Wafer chamfering device

Abstract

The present invention relates to the technical field of semiconductor product processing equipment, and more particularly to a wafer chamfering device, comprising a frame, a fixing unit, and a grinding unit. The fixing unit includes a vacuum suction cup for adsorbing wafers, a rotating mechanism for driving the vacuum suction cup to rotate, a vertical adjustment mechanism for vertically moving the rotating mechanism, and a horizontal drive mechanism for driving the rotating mechanism to move away from or toward the grinding unit. The vacuum suction cup is connected to an external vacuum pump via an air pipe. The grinding unit includes a grinding wheel assembly and a first drive mechanism. The grinding wheel assembly includes a grinding wheel body and a grinding sleeve sleeved outside the grinding wheel body. The grinding sleeve is formed with a plurality of annular grinding grooves with adjustable opening widths, which are coaxially arranged with an output shaft of the first drive mechanism. The present invention can effectively extend the service life of the grinding wheel, reduce the frequency of grinding wheel replacement, and improve work efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor product processing equipment, and in particular to a wafer chamfering device. Background Art

[0002] Wafers are the carriers used in the production of integrated circuits. They are made by melting polycrystalline silicon, planting seed crystals in the melt, and then slowly pulling them into cylindrical single-crystal silicon rods. After that, they are cut and processed into wafers. The edges of the wafers formed by cutting the silicon rods are very sharp, which can easily scratch the operator in the later production process. At the same time, the sharp edges of the wafers can easily lead to stress concentration at the edges of the wafers, resulting in cracks or other defects. Therefore, the edges of both sides of the sliced wafers need to be chamfered and polished to make the edges of the wafers smoother.

[0003] The existing wafer chamfering device grinds the wafer through the relative movement of the grinding mechanism and the wafer. During the processing, the grinding mechanism is fixed in position and rotates at high speed, and the edge grinding effect is completed through the relative displacement between the grinding wheel and the wafer. There is only one grinding groove on the existing wafer chamfering device. After the grinding groove is worn out, the entire grinding wheel needs to be replaced. After the grinding wheel is replaced and installed again, the rotation accuracy of the grinding wheel needs to be calibrated. Therefore, the service life of the grinding wheel is short, the frequency of grinding wheel replacement is high, the replacement process is long and cumbersome, resulting in low efficiency in wafer chamfering. Summary of the Invention

[0004] In view of the deficiencies of the above-mentioned prior art, the object of the present invention is to provide a wafer chamfering device to solve the problem of low work efficiency caused by high frequency of grinding wheel replacement and long replacement time in the wafer chamfering device in the above-mentioned prior art.

[0005] In order to solve the above technical problems, a technical solution adopted by the present invention is as follows: providing a wafer chamfering device, comprising a frame, a fixing unit arranged on the frame for fixing a wafer, and a grinding unit for grinding and chamfering the edge of the wafer on the fixing unit, the fixing unit comprising a horizontally arranged vacuum suction cup for adsorbing the wafer, a rotating mechanism for driving the vacuum suction cup to rotate around its own axis, a vertical adjustment mechanism for adjusting the rotating mechanism to move vertically up and down, and a horizontal driving mechanism for driving the rotating mechanism to move away from or close to the grinding unit, the vacuum suction cup is connected to an external vacuum pump through an air pipe, the grinding unit comprises a grinding wheel assembly and a first driving mechanism for driving the grinding wheel assembly to rotate to deburr and chamfer the edge of the wafer;

[0006] The grinding wheel assembly includes a grinding wheel body detachably connected to the output shaft of the first driving mechanism and a grinding sleeve detachably connected to the grinding wheel body. The grinding sleeve is formed with a plurality of annular grinding grooves with adjustable opening widths that are coaxially arranged with the output shaft of the first driving mechanism.

