Substrate processing equipment

Abstract

The present invention provides a substrate processing apparatus. Each branch pipe has an internal space for ambient gas to flow in from the main pipe. A downstream gate is disposed in each branch pipe, downstream of the upstream gate, to open and close the branch pipe. An upstream switching component switches the state of the upstream space between a state in which the inflow of ambient gas is permitted and a state in which the inflow of ambient gas is prohibited. A downstream switching component switches the state of the downstream space between a state in which the inflow of ambient gas is permitted and a state in which the inflow of ambient gas is prohibited.

Description

[0001] This application claims priority based on Japanese Patent Application No. 2021-126155 filed on July 30, 2021, the entire contents of which are incorporated herein by reference. Technical Field

[0002] The present invention relates to a substrate processing device for processing a substrate.

[0003] Examples of substrates to be processed include semiconductor wafers, FPD (Flat Panel Display) substrates such as liquid crystal display devices and organic EL (Electroluminescence) display devices, optical disc substrates, magnetic disc substrates, magneto-optical disc substrates, photomask substrates, ceramic substrates, and solar cell substrates. Background Art

[0004] The substrate liquid processing apparatus disclosed in Japanese Patent No. 6611893 includes a processing unit that performs predetermined substrate processing, a first exhaust pipe, a second exhaust pipe, and an exhaust switching unit.

[0005] The first exhaust pipe includes a separate exhaust pipe for alkaline waste gas, a separate exhaust pipe for acidic waste gas, and a separate exhaust pipe for organic waste gas. The second exhaust pipe guides waste gas from the treatment unit to the multiple separate exhaust pipes of the first exhaust pipe.

[0006] The exhaust switching unit switches the outflow destination of exhaust gas from the treatment unit to one of the individual exhaust pipes. It includes three switching mechanisms for the inflow of exhaust gas from the second exhaust pipe. Each switching mechanism consists of a hollow main body and a valve element that slides along the inner circumference of the main body. The inner circumference of the main body is formed with an exhaust gas intake port and an external air intake port.

[0007] In the substrate liquid processing disclosed in Japanese Patent No. 6611893, by moving the valve core from a position blocking the external air intake port to a position blocking the exhaust gas intake port, exhaust gas can be flowed into the corresponding individual exhaust pipe. Furthermore, by moving the valve core from a position blocking the exhaust gas intake port to a position blocking the external air intake port, external air can be flowed into the corresponding individual exhaust pipe. Therefore, by allowing external air to flow into the remaining individual exhaust pipes while exhaust gas from a processing unit flows into any one of the individual exhaust pipes, fluctuations in the flow rate of gas flowing into each individual exhaust pipe can be suppressed.

[0008] However, even when the valve core of a switching mechanism blocks the exhaust gas intake port, exhaust gas may still flow into the interior space of the main body through the gap between the valve core and the inner circumferential surface of the main body. This may make it impossible to fully prevent the unintended flow of exhaust gas from the exhaust gas intake port into the interior space of the main body. Summary of the Invention

[0009] One embodiment of the present invention provides a substrate processing device, comprising: a chamber that accommodates a substrate; a main pipe that exhausts the ambient gas in the above-mentioned chamber; a plurality of branch pipes that are connected to the above-mentioned main pipe, each branch pipe having an internal space for the ambient gas to flow into from the above-mentioned main pipe; a plurality of upstream gates, each of which is provided in each of the above-mentioned branch pipes, for opening and closing the corresponding above-mentioned branch pipes; a plurality of downstream gates, each of which is provided in each of the above-mentioned branch pipes at a position downstream of the above-mentioned upstream gate, for opening and closing the corresponding above-mentioned branch pipes; an upstream switching component that switches the state of the upstream space between a state in which an upstream space downstream of the above-mentioned upstream gate and upstream of the above-mentioned downstream gate in each of the above-mentioned internal spaces allows the inflow of external ambient gas from a path different from the above-mentioned main pipe and a state in which the upstream space prohibits the inflow of the above-mentioned external ambient gas; and a downstream switching component that switches the state of the downstream space between a state in which a downstream space downstream of the above-mentioned downstream gate in each of the above-mentioned internal spaces allows the inflow of the above-mentioned external ambient gas and a state in which the downstream space prohibits the inflow of the above-mentioned external ambient gas.

[0010] This device can switch the exhaust destination of the chamber's atmosphere by opening and closing the branch pipes with the upstream gate. Specifically, by opening a single branch pipe from among multiple branch pipes and closing the others, the open branch pipe can be used as the exhaust destination for the chamber's atmosphere.

[0011] By allowing external ambient air to flow into the downstream space through the downstream switching components corresponding to branch pipes that are not the exhaust destinations for ambient air, external ambient air can be transported downstream of the corresponding branch pipes. This prevents fluctuations in the amount of ambient air discharged from the branch pipes due to closure of the branch pipes by upstream gates.

[0012] Furthermore, because a downstream damper is positioned downstream of the upstream switching member, the upstream switching member allows external ambient air to flow into the upstream space while the downstream damper is closed, thereby increasing the pressure in the upstream space. This prevents ambient air exhausted from the chamber from flowing through the upstream damper into unintended branch pipes. Furthermore, while ambient air from the chamber is flowing into one of the multiple branch pipes, it is effectively prevented from flowing into other branch pipes.

[0013] In one embodiment of the present invention, the branch pipe has a circular upstream inner circumferential surface in cross-section at a location where the upstream gate is provided. The upstream gate includes an upstream valve core having a shape that follows the upstream inner circumferential surface and that rotates within the branch pipe to open and close the branch pipe.

[0014] This structure allows the branch pipe to be closed using a simple upstream gate. When the branch pipe is opened and closed by rotating the upstream valve core, a gap must be provided between the inner circumferential surface of the branch pipe and the upstream valve core to ensure smooth rotation of the upstream valve core within the branch pipe. However, if a gap is provided between the inner circumferential surface of the branch pipe and the upstream valve core, there is a concern that ambient gas exhausted from the chamber could flow through the gap between the upstream inner circumferential surface of the branch pipe and the upstream valve core and into a branch pipe other than the intended destination.

[0015] Even in this case, if the upstream switching member allows external ambient air to flow into the upstream space while the branch pipe is closed by the downstream gate, thereby increasing the pressure in the upstream space, it is possible to suppress the inflow of ambient air into the upstream space through the gap between the upstream inner peripheral surface and the upstream valve core. This effectively prevents the unintended inflow of ambient air from the chamber into the branch pipe.

[0016] In one embodiment of the present invention, the branch pipe has a circular downstream inner circumferential surface in cross-section at a location where the downstream gate is provided. The downstream gate includes a downstream valve core having a shape that conforms to the downstream inner circumferential surface and that rotates within the branch pipe to open and close the branch pipe.

[0017] According to this structure, the branch pipe can be closed downstream of the upstream gate by using a simple downstream gate. In the case of a structure in which the branch pipe is opened and closed by rotating the downstream valve core, a gap needs to be provided between the inner peripheral surface of the branch pipe and the downstream valve core to allow the downstream valve core to rotate smoothly within the branch pipe.

[0018] When the upstream gate plate fully suppresses the flow of ambient gas discharged from the chamber into the branch pipe, the ambient gas flowing to the position downstream of the downstream gate plate through the gap between the downstream inner peripheral surface and the downstream valve core is mostly composed of external ambient gas flowing into the upstream space by utilizing the upstream switching component.

[0019] Therefore, even if a gap exists between the inner circumference of the branch pipe and the downstream valve core, the likelihood of ambient gas exhausted from the chamber passing through this gap is lower than that of the upstream gate. This prevents ambient gas exhausted from the chamber from flowing downstream of the branch pipe, while allowing the downstream valve core to rotate smoothly within the branch pipe.

[0020] In one embodiment of the present invention, a sealing structure is further included. When the downstream valve core closes the branch pipe, the sealing structure seals the space between the downstream inner peripheral surface and the downstream valve core. Therefore, the pressure in the upstream space of the branch pipe can be quickly and sufficiently increased.

[0021] In one embodiment of the present invention, each of the branch pipes has an upstream opening connecting the upstream space and the space surrounding the branch pipe. The upstream switching component includes an upstream opening and closing damper that opens and closes the upstream opening. Therefore, by opening the upstream opening with the upstream opening and closing damper, ambient air surrounding the branch pipe can flow into the upstream space, and by closing the upstream opening with the upstream opening and closing damper, the flow of ambient air surrounding the branch pipe into the upstream space can be stopped.

[0022] In one embodiment of the present invention, the substrate processing apparatus further includes an air supply component disposed outside the branch pipe and configured to supply ambient air surrounding the branch pipe into the upstream space via the upstream opening. By supplying ambient air surrounding the branch pipe from the air supply component into the upstream space via the upstream opening, the pressure in the upstream space can be rapidly and sufficiently increased.

[0023] In one embodiment of the present invention, the substrate processing apparatus further includes a supply pipe connected to the branch pipe downstream of the upstream gate and upstream of the downstream gate. Furthermore, the upstream switching component switches the state of the upstream space between supplying gas to the upstream space via the supply pipe and stopping the supply of gas to the upstream space via the supply pipe. Supplying gas to the upstream space via the supply pipe allows the pressure in the upstream space to be rapidly and sufficiently increased.

[0024] In one embodiment of the present invention, each branch pipe has a downstream opening connecting the downstream space and the space surrounding the branch pipe. Furthermore, the downstream switching component includes a downstream opening and closing damper that opens and closes the downstream opening. Thus, by opening the downstream opening with the downstream opening and closing damper, ambient air surrounding the branch pipe can flow into the downstream space, and by closing the downstream opening with the downstream opening and closing damper, the flow of ambient air surrounding the branch pipe into the downstream space can be stopped.

[0025] In one embodiment of the present invention, each of the branch pipes has an upstream opening connecting the upstream space and the space around the branch pipe, and a downstream opening connecting the downstream space and the space around the branch pipe. The upstream switching component includes an upstream sliding gate that opens and closes the upstream opening by sliding relative to the branch pipe. The downstream switching component includes a downstream sliding gate that opens and closes the downstream opening by sliding relative to the branch pipe. Moreover, the substrate processing device further includes: a connecting component that connects the upstream sliding gate and the downstream sliding gate; and a sliding drive mechanism that drives the connecting component to slide the upstream sliding gate and the downstream sliding gate.

[0026] Therefore, by sliding the upstream sliding gate relative to the branch pipe to open the upstream opening, gas can flow from outside the branch pipe into the upstream space. Similarly, by sliding the downstream sliding gate relative to the branch pipe to open the downstream opening, gas can flow from outside the branch pipe into the downstream space.

[0027] If the upstream and downstream sliding gates are connected by a connecting member, the connecting member can be driven to simultaneously slide both the upstream and downstream sliding gates relative to the branch pipe. This allows for simultaneous opening and closing of the upstream and downstream openings. This simplifies the structure for sliding the sliding gates, compared to a structure that uses separate drive mechanisms to open and close the upstream and downstream sliding gates.

[0028] In one embodiment of the present invention, the substrate processing device further includes: an upstream opening and closing speed adjustment mechanism, which adjusts the opening and closing speed of the upstream gate; a downstream opening and closing speed adjustment mechanism, which adjusts the opening and closing speed of the downstream gate; and a downstream flow adjustment mechanism, which controls the switching action of the downstream switching component to adjust the flow rate of the external ambient gas flowing into the downstream space.

[0029] By adjusting the opening and closing speeds of the upstream and downstream gates, the flow rate of ambient gas flowing from the main pipe into the branch pipe can be gradually varied. Furthermore, by adjusting the flow rate of external ambient gas flowing into the downstream space, the flow rate of ambient gas discharged from the branch pipe can be gradually varied. This can suppress sudden changes in the amount of ambient gas discharged from the branch pipe.

[0030] In one embodiment of the present invention, the substrate processing device further includes: a plurality of processing liquid nozzles that spray processing liquids of different types toward the substrates accommodated in the chamber; and a controller that is programmed to switch the branch pipes into which the ambient gas discharged from the main pipe is to flow according to the type of processing liquid supplied to the substrates accommodated in the chamber by controlling the plurality of upstream gate plates, the plurality of downstream gate plates, the plurality of upstream switching components, and the plurality of downstream switching components.

[0031] This configuration allows switching of the branch pipes for exhausting the atmosphere in the main pipe according to the type of processing liquid supplied to the substrates accommodated in the chamber. Therefore, the atmosphere containing the appropriate type of processing liquid and mist can flow into each branch pipe.

[0032] In one embodiment of the present invention, the controller is programmed to initiate the flow of ambient air into the upstream space by the upstream switching component and into the downstream space by the downstream switching component before the upstream and downstream gates close the corresponding branch pipes. This prevents the branch pipes from being closed and the flow of ambient air into the downstream space from ceasing. This prevents a sudden decrease in the flow rate of ambient air discharged from the branch pipes.

[0033] In one embodiment of the present invention, the plurality of processing liquid nozzles include a chemical liquid nozzle that discharges a chemical liquid toward a substrate received in the chamber, a rinse liquid nozzle that supplies a rinse liquid toward the substrate received in the chamber, and an organic solvent nozzle that supplies an organic solvent toward the substrate received in the chamber. Furthermore, the plurality of branch pipes include a first branch pipe and a second branch pipe. The first branch pipe exhausts the atmosphere within the main pipe while the chemical liquid nozzle is discharging the chemical liquid and while the rinse liquid nozzle is discharging the rinse liquid. The second branch pipe exhausts the atmosphere within the main pipe while the organic solvent nozzle is discharging the organic solvent.

[0034] According to this configuration, the atmosphere in the main pipe is exhausted through the first branch pipe while the chemical nozzle is ejecting the chemical and the rinse liquid is ejecting the rinse liquid. Therefore, the chemical atmosphere containing chemical vapor is exhausted through the main pipe and the first branch pipe.

