Semiconductor process equipment

Abstract

The present application discloses a semiconductor process equipment, which includes a loading chamber and a sealing device. The chamber wall of the loading chamber has an opening, and the sealing device is used to seal the opening. The sealing device includes a sealing door assembly, a first driving mechanism, a second driving mechanism and an adjusting mechanism, wherein: the first driving mechanism is connected to the sealing door assembly and is used to drive the sealing door assembly to move to a position opposite to or misaligned with the opening; the second driving mechanism is arranged on the chamber wall and is used to drive the sealing door assembly to press against the chamber wall when the sealing door assembly is opposite to the opening; the adjusting mechanism is arranged on the sealing door assembly and is used to adjust the parallelism of the sealing door assembly relative to the chamber wall so that the sealing door assembly seals the opening. The above solution can solve the problem that the sealing door assembly is not tightly sealed to the opening due to the poor parallelism of the sealing door assembly relative to the chamber wall.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor processing technology, and in particular to a semiconductor process equipment. Background Art

[0002] As a precision component, the production process of semiconductor devices has high requirements for the environment. Therefore, semiconductor devices need to be processed in the chamber of semiconductor equipment with a special environment.

[0003] An opening for semiconductor devices to enter and exit the chamber is usually provided on the chamber wall of the semiconductor equipment. During the process of processing the semiconductor devices in the chamber, the sealing door assembly needs to seal the opening of the chamber to meet the environmental requirements of the chamber. Since the opening of the semiconductor chamber is relatively large, the size of the corresponding sealing door assembly is also relatively large. Due to the errors that may occur during the processing of the sealing door assembly, and the deformation of the sealing door assembly caused by the driving action of the driving mechanism when pressing against the semiconductor chamber, when the sealing door assembly seals the opening, the parallelism of the sealing door assembly relative to the chamber wall is relatively poor, resulting in the problem that the sealing door assembly does not seal the opening tightly. Summary of the Invention

[0004] The present invention discloses a semiconductor process equipment to solve the problem that the sealing door assembly has relatively poor parallelism relative to the chamber wall, resulting in the sealing door assembly not sealing the opening tightly.

[0005] In order to solve the above technical problems, the present invention is implemented as follows:

[0006] A semiconductor process equipment includes a loading chamber and a sealing device. The chamber wall of the loading chamber has an opening, and the sealing device is used to seal the opening. The sealing device includes a sealing door assembly, a first driving mechanism, a second driving mechanism, and an adjusting mechanism, where:

[0007] The first driving mechanism is connected to the sealing door assembly and is used to drive the sealing door assembly to move to a position opposite or misaligned with the opening;

[0008] The second driving mechanism is arranged on the chamber wall and is used to drive the sealing door assembly to press against the chamber wall when the sealing door assembly is opposite to the opening;

[0009] The adjusting mechanism is arranged on the sealing door assembly and is used to adjust the parallelism of the sealing door assembly relative to the chamber wall so that the sealing door assembly seals the opening.

[0010] The technical solution adopted by the present invention can achieve the following technical effects:

[0011] In the semiconductor process equipment disclosed in the embodiments of the present application, a sealing door assembly is connected to a first driving mechanism, so that the sealing door assembly can be moved to a position opposite to or misaligned with an opening under the driving action of the first driving mechanism; a second driving mechanism is arranged on the chamber wall, so that when the sealing door assembly is opposite to the opening, the second driving mechanism drives the sealing door assembly to press against the chamber wall; by arranging an adjusting mechanism on the sealing door assembly, when the sealing door assembly does not seal the opening tightly, the parallelism of the sealing door assembly relative to the chamber wall can be adjusted through the adjusting mechanism, so that the sealing door assembly is closely attached to the chamber wall, and finally the sealing door assembly seals the opening well, effectively solving the problem of poor parallelism of the sealing door assembly relative to the chamber wall, and further effectively solving the problem of poor sealing of the sealing door assembly to the opening. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 FIG. is a schematic diagram of a partial structure of the semiconductor process equipment disclosed in the embodiments of the present invention;

