Method for updating production report, production control system, device, medium and apparatus

Abstract

The disclosure provides a production report updating method, a production control system, a device, a medium and equipment, and relates to the technical field of semiconductor manufacturing. The semiconductor production report updating method is based on target production data obtained in real time to update the existing semiconductor production report in real time, without the need to reestablish a new semiconductor production report each time, and the updating efficiency is high. Meanwhile, the target production data in the embodiment of the disclosure is based on a target time interval determined by the maximum residence time of the semiconductor on each production device and the current time, and is obtained by querying the historical production database, without the need to reacquire a large amount of repeated historical data each time, so that the data amount can be greatly reduced under the premise of ensuring the accuracy of the semiconductor production report, thereby improving the data processing efficiency and the updating efficiency of the semiconductor production report.

Description

Technical Field

[0001] The present disclosure relates to the field of semiconductor manufacturing technology, and in particular to a method for updating a production report, a production control system, a device, a medium, and equipment. Background Art

[0002] The semiconductor production process involves multiple pieces of production equipment, each of which generates a large amount of real-time data for each batch of semiconductors, such as wafer test data. In practice, this real-time data needs to be regularly aggregated to generate corresponding semiconductor production reports for daily monitoring and analysis.

[0003] In the actual production process, each wafer in the process of multi-batch wafer processing has to go through hundreds of processing steps. In each step, hundreds or thousands of machine process parameter data will be collected in real time into the production system database. The amount of data is too large and complex and diverse. In order to obtain the production data of a complete batch of wafers, users often collect historical data for a long period of time for analysis and update, such as 2 to 5 months, to avoid data omissions. In this way, each collection, especially for a short collection cycle, when collecting such a long period of historical data, the previously collected data will be frequently counted, which not only causes a burden on the production system database, but also slows down the data processing and update speed and has low processing efficiency. Summary of the Invention

[0004] The present disclosure provides a production report updating method, a production control system, an apparatus, a medium, and equipment, thereby improving the generation efficiency of semiconductor production reports.

[0005] In a first aspect, an embodiment of the present disclosure provides a method for updating a semiconductor production report, the method comprising:

[0006] Determine the maximum residence time of any batch of semiconductors on each production equipment for the target production sequence;

[0007] Determine the target time interval based on the current time and the maximum stay time;

[0008] Querying a historical production database to obtain target production data within a target time interval; wherein the historical production database stores at least one historical semiconductor production data;

[0009] The target production data is added to a semiconductor production report to update the semiconductor production report.

[0010] In an optional embodiment of the present disclosure, determining the target time interval according to the current time and the maximum stay time includes:

[0011] Amplify the maximum residence time according to a preset amplification factor to obtain a target maximum residence time;

[0012] The time interval between the current time and the target maximum stay time is determined as the target time interval.

[0013] In an optional embodiment of the present disclosure, amplifying the maximum residence time according to a preset amplification factor to obtain a target maximum residence time includes:

[0014] Amplify the maximum residence time according to a preset amplification factor to obtain an initial maximum residence time;

[0015] The initial maximum residence time is rounded up to obtain the target maximum residence time.

[0016] In an optional embodiment of the present disclosure, the preset amplification factor is 1.5-3.

[0017] In an optional embodiment of the present disclosure, querying a historical production database to obtain target production data within a target time interval includes:

[0018] A historical production database is queried to obtain at least one of a plurality of production tacts, a plurality of equipment utilization rates, and a plurality of equipment loss rates for each production equipment within a target time interval.

[0019] In an optional embodiment of the present disclosure, querying a historical production database to obtain target production data within a target time interval includes:

[0020] Query the historical production database to obtain initial production data within the target time interval;

[0021] Determine the quantity of initial production data;

[0022] If the number of initial production data is equal to 1, the current initial production data is determined as the target production data.

[0023] In an optional embodiment of the present disclosure, querying the historical production database to obtain target production data within a target time interval further includes:

[0024] If the number of initial production data is greater than 1, the target production data is determined according to the equipment identification and batch identification of each initial production data.

[0025] In an optional embodiment of the present disclosure, determining target production data based on a plurality of equipment identifiers and batch identifiers of each initial production data includes:

[0026] Determine whether the equipment identifications of each initial production data are the same;

[0027] If the equipment identifications of the initial production data are the same, then determine whether the batch identifications of the initial production data are the same;

[0028] If the batch identifiers of the initial production data are the same, the target production data are determined according to the size of the initial production data.

[0029] In an optional embodiment of the present disclosure, the production data is a production tact, and the target production data is determined according to the sizes of a plurality of initial production data, including:

[0030] The maximum value among the production cycles is determined as the target production data.

[0031] In an optional embodiment of the present disclosure, the production data is equipment utilization, and the target production data is determined according to the sizes of the plurality of initial production data, including:

[0032] The minimum value among the utilization rates of each device is determined as the target production data.