[0035] At this point, if the upstream and downstream gates close the second branch pipe, and the upstream switching component allows external ambient air to flow into the upstream space of the second branch pipe, this prevents the flow of chemical liquid ambient air into the second branch pipe. Furthermore, if the downstream switching component allows external ambient air to flow into the downstream space of the second branch pipe, this prevents fluctuations in the amount of ambient air discharged from the second branch pipe. This prevents the chemical liquid ambient air from mixing with the ambient air discharged from the second branch pipe, and also reduces fluctuations in the amount of ambient air discharged from the second branch pipe.

[0036] The above and other objects, features, and effects of the present invention will become more apparent from the following description of the embodiments with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1A It is a plan view for explaining a configuration example of a substrate processing apparatus according to the first embodiment of the present invention.

[0038] Figure 1B It is a cross-sectional view for explaining the structure of the substrate processing apparatus.

[0039] Figure 2 It is a schematic diagram for explaining the structure of the processing unit included in the above-mentioned substrate processing apparatus.

[0040] Figure 3 4 is a top view of the processing unit.

[0041] Figure 4 It is a schematic diagram for explaining the structure of the discharge unit included in the substrate processing apparatus.

[0042] Figure 5A It is a schematic diagram for explaining the structure of the upstream gate plate included in the above-mentioned discharge unit.

[0043] Figure 5B It is along Figure 5A A cross-sectional view taken along line VB-VB is shown.

[0044] Figure 6A It is a schematic diagram for explaining the structure of the downstream gate plate included in the above-mentioned discharge unit.

[0045] Figure 6B It is along Figure 6A A cross-sectional view taken along line VIB-VIB is shown.

[0046] Figure 7 It is a schematic diagram for explaining the structure of the upstream slide gate and the downstream slide gate included in the above-mentioned discharge unit.

[0047] Figure 8This is a block diagram for explaining the electrical structure of the substrate processing apparatus.

[0048] Figure 9 This is a flowchart for explaining an example of substrate processing performed by the substrate processing apparatus.

[0049] Figure 10 It is a timing chart for explaining the state of the discharge unit when the substrate processing is performed.

[0050] Figure 11A It is a schematic diagram for explaining the state of the discharge unit when the substrate processing is performed.

[0051] Figure 11B It is a schematic diagram for explaining the state of the discharge unit when the substrate processing is performed.

[0052] Figure 12 This table shows the results of a simulation of the exhaust state of the atmosphere when the chemical solution supply step of the above-mentioned substrate processing is performed.

[0053] Figure 13A It is a timing chart for explaining substrate processing according to a modification example.

[0054] Figure 13B It is a timing chart for explaining the above-mentioned substrate processing according to a modified example.

[0055] Figure 14 It is a schematic diagram for explaining the discharge unit of the first modification.

[0056] Figure 15 It is a schematic diagram for explaining the discharge unit of the second modification.

[0057] Figure 16A It is a schematic diagram for explaining the discharge unit of the third modified example.

[0058] Figure 16B It is a schematic diagram for explaining the discharge unit of the third modified example.

[0059] Figure 17A It is a schematic diagram for explaining the discharge unit of the fourth modification.

[0060] Figure 17B It is a schematic diagram for explaining the discharge unit of the fourth modification.

[0061] Figure 18 It is a schematic diagram for explaining the configuration of a processing unit included in a substrate processing apparatus according to a second embodiment.

[0062] Figure 19 It is a top view of the processing unit of the second embodiment.

[0063] Figure 20 It is a schematic diagram for explaining the structure of the discharge unit included in the substrate processing apparatus according to the second embodiment.

[0064] Figure 21 This is a flowchart for explaining an example of substrate processing performed by the substrate processing apparatus according to the second embodiment.

[0065] Figure 22A This is a schematic diagram for explaining the state of the discharge unit when substrate processing is performed according to the second embodiment.

[0066] Figure 22B This is a schematic diagram for explaining the state of the discharge unit when substrate processing is performed according to the second embodiment.

[0067] Figure 22C This is a schematic diagram for explaining the state of the discharge unit when substrate processing is performed according to the second embodiment. DETAILED DESCRIPTION

[0068] <Structure of Substrate Processing Apparatus According to First Embodiment>

[0069] Figure 1A It is a plan view for explaining a configuration example of the substrate processing apparatus 1 according to the first embodiment of the present invention. Figure 1B It is a cross-sectional view for explaining the structure of the substrate processing apparatus 1 .

[0070] The substrate processing apparatus 1 is a single-wafer type apparatus that processes substrates W one by one. In this embodiment, the substrate W has a disk shape. The substrate W is a silicon wafer or the like, and has a pair of main surfaces.

[0071] The substrate processing device 1 includes: multiple processing units 2, each of which includes a chamber 4 and processes substrates W; multiple exhaust units 5, which exhaust ambient gas from the multiple chambers 4; a loading port LP (storage holding unit) for carrying a carrier C (storage) for storing multiple substrates W processed by the processing unit 2; a transport robot (a first transport robot IR and a second transport robot CR) that transports the substrate W between the loading port LP and the processing unit 2; and a controller 3, which controls the various components of the substrate processing device 1.

[0072] The first transfer robot IR transfers the substrate W between the carrier C and the second transfer robot CR. The second transfer robot CR transfers the substrate W between the first transfer robot IR and the processing unit 2.

[0073] Each transfer robot is, for example, a multi-joint arm robot including a pair of multi-joint arms AR and a pair of hands H provided at the front ends of the pair of multi-joint arms AR so as to be separated from each other in the upper and lower directions.

[0074] The plurality of processing units 2 are arranged on both sides of the transport path TR along which the second transport robot CR transports the substrates W, and are stacked in the vertical direction. The plurality of processing units 2 have, for example, the same structure.

[0075] The multiple processing units 2 form four processing towers TW, which are arranged at four horizontally separated positions when viewed from above. Each processing tower TW includes multiple processing units 2 stacked in a vertical direction. Two of the four processing towers TW are arranged on each side of the transfer path TR extending from the load port LP toward the second transfer robot CR.

[0076] The substrate processing apparatus 1 includes multiple fluid tanks 6 that house valves, piping, and other components. A portion of the discharge unit 5 is housed in the fluid tanks 6. The substrate processing apparatus 1 also includes a frame 7 that surrounds the multiple processing units 2, the multiple fluid tanks 6, the multiple discharge units 5, and the multiple transfer robots when viewed from above. The frame 7 has a generally square shape when viewed from above. The frame 7 includes a lower wall 7a, an upper wall 7b, and a side wall 7c connecting the lower and upper walls 7a and 7b.

[0077] The processing unit 2 includes a chamber 4 and a processing cup 8 disposed in the chamber 4 . The substrate W is processed in the processing cup 8 . The chamber 4 has a storage space for storing the substrate W.

[0078] The chamber 4 includes an entrance 4a (see the following) through which the second transfer robot CR carries substrates W into or out of the storage space. Figure 3 ) and the gate unit 4b for opening and closing the entrance and exit 4a (see the following Figure 3 ).

[0079] The processing unit 2 can use various processing liquids to process the substrate W. The processing liquid supplied to the substrate W in the chamber 4 is described in detail below, and examples thereof include chemical liquids, rinse liquids, and organic solvents.

[0080] The atmosphere in the chamber 4 (the storage space) is exhausted through the exhaust unit 5 and treated by the exhaust gas treatment unit 9. The exhaust gas treatment unit 9 includes a plurality of exhaust ducts 10 provided for each type of atmosphere exhausted from the chamber 4.

[0081] The exhaust gas treatment unit 9 may also include a suction device (not shown) for sucking the inside of the multiple exhaust pipes 10. The suction device includes at least one suction pump that is provided in the middle or at the end of the exhaust pipe 10 and sucks the multiple exhaust pipes 10. The at least one suction pump may be a plurality of suction pumps corresponding one-to-one to the multiple exhaust pipes 10, or a single suction pump that sucks exhaust gas from all the exhaust pipes 10. The exhaust gas treatment unit 9 is provided in the clean room where the substrate processing apparatus 1 is provided or in equipment attached to the clean room. The exhaust gas treatment unit 9 may also be a part of the substrate processing apparatus 1.

[0082] The plurality of exhaust units 5 have, for example, the same structure and include a main pipe 11 connected to the processing cups 8 and exhausting the atmosphere from the chamber 4 , and a plurality of branch pipes 12 connected to the main pipe 11 and exhausting the atmosphere from the main pipe 11 .

[0083] Reference Figure 1B The main pipe 11 has an upstream end 11a connected to the processing cup 8, and a downstream end 11b located inside the chamber 4 in a plan view and connected to a plurality of branch pipes 12. Specifically, the main pipe 11 includes an upstream main pipe 11A located inside the chamber 4, a midstream main pipe 11B connected to the upstream main pipe 11A and located outside the chamber 4 (fluid tank 6), and a downstream main pipe 11C connected to the midstream main pipe 11B and the plurality of branch pipes 12 and located below the lower wall 7a of the frame 7.

[0084] The plurality of branch pipes 12 are located below the plurality of chambers 4 constituting the treatment tower TW. The plurality of branch pipes 12 are connected to the downstream main pipe 11C and are located below the bottom wall 7 a of the frame 7 .

[0085] Reference Figure 1A The multiple branch pipes 12 are located inside the corresponding chambers 4 in a plan view. Therefore, the length of the main pipe 11 can be shortened compared to a case where the multiple branch pipes 12 are located outside the corresponding chambers 4. The multiple branch pipes 12 are located inside the frame 7 and outside the transport path TR in a plan view. The multiple branch pipes 12 are arranged inside the frame 7 in a plan view, thereby reducing the installation area of ​​the substrate processing apparatus 1.

[0086] <Configuration of Processing Unit of First Embodiment>

[0087] Figure 2 It is a schematic diagram for explaining the structure of the processing unit 2. Figure 3 is a top view of the processing unit 2.

[0088] The processing unit 2 further includes a rotary chuck 13 that rotates the substrate W around a rotation axis A1 while holding the substrate W in a predetermined processing posture. The rotation axis A1 passes through the center of the substrate W and is perpendicular to each main surface of the substrate W held in the processing posture. The processing posture is, for example, Figure 2 The substrate W is in the horizontal position shown, with the main surface of the substrate W being horizontal. When the processing position is the horizontal position, the rotation axis A1 extends vertically. The spin chuck 13 is an example of a rotating holding member that rotates the substrate W about the rotation axis A1 while holding the substrate W in the processing position.

[0089] The rotary chuck 13 includes: a rotary base 21 having a circular plate shape along the horizontal direction; a plurality of chuck pins 20, which hold the substrate W above the rotary base 21 and maintain the substrate W in a holding position; a rotary shaft 22 connected to the rotary base 21 and extending in the vertical direction; and a rotary drive mechanism 23, which rotates the rotary shaft 22 around its center axis (rotation axis A1).

[0090] The plurality of chuck pins 20 are arranged on the upper surface of the rotating base 21 at intervals in the circumferential direction of the rotating base 21 (see Figure 3 ).

[0091] The rotation drive mechanism 23 includes an actuator such as an electric motor. The rotation drive mechanism 23 rotates the rotation shaft 22 to rotate the spin base 21 and the plurality of chuck pins 20 about the rotation axis A1. As a result, the substrate W rotates about the rotation axis A1 together with the spin base 21 and the plurality of chuck pins 20.

[0092] The chuck pins 20 are movable between a closed position where they come into contact with the periphery of the substrate W to hold the substrate W and an open position where they are retracted from the periphery of the substrate W. The chuck pins 20 are moved by an opening and closing mechanism (not shown).

[0093] When located at the closed position, the chuck pins 20 grip the peripheral edge of the substrate W and hold the substrate W horizontally. The opening and closing mechanism includes, for example, a link mechanism and an actuator such as an electric motor or an air cylinder that applies a driving force to the link mechanism.

[0094] The processing cup 8 receives the liquid scattered from the substrate W held by the spin chuck 13. The processing cup 8 includes: Figure 2 In the example of two) shields 25, which catch the liquid flying outward from the substrate W held by the spin chuck 13; multiple (in Figure 2 In the example, there are two cups 26, each of which receives the liquid guided downward by the multiple shields 25; and a cylindrical outer wall member 27, which surrounds the multiple shields 25 and the multiple cups 26. The upstream end 11a of the main pipe 11 is connected to the outer wall member 27.

[0095] The plurality of shields 25 are raised and lowered by a shield raising and lowering drive mechanism (not shown). The shield raising and lowering drive mechanism includes, for example, an actuator such as an electric motor or an air cylinder that drives each shield 25 to raise and lower.

[0096] The structure of the processing cup 8 is not limited to Figure 2 For example, the number of shields 25 provided on the processing cup 8 may be one, or three or more. The number of cups 26 provided on the processing cup 8 may be one, or three or more.

[0097] The discharge unit 5 includes a main pipe damper 28 that opens and closes the main pipe 11. The main pipe damper 28 is a regulating valve that adjusts the flow rate of the fluid flowing in the pipe by changing the opening ratio of the space formed in the pipe or the opening of the pipe. The same applies to the dampers described below.

[0098] The main pipe damper 28 is, for example, a rotary damper, ie, a butterfly valve. The main pipe damper 28 is not limited to a butterfly valve, and may be configured to adjust the flow rate of the fluid in the main pipe 11 and to open and close the main pipe 11.

[0099] The butterfly valve includes a valve element having a shape conforming to the inner peripheral surface of a pipe and a valve element rotation shaft for rotating the valve element in the pipe.

[0100] When the main pipe gate 28 is a butterfly valve, the main pipe gate 28 includes a valve core 28a having a shape that conforms to the inner circumferential surface of the main pipe 11 and a valve core rotating shaft 28b that rotates the valve core 28a within the main pipe 11. The valve core rotating shaft 28b can be configured to be rotated by an actuator such as a motor or an air cylinder, or can be configured to be rotated manually.

[0101] In this embodiment, the main pipe gate plate 28 is provided in the upstream main pipe 11A, but the position of the main pipe gate plate 28 is not limited thereto. That is, the main pipe gate plate 28 may be provided in the midstream main pipe 11B or in the downstream main pipe 11C (see also Figure 1B ).