[0013] Figure 2 is Figure 1 a top view of the partial structure of the disclosed semiconductor process equipment;

[0014] Figure 3 FIG. is a schematic diagram of the cooperation between the adjusting mechanism and the sealing door assembly disclosed in the embodiments of the present invention;

[0015] Figure 4 FIG. is a top view of the partial structure of the semiconductor process equipment disclosed in the embodiments of the present invention;

[0016] Figure 5 FIG. is a schematic diagram of the structure of the sealing rubber ring disclosed in the embodiments of the present invention;

[0017] Figure 6 FIG. is a schematic diagram of the cooperation between the sealing rubber ring and the door panel through a fixing bracket disclosed in the embodiments of the present invention;

[0018] Figure 7 FIG. is a schematic diagram of the structure of the door panel disclosed in the embodiments of the present invention.

[0019] DESCRIPTION OF REFERENCE NUMERALS:

[0020] 100 - chamber wall,

[0021] 210 - pressing block, 220 - door panel, 221 - limiting groove, 222 - weight reduction groove, 230 - sealing rubber ring, 231 - rubber ring base, 232 - arc protrusion, 240 - fixing bracket,

[0022] 300 - first driving mechanism,

[0023] 400 - second driving mechanism,

[0024] 500-adjustment mechanism, 510-adjustment bracket, 520-adjustment part, 530-connection part,

[0025] 600-Door frame. DETAILED DESCRIPTION

[0026] To make the objectives, technical solutions, and advantages of the present invention more clear, the technical solutions of the present invention will be clearly and completely described below in conjunction with specific embodiments of the present invention and corresponding drawings. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0027] The technical solutions disclosed in various embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0028] Please refer to Figures 1 to 7 The present invention discloses a semiconductor processing apparatus comprising a loading chamber and a sealing device. The loading chamber wall 100 includes an opening for wafers to enter and exit the loading chamber. The sealing device seals the opening after the wafer enters the loading chamber. When the wafer enters and exits the loading chamber, the sealing device avoids the opening to facilitate wafer entry and exit.

[0029] The sealing device includes a sealing door assembly, a first driving mechanism 300 , a second driving mechanism 400 and an adjusting mechanism 500 .

[0030] The sealing door assembly is used to seal the opening. The sealing door assembly can be rotatably connected to the chamber wall 100. For example, one end of the sealing door assembly is hinged to the chamber wall 100, and the sealing door assembly rotates relative to the chamber wall 100 so that the sealing door assembly can rotate to a position opposite to or offset from the opening. The sealing door assembly can also be arranged parallel to the chamber wall 100 and slidably connected to the chamber wall 100. For example, the chamber wall 100 is provided with a sliding groove, and the sealing door assembly is provided with a sliding portion that cooperates with the sliding groove. The sealing door assembly is slidably connected to the chamber wall 100 through the cooperation of the sliding portion and the sliding groove, and the sealing door assembly can slide relative to the chamber wall 100 to a position opposite to or offset from the opening.

[0031] The first drive mechanism 300 is connected to the sealing door assembly, and the first drive mechanism 300 provides power for the movement of the sealing door assembly. The first drive mechanism 300 can be arranged on the chamber wall 100, or the first drive mechanism can be arranged on other components connected to the chamber wall 100. The first drive mechanism 300 is used to drive the sealing door assembly to move to a position relative to or misaligned with the opening. The first drive mechanism 300 can be of various types. For example, the first drive mechanism 300 can be a hydraulic telescopic component, a pneumatic telescopic component, a shape memory alloy component, etc. The embodiments of the present application do not limit the specific type of the first drive mechanism 300.

[0032] The second drive mechanism 400 is disposed on the chamber wall 100 and can be drivingly connected to the sealing door assembly. The second drive mechanism 400 provides power for the sealing door assembly to compress the chamber wall 100. The second drive mechanism 400 is used to drive the sealing door assembly to compress the chamber wall 100 when the sealing door assembly is opposite the opening. When the sealing door assembly is misaligned with the opening, the second drive mechanism 400 does not need to apply driving force. The second drive mechanism 400 can also serve as the basis for the connection between the sealing door assembly and the chamber wall 100.