[0033] In an optional embodiment of the present disclosure, determining the maximum residence time of any batch of semiconductors on each production equipment for a target production sequence includes:

[0034] For a target batch of semiconductors in a target production sequence, obtaining the residence time of the target batch of semiconductors on each production device;

[0035] The maximum value among the residence times is determined as the maximum residence time.

[0036] In a second aspect, an embodiment of the present disclosure provides a semiconductor production control system, including a processing device, on which a computer program is stored, and when the computer program is executed by the processing device, any of the above methods is implemented.

[0037] In a third aspect, an embodiment of the present disclosure provides a device for updating a semiconductor production report, the device comprising:

[0038] A first determination module is used to determine the maximum residence time of any batch of semiconductors on each production equipment for a target production sequence;

[0039] The second determination module is used to determine the target time interval according to the current time and the maximum stay time;

[0040] A query module is used to query a historical production database to obtain target production data within a target time interval; wherein the historical production database stores at least one historical semiconductor production data;

[0041] The update module adds target production data to the semiconductor production report to update the semiconductor production report.

[0042] In a fourth aspect, an embodiment of the present disclosure provides a computer-readable storage medium having a computer program stored thereon, which implements the above method when executed by a processor.

[0043] In a fifth aspect, an embodiment of the present disclosure provides an electronic device, comprising: a processor; and a memory for storing executable instructions of the processor; wherein the processor is configured to perform the above method by executing the executable instructions.

[0044] The technical solution disclosed in this disclosure has the following beneficial effects:

[0045] The above-mentioned semiconductor production report updating method is based on the real-time target production data to update the existing semiconductor production report in real time, without the need to re-establish a new semiconductor production report each time, and the update efficiency is high; at the same time, the target production data in the embodiment of the present disclosure is based on the maximum residence time of the semiconductor on each production equipment and the target time interval determined at the current time, and is obtained by querying in the historical production database, without the need to re-acquire a large amount of repeated historical data each time, which can greatly reduce the amount of data while ensuring the accuracy of the semiconductor production report, thereby improving the data processing efficiency and the update efficiency of the semiconductor production report.

[0046] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] The accompanying drawings are incorporated into and constitute a part of the specification, illustrate embodiments consistent with the present disclosure, and together with the specification, serve to explain the principles of the present disclosure. Obviously, the drawings described below are only some embodiments of the present disclosure, and it is possible for a person skilled in the art to derive other drawings based on these drawings without inventive effort.

[0048] Figure 1 A schematic diagram illustrating an application scenario of a method for updating a semiconductor production report in this exemplary embodiment is shown;

[0049] Figure 2 A flowchart showing a method for updating a semiconductor production report in this exemplary embodiment;

[0050] Figure 3 A flowchart showing a method for updating a semiconductor production report in this exemplary embodiment;

[0051] Figure 4 A flowchart showing a method for updating a semiconductor production report in this exemplary embodiment;

[0052] Figure 5 A flowchart showing a method for updating a semiconductor production report in this exemplary embodiment;

[0053] Figure 6 A flowchart showing a method for updating a semiconductor production report in this exemplary embodiment;

[0054] Figure 7 A flowchart showing a method for updating a semiconductor production report in this exemplary embodiment;

[0055] Figure 8 A schematic structural diagram of a semiconductor production report updating device according to this exemplary embodiment is shown;

[0056] Figure 9 A schematic structural diagram of an electronic device in this exemplary embodiment is shown. DETAILED DESCRIPTION

[0057] The exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, the exemplary embodiments can be implemented in many forms and should not be construed as limited to the examples set forth herein; on the contrary, these embodiments are provided so that the present disclosure will be more comprehensive and complete and the concepts of the exemplary embodiments will be fully conveyed to those skilled in the art. The described features, structures, or characteristics may be combined in one or more embodiments in any suitable manner. In the following description, many specific details are provided to provide a full understanding of the embodiments of the present disclosure. However, those skilled in the art will appreciate that the technical solutions of the present disclosure may be practiced while omitting one or more of the specific details, or that other methods, components, devices, steps, etc. may be employed. In other cases, well-known technical solutions are not shown or described in detail to avoid obscuring various aspects of the present disclosure.

[0058] In addition, the accompanying drawings are merely schematic illustrations of the present disclosure and are not necessarily drawn to scale. Identical reference numerals in the figures denote identical or similar parts, and thus repetitive descriptions thereof will be omitted. Some of the block diagrams shown in the accompanying drawings are functional entities that do not necessarily correspond to physically or logically separate entities. These functional entities may be implemented in software, in one or more hardware modules or integrated circuits, or in different networks and / or processor devices and / or microcontroller devices.

[0059] The flowcharts shown in the accompanying drawings are merely illustrative and do not necessarily include all steps. For example, some steps may be decomposed, while some steps may be combined or partially combined, so the actual execution order may change according to actual circumstances.

