Cover plate pressing device and semiconductor process apparatus

Abstract

The application discloses a cover plate pressing device and a semiconductor process equipment. The cover plate pressing device comprises a fixing base which can be fixed to a process chamber, a telescopic cylinder, a supporting shaft and a pressing piece. The telescopic cylinder comprises a cylinder body and a telescopic shaft. The connecting end of the telescopic shaft is sealingly and movably connected with the inner wall of the cylinder body. The cylinder body is fixedly arranged on the fixing base. The cylinder body is provided with a first gas connection port and a second gas connection port. The first gas connection port is arranged on one side of the connecting end. The second gas connection port is arranged on the other side of the connecting end. The supporting shaft is fixed to the fixing base. The pressing piece comprises two opposite ends. The first end of the pressing piece is rotatably connected with the telescopic shaft of the telescopic cylinder. The second end of the pressing piece can be tightly matched with a cover plate. The pressing piece is further provided with a movable groove which extends along the direction of the two opposite ends. The supporting shaft extends into the movable groove along the direction perpendicular to the axial direction of the telescopic shaft. The supporting shaft is rotatably and slidably matched with the movable groove. The technical scheme can simplify the operation process of opening and closing the cover plate.

Description

Technical Field

[0001] This application belongs to the field of semiconductor processing technology, specifically relating to a cover plate clamping device and semiconductor process equipment. Background Technology

[0002] In the silicon carbide growth process, each furnace cycle typically takes several days. For short-term processes, the ease of opening and closing the cover plate is particularly important. Currently, in the growth process, the cover plate is generally placed on the furnace chamber and secured with bolts to create a seal. Afterward, a vacuum is evacuated from the chamber. Once the vacuum level meets the process requirements, the bolts are removed to ensure the cover plate can be opened normally, preventing pressure buildup during the process that could cause the furnace chamber to rupture. Because each opening and closing of the cover plate requires repeatedly screwing in and out the bolts, the operation is cumbersome, labor-intensive, and can negatively impact the processing progress. Summary of the Invention

[0003] This application discloses a cover plate clamping device and semiconductor process equipment, which can solve the problem that the operation process is cumbersome and the workload is large because the bolts need to be repeatedly screwed in and out every time the cover plate is opened and closed, which will also have an adverse effect on the processing.

[0004] To solve the above problems, the embodiments of this application are implemented as follows:

[0005] In a first aspect, embodiments of this application provide a cover plate clamping device, applied in a semiconductor process equipment, the semiconductor process equipment including a cover plate and a process chamber, the cover plate being disposed on the process chamber, and the cover plate clamping device comprising:

[0006] The fixing base can be fixed to the process chamber;

[0007] A telescopic cylinder includes a cylinder body and a telescopic shaft. The connecting end of the telescopic shaft is sealed and movably connected to the inner wall of the cylinder body. The cylinder body is fixedly mounted on the fixed seat, and the cylinder body is provided with a first air inlet and a second air inlet. The first air inlet is located on one side of the connecting end, and the second air inlet is located on the other side of the connecting end.

[0008] A support shaft, which is fixed to the fixed base;

[0009] A clamping component includes two opposing ends, wherein the first end of the clamping component is rotatably connected to the telescopic shaft of the telescopic cylinder, and the second end of the clamping component can be clamped to the cover plate; the clamping component is also provided with a movable groove extending along the direction of the opposing ends, and the support shaft extends into the movable groove in a direction perpendicular to the axial direction of the telescopic shaft, and the support shaft and the movable groove are rotatably and slidably engaged.

[0010] Secondly, embodiments of this application provide a semiconductor process apparatus, which includes a cover plate, a process chamber, and the aforementioned cover plate clamping device. The cover plate is disposed on the process chamber, and the cover plate clamping device is installed in the process chamber.