[0033] Specifically, the second driving mechanism 400 can be of various types. For example, the second driving mechanism 400 can be a hydraulic telescopic part, a pneumatic telescopic part, a shape memory alloy part, etc. The embodiment of the present application does not limit the specific type of the second driving mechanism 400.

[0034] Adjustment mechanism 500 is provided on the sealing door assembly. Adjustment mechanism 500 can be provided at an edge or in the middle of the sealing door assembly. Alternatively, adjustment mechanism 500 can be provided at both the middle and edge of the sealing door assembly. Adjustment mechanism 500 is used to adjust the parallelism of the sealing door assembly relative to chamber wall 100 so that the sealing door assembly seals the opening. Optionally, the strength of adjustment mechanism 500 can be greater than that of the sealing door assembly to facilitate sealing.

[0035] Specifically, the adjustment mechanism 500 can be a frame structure, which is arranged at the edge of the sealing door assembly. The parallelism of the sealing door assembly with respect to the frame structure is manually adjusted to meet the parallelism of the sealing door assembly with respect to the chamber wall 100. The adjustment mechanism 500 can also be composed of a frame structure and an elastic telescopic rod, which is arranged between the frame structure and the sealing door assembly. The elastic telescopic rod adjusts the distance between the sealing door assembly and the frame structure by telescoping, thereby adjusting the parallelism between the sealing door assembly and the chamber wall 100. The adjustment mechanism 500 can also be a clamping mechanism, one end of which is rotatably connected to the chamber wall 100. When the sealing door assembly is pressed against the chamber wall 100, the clamping mechanism presses against the side of the sealing door assembly facing away from the chamber wall 100 to adjust the parallelism between the sealing door assembly and the chamber wall.

[0036] In a specific implementation process, the semiconductor process equipment includes a loading chamber and a sealing device. The chamber wall 100 of the loading chamber has an opening. The first driving mechanism 300 is connected to the sealing door assembly. The first driving mechanism 300 drives the sealing door assembly to move to a position opposite or misaligned with the opening. The second driving mechanism 400 is disposed on the chamber wall 100. The second driving mechanism 400 is used to drive the sealing door assembly to press against the chamber wall 100 when the sealing door assembly is opposite to the opening. The adjusting mechanism is arranged on the sealing door assembly and is used to adjust the parallelism of the sealing door assembly relative to the chamber wall 100 so as to seal the opening by the sealing door assembly.

[0037] In the semiconductor process equipment disclosed in the embodiment of the present application, the first driving mechanism 300 is connected to the sealing door assembly, so that the sealing door assembly can move to a position opposite or misaligned with the opening under the driving action of the first driving mechanism 300; the second driving mechanism 400 is disposed on the chamber wall 100, so that when the sealing door assembly is opposite to the opening, the second driving mechanism 400 drives the sealing door assembly to press against the chamber wall 100; by providing the adjusting mechanism 500 on the sealing door assembly, when the sealing door assembly does not seal the opening tightly, the parallelism of the sealing door assembly relative to the chamber wall 100 can be adjusted through the adjusting mechanism 500, so that the sealing door assembly is closely attached to the chamber wall 100, and finally the sealing door assembly seals the opening well, effectively solving the problem that the parallelism of the sealing door assembly relative to the chamber wall 100 is poor, and further effectively solving the problem that the sealing door assembly does not seal the opening tightly.