[0060] The disclosed embodiment provides a method for updating a semiconductor production report. First, for a target production sequence, the maximum residence time of any batch of semiconductor products on each production equipment is determined. Then, the target time interval in which the target production data is located is determined based on the current time and the maximum residence time of the semiconductor production report as needed. Then, the target production data located in the target time interval is obtained by querying the historical production database. Finally, the target production data is added to the semiconductor production report. The latest target production data is merged with the production data in the current semiconductor production report to obtain a new semiconductor production report, thereby achieving the purpose of updating the semiconductor production report. The semiconductor production report in this embodiment can be continuously updated based on the target production data obtained in real time, with higher real-time performance. During the update process, only the target production data within the target time interval needs to be obtained each time, without having to obtain and process a large amount of repetitive data, thereby further improving the efficiency of semiconductor production report generation and updating. At the same time, during the update process, the structure of the semiconductor production report is stable and the production data is highly reliable. Only a fixed update cycle needs to be set to update the semiconductor production report with stable quantity growth, and the stability of the production data is higher.

[0061] In view of the above problems, the embodiment of the present disclosure provides a method for updating semiconductor production reports, which updates existing semiconductor production reports in real time based on target production data obtained in real time, without the need to re-establish new semiconductor production reports each time, and has high update efficiency; at the same time, the target production data in the embodiment of the present disclosure is based on the maximum residence time of the semiconductor on each production equipment and the target time interval determined at the current moment, and is obtained by querying in the historical production database, without the need to re-acquire a large amount of repeated historical data each time, which can greatly reduce the amount of data while ensuring the accuracy of the semiconductor production report, thereby improving data processing efficiency and the update efficiency of the semiconductor production report.

[0062] The following briefly introduces the application environment of the semiconductor production report updating method provided by the embodiment of the present disclosure:

[0063] See Figure 1The semiconductor production report updating method provided in the embodiments of the present disclosure is applied to a semiconductor production control system 10, which includes at least: semiconductor production equipment 101, communication equipment 102, production execution equipment 103, storage device 104, and terminal device 105. The semiconductor production equipment 101 is used to process semiconductor products, such as wafers, during actual production processes, and records the production data generated during the processing, and simultaneously uploads the data to the production execution equipment 103 in real time via the communication equipment 102. The production execution device 103 is used to control the operation of each production device. The production data in the production execution device 103 is generally updated in real time, and most of them are temporarily stored; the storage device 104 has a semiconductor production database inside, which is used to store most of the semiconductor production data generated during the production process. The data update cycle can be about 1 hour; the terminal device 105 is used for staff to analyze and manage various production data. For example, based on the production data obtained from the storage device 104, a semiconductor production report is established or generated to facilitate visual processing by the staff. The production data update cycle in the terminal device 105 can be one or two days. Of course, it can also be specifically set according to actual conditions. The embodiment of the present disclosure does not make specific limitations. It should be pointed out that the semiconductor production report in the embodiment of the present disclosure refers to all semiconductor products in a batch, such as the set of all events of wafer products in various production equipment. The total events may include: lot (batch) quantity, product name, product type, flow identification, batch identification, equipment identification, operation step serial number, product grade, time of entering each chamber of the production equipment, time of leaving each chamber of the production equipment, start time of operation, end time of operation, historical operation time and current operation time, etc. This embodiment does not make specific limitations and can be set according to actual conditions.

[0064] The following uses the terminal device 105 as the execution subject and uses the semiconductor production report updating method to update the semiconductor production report in the terminal device as an example for explanation. Figure 2 The semiconductor production report updating method provided by the embodiment of the present disclosure includes the following steps 201 to 204.

[0065] Step 201: The terminal device determines the maximum residence time of any batch of semiconductors on each production device for a target production sequence.

[0066] Before each production, the staff sets a target production sequence based on the actual production situation, and controls the specific semiconductor production process based on the target production sequence. The target production sequence may include, for example, the order between multiple batches, the specific production parameters in each batch, etc., which are not specifically limited in this embodiment. The terminal device selects one of the batches of semiconductors from the historical production database, and then traverses the time that the batch of semiconductors stays in all production equipment, and then determines a maximum residence time. In this embodiment, any batch can be a randomly selected batch or a batch determined by the staff based on actual experience. This embodiment does not specifically limit the determination of any batch.

[0067] Step 202: The terminal device determines a target time interval according to the current time and the maximum stay time.

[0068] After obtaining the maximum dwell time, the terminal device determines a target time interval based on the maximum dwell time. The target time interval refers to the time interval during which real-time data acquisition is required. In this embodiment, the target time interval can be determined based on the following two methods:

[0069] The first method is to take the moment with the maximum residence time from the current moment as the starting moment, the current moment as the ending moment, and the time interval between the starting moment and the ending moment as the target time interval, so that the latest data can be obtained in the minimum range, thereby improving the real-time and accuracy of production data acquisition; the second method is to take the moment with several times the maximum residence time from the current moment as the starting moment, the current moment as the ending moment, and the time interval between the starting moment and the ending moment as the target time interval, so that production data can be obtained in the maximum range, thereby improving the integrity of production data acquisition, thereby further improving the accuracy of the semiconductor production report updating method provided in the embodiment of the present disclosure.

