LED light panel forming device and LED light panel forming method

Abstract

This invention provides a molding apparatus and a molding method for LED light panels. The molding apparatus includes a molding fixture and a winding mechanism. The molding fixture includes a base and a plurality of positioning posts spaced apart along the outer periphery of the base. The positioning posts and the base form a receiving space for accommodating the LED light panel. The positioning posts are arranged one-to-one with a plurality of LED beads located on the outermost ring of the LED light panel. The winding mechanism is used to wrap hot melt adhesive strips around the positioning posts, so that the hot melt adhesive strips are aligned with the light gaps of the LED light panel. The technical solution of this application can effectively solve the problem in related technologies where spraying or printing black ink between the light gaps affects the display effect.

Description

Technical Field

[0001] This invention relates to the field of LED processing, and more specifically, to an LED light board forming apparatus and a method for forming LED light boards. Background Technology

[0002] As LED display technology continues to develop, the size of red, green, and blue LED chips is getting smaller and smaller, and the corresponding LED beads are also getting smaller and smaller. This results in a larger and larger exposed area of ​​the display substrate. Due to the difference in ink color between different display substrates and different positions of the same substrate, the ink color of LED modules made with small LED beads varies greatly, which affects the display effect of the LED screen.

[0003] To address the issue of inconsistent ink color in LED modules, the following two solutions are currently being used:

[0004] One approach is to add a black mask between the LED module light gaps to cover the substrate's black color. The problem with this approach is that it can only be used for modules with larger pixel pitches, and it is difficult to install for modules with smaller pixel pitches. Also, the modularity becomes more obvious after the mask is installed.

[0005] Another approach is to print or spray black ink between the LED module's light gaps. However, with smaller pixel pitches, this method can result in ink stains on the top or sides of the LED chips. Since flip-chip LEDs emit light from five sides, the ink stains can severely affect the display effect. Furthermore, as the pixel pitch of LED modules becomes increasingly smaller, the number of light gaps in each module is enormous, and it takes a long time to spray or print ink on a single module. This leads to the problem of low production efficiency in the light gap inkjet printing process. Summary of the Invention

[0006] The main objective of this invention is to provide an LED light panel forming apparatus and an LED light panel forming method to solve the problem in related technologies where spraying or printing black ink between the light gaps affects the display effect.

[0007] To achieve the above objectives, according to one aspect of the present invention, an LED light panel forming apparatus is provided. The forming apparatus includes a forming fixture and a winding mechanism. The forming fixture includes a base and a plurality of positioning posts spaced apart along the outer periphery of the base. The plurality of positioning posts and the base form a receiving space for accommodating the LED light panel. The plurality of positioning posts are arranged in a one-to-one correspondence with a plurality of LED beads located on the outermost ring of the LED light panel. The winding mechanism is used to wrap hot melt adhesive strips around the plurality of positioning posts so that the hot melt adhesive strips are arranged in a corresponding manner with the light slots of the LED light panel.

[0008] By applying the technical solution of this invention, the LED light board to be processed is placed in a forming fixture. Multiple positioning posts are arranged one-to-one with multiple LED beads located on the outermost ring of the LED light board. A winding mechanism can then be used to wrap hot melt adhesive strips around the positioning posts, filling the gaps between the LED beads. After heating and curing, a uniform covering layer is formed on the surface of the LED light board, resulting in a more uniform ink color. Specifically, after heating, the hot melt adhesive strip first forms a liquid structure and then solidifies, preventing it from adhering to the surface around the LED beads and affecting the display effect. Therefore, the technical solution of this application effectively solves the problem in related technologies where spraying or printing black ink between the LED beads affects the display effect.

[0009] Furthermore, the upper end of the positioning post has an arc-shaped structure, and / or the positioning post is higher than the LED bead.

[0010] Furthermore, the base is provided with a clearance recess for avoiding electronic components on the back side of the LED light panel.

[0011] Furthermore, the base has a rectangular structure and includes a first side, a second side, a third side, and a fourth side arranged sequentially. The multiple positioning posts include multiple first positioning posts arranged on the first side, multiple second positioning posts arranged on the second side, multiple third positioning posts arranged on the third side, and multiple fourth positioning posts arranged on the fourth side. The multiple first positioning posts and multiple third positioning posts are arranged in a one-to-one correspondence, and the multiple second positioning posts and multiple fourth positioning posts are arranged in a one-to-one correspondence.

