A device for detecting the firmness of electrical components on a multi-layer circuit board

Abstract

The present invention discloses a device for detecting the firmness of electrical components of a multi-layer circuit board, belonging to the technical field of multi-layer circuit board detection. A device for detecting the firmness of electrical components of a multi-layer circuit board comprises a detection box, a mounting seat in the shape of a Chinese character "concave", symmetrically arranged at both ends of the interior of the detection box, and a swing rod rotatably connected in the detection box for driving the mounting seat to swing, a floating roller for clamping the upper and lower sides of the multi-layer circuit board is arranged in the mounting seat, and a vibrating part is arranged in the floating roller; a detection module for detecting the circuit board is slidably arranged in the detection box; the present invention, by bending and vibrating the multi-layer circuit board, can understand the influence of vibration and bending deformation on the multi-layer circuit board on the one hand, and on the other hand, through bending and vibrating, can detect the firmness of the welding of electrical components, so that the problem of solder leaks or false solder joints can be presented more clearly and clearly, which is easy to find, and helps to improve the detection efficiency and accuracy.

Description

Technical Field

[0001] The present invention relates to the technical field of multi-layer circuit board detection, and in particular to a device for detecting the firmness of electrical components of a multi-layer circuit board. Background Art

[0002] Circuit boards are divided into three major categories according to the number of layers: single-sided, double-sided, and multi-layer circuit boards. The first is single-sided. On the most basic printed circuit board, the components are concentrated on one side and the wires are concentrated on the other side. Because the wires only appear on one side, this type of printed circuit board is called a single-sided circuit board. Single-sided boards are usually simple to make and low in cost, but their disadvantage is that they cannot be applied to overly complex products. Double-sided boards are an extension of single-sided boards. When single-layer wiring cannot meet the needs of electronic products, double-sided boards are used. Both sides have copper cladding and routing, and vias can be used to conduct the lines between the two layers to form the required network connection. Multi-layer boards refer to printed boards with more than three layers of conductive graphic layers and insulating materials laminated in between, and the conductive patterns in between are interconnected as required. Multi-layer circuit boards are the product of the development of electronic information technology towards high speed, multi-function, large capacity, small size, thinness, and lightweight. Circuit boards are divided into flexible boards, rigid boards, and flexible and rigid boards according to their characteristics.

[0003] At present, in the batch production of multi-layer circuit boards, the placement work is generally completed by a placement machine. Compared with manual welding, the precision and efficiency of the placement machine have been greatly improved. However, in actual use, the problem of poor circuit welding is inevitable. Therefore, after the multi-layer circuit board is processed, it is necessary to conduct tests on vibration resistance, pressure resistance, and the firmness of surface component fixation to understand the processing quality of the circuit board and prevent the multi-layer circuit board from malfunctioning due to substandard quality during use. During the inspection, the circuit board is generally inspected manually, which makes the inspection efficiency low and the results have certain uncertainties. Summary of the Invention

[0004] The purpose of the present invention is to solve the problem in the prior art that manual inspection of circuit boards results in low inspection efficiency and certain uncertainty in the results, and to propose a device for inspecting the firmness of electrical components on multi-layer circuit boards.

[0005] In order to achieve the above object, the present invention adopts the following technical solutions:

[0006] A device for detecting the firmness of electrical components on a multi-layer circuit board comprises a detection box and also includes: a mounting seat in the shape of a "concave" character, symmetrically arranged at both ends of the interior of the detection box, and a swing rod rotatably connected inside the detection box for driving the mounting seat to swing, wherein a floating roller for clamping the upper and lower sides of the multi-layer circuit board is provided inside the mounting seat, and a vibrating part is provided inside the floating roller; a detection module for detecting the circuit board is slidably provided inside the detection box.

[0007] In order to be able to clamp the multi-layer circuit board, preferably, it also includes: a cylinder fixedly arranged on the mounting seat, wherein the cylinders are symmetrically arranged in two groups, the output ends of the two groups of cylinders are fixedly connected to a sleeve, a sliding rod is slidably connected in the sleeve, the floating roller is fixedly connected to the bottom of the sliding rod, and a clamping roller for clamping the upper and lower sides of the multi-layer circuit board is rotatably connected to the floating roller; a spring is provided on the sliding rod, and the two ends of the spring are respectively against the sleeve and the sliding rod.