[0102] The processing unit 2 may also include an air supply unit 29 disposed on the upper wall of the chamber 4. The air supply unit 29 is, for example, a fan filter unit (FFU) that cleans the air outside the chamber 4 and supplies it to the chamber 4. The air supply unit 29 facilitates the discharge of ambient air from the chamber 4 to the exhaust unit 5, i.e., the exhaust of the chamber 4.

[0103] The processing unit 2 includes a plurality of movable nozzles capable of moving at least horizontally. The plurality of movable nozzles further includes a first movable nozzle 31 that selectively ejects a continuous flow of a chemical solution and a continuous flow of a rinse liquid toward the upper surface (upper main surface) of the substrate W held by the spin chuck 13; and a second movable nozzle 32 that ejects a continuous flow of an organic solvent toward the upper surface of the substrate W held by the spin chuck 13.

[0104] The first movable nozzle 31 is an example of a chemical liquid nozzle and also an example of a rinse liquid nozzle. The second movable nozzle 32 is an example of an organic solvent nozzle. Both the first movable nozzle 31 and the second movable nozzle 32 are examples of processing liquid nozzles. That is, the processing unit 2 includes multiple processing liquid nozzles that discharge different types of processing liquids toward the substrates W accommodated in the chamber 4.

[0105] The first moving nozzle 31 and the second moving nozzle 32 are each moved in the horizontal direction by a plurality of nozzle moving mechanisms (a first nozzle moving mechanism 35 and a second nozzle moving mechanism 36 ).

[0106] Each nozzle movement mechanism is capable of moving the corresponding nozzle between a central position and a retracted position. The central position is where the nozzle faces the central area of ​​the upper surface of the substrate W. The central area of ​​the upper surface of the substrate W refers to the area of ​​the upper surface of the substrate W that includes the rotation center (central portion) and the area surrounding the rotation center. The retracted position is where the nozzle does not face the upper surface of the substrate W and is located outside the processing cup 8.

[0107] Each nozzle movement mechanism includes an arm (first arm 35a and second arm 36a) that supports the corresponding nozzle and an arm movement mechanism (first arm movement mechanism 35b and second arm movement mechanism 36b) that moves the corresponding arm horizontally. Each arm movement mechanism includes an actuator such as an electric motor or an air cylinder.

[0108] Different from this embodiment, the first moving nozzle 31 and the second moving nozzle 32 may also be configured to move integrally by a common nozzle moving mechanism. Figure 3 The rotary nozzle which rotates about a predetermined rotation axis as shown can also be used with Figure 3 The example shown is different in that it is a direct-acting nozzle that moves linearly in the direction in which the corresponding arm portion extends.

[0109] The first moving nozzle 31 and the second moving nozzle 32 may be configured to be movable in the vertical direction.

[0110] The chemical liquid ejected from the first movable nozzle 31 includes, for example, hydrogen peroxide solution (H2O2), hydrofluoric acid (HF), dilute hydrofluoric acid (DHF), buffered hydrofluoric acid (BHF), hydrochloric acid (HCl), HPM solution (hydrochloric acid-hydrogen peroxide mixture), SPM solution (sulfuric acid / hydrogen peroxide mixture), ammonia water, TMAH solution (Tetramethylammonium hydroxide solution), or APM solution (ammonia-hydrogen peroxide mixture).

[0111] Hydrofluoric acid, diluted hydrofluoric acid, buffered hydrofluoric acid, hydrochloric acid, HPM solution, and SPM solution are classified as acidic chemicals. Ammonia solution, APM solution, and TMAH solution are classified as alkaline chemicals.

[0112] The chemical solution may contain at least one of hydrogen peroxide solution, hydrofluoric acid, dilute hydrofluoric acid, buffered hydrofluoric acid, hydrochloric acid, HPM solution, and SPM solution. Furthermore, the chemical solution may contain at least one of ammonia solution, APM solution, and TMAH solution.

[0113] The rinse liquid ejected from the first movable nozzle 31 is, for example, water such as DIW (deionized water). However, the rinse liquid is not limited to DIW. The rinse liquid is not limited to DIW and may include at least one of DIW, carbonated water, electrolytic ionized water, hydrochloric acid water at a dilute concentration (e.g., 1 ppm to 100 ppm), ammonia water at a dilute concentration (e.g., 1 ppm to 100 ppm), and reduced water (hydrogen water).

[0114] The first movable nozzle 31 is connected to a common pipe 40 that guides a fluid to the first movable nozzle 31. A chemical liquid pipe 41 that supplies a chemical liquid to the common pipe 40 and a rinse liquid pipe 42 that supplies a rinse liquid to the common pipe 40 are connected to the common pipe 40. The common pipe 40 may also be connected to the chemical liquid pipe 41 and the rinse liquid pipe 42 via a mixing valve (not shown).

[0115] Common pipe 40 is provided with a common valve 50 for opening and closing common pipe 40. Chemical liquid pipe 41 is provided with a chemical liquid valve 51 for opening and closing chemical liquid pipe 41. Rinse liquid pipe 42 is provided with a rinse liquid valve 52 for opening and closing rinse liquid pipe 42.

[0116] Although not shown, the common valve 50 includes a valve body having a valve seat provided therein, a valve element for opening and closing the valve seat, and an actuator for moving the valve element between an open position and a closed position.

[0117] When the chemical liquid valve 51 and the common valve 50 are opened, a continuous flow of chemical liquid is ejected from the first moving nozzle 31. When the rinse liquid valve 52 and the common valve 50 are opened, a continuous flow of rinse liquid is ejected from the first moving nozzle 31.

[0118] The organic solvent ejected from the second moving nozzle 32 is, for example, isopropyl alcohol (IPA), but is not limited thereto.

[0119] As the organic solvent sprayed from the second movable nozzle 32, there can be cited alcohols such as ethanol (EtOH) and isopropyl alcohol, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, and other ethylene glycol monoalkyl ethers, ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, and other ethylene glycol monoalkyl ether acetates, propylene glycol monomethyl ether (PGME), propylene glycol monoethyl ether (PGEE), and other propylene glycol monoalkyl ethers, methyl lactate, ethyl lactate (EL) and other lactic acid esters, aromatic hydrocarbons such as toluene and xylene, methyl ethyl ketone, 2-heptanone, cyclohexanone and other ketones. In addition, as an organic solvent contained in the hydrophilic membrane-forming liquid in the form of a solvent, propylene glycol monomethyl ether acetate (PGMEA) can also be used. The above organic solvents can be used alone or as a mixture of two or more.

[0120] The second moving nozzle 32 is connected to an organic solvent pipe 43 that supplies an organic solvent to the second moving nozzle 32. The organic solvent pipe 43 is provided with an organic solvent valve 53 that opens and closes the organic solvent pipe 43. When the organic solvent valve 53 is opened, a continuous flow of the organic solvent is ejected from the second moving nozzle 32.

[0121] The processing liquid supplied to the upper surface of the substrate W scatters from the peripheral edge of the substrate W and is received by the processing cup 8. The processing liquid received by the processing cup 8 is recovered or discarded through a drainage pipe (not shown).

[0122] The substances contained in the atmosphere gas exhausted from the chamber 4 vary depending on the type of processing liquid supplied to the upper surface of the substrate W. Specifically, when a chemical liquid is supplied to the upper surface of the substrate W, the atmosphere gas (chemical liquid atmosphere gas) exhausted from the chamber 4 contains vapor and mist of the chemical liquid. When an organic solvent is supplied to the upper surface of the substrate W, the atmosphere gas (organic solvent atmosphere gas) exhausted from the chamber 4 contains vapor and mist of the organic solvent. In the following substrate processing (see the following Figure 9 ), the rinse liquid is supplied to the substrate W after the chemical liquid. Therefore, from the start of supplying the rinse liquid to the upper surface of the substrate W until a certain time has passed, the atmosphere exhausted from the chamber 4 is the chemical liquid atmosphere.

[0123] There may be cases where the chemical liquid atmosphere exhausted from the chamber 4 does not contain chemical liquid mist. Similarly, there may be cases where the organic solvent atmosphere exhausted from the chamber 4 does not contain organic solvent mist.

[0124] <Structure of the Discharge Unit of the First Embodiment>

[0125] Figure 4 1 is a schematic diagram for explaining the structure of the discharge unit 5. The following description focuses on one of the plurality of discharge units 5. In the first embodiment, an example in which two branch pipes 12 are provided in each discharge unit 5 is described.

[0126] The two branch pipes 12 include a first branch pipe 12A for exhausting the chemical liquid atmosphere and a second branch pipe 12B for exhausting the organic solvent atmosphere. Each branch pipe 12 has an upstream end connected to the downstream end 11b of the main pipe 11 and a downstream end connected to the corresponding exhaust pipe 10. Each branch pipe 12 has an internal space 62 through which the atmosphere from the main pipe 11 can flow.

[0127] The number of exhaust pipes 10 is set to be the same as the number of branch pipes 12, and the ambient gas in each branch pipe 12 is discharged into the corresponding exhaust pipe 10. The exhaust pipe 10 connected to the first branch pipe 12A is called the first exhaust pipe 10A, and the exhaust pipe 10 connected to the second branch pipe 12B is called the second exhaust pipe 10B.

[0128] Each branch pipe 12 may be integrally formed with the main pipe 11, or may be formed as a separate component from the main pipe 11 and mechanically joined to the main pipe 11. In this embodiment, the branch pipe 12 includes an integrally formed portion 14 integrally formed with the main pipe 11 and a separate formed portion 15 mechanically joined to the integrally formed portion 14 by a fastening member such as a screw (not shown). The separate formed portion 15 is formed by mechanically joining a plurality of pipe components using a fastening member such as a screw (not shown).

[0129] The discharge unit 5 includes a plurality of upstream gates 60 , a plurality of downstream gates 61 , a plurality of upstream slide gates 65 , and a plurality of downstream slide gates 66 .

[0130] Each branch pipe 12 is provided with an upstream gate 60. Each upstream gate 60 opens and closes the corresponding branch pipe 12. Specifically, the upstream gate 60 opens and closes the flow path formed by the internal space 62 of the corresponding branch pipe 12. By closing the branch pipe 12 with the upstream gate 60, the flow of ambient gas from a position upstream of the upstream gate 60 to a position downstream of the upstream gate 60 is prohibited. The upstream gate 60 is, for example, a butterfly valve.

[0131] Among the plurality of upstream gate plates 60 , the upstream gate plate 60 provided in the first branch pipe 12A is sometimes referred to as a first upstream gate plate 60A, and the upstream gate plate 60 provided in the second branch pipe 12B is sometimes referred to as a second upstream gate plate 60B.

[0132] Each branch pipe 12 is equipped with a downstream gate plate 61. Each downstream gate plate 61 is located downstream of the upstream gate plate 60 in the corresponding branch pipe 12. Each downstream gate plate 61 opens and closes the corresponding branch pipe 12. Specifically, the downstream gate plate 61 opens and closes the branch flow path formed by the internal space 62 of the branch pipe 12. By closing the branch pipe 12 with the downstream gate plate 61, the flow of ambient gas from the upstream side of the downstream gate plate 61 to the downstream side of the downstream gate plate 61 is prohibited. The downstream gate plate 61 is, for example, a butterfly valve.

[0133] Among the plurality of downstream gate plates 61 , the downstream gate plate 61 provided in the first branch pipe 12A is sometimes referred to as a first downstream gate plate 61A, and the downstream gate plate 61 provided in the second branch pipe 12B is sometimes referred to as a second downstream gate plate 61B.

[0134] The internal space 62 includes an upstream space 63 located downstream of the upstream gate 60 and upstream of the downstream gate 61, and a downstream space 64 located downstream of the downstream gate 61. Each branch pipe 12 has an upstream opening 63a that connects (is connected to) the upstream space 63 with the space surrounding the branch pipe 12 (the outside of the branch pipe 12), and a downstream opening 64a that connects (is connected to) the downstream space 64 with the space surrounding the branch pipe 12 (the outside of the branch pipe 12).

[0135] The upstream space 63 communicates with the space around the branch pipe 12 via the upstream opening 63a. The downstream space 64 communicates with the space around the branch pipe 12 via the downstream opening 64a.

[0136] Among the internal spaces 62 of the plurality of branch pipes 12 , the internal space 62 of the first branch pipe 12A is sometimes referred to as a first internal space 62A, and the internal space 62 of the second branch pipe 12B is sometimes referred to as a second internal space 62B.

[0137] The upstream sliding shutter 65 is configured to open the upstream opening 63 a to allow the ambient air around the branch pipe 12 to flow into the upstream space 63 , or to close the upstream opening 63 a to stop the ambient air around the branch pipe 12 from flowing into the upstream space 63 .

[0138] The downstream sliding shutter 66 is configured to open the downstream opening 64 a to allow the atmosphere around the branch pipe 12 to flow into the downstream space 64 , or to close the downstream opening 64 a to stop the atmosphere around the branch pipe 12 from flowing into the downstream space 64 .

[0139] In this embodiment, the ambient air surrounding the branch pipe 12 is sometimes referred to as external ambient air. External ambient air refers to the ambient air that flows into the upstream space 63 from a different path than the main pipe 11. The upstream sliding gate 65 is an example of an upstream opening and closing gate that opens and closes the upstream opening 63a. The downstream sliding gate 66 is an example of a downstream opening and closing gate that opens and closes the downstream opening 64a.

[0140] Among the plurality of upstream sliding gate plates 65 , the upstream sliding gate plate 65 provided in the first branch pipe 12A is sometimes referred to as a first upstream sliding gate plate 65A, and the upstream sliding gate plate 65 provided in the second branch pipe 12B is sometimes referred to as a second upstream sliding gate plate 65B.

[0141] Among the multiple downstream sliding gates 66, the downstream sliding gate 66 provided in the first branch pipe 12A is sometimes referred to as the first downstream sliding gate 66A, and the downstream sliding gate 66 provided in the second branch pipe 12B is sometimes referred to as the second downstream sliding gate 66B. When the opening opened and closed by the sliding gate is slit-shaped, the sliding gate is also called a slit gate.