[0012] According to another aspect of the present invention, a method for molding an LED light panel is provided, comprising: placing an LED light panel substrate on a molding fixture; using a winding mechanism to sequentially fold and wrap hot melt adhesive strips around a plurality of first positioning post groups arranged at intervals to fill a first light slot extending along a first direction on the LED light panel substrate, wherein each first positioning post group includes two positioning posts arranged opposite to each other in the first direction; using a winding mechanism to sequentially fold and wrap hot melt adhesive strips around a plurality of second positioning post groups arranged at intervals to fill a second light slot extending along a second direction on the LED light panel substrate, wherein each second positioning post group includes two positioning posts arranged opposite to each other in the second direction, the second direction intersecting the first direction; and heating and curing the hot melt adhesive strips on the LED light panel substrate to form a covering layer on the surface of the LED light panel substrate.

[0013] The technical solution of this invention involves first placing the LED light board substrate onto a molding fixture, then using a winding mechanism to fill the first light slot extending in a first direction and the second light slot extending in a second direction with hot melt adhesive strips. The hot melt adhesive strips on the LED light board substrate are then heated and cured to form a uniform covering layer on the surface of the LED light board substrate. During the heating and curing process, the hot melt adhesive strips first form a liquid structure and then solidify, preventing them from adhering to the surface around the LED beads and affecting the display effect. Therefore, the technical solution of this application effectively solves the problem in related technologies where spraying or printing black ink between the light slots affects the display effect.

[0014] Furthermore, in the step of using a winding mechanism to sequentially fold and wrap the hot melt adhesive strip around a plurality of spaced-apart first positioning post groups: all first light gaps are filled in a manner that proceeds first in the positive direction of the first direction and then in the negative direction of the first direction; and / or, in the step of using a winding mechanism to sequentially fold and wrap the hot melt adhesive strip around a plurality of spaced-apart second positioning post groups: all second light gaps are filled in a manner that proceeds first in the positive direction of the second direction and then in the negative direction of the second direction.

[0015] Furthermore, the ratio between the radial dimension of the hot melt adhesive strip and the width of the first light slit is between 1 / 2 and 3 / 4, and / or the ratio between the radial dimension of the hot melt adhesive strip and the width of the second light slit is between 1 / 2 and 3 / 4.

[0016] Furthermore, the step of heating and curing the hot melt adhesive strip on the LED light board substrate includes placing the LED light board substrate with the hot melt adhesive strip wrapped around it and the molding fixture into a vacuum oven for heating.

[0017] Furthermore, in the step of placing the LED light panel substrate with hot melt adhesive strips wrapped around it and the molding fixture into a vacuum oven for heating: the heating temperature is between 80°C and 120°C; the heating time is between 1 hour and 24 hours.

[0018] Furthermore, the molding method also includes: after heating and curing the hot melt adhesive strip on the LED light board substrate, separating the LED light board substrate and the molding fixture, and cutting the edge of the LED light board substrate to remove the covering layer located outside the cross-section of the LED light board substrate. Attached Figure Description

[0019] The accompanying drawings, which form part of this application, are used to provide a further understanding of the invention. The illustrative embodiments of the invention and their descriptions are used to explain the invention and do not constitute an undue limitation of the invention. In the drawings:

[0020] Figure 1A side view schematic diagram of a molding fixture according to an embodiment of an LED light panel molding apparatus is shown;

[0021] Figure 2 It shows Figure 1 A top view of the forming fixture;

[0022] Figure 3 The image shows the placement of an LED light panel. Figure 1 A top view of the forming fixture;

[0023] Figure 4 The image shows the placement of an LED light panel. Figure 1 A top view of the molding fixture with a hot melt adhesive strip wound around it; and

[0024] Figure 5 A flowchart illustrating an embodiment of the LED light panel forming method according to the present invention is shown.