[0008] In order to prevent the floating roller from rotating during clamping, further, a guide rod is fixedly connected to the floating roller, and a guide hole is opened on the mounting seat and is slidably connected to the guide rod.

[0009] In order to perform vibration detection on the multilayer circuit board, preferably, the vibration part includes an eccentric wheel, a vibration cavity is opened in the floating roller, a motor is fixedly installed in the vibration cavity, and the eccentric wheel is fixedly connected to the output end of the motor.

[0010] In order to facilitate the driving of the mounting seat to swing, preferably, a rotating shaft is fixedly provided in the detection box, the swing arm is rotatably connected to the rotating shaft, the swing arm is L-shaped, and the short side of the swing arm is fixedly connected to the mounting seat, a driving part is provided in the detection box, and the long side of the swing arm is connected to the driving part.

[0011] In order to better drive the swing arm to swing, the driving part further includes: a driving box fixedly arranged in the detection box, wherein chamber one, chamber two and chamber three are provided in the driving box, piston blocks are slidably connected to chamber two and chamber three, a driving rod is fixedly connected to the piston block, an end of the driving rod away from the piston block is fixedly connected to rotating shaft two, and a limiting groove is provided on the swing arm that is slidably connected to rotating shaft two; a pipe one connected to chamber one is fixedly connected to the detection box, and chamber two and chamber three are respectively connected to chamber one.

[0012] In order to automatically reset the piston block, a second spring is further provided on the driving rod, and two ends of the second spring are respectively against the piston block and the driving box.

[0013] In order to enable the detection module to slide for detection, a guide groove is further provided in the detection box, a support seat is slidably connected in the guide groove, the detection module is fixedly connected to the top of the support seat, an airbag is provided in the guide groove, and the two ends of the airbag are respectively fixedly connected to the inner wall of the guide groove and the support seat, the chamber one is connected to the airbag through the pipe two, and a one-way valve is fixedly connected to the pipe two.

[0014] In order to be able to purge the multi-layer circuit board, further, a nozzle for purging the multi-layer circuit board is fixedly provided on the support seat, the airbag is connected to the nozzle through a pipe three, and a valve is fixedly connected to the pipe three.

[0015] In order to prevent electrical components from flying out and injuring people during testing, preferably, the top of the testing box is rotatably connected to a box cover, the box cover is fixedly connected to an elastic buckle, and the testing box is provided with a slot engaged with the elastic buckle.

[0016] Compared with the prior art, the present invention provides a device for detecting the firmness of electrical components on a multi-layer circuit board, which has the following beneficial effects:

[0017] 1. This device for testing the firmness of electrical components on a multi-layer circuit board can, by bending and vibrating the multi-layer circuit board, understand the effects of vibration and bending deformation on the multi-layer circuit board. On the other hand, by bending and vibrating, it can test the firmness of the soldering of electrical components, making solder leaks or cold solder joints more clearly apparent and easier to detect, thereby helping to improve detection efficiency and accuracy.

[0018] 2. The device for detecting the firmness of electrical components on multi-layer circuit boards uses a detection module to scan and photograph the soldered pins. By comparing the two photos and comparing them with standard photos, it can promptly detect welding problems such as vibration and bending before and after welding, thereby detecting the connection firmness of electrical components and helping to improve detection accuracy and efficiency.

[0019] 3. The device for detecting the firmness of electrical components of a multi-layer circuit board can blow the multi-layer circuit board through a nozzle to blow off the welding slag from the multi-layer circuit board, thereby cleaning the multi-layer circuit board. This can make it easier for the detection module to find welding leaks or cold solder joints, thereby improving the detection accuracy.

[0020] The parts not involved in the device are the same as the existing technology or can be implemented by using the existing technology. By bending and vibrating the multi-layer circuit board, the present invention can, on the one hand, understand the impact of vibration and bending deformation on the multi-layer circuit board. On the other hand, through bending and vibration, the welding firmness of electrical components can be detected, so that the problem of welding leakage or cold welding can be presented more clearly, which is easy to find and helps to improve the detection efficiency and accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is a structural schematic diagram of a test box for testing the firmness of electrical components on a multi-layer circuit board proposed by the present invention;

[0022] Figure 2 A device for detecting the firmness of electrical components on a multi-layer circuit board proposed by the present invention Figure 1 Enlarged view of part A;

[0023] Figure 3 A device for detecting the firmness of electrical components on a multi-layer circuit board proposed by the present invention Figure 1 Enlarged view of part B;

[0024] Figure 4 This is a structural schematic diagram of a mounting base for a device for detecting the firmness of electrical components on a multi-layer circuit board proposed by the present invention.

