A two-dimensional material heterojunction device
By covering the surface of the two-dimensional material layer with an anti-oxidation film and fixing it with a fixing component, the oxidation problem of the two-dimensional material surface is solved, ensuring normal use of the device and facilitating film replacement, thus enhancing the protective effect.
Patent Information
- Application Number
- CN202211260723.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2022-10-14
- Publication Date
- 2025-10-31
- Estimated Expiration
- 2042-10-14
AI Technical Summary
Metal ions on the surface of two-dimensional materials oxidize in the air, causing heterojunction devices to fail and affecting their superiority.
An anti-oxidation film is applied to the surface of a two-dimensional material layer and fixed by a fixing component, including a pressure plate, a rotating shaft, a connecting block, a tension spring, and a torsion spring, to achieve the installation and replacement of the anti-oxidation film.
It effectively protects the surface of two-dimensional materials, reduces oxidation reactions, ensures the normal use of heterojunction devices, and facilitates the installation and replacement of anti-oxidation films.
Smart Images

Figure CN115642131B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of heterojunctions, specifically to a two-dimensional material heterojunction device. Background Technology
[0002] Two-dimensional materials, bound by van der Waals forces between their layers, can be easily cleaved into monolayers, and van der Waals heterojunction devices can be fabricated by stacking combinations of different materials. These devices possess excellent physicochemical properties and hold immense promise for applications in novel field-effect transistors, optoelectronics, energy storage, and flexible electronic devices.
[0003] Two-dimensional material heterojunction devices are typically composed of two-dimensional materials and electrodes and mounted on electrical components, such as light-emitting components, laser diodes, and high-speed electron mobility transistors. However, it is known that some two-dimensional materials have metal ions attached to their surfaces, such as boron nitride (BN), molybdenum disulfide (MoS2), tungsten disulfide (WS2), molybdenum diselenide (MoSe2), tungsten diselenide (WSe2), and MXene. In actual use, the metal ions on the surface of the two-dimensional materials may undergo oxidation reactions with the air, leading to heterojunction failure and affecting the superiority of two-dimensional material heterojunction devices over ordinary devices. Summary of the Invention
[0004] To address the shortcomings of existing technologies, the present invention aims to provide a two-dimensional material heterojunction device to solve the problems mentioned in the background. The present invention has a novel structure, which uses a fixing component to fix an anti-oxidation film onto the surface of the two-dimensional material layer for anti-oxidation protection, thereby enabling the entire heterojunction to achieve good performance.
[0005] To achieve the above objectives, the present invention is implemented through the following technical solution: a two-dimensional material heterojunction device, including a base plate, two electrodes symmetrically mounted on the top surface of the base plate, a two-dimensional material layer installed between the two electrodes, and a device body fixedly connected to the bottom of the base plate, the surface of the two-dimensional material layer being covered with an anti-oxidation film, and fixing components provided on both sides of the base plate corresponding to the anti-oxidation film.
[0006] The fixing component includes a pressure plate, and the surface of the extended portion on both sides of the anti-oxidation film is covered by the pressure plate. A rotating shaft is installed on the bottom plate at one end of the pressure plate, and the two pressure plates are rotatably connected to the rotating shaft.
[0007] A connecting block is fixed on the surface of the rotating shaft at the position corresponding to the two pressure plates, and the top of the connecting block slides through the pressure plate. A notch is opened on the surface of the pressure plate corresponding to the connecting block, and the connecting block slides and is engaged inside the notch.
[0008] Multiple tension springs are fixed on the inner wall of the pressure plate notch, and the other end of the tension springs is fixedly connected to the connecting block.
[0009] The end of the pressure plate away from the rotating shaft is slidably inserted with a plug, and the bottom of the two plugs is fixed with a connecting rod. A retaining frame is provided on the bottom surface of the base plate corresponding to the connecting rod, and the connecting rod can be movably engaged inside the retaining frame.
[0010] Furthermore, a push plate is fixed to the top of each of the two insert blocks.
[0011] Furthermore, a spring sheet is fixed to the bottom surface of the middle end of the pressing plate, and a contact plate is fixed to the bottom of the spring sheet, the contact plate being pressed into contact with the surface of the base plate.
[0012] Furthermore, a torsion spring is installed on the surface of the rotating shaft, and the two ends of the torsion spring are fixed to the rotating shaft and the base plate, respectively.
[0013] The beneficial effects of the present invention: The present invention provides a two-dimensional material heterojunction device, comprising a base plate; a device body; electrode terminals; an anti-oxidation film; a fixing assembly; a pressure plate; a pressing plate; a rotating shaft; a connecting block; a tension spring; an insert block; a connecting rod; a clamping frame; a spring sheet; a contact plate; a torsion spring; and a two-dimensional material layer.
