Semiconductor process equipment and wafer transport system therefor

Abstract

The application discloses a semiconductor process equipment and a wafer transmission system thereof, and belongs to the technical field of semiconductor manufacturing equipment. The wafer transmission system comprises a mounting platform, a loading cavity, a transmission cavity and a pumping device. The mounting platform is provided with a first mounting area and an avoiding space. The first mounting area is arranged on the top surface of the mounting platform. The avoiding space is in communication with the outside and penetrates through the bottom surface of the mounting platform. In the height direction of the mounting platform, the first mounting area covers the avoiding space. The loading cavity is mounted on the first mounting area. The transmission cavity is mounted on the first mounting area. The pumping device comprises a support and a first vacuum module and a second vacuum module which are integrally mounted on the support. The first vacuum module is used for pumping the loading cavity. The second vacuum module is used for pumping the transmission cavity. The size of the pumping device matches the size of the avoiding space. The pumping device is arranged in a spaced manner with the mounting platform when it is mounted in the avoiding space. The above scheme can optimize the layout mode of the pumping device in the wafer transmission system.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor manufacturing, and in particular to a semiconductor process equipment and a wafer transfer system thereof. BACKGROUND

[0002] In many processes related to semiconductor manufacturing, wafers to be processed need to be transferred by a wafer transfer system. The wafer transfer system includes a transfer chamber (TC for short) and two load lock chambers (LL for short), and a plurality of process chambers (PM for short) and two load lock chambers are arranged along the circumference of the transfer chamber and are in communication with the transfer chamber. During the process, the transfer chamber needs to be kept in a vacuum state, while the load lock chamber needs to be switched between an atmospheric state and a vacuum state. The related art achieves the vacuum state by providing two dry pumps to pump the transfer chamber and the load lock chamber, respectively.

[0003] In actual installation, there are generally two layout modes for the two dry pumps. In one mode, both dry pumps are arranged outside the transfer system. In the other mode, at least one of the dry pumps is arranged on the transfer system. However, the first mode described above results in excessively long connecting pipelines, which leads to low pumping efficiency. In the second mode described above, the vibration of the dry pump is transmitted to the transfer system, which results in low transfer accuracy. SUMMARY

[0004] The present application discloses a semiconductor process equipment and a wafer transfer system thereof, to optimize the layout mode of the pumping device in the wafer transfer system.

[0005] To solve the above problems, the present application adopts the following technical solutions:

[0006] In a first aspect, the present application provides a wafer transfer system of a semiconductor process equipment, which comprises:

[0007] A mounting platform is provided with a first mounting area and a clearance space. The first mounting area is arranged on the top surface of the mounting platform, the clearance space is in communication with the outside and penetrates the bottom surface of the mounting platform, and in the height direction of the mounting platform, the first mounting area covers the clearance space.

[0008] A load lock chamber is mounted in the first mounting area.

[0009] A transfer chamber is mounted in the first mounting area.

[0010] The air extraction device comprises a support and a first vacuum module and a second vacuum module integratedly installed on the support, the first vacuum module is used for extracting air from the loading cavity, and the second vacuum module is used for extracting air from the transmission cavity; the air extraction device is matched in size with the avoiding space, and the air extraction device is arranged in a spaced manner with the mounting platform when it is installed in the avoiding space.

[0011] In a second aspect, the present application provides a semiconductor process equipment, comprising:

[0012] a plurality of process chambers;

[0013] The wafer transmission system of the first aspect of the present application, the plurality of process chambers and the loading cavity are arranged along the circumference of the transmission cavity and are in communication with the transmission cavity.