[0011] This application provides a cover plate clamping device and a semiconductor process equipment. The cover plate clamping device includes a fixed base, a telescopic cylinder and a support shaft mounted on the fixed base, and a clamping member with one end rotatably connected to the telescopic shaft of the telescopic cylinder. The clamping member rotates and slides with the support shaft through its own movable groove. This cover plate clamping device can be applied to semiconductor process equipment and is fixed to the process chamber of the semiconductor process equipment by the fixed base. During the use of the cover plate clamping device, air is supplied to the cylinder through the first air inlet, which drives the telescopic shaft to extend from the cylinder body, thereby driving the clamping member to rotate around the support shaft and apply clamping force to the cover plate. Conversely, air is supplied to the second air inlet, which drives the telescopic shaft to retract, thereby causing the second end of the clamping member to move away from the cover plate to remove the clamping force and ensure that the cover plate can be opened.

[0012] Furthermore, when using the aforementioned cover plate clamping device to clamp the cover plate of the semiconductor process equipment, before the process begins, air is injected into the first air inlet to ensure that the cover plate can be clamped. The air pressure at the first air inlet is controlled to be equal to the critical pressure value required to open the cover plate during the semiconductor process equipment's process. As a result, after the process begins, the pressure in the semiconductor process equipment increases as the process progresses. When the air pressure in the semiconductor process equipment increases to exceed the aforementioned critical pressure value, the telescopic shaft can be driven to retract under the pressure inside the semiconductor process equipment. This causes the cover plate clamping device to loosen the cover plate, allowing the gas inside the semiconductor process equipment to escape, reducing the pressure inside the semiconductor process equipment, and preventing the process chamber from rupturing.

[0013] In addition, when using the above-mentioned cover plate clamping device to open and close the cover plate, there is no need to repeatedly tighten the bolts, which greatly reduces the workload and makes the processing process more compact, thus improving processing efficiency. Attached Figure Description

[0014] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings:

[0015] Figure 1 This is a schematic diagram of a portion of the structure of the semiconductor process equipment disclosed in the embodiments of this application;

[0016] Figure 2 This is a schematic diagram of the assembly of the cover plate clamping device and the flange of the process chamber disclosed in the embodiments of this application;

[0017] Figure 3 This is a schematic diagram of the cooperation between the cover plate clamping device and the cover plate disclosed in the embodiments of this application;

[0018] Figure 4 This is a schematic diagram of the cooperation between the cover plate clamping device and the cover plate in another direction, as disclosed in the embodiments of this application;

[0019] Figure 5 This is a state diagram of the cover plate clamping device disclosed in the embodiments of this application;

[0020] Figure 6 This is another state diagram of the cover plate clamping device disclosed in the embodiments of this application;

[0021] Figure 7 This is a schematic diagram of the structure of the clamping component in the cover plate clamping device disclosed in the embodiments of this application;

[0022] Figure 8 This is a schematic diagram of the structure of the fixing seat in the cover plate clamping device disclosed in the embodiments of this application;

[0023] Figure 9 This is a schematic diagram of a portion of the cover plate clamping device disclosed in the embodiments of this application, including the bearing seat.

[0024] Explanation of reference numerals in the attached figures:

[0025] 100-cover plate,

[0026] 200 - Process chamber, 210 - Reaction chamber, 220 - Flange

[0027] 300-Cover plate clamping device; 310-Fixed seat; 311-Bottom wall; 311a-Through hole; 311b-Mounting hole; 312-Side wall; 312a-Mounting hole; 312b-First side wall; 312c-Second side wall; 312d-Third side wall; 313-Flanged edge; 313a-Adjusting elongated hole; 320-Telescopic cylinder; 321-Cylinder body; 321a-First air inlet; 321b-Second air inlet; 322-Telescopic shaft; 331-Support shaft; 332-Shaft seat; 332a-Shaft hole; 332b-Mounting hole; 333-Connecting rod; 340-Clamping component; 341-Moving groove; 342-Mounting hole; 343-Double elbow joint; 350-Flexible buffer pad; 360-Connector; 370-Pin; 381-Bolt; 382-Nut.

[0028] 400-Lifting mechanism

[0029] 500-Chassis. Detailed Implementation

[0030] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions of this application will be clearly and completely described below in conjunction with specific embodiments and corresponding drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0031] The technical solutions disclosed in the various embodiments of this application are described in detail below with reference to the accompanying drawings.

