Refrigerator with multi-temperature zone storage space, control system and control method

Abstract

The present invention discloses a refrigerator with multi-temperature zone storage space, a control system, and a control method, and relates to the technical field of refrigerators. The present invention includes a cabinet, a refrigeration device installed at the lower part of the cabinet, and a damper; the cabinet has a cold storage chamber; a first independent space and a second independent space are arranged side by side in the cold storage chamber; a damper is installed on the rear side wall of the first independent space; the damper is used to control the connection between the first independent space and the air duct; a receiving groove is provided on a side wall of the first independent space close to the second independent space; a semiconductor refrigeration component is installed in the receiving groove; the cold surface of the semiconductor refrigeration component faces the first independent space; the hot surface of the semiconductor refrigeration component faces the second independent space. The present invention starts the semiconductor refrigeration component at the right time, uses the semiconductor refrigeration component to assist in cooling and heating, the cold capacity compensates for the cold capacity of the low-temperature zone, and the heat is transported to the relatively high-temperature zone, thereby meeting the user's demand for refrigeration in multiple temperature zones.

Description

Technical Field

[0001] The present invention belongs to the technical field of refrigerators, and in particular relates to a refrigerator with multi-temperature zone storage space, a control system and a control method. Background Art

[0002] Large-volume, multi-temperature zone refrigerators are the development trend of the refrigerator industry. Air-cooled refrigerators, with their flexible refrigeration duct system layout advantages, have become the key technology for refrigerators to achieve multi-temperature zones. With the upgrading of consumption, users have put forward higher requirements for the functionality of refrigerators, especially for refrigerators. They hope to store food in partitions within a large space. However, different ingredients have different temperature requirements. For example, ordinary fruits are generally stored in refrigerators at 2-8°C. Low temperature inhibits enzyme activity to reduce metabolic rate and inhibit bacterial reproduction and metabolism, achieving better preservation effect. However, tropical fruits such as mangoes and bananas are better stored at 10-14°C (except dragon fruit and lychee) to prevent the temperature from being too low to avoid chilling damage. Meat generally requires a slightly frozen temperature zone below -1°C to maintain the original freshness of the meat.

[0003] To address the above-mentioned issues, similar refrigerated storage technologies for classified storage have also been proposed. For example, Chinese patent application number CN211903443U discloses a semiconductor constant-temperature micro-freezing independent compartment in a refrigerator. This solution addresses the issues of insufficient cooling capacity and large temperature fluctuations in existing constant-temperature micro-freezing systems by installing a semiconductor refrigeration component in the independent compartment and coordinating it with the refrigeration system. The semiconductor refrigeration component cooperates with the refrigeration system to achieve rapid cooling of the independent compartment. Furthermore, when the refrigeration system is shut down, the micro-freezing temperature in the independent compartment can be effectively maintained at -3°C. However, the above-mentioned device lacks a dedicated storage area for tropical fruits with higher temperature requirements. Setting the entire refrigeration temperature above 10°C will affect other common fruits and vegetables. Therefore, to meet the storage needs of various types of fruits, vegetables, and meat, a refrigerator with multi-temperature controllable storage space is needed. Summary of the Invention

[0004] The present invention provides a refrigerator with multi-temperature zone storage space, a control system and a control method, the purpose of which is to solve the technical problems raised in the above background technology.

[0005] To solve the above technical problems, the present invention is achieved through the following technical solutions:

[0006] The present invention is a refrigerator with multi-temperature zone storage space, comprising a cabinet, a refrigeration device installed at the lower part of the cabinet, and an air damper; the refrigeration device comprises a compressor, an evaporator, a fan, and an air duct for conveying cold; the cabinet has a refrigeration chamber; a first independent space and a second independent space are arranged side by side in the refrigeration chamber; a damper is installed on the rear side wall of the first independent space; the damper is used to control the connection between the first independent space and the air duct; a side wall of the first independent space close to the second independent space is provided with a receiving groove; a semiconductor refrigeration component is installed in the receiving groove; the cold surface of the semiconductor refrigeration component faces the first independent space; the hot surface of the semiconductor refrigeration component faces the second independent space.

[0007] As a preferred technical solution of the present invention, a heat insulation structure is provided on the inner walls of the first independent space and the second independent space.