[0038] Further, the adjusting mechanism 500 may include an adjusting bracket 510, an adjusting member 520, and a connecting member 530. The adjusting bracket 510 may be a frame structure. The adjusting bracket 510 may be a frame structure formed by integral welding, or may be a frame structure composed of multiple plate-shaped members detachably connected, such as by bolt connection or hinged connection. The adjusting bracket 510 may be disposed along the edge of the sealing door assembly, and the end of the adjusting bracket 510 may be aligned with the end of the sealing door assembly. The adjusting bracket 510 is connected to the sealing door assembly through the connecting member 530, and at the same time, the connecting member 530 can also adjust the distance between the adjusting bracket 510 and the sealing door assembly. The connecting member 530 may be a bolt structure or a snap structure. The adjusting member 520 is disposed on the adjusting bracket 510 and is used to adjust the distance between the adjusting bracket 510 and the sealing door assembly. The adjusting member 520 and the connecting member 530 cooperate with each other to adjust the distance between the sealing door assembly and the adjusting bracket 510. Specifically, the adjusting member 520 may be a setscrew. The setscrew is disposed on the adjusting bracket 510, and one end of the setscrew abuts against the sealing door assembly. Rotating the setscrew can adjust the distance between the sealing door assembly and the adjusting bracket 510. The adjusting member 520 may also be an elastic telescopic rod. The elastic telescopic rod is disposed between the sealing door assembly and the adjusting bracket 510, and the elastic telescopic rod can be telescoped to adjust the distance between the sealing door assembly and the adjusting bracket 510.

[0039] The adjusting bracket 510 is disposed along the edge of the sealing door assembly through the connecting member 530, so that by only adjusting the parallelism between the edge of the sealing door assembly and the chamber wall 100, the sealing of the opening by the sealing door assembly can be realized, thereby making the adjustment of the adjusting mechanism 500 to the sealing door assembly easier and the adjustment efficiency higher. By disposing the adjusting member 520 on the adjusting bracket 510, the adjusting member 520 can adjust the distance between the adjusting bracket 510 and the sealing door assembly, and further adjust the parallelism of the sealing door assembly relative to the chamber wall 100, effectively solving the problem of adjusting the parallelism of the sealing door assembly relative to the chamber wall 100. At the same time, the connecting member 530 can also adjust the distance between the adjusting bracket 510 and the sealing door assembly. By the mutual cooperation of the adjusting member 520 and the connecting member 530, the distance between the adjusting bracket 510 and the sealing door assembly can be better adjusted.

[0040] Specifically, the adjusting bracket 510 may be an L-shaped angle iron, and the adjusting bracket 510 may also be a hollow triangular angle iron. The specific structure and material of the adjusting bracket 510 are not limited herein. The adjusting member 520 may be a hydraulic telescopic member, and the hydraulic telescopic member is disposed between the adjusting bracket 510 and the sealing door assembly. The adjusting member 520 may also be a bolt structure, and the bolt structure is in threaded cooperation with the adjusting bracket 510 so that one end of the bolt abuts against the sealing door assembly to achieve the final adjustment purpose.

[0041] Further, there may be multiple adjusting members 520 and connecting members 530. The adjusting members 520 and the connecting members 530 are arranged at intervals and alternately along the adjustment bracket 510.

[0042] By providing multiple adjusting members 520 and connecting members 530, which are arranged at intervals and alternately along the adjustment bracket 510, the connection between the adjustment bracket 510 and the sealing door assembly is made more stable. Through the mutual cooperation of the multiple adjusting members 520 and connecting members 530, the accuracy of adjusting the distance between the sealing door assembly and the adjustment bracket 510 is higher, so that the parallelism of the sealing door assembly relative to the chamber wall 100 is higher.

[0043] Specifically, the adjusting member 520 may be a setscrew, and the connecting member 530 may be a screw. The adjustment bracket 510 is provided with a connection hole and a first threaded hole, and the sealing door assembly is provided with a second threaded hole. The screw can cooperate with the connection hole and the second threaded hole to connect the adjustment bracket 510 and the sealing door assembly. At the same time, the distance between the adjustment bracket 510 and the sealing door assembly can be adjusted by rotating the screw. The setscrew cooperates with the first threaded hole, and the setscrew can abut against the sealing door assembly to move the sealing door assembly closer to or farther from the adjustment bracket 510, thereby adjusting the parallelism between the sealing door assembly and the chamber wall 100, making the fit between the sealing door assembly and the chamber wall 100 closer and the sealing effect better.