[0014] 1. This two-dimensional material heterojunction device protects the surface of the two-dimensional material through the action of an anti-oxidation film, reducing the oxidation reaction between its metal ions and air, which would affect the normal use of the heterojunction.
[0015] 2. This two-dimensional material heterojunction device facilitates the fixed installation of the anti-oxidation film through the action of the fixing component, and also facilitates its replacement later.
[0016] 3. Compared with the prior art, this two-dimensional material heterojunction device enhances the protection of the two-dimensional material layer surface, reduces oxidation reaction, and facilitates the installation, replacement and disassembly of the protective anti-oxidation film. Attached Figure Description
[0017] Figure 1 This is a schematic diagram of the overall structure of a two-dimensional material heterojunction device according to the present invention;
[0018] Figure 2 This is a schematic diagram illustrating the separation of the anti-oxidation film from the two-dimensional material body in a two-dimensional material heterojunction device according to the present invention;
[0019] Figure 3 This is one of the schematic diagrams of the fixing component of a two-dimensional material heterojunction device according to the present invention;
[0020] Figure 4 This is a second schematic diagram of the fixed component structure of a two-dimensional material heterojunction device according to the present invention;
[0021] Figure 5This is the third schematic diagram of the fixed component structure of a two-dimensional material heterojunction device according to the present invention;
[0022] In the diagram: 1. Base plate; 2. Device body; 3. Electrode terminal; 4. Anti-oxidation film; 5. Fixing assembly; 51. Pressure plate; 52. Press plate; 53. Rotating shaft; 54. Connecting block; 55. Tension spring; 56. Insert block; 57. Connecting rod; 58. Frame; 59. Spring plate; 510. Contact plate; 6. Torsion spring; 7. Two-dimensional material layer. Detailed Implementation
[0023] To make the technical means, creative features, objectives and effects of this invention easier to understand, the invention will be further described below in conjunction with specific embodiments.
[0024] Please see Figures 1 to 5 This invention provides a technical solution: a two-dimensional material heterojunction device, including a base plate 1, two electrode terminals 3 symmetrically mounted on the top surface of the base plate 1, a two-dimensional material layer 7 installed between the two electrode terminals 3, and a device body 2 fixedly connected to the bottom of the base plate 1. The surface of the two-dimensional material layer 7 is covered with an anti-oxidation film 4, and the base plate 1 is provided with fixing components 5 on both sides corresponding to the anti-oxidation film 4. The installation of the base plate 1, electrode terminals 3, two-dimensional material layer 7 and device body 2 is the same as that of existing heterojunction devices, such as existing heterojunction light-emitting components, laser diodes, etc. The two-dimensional material layer 7 includes one or more of black phosphorus, tin sulfide, germanium arsenide, palladium diselenide, germanium selenide or rhenium sulfide. The two-dimensional material layer 7 includes a heterojunction formed by stacking multiple anisotropic two-dimensional materials, with at least one layer of anisotropic two-dimensional material. In use, the anti-oxidation film 4 is covered on the surface of the two-dimensional material layer 7, and then the two sides of the anti-oxidation film 4 are squeezed and fixed by the fixing components 5. When replacing the anti-oxidation film 4, the fixing components 5 are opened.
[0025] In this embodiment, the fixing component 5 includes pressure plates 51. Pressure plates 51 are pressed and covered on the surfaces of both extended portions of the anti-oxidation film 4. A rotating shaft 53 is installed on the base plate 1 at one end corresponding to the pressure plates 51. The two pressure plates 51 are rotatably connected to the rotating shaft 53. Connecting blocks 54 are fixed on the surface of the rotating shaft 53 at positions corresponding to the two pressure plates 51. The tops of the connecting blocks 54 slide through the pressure plates 51. A notch is provided on the surface of the pressure plates 51 corresponding to the protruding connecting blocks 54, and the connecting blocks 54 slide and engage inside the notch. Multiple tension springs 55 are fixed on the inner wall of the notch of the pressure plate 51, and the other end of the tension springs 55 is fixedly connected to the connecting block 54. A torsion spring 6 is installed on the surface of the rotating shaft 53, and the two ends of the torsion spring 6 are fixed to the rotating shaft 53 and the base plate 1 respectively. A plug block 56 is slidably inserted into the end of the pressure plate 51 away from the rotating shaft 53. A connecting rod 57 is fixed to the bottom of the two plug blocks 56, and a retaining frame 58 is provided on the bottom surface of the base plate 1 corresponding to the bottom surface of the connecting rod 57. The connecting rod 57 is movably engaged in the retaining frame 58. The tops of the two plug blocks 56 are fixed. There is a pressing plate 52, on the bottom surface of the middle end of the pressing plate 52, a spring sheet 59 is fixed, and a contact plate 510 is fixed at the bottom of the spring sheet 59. The contact plate 510 is in contact with the surface of the base plate 1. When the restriction on the anti-oxidation film 4 is released, pressing the pressing plate 52 causes the insert block 56 to move downward along the pressure plate 51, and the spring sheet 59 is compressed. At this time, the connecting rod 57 disengages from the locking frame 58, and then the pressing plate 52 is pulled outward. The connecting block 54 at the other end of the two pressure plates 51 slides along the notch and compresses the tension spring 55. At this time, the locking block is in both horizontal and vertical positions. The device is disengaged from the frame 58, and then the two pressure plates 51 are rotated open by the torsion spring 6 at the pivot 53, allowing the anti-oxidation film 4 to be replaced. When fixing the anti-oxidation film 4, first rotate the pressure plate 51 along the pivot 53, then press down the press plate 52 and move the pressure plate 51 to adjust the position of the connecting rod 57 to the bottom of the frame 58. After releasing the press plate 52, the insert block 56, driven by the spring plate 59, drives the connecting rod 57 to rise and form a locking with the frame 58. The two pressure plates 51 press and fix the two sides of the anti-oxidation film 4.
