Supercapacitor heat dissipation device
By designing staggered air inlets and outlets and an integrated heat sink structure in the on-board supercapacitor module of electric vehicles, the problem of poor module heat dissipation is solved, a more efficient heat dissipation effect is achieved, and the performance and reliability of the energy storage system are improved.
Patent Information
- Application Number
- CN202211164111.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2022-09-23
- Publication Date
- 2025-09-26
- Estimated Expiration
- 2042-09-23
AI Technical Summary
The heat dissipation effect of existing on-board supercapacitor modules in electric vehicles is not ideal, resulting in excessively high internal temperatures, affecting energy storage performance and lifespan.
A supercapacitor heat dissipation device was designed, which adopts staggered air inlet and exhaust vents, combined with an integrally formed metal heat sink and guide structure to form multiple cavity channels, ensuring directional airflow and improving heat dissipation efficiency.
It achieves a more efficient heat dissipation effect, improves the heat dissipation efficiency of the supercapacitor module by about 30%, ensures the performance and reliability of the on-board energy storage system, and reduces the problem of module overheating.
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Figure CN115662794B_ABST
Abstract
Description
Technical Field
[0001] The present invention belongs to the technical field of electric vehicles, and in particular relates to an on-board energy storage supercapacitor heat dissipation device for electric vehicles. Background Art
[0002] Supercapacitors have the advantages of fast charging speed, high charge and discharge efficiency, high cycle life, excellent power performance, high output power, strong overload capacity and a wide operating temperature range. They are increasingly used as on-board energy storage devices in modern electric vehicles. On-board energy storage supercapacitor devices generally consist of supercapacitor modules and a housing. Because the supercapacitor module has a fully sealed structure, the supercapacitor cells inside it generate a large amount of heat during high current use. To prevent this heat from affecting the operating performance of the supercapacitor, metal heat sink fins are generally attached to the surface of the module, and a fan is used to force ventilation inside the housing to improve the heat dissipation capacity. However, due to the limited installation space of the equipment and the harsh operating environment, the heat dissipation effect of this solution is not ideal. The internal temperature of the supercapacitor module is often too high, resulting in a decrease in energy storage and a shortened lifespan. Summary of the Invention
[0003] In view of the deficiencies in the prior art, the present invention aims to provide a supercapacitor heat dissipation device.
[0004] In order to achieve the above object, the present invention adopts the following technical solutions:
[0005] The present invention provides a supercapacitor heat dissipation device, comprising:
[0006] A box body, wherein a first air inlet and a second air inlet are respectively provided on a pair of first opposite sides of the box body, and a first air outlet and a second air outlet are respectively provided on a pair of second opposite sides of the box body, and a supercapacitor module is disposed in the box body, and the supercapacitor module includes a plurality of supercapacitor cells arranged in parallel;
[0007] a first air inlet guide portion, the first air inlet guide portion being disposed between an inner surface of one of the first opposing side surfaces and the supercapacitor module to form a first air inlet path communicating with the first air inlet;
[0008] a second air inlet guide portion, the second air inlet guide portion being disposed between an inner surface of the other of the first opposing side surfaces and the supercapacitor module to form a second air inlet path communicating with the second air inlet;
[0009] a plurality of heat collecting portions, each of the heat collecting portions being attached to a side surface of the supercapacitor cell and having a hollow cavity, the hollow cavities of the heat collecting portions being in communication with the first air inlet passage and the second air inlet passage, respectively;
[0010] a plurality of guide portions, each of which is provided on the inner surface of the bottom surface of the box body, the bottom of the supercapacitor module is placed on the guide portion, and a guide channel communicating with the hollow cavity of the heat collecting portion is formed between the guide portions;
[0011] a first exhaust guide portion, the first exhaust guide portion being disposed between an inner surface of one of the second opposing side surfaces and the supercapacitor module to form a first exhaust air path communicating with the first exhaust port;
[0012] a second exhaust guide portion, the second exhaust guide portion being disposed between an inner surface of the other of the second opposing side surfaces and the supercapacitor module to form a second exhaust air path communicating with the second exhaust port;
[0013] The first exhaust air path and the second exhaust air path are respectively communicated with the guide channel.
[0014] Furthermore,
[0015] The box body includes a first side surface, a second side surface, a third side surface and a fourth side surface connected in sequence, wherein:
[0016] The first opposite side surfaces of the box body are the first side surface and the third side surface, and the first air inlet and the second air inlet are respectively provided on the first side surface and the third side surface;
[0017] The second opposite side surfaces of the box body are the second side surface and the fourth side surface, and the first air outlet and the second air outlet are respectively provided on the second side surface and the fourth side surface;
[0018] The first exhaust guide portion includes a first exhaust guide plate, a second exhaust guide plate, and a third exhaust guide plate, and the first exhaust guide plate, the second exhaust guide plate, and the third exhaust guide plate are arranged between the inner surface of the fourth side surface of the box and the supercapacitor module to form the first exhaust air path, wherein,
[0019] The second exhaust guide plate is vertically connected to the first exhaust guide plate at one end thereof, and is vertically connected to the third exhaust guide plate at the other end thereof, and the third exhaust guide plate is detachably connected to the second exhaust guide plate and is arranged relatively parallel to the first exhaust guide plate;
[0020] The first air inlet guide portion is a first air inlet guide plate, which is arranged between the inner surface of the first side surface of the box and the supercapacitor module to form the first air inlet path;
[0021] The second air inlet guide portion is a second air inlet guide plate, which is arranged between the inner surface of the third side surface of the box and the supercapacitor module to form the second air inlet path;
[0022] The second exhaust guide portion is a fourth exhaust guide plate, which is arranged between the inner surface of the second side surface of the box and the supercapacitor module to form the second exhaust air path.
[0023] Furthermore,
[0024] Both side ends of the first air inlet guide plate are sealed and fixed to the inner surface of the fourth air exhaust guide plate and the outer surface of the first air exhaust guide plate, respectively; the bottom of the first air inlet guide plate is sealed and fixed to the inner surface of the bottom surface of the box body; and the top of the first air inlet guide plate is at a predetermined distance from the inner surface of the top surface of the box body;
[0025] The two side ends of the second air inlet guide plate are respectively sealed and fixed to the inner surface of the fourth air exhaust guide plate and the outer surface of the first air exhaust guide plate, the bottom of the second air inlet guide plate is sealed and fixed to the inner surface of the bottom surface of the box body, and the top of the second air inlet guide plate is a predetermined distance away from the inner surface of the top surface of the box body.