[0007] When the above arrangement is used, the wafer to be chamfered is correctly placed and adsorbed on the vacuum suction cup, the rotating mechanism is operated to make the vacuum suction cup drive the wafer to rotate, the first driving mechanism is operated to drive the grinding sleeve to rotate horizontally, and the rotation direction of the first driving mechanism is opposite to the rotation direction of the rotating mechanism. The horizontal driving mechanism is controlled to make the wafer gradually approach the grinding sleeve, and the vertical adjusting mechanism is adjusted to make the horizontal center plane of the wafer and the horizontal center plane of an annular grinding groove equal in height so that when the wafer approaches an annular grinding groove on the grinding sleeve, the upper edge and the lower edge of the wafer respectively contact the upper grinding surface and the lower grinding surface of the annular grinding groove, and the edge of the wafer is ground and chamfered. After the chamfering is completed, the horizontal driving mechanism is controlled to make the vacuum suction cup gradually move away from the grinding sleeve, and the wafer can be removed by stopping the vacuum operation.

[0008] When grinding and chamfering wafers of the same thickness, the edge of the wafer is ground in contact with the same place on the upper grinding surface and the lower grinding surface of the annular grinding groove each time. After a long time, the abrasive at the contact point on the annular grinding groove is worn away to form a gap, causing the annular grinding groove to be unable to be used normally. At this time, the opening width of the annular grinding groove can be adjusted so that the edge of the wafer contacts other places outside the gap on the upper grinding surface and the lower grinding surface of the annular grinding groove. The annular grinding groove can be continued to work until the abrasive on the upper grinding surface and the lower grinding surface of the entire annular grinding groove is used. When the abrasive on the grinding surface of an annular grinding groove is worn away and cannot be used anymore, the wafer can be adjusted to be flush with the next annular grinding groove and the next annular grinding groove can be used to grind and chamfer the wafer. When all the annular grinding grooves on the grinding sleeve have been used, the grinding sleeve can be disassembled and replaced with a new one.

[0009] Furthermore, a ring recess is formed at the lower part of the grinding wheel body, and the grinding sleeve includes an inner ring, a closing ring, a long key, a blocking block and a plurality of grinding rings. The inner ring is sleeved outside the ring recess and is slidably connected to the grinding wheel body. An external thread is provided on the outer wall of the inner ring. The grinding ring is an annular body, and the inner wall of the grinding ring is threadedly connected to the outer wall of the inner ring sleeve. The upper surface and the lower surface of the grinding ring respectively form a lower grinding surface and an upper grinding surface for contacting the edge of the wafer. The annular grinding groove is formed between adjacent grinding rings, and a plurality of first key grooves are evenly distributed on the outer wall of the inner ring, and the first key grooves vertically penetrate the inner ring. , a plurality of second key grooves are evenly distributed on the inner wall of the grinding ring to cooperate with the first key groove, the second key groove vertically penetrates the grinding ring, and an annular hole is formed when the first key groove and the second key groove are aligned, the long key slides in cooperation with the annular hole, a bolt hole is arranged in the first key groove along the radial direction of the inner ring, and a threaded hole cooperating with the bolt hole is arranged on the grinding wheel body, the closed ring is annular, and the closed ring is threadedly connected to the lower outer wall of the ring recess, and a through hole for the long key to pass through is arranged on the closed ring, and the blocking block is detachably connected to the bottom of the grinding wheel body to block the lower end of the long key.

[0010] During specific use, first put the inner ring on the outside of the ring recess, fix the inner ring to the grinding wheel body with bolts, connect multiple grinding rings to the outer thread of the inner ring and adjust the distance between adjacent grinding rings to form multiple annular grinding grooves between adjacent grinding rings, rotate each grinding ring so that the second key groove is aligned with the first key groove to form annular holes arranged up and down, screw the closed ring on the bottom of the ring recess so that the through hole on the closed ring is aligned with the first key groove, insert the long key into each annular hole in turn through the through hole on the closed ring, and then connect a blocking block to the bottom of the grinding wheel body to prevent the long key from sliding out downwards, and fix the grinding ring and the inner ring together with the cooperation of threaded connection and key connection.