[0008] As a preferred technical solution of the present invention, the semiconductor refrigeration component includes a semiconductor chip with a cold end and a hot end; a cooler is bonded to the cold end of the semiconductor chip; a radiator is bonded to the hot end of the semiconductor chip; a cooling fan is installed on the side of the cooler away from the semiconductor chip; the cooling fan is arranged in a first independent space; the cooling fan is used to transport the cold at the cooler to the first independent space; a cooling fan is installed on the side of the radiator away from the semiconductor chip; the cooling fan is installed in a second independent space; the cooling fan is used to transport the heat at the radiator to the second independent space.

[0009] A control system for a refrigerator with multi-temperature zone storage space as described above includes a refrigerator controller, a first temperature sensor, a second temperature sensor and a third temperature sensor; the refrigerator controller is installed in a cabinet; the refrigerator controller is electrically connected to a refrigeration device, a damper, a semiconductor refrigeration component, a first temperature sensor, a second temperature sensor and a third temperature sensor, respectively; the first temperature sensor is installed in the cold storage chamber, and the first temperature sensor is arranged outside the first independent space and the second independent space; the second temperature sensor is installed in the first independent space; and the third temperature sensor is installed in the second independent space.

[0010] A method for controlling the refrigerator having multi-temperature storage space as described above comprises the following steps:

[0011] Step 1: Power on the refrigerator, obtain the temperature setting SC of the refrigerator compartment, the temperature setting SD1 of the first independent space, and the temperature setting SD2 of the second independent space, and obtain the temperature value T1 collected by the first temperature sensor, the temperature value T2 collected by the second temperature sensor, and the temperature value T3 collected by the third temperature sensor;

[0012] Step 2: Determine whether the temperature value T1 collected by the first temperature sensor reaches the start-up point temperature of the refrigeration compartment; if so, proceed to step 3; if not, proceed to step 13;

[0013] Step 3: Determine whether the temperature level setting SD2 of the second independent space is greater than the temperature value T0; if so, proceed to step 4; if not, proceed to step 6;

[0014] Step 4: Determine whether the temperature value T3 collected by the third temperature sensor is greater than the temperature value T0; if so, execute step 5; if not, execute step 6;

[0015] Step 5: Determine whether the temperature value T2 collected by the second temperature sensor reaches the power-on point temperature of the first independent space; if so, execute step 6; if not, execute step 11;

[0016] Step 6: Turn on the refrigeration system, the refrigeration device starts working, and delivers cold air to the refrigerated room. Then, the first temperature sensor, the second temperature sensor, and the third temperature sensor continuously obtain the real-time temperature values ​​of the refrigerated room, the first independent space, and the second independent space.

[0017] Step 7: Determine whether the temperature value T3 collected by the third temperature sensor is lower than the power-on point temperature of the second independent space; if so, execute step 8; if not, execute step 10;

[0018] Step 8: Start the semiconductor refrigeration component and continuously detect whether the temperature value T3 collected by the third temperature sensor is higher than the shutdown point temperature of the second independent space; if so, stop the semiconductor refrigeration component;

[0019] Step 9: Determine whether the temperature value T2 collected by the second temperature sensor reaches the shutdown point temperature of the first independent space; if so, execute step 11; if not, execute step 10;

[0020] Step 10: Open the damper;

[0021] Step 11: Close the damper;

[0022] Step 12: Determine whether the temperature value T1 collected by the first temperature sensor reaches the shutdown point temperature of the refrigeration chamber; if so, execute step 13; if not, execute step 6;

[0023] Step 13: Turn off the refrigeration system and stop the refrigeration device (2).

[0024] As an optimal technical solution of the present invention, the start-up point temperature of the refrigerating chamber is greater than its stop-point temperature; the start-up point temperature of the first independent space is greater than its stop-point temperature; and the start-up point temperature of the second independent space is less than its stop-point temperature.

[0025] As a preferred technical solution of the present invention, it is characterized in that, in step three, the temperature value T0 is an integer between 6 and 14.