[0026] Furthermore, the top of the first air inlet guide plate is provided with a first bending portion facing the inner surface of the first side surface of the box body, and the top of the second air inlet guide plate is provided with a second bending portion facing the inner surface of the third side surface of the box body.
[0027] Furthermore, the heat collecting portion is an integrally formed metal heat sink, and the heat sink comprises:
[0028] A heat sink housing having a hollow structure that is closed on all sides and open at the top and bottom ends, wherein the hollow structure forms a cavity that passes through the top and bottom ends, and the heat sink housing is attached to the supercapacitor cell;
[0029] Multiple partition walls are arranged at intervals in the cavity to form multiple cavity channels, and multiple air flow inlets are formed at the top end and multiple air flow outlets are formed at the bottom end. The cavity channels are respectively connected to the first air inlet duct and the second air inlet duct.
[0030] Furthermore, the guide portion includes a support seat arranged at intervals on the inner surface of the bottom surface of the box body, the support seat is parallel to the first relative side surface, the supercapacitor module is placed on the support seat, and the support seat and the inner surface of the bottom surface of the box body form the guide channel connected to the airflow outlet.
[0031] Furthermore,
[0032] Both side ends of the first exhaust guide plate are sealed and fixed to the inner surface of the first side surface and the inner surface of the third side surface of the box body, respectively; the top of the first exhaust guide plate is connected to the inner surface of the top surface of the box body, and the bottom of the first exhaust guide plate is connected to the inner surface of the bottom surface of the box body, and the lower portion of the first exhaust guide plate is provided with a plurality of first guide holes communicating with the guide channel; above the plurality of first guide holes, the second exhaust guide plate is vertically connected to the first exhaust guide plate at one end thereof;
[0033] Both side ends of the second exhaust guide plate and the third exhaust guide plate are respectively connected to the inner surface of the first side surface and the inner surface of the third side surface of the box body, and the upper end of the third exhaust guide plate is detachably connected to the inner surface of the top surface of the box body;
[0034] The portion of the first exhaust guide plate above the second exhaust guide plate, the second exhaust guide plate, and the third exhaust guide plate constitute an electrical chamber housing for accommodating electrical components; the outer surface of the first exhaust guide plate, the inner surface of the first side surface of the box body, the inner surface of the fourth exhaust guide plate, and the inner surface of the third side surface of the box body constitute a capacitor accommodating cavity for accommodating the supercapacitor module;
[0035] The outer surface of the second exhaust guide plate is at a predetermined distance from the inner surface of the bottom surface of the box body, and the outer surface of the third exhaust guide plate is at a predetermined distance from the inner surface of the fourth side surface of the box body, so as to form the first exhaust air path communicating with the first guide hole;
[0036] The two side ends of the fourth exhaust guide plate are respectively sealed and fixed to the inner surface of the first side surface and the inner surface of the third side surface of the box body, the top of the fourth exhaust guide plate is sealed and fixed to the inner surface of the top surface of the box body, the bottom of the fourth exhaust guide plate is connected to the inner surface of the bottom surface of the box body, and the lower part of the fourth exhaust guide plate is provided with a plurality of second guide holes connected to the guide channel to form the second exhaust air path.
[0037] Furthermore, a first fan and a second fan are respectively provided at the first air inlet and the second air inlet.
[0038] Furthermore, a first drainage hole and a second drainage hole are respectively provided on the bottom surface of the box body, between the first air inlet and the first air inlet guide plate, and between the second air inlet and the second air inlet guide plate.
[0039] Furthermore, positions of the first air outlet and the second air outlet on the side surface of the box body are higher than positions of the first air inlet and the second air inlet on the side surface of the box body.
[0040] Compared with the prior art, the beneficial technical effects of the present invention are:
[0041] (1) The air inlet and the air outlet of the present invention are staggered in height to avoid the self-circulation of air inlet and exhaust.
[0042] (2) The air inlet guide plate of the present invention is provided with a bent portion, which facilitates the sedimentation of large solid particles and raindrops, thereby purifying the incoming air. In addition, the provision of the air inlet guide plate plays a role in guiding the airflow, preventing the airflow from diffusing to other places in the box, thereby better maintaining the positive pressure of the gas in the box.
[0043] (3) The use of parallel support seats forms a guide channel for the air flow at the outlet of the metal heat sink cavity, which can guide the gas passing through the lower part of the air flow outlet and disperse it to the exhaust air duct, further improving the cooling effect.
[0044] (4) The heat sink of the present invention has an integrally formed structure and does not require welding, thus overcoming the shortcomings of welding. In addition, the heat sink has multiple cavity channels, which guide the airflow and limit the directional flow of the airflow, ensuring that the supercapacitor modules at different positions in the box and the different parts of each supercapacitor module can receive uniform airflow. The heat dissipation efficiency is about 30% higher than that of conventional heat sinks, and has excellent heat dissipation effect.
[0045] (5) The supercapacitor heat dissipation device of the present invention has a novel heat sink structure and ventilation airflow guide, which solves the problem of module overheating, achieves a significant improvement in the performance and stable operation of the vehicle-mounted energy storage system, and improves reliability, safety and economy. BRIEF DESCRIPTION OF THE DRAWINGS
[0046] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.
[0047] Figure 1 Schematic diagram of the top view of the supercapacitor heat dissipation device of the present invention;
[0048] Figure 2 For Figure 1 A schematic cross-sectional view of the AA section;
[0049] Figure 3For Figure 1 A schematic cross-sectional view of the BB section;
[0050] Figure 4 For Figure 1 A schematic cross-sectional perspective diagram of the BB section;
[0051] Figure 5 A schematic diagram of the three-dimensional structure of a supercapacitor unit equipped with a heat sink of the supercapacitor heat dissipation device of the present invention;
[0052] Figure 6 Schematic diagram of the three-dimensional structure of the heat sink of the supercapacitor heat dissipation device of the present invention;
[0053] Figure 7 The present invention provides a flow chart of a method for preparing a heat sink for a supercapacitor heat sink. DETAILED DESCRIPTION
[0054] In order to make the objectives, technical solutions and advantages of the present invention more clearly understood, the embodiments of the present invention are further described in detail below in conjunction with specific embodiments and with reference to the accompanying drawings.