[0011] When it is necessary to adjust the spacing between adjacent grinding rings to adjust the opening width of the annular grinding groove, remove the blocking block, pull out the long key, rotate the corresponding grinding ring and align the second keyway on the grinding ring with the first keyway again to adjust the opening width of the corresponding annular grinding groove, insert the long key into the annular hole and connect the blocking block to the bottom of the grinding wheel body to prevent the long key from sliding out downward.

[0012] Furthermore, in order to improve the threaded connection strength and durability of the grinding ring and the inner ring, the grinding ring includes a ring body threadedly connected to the inner ring and a grinding body fixedly connected to the ring body, the second keyway is arranged on the inner wall of the ring body, and the ring body is made of metal.

[0013] Furthermore, the first driving mechanism is a first motor, and the grinding wheel body is detachably connected to the output shaft of the first motor.

[0014] Furthermore, the first keyway and the second keyway are both rectangular keyways, and the long key is a rectangular key.

[0015] Furthermore, the horizontal driving mechanism includes a horizontally arranged transverse guide rail fixedly connected to the frame, a movable plate group slidably connected to the transverse guide rail, and a second motor fixedly connected to the frame that drives the movable plate group to move along the transverse guide rail toward or away from the grinding wheel assembly; the vertical adjusting mechanism includes a support frame fixedly connected to the movable plate group and a hollow threaded rod threadedly connected to the movable plate group, and the hollow threaded rod is vertically arranged; the rotating mechanism includes a hollow shaft motor that drives the vacuum suction cup to rotate, and the vacuum suction cup is coaxially fixedly connected to the hollow shaft of the hollow shaft motor, and the hollow shaft motor is slidably arranged on the support frame, and the hollow threaded rod is coaxially arranged with the hollow shaft motor, the upper end of the hollow threaded rod is rotatably connected to the bottom of the hollow shaft motor, and rotating the hollow threaded rod can drive the hollow shaft motor to slide up and down on the support frame.

[0016] Furthermore, the grinding unit also includes a mounting plate rotatably connected to the frame, the rotation axis of the mounting plate is horizontally arranged, the first motor is arranged on the mounting plate, and the frame is provided with a flip cylinder for driving the mounting plate to flip and a support plate for supporting and keeping the mounting plate in a horizontal state. When the mounting plate is in a horizontal state, the rotation axis of the grinding wheel body is in a vertical state. When the grinding sleeve needs to be replaced, the flip cylinder is operated to open the mounting plate so that there is enough space for operation to install the grinding wheel body and replace the grinding sleeve.

[0017] Furthermore, the frame is provided with a positioning unit for centering the wafer and a loading unit for transferring the wafer to the positioning unit, the positioning unit includes a positioning frame for placing the wafer, an optical sensor for scanning and determining the rotation center of the wafer on the positioning frame, and a positioning robot for transferring the positioned wafer to the vacuum suction cup for correct placement, the loading unit includes a storage box for placing the wafer and a loading robot for transferring the wafer in the storage box to the positioning frame, the frame is fixedly connected to a gantry and a fixed frame, the positioning robot is arranged on the gantry, and the optical sensor is arranged on the fixed frame.

[0018] The wafer to be chamfered is placed in a storage box, and the loading robot is operated to transfer the wafer in the storage box to the positioning frame. The wafer on the positioning frame is centered by an optical sensor and the center position information of the wafer is transmitted to the positioning robot. The positioning robot then transfers the positioned wafer to the vacuum suction cup for adsorption and fixation.

[0019] Furthermore, in order to meet the requirement of forming a straight chamfer on the edge of some wafers, the upper surface and the lower surface of the grinding body are both symmetrically set inclined planes, so that the upper grinding surface and the lower grinding surface of the annular grinding groove are both symmetrically set inclined planes.

