Substrate loading system

Abstract

The present invention relates to substrate loading systems, to methods, systems and apparatuses for substrate transfer, including positioning a tray handler device in a first position wherein i) a cutout of a hole of a first tray overlaps a respective pedestal of a pedestal platform, and ii) a distal end of the pedestal extends away from a top surface of the first tray; increasing a distance between the top surface of the first tray and a top surface of the pedestal platform to transfer a first substrate from the pedestal to a tab defined by the hole of the first tray, while engaging a second tray handler with a second tray; and increasing a distance between a top surface of the second tray and a bottom surface of a chuck to transfer a second substrate from the chuck to a tab defined by the second tray.

Description

[0001] This application is a divisional application of patent application number 201780067080.4, the original application of which was filed on September 27, 2017, entitled "Substrate Loading System".

[0002] Cross Reference to Related Applications

[0003] This application claims the benefit of the filing date of U.S. Provisional Application No. 62 / 416,916, filed November 3, 2016. The entire contents of U.S. Application No. 62 / 416,916 are hereby incorporated by reference. TECHNICAL FIELD

[0004] The present invention relates to loading substrates / substrates such as semiconductor wafers in systems and methods involving microlithography and similar nanofabrication techniques. BACKGROUND

[0005] Nanofabrication involves the fabrication of very small structures having features on the order of 100 nanometers or less. One application in which nanofabrication has had considerable impact is the processing of integrated circuits. The semiconductor processing industry continues to strive for greater throughput while increasing the number of circuits formed per unit area on a substrate, thus nanofabrication becomes increasingly important. Nanofabrication provides better process control while allowing the continued reduction of the minimum feature size of the structures formed. Other areas of research and development in which nanofabrication has been employed include biotechnology, optical technology, mechanical systems, etc.

[0006] However, transporting substrates among different modules of a nanofabrication system affects the throughput of the system. Improving the transport of substrates can reduce the loading / unloading time of substrates and increase the throughput, which is desirable. SUMMARY

[0007] Innovative aspects of the subject matter described in this specification can be embodied in a method that includes the actions of providing a tray handler apparatus including a first tray handler positioned opposite a second tray handler; providing a first tray and a second tray, each of the first tray and the second tray defining a hole and each tray having a top surface, each hole defining at least two cutouts and two tabs; providing a substrate chuck having a top surface and a bottom surface; engaging the first tray handler with the first tray; positioning the tray handler apparatus in a first position, wherein i) the cutouts of the hole of the first tray overlap respective pedestals of the pedestal platform, and ii) distal ends of the pedestals extend away from the top surface of the first tray; increasing a distance between the top surface of the first tray and the top surface of the pedestal platform to transfer a first substrate from the pedestals to the tabs defined by the hole of the first tray while engaging the second tray handler with the second tray; increasing a distance between the top surface of the second tray and the bottom surface of the substrate chuck to transfer a second substrate from the substrate chuck to the tabs defined by the second tray; rotating the tray handler apparatus from the first position to a second position, wherein i) the tabs defined by the hole of the first tray overlap respective channels of the substrate chuck, and ii) the cutouts of the hole of the second tray overlap respective pedestals; decreasing the distance between the top surface of the first tray and the bottom surface of the substrate chuck to transfer the first substrate from the tabs defined by the hole of the first tray to the top surface of the substrate chuck while disposing the tabs defined by the hole of the first tray within the respective channels of the substrate chuck; and disengaging the first tray handler from the first tray while decreasing the distance between the top surface of the second tray and the top surface of the pedestal platform to transfer the second substrate from the tabs defined by the hole of the second tray to the pedestals.

[0008] Other embodiments of these aspects include corresponding systems, apparatus, and computer programs.

[0009] These and other embodiments can each optionally include one or more of the following features. For example, removing the second substrate positioned on the pedestal; positioning a third substrate on the pedestal; and after engaging the first tray handler with the first tray, forming a pattern in the material positioned on the first substrate while the first substrate is positioned on the substrate chuck, and coupling the first tray with the substrate chuck. After forming the pattern in the material positioned on the first substrate, engaging the first tray handler with the first tray while increasing a distance between a top surface of the second tray and a top surface of the pedestal platform to transfer the third substrate from the pedestal to a tab defined by a hole of the second tray. After engaging the first tray handler with the first tray, increasing a distance between a top surface of the first tray and a bottom surface of the substrate chuck to transfer the first substrate from the substrate chuck to a tab defined by the first tray. After increasing the distance between the top surface of the first tray and the bottom surface of the substrate chuck, rotating the tray handler device from the second position to the first position, where a cutout of the hole of the first tray overlaps a corresponding pedestal of the pedestal platform. Decreasing the distance between the top surface of the first tray and the top surface of the pedestal platform to transfer the first substrate from the tab defined by the hole of the first tray to the pedestal. Decreasing the distance between the top surface of the second tray and the bottom surface of the substrate chuck to transfer the third substrate from the tab defined by the hole of the second tray to a top surface of the substrate chuck while disposing the tab defined by the hole of the second tray within a corresponding channel of the substrate chuck. Before transferring the second substrate from the substrate chuck to the tab defined by the second tray, the second substrate includes a patterned layer positioned thereon.