[0055] The terms "including" and "having" and any variations thereof in the specification and claims of the present invention and the above-mentioned drawings are intended to cover non-exclusive inclusions; the terms "first", "second", "third", "fourth", "fifth", "sixth", etc. in the specification and claims of the present disclosure or the above-mentioned drawings are used to distinguish different objects rather than to describe a specific order. Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which the present disclosure belongs. In the specification and claims of the present invention and the above-mentioned drawings, when an element is referred to as being "fixed on" or "mounted on" or "disposed on" or "connected to" another element, it may be directly or indirectly located on the other element. For example, when an element is referred to as being "connected to" another element, it may be directly or indirectly connected to the other element.
[0056] like Figure 1-5 As shown, the present invention provides a supercapacitor heat dissipation device, including a box body 2, a first air inlet guide part, a second air inlet guide part, multiple heat collecting parts, multiple guide parts, a first exhaust guide part and a second exhaust guide part.
[0057] like Figure 2-4As shown, a first air inlet 19 and a second air inlet 19' are respectively provided on a pair of first opposing side surfaces of the housing 2, and a first air outlet 14 and a second air outlet 14' are provided on a pair of second opposing side surfaces of the housing 2. A supercapacitor module is housed within the housing 2, and the supercapacitor module includes a plurality of supercapacitor cells 1 arranged in parallel. A first air inlet guide is provided between the inner surface of one of the first opposing side surfaces and the supercapacitor module to form a first air inlet path L in communication with the first air inlet 19. A second air inlet guide is provided between the inner surface of the other of the first opposing side surfaces and the supercapacitor module to form a second air inlet path L' in communication with the second air inlet 19'.
[0058] like Figure 5 As described above, each heat collecting portion is attached to the side of the supercapacitor cell 1, specifically, each heat collecting portion is attached to two opposite sides of the supercapacitor cell 1, and the heat collecting portion has a hollow cavity, and the hollow cavity of the heat collecting portion is connected to the first air inlet path L and the second air inlet path L' respectively. Figure 2-4 As shown, the guide part is arranged on the inner surface of the bottom surface 10 of the box body, the bottom of the supercapacitor module is placed on the guide part, and multiple guide channels 16 are formed between the multiple guide parts to communicate with the hollow cavity of the heat collection part. Figure 1 、 3 As shown in FIG4 , a first exhaust guide portion (including a first exhaust guide plate 25, a second exhaust guide plate 27, and a third exhaust guide plate 26) is disposed between the inner surface of one of the second opposing side surfaces and the supercapacitor module to form a first exhaust air path M in communication with the first exhaust port 14. A second exhaust guide portion is disposed between the inner surface of the other of the second opposing side surfaces and the supercapacitor module to form a second exhaust air path M' in communication with the second exhaust port 14'. The first exhaust air path M and the second exhaust air path M' are respectively in communication with the guide channel 16.
[0059] like Figure 1-4 As shown, the housing 2 includes a first side surface 21, a second side surface 22, a third side surface 23, and a fourth side surface 24, which are connected in sequence. The first opposing sides of the housing 2 are the first side surface 21 and the third side surface 23, and the first air inlet 19 and the second air inlet 19' are respectively provided on the first side surface 21 and the third side surface 23. The second opposing sides of the housing 2 are the second side surface 22 and the fourth side surface 24, and the first air outlet 14 and the second air outlet 14' are respectively provided on the second side surface 22 and the fourth side surface 24.
[0060] like Figure 1 、 3As shown in , and 4, the first exhaust guide portion includes a first exhaust guide plate 25, a second exhaust guide plate 27 and a third exhaust guide plate 26, and the first exhaust guide plate 25, the second exhaust guide plate 27 and the third exhaust guide plate 26 are arranged between the inner surface of the fourth side surface 24 of the box body 2 and the supercapacitor module to form a first exhaust air path M.
[0061] The two side ends of the first exhaust guide plate 25 are sealed and fixed to the inner surface of the first side surface 21 and the inner surface of the third side surface 23 of the box body 2, respectively. The top of the first exhaust guide plate 25 is connected to the inner surface of the top surface 12 of the box body, and the bottom of the first exhaust guide plate 25 is connected to the inner surface of the bottom surface 10 of the box body. The lower part of the first exhaust guide plate 25 is provided with a plurality of first guide holes 28 connected to the guide channel 16.
[0062] Above the plurality of first air guide holes 28, a second exhaust guide plate 27 is perpendicularly connected at one end to the first exhaust guide plate 25. The second exhaust guide plate 27 is perpendicularly connected at its other end to a third exhaust guide plate 26. The third exhaust guide plate 26 is detachably connected to the second exhaust guide plate 27 and is disposed relatively parallel to the first exhaust guide plate 25. The second and third exhaust guide plates 27 and 26 have their respective ends connected to the inner surface of the first side surface 21 and the inner surface of the third side surface 23 of the housing 2. The upper end of the third exhaust guide plate 26 is detachably connected to the inner surface of the top surface 12 of the housing.
[0063] It should be understood by those skilled in the art that Figure 3 and 4As shown, the portion of the first exhaust guide plate 25 above the second exhaust guide plate 27, the second exhaust guide plate 27, and the third exhaust guide plate 26 essentially constitute the electrical housing 13 for accommodating electrical components. The outer surface of the bottom surface of the electrical housing 13 (i.e., the outer surface of the second exhaust guide plate 27) is a predetermined distance from the inner surface of the bottom 10 of the housing. The outer surface of one side surface of the electrical housing 13 (i.e., the outer surface of the third exhaust guide plate 26) is a predetermined distance from the inner surface of the fourth side surface 24 of the housing 2, thereby forming a first exhaust airflow path M. Obviously, the first exhaust airflow path M communicates with the first air guide hole 28. Furthermore, the outer surface of one side surface of the electrical housing 13 (i.e., the outer surface of the first exhaust guide plate 25), the inner surface of the first side surface 21 of the housing 2, the inner surface of the fourth exhaust guide plate 20, and the inner surface of the third side surface 23 of the housing 2 form a capacitor housing cavity for accommodating the supercapacitor module. Therefore, the electrical compartment housing 13 not only houses the electrical components but also forms an airflow channel with the side and bottom surfaces of the housing 2 to remove heat from the capacitors. This eliminates the need for additional airflow channels and reduces the volume of the enclosed housing. Furthermore, the second exhaust guide is a fourth exhaust guide plate 20, which is positioned between the inner surface of the second side 22 of the housing 2 and the supercapacitor module to form a second exhaust air path M'.