[0014] The technical solution adopted by the present application can achieve the following beneficial effects:

[0015] In the wafer transmission system of the semiconductor process equipment of the present application, the mounting platform is provided with an avoiding space, the avoiding space is in communication with the outside, and the air extraction device can be conveniently installed in the avoiding space, at this time, the air extraction device is equivalent to being accommodated inside the mounting platform, thereby reserving a large amount of maintenance space around the mounting platform; at the same time, in the height direction of the mounting platform, the first installation area covers the avoiding space, since the loading cavity and the transmission cavity are both installed in the first installation area, and the air extraction device is installed in the avoiding space, the distance between the air extraction device and the loading cavity and the transmission cavity is greatly reduced, thereby the connecting pipeline between them can be shortened to improve the air extraction efficiency; furthermore, the air extraction device of the present application is arranged in a spaced manner with the mounting platform when it is installed in the avoiding space, in this case, even if the air extraction device has running vibration, it is difficult to transmit the vibration to the mounting platform, thereby ensuring that the entire wafer transmission system has better transmission accuracy.

[0016] Compared with the related art, the wafer transmission system of the present application optimizes the layout of the air extraction device through the above structural improvement, thereby expanding the maintenance space, improving the air extraction efficiency and transmission accuracy. BRIEF DESCRIPTION OF DRAWINGS

[0017] The drawings described herein are used to provide further understanding of the present application, and form a part of the present application. The schematic embodiments of the present application and their descriptions are used to explain the present application, and do not constitute an improper limitation on the present application.

[0018] In the drawings:

[0019] Figure 1 The structure schematic diagram of the wafer transmission system disclosed by the embodiments of the present application;

[0020] Figure 2A front view of the air extraction device disclosed by the embodiment of the present application;

[0021] Figure 3 A structural schematic diagram of the mounting platform disclosed by the embodiment of the present application

[0022] Figure 4 And Figure 5 An assembly relationship diagram of the mounting platform and the air extraction device disclosed by the embodiment of the present application;

[0023] Figure 6 A top view of the air extraction device disclosed by the embodiment of the present application;

[0024] Figure 7 A front view of the mounting platform and the air extraction device after assembly disclosed by the embodiment of the present application;

[0025] Figure 8 An electrical schematic diagram of the air extraction device disclosed by the embodiment of the present application.

[0026] Explanation of reference signs:

[0027] 100-mounting platform, 110-first mounting area, 120-avoidance space, 130-third interface integrated panel, 140-substrate, 150-supporting column, 160-second mounting area,

[0028] 200-loading cavity, 300-transmission cavity,

[0029] 400-air extraction device, 410-first vacuum module, 411-first interface integrated panel, 412-first air extraction interface, 420-second vacuum module, 421-second interface integrated panel, 422-second air extraction interface, 430-cooling medium circulation pipe group, 431-medium input pipeline, 432-medium output pipeline, 440-medium leakage sensor, 450-accepting disc, 460-fixing assembly, 470-exhaust pipeline,

[0030] 500-process cavity, 600-front and rear end cavity, 700-loading table. DETAILED DESCRIPTION

[0031] In order to make the purpose, technical scheme and advantages of the present application clearer, the technical scheme of the present application will be described clearly and completely in combination with the specific embodiments of the present application and corresponding drawings. Obviously, the described embodiments are only some of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0032] The technical scheme disclosed by each embodiment of the present application will be described in detail below in combination with the drawings.

[0033] To solve the problems of long connection pipeline and low transmission accuracy of the gas extraction device in the related art, an embodiment of the present application provides a wafer transmission system of a semiconductor process equipment, which is used for transmitting a wafer to be processed into a process chamber for process treatment and transmitting the processed wafer out of the process chamber. The embodiment does not limit the specific application object of the wafer transmission system, for example, it can be applied to etching equipment, vapor deposition equipment, photolithography equipment, etc.

[0034] Please refer to Figures 1-8 The wafer transmission system disclosed in the embodiment of the present application includes a mounting platform 100, a loading cavity 200, a transmission cavity 300 and a gas extraction device 400.

[0035] The mounting platform 100 is a basic component of the wafer transmission system, which can provide a mounting basis for the loading cavity 200, the transmission cavity 300, etc. Specifically, the mounting platform 100 is provided with a first mounting area 110, the first mounting area 110 is arranged on the top surface of the mounting platform 100, and the loading cavity 200 and the transmission cavity 300 are both mounted on the first mounting area 110.