[0026] The present invention has the following beneficial effects:

[0027] The present invention not only supplies cold air to the cold storage room through the refrigeration device, but also introduces the cold energy of the refrigeration device into the first independent space by opening the air damper, and arranges a semiconductor refrigeration component in the first independent space, with the cold surface of the semiconductor refrigeration component facing the first independent space and the hot surface of the semiconductor refrigeration component facing the second independent space. By combining the cooling conditions of the cold storage room and the cooling conditions of the relatively low temperature zone by the refrigeration system, the semiconductor refrigeration component is started in time, and the auxiliary cooling and heating of the semiconductor refrigeration component are utilized to make up for the cold energy of the first independent space, and the heat is transported to the second independent space, thereby meeting the user's demand for refrigeration in multiple temperature zones, and having no adverse effect on the reliability of the refrigeration system of the cold storage room, and having high market application value.

[0028] Of course, any product implementing the present invention does not necessarily need to achieve all of the advantages described above at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0030] Figure 1 The diagram is a front view of the structure of a refrigerator with multi-temperature zone storage space according to the present invention.

[0031] Figure 2 for Figure 1 side view of the structure.

[0032] Figure 3 It is a structural schematic diagram of the semiconductor refrigeration component 4 of the present invention.

[0033] Figure 4 The figure is a schematic diagram of a control system of a refrigerator with multi-temperature storage space according to the present invention.

[0034] Figure 5 The present invention is a flow chart of a control method for a refrigerator with multi-temperature zone storage space.

[0035] In the accompanying drawings, the components represented by the reference numerals are as follows:

[0036] 1- cabinet, 2- refrigeration device, 3- damper, 4- semiconductor refrigeration component, 5- refrigerator controller, 6- first temperature sensor, 7- second temperature sensor, 8- third temperature sensor, 101- cold storage chamber, 201- compressor, 202- evaporator, 203- fan, 204- air duct, 401- semiconductor chip, 402- cooler, 403- radiator, 404- cooling fan, 405- cooling fan, 1011- first independent space, 1012- second independent space, 1013- receiving tank, 1014- insulation structure. DETAILED DESCRIPTION

[0037] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts shall fall within the scope of protection of the present invention. Specific embodiment one:

[0039] See also Figure 1-2As shown, the present invention is a refrigerator with multi-temperature storage space, comprising a box body 1, a refrigeration device 2 and a damper 3 installed at the lower part of the box body 1; the damper 3 is a conventional electric damper in the field; the installation position of the refrigeration device 2 in the box body 1 belongs to the conventional technical means in the field; the refrigeration device 2 includes a conventional compressor 201 in the field, a conventional evaporator 202 in the field, a conventional fan 203 in the field and an air duct 204 for conveying cold; the box body 1 has a refrigeration chamber 101; the refrigeration chamber 101 is provided with a plurality of An independent space 1011 and a second independent space 1012; a damper 3 is installed on the rear side wall of the first independent space 1011; the damper 3 is used to control the connection between the first independent space 1011 and the air duct 204; a receiving groove 1013 is opened on the side wall of the first independent space 1011 close to the second independent space 1012; a semiconductor refrigeration component 4 is installed in the receiving groove 1013; the cold surface of the semiconductor refrigeration component 4 faces the first independent space 1011; the hot surface of the semiconductor refrigeration component 4 faces the second independent space 1012. During use, while supplying cold to the cold storage room 101 through the refrigeration device 2, the cold capacity of the refrigeration device 2 can also be introduced into the first independent space 1011 by opening the damper 3, and by arranging a semiconductor refrigeration component 4 in the first independent space 1011, with the cold surface of the semiconductor refrigeration component 4 facing the first independent space 1011 and the hot surface of the semiconductor refrigeration component 4 facing the second independent space 1012, by combining the cooling conditions of the cold storage room 101 and the cooling conditions of the relatively low temperature zone by the refrigeration system, the semiconductor refrigeration component 4 is started in time, and the auxiliary cooling and heating of the semiconductor refrigeration component 4 are used to make up for the cold capacity of the first independent space 1011, and the heat is transported to the second independent space 1012, thereby meeting the user's demand for refrigeration in multiple temperature zones, and having no adverse effect on the reliability of the refrigeration system of the cold storage room 101.