[0064] like Figure 2 As shown, the first air inlet guide portion is a first air inlet guide plate 8, which is disposed between the inner surface of the first side surface 21 of the housing 2 and the supercapacitor module to form a first air inlet path L. The second air inlet guide portion is a second air inlet guide plate 8', which is disposed between the inner surface of the third side surface 23 of the housing 2 and the supercapacitor module to form a second air inlet path L'.
[0065] like Figure 1 and 2As shown, the two side ends of the first air inlet guide plate 8 are respectively sealed and fixed to the inner surface of the fourth exhaust guide plate 20 and the outer surface of one side of the electrical room shell 13 (that is, the outer surface of the first exhaust guide plate 25), the bottom of the first air inlet guide plate 8 is sealed and fixed to the inner surface of the bottom surface 10 of the box body, and the top of the first air inlet guide plate 8 is at a predetermined distance from the inner surface of the top surface 12 of the box body, thereby allowing the airflow entering from the first air inlet 19 to flow into the cavity of the heat collecting part through the first air inlet path L. The two side ends of the second air inlet guide plate 8' are respectively sealed and fixed to the inner surface of the fourth exhaust guide plate 20 and the outer surface of one side of the electrical room shell 13 (that is, the outer surface of the first exhaust guide plate 25), and the bottom of the second air inlet guide plate 8' is sealed and fixed to the inner surface of the bottom surface 10 of the box body. The top of the second air inlet guide plate 8' is a predetermined distance away from the inner surface of the top surface 12 of the box body, thereby allowing the airflow entering from the second air inlet 19' to flow into the cavity of the heat collecting part through the second air inlet path L'. The setting of the first air inlet guide plate 8 and the second air inlet guide plate 8' plays a role in guiding the airflow, which can prevent the airflow from diffusing to other places in the box body 2, thereby better maintaining the positive pressure of the gas in the box body 2.
[0066] like Figure 2 As shown, the top of the first air inlet guide plate 8 is provided with a first bent portion 18 facing the inner surface of the first side surface 21 of the housing 2, and the top of the second air inlet guide plate 8' is provided with a second bent portion 18' facing the inner surface of the third side surface 23 of the housing 2. The first bent portion 18 and the second bent portion 18' allow large solid particles and raindrops in the airflow to settle, preventing the impurities from flowing into the capacitor housing cavity with the airflow and falling on the capacitor.
[0067] like Figure 5 and 6 As shown, each heat collection unit is an integrally formed metal heat sink 4 connected to a supercapacitor cell 1. The heat sink 4 includes a heat sink housing and multiple partition walls 5. The heat sink housing has a hollow structure that is closed on all sides and open at the top and bottom. The hollow structure is formed into a cavity that passes through the top and bottom ends. The heat sink housing is attached to the supercapacitor cell 1. The partition walls 5 are arranged at intervals within the cavity to form multiple cavity channels, and form multiple accordion-shaped airflow inlets 6 at the top and multiple accordion-shaped airflow outlets 7 at the bottom. The cavity channels are respectively connected to the first air inlet path L and the second air inlet path L'.
[0068] like Figure 5 and 6As shown, the heat sink housing is generally a flat, hollow rectangular parallelepiped structure formed by a first heat sink body 41, a first side wall 43, a second heat sink body 42, and a second side wall 45. The first heat sink body 41 is connected to the side of the supercapacitor cell 1. A plurality of partition walls 5 are arranged at intervals between the first heat sink body 41 and the second heat sink body 42, and the two side ends of each partition wall 5 are respectively perpendicularly connected to the first heat sink body 41 and the second heat sink body 42.
[0069] like Figure 5 and 6 As shown, the first heat sink body 41 has an upper mounting portion 46 extending upward at its top end and higher than the top ends of the first side wall 43, the second heat sink body 42, and the second side wall 45. The first heat sink body 41 has a lower mounting portion 44 extending downward at its bottom end and higher than the bottom ends of the first side wall 43, the second heat sink body 42, and the second side wall 45.
[0070] like Figure 5 and 6 As shown, the second heat sink body 42 includes a first connecting portion 48, which is formed at a side end of the second heat sink body 42 adjacent to the first side wall 43. The first connecting portion 48 extends along the length of the second heat sink body 42 and is recessed inwardly along the thickness direction of the second heat sink body 42. The top end of the first connecting portion 48 is a predetermined distance from the top end of the second heat sink body 42, and the bottom end of the first connecting portion 48 is a predetermined distance from the bottom end of the second heat sink body 42. The second heat sink body 42 also includes a second connecting portion 49, which is formed at a side end of the second heat sink body 42 adjacent to the second side wall 45. The second connecting portion 49 extends along the length of the second heat sink body 42 and is recessed inwardly along the thickness direction of the second heat sink body 42. The top end of the second connecting portion 49 is a predetermined distance from the top end of the second heat sink body 42, and the bottom end of the second connecting portion 49 is a predetermined distance from the bottom end of the second heat sink body 42.
[0071] It should be understood by those skilled in the art that the portion where the heat sink 4 is connected to the supercapacitor cell 1 has a matching shape. Figure 5 and 6 As shown, for example, screws are used to connect the first heat sink body 41 of the heat sink 4 to the side of the supercapacitor cell 1 through the upper mounting portion 46 and the lower mounting portion 44, thereby attaching the heat sink 4 to the supercapacitor cell 1. In order to facilitate heat dissipation, a heat sink 4 is attached to each of the opposite sides of the supercapacitor cell 1. Figure 5As shown, the corresponding connecting portions of the heat sink 4 attached to two opposite sides of the supercapacitor cell 1 are connected together by a U-shaped groove plate 51 to more firmly fix the heat sink 4. In a preferred embodiment, fixing portions 47 are further provided at the four corners of the second heat sink body 42. When the supercapacitor cells 1 with heat sinks 4 installed are arranged side by side, the fixing portions 47 can connect adjacent heat sinks 4.