[0032] like Figures 1-9 As shown in the illustration, this application discloses a cover plate clamping device 300, which can be applied in semiconductor process equipment. The semiconductor process equipment includes a cover plate 100 and a process chamber 200. During the operation of the semiconductor process equipment, the cover plate 100 can be placed on the process chamber 200. Correspondingly, in order to ensure that the cover plate 100 can form a stable fit with the process chamber 200, the cover plate clamping device 300 can be used to clamp the cover plate 100. The cover plate clamping device 300 includes a fixed base 310, a telescopic cylinder 320, a support shaft 331, and a clamping member 340.

[0033] The fixed base 310 serves as the mounting foundation for the entire cover plate clamping device 300. All other components of the cover plate clamping device 300 can be mounted on the fixed base 310, resulting in a higher degree of integration of the entire cover plate clamping device 300. The fixed base 310 can be made of hard materials such as metal to ensure high structural stability. During the installation of the cover plate clamping device 300, the fixed base 310 can be fixed to the process chamber 200. Specifically, the process chamber 200 may include a reaction chamber 210 and a flange 220, with the flange 220 fixedly mounted on the reaction chamber 210. Figure 2 As shown, the fixing seat 310 is fixed to the flange 220. By fixing the fixing seat 310 to the process chamber 200, the cover plate clamping device 300 can apply a reliable clamping force to the cover plate 100 by using the fixing seat 310 as a force point. The fixing seat 310 and the process chamber 200 can be fixed to each other by welding or other means, or the fixing seat 310 can be fixed to a suitable position on the process chamber 200 using bolts 381 or other connecting parts. The shape and size of the fixing seat 310 can be determined according to the actual situation and are not limited here.

[0034] The telescopic cylinder 320 is a component in the cover plate clamping device 300 used to provide clamping force. It includes a cylinder body 321 and a telescopic shaft 322. The two opposite ends of the telescopic shaft 322 can be a driving end and a connecting end, respectively. The driving end can be connected to a driving component such as the clamping member 340 mentioned above. The connecting end extends into the cylinder body 321 and is sealed and movably connected to the inner wall of the cylinder body 321. The cylinder body 321 can be connected to equipment such as an air pump so that by inflating the cylinder body 321, the telescopic shaft 322 can be driven to move relative to the cylinder body 321, thus providing telescopic drive.

[0035] Furthermore, the cylinder body 321 is fixedly mounted on the fixed base 310. Specifically, the cylinder body 321 can be fixed to the fixed base 310 by means of bolts 381 or other connecting parts to ensure that the cylinder body 321 can form a relatively fixed relationship with the process chamber 200. The cylinder body 321 is provided with a first air inlet 321a and a second air inlet 321b, both of which can be connected to equipment such as an air pump to inflate the inner cavity of the cylinder body 321, thereby driving the telescopic shaft 322 to move relative to the cylinder body 321. In order to improve the telescopic performance of the telescopic shaft 322, the first air inlet 321a is located on one side of the connecting end, and the second air inlet 321b is located on the other side of the connecting end. Thus, when the inner cavity of the cylinder body 321 is inflated through different air inlets (including the first air inlet 321a and the second air inlet 321b), the telescopic shaft 322 can be driven to move in opposite directions respectively. For example, the first air inlet 321a can be located on the side of the cylinder body 321 closer to the drive end of the telescopic shaft 322. When air is supplied to the inner cavity of the cylinder body 321 through the first air inlet 321a, the telescopic shaft 322 can retract. Correspondingly, when air is supplied to the inner cavity of the cylinder body 321 through the second air inlet 321b, the telescopic shaft 322 can extend.

[0036] The support shaft 331 is a component that provides support to the clamping member 340. The support shaft 331 is fixed to the fixed base 310 to ensure that the support shaft 331 can provide stable support to the clamping member 340, thereby ensuring that the clamping member 340 can provide a reliable clamping effect to the cover plate 100 under the driving action of the telescopic shaft 322. Specifically, the support shaft 331 can be a columnar structural member with a circular or rectangular cross-section, and can be fixed to the fixed base 310 by welding or connecting with connectors.