[0142] By opening and closing the branch pipe 12 by the upstream gate plate 60, the exhaust destination of the atmosphere in the chamber 4 can be switched. Figure 4 As shown, by opening one branch pipe 12 (e.g., first branch pipe 12A) and closing the other branch pipe 12 (e.g., second branch pipe 12B), one branch pipe 12 can be used as the exhaust destination for the atmosphere in chamber 4. Furthermore, by closing the branch pipe 12 with the downstream gate 61, it is possible to suppress the inflow of atmosphere from the main pipe 11 into the branch pipe 12 that is not the exhaust destination.

[0143] By allowing the external ambient air to flow into the downstream space 64 through the downstream sliding gate 66 corresponding to the branch pipe 12 that is not the discharge destination of the ambient air, the external ambient air can be transported downstream of the corresponding branch pipe 12. Therefore, it is possible to prevent the amount of ambient air discharged from the branch pipe 12 from fluctuating due to the closure of the branch pipe 12 by the upstream gate 60.

[0144] Figure 5A It is a schematic diagram for explaining the structure of the upstream gate plate 60 . Figure 5B It is along Figure 5A A cross-sectional view taken along line VB-VB is shown.

[0145] The branch pipe 12 includes an upstream cylindrical portion 70 at the location where the upstream gate plate 60 is located. The upstream cylindrical portion 70 has a circular upstream inner circumferential surface 70a in cross-sectional view. The upstream gate plate 60 includes an upstream valve element 71 having a circular disc-shaped shape that conforms to the upstream inner circumferential surface 70a, and an upstream valve element rotation mechanism 72 that rotates the upstream valve element 71 within the branch pipe 12.

[0146] The upstream valve core rotating mechanism 72 includes an upstream rotating shaft 73 that transmits rotational force to the upstream valve core 71, and an upstream supporting shaft 74 that is coaxially arranged on the opposite side of the upstream rotating shaft 73 relative to the upstream valve core 71 and supports the upstream valve core 71 so that it can rotate.

[0147] The upstream valve core 71 rotates together with the upstream rotation shaft 73 and the upstream support shaft 74 about the upstream rotation axis A2, which serves as the center axis of the upstream rotation shaft 73. The upstream rotation axis A2 is orthogonal to the upstream valve core center axis A3, which serves as the center axis of the upstream valve core 71. The upstream valve core 71 opens and closes the branch pipe 12 by rotating about the upstream rotation axis A2 within the branch pipe 12. When the upstream gate 60 (upstream valve core 71) closes the branch pipe 12, the upstream valve core center axis A3 of the upstream valve core 71 coincides with the center axis of the upstream inner peripheral surface 70a. When the upstream gate 60 (upstream valve core 71) closes the branch pipe 12, an upstream gap 75 exists between the upstream valve core 71 and the upstream inner peripheral surface 70a.

[0148] The discharge unit 5 also includes an upstream gate drive mechanism 67 that drives the upstream gate 60 to open and close the branch pipe 12. The upstream gate drive mechanism 67 drives the upstream valve core 71 via the upstream rotary shaft 73, enabling the upstream valve core 71 to move between a closed position, in which the upstream valve core 71 closes the branch pipe 12, and an open position, in which the upstream valve core 71 opens the branch pipe 12. The upstream gate drive mechanism 67 includes, for example, an actuator such as an electric motor or a pneumatic cylinder.

[0149] By using a butterfly valve as the upstream gate 60, the branch pipe 12 can be closed with a simple structure. By providing a gap (upstream gap 75) between the upstream inner peripheral surface 70a of the branch pipe 12 and the upstream valve element 71, the upstream valve element 71 can rotate smoothly in the branch pipe 12.

[0150] Figure 6A It is a schematic diagram for explaining the structure of the downstream gate plate 61. Figure 6B It is along Figure 6A A cross-sectional view taken along line VIB-VIB is shown.

[0151] The branch pipe 12 includes a downstream cylindrical portion 80 at a location where the downstream gate plate 61 is located. The downstream cylindrical portion 80 has a circular downstream inner peripheral surface 80a in cross-sectional view. The downstream gate plate 61 includes a downstream valve element 81 having a circular disc-like shape that conforms to the downstream inner peripheral surface 80a, and a downstream valve element rotation mechanism 82 that rotates the downstream valve element 81 within the branch pipe 12.

[0152] The downstream valve core rotating mechanism 82 includes a downstream rotating shaft 83 that transmits rotational force to the downstream valve core 81, and a downstream supporting shaft 84 that is coaxially arranged on the opposite side of the downstream rotating shaft 83 relative to the downstream valve core 81 and supports the downstream valve core 81 so that it can rotate.

[0153] The downstream valve core 81 rotates together with the downstream rotation shaft 83 and the downstream support shaft 84 about a downstream rotation axis A4, which is the center axis of the downstream rotation shaft 83. The downstream rotation axis A4 is orthogonal to a downstream valve core center axis A5, which is the center axis of the downstream valve core 81. The downstream valve core 81 opens and closes the branch pipe 12 by rotating about the downstream rotation axis A4 within the branch pipe 12.

[0154] When the downstream gate plate 61 (downstream valve core 81) closes the branch pipe 12, the downstream valve core center axis A5 of the downstream valve core 81 coincides with the center axis of the downstream inner peripheral surface 80a. When the downstream gate plate 61 (downstream valve core 81) closes the branch pipe 12, a downstream gap 85 exists between the downstream valve core 81 and the downstream inner peripheral surface 80a.

[0155] The discharge unit 5 further includes a downstream gate drive mechanism 68 that drives the downstream gate 61 to open and close the branch pipe 12. The downstream gate drive mechanism 68 drives the downstream gate 61 via the downstream rotating shaft 83, enabling the downstream gate 61 to move between a closed position, in which the downstream gate 61 closes the branch pipe 12, and an open position, in which the downstream gate 61 opens the branch pipe 12. The downstream gate drive mechanism 68 includes, for example, an actuator such as an electric motor or a pneumatic cylinder.

[0156] By using a butterfly valve as the downstream gate 61, the branch pipe 12 can be closed with a simple structure. By providing a gap (downstream gap 85) between the downstream inner peripheral surface 80a of the branch pipe 12 and the downstream valve element 81, the downstream valve element 81 can rotate smoothly within the branch pipe 12.

[0157] The discharge unit 5 includes a sealing structure 86 that seals the downstream inner peripheral surface 80a and the downstream valve core 81 when the downstream valve core 81 closes the branch pipe 12. The sealing structure 86 is, for example, a labyrinth seal structure that seals the downstream inner peripheral surface 80a and the downstream valve core 81 in a non-contact manner. The labyrinth seal structure is a structure in which two components are engaged with each other in a state where a gap is slightly provided between their surfaces. The concave-convex engagement refers to the engagement of the concave part with the convex part. Therefore, the downstream gate plate 61 has a higher sealing performance than the upstream gate plate 60, and can effectively suppress the passage of ambient gas compared to the upstream gate plate 60.

[0158] By providing the closing structure 86 , a gap (downstream gap 85 ) can be provided between the downstream inner peripheral surface 80 a of the branch pipe 12 and the downstream valve element 81 to enable the downstream valve element 81 to rotate smoothly and further suppress atmospheric gas from passing through the downstream gate plate 61 .

[0159] The closing structure 86 includes: a plurality of valve core sealing components 88, which have a roughly semicircular arc shape extending along the circumference of the downstream valve core 81 and are arranged on the peripheral portion of the downstream valve core 81; and a plurality of piping sealing components 87, which have a roughly semicircular arc shape extending along the circumference of the downstream inner peripheral surface 80a and are arranged on the downstream inner peripheral surface 80a.

[0160] When the downstream valve element 81 is located at the closed position, the plurality of pipe seal members 87 and the plurality of valve element seal members 88 are engaged with each other in a non-contact manner.

[0161] One end portion of each valve element sealing member 88 in the circumferential direction of the downstream valve element 81 is spaced apart from the downstream rotating shaft 83 , and the other end portion of each valve element sealing member 88 in the circumferential direction of the downstream valve element 81 is spaced apart from the downstream support shaft 84 .

[0162] The plurality of valve core sealing components 88 include a first valve core sealing component 88A and a second valve core sealing component 88B. The first valve core sealing component 88A is provided on one of a pair of circular surfaces of the downstream valve core 81. The second valve core sealing component 88B is provided on the other of the pair of circular surfaces of the downstream valve core 81. The first valve core sealing component 88A and the second valve core sealing component 88B have rotationally symmetrical shapes that overlap when one of the first valve core sealing component 88A and the second valve core sealing component 88B is rotated 180 degrees about the downstream rotation axis A4.

[0163] One end portion of each piping sealing member 87 in the circumferential direction of the downstream inner peripheral surface 80 a is spaced apart from the downstream rotating shaft 83 , and the other end portion of each piping sealing member 87 in the circumferential direction of the downstream inner peripheral surface 80 a is spaced apart from the downstream support shaft 84 .

[0164] The multiple piping sealing components 87 include: a first piping sealing component 87A, which is axially opposite to the first valve core sealing component 88A on the downstream inner peripheral surface 80a when the downstream valve core 81 is in the closed position; and a second piping sealing component 87B, which is axially opposite to the second valve core sealing component 88B on the downstream inner peripheral surface 80a when the downstream valve core 81 is in the closed position.

[0165] The first pipe sealing member 87A and the second pipe sealing member 87B have rotationally symmetrical shapes that overlap each other when one of the first pipe sealing member 87A and the second pipe sealing member 87B is rotated 180 degrees about the downstream rotation axis A4. Therefore, the downstream valve element 81 can be placed in the closed position by rotating the downstream valve element 81 to one side about the downstream rotation axis A4, and can be placed in the open position by rotating the downstream valve element 81 to the other side about the downstream rotation axis A4.

[0166] That is, through a simple rotation action, it is possible to switch to a state where the downstream inner circumference 80a of the branch pipe 12 and the downstream valve core 81 are closed by the closing structure 86, or it is possible to switch to a state where the downstream inner circumference 80a of the branch pipe 12 and the downstream valve core 81 are not closed.

[0167] The closed structure 86 can also be used with Figure 6A and Figure 6B The structure shown is different from that of the contact-type sealing structure 86 in which a plurality of valve element sealing members 88 and a plurality of pipe sealing members 87 are in contact with each other.

[0168] Figure 7 It is a schematic diagram for explaining the structure of the upstream slide gate 65 and the downstream slide gate 66 .

[0169] Each branch pipe 12 includes an upstream box-shaped portion 89, which is square in cross-section and is located downstream of the upstream cylindrical portion 70 and upstream of the downstream cylindrical portion 80, and a downstream box-shaped portion 90, which is located downstream of the downstream cylindrical portion 80. The upstream opening 63a extends through the flat wall of the upstream box-shaped portion 89, and the downstream opening 64a extends through the flat wall of the downstream box-shaped portion 90. In this embodiment, the upstream box-shaped portion 89, the downstream box-shaped portion 90, and the upstream cylindrical portion 70 form a single piping component.

[0170] The upstream sliding shutter 65 opens and closes the upstream opening 63a by sliding relative to the branch pipe 12. The downstream sliding shutter 66 opens and closes the downstream opening 64a by sliding relative to the branch pipe 12.

[0171] The discharge unit 5 further includes: a connecting member 91 that connects the upstream sliding gate 65 and the downstream sliding gate 66; and a sliding drive mechanism 92 (see Figure 4 ), which slides the upstream sliding gate plate 65 and the downstream sliding gate plate 66 by driving the connecting member 91. The sliding drive mechanism 92 includes an actuator such as an air cylinder or an electric motor.

[0172] The upstream sliding shutter 65 is moved to a closed position closing the upstream opening 63a, an open position opening the upstream opening 63a, and a position between the two positions by the slide drive mechanism 92. The upstream sliding shutter 65 moves along a guide provided at the edge of the upstream opening 63a, for example.

[0173] By sliding the upstream sliding gate 65 relative to the branch pipe 12 to open the upstream opening 63a, ambient air can flow from outside the branch pipe 12 into the upstream space 63. A sliding gate eliminates the need to connect piping, etc., for allowing ambient air to flow into the upstream space 63 to the branch pipe 12, thereby simplifying the structure.

[0174] The upstream sliding shutter 65 can switch the state of the upstream space 63 between an inflow-allowing state in which the external atmosphere is allowed to flow into the upstream space 63 and an inflow-restricting state in which the external atmosphere is prohibited from flowing into the upstream space 63. Therefore, the upstream sliding shutter 65 is an example of an upstream switching member.

[0175] “Switching the state of the upstream space 63 between the inflow permitted state and the inflow prohibited state” means that the state of the upstream space 63 can be switched from the inflow permitted state to the inflow prohibited state, and can also be switched from the inflow prohibited state to the inflow permitted state.

[0176] The downstream sliding shutter 66 is moved to a closed position closing the downstream opening 64a, an open position opening the downstream opening 64a, and a position between the two positions by the slide drive mechanism 92. The downstream sliding shutter 66 moves, for example, along a guide provided at the edge of the downstream opening 64a.

[0177] By sliding the downstream sliding gate 66 relative to the branch pipe 12 to open the downstream opening 64a, ambient air can flow from outside the branch pipe 12 into the downstream space 64. A sliding gate eliminates the need to connect piping, etc., to the branch pipe 12 for allowing ambient air to flow into the downstream space 64, thereby simplifying the structure.

[0178] The downstream sliding shutter 66 can switch the state of the downstream space 64 between an inflow-allowing state in which the external atmosphere is allowed to flow into the downstream space 64 and an inflow-restricting state in which the external atmosphere is prohibited from flowing into the downstream space 64. Therefore, the downstream sliding shutter 66 is an example of a downstream switching member.

[0179] “Switching the state of the downstream space 64 between the inflow permitted state and the inflow prohibited state” means that the state of the downstream space 64 can be switched from the inflow permitted state to the inflow prohibited state, and can also be switched from the inflow prohibited state to the inflow permitted state.