[0044] By setting the adjusting member 520 as a setscrew and the connecting member 530 as a screw, the structures of the adjusting member 520 and the connecting member 530 are simple and the economy is relatively high. At the same time, through the adjustment of the setscrew and the screw, the adjustment of the distance between the adjustment bracket 510 and the sealing door assembly is more convenient.

[0045] In an alternative embodiment, the semiconductor process equipment may further include a door frame 600. The door frame 600 can provide a mounting base for the sealing door assembly. The sealing door assembly can be slidably connected to the door frame 600 so that the sealing door assembly slides along the door frame 600. The door frame 600 can be rotatably connected to the chamber wall 100 so that the sealing door assembly can be rotatably connected to the chamber wall 100 through the door frame 600. The minimum distance between the sealing door assembly and the chamber wall 100 can be 2 mm, and the maximum distance is less than 10 mm.

[0046] The first driving mechanism 300 can be arranged on the door frame 600. The first driving mechanism 300 is used to drive the sealing door assembly to move along the door frame 600 to a position opposite or misaligned with the opening. The second driving mechanism 400 can be connected to the sealing door assembly. When the sealing door assembly is opposite the opening, the second driving mechanism 400 is used to drive the sealing door assembly to rotate and approach the chamber wall 100, so that the sealing door assembly presses against the chamber wall 100. The second driving mechanism 400 can also be connected to the door frame 600, and by driving the door frame 600 to rotate and approach the chamber wall 100, the sealing door assembly can rotate and approach the chamber wall 100 along with the door frame 600.

[0047] By providing the door frame 600, the door frame 600 is rotatably connected to the chamber wall 100. Furthermore, the sealing door assembly is arranged on the door frame. The sealing door assembly can move along the door frame 600 to a position opposite or misaligned with the opening under the driving action of the first driving mechanism 300, effectively improving the accuracy of the movement of the sealing door assembly. At the same time, through the rotation of the door frame 600, the sealing door assembly rotates relative to the chamber wall 100. When the sealing door assembly is opposite the opening, the sealing door assembly can approach the chamber wall 100 under the rotation of the door frame 600 to seal the opening. By rotatably connecting one end of the door frame 600 to the chamber wall 100, the accuracy of the position of the door frame 600 during rotation can be improved, thereby improving the position accuracy when the sealing door assembly is opposite the opening.

[0048] Specifically, the door frame 600 can be a flexible hinge structural member or a welded structural member. One end of the door frame 600 is rotatably connected to the chamber wall 100. The rotation angle between the door frame 600 and the chamber wall 100 can be about 2 degrees. For example, the cooperation angle can be 2 degrees.

[0049] Furthermore, the upper and lower sides of the door frame 600 can be sliding shafts. One side of the door frame 600 connected to both the upper and lower sides is rotatably connected to the chamber wall 100. The sealing door assembly can include pressing blocks 210 that cooperate with the sliding shafts. The pressing blocks 210 can be arranged at opposite ends of the sealing door assembly. The pressing blocks 210 can be welded to the sealing door assembly or connected by screws. The sealing door assembly can be connected to the door frame 600 through the cooperation of the pressing blocks 210 and the sliding shafts and can slide along the door frame 600. The pressing blocks 210 can be sleeved on the sliding shafts. The sealing door assembly moves to a position opposite or misaligned with the opening through the sliding cooperation of the pressing blocks 210 and the sliding shafts.

[0050] By setting the upper and lower sides of the door frame 600 as sliding shafts, the sealing door assembly is slidably connected to the door frame 600, so that the sealing door assembly can slide along the door frame 600 through the sliding cooperation between the clamping block 210 and the sliding shaft, effectively solving the connection problem between the sealing door assembly and the door frame, and the problem of the sealing door assembly moving along the door frame 600. At the same time, the sliding connection can also reduce the friction of the sealing door assembly when moving along the door frame 600.