[0070] Step 203: The terminal device searches the historical production database to obtain target production data within the target time interval.

[0071] The historical production database stores at least one historical semiconductor production data set. This historical semiconductor production data refers to the production data generated by each production device during the historical production process, recorded in time. The production data is generally stored in the historical production database on a storage device. The terminal device obtains the required target production data from the storage device in real time. The target production data is within the target time interval. Currently, the number of target production data sets can be one, one group, or multiple groups. This is not specifically limited in this embodiment and can be set based on actual circumstances.

[0072] Step 204: The terminal device adds the target production data to the semiconductor production report to update the semiconductor production report.

[0073] A semiconductor production report is pre-stored within the terminal device. After obtaining target production data, the target production data is updated to the semiconductor production report to update the semiconductor production report. During the actual production process, as the update time (i.e., the current time) changes, the target production data also changes with the target time interval. This allows the semiconductor production report in this embodiment to be continuously updated based on the real-time target production data, achieving higher real-time performance. During the update process, only the target production data within the target time interval needs to be obtained each time, eliminating the need to obtain and process large amounts of repetitive data. This further improves the efficiency of semiconductor production report generation and updating.

[0074] The semiconductor production report updating method provided by the embodiment of the present disclosure is to update the existing semiconductor production report in real time based on the target production data obtained in real time, without the need to re-establish a new semiconductor production report each time, and the updating efficiency is high; at the same time, the target production data in the embodiment of the present disclosure is based on the maximum residence time of the semiconductor on each production equipment and the target time interval determined at the current moment, and is obtained by querying in the historical production database, without the need to re-acquire a large amount of repeated historical data each time, which can greatly reduce the amount of data while ensuring the accuracy of the semiconductor production report, thereby improving the data processing efficiency and the updating efficiency of the semiconductor production report.

[0075] See Figure 3 In an optional embodiment of the present disclosure, step 202 of the terminal device determining the target time interval according to the current time and the maximum stay time includes the following steps 301-302:

[0076] Step 301: The terminal device amplifies the maximum residence time according to a preset amplification factor to obtain a target maximum residence time.

[0077] The preset amplification factor refers to the ratio by which the maximum stay time is amplified. It can be set based on actual conditions. Based on this preset amplification factor, a wider range of target maximum stay times can be obtained. For example, if the maximum stay time is T (in days) and the preset amplification factor is A, the target maximum stay time obtained is AT.

[0078] Step 302: The terminal device determines the time interval between the current time and the target maximum stay time as the target time interval.

[0079] For example, the maximum stay time of the target is AT, and the current time is T sys , then the corresponding target time interval is Tsys –AT. Based on the preset amplification factor, a wider range of target time intervals can be obtained, better including the complete production data of each batch, thereby ensuring the integrity of the updated production data, thereby improving the comprehensiveness and accuracy of the semiconductor production report updating method provided by the disclosed embodiment. In a specific embodiment, the preset amplification factor can be set to 2. When the preset amplification factor is 2, the integrity of each batch of semiconductor production data can be guaranteed to the greatest extent, while at the same time obtaining the most accurate target production data, thereby improving the reliability of the semiconductor production report updating method provided by the disclosed embodiment.

[0080] In an optional embodiment of the present disclosure, the preset amplification factor is 1.5 to 3. When the maximum residence time is amplified by 1.5 to 3 times, the accuracy of the target production data determined can be maximized while ensuring the integrity of each batch of semiconductor data, thereby achieving a comprehensive improvement in data integrity and data processing efficiency, and further improving the reliability of the semiconductor production report updating method provided in the embodiment of the present disclosure.

[0081] See Figure 4 In an optional embodiment of the present disclosure, step 301, the terminal device amplifies the maximum residence time according to a preset amplification factor to obtain a target maximum residence time, including the following steps 401-402:

[0082] Step 401: The terminal device amplifies the maximum residence time according to a preset amplification factor to obtain an initial maximum residence time.

[0083] After obtaining the maximum residence time, the terminal device first amplifies the maximum residence time based on the preset amplification factor. That is, based on the example in step 301, the maximum residence time is T (unit: day), the preset amplification factor is A, and the initial maximum residence time is AT.

[0084] Step 402: The terminal device rounds up the initial maximum stay time to obtain a target maximum stay time.

[0085] After obtaining the initial maximum stay time AT, the terminal device rounds up AT to obtain the target maximum stay time AT0. For example, if the initial maximum stay time is 1.2 days or 1.8 days, both are rounded up to 2 days.