[0010] Innovative aspects of the subject matter described in this specification can be embodied in a system that includes two or more pedestals of a pedestal platform; a substrate chuck having a top surface and a bottom surface and including channels; a first tray and a second tray, each of the first and second trays defining a hole and each tray having a top surface, each hole defining at least two cutouts and two tabs; a tray handler device including a first tray handler positioned opposite a second tray handler, the first tray handler engageable with the first tray and the second tray handler engageable with the second tray, the tray handlers rotatable between a first position and a second position, the first position such that i) the cutouts of the hole of the first tray overlap respective pedestals of the pedestal platform, and ii) distal ends of the pedestals extend away from the top surface of the first tray, the second position such that i) the tabs defined by the hole of the first tray overlap respective channels of the substrate chuck, and ii) the cutouts of the hole of the second tray overlap respective pedestals; and an actuator system to, when the tray handler device is in the first position, i) increase a distance between the top surface of the first tray and a top surface of the pedestal platform to transfer a first substrate from the pedestals to the tabs defined by the hole of the first tray while the second tray handler is engaged with the second tray, and ii) increase a distance between the top surface of the second tray and the bottom surface of the substrate chuck to transfer a second substrate from the substrate chuck to the tabs defined by the second tray, and when the tray handlers are in the second position, i) decrease a distance between the top surface of the first tray and the bottom surface of the substrate chuck to transfer the first substrate from the tabs defined by the hole of the first tray to the top surface of the substrate chuck while the tabs defined by the hole of the first tray are disposed within respective channels of the substrate chuck, and ii) decrease a distance between the top surface of the second tray and the top surface of the pedestal platform to transfer the second substrate from the tabs defined by the hole of the second tray to the pedestals while the first tray handler is disengaged from the first tray.

[0011] Other embodiments of these aspects include corresponding methods.

[0012] These and other embodiments can each optionally include one or more of the following features. For example, the system includes a rotation system to rotate the tray handler device between the first position and the second position. The system includes a patterning system to form a pattern in the first substrate while the first substrate is on the top surface of the substrate chuck. The actuator system includes a first actuator module that increases a distance between the top surface of the first tray and the top surface of the pedestal platform when the tray handler device is in the first position to transfer the first substrate from the pedestal to the tab defined by the aperture of the first tray while engaging the second tray handler with the second tray and decreases the distance between the top surface of the first tray and the bottom surface of the substrate chuck when the tray handler device is in the second position to transfer the first substrate from the tab defined by the aperture of the first tray to the top surface of the substrate chuck while the tab defined by the aperture of the first tray is disposed within the corresponding channel of the substrate chuck. The actuator system includes a second actuator module that increases a distance between the top surface of the second tray and the bottom surface of the substrate chuck when the tray handler is in the first position to transfer the second substrate from the substrate chuck to the tab defined by the second tray and decreases the distance between the top surface of the second tray and the top surface of the pedestal platform when the tray handler is in the second position and when the tray handler device is in the second position to transfer the second substrate from the tab defined by the aperture of the second tray to the pedestal while disengaging the first tray handler from the first tray.

[0013] Particular embodiments of the subject matter described in this specification can be implemented so as to realize one or more of the following advantages. Embodiments of the present application can improve the transport of substrates, thereby reducing the load / unload time of substrates and increasing throughput.

[0014] The details of one or more embodiments of the subject matter described in this specification are set forth in the accompanying drawings and the description below. Other potential features, aspects, and advantages of the subject matter will become apparent from the description, the drawings, and the claims. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 A simplified side view of a lithography system is shown.

[0016] Figure 2 A simplified side view of a substrate with a pattern layer thereon is shown.

[0017] Figure 3 A perspective view of a substrate loading system including a tray handler device is shown.

[0018] Figure 4 A top view of a portion of a tray handler device is shown.

[0019] Figure 5 A side view of a substrate chuck is shown.

[0020] Figure 6 A side view of a substrate loading system is shown.

[0021] Figures 7A-7L A simplified side view of a substrate loading system is shown, including loading and unloading substrates to and from pedestals and substrate chucks.