[0180] According to the discharge unit 5 of the first embodiment, the downstream gate 61 is provided downstream of the upstream sliding gate 65. Therefore, by opening the upstream opening 63a with the upstream sliding gate 65, the external ambient air flows into the upstream space 63, thereby increasing the pressure in the upstream space 63. The air pressure around the branch pipe 12 may be equal to, higher than, or lower than the air pressure in the upstream space 63.

[0181] Specifically, by making the pressure in the upstream space 63 higher than the pressure in the main pipe 11, it is possible to suppress the flow of ambient gas from the upstream gap 75 between the upstream inner peripheral surface 70a and the upstream valve core 71 into the upstream space 63. This effectively suppresses the flow of ambient gas from the chamber 4 into the branch pipe 12, which is not the exhaust destination of the ambient gas from the chamber 4. A state in which the pressure in the upstream space 63 is higher than the pressure in the main pipe 11 is referred to as a positive pressure state. Therefore, the upstream sliding gate 65 is also referred to as an air pressure gate.

[0182] Alternatively, the ambient gas may flow back from the upstream space 63 toward the main pipe 11, and the backflowing ambient gas may flow into the branch pipe 12, which is the discharge destination. Since the backflowing ambient gas is essentially composed of external ambient gas, even if it flows into the branch pipe 12, which is the discharge destination, it has little effect on the discharge pipe 10.

[0183] By increasing the pressure in the upstream space 63, it is possible to suppress the flow of atmosphere exhausted from the chamber 4 into unintended branch pipes 12. Therefore, while the atmosphere is flowing from the chamber 4 into one of the plurality of branch pipes 12, it is possible to effectively suppress the flow of atmosphere from the chamber 4 into the other branch pipes 12.

[0184] In addition, according to the exhaust unit 5 of the first embodiment, when the flow of the ambient gas exhausted from the chamber 4 into the branch pipe 12 is fully suppressed by the upstream gate plate 60, the ambient gas flowing to the position downstream of the downstream gate plate 61 through the downstream gap 85 is mostly composed of external ambient gas flowing into the upstream space 63 through the upstream opening 63a.

[0185] Therefore, even when a downstream gap 85 exists between the inner circumferential surface of the branch pipe 12 and the downstream valve element 81, the atmosphere exhausted from the chamber 4 is less likely to pass through the downstream gap 85 than through the upstream gate plate 60. As a result, the atmosphere exhausted from the chamber 4 is prevented from flowing downstream of the branch pipe 12, and the downstream valve element 81 can rotate smoothly within the branch pipe 12.

[0186] Furthermore, according to the discharge unit 5 of the first embodiment, when the downstream valve element 81 closes the branch pipe 12, the space between the downstream inner peripheral surface 80a and the downstream valve element 81 is sealed by the sealing structure 86. Therefore, the pressure in the upstream space 63 of the branch pipe 12 can be quickly and sufficiently increased.

[0187] The downstream valve element 81 is located upstream of the downstream sliding gate 66. Therefore, even when the branch pipe 12 is closed by the upstream gate 60 and the downstream gate 61, the external atmosphere can be fed into the discharge pipe 10.

[0188] Furthermore, according to the discharge unit 5 of the first embodiment, the upstream sliding gate 65 and the downstream sliding gate 66 are connected by a connecting member 91. Therefore, by driving the connecting member 91, both the upstream sliding gate 65 and the downstream sliding gate 66 can be slid simultaneously relative to the branch pipe 12. This allows the upstream opening 63a and the downstream opening 64a to be opened and closed simultaneously. Consequently, compared to a configuration in which separate drive mechanisms are used to open and close the upstream sliding gate 65 and the downstream sliding gate 66, the structure for sliding the sliding gates can be simplified.

[0189] Figure 8 This is a block diagram for explaining a configuration example related to control of the substrate processing apparatus 1. The controller 3 includes a microcomputer and controls a control target included in the substrate processing apparatus 1 according to a predetermined control program.

[0190] Specifically, the controller 3 includes a processor 3A (CPU) and a memory 3B storing a control program. The controller 3 is configured such that the processor 3A executes the control program to perform various controls for substrate processing.

[0191] In particular, the controller 3 is programmed to control the first transport robot IR, the second transport robot CR, the rotation drive mechanism 23, the first nozzle moving mechanism 35, the second nozzle moving mechanism 36, the upstream gate drive mechanism 67, the downstream gate drive mechanism 68, the sliding drive mechanism 92, the common valve 50, the drug liquid valve 51, the flushing liquid valve 52, the organic solvent valve 53, etc.

[0192] By controlling the valves via the controller 3, the start and stop of fluid ejection from the corresponding nozzles and the fluid ejection flow rate from the corresponding nozzles are controlled. By controlling the upstream gate drive mechanism 67 via the controller 3, the opening and closing of the upstream gate 60 can be controlled. By controlling the downstream gate drive mechanism 68 via the controller 3, the opening and closing of the downstream gate 61 can be controlled. By controlling the slide drive mechanism 92 via the controller 3, the opening and closing of the upstream slide gate 65 and the downstream slide gate 66 can be controlled.

[0193] The following steps are executed by controlling the components of the substrate processing apparatus 1 by the controller 3. In other words, the controller 3 is programmed to execute the following steps.

[0194] in addition, Figure 8 Although representative components are shown in FIG. 3 , this does not mean that components not shown are not controlled by the controller 3 . The controller 3 can appropriately control the components included in the substrate processing apparatus 1 . Figure 8 Components described in the following modifications and the second embodiment are also described, and these components are also controlled by the controller 3.

[0195] <Example of Substrate Processing>

[0196] Figure 9 This is a flowchart for explaining an example of substrate processing performed by the substrate processing apparatus 1 . Figure 9 , the processing realized by the controller 3 executing the program is mainly shown.

[0197] In the substrate processing performed by the substrate processing apparatus 1, for example, Figure 9 As shown, the substrate carrying-in process (step S1), the chemical solution supplying process (step S2), the rinsing liquid supplying process (step S3), the organic solvent supplying process (step S4), the spin drying process (step S5) and the substrate carrying-out process (step S6) are performed in sequence. Figure 2 、 Figure 3 as well as Figure 9 The details of substrate processing will be described.

[0198] First, an unprocessed substrate W is carried by the second transfer robot CR (see Figure 1A ) into the processing unit 2 and transferred to the spin chuck 13 (substrate loading process: step S1). The substrate W is then held horizontally by the spin chuck 13 (substrate holding process). With the substrate W held by the spin chuck 13, the rotation drive mechanism 23 begins rotating the substrate W (substrate rotation process). The substrate W remains held by the spin chuck 13 until the spin drying process (step S5) is completed.

[0199] After the second transfer robot CR retreats outside the processing unit 2, a chemical liquid supply process is performed to supply a chemical liquid to the upper surface of the substrate W (step S2). Specifically, the first nozzle moving mechanism 35 moves the first movable nozzle 31 so that the first movable nozzle 31 faces the upper surface of the substrate W. By opening the common valve 50 and the chemical liquid valve 51 in this state, a continuous flow of chemical liquid is ejected (supplied) from the first movable nozzle 31 toward the upper surface of the substrate W (chemical liquid ejection process, chemical liquid supply process). Thus, the upper surface of the substrate W is treated with the chemical liquid.

[0200] After the chemical liquid supply process (step S2), a rinsing liquid supply process (step S3) is performed to supply a rinsing liquid to the upper surface of the substrate W. Specifically, while maintaining the first movable nozzle 31 opposite to the upper surface of the substrate W and the common valve 50 open, the chemical liquid valve 51 is closed and the rinsing liquid valve 52 is opened. As a result, the ejection of chemical liquid from the first movable nozzle 31 is stopped. In addition, a continuous flow of rinsing liquid is ejected (supplied) from the first movable nozzle 31 toward the upper surface of the substrate W (rinsing liquid ejection process, rinsing liquid supply process). As a result, the chemical liquid on the upper surface of the substrate W is discharged to the outside of the substrate W together with the rinsing liquid, thereby cleaning the upper surface of the substrate W.

[0201] After the rinsing liquid supply process (step S3), an organic solvent supply process (step S4) is performed to supply an organic solvent to the upper surface of the substrate W. Specifically, the discharge of the rinsing liquid from the first movable nozzle 31 is stopped, and the first movable nozzle 31 is retracted. Then, the second nozzle moving mechanism 36 positions the second movable nozzle 32 opposite the upper surface of the substrate W, and the organic solvent valve 53 is opened. As a result, a continuous flow of organic solvent is ejected (supplied) from the second movable nozzle 32 toward the upper surface of the substrate W (organic solvent discharge process, organic solvent supply process). As a result, the rinsing liquid on the upper surface of the substrate W is replaced with the organic solvent.

[0202] The organic solvent used in substrate processing preferably has a higher volatility than the rinsing liquid. This allows the substrate W to be efficiently dried during the subsequent spin drying process by replacing the rinsing liquid with the organic solvent. The organic solvent used in substrate processing preferably has a lower surface tension than the rinsing liquid. This reduces the surface tension acting on the concave-convex pattern during drying of the substrate W, thereby preventing the pattern from collapsing.

[0203] Next, a spin drying process is performed (step S5 ) in which the substrate W is rotated at high speed to dry the upper surface of the substrate W. Specifically, the organic solvent valve 53 is closed to stop supplying the organic solvent to the upper surface of the substrate W.

[0204] The rotation drive mechanism 23 then accelerates the substrate W to rotate at a high speed (eg, 1500 rpm). This exerts a strong centrifugal force on the processing liquid (mainly an organic solvent) adhering to the substrate W, causing the processing liquid to be thrown around the substrate W.

[0205] After the spin drying step (step S5), the rotation drive mechanism 23 stops the rotation of the substrate W. Then, the second transfer robot CR enters the processing unit 2, receives the processed substrate W from the spin chuck 13, and unloads it out of the processing unit 2 (substrate unloading step: step S6).

[0206] The substrate W is transferred from the second transfer robot CR to the first transfer robot IR and stored on a carrier C by the first transfer robot IR. After the processed substrate W is unloaded from the processing unit 2, the second transfer robot CR loads the next unprocessed substrate W into the processing unit 2 and starts processing the substrate W.

[0207] <Status of the discharge unit during substrate processing>

[0208] Next, the state of the discharge unit 5 during substrate processing will be described. Figure 10 It is a timing chart for explaining the state of the discharge unit 5 when substrate processing is performed. Figure 11A and Figure 11B It is a schematic diagram for explaining the state of the discharge unit 5 when substrate processing is performed.

[0209] like Figure 10 As shown, during the execution of the chemical liquid supply process (step S2) and the rinse liquid supply process (step S3), the first upstream gate 60A and the first downstream gate 61A are open, and the first upstream sliding gate 65A and the first downstream sliding gate 66A are closed. On the other hand, the second upstream gate 60B and the second downstream gate 61B are closed, and the second upstream sliding gate 65B and the second downstream sliding gate 66B are open.

[0210] Therefore, if Figure 11A As shown, the chemical liquid atmosphere from the chamber 4 flows into the first branch pipe 12A via the main pipe 11. The atmosphere flowing into the first branch pipe 12A is discharged from the first branch pipe 12A to the first exhaust pipe 10A.

[0211] The ambient air (external air) surrounding second branch pipe 12B flows into the upstream space 63 of second branch pipe 12B through upstream opening 63a. This increases the pressure in upstream space 63 of second branch pipe 12B, suppressing the flow of the chemical liquid ambient air into second branch pipe 12B (strictly speaking, into second internal space 62B). This prevents the chemical liquid ambient air from mixing with the ambient air discharged from second branch pipe 12B.

[0212] On the other hand, the ambient air (external air) surrounding the second branch pipe 12B flows into the downstream space 64 of the second branch pipe 12B through the downstream opening 64a. Therefore, even when the flow of the chemical liquid ambient air from the main pipe 11 into the second branch pipe 12B is suppressed, the flow rate of the ambient air discharged into the second exhaust pipe 10B can be sufficiently increased.

[0213] The state in which the first branch pipe 12A discharges the atmosphere from the main pipe 11 and the second branch pipe 12B discharges the external atmosphere is referred to as the "chemical liquid atmosphere discharge state." Figure 10 In the example shown, the chemical liquid atmosphere is continuously exhausted from the start of the substrate loading process (step S1) to the end of the rinse liquid supply process (step S3) (eg, until the discharge of the rinse liquid is stopped).

[0214] like Figure 10 As shown, after the rinse liquid supply process (step S3), when the organic solvent supply process (step S4) is started, the first upstream gate 60A and the first downstream gate 61A are closed, and the first upstream sliding gate 65A and the first downstream sliding gate 66A are opened. On the other hand, the second upstream gate 60B and the second downstream gate 61B are opened, and the second upstream sliding gate 65B and the second downstream sliding gate 66B are closed.

[0215] Therefore, if Figure 11B As shown, the organic solvent atmosphere from the chamber 4 flows into the second branch pipe 12B via the main pipe 11. The organic solvent atmosphere flowing into the second branch pipe 12B is discharged from the second branch pipe 12B to the second exhaust pipe 10B.

[0216] The ambient air surrounding the first branch pipe 12A flows into the upstream space 63 of the first branch pipe 12A through the upstream opening 63a. This increases the pressure in the upstream space 63 of the first branch pipe 12A, thereby suppressing the flow of the organic solvent ambient air into the first branch pipe 12A (strictly speaking, into the first internal space 62A). Consequently, the organic solvent ambient air is prevented from mixing with the ambient air discharged from the first branch pipe 12A.

[0217] On the other hand, the ambient air (external air) surrounding the first branch pipe 12A flows into the downstream space 64 of the first branch pipe 12A through the downstream opening 64a. Therefore, even when the flow of the organic solvent ambient air from the main pipe 11 into the first branch pipe 12A is suppressed, the flow rate of the ambient air discharged into the first exhaust pipe 10A can be sufficiently increased.

[0218] The state in which the second branch pipe 12B discharges the atmosphere from the main pipe 11 and the first branch pipe 12A discharges the external atmosphere is referred to as "organic solvent atmosphere discharge state". Figure 10 In the example shown, the organic solvent atmosphere is continuously exhausted from the start of the organic solvent supply process (step S4 ) (eg, the start of the discharge of the organic solvent) until the start of the substrate loading process (step S1 ) for the next substrate W.