[0020] Furthermore, in order to meet the requirement of forming arc chamfers on the edges of some wafers, the upper surface and the lower surface of the grinding body are both symmetrically arranged arc surfaces, so that the upper grinding surface and the lower grinding surface of the annular grinding groove are both symmetrically arranged arc surfaces.

[0021] Compared with the wafer chamfering equipment in the prior art that has only one fixed-width grinding groove, this solution has at least the following beneficial effects:

[0022] First, this solution has multiple annular grinding grooves with adjustable widths. By adjusting the width of the annular grinding grooves, all the abrasives on the grinding surface of the annular grinding grooves can be used, thereby improving the utilization rate of the abrasives on the grinding wheel and extending the service life of a single annular grinding groove. The sequential use of multiple annular grinding grooves further extends the service life of the grinding wheel.

[0023] Second, this solution only requires replacing the grinding sleeve without replacing the grinding wheel body. The grinding sleeve can be replaced quickly and conveniently, avoiding the need to spend a lot of time calibrating the coaxiality of the grinding wheel body and the output shaft after replacing the grinding wheel body, reducing the frequency of grinding wheel replacement, and extending the service life of the grinding wheel after a single replacement.

[0024] Third, by adjusting the width of the annular grinding groove, it is possible to grind chamfers on wafers of different thicknesses. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0026] Figure 1 It is a three-dimensional diagram of the present invention.

[0027] Figure 2 It is a three-dimensional diagram from another perspective of the present invention.

[0028] Figure 3 It is a top view of the present invention.

[0029] Figure 4 for Figure 3 Middle AA section view.

[0030] Figure 5 for Figure 4 Enlarged view of part A in the middle.

[0031] Figure 6 Schematic diagram of the grinding wheel assembly structure.

[0032] Figure 7 for Figure 6 Middle BB cross-section view.

[0033] Figure 8 for Figure 6 Enlarged view of part B in the middle.

[0034] Figure 9 for Figure 7 Enlarged view of part C in the middle.

[0035] Figure 10 Schematic diagram of the grinding wheel body structure.

[0036] The meanings of the reference numerals in the accompanying drawings are:

[0037] Frame 10; gantry 101; fixed frame 102; vacuum suction cup 201; mounting plate 301; support plate 3011; tilting cylinder 3012; first motor 302; output shaft 3021; grinding wheel body 303; annular recess 3031; annular grinding groove 3032; inner ring 304; first keyway 3041; sealing ring 3042; long key 3043; blocking block 3044; screw Bolt hole 3045; through hole 3046; ring body 305; second keyway 3051; grinding body 3052; transverse guide rail 401; movable plate assembly 402; second motor 403; support frame 501; hollow threaded rod 502; hollow shaft motor 601; positioning frame 701; optical sensor 702; positioning robot 703; storage box 801; loading robot 802; wafer 90. DETAILED DESCRIPTION

[0038] To make the purpose, technical solutions, and advantages of this application more clear, the technical solutions of this application will be clearly and completely described below in conjunction with the specific embodiments of this application and the corresponding drawings. Obviously, the embodiments described are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0039] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used in this specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention.

[0040] The present invention discloses a wafer chamfering device, such as Figure 1-Figure 5As shown, it includes a frame 10, a fixing unit arranged on the frame 10 for fixing a wafer 90, and a grinding unit for grinding and chamfering the edge of the wafer 90 on the fixing unit. The fixing unit includes a horizontally arranged vacuum suction cup 201 for adsorbing the wafer 90, a rotating mechanism for driving the vacuum suction cup 201 to rotate about its own axis, a vertical adjustment mechanism for adjusting the rotating mechanism to move vertically up and down, and a horizontal driving mechanism for driving the rotating mechanism to move away from or toward the grinding unit. The vacuum suction cup 201 is connected to an external vacuum pump via an air pipe. The grinding unit includes a grinding wheel assembly, a first motor 302 for driving the grinding wheel assembly to rotate to deburr and chamfer the edge of the wafer 90, and a mounting plate 301 for mounting the first motor 302. In this embodiment, two groups of fixing units and two groups of grinding units cooperating with the two groups of fixing units are provided on the frame 10.