[0037] The clamping member 340 is a component in the cover plate clamping device 300 that interacts with the cover plate 100 and provides a clamping effect to the cover plate 100. The clamping member 340 can be made of a material with relatively good hardness and rigidity, such as metal, to ensure that the clamping member 340 has a good clamping effect and a long service life. The clamping member 340 includes two opposing ends, that is, the clamping member 340 can specifically be a rod-shaped structural member. The first end of the clamping member 340 is rotatably connected to the telescopic shaft 322 of the telescopic cylinder 320, so that during the telescopic movement of the telescopic shaft 322 relative to the cylinder body 321, the telescopic shaft 322 can drive the clamping member 340 to move together. Furthermore, as mentioned above, the clamping member 340 also cooperates with the support shaft 331, so that when the telescopic shaft 322 drives the clamping member 340 to move, the second end of the clamping member 340 can be clamped to the cover plate 100.

[0038] Of course, to ensure that the clamping member 340, which applies pressure to the cover plate 100 using the lever principle, can work normally, the clamping member 340 is also provided with a movable groove 341. The movable groove 341 extends along the direction of the opposite ends of the clamping member 340, and the support shaft 331 extends into the movable groove 341 in a direction perpendicular to the axial direction of the telescopic shaft 322, so that the support shaft 331 and the movable groove 341 can rotate and slide together. Specifically, the direction of the opposite ends of the clamping member 340 forms a plane with the axial direction of the telescopic shaft 322. By allowing the end of the support shaft 331 away from the fixed seat 310 to extend into the movable groove 341 from one side of the clamping member 340 in a direction perpendicular to the aforementioned plane, the support shaft 331 can slide together with the movable groove 341 along the extension direction of the movable groove 341, ensuring that the clamping member 340 and the support shaft 331 have the ability to move relative to each other. More specifically, the support shaft 331 can be an L-shaped structure, which may include a first rod and a second rod that are connected to each other and arranged vertically, one of which is mounted on the fixed seat 310 and the other extends into the movable groove 341.

[0039] Furthermore, by enabling relative rotation between the clamping member 340 and the support shaft 331, it is ensured that during the telescopic shaft 322's telescopic movement, the two ends of the clamping member 340 can move relative to each other along the axial direction of the telescopic shaft 322, and the distance between the opposite ends of the clamping member 340 in the direction perpendicular to the axial direction of the telescopic shaft 322 remains unchanged. This ensures that the clamping position of the clamping member 340 on the cover plate 100 remains unchanged, providing a stable and reliable clamping effect for the cover plate 100.

[0040] This application provides a cover plate clamping device 300 and a semiconductor process apparatus. The cover plate clamping device 300 includes a fixed base 310, a telescopic cylinder 320 mounted on the fixed base 310, a support shaft 331, and a clamping member 340, one end of which is rotatably connected to the telescopic shaft 322 of the telescopic cylinder 320. The clamping member 340 is rotatably and slidably engaged with the support shaft 331 through its own movable groove 341. This cover plate clamping device 300 can be applied to a semiconductor process apparatus and is fixed to the process chamber 200 in the semiconductor process apparatus via the fixed base 310. During the use of the cover plate clamping device 300, air is supplied to the telescopic cylinder 320 through the first air inlet 321a, which drives the telescopic shaft 322 to extend from the cylinder body 321, thereby driving the clamping member 340 to rotate around the support shaft 331 and apply clamping force to the cover plate 100. Conversely, air is supplied to the second air inlet 321b, which drives the telescopic shaft 322 to retract, thereby causing the second end of the clamping member 340 to move away from the cover plate 100 to remove the clamping force and ensure that the cover plate 100 can be opened.

[0041] Furthermore, when using the aforementioned cover plate clamping device 300 to clamp the cover plate 100 of the semiconductor process equipment, before the process begins, air is injected into the first air inlet 321a to ensure that the cover plate 100 can be clamped. The air pressure at the first air inlet 321a is controlled to be equal to the critical pressure value required to open the cover plate 100 when the semiconductor process equipment is performing the process. As a result, after the process begins, the pressure in the semiconductor process equipment increases as the process progresses. When the air pressure in the semiconductor process equipment increases to exceed the aforementioned critical pressure value, the telescopic shaft 322 can be driven to retract under the pressure inside the semiconductor process equipment. This causes the cover plate clamping device 300 to release the cover plate 100, allowing the gas inside the semiconductor process equipment to escape, reducing the pressure inside the semiconductor process equipment, and preventing the process chamber 200 from rupturing.

