Fixing component; 2-Flipping mechanism; 21-Drive shaft; 22-Drive gear; 3-Restriction mechanism; 31-First adapter; 31a-First limiting part; 32-Second adapter; 32a-Second limiting part; 32b-Protruding cavity; 32c-Limiting surface; 33-Elastic component; 34-Sliding sleeve; 4-Linkage mechanism; 41-Linkage; 42-Adapter shaft; 43-Rotating plate; 44-Fixing shaft; 5-Vacuum chamber; 6-Adjustment mechanism; 61-Carrier frame; 7-Flipping output end; 8-Traveling mechanism; 81-Traveling gear; 82-Traveling rack. Detailed Implementation

[0032] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, and not all of the structures.

[0033] In the description of this invention, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0034] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0035] In the description of this embodiment, the terms "upper," "lower," "left," and "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention. In addition, the terms "first" and "second" are used only for distinction in description and have no special meaning.

[0036] like Figure 1-9 As shown, this embodiment provides a silicon wafer flipping device, which includes a silicon wafer placement mechanism 1, which includes a placement frame 11 and a flipping frame 12. The flipping frame 12 is rotatably disposed within the placement frame 11 and is used to fix the silicon wafer. The device also includes a flipping mechanism 2, the output end of which is connected to the flipping frame 12, and the input end of which can be connected to the output end of an external driving mechanism to flip the flipping frame 12. The device also includes a limiting mechanism 3, which is connected to the flipping frame 12 and the placement frame 11 to unidirectionally limit the flipping frame 12 before and after flipping.

[0037] By setting a flipping frame 12, a flipping mechanism 2, and a limiting mechanism 3 on the mounting frame 11, the silicon wafer mounted on the flipping frame 12 can be flipped by the flipping mechanism 2. The flipping mechanism provides power during flipping, while the limiting mechanism can unidirectionally limit the flipping frame 12 before and after flipping to prevent it from deviating before and after flipping. Together, they eliminate the need to move the mounting frame 11 out of the processing cavity to the conversion cavity to flip the silicon wafer, reducing the number of conversion cavities and mechanisms, thereby reducing costs.

[0038] This embodiment will be described in detail below, such as Figure 1 As shown, a silicon wafer flipping device is used to flip silicon wafers during silicon wafer coating. The silicon wafer flipping device includes a silicon wafer placement mechanism 1, which has a placement frame 11. In this embodiment, the placement frame 11 is a rectangular frame used to fix the silicon wafer to be coated. Specifically, the placement frame 11 is provided with a flipping frame 12 for fixing the silicon wafer. The flipping frame 12 is provided with a plurality of uniformly distributed fixing members 13 for fixing the silicon wafer, so that the silicon wafer can be flipped with the flipping frame 12. In this embodiment, the fixing members 13 can take various forms, such as snap-fit ​​members or adhesive members. This application does not limit the form of the fixing members 13.

[0039] like Figure 1 , 2As shown in Figure 3, the silicon wafer flipping device flips the flipping frame 12, which is set in the mounting frame 11, through the flipping mechanism 2 to drive the silicon wafer to flip. The output end of the flipping mechanism 2 is connected to the flipping frame 12, and the input end of the flipping mechanism 2 can be connected to the output end of the external drive mechanism to flip the flipping frame 12. Specifically, the mounting frame 11 is provided with a first fixing plate 111, which is parallel to the upper frame of the mounting frame 11 to facilitate the installation of the flipping frame 12 and to avoid flipping interference due to the different heights of the first fixing plate 111 when the flipping frame 12 is flipped. The flipping mechanism 2 includes a drive shaft 21, one end of which passes through the first fixing plate 111 and is connected to the outer end of the flipping frame 12. The drive shaft 21 is provided with a drive gear 22, which can be connected to the output end of the external drive mechanism to drive the flipping frame 12 to rotate when the drive gear rotates.