[0025] In the figure: 1. Detection box; 101. Support pad; 102. Guide groove; 2. Mounting seat; 201. Swing rod; 202. Limiting groove; 3. Drive box; 301. Piston block; 302. Drive rod; 303. Rotating shaft 2; 304. Pipe 1; 305. Pipe 2; 306. Chamber 1; 4. Cylinder; 401. Sleeve; 402. Slide rod; 403. Spring 1; 5. Floating roller; 501. Clamping roller; 502. Guide rod; 6. Eccentric wheel; 7. Airbag; 701. Pipe 3; 8. Support seat; 801. Detection module; 802. Nozzle; 9. Box cover; 901. Elastic buckle. DETAILED DESCRIPTION

[0026] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0027] In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside", "outside", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as limiting the present invention.

[0028] Example:

[0029] Reference Figures 1-4A device for testing the firmness of electrical components on a multi-layer circuit board comprises a testing box 1 with a box cover 9 rotatably connected to the top. The box cover 9 is rotatably connected to the top of the testing box 1 by a hinge. An elastic buckle 901 is fixedly connected to the end of the box cover 9 away from the hinge. The box cover 9 is a transparent acrylic plate or tempered glass. A card slot is provided on the testing box 1 to engage with the elastic buckle 901. When performing vibration or bending tests, it can prevent electrical components from falling off the multi-layer circuit board or broken fragments of the multi-layer circuit board from jumping out and injuring people, causing safety accidents during the test. Therefore, the detection situation in the detection box 1 can be observed through the transparent box cover 9, which is helpful to grasp the detection situation in real time by combining the detection data and improve the detection accuracy. The bottom of the detection box 1 is fixedly connected with a support pad 101, which is made of rubber or nylon and can reduce the vibration generated by the detection box 1 during detection and transmitted to the surrounding objects. It also includes: a "concave" shaped mounting seat 2, which is symmetrically arranged at both ends of the interior of the detection box 1, and a swing rod 201 for driving the mounting seat 2 to swing is rotatably connected in the detection box 1. When in use, By swinging the swing rod 201, the mounting base 2 is driven to swing together, so that a slight bending test can be performed on the multi-layer circuit board, simulating the uneven mounting surface or uneven force of the fastening screws in the actual installation process, which may cause the multi-layer circuit board to bend and deform, resulting in the multi-layer circuit board being broken or the electrical component connection being loose, affecting the normal use of the multi-layer circuit board. Among them, a floating roller 5 is provided in the mounting base 2 for clamping the upper and lower sides of the multi-layer circuit board, and a vibrating part is provided in the floating roller 5. By simulating vibration, the firmness of the connection between the electrical component and the multi-layer circuit board can be detected, and welding leaks or cold solder joints can be discovered in time, which is convenient for understanding the processing quality of the circuit board and preventing the multi-layer circuit board from malfunctioning due to substandard quality during use. A detection module 801 for detecting the circuit board is slidingly provided in the detection box 1. The detection module 801 adopts the existing image detection technology. By taking pictures and comparing the welding pins at the connection between the multi-layer circuit board and the electrical component, it is automatically determined whether there is welding leaks or cold solder joints between the electrical component and the multi-layer circuit board, thereby improving the detection efficiency and detection accuracy.