[0041] Combine Figures 6-10 The grinding wheel assembly includes a grinding wheel body 303 detachably connected to the output shaft 3021 of the first motor 302 and a grinding sleeve detachably connected to the grinding wheel body 303. The grinding sleeve is formed with a plurality of annular grinding grooves 3032 coaxially arranged with the output shaft 3021 of the first driving mechanism and having an adjustable opening width. Figure 2 、 Figure 3 The mounting plate 301 is rotatably connected to the frame 10. In this embodiment, there are two mounting plates 301, and the two mounting plates 301 are symmetrically arranged. The rotation axes of the two mounting plates 301 are horizontally arranged. Each mounting plate 301 is provided with a first motor 302, and the first motor 302 is externally powered. The frame 10 is provided with a flip cylinder 3012 for driving the mounting plate 301 to flip and a support plate 3011 for supporting and keeping the mounting plate 301 in a horizontal state. The flip cylinder 3012 is externally connected to an air source, one end of the flip cylinder 3012 is hinged to the frame 10, and the other end of the flip cylinder 3012 is hinged to the side wall of the mounting plate 301. When the mounting plate 301 is in a horizontal state, the rotation axis of the grinding wheel body 303 is in a vertical state.

[0042] like Figure 10 As shown, the lower part of the grinding wheel body 303 forms an annular recess 3031, combined with Figure 6-Figure 9 The grinding sleeve includes an inner ring 304, a closing ring 3042, a long key 3043, a blocking block 3044 and multiple grinding rings. The inner ring 304 is sleeved outside the ring recess 3031 and is slidably connected to the grinding wheel body 303. The outer wall of the inner ring 304 is provided with an external thread.

[0043] like Figure 6-Figure 8The grinding ring is annular and includes a ring body 305 and a grinding body 3052 fixedly connected to the outer wall of the ring body 305. The ring body 305 is made of metal. The inner wall of the ring body 305 is provided with an internal thread that matches the external thread on the outer wall of the inner ring 304. The ring body 305 is threadedly connected to the inner ring 304. The upper surface and lower surface of the grinding body 3052 respectively form a lower grinding surface and an upper grinding surface for contacting the upper edge and lower edge of the wafer 90. The annular grinding groove 3032 is formed between adjacent grinding rings. In this embodiment, the grinding The upper surface and the lower surface of the body 3052 are both symmetrically arranged inclined planes, so that the upper grinding surface and the lower grinding surface of the annular grinding groove 3032 are both symmetrically arranged inclined planes, which are used to meet the needs of some wafers 90 to form straight chamfers on the edges of the wafers 90. In other feasible embodiments, the upper surface and the lower surface of the grinding body 3052 are both symmetrically arranged arc surfaces, so that the upper grinding surface and the lower grinding surface of the annular grinding groove 3032 are both symmetrically arranged arc surfaces, which are used to meet the needs of some wafers 90 to form circular chamfers on the edges of the wafers 90.

[0044] like Figure 7 、 Figure 9 Multiple first key slots 3041 are evenly distributed circumferentially along the outer wall of the inner collar 304. In this embodiment, there are four first key slots 3041. Of course, in other feasible embodiments, the number of first key slots 3041 can be flexibly set as needed, for example, three, five, or more. The first key slot 3041 vertically penetrates the inner collar 304. Four second key slots 3051 are evenly distributed on the inner wall of the ring body 305 to cooperate with the first key slot 3041. The second key slots 3051 vertically penetrate the ring body 305. When the first and second key slots 3041 are aligned, an annular hole is formed. The long key 3043 slides in the annular hole. The first and second key slots 3041, 3051 are both rectangular key slots, and the long key 3043 is a rectangular key.