[0040] like Figure 1 , 4 As shown in Figures 5, 7, and 8, the silicon wafer flipping device also has a limiting mechanism 3, which connects the flipping frame 12 and the mounting frame 11 to limit the flipping frame 12 before and after flipping. Specifically, the limiting mechanism 3 has a first connecting part 31 and a second connecting part 32. In this embodiment, the second connecting part 32 is located above the first connecting part 31. The first connecting part 31 is connected to the flipping frame 12, and the second connecting part 32 is connected to the mounting frame 11. The first connecting part 31 is provided with a first limiting part 31a, and the second connecting part 32 is provided with a second limiting part 32a that cooperates with the first limiting part 31a. When the first connecting part 31 and the second connecting part 32 rotate relative to each other, they are unidirectionally locked and limited by the first limiting part 31a and the second limiting part 32a. The limiting operation can be achieved by the first connecting part 31 and the second connecting part 32 during the rotation of the flipping frame 12, simplifying the limiting device and process. More specifically, the first adapter 31 and the second adapter 32 are annular seats, each including two semi-annular seats connected end to end. The height of the first end of any semi-annular seat is higher than the height of its second end. In this embodiment, the first end of the semi-annular seat smoothly transitions to the second end to facilitate the adapter. The first end of any semi-annular seat is connected to the second end of any other semi-annular seat to form an annular seat. Two centrally symmetrical stepped limits are formed on the annular seat. In this embodiment, the first adapter 31 and the second adapter 32 are integrally molded. In other embodiments, the two semi-annular seats can also be connected by welding, plugging, or other methods. The first adapter 31 and the second adapter 32 form stepped limits on the annular seat through the height difference between the two ends of the semi-annular seats to form a snap-fit ​​and form a one-way limit for the adapter.

[0041] The second adapter 32 is disposed on the first fixed plate 111. The second adapter 32 has a protruding cavity 32b, and the flipping frame 12 has a protruding key 121. The protruding key 121 passes through the first fixed plate 111 and the first adapter 31 in sequence and extends into the protruding cavity 32b on the second adapter 32 to form an insertion fit. In this embodiment, the protruding key 121 and the inner wall of the protruding cavity 32b have limiting surfaces 32c, so that the second adapter 32 can be rotated when the protruding key 121 rotates. In this embodiment, the protruding cavity 32b is coaxial with the central hole of the second adapter 32 (i.e., the central hole of the annular seat) to facilitate the insertion fit. Before the flipping frame 12 flips, the first transition part 31 and the second transition part 32 are unidirectionally limited by a stepped limiter (i.e., the first limiter state). During the flipping, the protruding key 121 on the flipping frame 12 drives the second transition part 32 to rotate. The stepped limiter structure of the second transition part 32 rotates, and the relative position with the stepped limiter structure of the first transition part 31 changes (i.e., one of the steps of the second transition part 32 rotates from the first step of the first transition part 31 to the second step). After rotating 180 degrees, the second transition part 32 moves towards the first transition part 31 (due to gravity). The centrally symmetrical stepped limiter structure recombines to form a unidirectional limiter position (i.e., the second limiter state). At this time, the flipping frame 12 is rotated 180 degrees to complete the flipping.

[0042] Furthermore, the second adapter 32 is connected to the frame of the mounting frame 11 parallel to the first fixing plate 111 by an elastic member 33. Specifically, one end of the elastic member 33 is connected to the outer wall of the protruding cavity 32b, and the other end of the elastic member 33 is connected to the mounting frame 11. During the adapter process, as the second adapter 32 rotates relative to the first adapter 31, the height of the stepped limit on the surface will cause the second adapter 32 to be lifted up, thereby compressing the elastic member 33. After the rotation is completed, the height of the second adapter 32 returns to the initial position to press against the second adapter 32 to prevent it from shaking when not rotating. In this embodiment, the elastic member 33 is a compression spring. In other embodiments, compressible elastic members such as elastic rubber can also be used. It also includes a sliding sleeve 34. Specifically, one end of the sliding sleeve 34 is fixed to the mounting frame 11, and the elastic element 33 is disposed inside the sliding sleeve 34. On the one hand, during compression, the elastic element 33 is compressed along the vertical direction to avoid positional displacement during compression deformation, thereby preventing the flipping frame 12 from shifting during flipping. On the other hand, the sliding sleeve 34 can also protect the elastic element 33 and extend its service life.