[0030] When in use, multiple groups of multi-layer circuit boards are taken out from the product line, which can reduce detection errors and avoid detection uncertainties. Then, the box cover 9 is opened to place the multi-layer circuit boards on the clamping roller 501, and the box cover 9 is closed. The cylinder 4 is started to extend the sleeve 401. The sleeve 401 drives the slide bar 402 and the floating roller 5 fixed on the slide bar 402 to extend through the spring 1 403, so that the clamping rollers 501 on the upper and lower sides of the mounting seat 2 are close to each other to clamp the multi-layer circuit boards. After the clamping is completed, gas is introduced into the chamber 1 306 through the pipe 1 304. Since the resistance in the chamber 2 and the chamber 3 is greater than the airbag 7, the gas passes through the one-way valve with The pipe 2 305 enters the airbag 7, and the airbag 7 expands, pushing the support seat 8 to slide to the right. During the sliding process of the support seat 8, the detection module 801 can scan and take pictures of the welding points at the bottom of the multi-layer circuit board. When the support seat 8 moves to the far right with the detection module 801, it stops moving. At this time, the airbag 7 is also full of gas, and then the gas in the chamber 1 306 is inflated into the chamber 2 and the chamber 3 at the same time. The gas pushes the piston block 301 to slide in the corresponding chamber, and the driving rod 302 drives the swing rod 201 to swing slightly through the rotating shaft 2 303. In this process, the mounting seats 2 on both sides will swing slightly downward at the same time, which can make the multi-layer circuit board When the circuit board is bent, the chamber 1 306 is continuously inflated and deflated, and with the cooperation of the spring 2, the multi-layer circuit board can be subjected to multiple bending tests. During the bending process, the pins with poor soldering or leaking soldering can be detached from the multi-layer circuit board, which is convenient for discovering welding problems and helps to understand the processing quality of the circuit board. After the bending test is completed, the motor is started to rotate with the eccentric wheel 6 in the vibration chamber. When the eccentric wheel 6 rotates at a high speed, the motor and the floating roller 5 will vibrate, and then the floating roller 5 will transmit the vibration to the multi-layer circuit board through the clamping roller 501. The multi-layer circuit board is subjected to vibration test, and the pins with poor soldering or leaking soldering can be vibrated off from the multi-layer circuit board. , problems can be quickly discovered. After vibrating for a period of time, the vibration is stopped, and the valve on the pipe three 701 is opened. The gas in the airbag 7 enters the nozzle 802 through the pipe three 701. During this process, the support seat 8 slides from right to left for a return stroke. The nozzle 802 can purge the multi-layer circuit board during the return stroke, which can make it easier for the detection module 801 to find leaking solder or cold solder joints. The detection module 801 also scans and photographs the welded pins again. By comparing the two photos with the standard photos, welding problems before and after vibration and bending can be discovered in time, and the connection firmness of electrical components can be detected, which helps to improve detection accuracy and efficiency.

[0031] Reference Figure 1 、 Figure 2 and Figure 4, a device for detecting the firmness of electrical components of a multi-layer circuit board, further comprising: a cylinder 4 fixedly arranged on a mounting base 2, wherein the cylinder 4 is symmetrically arranged in two groups, the output ends of the two groups of cylinders 4 are fixedly connected to a sleeve 401, a slide bar 402 is slidably connected in the sleeve 401, a floating roller 5 is fixedly connected to the bottom of the slide bar 402, and a clamping roller 501 for clamping the upper and lower sides of the multi-layer circuit board is rotatably connected to the floating roller 5. When bending, the multi-layer circuit board will slide to a certain extent relative to the mounting base 2. The rotating clamping roller 501 can avoid scratching the upper and lower sides of the multi-layer circuit board, thereby improving the quality of the multi-layer circuit board; a spring 403 is sleeved on the slide bar 402, and the two ends of the spring 403 are respectively against the sleeve 401 and the slide bar 402, which can ensure that the clamping roller 501 is always clamped on the upper and lower sides of the multi-layer circuit board during bending or vibration. A guide rod 502 is fixedly connected to the floating roller 5, and a guide hole is provided on the mounting base 2 which is slidably connected to the guide rod 502, which can prevent the floating roller 5 from rotating during the clamping process, resulting in improper clamping and even damage to electrical components. When in use, the multi-layer circuit board is placed on the clamping roller 501, and the cylinder 4 is started to extend the sleeve 401. The sleeve 401 drives the slide rod 402 and the floating roller 5 fixed on the slide rod 402 to extend through the spring 403, so that the clamping rollers 501 on the upper and lower sides of the mounting base 2 are close to each other to clamp the multi-layer circuit board.