[0072] In a preferred embodiment, multiple partition walls 5 divide the heat sink 4 cavity into 23 cavity channels. The heat sink is made of an aluminum alloy with the following composition by weight: silicon 0.32%-0.34%, magnesium 0.52%-0.53%, copper 0.05%-0.08%, and the remainder aluminum. The heat sink has a conductivity of 150-160 W / m.
[0073] like Figure 2-4 As shown, the guide portion includes support bases 15 spaced apart on the inner surface of the bottom surface 10 of the housing. The support bases 15 are parallel to the first opposing side surfaces (i.e., the first side surface 21 and the third side surface 23). The supercapacitor module is mounted on the support bases 15. Parallel guide channels 16 communicating with the airflow outlet 7 are formed between the multiple support bases 15 and the inner surface of the bottom surface 10 of the housing. The parallel guide channels 16 can guide the gas passing through the lower portion of the airflow outlet 7 to disperse it toward the exhaust duct.
[0074] like Figure 3 and 4 As shown, both side ends of the fourth exhaust guide plate 20 are sealed and fixed to the inner surface of the first side surface 21 and the inner surface of the third side surface 23 of the box body 2, respectively, the top of the fourth exhaust guide plate 20 is sealed and fixed to the inner surface of the top surface 12 of the box body, the bottom of the fourth exhaust guide plate 20 is connected to the inner surface of the bottom surface 10 of the box body, and the lower part of the fourth exhaust guide plate 20 is provided with a plurality of second guide holes 28' connected to the guide channel 16 to form a second exhaust air path M'.
[0075] like Figure 2 As shown, a first fan 3 and a second fan 3' are respectively provided at the first air inlet 19 and the second air inlet 19'. A first drain hole 9 and a second drain hole 9' are respectively provided on the inner surface of the bottom surface 10 of the housing, between the first air inlet 19 and the first air inlet guide plate 8, and between the second air inlet 19' and the second air inlet guide plate 8'. The first and second air exhaust ports 14 and 14' are positioned higher on the side of the housing 2 than the first and second air inlet 19', thereby preventing self-circulation of the incoming and outgoing air.
[0076] When the supercapacitor heat dissipation device of the present invention is working, the first fan 3 and the second fan 3' at the first air inlet 19 and the second air inlet 19' of the housing 2 send the air outside the housing 2 into the housing 2. At the first air inlet guide plate 8 and the second air inlet guide plate 8', the large solid particles of impurities in the air flow are blocked by the first bending portion 18 and the second bending portion 18' respectively and are allowed to settle. Then, under the guidance of the first air inlet guide plate 8 and the second air inlet guide plate 8', the air flow rises to the upper part of the housing 2, forming a positive pressure, so that the air flow enters the cavity of the heat sink 4 from the air flow inlet 6 of the heat sink 4, and the air flow reaches the air flow outlet 7 through the cavity channel formed by the partition wall 5, thereby taking away the heat conducted from the supercapacitor module to the heat sink 4. The airflow flows out from the airflow outlet 7 of the heat sink 4, passes through the guide channel 16, and flows through the first exhaust air path M under the guidance of the first exhaust guide plate 25, the second exhaust guide plate 27, and the third exhaust guide plate 26. It also flows through the second exhaust air path M' under the guidance of the fourth exhaust guide plate 20, and is finally discharged from the first exhaust port 14 and the second exhaust port 14' of the housing 2. The present invention improves the air duct inside the heat sink so that after entering the housing through the air inlet, the airflow can pass through the cavity of each heat sink attached to the supercapacitor cell. The airflow passes through the entire capacitor housing, thereby increasing the heat dissipation area of the capacitor and improving the heat dissipation efficiency.
[0077] In addition, if Figure 7 As shown, the present invention also provides a method for preparing the above-mentioned heat sink 4, comprising the following steps:
[0078] 1) Transport aluminum alloy rods (e.g., 10 aluminum alloy rods) to an aluminum alloy rod heating furnace, heat them to 480°C-500°C for 3 hours, and keep them warm for 1 hour-1.5 hours.
[0079] In a preferred embodiment, the process further includes the following steps before step 1): hoisting the aluminum alloy rods to a material rack of an aluminum alloy rod heating furnace, laying the aluminum alloy rods flat on the material rack, and ensuring that there is no overlap of rods.
[0080] 2) While the aluminum alloy rod is being heated, place the mold in a mold heating furnace, heat it to 460-480°C, and keep it warm for 2-4 hours. Then, place the mold in the die base of the extruder.
[0081] 3) Shear the aluminum alloy rod after the insulation in step 1) according to production requirements, and then convey it to the extruder, and extrude the aluminum alloy rod while maintaining the temperature of the extrusion part at 380°C ± 5°C.
[0082] In a preferred embodiment, the extrusion component is an extrusion barrel, which is maintained at a temperature of 380°C ± 5°C to maintain the desired temperature during the extrusion process. Furthermore, the profile exit temperature is 510°C-530°C. This temperature refers to the temperature of the aluminum alloy bar upon exiting the die after being shaped. In a preferred embodiment, the main cylinder advances at a speed of 1.5 mm / s-2 mm / s during extrusion.
[0083] 4) The extruded profile is cooled to below 420° C. in a first cooling step, and then the profile is cooled to below 50° C. in a second cooling step.
[0084] In a preferred embodiment, the first cooling step is air-cooled quenching and is carried out in an air-cooled rack at 20M / s-50M / s, and the second cooling step is carried out in a cooling bed. In addition, after the first cooling step, the profile is pulled by a traction machine and the profile is sawn as needed.
[0085] 5) The profile obtained in step 4) is straightened, and then the pulling length is set as required and the profile is sawed.
[0086] 6) The profile obtained in step 5) is transferred to an aging furnace for aging at a temperature of 185°C-190°C and an aging time of 300 min±5 min.
[0087] After step 6), the method further includes the following steps: detecting the Webster hardness of the profile and ensuring that the Webster hardness of the profile is 10HW-12HW.
[0088] In addition, after step 6), the step of finishing the profile is also included, including:
[0089] 7) The profile is milled with a milling thickness of 0.2mm to ensure that the height dimension of the profile meets the requirements.
[0090] 8) Chamfer the profile (R0.5-R1).
[0091] 9) The surface of the profile is sandblasted. To ensure that the color of the two sides of the profile is consistent after sandblasting, the profile is exchanged and sandblasted twice. The speed of the sandblasting machine is 37HZ-39HZ, and the sandblasting steel shot is 0.15mm-0.25mm.