[0045] A bolt hole 3045 is provided in the radial direction of the inner ring 304 in the first keyway 3041, and a threaded hole matching the bolt hole 3045 is provided on the grinding wheel body 303. The closed ring 3042 is annular, and the closed ring 3042 is threadedly connected to the lower outer wall of the ring recess 3031. A through hole 3046 for accommodating the long key 3043 to pass through is provided on the closed ring 3042. The blocking block 3044 is provided at the bottom of the grinding wheel body 303, and one end of the blocking block 3044 is screwed to the grinding wheel body 303, and the other end of the blocking block 3044 is screwed to the bottom of the closed ring 3042 to block the through hole 3046 and then block the lower end of the long key 3043 to prevent the long key 3043 from sliding downward.

[0046] like Figure 1-Figure 5 The horizontal driving mechanism includes a horizontally arranged transverse guide rail 401 fixedly connected to the frame 10, a movable plate group 402 slidably connected to the transverse guide rail 401, and a second motor 403 fixedly connected to the frame 10 to drive the movable plate group 402 to move along the transverse guide rail 401 toward or away from the grinding wheel assembly. The second motor 403 is a stepping motor, and the second motor 403 is connected to an external power supply. Figure 5 As shown, the vertical adjustment mechanism includes a support frame 501 fixedly connected to the movable plate group 402 and a hollow threaded rod 502 threadedly connected to the movable plate group 402, and the hollow threaded rod 502 is vertically arranged; the rotating mechanism includes a hollow shaft motor 601 for driving the vacuum suction cup 201 to rotate, the vacuum suction cup 201 is coaxially fixedly connected to the hollow shaft of the hollow shaft motor 601, the hollow shaft motor 601 is slidably arranged on the support frame 501, the hollow threaded rod 502 is coaxially arranged with the hollow shaft motor 601, and the upper end of the hollow threaded rod 502 is provided with A thrust bearing is placed to make the hollow threaded rod 502 rotatably connected to the hollow shaft motor 601. Rotating the hollow threaded rod 502 can drive the hollow shaft motor 601 to slide up and down on the support frame 501 to drive the vacuum suction cup 201 to move up and down, thereby adjusting the position height of the wafer 90 on the vacuum suction cup 201. A rotating air pipe joint is connected to the bottom center of the vacuum suction cup 201, and a hard air pipe is connected to the rotating air pipe joint. The hard air pipe vertically passes through the hollow shaft of the hollow shaft motor 601 and the hollow channel of the hollow threaded rod 502 and is connected to an external vacuum pumping equipment to vacuum the vacuum suction cup 201.

[0047] The frame 10 is provided with a positioning unit for centering the wafer 90 and a loading unit for transferring the wafer 90 to the positioning unit. The positioning unit includes a positioning frame 701 for placing the wafer 90, an optical sensor 702 for scanning and determining the rotation center of the wafer 90 on the positioning frame 701, and a positioning robot 703 for transferring the positioned wafer 90 to the vacuum suction cup 201 and correctly placing it. The loading unit includes a storage box 801 for storing the wafer 90 to be chamfered and a loading robot 802 for transferring the wafer 90 in the storage box 801 to the positioning frame 701. The gantry 101 and the fixed frame 102 are fixedly connected to the frame 10. The positioning robot 703 is arranged on the gantry 101, and the optical sensor 702 is arranged on the fixed frame 102.