[0026] In use, the anti-oxidation film 4 is covered on the surface of the two-dimensional material layer 7. When the anti-oxidation film 4 is released, the pressing plate 52 is pressed, and the insert block 56 moves downward along the pressure plate 51, compressing the spring plate 59. At this time, the connecting rod 57 disengages from the locking frame 58. Then, the pressing plate 52 is pulled outward, and the connecting block 54 at the other end of the two pressure plates 51 slides along the notch and compresses the tension spring 55. At this time, the locking block disengages from the locking frame 58 in both the horizontal and vertical positions, and then the torsional spring at the pivot 53 is released. Under the action of spring 6, the two pressure plates 51 are rotated and opened, allowing the anti-oxidation film 4 to be replaced. When fixing the anti-oxidation film 4, first rotate the pressure plate 51 along the rotating shaft 53, then press down the pressing plate 52 and move it by pulling the pressure plate 51 to adjust the position of the connecting rod 57 to the bottom of the frame 58. After releasing the pressing plate 52, the insert block 56, driven by the spring plate 59, drives the connecting rod 57 to rise and form a snap-fit with the frame 58. The two pressure plates 51 press and fix the two sides of the anti-oxidation film 4.
[0027] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.
[0028] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.
Claims
1. A two-dimensional material heterojunction device, comprising a base plate (1), characterized in that: Two electrode terminals (3) are symmetrically installed on the top surface of the base plate (1), a two-dimensional material layer (7) is installed between the two electrode terminals (3), and a device body (2) is fixedly connected to the bottom of the base plate (1). The surface of the two-dimensional material layer (7) is covered with an anti-oxidation film (4), and a fixing component (5) is provided on both sides of the base plate (1) corresponding to the anti-oxidation film (4). The fixing component (5) includes a pressure plate (51). The surface of the extended portion on both sides of the anti-oxidation film (4) is covered by the pressure plate (51). The bottom plate (1) is equipped with a rotating shaft (53) at one end of the pressure plate (51). The two pressure plates (51) are rotatably connected to the rotating shaft (53). Connecting blocks (54) are fixed on the surface of the rotating shaft (53) at the positions corresponding to the two pressure plates (51), and the top of the connecting block (54) slides through the pressure plate (51). The pressure plate (51) has a notch on the surface through which the connecting block (54) passes, and the connecting block (54) slides and engages inside the notch. Multiple tension springs (55) are fixed on the inner wall of the notch of the pressure plate (51), and the other end of the tension spring (55) is fixedly connected to the connecting block (54); The pressure plate (51) has a slidable insertion block (56) at one end away from the rotating shaft (53). The bottom of the two insertion blocks (56) is fixed with a connecting rod (57), and the bottom plate (1) is provided with a frame (58) on the bottom surface corresponding to the connecting rod (57). The connecting rod (57) is movably engaged inside the frame (58).
2. The two-dimensional material heterojunction device according to claim 1, characterized in that: The top of the two inserts (56) is fixed with a push plate (52).
3. A two-dimensional material heterojunction device according to claim 2, characterized in that: A spring sheet (59) is fixed on the bottom surface of the middle end of the pressing plate (52), and a contact plate (510) is fixed at the bottom of the spring sheet (59). The contact plate (510) is pressed against the surface of the base plate (1).
4. A two-dimensional material heterojunction device according to claim 3, characterized in that: A torsion spring (6) is mounted on the surface of the rotating shaft (53), and the two ends of the torsion spring (6) are fixed to the rotating shaft (53) and the base plate (1) respectively.
Citation Information
Patent Citations
Two-dimensional layered film material heterojunction optoelectronic device based on self-alignment process
CN115020527A
Metal oxide semiconductor field effect transistor
CN214378389U