[0022] Figure 8 An exemplary method for loading and unloading substrates to and from pedestals and substrate chucks is shown. DETAILED DESCRIPTION

[0023] Methods and systems are described herein that provide for loading and unloading substrates to and from pedestals and substrate chucks. In particular, a tray handler device is provided that includes a first tray handler positioned opposite a second tray handler. A first tray and a second tray are provided, each of the first and second trays defining a hole and each having a top surface, each hole defining at least two cutouts and two tabs. A substrate chuck is provided having a top surface and a bottom surface. The first tray handler is engaged with the first tray. The tray handler device is positioned in a first position, where i) the cutouts of the hole of the first tray overlap respective pedestals of a pedestal platform, and ii) distal ends of the pedestals extend away from the top surface of the first tray. A distance between the top surface of the first tray and the top surface of the pedestal platform is increased to transfer a first substrate from the pedestals to the tabs defined by the hole of the first tray, while the second tray handler is engaged with the second tray. A distance between the top surface of the second tray and the bottom surface of the substrate chuck is increased to transfer a second substrate from the substrate chuck to the tabs defined by the second tray.

[0024] The tray handler device is rotated from the first position to a second position, where i) the tabs defined by the hole of the first tray overlap respective channels of the substrate chuck, and ii) the cutouts of the hole of the second tray overlap respective pedestals. A distance between the top surface of the first tray and the bottom surface of the substrate chuck is decreased to transfer the first substrate from the tabs defined by the hole of the first tray to the top surface of the substrate chuck, while the tabs defined by the first tray are disposed within the respective channels of the substrate chuck. The first tray handler is disengaged from the first tray, while a distance between the top surface of the second tray and the top surface of the pedestal platform is decreased to transfer the second substrate from the tabs defined by the hole of the second tray to the pedestals.

[0025] Figure 1An imprint lithography system 100 is shown forming a relief pattern on a substrate 102. The substrate 102 can be coupled to a substrate chuck 104. In some examples, the substrate chuck 104 can include a vacuum chuck, a pin-type chuck, a slot-type chuck, an electromagnetic chuck, or the like. In some examples, the substrate 102 and the substrate chuck 104 can also be located on an air bearing 106. The air bearing 106 provides motion about the x, y, and / or z axes. In some examples, the substrate 102 and the substrate chuck 104 are located on a stage. The air bearing 106, the substrate 102, and the substrate chuck 104 can also be located on a base 108. In some examples, a robotic system 110 positions the substrate 102 on the substrate chuck 104.

[0026] The imprint lithography system 100 also includes an imprint lithography flexible template 112 coupled to one or more rollers 114, depending on design considerations. The rollers 114 provide motion of at least a portion of the flexible template 112. This motion can selectively provide different portions of the flexible template 112 to overlap the substrate 102. In some examples, the flexible template 112 includes a patterned surface that includes a plurality of features (parts), such as spaced apart grooves and protrusions. However, other configurations of features are possible in some examples. The patterned surface can define any original pattern that forms the basis of a pattern to be formed on the substrate 102. In some examples, the flexible template 112 can be coupled to a template chuck, such as a vacuum chuck, a pin-type chuck, a slot-type chuck, an electromagnetic chuck, or the like.

[0027] The imprint lithography system 100 can also include a fluid dispensing system 120. The fluid dispensing system 120 can be used to deposit a polymerizable material on the substrate 102. The polymerizable material can be positioned on the substrate 102 using techniques such as drop dispensing, spin coating, dip coating, chemical vapor deposition (CVD), physical vapor deposition (PVD), thin film deposition, thick film deposition, or the like. In some examples, the polymerizable material is positioned on the substrate 102 as a plurality of drops.

[0028] Referring to Figure 1 and 2 The imprint lithography system 100 can also include an energy source 122 coupled to direct energy toward the substrate 102. In some examples, the rollers 114 and the air bearing 106 are configured to position the desired portions of the flexible template 112 and the substrate 102 in a desired position. The imprint lithography system 100 can be regulated by an operator in communication with the air bearing 106, the rollers 114, the fluid dispensing system 120, and / or the energy source 122, and can operate on computer readable programs stored in a memory.

[0029] In some examples, the roller 114, the air bearing 106, or both, change a distance between the flexible template 112 and the substrate 102 to define a desired volume therebetween to be filled with the polymerizable material. For example, the flexible template 112 contacts the polymerizable material. After the desired volume is filled with the polymerizable material, the energy source 122 generates energy, such as broadband ultraviolet radiation, to cure and / or crosslink the polymerizable material to conform to a shape of a portion of the surface of the substrate 102 and the patterned surface of the flexible template 112 to define a pattern layer 150 on the substrate 102. In some examples, the pattern layer 150 can include a residual layer 152 and a plurality of features shown as protrusions 154 and recesses 156.