[0032] Reference Figure 1 and Figure 2 The vibration part includes an eccentric wheel 6, a vibration cavity is opened in the floating roller 5, a motor is fixedly installed in the vibration cavity, and the eccentric wheel 6 is fixedly connected to the output end of the motor. The motor is started to rotate with the eccentric wheel 6 in the vibration cavity. When the eccentric wheel 6 rotates at a high speed, the motor and the floating roller 5 will vibrate, and then the floating roller 5 will transmit the vibration to the multi-layer circuit board through the clamping roller 501 to perform vibration detection on the multi-layer circuit board.

[0033] Reference Figure 1 A rotating shaft is fixedly provided in the detection box 1, and the swing rod 201 is rotatably connected to the rotating shaft. The swing rod 201 is L-shaped, and the short side of the swing rod 201 is fixedly connected to the mounting base 2. A driving part is provided in the detection box 1, and the long side of the swing rod 201 is connected to the driving part. When in use, when the driving rod 302 is extended, it will push the long side of the swing rod 201 to swing around the rotating shaft, and the short side of the swing rod 201 will swing around the rotating shaft with the mounting base 2, thereby realizing bending detection of the multi-layer circuit board.

[0034] Reference Figure 1The driving part includes: a driving box 3 fixedly arranged in the detection box 1, wherein the driving box 3 is provided with chamber 1 306, chamber 2 and chamber 3, and piston blocks 301 are slidably connected to chamber 2 and chamber 3, a driving rod 302 is fixedly connected to the piston block 301, and the end of the driving rod 302 away from the piston block 301 is fixedly connected to the rotating shaft 2 303, and a limiting groove 202 slidably connected to the rotating shaft 2 303 is provided on the swing arm 201; a pipe 1 304 connected to chamber 1 306 is fixedly connected to the detection box 1, and chamber 2 and chamber 3 are respectively connected to chamber 1 306. The driving rod 302 is provided with a spring 2 for resetting the piston block 301. The two ends of the spring 2 are respectively against the piston block 301 and the driving box 3. When in use, gas is introduced into the chamber 1 306 through the pipe 1 304, and then the gas in the chamber 1 306 is inflated into the chamber 2 and the chamber 3 at the same time. The gas pushes the piston block 301 to slide in the corresponding chamber, and the driving rod 302 drives the long side of the swing rod 201 to swing slightly through the rotating shaft 2 303. After the inflation is completed, the piston block 301 is reset under the action of the spring 2, and the driving rod 302 is reset with the swing rod 201 through the rotating shaft 2 303, completing a bending test. By continuously inflating and deflating the chamber 1 306, with the cooperation of the spring 2, the multi-layer circuit board can be subjected to multiple bending tests. During the bending process, the pins with poor soldering or leaking solder can be detached from the multi-layer circuit board, making it easier to find welding problems.

[0035] Reference Figure 1 and Figure 3 , a guide groove 102 is provided in the detection box 1, and a support seat 8 is slidably connected in the guide groove 102. The detection module 801 is fixedly connected to the top of the support seat 8. An airbag 7 is provided in the guide groove 102. The airbag 7 adopts an elastic airbag 7. When the valve on the pipe three 701 is opened, the airbag 7 automatically contracts and discharges the gas inside it through the pipe three 701. The two ends of the airbag 7 are respectively fixedly connected to the inner wall of the guide groove 102 and the support seat 8. The chamber 1 306 is connected to the airbag 7 through the pipe 2 305, and a one-way valve is fixedly connected to the pipe 2 305. The gas can enter the airbag 7 from the chamber 1 306 through the one-way valve, which can prevent the gas in the airbag 7 from flowing back to the chamber 1 306, resulting in The detection module 801 continuously scans and takes pictures, which wastes resources. A nozzle 802 for purging the multi-layer circuit board is fixedly provided on the support seat 8. The airbag 7 is connected to the nozzle 802 through the pipe three 701. The pipe three 701 is fixedly connected with a valve, which is a solenoid valve. When in use, the valve on the pipe three 701 is opened, and the gas in the airbag 7 enters the nozzle 802 through the pipe three 701. During this process, the support seat 8 slides from right to left for a return journey. The nozzle 802 can purge the multi-layer circuit board on the return journey, which can make it easier for the detection module 801 to detect leaking solder joints or cold solder joints, thereby improving the detection accuracy. The detection module 801 also scans and takes pictures of the welded pins again.