[0042] In addition, during the opening and closing of the cover plate 100 using the cover plate clamping device 300, there is no need to repeatedly tighten the bolts, which greatly reduces the workload and makes the processing process more compact, thus improving processing efficiency.

[0043] Furthermore, the cover plate clamping device 300 disclosed in this application embodiment also includes a flexible buffer pad 350. The second end of the clamping member 340, that is, the end of the clamping member 340 facing away from the telescopic rod and towards the cover plate 100, is provided with the flexible buffer pad 350. Under the action of the flexible buffer pad 350, on the one hand, it can prevent the cover plate 100 and the clamping member 340 from being damaged by mutual squeezing, thereby increasing the service life of the cover plate clamping device 300 and the cover plate 100; on the other hand, it can increase the contact area between the clamping member 340 and the cover plate 100, thereby improving the clamping effect of the clamping member 340 on the cover plate 100. Specifically, the flexible buffer pad 350 can be formed of materials such as rubber, silicone, or foam; more specifically, the flexible buffer pad 350 can be formed of polytetrafluoroethylene. The flexible buffer pad 350 can be fixed to the surface of the second end of the clamping member 340 facing the cover plate 100 by means of adhesion or other methods. In another embodiment of this application, a mounting hole 342 may be provided at the second end of the clamping member 340 to fix the flexible buffer pad 350 to the second end of the clamping member 340 by means of a threaded connector. Furthermore, there may be multiple mounting holes 342 and threaded connectors to further improve the connection reliability between the clamping member 340 and the flexible connector.

[0044] As described above, the shape of the fixing seat 310 can be determined according to the actual situation. Optionally, the fixing seat 310 includes a side wall 312 and a bottom wall 311 connected to each other, with the side wall 312 forming a receiving cavity. The cylinder body 321 is fixed to the side of the bottom wall 311 opposite to the side wall 312; in other words, the cylinder body 321 is fixed below the bottom wall 311. Furthermore, the bottom wall 311 is provided with a through hole 311a, through which the telescopic shaft 322 passes, allowing a portion of the telescopic shaft 322 to be accommodated within the receiving cavity, and ensuring that one end of the telescopic shaft 322 can be connected to the first end of the clamping member 340.

[0045] Furthermore, the side wall 312 has a flange 313 at the end opposite to the bottom wall 311, the support shaft 331 is fixed to the flange 313, and the clamping member 340 is connected to the support shaft 331, allowing the telescopic shaft 322 extending into the receiving cavity from one side of the fixed seat 310 to cooperate with the clamping member 340. As described above, the fixed seat 310 can be fixed to the process chamber 200 in various ways. Based on the above embodiment, optionally, the side wall 312 is also provided with a mounting hole 312a, and the fixed seat 310 can be fixed to the process chamber 200 by a threaded connector passing through the mounting hole 312a. More specifically, in order to prevent the installation structure from damaging the process chamber 200, the threaded connector used to install the fixed seat 310 can be connected to the flange 220 of the process chamber 200. In addition, multiple mounting holes 312a can be formed on the side wall 312 to provide a fixing effect for the fixed seat 310 together with multiple threaded connectors, thereby improving the reliability of the fixing relationship between the fixed seat 310 and the process chamber 200, and thus also improving the pressing reliability of the cover plate pressing device 300.

[0046] As described above, during the assembly of the cover plate clamping device 300, the telescopic cylinder 320 can be fixed to the fixed base 310 in various ways. Optionally, both the telescopic cylinder 320 and the support shaft 331 can be installed on the fixed base 310 using threaded connectors, thereby ensuring a relatively reliable fixing relationship while reducing the assembly difficulty between components. Specifically, the bottom wall 311 can be provided with mounting holes 311b, and the cylinder body 321 can be stably fixed to the bottom wall 311 of the fixed base 310 using connecting components such as bolts 381 and nuts 382.