[0030] Figure 3 A perspective view of a substrate loading system 302 is shown. Briefly, the substrate loading system 302 facilitates loading and unloading of substrates to and from one or more stations (e.g., pedestals and / or substrate chucks). The substrate loading system 302 includes a tray handler apparatus 304 that includes a first tray handler 306 positioned opposite a second tray handler 308. In some examples, the first tray handler 306 and the second tray handler 308 can include one or more arms 309.

[0031] The substrate loading system 302 also includes a first tray 310 and a second tray 312. The first tray 310 and the second tray 312 each have top surfaces 314, 316. Further, the first tray 310 defines holes 318a, 318b, 318c, 318d (collectively, holes 318) and the second tray 312 defines holes 320a, 320b, 320c, 320d (collectively, holes 320). However, the first tray 310 and the second tray 312 can define any number of holes. Each hole 318, 320 defines a cutout and a tab. Specifically, Figure 4 A top view of one of the holes 318, 320 is shown that includes cutouts 322a, 322b, 322c, 322d (collectively, cutouts 322) and tabs 324a, 324b, 324c, 324d (collectively, tabs 324). However, each of the holes 318, 320 can include any number of cutouts 322 and tabs 324. In some examples, the tabs 324 include a high-friction material thereon, such as (available from The Chemours Company), (available from DuPont TM ) or (available from Freudenberg Sealing Technologies).

[0032] The substrate loading system 302 also includes substrate chucks 326a, 326b, 326c, 326d (collectively, substrate chucks 326); however, the system 302 can include any number of substrate chucks 326. Figure 5 A side view of one of the substrate chucks 326 is shown. The substrate chucks 326 include a top surface 328 positioned opposite a bottom surface 330. The substrate chucks 326 also include channels 332 positioned at a periphery of each substrate chuck 326. In some examples, the number of channels 332 matches the number of tabs 324 for a particular hole 318, 320. The substrate loading system 302 also includes a susceptor platform 334 that includes Figure 6 A plurality of susceptor 336 extending from a top surface 337 is shown. In some examples, a first subset of the susceptor 336 can be associated with a first height and a second subset of the susceptor 336 can be associated with a second height.

[0033] Referring to Figure 6 , a side view of the substrate loading system 302 is shown. The substrate loading system 302 also includes an actuator system 340 and a rotation system 342. In some examples, the actuator system 340 includes a first actuator module 341 and a second actuator module 343. The actuator system 340 increases and / or decreases a relative positioning of the tray handler device 304, specifically the first tray handler 306 and the second tray handler 308, relative to the substrate chucks 326 and the susceptor 336. The rotation system 342 rotates the tray handler device 304 relative to an axis 344. The substrate loading system 302 also includes an air bearing 350 and a support structure 352. In some examples, the air bearing 350 facilitates movement of the substrate chucks 326 about the support structure 352.

[0034] Referring to Figures 7A-7L , the substrate loading system 302 is shown facilitating loading and unloading of substrates to and from the susceptor 336 and the substrate chucks 326. Specifically, in some embodiments, as Figure 7A shown, the first tray handler 306 engages with the first tray 310. In some examples, the first tray handler 306 engaging with the first tray 310 can include coupling the first tray handler 306 and the first tray 310. In some examples, the arm 309 of the first tray handler 306 engages with the first tray 310 at a periphery of the first tray 310.

[0035] In some embodiments, the substrate loading system 302 positions the tray manipulator device 304 in a first position. In some examples, positioning the tray manipulator device 304 in the first position includes aligning the cutout 322 of each hole 318 of the first tray 310 with the corresponding base 336 of the base platform 334. In some examples, positioning the tray manipulator device 304 in the first position includes extending the distal end 354 of each base 336 away from the top surface 314 of the first tray 310.

[0036] In some implementation schemes, such as Figure 7B As shown, actuator module 341 increases the distance between the top surface 314 of the first tray 310 and the top surface 337 of the base platform 334. In some examples, increasing the distance between the top surface 314 of the first tray 310 and the top surface 337 of the base platform 334 includes transferring a first substrate 360 ​​positioned on the base 336 to a tab 324 defined by a hole 318 in the first tray 310. In some examples, transferring the first substrate 360 ​​positioned on the base 336 to the tab 324 defined by the hole 318 in the first tray 310 includes transferring the first substrate 360 ​​positioned on the base 336 to the tab 324 defined by the hole 318 in the first tray 310 while the second tray operator 308 engages with the second tray 312. In some examples, engaging the second tray operator 308 with the second tray 312 may include coupling the second tray operator 308 and the second tray 312. In some examples, the arm 309 of the second tray operator 308 engages with the second tray 312 at the periphery of the second tray 312.