[0092] 10) Since the semi-finished radiator of the present invention has a size of only 290 mm × 500 mm, a minor oxidation treatment is performed on the profile, which includes the following steps in sequence:
[0093] Water washing for 1 min-3 min, degreasing with degreasing agent for 5 min-8 min, water washing for 3 min-5 min, alkaline etching with sheet alkali for 1 min-3 min, alkaline etching temperature is 35℃±5℃, water washing for 1 min-3 min, neutralization with 180±10 g / L free acid for 3 min-5 min, pure water washing for 2 min-4 min, anodizing for 10 min-12 min, anodizing temperature is 20℃±2℃ (the profile is placed in the electrolyte solution as the anode, and an aluminum oxide film is formed on the surface of the profile by electrolysis), medium temperature sealing for 15 min-20 min, medium temperature sealing temperature is 65℃±5℃ (medium temperature sealing is used to make up for the defects of high porosity and high adsorption capacity on the surface anodized film), water washing for 1 min-3 min, curing and drying for 10 min-12 min, curing and drying temperature is 180℃±10℃.
[0094] Furthermore, the threaded sleeve is installed. Because all the round holes are machined to high precision, and some of the round holes are also tapped for screws, each directional radiator must be equipped with a threaded sleeve before it can be packaged.
[0095] In a preferred embodiment, the composition of the aluminum alloy rod is as follows by weight: silicon 0.32%-0.34%, magnesium 0.52%-0.53%, copper 0.05%-0.08%, and the remainder is aluminum.
[0096] Example 1
[0097] The present invention provides a method for preparing the above-mentioned heat sink, comprising the following steps:
[0098] 1) The aluminum alloy rod is transported to the aluminum alloy rod heating furnace, heated to 480°C, and kept warm for 1.5 hours.
[0099] 2) Place the mold in a mold heating furnace, heat it to 460°C, and keep it warm for 4 hours, then place the mold in the extruder die base.
[0100] 3) The aluminum alloy rod after the heat preservation in step 1) is transported to an extruder, and the aluminum alloy rod is extruded while maintaining the temperature of the extrusion part at 375°C.
[0101] The extrusion component, the extrusion barrel, is maintained at a temperature of 375°C to maintain the desired temperature during the extrusion process. Furthermore, the profile exit temperature is 510°C. The main cylinder advances at a speed of 2 mm / s during extrusion.
[0102] 4) The extruded profile is cooled to below 420° C. in a first cooling step, and then the profile is cooled to below 50° C. in a second cooling step.
[0103] The first cooling step is air-cooled quenching and is carried out in an air-cooled rack at 20M / s, and the second cooling step is carried out in a cooling bed. In addition, after the first cooling step, the profile is pulled by a traction machine and the profile is sawn as needed.
[0104] 5) The profile obtained in step 4) is straightened, and then the pulling length is set as required and the profile is sawed.
[0105] 6) The profile obtained in step 5) is transferred to an aging furnace for aging at a temperature of 185°C and an aging time of 305 min.
[0106] After step 6), the method further includes the following steps: detecting the Webster hardness of the profile and ensuring that the Webster hardness of the profile is 10 HW.
[0107] 7) The profile is milled with a milling thickness of 0.2mm to ensure that the height dimension of the profile meets the requirements.
[0108] 8) Chamfer the profile (R0.5-R1).
[0109] 9) The surface of the profile is sandblasted. To ensure that the color of the two sides of the profile is consistent after sandblasting, the profile is sandblasted twice with the upper and lower sides exchanged. The speed of the sandblasting machine is 37HZ, and the sandblasting steel shot is 0.15mm.
[0110] 10) The profile is subjected to a minor oxidation treatment, which includes the following steps in sequence:
[0111] Wash with water for 1 min, degrease with degreaser for 5 min, wash with water for 3 min, alkali etching with sheet alkali for 1 min, alkali etching temperature is 30℃, wash with water for 1 min, neutralize with 170g / L free acid for 3 min, wash with pure water for 2 min, anodize for 10 min, anodize temperature is 18℃, seal at medium temperature for 15 min, seal at medium temperature at 60℃, wash with water for 1 min, cure and dry for 10 min, cure and dry at 170℃.
[0112] The composition of the aluminum alloy rod is as follows by weight: silicon 0.32%, magnesium 0.52%, copper 0.05%, and the remainder is aluminum.
[0113] Example 2
[0114] The present invention provides a method for preparing the above-mentioned heat sink, comprising the following steps:
[0115] 1) The aluminum alloy rod is transported to an aluminum alloy rod heating furnace, heated to 490°C, and kept warm for 1.3 hours.
[0116] 2) Place the mold in a mold heating furnace, heat it to 470°C, and keep it warm for 3 hours, then place the mold in the extruder die base.
[0117] 3) The aluminum alloy rod after the heat preservation in step 1) is transported to an extruder, and the aluminum alloy rod is extruded while maintaining the temperature of the extrusion part at 380°C.
[0118] The extrusion component, the extrusion barrel, is maintained at a temperature of 380°C to maintain the desired temperature during the extrusion process. Furthermore, the profile exit temperature is 520°C. The main cylinder advances at a speed of 1.7 mm / s during extrusion.
[0119] 4) The extruded profile is cooled to below 420° C. in a first cooling step, and then the profile is cooled to below 50° C. in a second cooling step.
[0120] The first cooling step is air-cooled quenching and is carried out in an air-cooled rack at 30M / s, and the second cooling step is carried out in a cooling bed. In addition, after the first cooling step, the profile is pulled by a traction machine and the profile is sawn as needed.
[0121] 5) The profile obtained in step 4) is straightened, and then the pulling length is set as required and the profile is sawed.
[0122] 6) The profile obtained in step 5) is transferred to an aging furnace for aging at a temperature of 188°C for 300 min.
[0123] After step 6), the method further includes the following steps: detecting the Webster hardness of the profile and ensuring that the Webster hardness of the profile is 11 HW.
[0124] 7) The profile is milled with a milling thickness of 0.2mm to ensure that the height dimension of the profile meets the requirements.
[0125] 8) Chamfer the profile (R0.5-R1).
[0126] 9) The surface of the profile is sandblasted. To ensure that the color of the two sides of the profile is consistent after sandblasting, the profile is exchanged and sandblasted twice. The sandblasting machine speed is 38HZ and the sandblasting steel shot is 0.20mm.