[0048] When the present invention is actually used, the wafer 90 in the storage box 801 is transferred to the positioning frame 701 by the loading robot 802, the wafer 90 on the positioning frame 701 is centered by the optical sensor 702 and the center position information of the wafer 90 is transmitted to the positioning robot 703, the second motor 403 is operated to drive the movable plate group 402 to move to a fixed position away from the grinding wheel assembly, and then the positioning robot 703 transfers the positioned wafer 90 to the vacuum suction cup 201 for adsorption and fixation, the second motor 403 is operated to drive the movable plate group 402 to move to a fixed position close to the grinding wheel assembly, the hollow shaft motor 601 is operated to drive the vacuum suction cup 201 to rotate, and the first motor 302 is operated to drive the grinding wheel assembly The component rotates horizontally, and the rotation direction of the first motor 302 is opposite to that of the hollow shaft motor 601. The second motor 403 is controlled to drive the movable plate group 402 to move so that the wafer 90 gradually approaches the grinding sleeve, and the hollow threaded rod 502 is adjusted to make the horizontal center plane of the wafer 90 and the horizontal center plane of an annular grinding groove 3032 equal in height so that when the wafer 90 approaches the annular grinding groove 3032 on the grinding sleeve, the upper edge and the lower edge of the wafer 90 respectively contact the upper grinding surface and the lower grinding surface of the annular grinding groove 3032, and the edge of the wafer 90 is ground and chamfered. After the chamfering is completed, the second motor 403 is controlled to make the wafer 90 gradually move away from the grinding wheel assembly, and the wafer 90 can be removed by stopping the operation and vacuuming.

[0049] When grinding and chamfering a wafer 90 of the same thickness, the edge of the wafer 90 is ground in contact with the same place of the upper grinding surface and the lower grinding surface of the annular grinding groove 3032 each time. After a long time, the abrasive at the contact point of the annular grinding groove 3032 is worn away to form a gap, causing the annular grinding groove 3032 to be unable to be used normally. At this time, the blocking block 3044 can be removed, the long key 3043 can be pulled out, and the ring body 305 can be rotated as needed to change the distance between the adjacent grinding bodies 3052 to change the opening width of the annular grinding groove 3032 and realign the first key groove 3041 with the second key groove 3051. Then the long key 3043 can be inserted into the ring formed between the first key groove 3041 and the second key groove 3051. shaped hole, so that the edge of the wafer 90 can contact other places outside the notch on the upper grinding surface and the lower grinding surface of the annular grinding groove 3032, and the annular grinding groove 3032 can continue to be used to work until the abrasives on the upper grinding surface and the lower grinding surface of the entire annular grinding groove 3032 are used. When the abrasives on the grinding surface of an annular grinding groove 3032 are all ground off and cannot be used anymore, the wafer 90 can be adjusted to be flush with the next annular grinding groove 3032 and the next annular grinding groove 3032 can be used to grind and chamfer the wafer 90. When all the annular grinding grooves 3032 on the grinding wheel body 303 are used, the new grinding body 3052 can be replaced by disassembly.

[0050] The above are only embodiments of the present invention, and the common knowledge such as the specific structure and characteristics of the scheme are not described in detail here. It should be pointed out that for those skilled in the art, without departing from the structure of the present invention, several variations and improvements can be made, which should also be regarded as the scope of protection of the present invention, and these will not affect the effect of the implementation of the present invention and the practicality of the patent. The scope of protection required by this application shall be based on the content of its claims, and the specific implementation methods and other records in the specification can be used to interpret the content of the claims.