[0025] The above figures include the following reference numerals:

[0026] 10. Base; 11. Recessed area; 20. Positioning post; 211. First positioning post; 212. Second positioning post; 213. Third positioning post; 214. Fourth positioning post; 22. First positioning post group; 23. Second positioning post group; 30. LED light board; 31. LED light board substrate; 311. LED bead; 32. Light gap; 321. First light gap; 322. Second light gap; 40. Hot melt adhesive strip; L1. First direction; L2. Second direction. Detailed Implementation

[0027] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the present invention or its application or use. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0028] like Figures 1 to 4 As shown, the LED light panel forming apparatus of this embodiment includes a forming fixture and a winding mechanism; the forming fixture includes a base 10 and a plurality of positioning posts 20 spaced apart along the outer periphery of the base 10, the plurality of positioning posts 20 and the base 10 forming a receiving space for accommodating the LED light panel 30, the plurality of positioning posts 20 being arranged one-to-one with a plurality of LED beads 311 located on the outermost ring of the LED light panel 30; the winding mechanism is used to wind hot melt adhesive strips 40 around the plurality of positioning posts 20 so that the hot melt adhesive strips 40 are arranged correspondingly to the light slots 32 of the LED light panel 30.

[0029] Applying the technical solution of this embodiment, the LED light panel 30 to be processed is placed in a molding fixture. Multiple positioning posts 20 are arranged one-to-one with multiple LED beads 311 located on the outermost ring of the LED light panel 30. A winding mechanism can then be used to wrap hot melt adhesive strips 40 around the positioning posts 20, filling the LED gaps 32 on the LED light panel 30. After heating and curing, the hot melt adhesive strips 40 form a uniform covering layer on the surface of the LED light panel 30, resulting in a more uniform ink color. Specifically, after heating, the hot melt adhesive strips 40 first form a liquid structure and then solidify, preventing them from adhering to the surface around the LED beads 311 and affecting the display effect. Therefore, the technical solution of this embodiment effectively solves the problem in related technologies where spraying or printing black ink between the LED gaps affects the display effect.

[0030] In addition, solid hot melt adhesive strips 40 are first wrapped around positioning posts 20 to fill multiple light gaps 32 on LED light panels 30, and then heated and cured. Compared with spraying or printing black ink at the light gaps in related technologies, the steps are simpler and the operation is easier.

[0031] Specifically, in this embodiment, the "hot melt adhesive strip 40" is a linear structure made of epoxy resin, acrylic resin or polyurethane and with added black ink.

[0032] Specifically, the winding mechanism in this embodiment includes a roller for receiving the hot melt adhesive strip 40 and a robotic arm for driving the hot melt adhesive strip 40 to wind around the positioning post 20. The hot melt adhesive strip 40 is wound around the roller, and the end of the robotic arm is provided with a nozzle or threading ring for discharging the wire. The robotic arm can move along a preset trajectory to wind the hot melt adhesive strip 40 around the positioning post 20.

[0033] like Figure 1 As shown, the upper end of the positioning post 20 has an arc-shaped structure. Specifically, the top of the positioning post 20 has a hemispherical structure, which can effectively prevent damage to the hot melt adhesive strip 40 during the winding process. In addition, even if the position of the hot melt adhesive strip 40 deviates during its movement, the arc-shaped structure can still guide the hot melt adhesive strip 40. That is, the technical solution of this embodiment has low requirements for the positional accuracy of the hot melt adhesive strip 40 during the movement of the winding mechanism.

[0034] like Figure 2As shown, the base 10 is provided with a clearance recess 11 to avoid electronic components on the rear side of the LED light board 30. While supporting the LED light board 30, the base 10 also avoids the electronic components on the rear side of the LED light board 30, thereby ensuring the parallelism between the upper surface of the LED light board 30 and the horizontal plane, facilitating the winding operation. Furthermore, during subsequent heat curing, placing the LED light board 30 and the molding fixture together in a vacuum oven for heating effectively ensures the parallelism between the upper surface of the LED light board 30 and the horizontal plane, resulting in a more uniform coating layer. Specifically, the clearance recess 11 can be a groove structure or it can penetrate the molding fixture vertically.