[0047] As described above, the fixing base 310 can be fixed to the process chamber 200 by means of the mounting holes 312a on its side wall 312. Optionally, the side wall 312 may include a first side wall 312b, a second side wall 312c, and a third side wall 312d. Specifically, the bottom wall 311, the first side wall 312b, the second side wall 312c, and the third side wall 312d can be integrally formed by sheet metal or other processes to improve the structural stability of the entire fixing base 310 and thus improve the load-bearing capacity of the fixing base 310. The first side wall 312b and the second side wall 312c are arranged opposite to each other, and one end of the first side wall 312b and one end of the second side wall 312c are connected through the third side wall 312d, so that the first side wall 312b, the second side wall 312c, and the third side wall 312d form the above-mentioned receiving cavity, and the third side wall 312d is provided with mounting holes 312a. With the above technical solution, the area opposite to the third sidewall 312d is left empty, so that during the process of installing the fixing seat 310 with the help of the mounting hole 312a, the worker can reach into the receiving cavity from outside the fixing seat 310 and install the bolts 381 and other connecting parts at the mounting hole 312a, which reduces the assembly difficulty of the fixing seat 310 and improves the installation reliability.

[0048] As described above, the support shaft 331 can be a segmented structural component, with one part fixed to the fixed seat 310 and the other part extending into the movable groove 341 in a direction perpendicular to the axial direction of the telescopic shaft 322. In another embodiment of this application, the support shaft 331 is a straight rod-shaped structural component. In this case, the movable groove 341 is provided through the clamping member 340, thereby allowing both opposite ends of the support shaft 331 to extend beyond the clamping member 340. Furthermore, the cover plate clamping device 300 disclosed in this application includes two shaft seats 332. Correspondingly, both opposite sides of the side wall 312 of the fixed seat 310 are provided with flanges 313. The two shaft seats 332 are fixed one-to-one on the two flanges 313. Both shaft seats 332 are provided with shaft holes 332a, supporting... The opposite ends of the shaft 331 are respectively inserted into the shaft holes 332a of the two bearing seats 332. This also allows the support shaft 331 of the straight rod-shaped structure to be inserted into the clamping member 340, and allows the clamping member 340 and the support shaft 331 to form a sliding and rotating fit relationship. Furthermore, with the above technical solution, the force on the support shaft 331 is applied to the two bearing seats 332 respectively, which allows the force of the clamping member 340 to be applied to the fixed seat 310 more evenly, thereby improving the stress stability of the cover plate clamping device 300.

[0049] Specifically, the shaft hole 332a can penetrate the bearing seat 332, and a pin-like structural component is used to form a limiting fit between the support shaft 331 and the two bearing seats 332, ensuring that the support shaft 331 can be stably supported on the two bearing seats 332. Furthermore, it allows for relative rotation between the support shaft 331 and the bearing seats 332, improving the smoothness of the fit between the support shaft 331 and the clamping member 340. The size of the flange 313 can be determined according to the actual situation such as the size of the bearing seat 332, and is not limited here. The bearing seat 332 and the flange 313 can also be fixed to each other by welding or other methods. Further, the two bearing seats 332 can be connected together by a connecting rod 333, thereby reducing the assembly difficulty between the bearing seat 332 and the fixed seat 310 during the assembly of the cover plate clamping device 300, and improving the installation accuracy of the bearing seat 332 to a certain extent. Specifically, the connecting rod 333 and the two bearing seats 332 can be formed integrally, which further improves the reliability of the connection between the three.

[0050] In another embodiment of this application, the flange 313 and the bearing seat 332 can also be fixed to each other by a threaded connector. By having the threaded connector pass through the flange 313 and the bearing seat 332, a stable and reliable fixed connection can be formed between the two. Further, the bearing seat 332 is provided with a mounting hole 332b, and the flange 313 is provided with an adjusting elongated hole 313a. The adjusting elongated hole 313a extends along the distribution direction of the opposite ends of the clamping member 340. By means of the adjusting elongated hole 313a, the position of the threaded connector connected to the mounting hole 332b of the bearing seat 332 can be adjusted, thereby changing the position of the support shaft 331, so as to achieve the purpose of adjusting the clamping position of the second end of the clamping member 340, thereby enabling the cover plate clamping device 300 to adapt to more models of cover plates 100 and expanding the application range of the cover plate clamping device 300.