[0127] 10) The profile is subjected to a minor oxidation treatment, which includes the following steps in sequence:
[0128] Wash with water for 2 minutes, degrease with degreaser for 7 minutes, wash with water for 4 minutes, alkali etching with sheet alkali for 2 minutes, alkali etching temperature is 35℃, wash with water for 2 minutes, neutralize with 180g / L free acid for 4 minutes, wash with pure water for 3 minutes, anodize for 11 minutes, anodize temperature is 20℃, seal at medium temperature for 18 minutes, seal at medium temperature at 65℃, wash with water for 2 minutes, cure and dry for 11 minutes, cure and dry at 180℃.
[0129] The composition of the aluminum alloy rod is as follows by weight: silicon 0.33%, magnesium 0.525%, copper 0.06%, and the remainder is aluminum.
[0130] Example 3
[0131] The present invention provides a method for preparing the above-mentioned heat sink, comprising the following steps:
[0132] 1) The aluminum alloy rod is transported to the aluminum alloy rod heating furnace, heated to 500°C, and kept warm for 1 hour.
[0133] 2) Place the mold in a mold heating furnace, heat it to 480°C, and keep it warm for 2 hours, then place the mold in the extruder die base.
[0134] 3) The aluminum alloy rod after the heat preservation in step 1) is transported to an extruder, and the aluminum alloy rod is extruded while maintaining the temperature of the extrusion part at 385°C.
[0135] The extrusion component, the extrusion barrel, is maintained at a temperature of 385°C to maintain the temperature during the extrusion process of the aluminum alloy rod. Furthermore, the profile exit temperature is 530°C. The main cylinder advances at a speed of 1.5 mm / s during extrusion.
[0136] 4) The extruded profile is cooled to below 420° C. in a first cooling step, and then the profile is cooled to below 50° C. in a second cooling step.
[0137] The first cooling step is air-cooled quenching and is carried out in an air-cooled rack at 50M / s, and the second cooling step is carried out in a cooling bed. In addition, after the first cooling step, the profile is pulled by a traction machine and the profile is sawn as needed.
[0138] 5) The profile obtained in step 4) is straightened, and then the pulling length is set as required and the profile is sawed.
[0139] 6) The profile obtained in step 5) is transferred to an aging furnace for aging at a temperature of 190°C and an aging time of 295 min.
[0140] After step 6), the method further includes the following steps: detecting the Webster hardness of the profile and ensuring that the Webster hardness of the profile is 12 HW.
[0141] 7) The profile is milled with a milling thickness of 0.2mm to ensure that the height dimension of the profile meets the requirements.
[0142] 8) Chamfer the profile (R0.5-R1).
[0143] 9) The surface of the profile is sandblasted. To ensure that the color of the two sides of the profile is consistent after sandblasting, the profile is sandblasted twice with the upper and lower sides exchanged. The speed of the sandblasting machine is 39HZ, and the sandblasting steel shot is 0.25mm.
[0144] 10) The profile is subjected to a minor oxidation treatment, which includes the following steps in sequence:
[0145] Wash with water for 3 minutes, degrease with degreaser for 8 minutes, wash with water for 5 minutes, alkali etching with sheet alkali for 3 minutes, alkali etching temperature is 40℃, wash with water for 3 minutes, neutralize with 190g / L free acid for 5 minutes, wash with pure water for 4 minutes, anodize for 12 minutes, anodize temperature is 22℃, seal at medium temperature for 20 minutes, seal at medium temperature at 70℃, wash with water for 3 minutes, cure and dry for 12 minutes, cure and dry at 190℃.
[0146] The composition of the aluminum alloy rod is as follows by weight: silicon 0.34%, magnesium 0.53%, copper 0.08%, and the remainder is aluminum.
[0147] The above are exemplary embodiments disclosed in the present invention. The order in which the above embodiments of the present invention are disclosed is for description only and does not represent the advantages and disadvantages of the embodiments. However, it should be noted that the discussion of any of the above embodiments is only exemplary and is not intended to imply that the scope of the disclosure of the embodiments of the present invention (including the claims) is limited to these examples. Various changes and modifications may be made without departing from the scope defined by the claims. The functions, steps and / or actions of the method claims according to the disclosed embodiments described herein do not need to be performed in any particular order. In addition, although the elements disclosed in the embodiments of the present invention may be described or required in individual form, they may also be understood as plural unless expressly limited to the singular.
[0148] Those skilled in the art should understand that the discussion of any of the above embodiments is merely illustrative and is not intended to limit the scope of the disclosure of the present invention (including the claims) to these examples. Within the spirit of the present invention, the technical features of the above embodiments or different embodiments may be combined, and many other variations exist in different aspects of the present invention as described above, which are not provided in detail for the sake of clarity. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.
Claims
1. A supercapacitor heat dissipation device, characterized in that: include: A box body, wherein a first air inlet and a second air inlet are respectively provided on a pair of first opposite sides of the box body, and a first air outlet and a second air outlet are respectively provided on a pair of second opposite sides of the box body, and a supercapacitor module is disposed in the box body, and the supercapacitor module includes a plurality of supercapacitor cells arranged in parallel; a first air inlet guide portion, the first air inlet guide portion being disposed between an inner surface of one of the first opposing side surfaces and the supercapacitor module to form a first air inlet path communicating with the first air inlet; a second air inlet guide portion, the second air inlet guide portion being disposed between an inner surface of the other of the first opposing side surfaces and the supercapacitor module to form a second air inlet path communicating with the second air inlet; a plurality of heat collecting portions, each of the heat collecting portions being attached to a side surface of the supercapacitor cell and having a hollow cavity, the hollow cavities of the heat collecting portions being in communication with the first air inlet passage and the second air inlet passage, respectively; a plurality of guide portions, each of which is provided on the inner surface of the bottom surface of the box body, the bottom of the supercapacitor module is placed on the guide portion, and a guide channel communicating with the hollow cavity of the heat collecting portion is formed between the guide portions; a first exhaust guide portion, the first exhaust guide portion being disposed between an inner surface of one of the second opposing side surfaces and the supercapacitor module to form a first exhaust air path communicating with the first exhaust port; a second exhaust guide portion, the second exhaust guide portion being disposed between an inner surface of the other of the second opposing side surfaces and the supercapacitor module to form a second exhaust air path communicating with the second exhaust port; The first exhaust air passage and the second exhaust air passage are respectively connected to the guide channel; The box body includes a first side surface, a second side surface, a third side surface and a fourth side surface connected in sequence; The first exhaust guide portion includes a first exhaust guide plate, a second exhaust guide plate, and a third exhaust guide plate, wherein the first exhaust guide plate, the second exhaust guide plate, and the third exhaust guide plate are arranged between the inner surface of the fourth side surface of the box and the supercapacitor module to form the first exhaust air path; The second exhaust guide portion is a fourth exhaust guide plate, which is arranged between the inner surface of the second side surface of the box and the supercapacitor module to form the second exhaust air path; Positions of the first air outlet and the second air outlet on the side surface of the box body are higher than positions of the first air inlet and the second air inlet on the side surface of the box body.