[0040] Among them Figure 3 As shown, the inner walls of both the first independent space 1011 and the second independent space 1012 are provided with insulation structures 1014; insulation structures 1014 are manufactured using the same process as the insulation layer of the refrigeration chamber 101. By providing insulation structures 1014 on the inner walls of both the first independent space 1011 and the second independent space 1012, temperature uniformity can be effectively maintained in the first independent space 1011 and the second independent space 1012. Specific embodiment two:

[0042] Based on the specific embodiment 1, Figure 3As shown, the semiconductor refrigeration component 4 includes a semiconductor chip 401 having a cold end and a hot end; the semiconductor chip 401 is a conventional component in this field; a cooler 402 is bonded to the cold end of the semiconductor chip 401; the cooler 402 is a conventional cooling fin in this field; a heat sink 403 is bonded to the hot end of the semiconductor chip 401; the heat sink 403 is a conventional heat sink in this field; a cooling fan 404 is installed on the side of the cooler 402 away from the semiconductor chip 401; the cooling fan 404 is arranged in the first independent space 1011; the cooling fan 404 is used to transport the cold at the cooler 402 to the first independent space 1011; a cooling fan 405 is installed on the side of the heat sink 403 away from the semiconductor chip 401; the cooling fan 405 is installed in the second independent space 1012; the cooling fan 405 is used to transport the heat at the heat sink 403 to the second independent space 1012. During use, during the operation of the semiconductor chip 401, the cold energy generated by the semiconductor chip 401 is absorbed by the cooler 402, and the cold energy at the cooler 402 is transported to the first independent space 1011 through the cooling fan 404. At the same time, the heat generated by the semiconductor chip 401 is absorbed by the radiator 403, and the heat at the radiator 403 is transported to the second independent space 1012 through the cooling fan 405, thereby realizing temperature control of the first independent space 1011 and the second independent space 1012.

[0043] like Figure 4 As shown, a control system of a refrigerator with multi-temperature zone storage space includes a conventional refrigerator controller 5 in the field, a conventional first temperature sensor 6 in the field, a conventional second temperature sensor 7 in the field and a conventional third temperature sensor 8 in the field; the refrigerator controller 5 is installed in the box body 1; the refrigerator controller 5 is electrically connected to the refrigeration device 2, the damper 3, the semiconductor refrigeration component 4, the first temperature sensor 6, the second temperature sensor 7 and the third temperature sensor 8 respectively; the first temperature sensor 6 is installed in the cold storage room 101, and the first temperature sensor 6 is arranged outside the first independent space 1011 and the second independent space 1012; the second temperature sensor 7 is installed in the first independent space 1011; the third temperature sensor 8 is installed in the second independent space 1012.

[0044] like Figure 5 As shown, a control method for a refrigerator with multi-temperature zone storage space includes the following steps:

[0045] Step 1: Turn on the power of the refrigerator, obtain the temperature gear setting SC of the refrigerator compartment 101, the temperature gear setting SD1 of the first independent space 1011, and the temperature gear setting SD2 of the second independent space 1012, and obtain the temperature value T1 collected by the first temperature sensor 6, the temperature value T2 collected by the second temperature sensor 7, and the temperature value T3 collected by the third temperature sensor 8; the temperature gear setting SC takes an integer between 2 and 8, and each value represents the temperature value of the refrigerator compartment 101. For example, when the temperature gear setting SC takes 5, it means that the temperature of the refrigerator compartment 101 is The temperature setting SD1 of the first independent space 1011 is set to 5°C; the temperature setting SD1 of the first independent space 1011 is an integer between -3 and 2, and each value represents the temperature value in the first independent space 1011. The temperature setting SD1 is 0, which means that the temperature of the first independent space 1011 is set to 0°C; the temperature setting SD2 of the second independent space 1012 is an integer between 8 and 14, and each value represents the temperature value of the second independent space 1012. For example, when the temperature setting SD2 is 10, it means that the temperature of the second independent space 1012 is set to 10°C.