[0219] As described above, according to this embodiment, the controller 3 is programmed to switch the branch pipes 12 into which the atmospheric gas exhausted from the main pipe 11 flows, depending on the type of process liquid, by controlling the plurality of upstream gates 60, the plurality of downstream gates 61, the plurality of upstream slide gates 65, and the plurality of downstream slide gates 66. Thus, the atmospheric gas containing the appropriate type of process liquid and mist can flow into each branch pipe 12.

[0220] <Exhaust Simulation Results>

[0221] Figure 12 This table shows the results of a simulation of the exhaust state of the atmosphere when the chemical solution supply step (step S2) of substrate processing is performed.

[0222] In this simulation, the flow rate of the atmosphere in each branch pipe 12 when the ammonia atmosphere as an example of the chemical liquid atmosphere is discharged from the first branch pipe 12A is calculated. The total flow rate of the ammonia atmosphere flowing in the main pipe 11 is 3m 3 / min. Figure 12 The embodiment in FIG. 1 shows an example in which a simulation was performed using the above-mentioned discharge unit 5 . Figure 12 The reference example in FIG. 1 shows an example in which a simulation was performed using the discharge unit 5 in which the downstream gate plate 61 and the closing structure 86 were removed.

[0223] In both the reference example and the working example, the majority of the ammonia ambient gas flowed into the first branch pipe 12A. However, in the reference example, a portion of the ammonia ambient gas (equivalent to 7.43% of the total ammonia ambient gas) flowed into the second branch pipe 12B, whereas in the working example, the ammonia ambient gas did not flow into the second branch pipe 12B.

[0224] Specifically, the following results were obtained: the flow rate of the ambient gas after passing through the second upstream gate plate 60B was -0.293 m 3 / min, the ratio of the atmosphere flowing into the second branch pipe 12B to the total ammonia atmosphere was -9.77%. In other words, no airflow from the main pipe 11 to the second branch pipe 12B was generated, but airflow from the second branch pipe 12B to the main pipe 11 was generated.

[0225] Therefore, by providing the closing structure 86 and the second downstream gate plate 61B, the pressure in the upstream space 63 is increased, thereby preventing the ammonia atmosphere from flowing into the second branch pipe 12B.

[0226] <Substrate Processing of Modification Example>

[0227] Figure 13A and Figure 13B1 is a timing chart for explaining substrate processing according to a modified example. In the substrate processing according to the modified example, the shutters are opened and closed while gradually changing their opening degrees.

[0228] exist Figure 13A In the substrate processing of the modified example shown, before stopping the supply of the rinsing liquid (during the execution of the rinsing liquid supply process (step S3)), the action of opening the second upstream sliding gate 65B and the second downstream sliding gate 66B and the action of closing the second upstream gate 60B and the second downstream gate 61B are started.

[0229] Specifically, the second upstream gate 60B and the second downstream gate 61B are first opened. This slowly opens the second branch pipe 12B. Before the second upstream gate 60B and the second downstream gate 61B are fully opened, the second upstream sliding gate 65B and the second downstream sliding gate 66B are closed. This slowly closes the upstream opening 63a and the downstream opening 64a of the second branch pipe 12B. When the upstream opening 63a and the downstream opening 64a are fully closed, the supply of rinse liquid to the substrate W is stopped, and the organic solvent supply process begins (step S4).

[0230] exist Figure 13B In the substrate processing of the modified example shown, before the supply of the chemical solution is started (during the substrate unloading process (step S7) on the previous substrate W), the action of closing the second upstream gate 60B and the second downstream gate 61B and opening the second upstream sliding gate 65B and the second downstream sliding gate 66B is started.

[0231] Specifically, the second upstream sliding shutter 65B and the second downstream sliding shutter 66B begin to open. This gradually opens the upstream opening 63a and the downstream opening 64a of the second branch pipe 12B. Before the second upstream sliding shutter 65B and the second downstream sliding shutter 66B are fully open, the second upstream shutter 60B and the second downstream shutter 61B begin to close. This gradually closes the second branch pipe 12B. After the second branch pipe 12B is fully open, the substrate W is loaded into the processing unit 2, and the supply of chemical solution to the upper surface of the substrate W begins.

[0232] Although not shown, the same operation can be performed in the first branch pipe 12A. During the rinse liquid supply process (step S3), the first upstream sliding shutter 65A and the first downstream sliding shutter 66A begin to open before the first upstream shutter 60A and the first downstream shutter 61A begin to close. During the substrate unloading process (step S7), the first upstream shutter 60A and the first downstream sliding shutter 61A begin to open before the first upstream sliding shutter 65A and the first downstream sliding shutter 66A begin to close.

[0233] Thus, in the substrate processing of the modified example, in each branch pipe 12 , the external atmosphere starts to flow into the upstream space 63 and the downstream space 64 before the branch pipe 12 is closed by the upstream shutter 60 and the downstream shutter 61 .

[0234] This prevents the upstream gate 60, the downstream gate 61, the upstream sliding gate 65, and the downstream sliding gate 66 from being closed. This prevents the flow of ambient gas into the downstream space 64 from being significantly reduced due to the closure of the upstream gate 60, the downstream gate 61, the upstream sliding gate 65, and the downstream sliding gate 66.

[0235] Similarly, by opening the branch pipe 12 with the upstream damper 60 and the downstream damper 61 before stopping the flow of external ambient air into the upstream space 63 and the downstream space 64 , it is possible to suppress a significant decrease in the flow of ambient air into the downstream space 64 .

[0236] Furthermore, as described in this modification, by gradually changing the opening degree of each gate plate, it is possible to suppress a sudden change in the flow rate of the atmosphere gas flowing into the downstream space 64 .

[0237] And, as Figure 13A As shown by the double dotted lines, even when the opening degree of each gate plate is changed drastically, the upstream gate plate 60 and the downstream gate plate 61 open the branch pipe 12 before stopping the flow of external ambient gas into the upstream space 63 and the downstream space 64, thereby significantly reducing the flow of ambient gas into the downstream space 64.

[0238] Likewise, Figure 13B As shown by the double-dotted lines, even when the opening of each gate plate is changed drastically, as long as the external ambient gas starts to flow into the upstream space 63 and the downstream space 64 before the upstream gate plate 60 and the downstream gate plate 61 are closed, the flow of ambient gas into the downstream space 64 can be significantly reduced.

[0239] <Discharge Unit of Modification>

[0240] Next, refer to Figures 14 to 17BThe discharge units 5 according to the first to fourth modified examples will be described.

[0241] Figure 14 It is a schematic diagram for explaining the discharge unit 5 according to the first modification.

[0242] The discharge unit 5 of the first modified example further includes a plurality of upstream opening and closing speed adjustment mechanisms 93 for adjusting the opening and closing speeds of the plurality of upstream shutters 60 , and a plurality of downstream opening and closing speed adjustment mechanisms 94 for adjusting the opening and closing speeds of the plurality of downstream shutters 61 .

[0243] If the upstream shutter drive mechanism 67 includes an air cylinder, the upstream opening and closing speed adjustment mechanism 93 comprises an air pressure-controlled adjustment mechanism that adjusts the cylinder's operating speed by controlling the amount of air supplied to the cylinder. If the upstream shutter drive mechanism 67 includes an electric motor, the upstream opening and closing speed adjustment mechanism 93 comprises a voltage-controlled adjustment mechanism that performs feedback control on the electric motor's rotational speed. The downstream opening and closing speed adjustment mechanism 94, like the upstream opening and closing speed adjustment mechanism 93, comprises an air pressure-controlled adjustment mechanism or a voltage-controlled adjustment mechanism.

[0244] The exhaust unit 5 of the first modified example further includes a flow rate adjustment mechanism 95 that controls the opening and closing of the upstream sliding shutter 65 and the downstream sliding shutter 66 to adjust the flow rate of the atmosphere flowing into the upstream space 63 and the downstream space 64 .

[0245] If the slide drive mechanism 92 includes an air cylinder, the flow rate adjustment mechanism 95 includes an air pressure control type adjustment mechanism that adjusts the cylinder's operating speed by controlling the amount of air supplied to the cylinder. If the slide drive mechanism 92 includes an electric motor, the flow rate adjustment mechanism 95 includes a voltage control type adjustment mechanism that performs feedback control on the rotational speed of the electric motor.

[0246] The flow rate adjustment mechanism 95 is an example of a downstream flow rate adjustment mechanism that adjusts the flow rate of the atmosphere gas flowing into the downstream space 64 , and is also an example of an upstream flow rate adjustment mechanism that adjusts the flow rate of the atmosphere gas flowing into the upstream space 63 .

[0247] By adjusting the opening and closing speed of the upstream gate 60 and the downstream gate 61, the flow rate of the ambient gas flowing from the main pipe 11 to the branch pipe 12 can be gradually changed. Then, by adjusting the flow rate of the external ambient gas flowing into the downstream space 64, the flow rate of the ambient gas discharged from the branch pipe 12 can be gradually changed. In this way, it is possible to suppress the rapid change of the discharge amount of the ambient gas from the branch pipe 12. Figure 14 In the case of the discharge unit 5 of the first modified example shown in FIG. 13 , the substrate processing of the modified example shown in FIG. 13 can be easily realized.

[0248] Figure 15 It is a schematic diagram for explaining the discharge unit 5 according to the second modification.

[0249] The discharge unit 5 of the second modified example includes a main pipe pressure gauge 96 for measuring the pressure in the main pipe 11 and a plurality of branch pipe pressure gauges 97 for respectively measuring the pressure in the upstream space 63 in the plurality of branch pipes 12 .

[0250] By measuring the pressure in the main pipe 11 with the main pipe pressure gauge 96, it is possible to detect whether the atmosphere from the chamber 4 is being exhausted normally. In other words, exhaust abnormality (exhaust abnormality) in the main pipe 11 can be detected.

[0251] If the pressure of the upstream space 63 required to suppress the flow of ambient gas from the main distribution pipe 11 to the upstream space 63 is prepared and mastered in advance, it is possible to detect whether the upstream opening 63a is properly opened by measuring the pressure of the upstream space 63 of the branch pipe 12 with the branch pipe pressure gauge 97.

[0252] Figure 16A It is a schematic diagram for explaining the discharge unit 5 according to the third modification. Figure 16B It is a schematic diagram for explaining the discharge unit 5 according to the third modification.

[0253] The exhaust unit 5 of the third variant also includes: an upstream protective component 98, which covers the upstream opening 63a and the upstream sliding gate 65; an air supply component 100, which is supported by the branch pipe 12 via the upstream protective component 98 and supplies gas into the branch pipe 12 via the upstream opening 63a; and a downstream protective component 99, which covers the downstream opening 64a and the downstream sliding gate 66.

[0254] The upstream protection member 98 has a plurality of upstream through-holes 98a that allow passage of ambient gas, and the downstream protection member 99 has a plurality of downstream through-holes 99a that allow passage of ambient gas.

[0255] The air supply member 100 includes, for example, an air supply fan, but it does not need to be a fan as long as it can supply gas to the upstream space 63 through the upstream opening 63a. The exhaust unit 5 of the third modified example further includes an air supply member drive mechanism 101 that drives the air supply member 100. If the air supply member 100 is a fan, the air supply member drive mechanism 101 includes, for example, an electric motor that rotates the fan.

[0256] By sending ambient air (external ambient air) around the branch pipe 12 from the air sending member 100 to the upstream space 63 with the upstream opening 63 a opened, the pressure of the upstream space 63 can be increased quickly and sufficiently.

[0257] Figure 17A It is a schematic diagram for explaining the discharge unit 5 according to the fourth modification. Figure 17B It is a schematic diagram for explaining the discharge unit 5 according to the fourth modification.

[0258] In the discharge unit 5 of the fourth modification, Figure 4 The discharge unit 5 shown is different in that it does not have the upstream opening 63a and the upstream sliding shutter 65. Instead, the branch pipe 12 of the fourth modification has a supply hole 63b penetrating the branch pipe 12 downstream of the upstream shutter 60 and upstream of the downstream shutter 61.

[0259] The discharge unit 5 of the fourth modification further includes a supply pipe 102 connected to the branch pipe 12 downstream of the upstream gate 60 and upstream of the downstream gate 61 , and supplies gas to the branch pipe 12 through the supply hole 63 b.

[0260] The gas supplied to the branch pipe 12 via the supply pipe 102 is, for example, an inert gas such as nitrogen, air, or the like.

[0261] The discharge unit 5 of the fourth modified example further includes a supply valve 103 that is provided in the supply piping 102 and opens and closes the supply piping 102. Strictly speaking, the supply valve 103 opens and closes the supply flow path formed by the space in the supply piping 102. The supply valve 103 is an example of a supply switching component that switches the state of the upstream space 63 between a supply state in which gas is supplied to the upstream space 63 via the supply piping 102 and a supply stop state in which the supply of gas to the upstream space 63 via the supply piping 102 is stopped. By supplying gas to the upstream space 63 via the supply piping 102, the pressure in the upstream space 63 can be quickly and sufficiently increased. Furthermore, if gas is supplied to the upstream space 63 via the supply piping 102, it is easy to finely adjust the composition and flow rate of the gas supplied to the upstream space 63.

[0262] Supply pipe 102 is provided with supply device 105 such as a compressor for supplying gas to supply pipe 102. Supply device 105 may constitute a part of substrate processing apparatus 1 or may be provided in a clean room where substrate processing apparatus 1 is installed or in equipment attached to the clean room.

[0263] The gas (atmospheric gas) from the supply pipe 102 is an example of external ambient gas from a different path from the main pipe 11. Therefore, the supply valve 103 is an example of an upstream switching member.

[0264] Furthermore, “a state in which the upstream space 63 is switched between the supply state and the supply stop state” means a state in which the upstream space 63 can be switched from the supply state to the supply stop state and a state in which the upstream space 63 can be switched from the supply stop state to the supply state.