[0035] like Figure 2 As shown, the base 10 has a rectangular structure and includes a first side, a second side, a third side, and a fourth side arranged sequentially. Multiple positioning posts 20 include multiple first positioning posts 211 located on the first side, multiple second positioning posts 212 located on the second side, multiple third positioning posts 213 located on the third side, and multiple fourth positioning posts 214 located on the fourth side. The shape of the base 10 is adapted to the shape of the LED light panel 30. The multiple first positioning posts 211 and multiple third positioning posts 213 are arranged in a one-to-one correspondence, as are the multiple second positioning posts 212 and multiple fourth positioning posts 214. Each positioning post 20 corresponds to a lamp bead 311 located on the outermost ring of the LED light panel 30. This ensures that the gap between the lamp seam 32 and the positioning post 20 corresponds, allowing the hot melt adhesive strip 40 to align with the lamp seam 32 during winding.

[0036] Specifically, in this embodiment, the positioning post 20 is higher than the LED bead 311. This allows the winding mechanism to move above the LED bead 311 when the hot melt adhesive strip 40 is wound around the positioning post 20, without touching the LED bead 311, thus facilitating the winding operation. At the same time, it prevents damage to the LED bead 311 and the hot melt adhesive strip 40.

[0037] This application also provides a method for molding an LED light panel, such as... Figure 5 As shown, the LED light board forming method of this embodiment includes:

[0038] Step S10: Place the LED light board substrate 31 on the molding fixture;

[0039] Step S20: Use a winding mechanism to fold and wrap the hot melt adhesive strip 40 around a plurality of first positioning post groups 22 arranged at intervals to fill the first lamp slot 321 extending along the first direction L1 on the LED lamp board substrate 31, wherein each first positioning post group 22 includes two positioning posts 20 arranged opposite to each other in the first direction L1.

[0040] Step S30: Use a winding mechanism to fold and wrap the hot melt adhesive strip 40 around a plurality of spaced second positioning post groups 23 in sequence to fill the second lamp slot 322 extending along the second direction L2 on the LED lamp board substrate 31. Each second positioning post group 23 includes two positioning posts 20 arranged opposite to each other in the second direction L2, and the second direction L2 intersects with the first direction L1.

[0041] Step S40: The hot melt adhesive strip 40 on the LED light board substrate 31 is heated and cured to form a covering layer on the surface of the LED light board substrate 31.

[0042] Applying the technical solution of this embodiment, the LED light board substrate 31 is first placed on a molding fixture. Then, a winding mechanism is used to fill the first light slit 321 extending along the first direction L1 and the second light slit 322 extending along the second direction L2 with hot melt adhesive strip 40. The hot melt adhesive strip 40 on the LED light board substrate 31 is then heated and cured to form a uniform covering layer on the surface of the LED light board substrate 31. During the heating and curing process, the hot melt adhesive strip 40 first forms a liquid structure and then solidifies, preventing it from adhering to the surface around the LED beads 311 and affecting the display effect. Therefore, the technical solution of this embodiment can effectively solve the problem in related technologies where spraying or printing black ink between the light slits affects the display effect.

[0043] Furthermore, compared to the related technologies that spray or print liquid ink onto the lamp slit, the technical solution of this embodiment only requires the solid hot melt adhesive strip 40 to be wrapped around the positioning post 20, which is less difficult to operate and more efficient.

[0044] It should be noted that the "filling" in "filling...first light slit 321" and "filling...second light slit 322" mentioned above refers to the hot melt adhesive strip 40 being positioned corresponding to the first light slit 321 or the second light slit 322. The hot melt adhesive strip 40 can be located inside or above the first light slit 321 or the second light slit 322, as long as the projection of the hot melt adhesive strip 40 on the horizontal plane is within the projection of the first light slit 321 or the second light slit 322 on the horizontal plane. The aforementioned "hot melt adhesive strip 40" is a linear structure made of epoxy resin, acrylic resin, or polyurethane and infused with black ink. Furthermore, as... Figure 3 As shown, the "first light gap 321" mentioned above includes not only the gap between adjacent rows of LED beads 311, but also the gap between the outermost two rows of LED beads 311 and the corresponding edges of the LED light panel 30; the "second light gap 322" mentioned above includes not only the gap between adjacent rows of LED beads 311, but also the gap between the outermost two rows of LED beads 311 and the corresponding edges of the LED light panel 30.