[0036] As shown in Figure 1 The wafer transmission system usually further includes a loading table 700 and a front and rear end chamber 600, the loading table 700 is mounted on the front and rear end chamber 600, the front and rear end chamber 600 is communicated with the loading cavity 200, the loading cavity 200 is divided into a loading A cavity (Load Lock A, LLA for short) and a loading B cavity (Load Lock B, LLB for short), the loading A cavity is used for transmitting the wafer, and the loading B cavity is used for transmitting the wafer out. The two loading cavities 200 are arranged along the circumference of the transmission cavity 300 and communicated with the transmission cavity 300, and a plurality of process chambers 500 are also communicated with the circumference of the transmission cavity 300. In the specific operation process, the wafer to be processed can be placed on the loading table 700, and transmitted to the loading A cavity through the front and rear end chamber 600 by an atmospheric mechanical hand, the loading A cavity is extracted from the atmospheric state to the vacuum state, and then the wafer to be processed is transmitted into the process chamber 500 through the transmission cavity 300 by a vacuum mechanical hand, and processed in the process chamber 500; after the process, the processed wafer is transmitted to the loading B cavity in the vacuum state by the vacuum mechanical hand, and then the loading B cavity is filled with the atmosphere, and the processed wafer can be transmitted to the loading table 700 through the front and rear end chamber 600 by the atmospheric mechanical hand. When on the loading table 700, the wafer usually needs to be placed in a Foup (Front Opening Unified Pod).

[0037] Therefore, in the specific wafer transmission process, the transmission cavity 300 needs to be in a vacuum state at all times, and the two loading cavities 200 need to be switched between an atmospheric state and a vacuum state. In the embodiment of the present application, the transmission cavity 300 and the loading cavity 200 are vacuumized by the air extraction device 400. It should be noted that the loading cavity 200 needs to be vacuumized because it has an atmospheric state by itself. The transmission cavity 300 needs to be vacuumized because the wafer surface will be left with process gas after process treatment, which will contaminate the transmission cavity 300 and the loading cavity 200. Therefore, the transmission cavity 300 also needs to be vacuumized to maintain the vacuum state of the transmission cavity 300. Of course, the wafer transmission system also includes a gas filling device for filling the loading cavity 200 with gas to switch the loading cavity 200 from a vacuum state to an atmospheric state.

[0038] As shown in Figures 3-5 In the embodiment, the mounting platform 100 is also provided with a clearance space 120, which is in communication with the outside and penetrates the bottom surface of the mounting platform 100. The size of the air extraction device 400 matches the size of the clearance space 120, and the clearance space 120 is used to accommodate the air extraction device 400. Since the clearance space 120 is in communication with the outside, the air extraction device 400 can be directly assembled into the clearance space 120 from the outside, and the clearance space 120 penetrates the bottom surface of the mounting platform 100, so that the air extraction device 400 can be directly placed on a support surface (such as the ground, a workbench, etc.), without the need for the mounting platform 100 to bear the air extraction device 400, thereby avoiding the transmission of vibration of the air extraction device 400 to the loading cavity 200 and the transmission cavity 300 through the mounting platform 100.

[0039] At the same time, the air extraction device 400 of the embodiment is configured to be arranged at a distance from the mounting platform 100 when it is installed in the clearance space 120. With such an arrangement, even if the air extraction device 400 vibrates when it is running, since it maintains a certain distance from the mounting platform 100, it can avoid contacting the mounting platform 100, so that the vibration of the air extraction device 400 is difficult to transmit to the mounting platform 100, and the transmission cavity 300 and the loading cavity 200 on the mounting platform 100 will not vibrate, thereby ensuring that the wafer transmission system maintains a relatively high transmission accuracy.

