Hydrogen sensor with dustproof and heating functions and preparation method thereof

By integrating a micro-nano dust cover and heating components in a hydrogen sensor, the problems of low heating efficiency and poor dust protection are solved, enabling efficient and accurate hydrogen concentration detection and miniaturized design of the hydrogen sensor.

CN115684274BActive Publication Date: 2026-06-26LASER FUSION RES CENT CHINA ACAD OF ENG PHYSICS
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
LASER FUSION RES CENT CHINA ACAD OF ENG PHYSICS
Filing Date
2022-11-14
Publication Date
2026-06-26

AI Technical Summary

Technical Problem

Existing hydrogen sensors suffer from low efficiency and poor temperature uniformity in their heating methods, and their dustproof performance is inadequate, resulting in large package size and affecting device performance.

Method used

A palladium-nickel alloy thin film is encapsulated with a micro-nano dust cover, and a heating component is integrated on it. Uniform heating and dust prevention are achieved through micron-level through-holes. At the same time, the temperature sensing film feedback sensitivity and stability are set. Hydrogen sensors are fabricated using processes such as PECVD, RIE, and DRIE.

Benefits of technology

This technology achieves uniform heating of the hydrogen sensor, micron-level dust protection, reduced packaging size, improved sensitivity and stability, and ensures measurement and dust protection performance.

✦ Generated by Eureka AI based on patent content.

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  • Figure CN115684274B_ABST
    Figure CN115684274B_ABST
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Abstract

The application discloses a hydrogen sensor with dustproof and heating functions, which comprises a substrate, a palladium-nickel alloy film arranged on the substrate, two first lead electrodes arranged on the substrate for connecting the palladium-nickel alloy film, a micro-nano dustproof cover which is bonded with the substrate to form a cavity, the palladium-nickel alloy film is located in the cavity, and a plurality of first through holes in the micron level are vertically arranged on the substrate corresponding to the micro-nano dustproof cover, and a heating assembly which is arranged on the micro-nano dustproof cover and corresponds to the palladium-nickel alloy film. According to the application, the palladium-nickel alloy film is packaged and dustproofed by the micro-nano dustproof cover, and the heating assembly is integrally arranged on the micro-nano dustproof cover, so that the hydrogen sensor is uniformly heated, the packaging volume is greatly reduced while the micron-level dustproofing is realized, and the beneficial effects of improving the dustproof effect, guaranteeing the heating effect and reducing the packaging volume are achieved.
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