[0045] Specifically, such as Figure 2 As shown, in this embodiment, each of the above-mentioned "first positioning post group 22" includes a first positioning post 211 and a third positioning post 213 arranged opposite to each other, and each of the above-mentioned "second positioning post group 23" includes a second positioning post 212 and a fourth positioning post 214 arranged opposite to each other. The first direction L1 is perpendicular to the second direction L2.

[0046] In this embodiment, the LED light board substrate 31 includes a substrate, a plurality of LED beads 311 disposed on the front side of the substrate, and electronic components and connecting lines disposed on the rear side of the substrate.

[0047] Specifically, in the step of using a winding mechanism to sequentially fold and wrap the hot melt adhesive strip 40 around multiple first positioning post groups 22 arranged at intervals, all first light slots 321 are filled by first moving along the positive direction of the first direction L1 and then moving along the negative direction of the first direction L1. Of course, after the winding mechanism drives the hot melt adhesive strip 40 to fill one first light slot 321 along the positive direction of the first direction L1, it will move the hot melt adhesive strip 40 along a direction perpendicular to the first direction L1 to the position corresponding to the next first light slot 321, and then move the hot melt adhesive strip 40 along the negative direction of the first direction L1 to fill the next first light slot 321. The winding mechanism drives the hot melt adhesive strip 40 in a serpentine path, which can fill all the first light slots 321 at once, improving operational efficiency.

[0048] Accordingly, in the step of using the winding mechanism to sequentially fold and wrap the hot melt adhesive strip 40 around the multiple spaced second positioning post groups 23, all the second light slots 322 are filled by first moving along the positive direction of the second direction L2 and then moving along the negative direction of the second direction L2. Of course, after the winding mechanism drives the hot melt adhesive strip 40 to fill one second light slot 322 along the positive direction of the second direction L2, it will move the hot melt adhesive strip 40 along a direction perpendicular to the second direction L2 to the position corresponding to the next second light slot 322, and then move the hot melt adhesive strip 40 along the negative direction of the second direction L2 to fill the next second light slot 322. The winding mechanism drives the hot melt adhesive strip 40 in a serpentine path, which can fill all the second light slots 322 at once, improving operational efficiency.

[0049] It should be noted that the above-mentioned "first proceed along the positive direction of the first direction L1, then proceed along the negative direction of the first direction L1" does not mean that the winding step must end with the movement in the negative direction. For example, when the LED light board 30 has three first light slots 321, it needs to perform two movements in the positive direction and one movement in the negative direction. In this case, the winding step ends with the movement in the positive direction.

[0050] In this embodiment, the ratio between the radial dimension of the hot melt adhesive strip 40 and the width of the first lamp slit 321 is between 1 / 2 and 3 / 4, and the ratio between the radial dimension of the hot melt adhesive strip 40 and the width of the second lamp slit 322 is between 1 / 2 and 3 / 4. Preferably, the cross-section of the hot melt adhesive strip 40 is circular, and the ratio between the diameter of the hot melt adhesive strip 40 and the width of the first lamp slit 321 is between 1 / 2 and 3 / 4, and the ratio between the diameter of the hot melt adhesive strip 40 and the width of the second lamp slit 322 is between 1 / 2 and 3 / 4. If the above ratio is less than 1 / 2, the hot melt adhesive strip 40 may not be able to fill the lamp slit 32 after curing. If the above ratio is greater than 3 / 4, the operation of winding the wire is more difficult, and the hot melt adhesive strip 40 may not be able to be correspondingly set between adjacent first positioning post groups 22 or between adjacent second positioning post groups 23; during heating and curing, the hot melt adhesive may adhere to the circumferential surface of the lamp bead 311, causing residual ink on the side of the lamp bead. Preferably, the ratio can be 1 / 2, 5 / 8 or 3 / 4.