[0040] As shown in Figure 2As shown, in the embodiment, the air exhaust device 400 comprises a bracket and a first vacuum module 410 and a second vacuum module 420 which are integrally installed on the bracket, the first vacuum module 410 is used for air exhaust of the loading cavity 200, and the second vacuum module 420 is used for air exhaust of the transmission cavity 300. Among them, the bracket is the basic component of the air exhaust device 400, which provides the installation basis for the first vacuum module 410 and the second vacuum module 420. The first vacuum module 410 communicates with the loading cavity 200, and then realizes vacuum by air exhaust of the loading cavity 200. Of course, the first vacuum module 410 communicates with the loading cavity A and the loading cavity B, and it can communicate with the loading cavity A and the loading cavity B through a two-way pipe. The second vacuum module 420 communicates with the transmission cavity 300, and then realizes vacuum by air exhaust of the transmission cavity 300.

[0041] Since the first vacuum module 410 and the second vacuum module 420 are integrally installed on the bracket, they three constitute a modular assembly, which is convenient to move, disassemble and assemble, and is also beneficial to improve the structural compactness of the wafer transmission system.

[0042] In the height direction of the installation platform 100, the first installation area 110 covers the avoidance space 120. Under this structural layout, the accommodation area provided by the avoidance space 120 is below the projection of the first installation area 110, that is, when the modular air exhaust device 400 is installed in the avoidance space 120, the transmission cavity 300 and the loading cavity 200 are located above the air exhaust device 400 in the vertical direction, at this time, the air exhaust device 400 is short in distance from the transmission cavity 300 and the loading cavity 200, which undoubtedly can conveniently connect the first vacuum module 410 and the loading cavity 200, and connect the second vacuum module 420 and the transmission cavity 300, and then shorten the connecting pipe between them, which not only improves the air exhaust efficiency, but also reduces the cost.

[0043] At the same time, under this structural layout, the air exhaust device 400 is equivalent to being completely embedded in the installation platform 100, and will not occupy a large amount of space around the installation platform 100 as in the related art air exhaust device 400, thereby leaving a large amount of maintenance space around the installation platform 100, which is convenient for subsequent maintenance and repair work.

[0044] In the embodiment, the first vacuum module 410 and the second vacuum module 420 can be selected as dry vacuum pumps, of course, they can also select other fluid driving devices such as cold pumps.

[0045] As can be seen from the above description, in the wafer transfer system of the semiconductor process equipment in the embodiment of the present application, the mounting platform 100 is provided with the avoiding space 120, the avoiding space 120 is in communication with the outside, and the air extraction device 400 can be conveniently mounted into the avoiding space 120. At this time, the air extraction device 400 is equivalent to being accommodated inside the mounting platform 100, and a large amount of maintenance space is reserved around the mounting platform 100. At the same time, in the height direction of the mounting platform 100, the first mounting area 110 covers the avoiding space 120. Since the loading cavity 200 and the transfer cavity 300 are both mounted in the first mounting area 110, and the air extraction device 400 is mounted in the avoiding space 120, the distance between the air extraction device 400 and the loading cavity 200 and the transfer cavity 300 is greatly reduced, and thus the connecting pipeline therebetween can be shortened to improve the air extraction efficiency. Furthermore, the air extraction device 400 in the embodiment of the present application is arranged in a spaced manner with the mounting platform 100 when it is mounted in the avoiding space 120. In this case, even if the air extraction device 400 has running vibration, it is difficult to transmit the vibration to the mounting platform 100, and thus the entire wafer transfer system has relatively high transfer precision.

[0046] Compared with the related art, the wafer transfer system in the embodiment of the present application optimizes the layout mode of the air extraction device 400 through the above structural improvement, and thus expands the maintenance space, improves the air extraction efficiency and the transfer precision.