[0043] like Figure 1 , 2As shown in Figures 4 and 5, the flipping frame 12 further includes an active flipping frame and several driven flipping frames. The drive shaft 21 of the flipping mechanism 2 is connected to the active flipping frame, and the limiting mechanism 3 is provided on at least one driven flipping frame. In this embodiment, the driven flipping frames and the active flipping frames are evenly spaced, and each driven flipping frame is provided with a limiting mechanism 3. The driven flipping frames are connected to the active flipping frame through a linkage mechanism 4, so that they can drive other flipping plates to rotate while one is flipping, simplifying the flipping steps and facilitating the flipping operation. Specifically, a second fixing plate 112 is provided inside the mounting frame 11. The second fixing plate 112 is arranged opposite to the first fixing plate 111. Both the active and passive tilting frames have a fixed shaft 44. In this embodiment, the second fixing plate 112 has a bearing sleeve. The fixed shaft 44 passes through the bearing sleeve of the second fixing plate 112 and connects to the first end of the rotating plate 43. The second end of the rotating plate 43 is connected to a transition shaft 42. The transition shaft 42 is connected to the connecting rod 41. When the active tilting frame rotates, the active tilting frame drives the rotating plate 43 set on the fixed shaft 44 to rotate. This drives the connecting rod 41 connected to the transition shaft 42 to move through the transition shaft 42. The connecting rod 41 feeds back to the transition shaft 42 connected to the passive tilting frame. Then, the rotating plate 43 and the fixed shaft 44 set on the passive tilting frame drive the passive tilting frame to rotate to achieve synchronous rotation.

[0044] like Figure 1 and 9 As shown, this embodiment also includes a silicon wafer coating processing system, including a vacuum chamber 5. The vacuum chamber 5 is equipped with the silicon wafer flipping device as described above to achieve the flipping of the silicon wafer. The system also includes a spacing adjustment mechanism 6, which is set in the vacuum chamber 5. The spacing adjustment mechanism 6 is equipped with a carrier plate frame 61 for hanging the mounting frame 11 on the silicon wafer flipping device. The inner wall of the vacuum chamber 5 is provided with a flipping output end 7 of an external drive mechanism that matches the transmission gear 22 of the flipping mechanism 2. In this embodiment, the flipping output end is an output rack. Specifically, the number of teeth of the output rack is exactly half the number of teeth of the transmission gear 22, so that the transmission gear 22 can rotate half a shaft (180 degrees), thereby driving the flipping frame 12 to rotate exactly 180 degrees. There is no need to accurately calculate and control the number of rotations of the transmission gear 22, which facilitates operation. Furthermore, it also includes a walking mechanism 8, which includes a walking rack 82 that extends along the conveying direction of the mounting frame 11. In this embodiment, it is arranged along the upper frame of the mounting frame 11. The walking rack 82 is matched with a walking gear 81, which is connected to the output end of the external walking drive unit to facilitate the conveying of the flipping frame 12 set on the mounting frame 11. On the one hand, it reduces the manual conveying and saves manpower. On the other hand, it can also disengage the transmission gear 22 from the output rack to avoid the two being in a meshing state after the flipping frame 12 has been reversed, thus avoiding damage during movement.

[0045] The working process of the silicon wafer coating system and silicon wafer flipping device:

[0046] The silicon wafer is fixed in the flipping frame 12 on the mounting frame 11 by the fixing member 13. The mounting frame 11 is placed into the carrier frame 61 on the adjusting mechanism 6 in the vacuum chamber 5. The mounting frame 11 is transported to the processing position by the traveling mechanism 8 on the mounting frame 11 and the external traveling drive unit. The position of the carrier is adjusted by the adjusting mechanism 6 to process the first side of the silicon wafer. After processing, the adjusting mechanism 6 adjusts the position of the mounting frame 11 so that the mounting frame 11 is close to the output rack located on the wall of the vacuum chamber 5, so that the output rack meshes with the transmission gear 22. The output drives the transmission gear 22 on the active silicon wafer flipping device to rotate, which in turn drives the active flipping frame to rotate. This, in turn, drives the driven flipping frame to flip synchronously via the connecting rod 41. The limiting mechanism 3 provides unidirectional limit to the flipping frame 12 before and after flipping. After the rotation is completed, the traveling mechanism 8 controls the placement frame 11 to move back a certain position so that the output rack and transmission gear 22 are no longer meshed. Then, the adjusting mechanism 6 adjusts the position so that the placement frame 11 returns to the processing position to complete the double-sided coating of the silicon wafer. After completion, the traveling mechanism 8 transfers the wafer to the next process chamber. This cycle can then be repeated, thus enabling the silicon wafer to be flipped directly in the processing chamber, reducing an intermediate conversion chamber and multiple sets of drive equipment, reducing the space required for the equipment, and saving costs.