[0051] Specifically, the step of heating and curing the hot melt adhesive strip 40 on the LED light panel substrate 31 includes placing the LED light panel substrate 31 with the hot melt adhesive strip 40 wrapped around it and the molding fixture into a vacuum oven for heating. During the heating process, the hot melt adhesive strip 40 undergoes a chemical reaction, first melting and then solidifying to form a uniform covering layer. Placing the LED light panel 30 and the molding fixture together in the vacuum oven for heating effectively ensures the parallelism between the upper surface of the LED light panel 30 and the horizontal plane, thus making the formed covering layer more uniform. In addition, the molding fixture can limit the position of the hot melt adhesive strip 40, so that the hot melt adhesive strip 40 can be kept in the position corresponding to the light slot 32, preventing the hot melt adhesive strip 40 from shifting and affecting the uniformity of the formed covering layer.

[0052] In this embodiment, in the step of placing the LED light board substrate 31 with the hot melt adhesive strip 40 wrapped around it and the molding fixture into a vacuum oven for heating: the heating temperature is between 80°C and 120°C; the heating time is between 1 hour and 24 hours. In actual operation, appropriate heating parameters can be selected within the above temperature and time ranges according to the performance of the hot melt adhesive strip 40.

[0053] Furthermore, such as Figure 5 As shown, the molding method of this embodiment further includes: Step S50: After heating and curing the hot melt adhesive strip 40 on the LED light board substrate 31, the LED light board substrate 31 and the molding fixture are separated, and the edge of the LED light board substrate 31 is cut to remove the covering layer located outside the cross-section of the LED light board substrate 31. After removing the excess covering layer, an LED light board 30 with a flat outer contour can be formed.

[0054] The method for forming the LED light board of this application will be described using the fabrication of an LED light board 30 with a pixel pitch of P1.25mm as an example:

[0055] First, the forming fixture is fabricated using aluminum alloy. The forming fixture has a recessed area 11 in the center to accommodate electronic components on the back of the LED light board substrate 31. Multiple positioning posts 20 are arranged around the forming fixture, with rounded tops to prevent damage to the hot melt adhesive strip 40 during operation. The positioning posts 20 are designed to ensure that the gap between two adjacent positioning posts 20 aligns with the gap between adjacent LED beads 311 on the LED light board 30. The height of the positioning posts 20 is higher than the height of the LED beads 311, facilitating the winding layout of the equipment.

[0056] Next, an LED light board 30 with a pixel pitch of P1.25mm is fixed on the molding fixture. The back of the module has various components arranged in advance, and the front has LED beads 311 set. The size of the LED beads 311 is 1.0mm*1.0mm, and the gap between adjacent LED beads is 0.25mm.

[0057] Then, the black hot melt adhesive strip 40 is filled between the light gaps 32 of the LED light board 30 using a winding mechanism. The hot melt adhesive strip 40 is made of epoxy resin and its radial dimension is 3 / 4 of the width of the light gap 32, i.e., 0.188mm.

[0058] After completing the above steps, place the molding fixture and LED light panel 30 into a vacuum oven and heat at 120°C for 1.5 hours.

[0059] Finally, after separating the molding fixture and the LED light board 30, an LED light board 30 with a uniform ink color is obtained.

[0060] In the description of this invention, it should be understood that the orientation or positional relationship indicated by directional terms such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" is generally based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing this invention and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the scope of protection of this invention; the directional terms "inner" and "outer" refer to the inner and outer contours relative to the outline of each component itself.

[0061] Furthermore, it should be noted that the use of terms such as "first" and "second" to define components is merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore should not be construed as limiting the scope of protection of this invention.

[0062] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A forming device for an LED light panel, characterized in that, The forming device includes a forming fixture and a winding mechanism; The forming fixture includes a base (10) and a plurality of positioning posts (20) spaced apart along the outer periphery of the base (10). The plurality of positioning posts (20) and the base (10) form a receiving space for accommodating the LED light panel (30). The plurality of positioning posts (20) are arranged one-to-one with a plurality of LED beads (311) located on the outermost ring of the LED light panel (30). The winding mechanism is used to wrap the hot melt adhesive strip (40) around the plurality of positioning posts (20) so that the hot melt adhesive strip (40) is correspondingly set with the lamp slot (32) of the LED lamp board (30). The lamp slot (32) includes the gap between adjacent columns of lamp beads (311) and the gap between the outermost two columns of lamp beads (311) and the corresponding edges of the LED lamp board (30).