[0047] In the embodiment, the configuration inside the air extraction device 400 has multiple modes. For example, the first vacuum module 410 and the second vacuum module 420 can be arranged in the same horizontal plane on the support. The above configuration mode causes the air extraction device 400 to occupy too much space in the horizontal plane, and thus occupies too much accommodation space in the mounting platform 100. Even the air extraction device 400 needs to be partially placed into the maintenance space due to the interference with the air charging device, the CDA system (i.e., the semiconductor chip clean dry air system) and the like in the mounting platform 100.

[0048] In another embodiment, as shown in Figs. 1A and 1B, the first vacuum module 410 and the second vacuum module 420 in the embodiment are arranged along the height direction of the air extraction device 400. In this structural layout, the first vacuum module 410 and the second vacuum module 420 are in a stacked state. This only increases the height size of the air extraction device 400, but can significantly reduce the size of the air extraction device 400 in the horizontal direction. Since the mounting platform 100 itself has a relatively large height size, it is relatively easy to open the avoiding space 120 matching the air extraction device 400 in the mounting platform 100. After the air extraction device 400 in the embodiment is mounted into the avoiding space 120, it will not interfere with the air charging device, the CDA system and the like in the mounting platform 100. Figure 2 Figure 7 In another embodiment, as shown in Figs. 1A and 1B, the first vacuum module 410 and the second vacuum module 420 in the embodiment are arranged along the height direction of the air extraction device 400. In this structural layout, the first vacuum module 410 and the second vacuum module 420 are in a stacked state. This only increases the height size of the air extraction device 400, but can significantly reduce the size of the air extraction device 400 in the horizontal direction. Since the mounting platform 100 itself has a relatively large height size, it is relatively easy to open the avoiding space 120 matching the air extraction device 400 in the mounting platform 100. After the air extraction device 400 in the embodiment is mounted into the avoiding space 120, it will not interfere with the air charging device, the CDA system and the like in the mounting platform 100.​

[0049] In order to improve the structural compactness of the air exhaust device 400 as a whole, the first vacuum module 410 and the second vacuum module 420 in the embodiment can be selected as square dry vacuum pumps. Compared with circular dry vacuum pumps, the square dry vacuum pumps have smaller volume, which is conducive to reducing the overall size of the air exhaust device 400. At the same time, the shape of the square dry vacuum pumps makes the overall shape of the air exhaust device 400 in the stacked form more square, which is conducive to the opening of the avoiding space 120 matching the air exhaust device 400 in the installation platform 100, and also more convenient for assembling the air exhaust device 400 into the avoiding space 120.

[0050] In the embodiment, the air exhaust device 400 further comprises a cooling medium circulation pipe group 430 connected with a cooling medium supply source. The cooling medium circulation pipe group 430 is used to supply cooling medium to the first vacuum module 410 and the second vacuum module 420, and discharge the cooling medium in the first vacuum module 410 and the second vacuum module 420. It should be understood that a large amount of heat will be generated during the operation of the air exhaust device 400, which will cause a high temperature, thereby increasing the power consumption, reducing the efficiency, and also causing a safety hazard. The cooling medium circulation pipe group 430 is used to transmit the cooling medium of the cooling medium supply source to the air exhaust device 400 for cooling, and discharge the cooling medium after absorbing heat to realize circulation.

[0051] The cooling medium can be selected as cooling water, cooling brine, ethylene glycol liquid, liquid ammonia, etc. The specific type of the cooling medium is not limited in the embodiment.

[0052] In order to cope with the risk of leakage of the cooling medium circulation pipe group 430, the air exhaust device 400 in the embodiment further comprises a medium leakage sensor 440. The medium leakage sensor 440 is used to detect the leakage information of the cooling medium at the connection between the cooling medium circulation pipe group 430 and the first vacuum module 410 and the second vacuum module 420. It should be understood that the leakage of the cooling medium usually occurs at the connection between the cooling medium circulation pipe group 430 and the first vacuum module 410 and the second vacuum module 420. The medium leakage sensor 440 in the embodiment can detect the leakage information of the cooling medium at the connection and feed back. The operating personnel can obtain the conveying working condition of the cooling medium in real time through the leakage information. If leakage occurs, the leakage problem can be solved through maintenance at the first time.