[0047] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the implementation of the present invention. Those skilled in the art will be able to make various obvious changes, readjustments, and substitutions without departing from the scope of protection of the present invention. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the claims of the present invention.

Claims

1. A silicon wafer flipping device, characterized in that, include: A silicon wafer placement mechanism (1) includes a placement frame (11) and a flipping frame (12), wherein the flipping frame (12) is flipped and disposed within the placement frame (11) and is used to fix the silicon wafer; A flipping mechanism (2) is provided, the output end of which is connected to the flipping frame (12), and the input end of which can be connected to the output end of an external drive mechanism to flip the flipping frame (12). A limiting mechanism (3) is connected to the flipping frame (12) and the placement frame (11) to limit the flipping frame (12) in one direction before and after flipping. The limiting mechanism (3) has a first connecting part (31) and a second connecting part (32). The first connecting part (31) is connected to the flipping frame (12), and the second connecting part (32) is connected to the placement frame (11). The first connecting part (31) is provided with a first limiting part (31a), and the second connecting part (32) is provided with a second limiting part (32a) that cooperates with the first limiting part (31a). When the first connecting part (31) and the second connecting part (32) rotate relative to each other, they are unidirectionally locked and limited by the first limiting part (31a) and the second limiting part (32a). The first adapter (31) and the second adapter (32) are ring seats. The ring seat includes two semi-ring seats connected end to end. The height of the first end of any semi-ring seat is higher than the height of its second end. The first end of any semi-ring seat is connected to the second end of any other semi-ring seat to form the ring seat.

2. The silicon wafer flipping device according to claim 1, characterized in that, The flipping mechanism (2) includes a drive shaft (21), one end of which is connected to the outer end of the flipping frame (12). A drive gear (22) is provided on the drive shaft (21), and the drive gear (22) can be connected to the output end of an external drive mechanism.

3. The silicon wafer flipping device according to claim 1, characterized in that, The placement frame (11) is provided with a first fixing plate (111), and the second adapter (32) is provided on the first fixing plate (111). The flipping frame (12) is provided with a protruding key (121), and the protruding key (121) passes through the first fixing plate (111) and the first adapter (31) in sequence and connects to the second adapter (32).

4. The silicon wafer flipping device according to claim 3, characterized in that, The second adapter (32) is connected to the frame of the mounting frame (11) which is parallel to the first fixing plate (111) by an elastic member (33).

5. The silicon wafer flipping device according to any one of claims 1-4, characterized in that, The flipping frame (12) includes an active flipping frame and several passive flipping frames. The flipping mechanism (2) is connected to the active flipping frame, and the passive flipping frames are connected to the active flipping frame through a linkage mechanism (4).

6. The silicon wafer flipping device according to claim 5, characterized in that, The limiting mechanism (3) is disposed on at least one of the driven flipping frames.

7. The silicon wafer flipping device according to claim 5, characterized in that, The linkage mechanism (4) includes a link (41), a rotating plate (43) is provided on the link (41), the rotating plate (43) is connected to the driven tilting frame through a transition shaft (42), the rotating plate (43) is provided with a fixed shaft (44), and the rotating plate (43) is connected to the driven tilting frame through the fixed shaft (44).

8. A silicon wafer coating system, characterized in that, The device includes a vacuum chamber (5), which is equipped with a silicon wafer flipping device as described in any one of claims 1-7, and also includes a spacing adjustment mechanism (6). The spacing adjustment mechanism (6) is disposed in the vacuum chamber (5), and the spacing adjustment mechanism (6) is provided with a carrier frame (61) for hanging the mounting frame (11) on the silicon wafer flipping device. The inner wall of the vacuum chamber (5) is provided with a flipping output end (7) of an external driving mechanism that matches the flipping mechanism (2).

9. The silicon wafer coating system according to claim 8, characterized in that, It also includes a walking mechanism (8), which includes a walking rack (82) that extends along the conveying direction of the mounting frame (11), and a walking gear (81) that is matched on the walking rack (82) and is connected to the output end of an external walking drive unit.

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