Claims

1. A wafer chamfering device, comprising a frame, a fixing unit arranged on the frame for fixing a wafer, and a grinding unit for grinding and chamfering the edge of the wafer on the fixing unit, wherein the fixing unit comprises a horizontally arranged vacuum suction cup for adsorbing the wafer, a rotating mechanism for driving the vacuum suction cup to rotate around its own axis, a vertical adjustment mechanism for adjusting the rotating mechanism to move vertically up and down, and a horizontal driving mechanism for driving the rotating mechanism to move away from or close to the grinding unit, the vacuum suction cup is connected to an external vacuum pump through an air pipe, the grinding unit comprises a grinding wheel assembly and a first driving mechanism for driving the grinding wheel assembly to rotate to deburr and chamfer the edge of the wafer, characterized in that: The grinding wheel assembly includes a grinding wheel body detachably connected to the output shaft of the first driving mechanism and a grinding sleeve detachably connected to the grinding wheel body, wherein the grinding sleeve is formed with a plurality of annular grinding grooves with adjustable opening widths and coaxially arranged with the output shaft of the first driving mechanism; The lower part of the grinding wheel body forms a ring recess, and the grinding sleeve comprises an inner ring, a closing ring, a long key, a blocking block and a plurality of grinding rings. The inner ring is sleeved outside the ring recess and is slidably connected to the grinding wheel body. The outer wall of the inner ring is provided with an external thread. The grinding ring is annular, and the inner wall of the grinding ring is threadedly connected to the outer wall of the inner ring sleeve. The upper surface and the lower surface of the grinding ring respectively form a lower grinding surface and an upper grinding surface for contacting the edge of the wafer. The annular grinding groove is formed between adjacent grinding rings. The outer wall of the inner ring is evenly distributed with a plurality of first key grooves, and the first key grooves vertically penetrate the inner ring. A plurality of second key grooves are evenly distributed on the inner wall of the grinding ring in cooperation with the first key groove, and the second key grooves vertically penetrate the grinding ring. An annular hole is formed when the first key groove and the second key groove are aligned, and the long key slides in cooperation with the annular hole. Bolt holes are arranged in the radial direction of the inner ring in the first key groove, and threaded holes that cooperate with the bolt holes are arranged on the grinding wheel body. The closed ring is annular, and the closed ring is threadedly connected to the lower outer wall of the ring recess. A through hole for accommodating the long key to pass through is arranged on the closed ring, and the blocking block is detachably connected to the bottom of the grinding wheel body to block the lower end of the long key.

2. The wafer chamfering device according to claim 1, wherein: The grinding ring includes a ring body threadedly connected to the inner collar and a grinding body fixedly connected to the ring body, and the second keyway is arranged on the inner wall of the ring body.

3. The wafer chamfering device according to claim 2, wherein: The first driving mechanism is a first motor, and the grinding wheel body is detachably connected to the output shaft of the first motor.

4. The wafer chamfering device according to claim 3, wherein: The first keyway and the second keyway are both rectangular keyways, and the long key is a rectangular key.

5. The wafer chamfering device according to claim 4, wherein: The driving mechanism comprises a first motor, a second motor, and a second motor. The first motor is connected to the second guide rails by a fixing mechanism. The first motor is connected to the second guide rail by a fixing mechanism. The first motor is connected to the second guide rail by a fixing mechanism.

6. The wafer chamfering device according to claim 5, wherein: The grinding unit also includes a mounting plate rotatably connected to the frame, the rotation axis of the mounting plate is horizontally arranged, the first motor is arranged on the mounting plate, and the frame is provided with a flip cylinder for driving the mounting plate to flip and a support plate for supporting and keeping the mounting plate in a horizontal state. When the mounting plate is in a horizontal state, the rotation axis of the grinding wheel body is in a vertical state.

7. The wafer chamfering device according to claim 6, wherein: The frame is provided with a positioning unit for centering the wafer and a loading unit for transferring the wafer to the positioning unit. The positioning unit includes a positioning frame for placing the wafer, an optical sensor for scanning and determining the rotation center of the wafer on the positioning frame, and a positioning robot for transferring the positioned wafer to the vacuum suction cup for correct placement. The loading unit includes a storage box for placing the wafer and a loading robot for transferring the wafer in the storage box to the positioning frame. The frame is fixedly connected to a gantry and a fixed frame, the positioning robot is arranged on the gantry, and the optical sensor is arranged on the fixed frame.

8. The wafer chamfering device according to any one of claims 2 to 7, characterized in that: The upper surface and the lower surface of the grinding body are both symmetrically arranged inclined planes, so that the upper grinding surface and the lower grinding surface of the annular grinding groove are both symmetrically arranged inclined planes.

9. The wafer chamfering device according to any one of claims 2 to 7, characterized in that: The upper surface and the lower surface of the grinding body are both symmetrically arranged arcuate surfaces, so that the upper grinding surface and the lower grinding surface of the annular grinding groove are both symmetrically arranged arcuate surfaces.

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