[0053] The type of the medium leakage sensor 440 is not limited in the embodiment, which can be a point type liquid leakage sensor, a cable type liquid leakage sensor, etc.

[0054] Further, as shown in FIG. 4, the air exhaust device 400 in the embodiment further comprises a first air exhaust pipe 410 and a second air exhaust pipe 420. The first air exhaust pipe 410 is connected with the first vacuum module 410, and the second air exhaust pipe 420 is connected with the second vacuum module 420. The first air exhaust pipe 410 and the second air exhaust pipe 420 are connected with each other to form the air exhaust pipe 400. Figure 2 and Figure 6As shown, the vacuum pumping device 400 in this embodiment may further include a receiving plate 450, which is connected to the support. Along the height direction of the vacuum pumping device 400, the projection of the cooling medium circulation pipe assembly 430 is located in the receiving plate 450. The cooling medium is coolant, and the medium leakage sensor 440 is a leakage detection strip, which is also located in the receiving plate 450. In this structural layout, along the height direction of the vacuum pumping device 400, the connection between the cooling medium circulation pipe assembly 430 and the first vacuum module 410 and the second vacuum module 420 is also projected into the receiving plate 450. When a leak occurs at this connection, the leaked coolant will drip into the receiving plate 450, and the leakage detection strip in the receiving plate 450 can detect the leakage information.

[0055] It should be noted that in this embodiment, the receiving tray 450 is used to collect leaked liquid. After the leak is resolved, the receiving tray 450 can be removed and the leaked liquid poured out, making the operation extremely convenient. Because the receiving tray 450 can collect leaked liquid, it can prevent coolant from dripping directly onto electrical equipment or onto the support surface and flowing onto the equipment, thus undoubtedly avoiding electrical safety issues. Simultaneously, since the leak detection strip is located within the receiving tray 450, the two are integrated into a modular component, improving ease of assembly and disassembly. The leak detection strip is a cable-type leak sensor. In another embodiment, it can also be wound around the connection between the cooling medium circulation pipe assembly 430 and the first vacuum module 410 and the second vacuum module 420. This embodiment does not limit the specific placement of the leak detection strip.

[0056] To improve the overall ease of operation of the vacuum device 400, such as Figure 8 As shown, the wafer transfer system of this embodiment also includes a controller (not shown in the figure) and a solenoid valve. The solenoid valve is disposed between the cooling medium circulation pipe group 430 and the cooling medium supply source. The controller is communicatively connected to the medium leakage sensor 440 and the solenoid valve. The controller controls the solenoid valve according to the leakage information.

[0057] Specifically, the controller can interact with both the media leakage sensor 440 and the solenoid valve. The media leakage sensor 440 can detect leakage at the connection between the cooling medium circulation pipe assembly 430 and the first vacuum module 410 and the second vacuum module 420, and feed this information back to the controller in real time. Upon receiving the leakage information, the controller can issue a command to disconnect the solenoid valve, preventing the cooling medium circulation pipe assembly 430 from supplying cooling medium to the first vacuum module 410 and the second vacuum module 420. After resolving the leakage issue, the controller can reopen the solenoid valve, allowing the cooling medium circulation pipe assembly 430 to continue supplying cooling medium from the cooling medium supply source to the first vacuum module 410 and the second vacuum module 420.

[0058] In the embodiment, the controller can be a separate control unit in the pumping device 400, or it can also be a control module in the wafer transfer system, and the embodiment does not limit the specific type of the controller.