[0051] In an optional embodiment, the sealing door assembly may further include a door panel 220 and a sealing rubber ring 230. The sealing rubber ring 230 may be arranged along the edge of the door panel 220. The sealing rubber ring 230 includes a rubber ring base 231 and a circular arc protrusion 232. The circular arc protrusion 232 is located at one end of the rubber ring base 231. The sealing rubber ring 230 is connected to the door panel 220 via the rubber ring base 231. The sealing rubber ring 230 may be bonded to the door panel 220 or fixed to the door panel 220 by screws. When the second driving mechanism 400 drives the door panel 220 to press against the chamber wall 100, the circular arc protrusion 232 is pressed between the door panel 220 and the chamber wall 100 and undergoes elastic deformation to seal the opening.

[0052] By configuring the sealing door assembly with a door panel 220 and a sealing rubber ring 230, when the door panel 220 is pressed against the opening, the sealing rubber ring 230 is compressed between the door panel 220 and the chamber wall 100 and elastically deforms, thereby enhancing the sealing effect of the sealing door assembly on the opening. The arc-shaped protrusion 232 of the sealing rubber ring 230 allows the sealing rubber ring 230 to form a linear seal with the chamber wall 100 when deformed by force, thereby enhancing the sealing effect.

[0053] Furthermore, the door panel 220 may be provided with a retaining groove 221, and a rubber ring base 231 may be disposed in the retaining groove 221 and abut against the bottom of the retaining groove 221. The end of the rubber ring base 231 facing away from the arcuate protrusion 232 may be aligned with an end of the door panel 220. The sealed door assembly may further include a fixing bracket 240 connected to the door panel 220 for securing the end of the rubber ring base 231 facing away from the arcuate protrusion 232 to the door panel 220.

[0054] By setting the limiting groove 221, the sealing rubber ring 230 can be stably set in the limiting groove 221 through the cooperation between the rubber ring base 231 and the limiting groove 221. By setting the fixing bracket 240, the end of the rubber ring base 231 away from the arc protrusion 232 is fixed to the door panel 220, so that the sealing rubber ring 230 is stably fixed on the door panel 220.

[0055] Specifically, the fixing bracket 240 can be an L-shaped structural member, one side plate of the L-shaped structural member presses the end of the rubber ring base 231 away from the arc protrusion 232, and the other side plate of the L-shaped structural member rests on the end of the sealing door assembly. A mounting hole is provided on the side plate resting on the end of the sealing door assembly, and the end of the sealing door assembly has a threaded hole opposite to the mounting hole. The bolt passes through the mounting hole and cooperates with the threaded hole, so that the L-shaped structural member fixes the sealing rubber ring 230 to the door panel 220.

[0056] Furthermore, the material of the sealing rubber ring 230 can be silicone sponge. Silicone sponge has good elasticity and high wear resistance, which can effectively improve the sealing effect and the service life of the sealing rubber ring 230.

[0057] As an optional embodiment, the door panel 220 may be provided with a weight-reducing groove 222. There may be multiple weight-reducing grooves 222, which may be evenly distributed across the surface of the door panel 220. The provision of the weight-reducing grooves 222 reduces the overall weight of the door panel 220, thereby reducing the force acting on the sealed door assembly during movement and improving economic efficiency.

[0058] In an optional embodiment, multiple second drive mechanisms 400 may be provided, each of which is spaced apart on the chamber wall 100. The multiple second drive mechanisms 400 may be evenly spaced along the length of the sealing door assembly. By providing multiple second drive mechanisms 400 to drive the sealing door assembly to press against the chamber wall 100, the sealing door assembly is evenly stressed when pressing against the chamber wall 100, thereby ensuring that the sealing door assembly effectively seals the opening.

[0059] The above embodiments of the present invention focus on the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. Considering the simplicity of the text, they will not be repeated here.

[0060] The embodiments of the present invention are described above in conjunction with the accompanying drawings, but the present invention is not limited to the above-mentioned specific implementation modes, which are merely illustrative rather than restrictive. Under the guidance of the present invention, ordinary technicians in this field can also make many forms without departing from the scope of protection of the present invention and the claims, all of which are within the protection of the present invention.