[0046] Step 2: Determine whether the temperature value T1 collected by the first temperature sensor 6 reaches the power-on point temperature of the refrigerating chamber 101; if so, proceed to step 3; if not, proceed to step 13;

[0047] Step 3: Determine whether the temperature level setting SD2 of the second independent space 1012 is greater than the temperature value T0=8; if so, proceed to step 4; if not, proceed to step 6;

[0048] Step 4: Determine whether the temperature value T3 collected by the third temperature sensor 8 is greater than the temperature value T0=8; if so, execute step 5; if not, execute step 6; wherein the temperature value T0 is an integer between 6 and 14, and the temperature value T0 is preferably 10;

[0049] Step 5: Determine whether the temperature value T2 collected by the second temperature sensor 7 reaches the power-on point temperature of the first independent space 1011; if so, execute step 6; if not, execute step 11;

[0050] Step 6: Turn on the refrigeration system. The refrigeration device 2 starts working and transfers the cold energy from the evaporator 202 to the refrigeration chamber 101 through the fan 203, the air duct 204 and the refrigeration damper. Then, the first temperature sensor 6, the second temperature sensor 7 and the third temperature sensor 8 continuously obtain the real-time temperature values ​​in the refrigeration chamber 101, the first independent space 1011 and the second independent space 1012.

[0051] Step 7: Determine whether the temperature value T3 collected by the third temperature sensor 8 is lower than the power-on point temperature of the second independent space 1012; if so, proceed to step 8; if not, proceed to step 10;

[0052] Step 8: Start the semiconductor refrigeration component 4 and continuously detect whether the temperature value T3 collected by the third temperature sensor 8 is higher than the shutdown point temperature of the second independent space 1012; if so, stop the semiconductor refrigeration component 4;

[0053] Step 9: Determine whether the temperature value T2 collected by the second temperature sensor 7 reaches the shutdown point temperature of the first independent space 1011; if so, execute step 11; if not, execute step 10;

[0054] Step 10: Open damper 3;

[0055] Step 11: Close damper 3;

[0056] Step 12: Determine whether the temperature value T1 collected by the first temperature sensor 6 reaches the shutdown point temperature of the refrigerating chamber 101; if so, execute step 13; if not, execute step 6;

[0057] Step 13: Turn off the refrigeration system and stop the refrigeration device 2.

[0058] The start-up temperature of the refrigeration chamber 101 is higher than its shut-down temperature; the start-up temperature of the first independent space 1011 is higher than its shut-down temperature; and the start-up temperature of the second independent space 1012 is lower than its shut-down temperature. Because the temperature range of the second independent space 1012 is higher than the refrigeration temperature range of the refrigeration chamber 101, the cooling of the second independent space 1012 can be met by the cooling of the refrigeration chamber 101. The rising temperature demand is met by the heat dissipation of the hot end during the cooling of the semiconductor refrigeration component 4. The start-up and shut-down points of the second independent space 1012 are relative to whether heating is required, while the start-up and shut-down points of the refrigeration chamber 101 and the first independent space 1011 are relative to whether cooling is required.

[0059] The preferred embodiments of the present invention disclosed above are intended only to help illustrate the present invention. These preferred embodiments do not exhaustively describe all details, nor do they limit the present invention to the specific embodiments described. Obviously, many modifications and variations are possible based on the content of this specification. These embodiments are selected and described in detail in this specification to better explain the principles and practical applications of the present invention, thereby enabling those skilled in the art to better understand and utilize the present invention. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. A refrigerator with a multi-temperature zone storage space, comprising a housing (1), a refrigeration device (2) installed at the lower portion of the housing (1), and a damper (3); the refrigeration device (2) comprises a compressor (201), an evaporator (202), a fan (203), and an air duct (204) for conveying cold energy; the housing (1) has a refrigeration chamber (101); and is characterized in that: A first independent space (1011) and a second independent space (1012) are arranged side by side in the cold storage room (101); a damper (3) is installed on the rear side wall of the first independent space (1011); the damper (3) is used to control the communication between the first independent space (1011) and the air duct (204); a receiving groove (1013) is provided on a side wall of the first independent space (1011) close to the second independent space (1012); a semiconductor refrigeration component (4) is installed in the receiving groove (1013); the cold surface of the semiconductor refrigeration component (4) faces the first independent space (1011); and the hot surface of the semiconductor refrigeration component (4) faces the second independent space (1012).

2. The refrigerator with multi-temperature storage space according to claim 1, characterized in that: Inner walls of the first independent space (1011) and the second independent space (1012) are both provided with heat-insulating structures (1014).

3. A refrigerator with multi-temperature storage space according to claim 1 or 2, characterized in that: The semiconductor refrigeration component (4) comprises a semiconductor chip (401) having a cold end and a hot end; a cooler (402) is bonded to the cold end of the semiconductor chip (401); and a heat sink (403) is bonded to the hot end of the semiconductor chip (401).