[0051] As described above, the first end of the clamping member 340 is rotatably connected to one end of the telescopic rod. Optionally, the two can be directly rotatably connected by a pin 370 or a universal joint or other rotatable connecting member. In a specific embodiment, the cover plate clamping device 300 further includes a connecting member 360. The first end of the connecting member 360 is provided with an internal thread, and the telescopic rod is provided with an external thread. The first end of the connecting member 360 is detachably connected to the telescopic rod, and the second end of the connecting member 360 is rotatably connected to the first end of the clamping member 340. Specifically, the second end of the connecting member 360 and the first end of the clamping member 340 can be connected to each other by a pin 370. When using the above embodiments, on the one hand, the clamping position of the clamping member 340 can be adjusted by the threaded connecting member and the telescopic rod, thereby expanding the applicability of the cover plate clamping device 300. On the other hand, the connecting member 360 can be used to provide a transition function, thereby reducing the connection difficulty between the clamping member 340 and the telescopic shaft 322, and enabling the cover plate clamping device 300 to be basically compatible with different types and models of cylinders, thus expanding the spare parts range of the cover plate clamping device 300.

[0052] Furthermore, the second end of the connector 360 and the first end of the clamping member 340 each have a single-elbow joint structure and a double-elbow joint 343 structure, respectively. The single-elbow joint structure and the double-elbow joint 343 structure are rotatably connected by a pin 370. Specifically, during the assembly of the connector 360 and the clamping member 340, the single-elbow joint structure is inserted into the gap of the double-elbow joint 343 structure, and then the pin 370 is passed from one side of the double-elbow joint 343 structure to the other side, thus connecting the connector 360 and the clamping member 340 into one unit. This connection structure has relatively high reliability, which can improve the overall stability of the cover plate clamping device 300 and thus improve the clamping effect on the cover plate 100.

[0053] Based on the cover plate clamping device 300 provided in any of the above embodiments, this application also provides a semiconductor process apparatus, which includes a cover plate 100, a process chamber 200, and any of the above-described cover plate clamping devices 300. The cover plate 100 covers the process chamber 200, and the cover plate clamping device 300 is installed in the process chamber 200. Specifically, the fixing seat 310 in the cover plate clamping device 300 is fixedly connected to the process chamber 200. Of course, the semiconductor process apparatus also includes other components such as a lifting mechanism 400. The lifting mechanism 400 is connected to the cover plate 100 to drive the cover plate 100 to perform lifting movements. In addition, a chassis 500 is provided outside the process chamber 200, and the process chamber 200 is supported on the chassis 500 by its flange 220.

[0054] During the operation of the aforementioned semiconductor process equipment, the inflation pressure of devices such as the air pump connected to the telescopic cylinder 320 can be controlled so that the pressure exerted by the air pump on the cover plate 100 through the telescopic shaft 322 is equivalent to the critical pressure value required to open the cover plate 100 during the semiconductor process equipment's operation. Thus, during the semiconductor process equipment's operation, when the pressure inside the process chamber 200 exceeds the aforementioned critical pressure value, the telescopic shaft 322 can be driven to retract under the pressure inside the process chamber 200, thereby releasing the cover plate 100 and ensuring that the cover plate 100 can perform normal pressure relief operation.

[0055] Furthermore, in the semiconductor process equipment disclosed in this application embodiment, the number of cover plate clamping devices 300 can be multiple. These multiple cover plate clamping devices 300 are uniformly and spaced apart around the axial direction of the cover plate 100, so that the multiple cover plate clamping devices 300 can provide clamping action on the cover plate 100 from different positions, thereby improving the clamping effect on the cover plate 100. Specifically, the multiple cover plate clamping devices 300 can have identical structures, and the angle between any two adjacent devices can be equal, improving the uniformity of the clamping effect on the cover plate 100.

[0056] The above embodiments of this application focus on describing the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. For the sake of brevity, they will not be described in detail here.

[0057] The above description is merely an embodiment of this application and is not intended to limit the scope of this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of the claims of this application.