[0059] As shown in Figure 2 , Figure 6 and Figure 8 , the pumping device 400 of the embodiment includes a first pumping pipeline and a second pumping pipeline, the first vacuum module 410 is provided with a first pumping port 412, and the second vacuum module 420 is provided with a second pumping port 422; wherein the first pumping pipeline is connected to the loading cavity 200 and the first pumping port 412, so that the first vacuum module 410 can successfully pump the loading cavity 200, the first pumping pipeline is a one-to-two pipeline, and the two branch pipes thereof are respectively connected to the loading A cavity and the loading B cavity; the second pumping pipeline is connected to the transfer cavity 300 and the second pumping port 422, so that the second vacuum module 420 can successfully pump the transfer cavity 300. The pumping device 400 further includes an exhaust pipeline 470, which is a two-in-one pipeline, and is connected to the first vacuum module 410 and the second vacuum module 420, and collects the gas in the two modules and then discharges it to the factory exhaust system. As shown in Figure 8 , the solid arrows in the figure represent the pumping and exhaust paths of the pumping device 400.

[0060] The cooling medium circulation pipe group 430 includes a medium input pipeline 431 and a medium output pipeline 432, one end of the medium input pipeline 431 is connected to a cooling medium supply source, and the medium input pipeline 431 is a one-to-two pipeline, and the two branch pipes thereof are respectively connected to the first vacuum module 410 and the second vacuum module 420 to respectively transport cooling medium to the first vacuum module 410 and the second vacuum module 420. The medium output pipeline 432 is a two-in-one pipeline, which is connected to the first vacuum module 410 and the second vacuum module 420, and collects the cooling medium after absorbing heat in the two modules and then discharges it. As shown in Figure 8 , the dashed arrows in the figure represent the circulation path of the cooling medium.

[0061] The wafer transfer system of the embodiment further includes a plurality of vacuum gauges, part of the vacuum gauges are connected to the loading cavity 200 and the transfer cavity 300 to detect the pressure values in the loading cavity 200 and the transfer cavity 300, and the other part of the vacuum gauges are arranged on the first pumping pipeline and the second pumping pipeline to detect whether the first pumping pipeline and the second pumping pipeline leak.

[0062] In order to ensure that the pumping device 400 can be reliably installed, as shown in Figure 2 and Figure 6As shown, the evacuation device 400 of the present embodiment can further comprise a fixing assembly 460 connected to the support frame, which is configured to fix the evacuation device 400 to the support surface when the evacuation device 400 is arranged in the avoiding space 120. It should be understood that when the fixing assembly 460 fixes the evacuation device 400 to the support surface, the evacuation device 400 will be constrained when it vibrates during operation, so as to ensure that the evacuation device 400 can be reliably and stably installed on the support surface.

[0063] In the present embodiment, the fixing assembly 460 can be of various types, for example, the fixing assembly 460 can be an adhesive assembly, a threaded fastening assembly, etc. for achieving connection with the support surface. In another embodiment, the fixing assembly 460 of the present embodiment can comprise a plurality of shockproof feet arranged along the circumference of the support frame to provide balanced support and fixing effect for the evacuation device 400.

[0064] In an optional solution, the evacuation device 400 of the present embodiment can further comprise a traveling wheel set (not shown in the drawings) arranged at the bottom of the support frame, by which the evacuation device 400 can move on the support surface. In this way, the evacuation device 400 of the present embodiment has the mobility. It should be noted that the wafer transfer system needs to be debugged during the installation stage, and in the related art, the evacuation device 400 needs to be fixedly installed in place before the wafer transfer system can be debugged, which will result in that the entire debugging stage is time-consuming and laborious, especially when multiple systems need to be debugged.

[0065] To solve the above problem, the evacuation device 400 of the present embodiment has the mobility, which can be quickly connected with the pipeline of the system by moving and adjusting the position during debugging, so as to quickly complete the debugging operation; at the same time, after the evacuation device 400 is debugged for one system, it can be moved to another system for debugging, so that one evacuation device 400 can debug multiple systems, avoiding the need to install all the systems with the evacuation device 400 during the debugging stage, thereby further improving the convenience of debugging.