[0086] The embodiment of the present disclosure first amplifies the obtained maximum residence time based on a preset amplification factor to obtain an initial maximum residence time, and then rounds up the initial maximum residence time to prevent the situation where, in the case of, for example, half a day or several hours, the time interval is deleted by rounding off, thereby deleting the production data of that part. This can improve the integrity of the target production data and maximize the reliability of the semiconductor production report provided by the embodiment of the present disclosure.

[0087] In an optional embodiment of the present disclosure, step 203 of the terminal device querying the historical production database to obtain target production data within the target time interval includes the following steps:

[0088] The terminal device queries the historical production database to obtain at least one of a plurality of production beats, a plurality of equipment utilization rates and a plurality of equipment loss rates for each production equipment within a target time interval.

[0089] Among them, the production rhythm refers to the time interval between the end time of two consecutive batches of semiconductor production under the same target production sequence when the equipment is fully loaded and running stably, which is used to characterize the rhythm of the semiconductor production process. Equipment utilization refers to the proportion of production equipment involved in production during the production process, which can be calculated by the ratio of the number of equipment currently involved in production to the total number of production equipment. The equipment loss rate is the opposite of the equipment utilization rate, which refers to the proportion of equipment that has stopped production among multiple production equipment during the production process, which can be calculated by the ratio of the number of equipment that is not currently involved in production to the total number of production equipment. The embodiment of the present disclosure continuously updates the semiconductor production report based on the obtained production rhythm, equipment utilization and equipment loss rate, etc., which can further improve the comprehensiveness of the production data in the semiconductor production report.

[0090] See Figure 5 In an optional embodiment of the present disclosure, step 203 of the terminal device querying the historical production database to obtain target production data within the target time interval includes the following steps 501 to 504:

[0091] Step 501: The terminal device searches the historical production database to obtain initial production data within a target time interval.

[0092] Step 502: The terminal device determines the quantity of initial production data;

[0093] Step 503: If the number of initial production data is equal to 1, the terminal device determines the current initial production data as the target production data;

[0094] Step 504: If the number of initial production data is greater than 1, the terminal device determines the target production data according to the device identifier and batch identifier of each initial production data.

[0095] In the actual production process, some batches of semiconductors may need to re-enter the production equipment for secondary processing. Therefore, the same batch of semiconductors may correspond to multiple production data on the same production equipment. In this embodiment, after obtaining the initial production data within the target time interval, the number of the initial production data is first judged. If the number is 1, it means that there is one production data within the target time interval, which is the target production data. If the number is greater than 1, for example, two or more, it means that during the production process, the same batch has secondary processing or more than two return processing, and there are multiple production data. However, each device and each production flow has its own device identification and batch identification. The terminal device only needs to determine the unique target production data based on the device identification and batch identification of the multiple initial production data currently obtained, and finally update the semiconductor production report based on the target production data. The disclosed embodiment determines the target production data based on the device identification and batch identification of the production data of each department. The method is simple and convenient, and can ensure the reliability of the obtained target production data, thereby improving the stability and reliability of the semiconductor production report update.

[0096] See Figure 6 In an optional embodiment of the present disclosure, the terminal device determines the target production data according to the device identifier and the batch identifier of each of the multiple initial production data, including the following steps 601 to 603:

[0097] Step 601: The terminal device determines whether the device identifications of the initial production data are the same;

[0098] Step 602: If the device identifiers of the initial production data are the same, the terminal device determines whether the batch identifiers of the initial production data are the same;

[0099] Step 603: If the batch identifiers of the initial production data are the same, the terminal device determines the target production data according to the size of the initial production data.

[0100] If the equipment identifiers of the two initial production data are the same, it means that the two initial production data are from the same production equipment. If the batch identifiers of the two initial production data are the same, it means that the two initial production data are from the same production batch. In other words, the same batch of semiconductor products has been used on the same production equipment at least twice, generating two or more production data. Therefore, the target production data determined by the equipment identifier and batch identifier of the initial production data in this embodiment is highly reliable, which can further improve the reliability and update reliability of the semiconductor production report provided by the embodiment of the disclosure.

[0101] In an optional embodiment of the present disclosure, the production data is a production tact. In step 603, the terminal device determines target production data according to the sizes of the multiple initial production data, including:

[0102] The terminal device determines the maximum value among the production cycles as the target production data.

[0103] The production takt time refers to the interval between the completion times of two consecutive batches of semiconductor production under the same target production sequence, when the equipment is fully loaded and operating stably. It is used to characterize the rhythm of the semiconductor production process. Therefore, in order to facilitate the subsequent determination of parameters that are more conducive to the adjustment of the next production, this embodiment determines the maximum value among the production takt times as the target production data, thereby facilitating the optimization of equipment parameters and other factors during the next production process. At the same time, using the maximum value among the production takt times as the target production data can avoid the occurrence of multiple target production data for the same batch of semiconductors, which would affect the update of semiconductor production reports, thereby improving the reliability of semiconductor production report updates.