2. The molding apparatus according to claim 1, characterized in that, The upper end of the positioning post (20) is an arc-shaped structure, and / or the positioning post (20) is higher than the lamp bead (311).

3. The molding apparatus according to claim 1, characterized in that, The base (10) is provided with a clearance recess (11) for avoiding electronic components on the rear side of the LED light panel (30).

4. The molding apparatus according to claim 1, characterized in that, The base (10) is a rectangular structure. The base (10) includes a first side, a second side, a third side and a fourth side arranged in sequence. The plurality of positioning posts (20) include a plurality of first positioning posts (211) arranged on the first side, a plurality of second positioning posts (212) arranged on the second side, a plurality of third positioning posts (213) arranged on the third side and a plurality of fourth positioning posts (214) arranged on the fourth side. The plurality of first positioning posts (211) and the plurality of third positioning posts (213) are arranged in a one-to-one correspondence, and the plurality of second positioning posts (212) and the plurality of fourth positioning posts (214) are arranged in a one-to-one correspondence.

5. A method for forming an LED light panel, characterized in that, include: Place the LED light panel substrate (31) on the molding fixture; The hot melt adhesive strip (40) is folded back and wound sequentially on a plurality of first positioning post groups (22) arranged at intervals to fill the first lamp slot (321) extending along the first direction (L1) on the LED lamp panel substrate (31), wherein each first positioning post group (22) includes two positioning posts (20) arranged opposite to each other in the first direction (L1). The hot melt adhesive strip (40) is sequentially folded back and wound around a plurality of spaced second positioning post groups (23) to fill the second lamp slot (322) extending along the second direction (L2) on the LED lamp panel substrate (31). Each second positioning post group (23) includes two positioning posts (20) arranged opposite to each other in the second direction (L2), and the second direction (L2) intersects with the first direction (L1). The hot melt adhesive strip (40) on the LED light panel substrate (31) is heated and cured to form a covering layer on the surface of the LED light panel substrate (31); The first light gap (321) includes the gap between adjacent columns of LED beads (311) and the gap between the outermost two columns of LED beads (311) and the corresponding edges of the LED light panel substrate (31); the second light gap (322) includes the gap between adjacent rows of LED beads (311) and the gap between the outermost two rows of LED beads (311) and the corresponding edges of the LED light panel substrate (31).

6. The molding method according to claim 5, characterized in that, In the step of using a winding mechanism to sequentially fold and wrap the hot melt adhesive strip (40) around a plurality of first positioning post groups (22) arranged at intervals: all the first light slots (321) are filled in such a manner that they first travel in the positive direction of the first direction (L1) and then in the negative direction of the first direction (L1); and / or, In the step of using the winding mechanism to fold the hot melt adhesive strip (40) back and forth sequentially around the multiple second positioning post groups (23) arranged at intervals: all the second light slots (322) are filled in such a way that they first travel in the positive direction of the second direction (L2) and then travel in the negative direction of the second direction (L2).

7. The molding method according to claim 5, characterized in that, The ratio between the radial dimension of the hot melt adhesive strip (40) and the width of the first light slit (321) is between 1 / 2 and 3 / 4, and / or the ratio between the radial dimension of the hot melt adhesive strip (40) and the width of the second light slit (322) is between 1 / 2 and 3 / 4.

8. The molding method according to claim 5, characterized in that, The step of heat curing the hot melt adhesive strip (40) on the LED light panel substrate (31) includes: The LED light panel substrate (31) with the hot melt adhesive strip (40) wrapped around it and the molding fixture are placed in a vacuum oven for heating.

9. The molding method according to claim 8, characterized in that, In the step of placing the LED light panel substrate (31) with the hot melt adhesive strip (40) wrapped around it and the molding fixture into a vacuum oven for heating: The heating temperature is between 80℃ and 120℃; Heating time is between 1 hour and 24 hours.

10. The molding method according to claim 5, characterized in that, The molding method further includes: after heating and curing the hot melt adhesive strip (40) on the LED light board substrate (31), separating the LED light board substrate (31) and the molding fixture, and cutting the edge of the LED light board substrate (31) to remove the covering layer located outside the cross-section of the LED light board substrate (31).

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