[0265] The discharge unit 5 of the fourth modified example further includes a downstream protective member 99 that covers the downstream opening 64a and the downstream sliding shutter 66. The downstream protective member 99 has a plurality of downstream through-holes 99a that allow the passage of ambient gas. The discharge unit 5 further includes a downstream sliding drive mechanism 104 that causes the downstream sliding shutter 66 to slide relative to the branch pipe 12.

[0266] <Configuration of Processing Unit of Second Embodiment>

[0267] Figure 18 It is a schematic diagram for explaining the configuration of a processing unit 2 included in a substrate processing apparatus 1A according to the second embodiment. Figure 19 It is a top view of the processing unit 2 according to the second embodiment.

[0268] The processing unit 2 of the second embodiment differs primarily from the processing unit 2 of the first embodiment in that the processing unit 2 of the second embodiment further includes a third movable nozzle 33 that selectively ejects a continuous stream of chemical liquid and a continuous stream of rinse liquid toward the upper surface of the substrate W held by the spin chuck 13. The third movable nozzle 33 is an example of a chemical liquid nozzle and an example of a rinse liquid nozzle. The third movable nozzle 33 is also an example of a processing liquid nozzle.

[0269] Examples of the chemical liquid ejected from the third moving nozzle 33 are the same as those listed as examples of the chemical liquid ejected from the first moving nozzle 31. Examples of the rinse liquid ejected from the third moving nozzle 33 are the same as those listed as examples of the rinse liquid ejected from the first moving nozzle 31.

[0270] The chemical liquid ejected from the third moving nozzle 33 may be of a different type than the chemical liquid ejected from the first moving nozzle 31. Hereinafter, an example will be described in which the chemical liquid ejected from the first moving nozzle 31 is an acidic chemical liquid such as hydrofluoric acid, and the chemical liquid ejected from the third moving nozzle 33 is an alkaline chemical liquid such as APM liquid.

[0271] The third movable nozzle 33 is moved horizontally by a third nozzle moving mechanism 37. The third nozzle moving mechanism 37 is capable of moving the third movable nozzle 33 between a central position and a retracted position. The third nozzle moving mechanism 37 has the same structure as the other nozzle moving mechanisms. Specifically, the third nozzle moving mechanism 37 includes a third arm 37a that supports the third movable nozzle 33 and a third arm moving mechanism 37b that moves the third arm 37a horizontally.

[0272] In the second embodiment, the processing unit 2 includes a first common pipe 40A, a first chemical liquid pipe 41A, a first rinse liquid pipe 42A, a first common valve 50A, and a first rinse liquid valve 52A. The structures of the first common pipe 40A, the first chemical liquid pipe 41A, the first rinse liquid pipe 42A, the first common valve 50A, and the first rinse liquid valve 52A are similar to those of the first common pipe 40A, the first chemical liquid pipe 41A, the first rinse liquid pipe 42A, the first common valve 50A, and the first rinse liquid valve 52A. Figure 2 The common pipe 40 , the chemical liquid pipe 41 , the rinse liquid pipe 42 , the common valve 50 , the chemical liquid valve 51 , and the rinse liquid valve 52 of the first embodiment shown have the same configuration.

[0273] The third movable nozzle 33 is connected to a second common pipe 40B that guides a fluid to the third movable nozzle 33. A second chemical liquid pipe 41B that supplies a chemical liquid to the second common pipe 40B and a second rinse liquid pipe 42B that supplies a rinse liquid to the second common pipe 40B are connected to the second common pipe 40B. The second common pipe 40B may also be connected to the second chemical liquid pipe 41B and the second rinse liquid pipe 42B via a mixing valve (not shown).

[0274] Second common pipe 40B is provided with second common valve 50B for opening and closing second common pipe 40B. Second chemical liquid pipe 41B is provided with second chemical liquid valve 51B for opening and closing second chemical liquid pipe 41B. Second rinse liquid pipe 42B is provided with second rinse liquid valve 52B for opening and closing second rinse liquid pipe 42B.

[0275] <Structure of Discharge Unit of Second Embodiment>

[0276] Figure 20 This is a schematic diagram for explaining the structure of the discharge unit 5 included in the substrate processing apparatus 1A according to the second embodiment. The discharge unit 5 of the second embodiment is different from the discharge unit 5 of the first embodiment (see FIG. Figure 4 ) is that the discharge unit 5 in the second embodiment is provided with three branch pipes 12.

[0277] That is, the discharge unit 5 of the second embodiment includes a third branch pipe 12C in addition to the first branch pipe 12A and the second branch pipe 12B. The third branch pipe 12C has the same structure as the first branch pipe 12A.

[0278] Specifically, the third branch pipe 12C has an upstream end connected to the downstream end 11b of the main pipe 11 and a downstream end connected to the corresponding exhaust pipe 10. The third branch pipe 12C has an internal space 62 through which ambient gas from the main pipe 11 can flow. The internal space 62 of the third branch pipe 12C is sometimes referred to as the third internal space 62C, and the exhaust pipe 10 connected to the third branch pipe 12C is sometimes referred to as the third exhaust pipe 10C.

[0279] The third branch pipe 12C is provided with an upstream gate plate 60, a downstream gate plate 61, an upstream sliding gate plate 65, and a downstream sliding gate plate 66, similar to the other branch pipes 12. The upstream gate plate 60, the downstream gate plate 61, the upstream sliding gate plate 65, and the downstream sliding gate plate 66 provided in the third branch pipe 12C are also referred to as a third upstream gate plate 60C, a third downstream gate plate 61C, a third upstream sliding gate plate 65C, and a third downstream sliding gate plate 66C, respectively.

[0280] <Example of Substrate Processing in Second Embodiment>

[0281] Figure 21 This is a flowchart for explaining an example of substrate processing performed by the substrate processing apparatus 1A according to the second embodiment. Figure 21 The main figure shows that the controller 3 (refer to Figure 8 )Processing achieved by executing a program.

[0282] In the substrate processing performed by the substrate processing apparatus 1A of the second embodiment, for example, Figure 21 As shown, the substrate carrying-in process (step S1), the first chemical liquid supplying process (step S10), the first rinsing liquid supplying process (step S11), the second chemical liquid supplying process (step S12), the second rinsing liquid supplying process (step S13), the organic solvent supplying process (step S4), the spin drying process (step S5) and the substrate carrying-out process (step S6) are performed in sequence.

[0283] The following, with Figure 9 The following description will focus on the differences in substrate processing from the first embodiment shown.

[0284] In the substrate processing of the second embodiment, after the second transfer robot CR retreats outside the processing unit 2, a first chemical liquid supply process (step S10) is performed to supply an acidic chemical liquid such as hydrofluoric acid to the upper surface of the substrate W. Specifically, the first nozzle moving mechanism 35 moves the first movable nozzle 31 so that the first movable nozzle 31 faces the upper surface of the substrate W. By opening the first common valve 50A and the first chemical liquid valve 51A in this state, a continuous flow of an acidic chemical liquid such as hydrofluoric acid is ejected (supplied) from the first movable nozzle 31 toward the upper surface of the substrate W (first chemical liquid ejection process, first chemical liquid supply process). Thus, the upper surface of the substrate W is treated with the acidic chemical liquid.

[0285] After the first chemical liquid supply process (step S10), a first rinse liquid supply process (step S11) is performed to supply a rinse liquid to the upper surface of the substrate W. Specifically, while maintaining the first movable nozzle 31 opposite to the upper surface of the substrate W and the common valve 50 open, the first chemical liquid valve 51A is closed and the first rinse liquid valve 52A is opened. As a result, the spraying of the acidic chemical liquid from the first movable nozzle 31 is stopped. In addition, a continuous flow of rinse liquid is sprayed (supplied) from the first movable nozzle 31 toward the upper surface of the substrate W (first rinse liquid spraying process, first rinse liquid supply process). As a result, the acidic chemical liquid on the upper surface of the substrate W is discharged to the outside of the substrate W together with the rinse liquid, thereby cleaning the upper surface of the substrate W.

[0286] After the first rinsing liquid supply process (step S11), a second liquid supply process (step S12) is performed to supply an alkaline liquid such as an APM liquid to the upper surface of the substrate W. Specifically, the spraying of the rinsing liquid from the first movable nozzle 31 is stopped, and the first movable nozzle 31 is retracted. Then, the third movable nozzle 33 is moved by the third nozzle moving mechanism 37 so that the third movable nozzle 33 is opposite to the upper surface of the substrate W. By opening the second common valve 50B and the second liquid valve 51B in this state, a continuous flow of alkaline liquid is sprayed (supplied) from the third movable nozzle 33 toward the upper surface of the substrate W (second liquid spraying process, second liquid supply process). In this way, the upper surface of the substrate W is treated with the alkaline liquid.

[0287] After the second chemical liquid supply process (step S12), a second rinsing liquid supply process (step S13) is performed to supply a rinsing liquid to the upper surface of the substrate W. Specifically, while maintaining the third movable nozzle 33 opposite to the upper surface of the substrate W and the second common valve 50B open, the second chemical liquid valve 51B is closed and the second rinsing liquid valve 52B is opened. As a result, the discharge of the alkaline chemical liquid from the third movable nozzle 33 is stopped. In addition, a continuous flow of rinsing liquid is sprayed (supplied) from the third movable nozzle 33 toward the upper surface of the substrate W (second rinsing liquid spraying process, second rinsing liquid supply process). As a result, the alkaline chemical liquid on the upper surface of the substrate W is discharged to the outside of the substrate W together with the rinsing liquid, thereby cleaning the upper surface of the substrate W.

[0288] After the second rinse liquid supplying step (step S13 ), an organic solvent supplying step (step S4 ), a spin drying step (step S5 ), and a substrate unloading step (step S6 ) are performed.

[0289] <Situation of the Discharge Unit During Substrate Processing in the Second Embodiment>

[0290] Next, the state of the discharge unit 5 during substrate processing according to the second embodiment will be described. Figures 22A to 22C It is a schematic diagram for explaining the state of the discharge unit 5 when substrate processing is performed.

[0291] During the execution of the first chemical solution supply process (step S10) and the first rinse solution supply process (step S11), Figure 22A As shown, the first upstream gate 60A and the first downstream gate 61A are open, and the first upstream sliding gate 65A and the first downstream sliding gate 66A are closed. On the other hand, the second upstream gate 60B, the second downstream gate 61B, the third upstream gate 60C, and the third downstream gate 61C are closed, and the second upstream sliding gate 65B, the second downstream sliding gate 66B, the third upstream sliding gate 65C, and the third downstream sliding gate 66C are open.

[0292] Therefore, the acidic atmosphere from chamber 4 flows into first branch pipe 12A via main pipe 11. The acidic atmosphere flowing into first branch pipe 12A is then discharged from first branch pipe 12A into first exhaust pipe 10A. Meanwhile, external ambient air flows into upstream space 63 and downstream space 64 of second branch pipe 12B. Similarly, external ambient air flows into upstream space 63 and downstream space 64 of third branch pipe 12C. This prevents abrupt changes in the amount of ambient air discharged from second and third branch pipes 12B, 12C, and prevents the acidic atmosphere from mixing with the ambient air discharged from second and third branch pipes 12B, 12C.

[0293] After the first rinse liquid supply process (step S11), when the second chemical liquid supply process (step S12) is started, Figure 22B As shown, the first upstream gate 60A and the first downstream gate 61A are closed, while the first upstream sliding gate 65A and the first downstream sliding gate 66A are open. On the other hand, the third upstream gate 60C and the third downstream gate 61C are open, while the third upstream sliding gate 65C and the third downstream sliding gate 66C are closed. The second upstream gate 60B and the second upstream gate 60B remain closed, while the second upstream sliding gate 65B and the second downstream sliding gate 66B remain open.

[0294] Therefore, the alkaline ambient gas from the chamber 4 flows into the third branch pipe 12C via the main pipe 11. The alkaline ambient gas flowing into the third branch pipe 12C is discharged from the third branch pipe 12C to the third exhaust pipe 10C. Meanwhile, the external ambient gas flows into the upstream space 63 and downstream space 64 of the first branch pipe 12A. Similarly, the external ambient gas also flows into the upstream space 63 and downstream space 64 of the second branch pipe 12B. Therefore, it is possible to suppress abrupt changes in the amount of ambient gas discharged from the first branch pipe 12A and the second branch pipe 12B, and it is possible to suppress the mixing of the alkaline ambient gas into the ambient gas discharged from the first branch pipe 12A and the second branch pipe 12B.

[0295] After the second rinse liquid supply process (step S13), when the organic solvent supply process (step S4) is started, Figure 22C As shown, the third upstream gate 60C and the third downstream gate 61C are closed, while the third upstream sliding gate 65C and the third downstream sliding gate 66C are open. On the other hand, the second upstream gate 60B and the second downstream gate 61B are open, while the second upstream sliding gate 65B and the second downstream sliding gate 66B are closed. The first upstream gate 60A and the first upstream gate 60A remain closed, while the first upstream sliding gate 65A and the first downstream sliding gate 66A remain open.

[0296] Therefore, the organic solvent ambient gas from the chamber 4 flows into the second branch pipe 12B via the main pipe 11. The organic solvent ambient gas flowing into the second branch pipe 12B is discharged from the second branch pipe 12B to the second exhaust pipe 10B. On the other hand, the external ambient gas flows into the upstream space 63 and the downstream space 64 of the first branch pipe 12A. Similarly, the external ambient gas also flows into the upstream space 63 and the downstream space 64 of the third branch pipe 12C. Therefore, the discharge amount of the ambient gas from the first branch pipe 12A and the third branch pipe 12C can be maintained, and the mixing of the organic solvent ambient gas into the ambient gas discharged from the first branch pipe 12A and the third branch pipe 12C can be suppressed.

[0297] According to the second embodiment, the same effects as those of the first embodiment are achieved.

[0298] In the substrate processing of the substrate processing apparatus 1A of the second embodiment, it is also possible to Figure 21 The substrate processing shown in FIG. 1 is different from that shown in FIG. 1 , in which an alkaline chemical solution is supplied to the upper surface of the substrate W in the first chemical solution supplying step, and in which an acidic chemical solution is supplied to the upper surface of the substrate W in the second chemical solution supplying step. Figure 13A and Figure 13B Substrate processing according to a modified example is shown.