[0037] In some examples, contact with the first substrate 360 ​​is minimized by transferring the first substrate 360 ​​to the tab 324 defined by the aperture 318 of the first tray 310. That is, contact between the first substrate 360 ​​and the tab 324 is minimized by ensuring that the first substrate 360 ​​contacts only the tab 324 defined by the aperture 318 of the first tray 310. For example, minimizing contact with the first substrate 360 ​​via the tab 324 minimizes the introduction of potential defects into the first substrate 360 ​​and minimizes particulate contamination of the first substrate 360 ​​by the tray manipulator device 304.

[0038] In some implementation schemes, such as Figure 7CAs shown, the actuator module 343 increases the distance between the top surface 316 of the second tray 312 and the bottom surface 330 of the substrate chuck 326. In some examples, increasing the distance between the top surface 316 of the second tray 312 and the bottom surface 330 of the substrate chuck 326 includes transferring the second substrate 362 positioned on the substrate chuck 326 to the tab 324 defined by the hole 320 of the second tray 312. In some examples, the second substrate 362 includes a pattern layer 351 positioned thereon prior to transferring the second substrate 362 from the substrate chuck 326 to the tab 324 defined by the hole 320 of the second tray 312.

[0039] In some implementations, as shown in FIG. 3A, the substrate processing system 300 includes a substrate transfer system 302. The substrate transfer system 302 includes a first tray 310, a second tray 312, a substrate chuck 326, and a substrate transfer system 342. The substrate transfer system 342 is configured to rotate the first tray 310 and the second tray 312 about an axis 344. In some examples, the substrate transfer system 342 is configured to rotate the first tray 310 and the second tray 312 about the axis 344 to position the first tray 310 and the second tray 312 in a first position and a second position, respectively. Figure 7D As shown, the rotation system 342 rotates the tray handler device 304 from the first position to the second position. Specifically, the rotation system 342 rotates the tray handler device 304 about the axis 344 such that the tray handler device 304 is in the second position. In some examples, positioning the tray handler device 304 in the second position includes overlapping the tab 324 defined by the hole 318 of the first tray 310 with the channel 332 of the substrate chuck 326. In some examples, positioning the tray handler device 304 in the second position includes overlapping the cutout 322 of each hole 320 of the second tray 312 with a respective pedestal 336 of the pedestal platform 334.

[0040] In some implementations, as shown in FIG. 3A, the substrate processing system 300 includes a substrate transfer system 302. The substrate transfer system 302 includes a first tray 310, a second tray 312, a substrate chuck 326, and a substrate transfer system 342. The substrate transfer system 342 is configured to rotate the first tray 310 and the second tray 312 about an axis 344. In some examples, the substrate transfer system 342 is configured to rotate the first tray 310 and the second tray 312 about the axis 344 to position the first tray 310 and the second tray 312 in a first position and a second position, respectively. Figure 7E As shown, the rotation system 342 rotates the tray handler device 304 from the first position to the second position. Specifically, the rotation system 342 rotates the tray handler device 304 about the axis 344 such that the tray handler device 304 is in the second position. In some examples, positioning the tray handler device 304 in the second position includes overlapping the tab 324 defined by the hole 318 of the first tray 310 with the channel 332 of the substrate chuck 326. In some examples, positioning the tray handler device 304 in the second position includes overlapping the cutout 322 of each hole 320 of the second tray 312 with a respective pedestal 336 of the pedestal platform 334.

[0041] In some implementations, as shown in FIG. 3A, the substrate processing system 300 includes a substrate transfer system 302. The substrate transfer system 302 includes a first tray 310, a second tray 312, a substrate chuck 326, and a substrate transfer system 342. The substrate transfer system 342 is configured to rotate the first tray 310 and the second tray 312 about an axis 344. In some examples, the substrate transfer system 342 is configured to rotate the first tray 310 and the second tray 312 about the axis 344 to position the first tray 310 and the second tray 312 in a first position and a second position, respectively. Figure 7FAs shown, the first tray operator 306 disengages from the first tray 310. That is, disengaging the first tray operator 306 from the first tray 310 may include separating the first tray operator 306 from the first tray 310. In some examples, the arm 309 of the first tray operator 306 disengages from the first tray 310 at its periphery. In some examples, the first tray operator 306 disengages from the first tray 310 while the actuator module 343 reduces the distance between the top surface 316 of the second tray 312 and the top surface 337 of the base platform 334. In some examples, reducing the distance between the top surface 316 of the second tray 312 and the top surface 337 of the base platform 334 includes transferring a second substrate 362 positioned on a tab 324 defined by a hole 320 in the second tray 312 to the base 336.