Claims

1. A cover plate clamping device, applied in semiconductor process equipment, the semiconductor process equipment including a cover plate and a process chamber, the cover plate covering the process chamber, characterized in that, The cover plate clamping device includes: The fixing seat is fixed to the process chamber; A telescopic cylinder includes a cylinder body and a telescopic shaft. The connecting end of the telescopic shaft is sealed and movably connected to the inner wall of the cylinder body. The cylinder body is fixedly mounted on the fixed seat, and the cylinder body is provided with a first air inlet and a second air inlet. The first air inlet is located on one side of the connecting end, and the second air inlet is located on the other side of the connecting end. A support shaft, which is fixed to the fixed base; A clamping component includes two opposing ends, wherein a first end of the clamping component is rotatably connected to the telescopic shaft of the telescopic cylinder, and a second end of the clamping component is clamped to the cover plate; the clamping component is also provided with a movable groove extending along the direction of the opposing ends, and a support shaft extends into the movable groove in a direction perpendicular to the axial direction of the telescopic shaft, and the support shaft and the movable groove are rotatably and slidably engaged; When the gas pressure in the semiconductor process equipment increases to a critical pressure value required to open the cover, the telescopic shaft is driven to retract under the pressure inside the semiconductor process equipment, causing the cover clamping device to release the cover.

2. The cover plate clamping device according to claim 1, characterized in that, A flexible cushioning pad is provided at the second end of the clamping member facing the cover plate.

3. The cover plate clamping device according to claim 1, characterized in that, The fixed base includes a side wall and a bottom wall that are connected to each other. The side wall forms a receiving cavity. The cylinder body is fixed to the side of the bottom wall away from the side wall. The bottom wall is provided with a through hole. The telescopic shaft passes through the through hole. The side wall away from the bottom wall is provided with a flange. The support shaft is fixed to the flange. The side wall is provided with a mounting hole. The fixed base is fixed to the process chamber by a threaded connector passing through the mounting hole.

4. The cover plate clamping device according to claim 3, characterized in that, The sidewall includes a first sidewall, a second sidewall, and a third sidewall that form the receiving cavity. The first sidewall and the second sidewall are disposed opposite to each other. One end of the first sidewall and one end of the second sidewall are connected through the third sidewall, and the third sidewall is provided with the mounting hole.

5. The cover plate clamping device according to claim 3, characterized in that, The movable groove is provided through the clamping member. The cover plate clamping device includes two shaft seats. The two opposite sides of the side wall are provided with flanges. The two shaft seats are fixed to the two flanges in a one-to-one correspondence. Both shaft seats are provided with shaft holes, and the opposite ends of the support shaft are respectively inserted into the shaft holes of the two shaft seats.

6. The cover plate clamping device according to claim 5, characterized in that, Each of the aforementioned bearing seats is provided with mounting holes, and each of the aforementioned flanges is provided with adjusting elongated holes. Each of the aforementioned adjusting elongated holes extends along the distribution direction of the opposite ends of the clamping member. The bearing seats and the aforementioned flanges are fixedly connected by threaded connectors.

7. The cover plate clamping device according to claim 1, characterized in that, The cover plate clamping device also includes a connector. The first end of the connector is provided with an internal thread, and the telescopic shaft is provided with an external thread. The first end of the connector is detachably connected to the telescopic shaft, and the second end of the connector is rotatably connected to the first end of the clamping member.

8. The cover plate clamping device according to claim 7, characterized in that, Of the second end of the connector and the first end of the clamping member, one is provided with a single elbow joint structure and the other is provided with a double elbow joint structure. The single elbow joint structure and the double elbow joint structure are rotatably connected by a pin.

9. A semiconductor process apparatus, characterized in that, The device includes a cover plate, a process chamber, and a cover plate clamping device as described in any one of claims 1-8, wherein the cover plate is disposed on the process chamber, and the cover plate clamping device is installed in the process chamber.

10. The semiconductor process equipment according to claim 9, characterized in that, The number of cover plate clamping devices is multiple, and the multiple cover plate clamping devices are evenly and spaced apart around the axial direction of the cover plate.

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