[0299] In the second embodiment, the modified example ( Figures 14 to 17B , (see the variation shown).

[0300] <Other embodiments>

[0301] The present invention is not limited to the above-described embodiment, and can be implemented in other forms.

[0302] In the above-mentioned embodiments, examples in which two or three branch pipes 12 are provided have been described. However, the number of branch pipes 12 may be four or more.

[0303] Unlike the above embodiments, a butterfly valve may be used as the upstream switching member. For example, as in the discharge unit 5 of the third modification, a supply pipe 102 may be provided, and a butterfly valve may be provided in the supply pipe 102 as the upstream switching member.

[0304] Furthermore, unlike the above-mentioned embodiment, a downstream air supply component (not shown) may be provided to supply external ambient air to the downstream space 64 via the downstream opening 64a. Furthermore, unlike the above-mentioned embodiments, the downstream opening 64a may not be provided, and a supply pipe (downstream supply pipe) connected to the branch pipe 12 may be provided at a position downstream of the downstream gate 61. In this case, for example, a downstream supply valve (not shown) is provided as a downstream switching component, and the downstream supply valve switches the state of the downstream space 64 between a state of supplying gas to the downstream space 64 via the downstream supply pipe and a state of stopping the supply of gas to the downstream space 64 via the downstream supply pipe. In the case of providing a downstream supply pipe, a butterfly valve can also be used as the downstream switching component.

[0305] In each of the above-described embodiments, the upstream end 11a of the main pipe 11 is connected to the outer wall member 27 of the processing cup 8. The structure of the main pipe 11 may be any structure as long as it connects the chamber 4 to the plurality of branch pipes 12. For example, the upstream end 11a of the main pipe 11 may be connected to the shield 25 or the cup 26.

[0306] Alternatively, the upstream end 11a of the main pipe 11 may be connected to the side wall 7c of the chamber 4. In this case, the main pipe 11 is composed of an upstream main pipe connected to the side wall 7c of the chamber 4 and located outside the chamber 4 (fluid tank 6), and a downstream main pipe connected to the upstream main pipe and located below the lower wall 7a of the frame 7.

[0307] Instead of the upstream sliding gate 65, a gate that opens and closes the upstream opening 63a by a motion other than sliding may be used as the upstream opening and closing gate. For example, a gate that moves toward or away from the outer surface of the branch pipe 12 may be provided as the upstream opening and closing gate. Furthermore, a rotating gate that opens and closes the upstream opening 63a by rotating about a rotation axis fixed to the branch pipe 12 may be provided as the upstream opening and closing gate.

[0308] Likewise, instead of the downstream sliding shutter 66 , a shutter that opens and closes the downstream opening 64 a by an action other than sliding may be used as the downstream opening and closing shutter.

[0309] The gates provided in the plurality of branch pipes 12 do not need to have the same structure. For example, the structure of the gates corresponding to the first branch pipe 12A may be Figure 4 The structure shown in FIG. 1 is that the structure of each gate plate corresponding to the second branch pipe 12B is Figure 16A and Figure 16B Furthermore, the structure of each gate plate corresponding to the first branch pipe 12A may be Figure 4 The structure shown in FIG. 1 is that the structure of each gate plate corresponding to the second branch pipe 12B is Figure 17A and Figure 17B That is, in each branch pipe 12, the above-mentioned gate plate structures can be freely combined.

[0310] Located in Figure 14 The upstream opening and closing speed adjustment mechanism 93, downstream opening and closing speed adjustment mechanism 94, and flow rate adjustment mechanism 95 of the discharge unit 5 of the first modified example shown can be provided regardless of the type of gate. For example, the flow rate adjustment mechanism 95 is not limited to controlling the opening and closing of the upstream sliding gate 65 and the downstream sliding gate 66; it can also control the opening and closing of gates other than the sliding gates. In other words, the flow rate adjustment mechanism 95 only needs to control the switching of the upstream switching member and the downstream switching member.

[0311] and, Figure 7 The sliding drive mechanism 92 shown drives the connecting member 91 to slide the upstream sliding gate plate 65 and the downstream sliding gate plate 66 relative to the branch pipe 12. However, instead of providing the connecting member 91, a drive mechanism for sliding the upstream sliding gate plate 65 and the downstream sliding gate plate 66 relative to the branch pipe 12 may be provided.

[0312] In the first embodiment, unlike the downstream gate plate 61 , the upstream gate plate 60 is not provided with the closing structure 86 . However, a closing structure 86 that closes the space between the upstream inner peripheral surface 70 a and the upstream valve element 71 may be provided.

[0313] The first upstream gate plate 60A and the second upstream gate plate 60B are exposed to the chemical atmosphere when the chemical atmosphere is exhausted. Consequently, there is a risk of chemical crystals adhering to the upstream gate plates 60. Therefore, if the upstream gate plates 60 are provided with a sealing structure 86, there is a concern that chemical crystals could hinder the rotation of the upstream valve element 71. Therefore, it is preferable not to provide the upstream gate plates 60 with a sealing structure 86.

[0314] In each of the above-mentioned embodiments, the downstream gate plate 61 is provided with the closing structure 86 . However, in each of the above-mentioned embodiments, the closing structure 86 may not be provided.

[0315] The first upstream gate plate 60A and the second upstream gate plate 60B are exposed to the chemical liquid atmosphere when the chemical liquid atmosphere flows into the main pipe 11, and are exposed to the organic solvent atmosphere when the organic solvent atmosphere flows into the main pipe 11. Therefore, the first downstream gate plate 61A and the second downstream gate plate 61B are exposed to the chemical liquid atmosphere and the organic solvent atmosphere for a shorter period of time than the first upstream gate plate 60A and the second upstream gate plate 60B.

[0316] Therefore, it is difficult for crystals of the chemical solution to adhere to the first downstream gate plate 61A and the second downstream gate plate 61B. Furthermore, even when the sealing structure 86 is provided, it is possible to prevent the adhesion of chemical solution crystals from hindering the rotation of the downstream valve element 81, and the pressure in the upstream space 63 of the branch pipe 12 can be quickly and sufficiently increased. Therefore, it is preferable to provide the sealing structure 86 on the first downstream gate plate 61A and the second downstream gate plate 61B.

[0317] In addition, unlike the third variant, the exhaust unit 5 can also be constructed without providing the air supply component 100, but instead including: an upstream protection component 98, which covers the upstream opening 63a and the upstream sliding gate 65; and a downstream protection component 99, which is supported by the branch pipe 12 via the upstream protection component 98 and covers the downstream opening 64a and the downstream sliding gate 66.

[0318] In each of the above-described embodiments, the spin chuck 13 is a gripping type spin chuck 13 that grips the periphery of the substrate W using a plurality of chuck pins 20. However, the spin chuck 13 is not limited to a gripping type spin chuck 13. For example, the spin chuck 13 may be a vacuum suction type spin chuck 13 that suctions the substrate W to the spin base 21.

[0319] In the above embodiments, the processing liquid is ejected from a plurality of movable nozzles. However, unlike the above embodiments, the processing liquid may be ejected from a horizontally fixed nozzle, or all the processing liquid may be ejected from a single nozzle.

[0320] In each of the above-described embodiments, the controller 3 controls the entire substrate processing apparatus 1. However, the controller 3 that controls each component of the substrate processing apparatus 1 may be distributed in a plurality of locations.

[0321] Furthermore, in the above embodiments, expressions such as “along,” “horizontally,” and “vertically” are used, but they do not need to be strictly “along,” “horizontally,” or “vertically.” In other words, each of the above expressions allows for variations in manufacturing accuracy, installation accuracy, and the like.

[0322] Furthermore, although various structures are sometimes schematically shown using blocks, the shape, size, and positional relationship of each block do not necessarily represent the shape, size, and positional relationship of each structure.

[0323] The first movable nozzle 31 is an example of a treatment liquid nozzle, a chemical liquid nozzle, and a rinse liquid nozzle. The second movable nozzle 32 is an example of a treatment liquid nozzle and an organic solvent nozzle. The third movable nozzle 33 is an example of a treatment liquid nozzle, a chemical liquid nozzle, and a rinse liquid nozzle. The upstream sliding gate 65 is an example of an upstream switching component and an upstream opening and closing gate. The downstream sliding gate 66 is an example of a downstream switching component and a downstream opening and closing gate. The flow control mechanism 95 is an example of a downstream flow control mechanism. The supply valve 103 is an example of an upstream switching component.

[0324] While the embodiments of the present invention have been described in detail, these are merely specific examples used to clarify the technical content of the present invention, and the present invention should not be construed as being limited to these specific examples. The spirit and scope of the present invention are defined solely by the claims.

Claims

1. A substrate processing device, characterized in that: include: a chamber receiving a substrate; a main pipe for discharging ambient gas from the chamber; a plurality of branch pipes connected to the main pipe, each branch pipe having an inner space for the ambient gas to flow in from the main pipe; a plurality of upstream gates, each of which is provided in each of the branch pipes, for opening and closing the corresponding branch pipe; a plurality of downstream gates, each of which is provided in each of the branch pipes at a position downstream of the upstream gate, for opening and closing the corresponding branch pipe; an upstream switching member for switching the state of the upstream space between a state in which the upstream space downstream of the upstream damper and upstream of the downstream damper in each of the internal spaces allows the inflow of external ambient gas from a path different from the main pipe and a state in which the upstream space prohibits the inflow of the external ambient gas; as well as The downstream switching member switches the state of the downstream space between a state in which the downstream space on the downstream side of the downstream gate in each of the internal spaces allows the inflow of the external ambient gas and a state in which the downstream space prohibits the inflow of the external ambient gas.

2. The substrate processing apparatus according to claim 1, wherein: The branch pipe has an upstream inner peripheral surface that is circular in cross-section at the position where the upstream gate is provided. The upstream gate plate includes an upstream valve element having a shape along the upstream inner peripheral surface and opening and closing the branch pipe by rotating in the branch pipe.

3. The substrate processing apparatus according to claim 1, wherein: The branch pipe has a circular downstream inner peripheral surface in cross-section at the position where the downstream gate is provided. The downstream gate plate includes a downstream valve element having a shape along the downstream inner peripheral surface and opening and closing the branch pipe by rotating in the branch pipe.

4. The substrate processing apparatus according to claim 3, wherein: The valve body further includes a sealing structure that seals a space between the downstream inner peripheral surface and the downstream valve body when the downstream valve body closes the branch pipe.

5. The substrate processing apparatus according to any one of claims 1 to 4, wherein: Each of the branch pipes has an upstream opening connecting the upstream space and the space around the branch pipe. The upstream switching component includes an upstream opening and closing gate for opening and closing the upstream opening.

6. The substrate processing apparatus according to claim 5, wherein: The air supply component is further included. The air supply component is arranged outside the branch pipe and supplies the ambient air around the branch pipe to the upstream space through the upstream opening.

7. The substrate processing apparatus according to any one of claims 1 to 4, wherein: It also includes a supply pipe connected to the branch pipe on the downstream side of the upstream gate and the upstream side of the downstream gate, The upstream switching member switches the state of the upstream space between a state in which gas is supplied to the upstream space via the supply pipe and a state in which the supply of gas to the upstream space via the supply pipe is stopped.

8. The substrate processing apparatus according to any one of claims 1 to 4, wherein: Each of the branch pipes has a downstream opening connecting the downstream space and the space around the branch pipe. The downstream switching component includes a downstream opening and closing gate for opening and closing the downstream opening.

9. The substrate processing apparatus according to any one of claims 1 to 4, wherein: Each of the branch pipes has an upstream opening connecting the upstream space and the space around the branch pipe and a downstream opening connecting the downstream space and the space around the branch pipe. The upstream switching member includes an upstream sliding gate that opens and closes the upstream opening by sliding relative to the branch pipe. The downstream switching member includes a downstream sliding gate that opens and closes the downstream opening by sliding relative to the branch pipe. The substrate processing device further includes: a connecting member connecting the upstream sliding gate plate and the downstream sliding gate plate; and The slide drive mechanism drives the connecting member to slide the upstream slide gate plate and the downstream slide gate plate.

10. The substrate processing apparatus according to any one of claims 1 to 4, wherein: Also includes: an upstream opening and closing speed adjustment mechanism for adjusting the opening and closing speed of the upstream gate; A downstream opening and closing speed adjustment mechanism, which adjusts the opening and closing speed of the downstream gate; and A downstream flow rate adjustment mechanism controls the switching action of the downstream switching member to adjust the flow rate of the external environment gas flowing into the downstream space.

11. The substrate processing apparatus according to any one of claims 1 to 4, wherein: Also includes: a plurality of processing liquid nozzles for spraying different types of processing liquids toward the substrate received in the chamber; and A controller is programmed to switch the branch pipe into which the ambient gas exhausted from the main pipe flows according to the type of processing liquid supplied to the substrate accommodated in the chamber by controlling the plurality of upstream gate plates, the plurality of downstream gate plates, the plurality of upstream switching components and the plurality of downstream switching components.

12. The substrate processing apparatus according to claim 11, wherein: The controller is programmed to start the flow of the external environmental gas into the upstream space by the upstream switching component and the flow of the external environmental gas into the downstream space by the downstream switching component in each of the branch pipes before the corresponding branch pipe is closed by the upstream gate and the downstream gate.

13. The substrate processing apparatus according to claim 11, wherein: The plurality of processing liquid nozzles include a chemical liquid nozzle for spraying a chemical liquid toward the substrate received in the chamber, a rinse liquid nozzle for supplying a rinse liquid toward the substrate received in the chamber, and an organic solvent nozzle for supplying an organic solvent toward the substrate received in the chamber. The plurality of branch pipes include a first branch pipe and a second branch pipe. The first branch pipe discharges the ambient gas in the main pipe during the period when the chemical liquid is sprayed from the chemical liquid nozzle and the period when the rinse liquid is sprayed from the rinse liquid nozzle. The second branch pipe discharges the ambient gas in the main pipe during the period when the organic solvent is sprayed from the organic solvent nozzle.

Images