[0104] In an optional embodiment of the present disclosure, the production data is equipment utilization. In step 603, the terminal device determines target production data based on the sizes of the multiple initial production data, including:

[0105] The terminal device determines the minimum value among the utilization rates of each device as the target production data.

[0106] Equipment utilization refers to the percentage of production equipment involved in production during the production process. It can be calculated by calculating the ratio of the current number of equipment involved in production to the total number of production equipment. Therefore, in order to facilitate the subsequent determination of parameters that are more conducive to the next production adjustment, this embodiment determines the minimum value of each equipment utilization rate as the target production data, thereby facilitating the optimization of equipment parameters and other parameters during the next production process. At the same time, using the minimum value of each equipment utilization rate as the target production data can avoid the occurrence of multiple target production data for the same batch of semiconductors, which would affect the update of semiconductor production reports, thereby improving the reliability of semiconductor production report updates.

[0107] See Figure 7 In an optional embodiment of the present disclosure, step 201, the terminal device determines the maximum residence time of any batch of semiconductors on each production device for the target production sequence, including the following steps 701-702:

[0108] Step 701: The terminal device obtains the residence time of the target batch of semiconductors on each production device for each target batch of semiconductors in the target production sequence.

[0109] The target production sequence includes multiple batches of semiconductors. For one batch of semiconductors, that is, for the target batch of semiconductors, its residence time on all production equipment is counted, for example, 2 hours, 3 hours, 1.2 hours, etc.

[0110] Step 702: The terminal device determines the maximum value among the dwell times as the maximum dwell time.

[0111] The terminal device determines the maximum value of the obtained residence times as the maximum residence time. For example, for 2 hours, 3 hours, 1.2 hours, etc. in step 501, 3 hours is determined as the maximum residence time.

[0112] The embodiment of the present disclosure determines the maximum residence time by the residence time of the target batch of semiconductors on each production equipment, and obtains a maximum residence time by comparing all the residence times, which can improve the accuracy of the maximum residence time and further improve the accuracy and reliability of the semiconductor production report updating method provided by the embodiment of the present disclosure.

[0113] One embodiment of the present disclosure provides a semiconductor production control system, including a processing device, which is used to control the operation of each production device and analyze and process production data generated by each production device, wherein a computer program is stored on the processing device, and when the computer program is executed by the processing device, any of the methods described above is implemented.

[0114] See Figure 8 In order to implement the above-mentioned business processing method, an embodiment of the present disclosure provides a semiconductor production report updating device 800. Figure 8 A schematic architecture diagram of a semiconductor production report updating device 800 is shown.

[0115] A semiconductor production report updating device 800 includes: a first determination module 801, a second determination module 802, a query module 803, and an update module 804.

[0116] The first determination module 801 is configured to determine the maximum residence time of any batch of semiconductors on each production equipment for a target production sequence;

[0117] The second determining module 802 is configured to determine a target time interval based on the current time and the maximum stay time;

[0118] The query module 803 is used to query the historical production database to obtain target production data within a target time interval; wherein the historical production database stores at least one historical semiconductor production data;

[0119] The updating module 804 is used to add the target production data to the semiconductor production report to update the semiconductor production report.

[0120] In an optional embodiment of the present disclosure, the second determination module 802 is specifically configured to amplify the maximum stay time according to a preset amplification factor to obtain a target maximum stay time; and determine a time interval between the current moment and the target maximum stay time as the target time interval.

[0121] In an optional embodiment of the present disclosure, the second determining module 802 is specifically configured to amplify the maximum residence time according to a preset amplification factor to obtain an initial maximum residence time; and round up the initial maximum residence time to obtain a target maximum residence time.

[0122] In an optional embodiment of the present disclosure, the preset amplification factor is 1.5-3.

[0123] In an optional embodiment of the present disclosure, the query module 803 is specifically used to query the historical production database to obtain at least one production data of multiple production rhythms, multiple equipment utilization rates and multiple equipment loss rates for each production equipment within the target time interval.

[0124] In an optional embodiment of the present disclosure, the query module 803 is specifically used to query the historical production database to obtain the initial production data within the target time interval; determine the number of initial production data; if the number of initial production data is equal to 1, determine the current initial production data as the target production data.

[0125] In an optional embodiment of the present disclosure, the query module 803 is further configured to, if the number of initial production data is greater than 1, determine the target production data according to the device identifier and the batch identifier of each initial production data.

[0126] In an optional embodiment of the present disclosure, the second determination module 802 is specifically used to determine whether the device identifications of each initial production data are the same; if the device identifications of each initial production data are the same, then determine whether the batch identifications of each initial production data are the same; if the batch identifications of each initial production data are the same, then determine the target production data based on the size of each initial production data.