4. The refrigerator with multi-temperature storage space according to claim 3, characterized in that: A cooling fan (404) is installed on the side of the cooler (402) away from the semiconductor chip (401); the cooling fan (404) is arranged in the first independent space (1011); the cooling fan (404) is used to transport the cold at the cooler (402) to the first independent space (1011); a heat dissipation fan (405) is installed on the side of the radiator (403) away from the semiconductor chip (401); the heat dissipation fan (405) is installed in the second independent space (1012); the heat dissipation fan (405) is used to transport the heat at the radiator (403) to the second independent space (1012).

5. A control system for a refrigerator with a multi-temperature storage space as claimed in claim 3, comprising a refrigerator controller (5), a first temperature sensor (6), a second temperature sensor (7) and a third temperature sensor (8); characterized in that: The refrigerator controller (5) is installed in the box (1); the refrigerator controller (5) is electrically connected to the refrigeration device (2), the damper (3), the semiconductor refrigeration component (4), the first temperature sensor (6), the second temperature sensor (7) and the third temperature sensor (8); the first temperature sensor (6) is installed in the refrigeration chamber (101), and the first temperature sensor (6) is arranged outside the first independent space (1011) and the second independent space (1012); the second temperature sensor (7) is installed in the first independent space (1011); and the third temperature sensor (8) is installed in the second independent space (1012).

6. A control method for a refrigerator with multi-temperature storage space according to claim 5, characterized in that: The steps include: Step 1: Power on the refrigerator, obtain the temperature setting SC of the refrigerating chamber (101), the temperature setting SD1 of the first independent space (1011), and the temperature setting SD2 of the second independent space (1012), and obtain the temperature value T1 collected by the first temperature sensor (6), the temperature value T2 collected by the second temperature sensor (7), and the temperature value T3 collected by the third temperature sensor (8); Step 2: determine whether the temperature value T1 collected by the first temperature sensor (6) reaches the start-up point temperature of the refrigeration chamber (101); if so, execute step 3; if not, execute step 13; Step 3: Determine whether the temperature level setting SD2 of the second independent space (1012) is greater than the temperature value T0; if so, execute step 4; if not, execute step 6; Step 4: determine whether the temperature value T3 collected by the third temperature sensor (8) is greater than the temperature value T0; if so, execute step 5; if not, execute step 6; Step 5: Determine whether the temperature value T2 collected by the second temperature sensor (7) reaches the power-on point temperature of the first independent space (1011); if so, execute step 6; if not, execute step 11; Step 6: Turn on the refrigeration system, the refrigeration device (2) starts working, and delivers cold energy to the refrigeration chamber (101), and then continuously obtains the real-time temperature values ​​in the refrigeration chamber (101), the first independent space (1011) and the second independent space (1012) through the first temperature sensor (6), the second temperature sensor (7) and the third temperature sensor (8); Step 7: Determine whether the temperature value T3 collected by the third temperature sensor (8) is lower than the power-on point temperature of the second independent space (1012); if so, execute step 8; if not, execute step 10; Step 8: Start the semiconductor refrigeration component (4) and continuously detect whether the temperature value T3 collected by the third temperature sensor (8) is higher than the shutdown point temperature of the second independent space (1012); if so, stop the semiconductor refrigeration component (4); Step nine, determining whether the temperature value T2 collected by the second temperature sensor (7) reaches the shutdown point temperature of the first independent space (1011); if so, executing step eleven; if not, executing step ten; Step 10: Open the damper (3); Step 11: Close the damper (3); Step 12: Determine whether the temperature value T1 collected by the first temperature sensor (6) reaches the shutdown point temperature of the refrigeration chamber (101); if so, execute step 13; if not, execute step 6; Step 13: Turn off the refrigeration system and stop the refrigeration device (2).

7. The control method of a refrigerator with multi-temperature storage space according to claim 6, characterized in that: The start-up temperature of the refrigerating chamber (101) is greater than the stop-up temperature; the start-up temperature of the first independent space (1011) is greater than the stop-up temperature; and the start-up temperature of the second independent space (1012) is less than the stop-up temperature.

8. A control method for a refrigerator with multi-temperature storage space according to claim 6 or 7, characterized in that: In step 3, the temperature value T0 is an integer between 6 and 14.

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