[0036] The above description is only a preferred specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any technician familiar with the technical field, within the technical scope disclosed by the present invention, who makes equivalent replacements or changes based on the technical solution and inventive concept of the present invention, should be covered by the scope of protection of the present invention.

Claims

1. A device for detecting the firmness of electrical components of a multi-layer circuit board, comprising a detection box (1), characterized in that: Also includes: The mounting seat (2) is symmetrically arranged at both ends of the interior of the detection box (1), and a swing rod (201) is rotatably connected to the detection box (1) for driving the mounting seat (2) to swing. Wherein, a floating roller (5) for clamping the upper and lower sides of the multilayer circuit board is provided in the mounting seat (2), and a vibrating part is provided in the floating roller (5); A detection module (801) for detecting circuit boards is slidably arranged in the detection box (1); A rotating shaft is fixedly provided in the detection box (1), and the swing rod (201) is rotatably connected to the rotating shaft. The swing rod (201) is L-shaped, and the short side of the swing rod (201) is fixedly connected to the mounting seat (2). A driving unit is provided in the detection box (1), and the long side of the swing rod (201) is connected to the driving unit. The driving unit includes: A drive box (3) fixedly arranged in the detection box (1), The drive box (3) is provided with a chamber 1 (306), a chamber 2 and a chamber 3, the chambers 2 and 3 are both slidably connected to piston blocks (301), the piston block (301) is fixedly connected to a drive rod (302), an end of the drive rod (302) away from the piston block (301) is fixedly connected to a second rotating shaft (303), and the swinging rod (201) is provided with a limiting groove (202) slidably connected to the second rotating shaft (303); The detection box (1) is fixedly connected to a pipe (304) that is in communication with chamber one (306), and chamber two and chamber three are respectively in communication with chamber one (306); A guide groove (102) is provided in the detection box (1), a support seat (8) is slidably connected in the guide groove (102), the detection module (801) is fixedly connected to the top of the support seat (8), an airbag (7) is provided in the guide groove (102), two ends of the airbag (7) are fixedly connected to the inner wall of the guide groove (102) and the support seat (8), respectively, the chamber 1 (306) is connected to the airbag (7) through the pipe 2 (305), and a one-way valve is fixedly connected to the pipe 2 (305).

2. A device for detecting the firmness of electrical components of a multi-layer circuit board according to claim 1, characterized in that: Also includes: A cylinder (4) fixedly arranged on the mounting seat (2), The cylinders (4) are symmetrically arranged in two groups, and the output ends of the two groups of cylinders (4) are fixedly connected to sleeves (401), and a slide bar (402) is slidably connected inside the sleeve (401). The floating roller (5) is fixedly connected to the bottom of the slide bar (402), and a clamping roller (501) for clamping the upper and lower sides of the multi-layer circuit board is rotatably connected to the floating roller (5); A spring 1 (403) is sleeved on the slide rod (402), and two ends of the spring 1 (403) are respectively against the sleeve (401) and the slide rod (402).

3. A device for detecting the firmness of electrical components of a multi-layer circuit board according to claim 2, characterized in that: A guide rod (502) is fixedly connected to the floating roller (5), and a guide hole slidably connected to the guide rod (502) is provided on the mounting seat (2).

4. The device for detecting the firmness of electrical components of a multi-layer circuit board according to claim 1, characterized in that: The vibration part includes an eccentric wheel (6), a vibration cavity is provided in the floating roller (5), a motor is fixedly arranged in the vibration cavity, and the eccentric wheel (6) is fixedly connected to the output end of the motor.

5. The device for detecting the firmness of electrical components of a multi-layer circuit board according to claim 1, characterized in that: A second spring is sleeved on the driving rod (302), and two ends of the second spring respectively abut against the piston block (301) and the driving box (3).

6. The device for detecting the firmness of electrical components of a multi-layer circuit board according to claim 1, characterized in that: A nozzle (802) for purging the multi-layer circuit board is fixedly provided on the support seat (8), and the air bag (7) is connected to the nozzle (802) via a third pipe (701), and a valve is fixedly connected to the third pipe (701).

7. The device for detecting the firmness of electrical components of a multi-layer circuit board according to claim 1, characterized in that: The top of the detection box (1) is rotatably connected to a box cover (9), an elastic buckle (901) is fixedly connected to the box cover (9), and a slot engaged with the elastic buckle (901) is provided on the detection box (1).

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