[0127] In an optional embodiment of the present disclosure, the production data is the production tact, and the second determination module 802 is specifically configured to determine the maximum value of each production tact as the target production data.

[0128] In an optional embodiment of the present disclosure, the production data is equipment utilization, and the second determination module 802 is specifically configured to determine the minimum value of each equipment utilization as the target production data.

[0129] In an optional embodiment of the present disclosure, the first determination module 801 is specifically used to obtain, for a target batch of semiconductors in a target production sequence, the residence time of the target batch of semiconductors on each production device; and determine the maximum value of the residence times as the maximum residence time.

[0130] The exemplary embodiments of the present disclosure also provide a computer-readable storage medium that can be implemented in the form of a program product, which includes program code. When the program product is run on an electronic device, the program code is used to cause the electronic device to perform the steps described in the "Exemplary Method" section above of this specification according to the various exemplary embodiments of the present disclosure. In one embodiment, the program product can be implemented as a portable compact disc read-only memory (CD-ROM) and includes program code, and can be run on an electronic device, such as a personal computer. However, the program product of the present disclosure is not limited to this, and in this document, a readable storage medium can be any tangible medium that contains or stores a program that can be used by or in combination with an instruction execution system, apparatus, or device.

[0131] The program product may employ any combination of one or more readable media. The readable medium may be a readable signal medium or a readable storage medium. The readable storage medium may be, for example, but not limited to, an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, device, or component, or any combination thereof. More specific examples (a non-exhaustive list) of readable storage media include: an electrical connection with one or more wires, a portable disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination thereof.

[0132] A computer-readable signal medium may include a data signal propagated in baseband or as part of a carrier wave, which carries readable program code. Such propagated data signals may take a variety of forms, including but not limited to electromagnetic signals, optical signals, or any suitable combination thereof. A readable signal medium may also be any readable medium other than a readable storage medium that can transmit, propagate, or transfer a program for use by or in conjunction with an instruction execution system, apparatus, or device.

[0133] The program code embodied on the readable medium may be transmitted using any appropriate medium, including but not limited to wireless, wireline, optical fiber cable, RF, etc., or any suitable combination of the foregoing.

[0134] Program code for performing the operations of the present disclosure may be written in any combination of one or more programming languages, including object-oriented programming languages ​​such as Java, C++, and the like, as well as conventional procedural programming languages ​​such as "C" or similar programming languages. The program code may be executed entirely on the user computing device, partially on the user device, as a stand-alone software package, partially on the user computing device and partially on a remote computing device, or entirely on a remote computing device or server. In cases involving a remote computing device, the remote computing device may be connected to the user computing device via any type of network, including a local area network (LAN) or a wide area network (WAN), or may be connected to an external computing device (e.g., via the Internet using an Internet service provider).

[0135] The exemplary embodiment of the present disclosure also provides an electronic device, which can be a background server of an information platform. Figure 7 The electronic device will be described. It should be understood that Figure 9 The electronic device 900 shown is merely an example and should not limit the functionality and scope of use of the embodiments of the present disclosure.

[0136] like Figure 9 As shown, electronic device 900 is implemented as a general-purpose computing device. Components of electronic device 900 may include, but are not limited to, at least one processing unit, at least one storage unit, and a bus connecting different system components (including the storage unit and the processing unit).

[0137] The storage unit stores program codes, which can be executed by the processing unit so that the processing unit performs the steps according to various exemplary embodiments of the present invention described in the "Exemplary Method" section above. For example, the processing unit can perform the following steps: Figure 2 The method steps shown, etc.

[0138] The memory unit may include a volatile memory unit, such as a random access memory unit (RAM) and / or a cache memory unit, and may further include a read-only memory unit (ROM).

[0139] The storage unit may also include a program / utility having a set (at least one) of program modules, such program modules including but not limited to: an operating system, one or more application programs, other program modules, and program data, each of which or some combination may include an implementation of a network environment.

[0140] The bus may include a data bus, an address bus, and a control bus.

[0141] The electronic device 900 can also communicate with one or more external devices (such as keyboards, pointing devices, Bluetooth devices, etc.), and this communication can be carried out through input / output (I / O) interfaces. The electronic device can also communicate with one or more networks (such as local area networks (LANs), wide area networks (WANs) and / or public networks, such as the Internet) through a network adapter. As shown in the figure, the network adapter communicates with other modules of the electronic device 900 through a bus. It should be understood that, although not shown in the figure, other hardware and / or software modules can be used in conjunction with the electronic device 900, including but not limited to: microcode, device drivers, redundant processing units, external disk drive arrays, RAID systems, tape drives, and data backup storage systems, etc.

[0142] It should be noted that although several modules or units of the device for action execution are mentioned in the above detailed description, this division is not mandatory. In fact, according to the exemplary embodiments of the present disclosure, the features and functions of two or more modules or units described above can be concretized in one module or unit. Conversely, the features and functions of one module or unit described above can be further divided into multiple modules or units to be concretized.