[0042] In some examples, after the first tray operator 306 disengages from the first tray 310, the pattern forming system—for example, such as... Figure 1 As shown, a pattern is formed in the first substrate 360 ​​(or in a layer located on the first substrate 360). Specifically, the air bearing 350 facilitates the movement of the substrate chuck 326 about the support structure 352 in a direction away from the tray operator device 304 and toward the pattern forming system (not shown).

[0043] In some implementation schemes, such as Figure 7G As shown, a robot system (not shown) removes a second substrate 362 positioned on a base 336. In some examples, the robot system (not shown) positions a third substrate 364 on the base 336. In some examples, after the first tray manipulator 304 disengages from the first tray 310, a patterning system (not shown) forms a patterned layer 370 on the first substrate 360, while the first substrate 360 ​​is positioned on a substrate chuck 326 and the first tray 310 is coupled to the substrate chuck 326.

[0044] In some implementation schemes, such as Figure 7HAs shown, after the patterning system (not shown) forms the patterned layer 370 on the first substrate 360, the first tray handler 306 engages with the first tray 310. In some examples, the first tray handler 306 engaging with the first tray 310 can include coupling the first tray handler 306 and the first tray 310. In some examples, the arm 309 of the first tray handler 306 engages with the first tray 310 at a perimeter of the first tray 310. In some examples, while the first tray handler 306 is engaged with the first tray 310, the actuator module 343 increases a distance between the top surface 316 of the second tray 312 and the top surface 337 of the base platform 334. In some examples, increasing the distance between the top surface 316 of the second tray 312 and the top surface 337 of the base platform 334 includes transferring the third substrate 364 positioned on the pedestal 336 to the tab 324 defined by the aperture 320 of the second tray 312.

[0045] In some embodiments, as Figure 7I As shown, after the first tray handler 306 engages with the first tray 310, the actuator module 341 increases a distance between the top surface 314 of the first tray 310 and the bottom surface 330 of the substrate chuck 326. In some examples, increasing the distance between the top surface 314 of the first tray 310 and the bottom surface 330 of the substrate chuck 326 includes transferring the first substrate 360 positioned on the substrate chuck 326 to the tab 324 defined by the aperture 318 of the first tray 310.

[0046] In some embodiments, as Figure 7J As shown, after the actuator module 341 increases the distance between the top surface 314 of the first tray 310 and the bottom surface 330 of the substrate chuck 326, the rotation system 342 rotates the tray handler device 304 from the second position to the first position. Specifically, the rotation system 342 rotates the tray handler device 304 about the axis 344 such that the tray handler device 304 is in the first position. In some examples, positioning the tray handler device 304 in the first position includes superimposing the cutout 322 of the aperture 318 of the first tray 310 with the corresponding pedestal 336 of the base platform 334.

[0047] In some embodiments, as Figure 7K As shown, the actuator module 341 decreases a distance between the top surface 314 of the first tray 310 and the top surface 337 of the base platform 334. In some examples, decreasing the distance between the top surface 314 of the first tray 310 and the top surface 337 of the base platform 334 includes transferring the first substrate 360 positioned on the tab 324 defined by the aperture 318 of the first tray 310 to the pedestal 336.

[0048] In some embodiments, asFigure 7L As shown, the actuator module 343 reduces the distance between the top surface 316 of the second tray 312 and the bottom surface 330 of the substrate chuck 326. In some examples, reducing the distance between the top surface 316 of the second tray 312 and the bottom surface 330 of the substrate chuck 326 includes transferring the third substrate 364 from the tab 324 defined by the hole 320 of the second tray 312 to the top surface 328 of the substrate chuck 326, while the tab 324 defined by the hole 320 of the second tray 312 is disposed within the corresponding channel 332 of the substrate chuck 326.

[0049] In some examples, the second substrate 362 can be processed similarly to that described above with respect to the first substrate 360, and in particular, Figures 7A-7L The processing described in 5.2 can be applied to the second substrate 362. In some examples, Figures 7A-7L Any of the steps of 5.1-5.6 can occur sequentially or simultaneously.