2. The supercapacitor heat dissipation device according to claim 1, characterized in that: The first opposite side surfaces of the box body are the first side surface and the third side surface, and the first air inlet and the second air inlet are respectively provided on the first side surface and the third side surface; The second opposite side surfaces of the box body are the second side surface and the fourth side surface, and the first air outlet and the second air outlet are respectively provided on the second side surface and the fourth side surface; The second exhaust guide plate is vertically connected to the first exhaust guide plate at one end thereof, and is vertically connected to the third exhaust guide plate at the other end thereof, and the third exhaust guide plate is detachably connected to the second exhaust guide plate and is arranged relatively parallel to the first exhaust guide plate; The first air inlet guide portion is a first air inlet guide plate, which is arranged between the inner surface of the first side surface of the box and the supercapacitor module to form the first air inlet path; The second air inlet guide portion is a second air inlet guide plate, which is arranged between the inner surface of the third side surface of the box and the supercapacitor module to form the second air inlet path.
3. The supercapacitor heat dissipation device according to claim 2, characterized in that: Both side ends of the first air inlet guide plate are sealed and fixed to the inner surface of the fourth air exhaust guide plate and the outer surface of the first air exhaust guide plate, respectively; the bottom of the first air inlet guide plate is sealed and fixed to the inner surface of the bottom surface of the box body; and the top of the first air inlet guide plate is at a predetermined distance from the inner surface of the top surface of the box body; The two side ends of the second air inlet guide plate are respectively sealed and fixed to the inner surface of the fourth air exhaust guide plate and the outer surface of the first air exhaust guide plate, the bottom of the second air inlet guide plate is sealed and fixed to the inner surface of the bottom surface of the box body, and the top of the second air inlet guide plate is a predetermined distance away from the inner surface of the top surface of the box body.
4. The supercapacitor heat dissipation device according to claim 3, characterized in that: The top of the first air inlet guide plate is provided with a first bent portion facing the inner surface of the first side surface of the box body, and the top of the second air inlet guide plate is provided with a second bent portion facing the inner surface of the third side surface of the box body.
5. The supercapacitor heat dissipation device according to claim 2, characterized in that: The heat collecting portion is an integrally formed metal heat sink, and the heat sink comprises: A heat sink housing having a hollow structure that is closed on all sides and open at the top and bottom ends, wherein the hollow structure forms a cavity that passes through the top and bottom ends, and the heat sink housing is attached to the supercapacitor cell; Multiple partition walls are arranged at intervals in the cavity to form multiple cavity channels, and multiple air flow inlets are formed at the top end and multiple air flow outlets are formed at the bottom end. The cavity channels are respectively connected to the first air inlet duct and the second air inlet duct.
6. The supercapacitor heat dissipation device according to claim 5, characterized in that: The guide portion includes a support seat arranged at intervals on the inner surface of the bottom surface of the box body, the support seat is parallel to the first relative side surface, the supercapacitor module is placed on the support seat, and the support seat and the inner surface of the bottom surface of the box body form the guide channel connected to the airflow outlet.
7. The supercapacitor heat dissipation device according to claim 6, characterized in that: Both side ends of the first exhaust guide plate are sealed and fixed to the inner surface of the first side surface and the inner surface of the third side surface of the box body, respectively; the top of the first exhaust guide plate is connected to the inner surface of the top surface of the box body, and the bottom of the first exhaust guide plate is connected to the inner surface of the bottom surface of the box body, and the lower part of the first exhaust guide plate is provided with a plurality of first guide holes connected to the guide channel; The second air exhaust guide plate is vertically connected to the first air exhaust guide plate at one end above the plurality of first air guide holes; Both side ends of the second exhaust guide plate and the third exhaust guide plate are respectively connected to the inner surface of the first side surface and the inner surface of the third side surface of the box body, and the upper end of the third exhaust guide plate is detachably connected to the inner surface of the top surface of the box body; The portion of the first exhaust guide plate above the second exhaust guide plate, the second exhaust guide plate, and the third exhaust guide plate constitute an electrical chamber housing for accommodating electrical components; the outer surface of the first exhaust guide plate, the inner surface of the first side surface of the box body, the inner surface of the fourth exhaust guide plate, and the inner surface of the third side surface of the box body constitute a capacitor accommodating cavity for accommodating the supercapacitor module; The outer surface of the second exhaust guide plate is at a predetermined distance from the inner surface of the bottom surface of the box body, and the outer surface of the third exhaust guide plate is at a predetermined distance from the inner surface of the fourth side surface of the box body, so as to form the first exhaust air path communicating with the first guide hole; The two side ends of the fourth exhaust guide plate are respectively sealed and fixed to the inner surface of the first side surface and the inner surface of the third side surface of the box body, the top of the fourth exhaust guide plate is sealed and fixed to the inner surface of the top surface of the box body, the bottom of the fourth exhaust guide plate is connected to the inner surface of the bottom surface of the box body, and the lower part of the fourth exhaust guide plate is provided with a plurality of second guide holes connected to the guide channel to form the second exhaust air path.
8. The supercapacitor heat dissipation device according to claim 2, characterized in that: A first fan and a second fan are respectively provided at the first air inlet and the second air inlet.
9. The supercapacitor heat dissipation device according to claim 8, characterized in that: A first drainage hole and a second drainage hole are respectively provided on the bottom surface of the box body, between the first air inlet and the first air inlet guide plate, and between the second air inlet and the second air inlet guide plate.
Citation Information
Patent Citations
Super capacitor heat dissipation device
CN219350015U