[0143] Those skilled in the art will appreciate that various aspects of the present disclosure may be implemented as systems, methods, or program products. Therefore, various aspects of the present disclosure may be specifically implemented in the following forms, namely: a complete hardware implementation, a complete software implementation (including firmware, microcode, etc.), or a combination of hardware and software implementations, which may be collectively referred to herein as "circuits," "modules," or "systems." Those skilled in the art will readily conceive of other implementations of the present disclosure after considering the specification and practicing the invention disclosed herein. The present disclosure is intended to cover any variations, uses, or adaptations of the present disclosure that follow the general principles of the present disclosure and include common knowledge or customary technical means in the art that are not disclosed in the present disclosure. The specification and implementations are to be regarded as exemplary only, and the true scope and spirit of the present disclosure are indicated by the claims.

[0144] It should be understood that the present disclosure is not limited to the exact structures that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims

1. A method for updating a semiconductor production report, characterized in that: The method comprises: Determine the maximum residence time of any batch of semiconductors on each production equipment for the target production sequence; Determine a target time interval based on the current time and the maximum stay time; Querying a historical production database to obtain target production data within the target time interval; wherein the historical production database stores at least one historical semiconductor production data; The target production data is added to a semiconductor production report to update the semiconductor production report.

2. The method for updating semiconductor production reports according to claim 1, wherein: The determining of the target time interval according to the current time and the maximum stay time includes: Amplifying the maximum residence time according to a preset amplification factor to obtain a target maximum residence time; A time interval between the current moment and the target maximum stay time is determined as the target time interval.

3. The method for updating semiconductor production reports according to claim 2, wherein: The step of amplifying the maximum residence time according to a preset amplification factor to obtain a target maximum residence time includes: amplifying the maximum residence time according to the preset amplification factor to obtain an initial maximum residence time; The initial maximum residence time is rounded up to obtain the target maximum residence time.

4. The method for updating semiconductor production reports according to claim 3, wherein: The preset amplification factor is 1.5-3.

5. The method for updating semiconductor production reports according to claim 1, wherein: The querying in the historical production database to obtain target production data within the target time interval includes: A historical production database is queried to obtain at least one of a plurality of production tacts, a plurality of equipment utilization rates, and a plurality of equipment loss rates for each production equipment within the target time interval.

6. The method for updating semiconductor production reports according to claim 1, wherein: The querying in the historical production database to obtain target production data within the target time interval includes: Querying a historical production database to obtain initial production data within the target time interval; determining the quantity of the initial production data; If the number of the initial production data is equal to 1, the current initial production data is determined as the target production data.

7. The method for updating semiconductor production reports according to claim 6, wherein: The querying in the historical production database to obtain the target production data within the target time interval further includes: If the number of the initial production data is greater than 1, the target production data is determined according to the equipment identification and batch identification of each initial production data.

8. The method for updating semiconductor production reports according to claim 7, wherein: The determining of the target production data according to the equipment identification and batch identification of each initial production data includes: Determining whether the device identifications of the respective initial production data are the same; If the equipment identifiers of the various initial production data are the same, determining whether the batch identifiers of the various initial production data are the same; If the batch identifiers of the initial production data are the same, the target production data is determined according to the size of the initial production data.

9. The method for updating semiconductor production reports according to claim 8, wherein: The production data is a production rhythm, and determining the target production data according to the size of each initial production data includes: The maximum value among the production cycles is determined as the target production data.

10. The method for updating semiconductor production reports according to claim 8, wherein: The production data is equipment utilization, and determining the target production data according to the size of each initial production data includes: The minimum value among the utilization rates of each device is determined as the target production data.

11. The method for updating semiconductor production reports according to claim 1, wherein: Determining the maximum residence time of any batch of semiconductors on each production equipment for the target production sequence includes: For a target batch of semiconductors in a target production sequence, respectively obtain the residence time of the target batch of semiconductors on each production device; The maximum value among the residence times is determined as the maximum residence time.

12. A semiconductor production control system, characterized in that: The method comprises a processing device having a computer program stored thereon, wherein the computer program implements the method according to any one of claims 1 to 11 when executed by the processing device.

13. A semiconductor production report updating device, characterized in that: The device comprises: A first determination module is used to determine the maximum residence time of any batch of semiconductors on each production equipment for a target production sequence; A second determining module is used to determine a target time interval according to the current time and the maximum stay time; A query module, configured to query a historical production database to obtain target production data within the target time interval; wherein the historical production database stores at least one historical semiconductor production data; An updating module is used to add the target production data to a semiconductor production report to update the semiconductor production report.

14. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the method according to any one of claims 1 to 11 is implemented.

15. An electronic device, characterized in that: include: processor; and a memory for storing executable instructions of the processor; The processor is configured to perform the method according to any one of claims 1 to 11 by executing the executable instructions.

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