[0050] For simplicity of illustration, a single first substrate 360, a single second substrate 362, a single third substrate 364, and a single substrate chuck 326 are shown; however, Figures 7A-7L The processing of 5.1-5.6 can be applied to a plurality of first substrates 360, a plurality of second substrates 362, and a plurality of third substrates 364 with respect to a plurality of substrate chucks 326. That is, a plurality of first substrates 360, a plurality of second substrates 362, and a plurality of third substrates 364 can be processed simultaneously. Figures 7A-7L The processing of 5.1-5.6 is associated with one complete exchange cycle of substrates of 5.3 seconds, and the substrate loading system 302, in particular the tray handler device 304, completes one rotation in 1.5 seconds. In some examples, the substrate loading system 302, in particular the rotation system 342, rotates the tray handler device 304 clockwise and / or counterclockwise. Figures 7A-7L

[0051] Figure 8 An exemplary method for loading and unloading substrates onto and from pedestals and substrate chucks is shown. The process 800 is shown as a collection of reference actions arranged in a logical flow graph. The order in which the actions are described is not intended to be construed as a limitation, and any number of the described actions can be combined in other orders and / or in parallel to implement the process.

[0052] ​A tray handler apparatus 304 is provided (802). In some examples, the tray handler apparatus 304 includes a first tray handler 306 positioned opposite a second tray handler 308. A first tray 310 and a second tray 312 are provided (804). In some examples, the first tray 310 defines holes 318 and the second tray defines holes 320. In some examples, the first tray 310 has a top surface 314 and the second tray has a top surface 316. In some examples, each hole 318, 320 defines at least two cutouts 322 and two tabs 324. A substrate chuck 326 is provided (806). In some examples, the substrate chuck 326 includes a top surface 328 and a bottom surface 330. The first tray handler 306 is engaged with the first tray 310 (808).

[0053] The tray handler apparatus 304 is positioned in a first position (810). In some examples, positioning the tray handler apparatus 304 in the first position includes overlapping the cutouts 322 of each hole 318 of the first tray 310 with a respective pedestal 336 of the pedestal platform 334. In some examples, positioning the tray handler apparatus 304 in the first position includes extending the distal end 354 of each pedestal 336 away from the top surface 314 of the first tray 310.

[0054] A distance between the top surface 314 of the first tray 310 and the top surface 337 of the pedestal platform 334 is increased (812). For example, the actuator module 341 increases the distance between the top surface 314 of the first tray 310 and the top surface 337 of the pedestal platform 334. In some examples, increasing the distance between the top surface 314 of the first tray 310 and the top surface 337 of the pedestal platform 334 includes transferring a first substrate 360 positioned on the pedestal 336 to the tabs 324 defined by the hole 318 of the first tray 310. In some examples, transferring the first substrate 360 positioned on the pedestal 336 to the tabs 324 defined by the hole 318 of the first tray 310 includes transferring the first substrate 360 positioned on the pedestal 336 to the tabs 324 defined by the hole 318 of the first tray 310 while the second tray handler 308 is engaged with the second tray 312.

[0055] A distance between the top surface 316 of the second tray 312 and the bottom surface 330 of the substrate chuck 326 is increased (814). For example, the actuator module 343 increases the distance between the top surface 316 of the second tray 312 and the bottom surface 330 of the substrate chuck 326. In some examples, increasing the distance between the top surface 316 of the second tray 312 and the bottom surface 330 of the substrate chuck 326 includes transferring a second substrate 362 positioned on the substrate chuck 326 to the tabs 324 defined by the hole 320 of the second tray 312.

[0056] The tray handler apparatus 304 is rotated from the first position to a second position (816). For example, the rotation system 342 rotates the tray handler apparatus 304 from the first position to the second position. In some examples, positioning the tray handler apparatus 304 in the second position includes overlapping the tab 324 defined by the aperture 318 of the first tray 310 with the channel 332 of the substrate chuck 326. In some examples, positioning the tray handler apparatus 304 in the second position includes overlapping the cutout 322 of each aperture 320 of the second tray 312 with a respective pedestal 336 of the pedestal platform 334.

[0057] A distance between the top surface 314 of the first tray 310 and the bottom surface 330 of the substrate chuck 326 is reduced (818). For example, the actuator module 341 reduces the distance between the top surface 314 of the first tray 310 and the bottom surface 330 of the substrate chuck 326. In some examples, reducing the distance between the top surface 314 of the first tray 310 and the bottom surface 330 of the substrate chuck 326 includes transferring the first substrate 360 from the tab 324 defined by the aperture 318 of the first tray 310 to the top surface 328 of the substrate chuck 326 while the tab 324 defined by the aperture 318 of the first tray 310 is disposed within the respective channel 332 of the substrate chuck 326.

[0058] The first tray handler 306 is disengaged from the first tray 310 (820). In some examples, the first tray handler 306 is disengaged from the first tray 310 while the actuator module 343 reduces a distance between the top surface 316 of the second tray 312 and the top surface 337 of the pedestal platform 334. In some examples, reducing the distance between the top surface 316 of the second tray 312 and the top surface 337 of the pedestal platform 334 includes transferring the second substrate 362 positioned on the tab 324 defined by the aperture 320 of the second tray 312 to the pedestal 336.