Claims

1. A semiconductor processing device, characterized in that, It includes a loading chamber and a sealing device. The chamber wall (100) of the loading chamber has an opening, and the sealing device is used to seal the opening. The sealing device includes a sealing door assembly, a first driving mechanism (300), a second driving mechanism (400), and an adjusting mechanism (500), where: The first driving mechanism (300) is connected to the sealing door assembly and is used to drive the sealing door assembly to move to a position opposite to or misaligned with the opening; The second driving mechanism (400) is arranged on the chamber wall (100) and is used to drive the sealing door assembly to press against the chamber wall (100) when the sealing door assembly is opposite to the opening; The adjusting mechanism (500) is arranged on the sealing door assembly and is used to adjust the parallelism of the sealing door assembly relative to the chamber wall (100) so that the sealing door assembly seals the opening; The adjusting mechanism (500) includes an adjusting bracket (510), an adjusting member (520), and a connecting member (530). The adjusting bracket (510) is of a frame structure. The adjusting bracket (510) is arranged along the edge of the sealing door assembly. The adjusting bracket (510) is connected to the sealing door assembly through the connecting member (530). The adjusting member (520) is arranged on the adjusting bracket (510) and is used to adjust the distance between the adjusting bracket (510) and the sealing door assembly.

2. The semiconductor processing equipment according to claim 1, wherein Both the adjusting member (520) and the connecting member (530) are multiple. The adjusting member (520) and the connecting member (530) are arranged at intervals and alternately along the adjusting bracket (510).

3. The semiconductor process equipment according to claim 1, characterized in that, The adjusting member (520) is a setscrew, and the connecting member (530) is a screw. The adjusting bracket (510) is provided with a connecting hole and a first threaded hole, and the sealing door assembly is provided with a second threaded hole. The screw cooperates with the connecting hole and the second threaded hole to connect the adjusting bracket (510) and the sealing door assembly. The setscrew cooperates with the first threaded hole and abuts against the sealing door assembly to make the sealing door assembly close to or away from the adjusting bracket (510).

4. The semiconductor processing equipment according to claim 1, characterized in that, The semiconductor process equipment further includes a door frame (600). The sealing door assembly is rotatably connected to the chamber wall (100) through the door frame (600). The first driving mechanism (300) is arranged on the door frame (600). The first driving mechanism (300) is used to drive the sealing door assembly to move along the door frame (600) to a position opposite to or misaligned with the opening. The second driving mechanism (400) is used to drive the sealing door assembly to rotate and approach the chamber wall (100) when the sealing door assembly is opposite to the opening, so that the sealing door assembly presses against the chamber wall (100).

5. The semiconductor processing equipment according to claim 1, wherein, The sealing door assembly comprises a door panel (220) and a sealing rubber ring (230), wherein the sealing rubber ring (230) is arranged along the edge of the door panel (220), and the sealing rubber ring (230) comprises a rubber ring base (231) and a circular arc protrusion (232), wherein the circular arc protrusion (232) is located at one end of the rubber ring base (231), and the sealing rubber ring (230) is connected to the door panel (220) via the rubber ring base (231). When the second driving mechanism (400) drives the door panel (220) to press the chamber wall (100), the circular arc protrusion (232) is pressed between the door panel (220) and the chamber wall (100), and generates elastic deformation to seal the opening.

6. The semiconductor processing equipment according to claim 5, characterized in that, The door panel (220) is provided with a limiting groove (221), the rubber ring base (231) is provided in the limiting groove (221) and abuts against the bottom of the limiting groove (221), and one end of the rubber ring base (231) facing away from the arc protrusion (232) is aligned with the end of the door panel (220), and the sealing door assembly further includes a fixing bracket (240), the fixing bracket (240) being connected to the door panel (220) and being used for fixing one end of the rubber ring base (231) facing away from the arc protrusion (232) to the door panel (220).

7. The semiconductor processing equipment according to claim 5, characterized in that, The material of the sealing rubber ring (230) is silicone sponge.

8. The semiconductor process equipment according to claim 5, characterized in that, The door panel (220) is provided with a weight-reducing groove (222).

9. The semiconductor process equipment according to claim 1, characterized in that, There are multiple second driving mechanisms (400), and the multiple second driving mechanisms (400) are arranged at intervals on the chamber wall (100).

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