Claims

1. An imprint lithography substrate transfer method, the method comprising: providing a tray handler apparatus comprising a tray handler; providing a tray defining a hole and having a top surface, the hole defining a cutout and a tab; providing a substrate chuck having a top surface and a bottom surface; engaging the tray handler with the tray; positioning the tray handler apparatus in a first position, wherein i) the cutout of the hole of the tray overlaps a respective pedestal of a pedestal platform, and ii) a distal end of the pedestal extends away from the top surface of the tray; increasing a distance between the top surface of the tray and a top surface of the pedestal platform to transfer a substrate from the pedestal to the tab defined by the hole of the tray; rotating the tray handler apparatus from the first position to a second position, wherein the tab defined by the hole of the tray overlaps a respective channel of the substrate chuck; decreasing a distance between the top surface of the tray and the bottom surface of the substrate chuck to transfer the substrate from the tab defined by the hole of the tray to the top surface of the substrate chuck while the tab defined by the hole of the tray is disposed within the respective channel of the substrate chuck; and disengaging the tray handler from the tray.

2. The method of claim 1, wherein, the tray handler apparatus comprises a further tray handler.

3. The method of claim 2, wherein, the further tray handler is positioned opposite the tray handler.

4. The method of claim 2, further comprising providing a further tray defining a hole and having a top surface.

5. The method of claim 4, wherein, the hole of the further tray defines a cutout and a tab.

6. The method of claim 5, further comprising engaging the further tray handler with the further tray.

7. The method of claim 6, wherein, engaging the further tray handler with the further tray occurs simultaneously with increasing the distance between the top surface of the tray and the top surface of the pedestal platform.

8. The method of claim 6, further comprising increasing a distance between the top surface of the further tray and the bottom surface of the substrate chuck to transfer a further substrate from the substrate chuck to the tab defined by the further tray.

9. The method of claim 8, wherein, the cutout of the hole of the further tray overlaps a respective pedestal when the tray handler apparatus is in the second position.

10. The method of claim 9, further comprising decreasing a distance between the top surface of the further tray and the top surface of the pedestal platform to transfer the further substrate from the tab defined by the hole of the further tray to the pedestal.

11. The method of claim 10, wherein, disengaging the tray handler from the tray occurs simultaneously with decreasing the distance between the top surface of the further tray and the top surface of the pedestal platform to transfer the further substrate from the tab defined by the hole of the further tray to the pedestal.

12. An imprint lithography system, comprising: a pedestal platform comprising pedestals; a substrate chuck having a top surface and a bottom surface and defining channels; a tray defining a hole and having a top surface, the hole defining a cutout and a tab; a tray handler device comprising a tray handler, the tray handler being engageable with the tray, the tray handler being rotatable between a first position and a second position, the first position being such that i) a cutout of a hole of the tray overlaps a corresponding pedestal of a pedestal platform, and ii) a distal end of the pedestal extends away from a top surface of the tray, the second position being such that a tab defined by the hole of the tray overlaps a corresponding channel of a substrate chuck, and and an actuator system configured to, when the tray handler device is in the first position, increase a distance between the top surface of the tray and a top surface of the pedestal platform to transfer a substrate from the pedestal to the tab defined by the hole of the tray, and, when the tray handler is in the second position, decrease a distance between the top surface of the tray and a bottom surface of the substrate chuck to transfer the substrate from the tab defined by the hole of the tray to a top surface of the substrate chuck while the tab defined by the hole of the tray is disposed within the corresponding channel of the substrate chuck.

13. The system of claim 12, further comprising a further tray defining a hole and having a top surface, the hole defining a cutout and a tab.

14. The system of claim 13, further comprising an additional tray handler, wherein, the further tray handler being engageable with the further tray.

15. The system of claim 14, wherein, the further tray handler is positioned opposite the tray handler.

16. The system of claim 14, wherein, when the tray handler device is in the first position, the cutout of the hole of the further tray overlaps a corresponding pedestal.

17. The system of claim 16, wherein, the actuator system is configured to, when the tray handler device is in the first position, increase the distance between the top surface of the tray and the top surface of the pedestal platform while the further tray handler is engaged with the further tray.

18. The system of claim 16, wherein, the actuator system is configured to, when the tray handler device is in the first position, increase a distance between the top surface of the further tray and the bottom surface of the substrate chuck to transfer a further substrate from the substrate chuck to the tab defined by the further tray.

19. The system of claim 18, wherein, the actuator system is configured to, when the tray handler is in the second position, decrease the distance between the top surface of the further tray and the top surface of the pedestal platform to transfer the further substrate from the substrate chuck to the pedestal while the tray handler is disengaged from the tray.

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