[0066] In an optional solution, as shown, Figure 2 The first vacuum module 410 of the present embodiment has a first interface integrated panel 411, and the second vacuum module 420 has a second interface integrated panel 421, which can be arranged on the same side of the evacuation device 400. It should be understood that the first interface integrated panel 411 refers to the end face panel of the first vacuum module 410 on which a plurality of interfaces are integrated, as shown in Figure 2As shown, the first interface integrated panel 411 is provided with the interface of the exhaust pipeline 470, the interface of the medium input pipeline 431 and the interface of the medium output pipeline 432. The second interface integrated panel 421 refers to the end face panel integrated with a plurality of interfaces on the second vacuum module 420, such as Figure 2 As shown, the second interface integrated panel 421 is provided with the second exhaust interface 422, the interface of the exhaust pipeline 470, the interface of the medium input pipeline 431 and the interface of the medium output pipeline 432. Of course, the specific number and type of interfaces provided on the first interface integrated panel 411 and the second interface integrated panel 421 are not limited in the embodiment.

[0067] Since the first interface integrated panel 411 and the second interface integrated panel 421 are arranged on the same side of the exhaust device 400, it is convenient to perform assembly operation on the same side end face of the exhaust device 400. Meanwhile, during the subsequent operation stage of the exhaust device 400, even if a fault (such as leakage, poor electrical contact, etc.) occurs, the structure layout is also convenient for the operator to uniformly perform troubleshooting and maintenance.

[0068] Further, the exhaust device 400 is configured to expose the first interface integrated panel 411 and the second interface integrated panel 421 to the installation platform 100 when it is installed in the avoidance space 120. In this case, when the exhaust device 400 is installed in the avoidance space 120, the first interface integrated panel 411 and the second interface integrated panel 421 are exposed to the outside of the installation platform 100, that is, when the operator performs maintenance on the exhaust device 400, he can face the first interface integrated panel 411 and the second interface integrated panel 421, which undoubtedly facilitates the operator to perform maintenance work.

[0069] Further, as shown in the figure, Figure 7 The installation platform 100 of the embodiment has a third interface integrated panel 130, which can be arranged on the end face of the installation platform 100 on the side where the avoidance space 120 is opened. It should be noted that the third interface integrated panel 130 of the embodiment refers to the end face panel integrated with a plurality of interfaces of related devices on the installation platform 100, which can include a gas charging device, a CDA system, etc.

[0070] In this way, when the exhaust device 400 is installed in the avoidance space 120, the first interface integrated panel 411, the second interface integrated panel 421 and the third interface integrated panel 130 are all located on the same side end face of the installation platform 100, so that the power interfaces of the entire wafer transfer system are concentrated in the same side region, thereby further improving the convenience of the operator to perform troubleshooting and maintenance.

[0071] In the present embodiment, the mounting platform 100 can have various configurations, such as a box structure, etc. In another embodiment, as shown in Figs. 1A and 1B, the mounting platform 100 of the present embodiment can include a base plate 140 and a plurality of support columns 150 disposed on the base plate 140, the plurality of support columns 150 defining a first mounting area 110 on a side thereof away from the base plate 140, and a side edge of the base plate 140 being provided with a relief space 120. Figure 3 and Figure 7 As shown in Figs. 1A and 1B, the mounting platform 100 of the present embodiment can include a base plate 140 and a plurality of support columns 150 disposed on the base plate 140, the plurality of support columns 150 defining a first mounting area 110 on a side thereof away from the base plate 140, and a side edge of the base plate 140 being provided with a relief space 120.

[0072] In this structural arrangement, the top portions of the plurality of support columns 150 can serve as support points, which form the first mounting area 110, and the loading cavity 200 and the transfer cavity 300 are mounted and fixed in the first mounting area 110. At the same time, the support columns 150 have a small structural footprint, so as to reserve more mounting space inside the mounting space. Specifically, a second mounting area 160 can be formed between the support columns 150, and the second mounting area 160 is used for accommodating an inflation device, a CDA system, etc. Of course, the structure of the support columns 150 is also conducive to reserving the area where the relief space 120 is provided. Overall, the mounting platform 100 of this structure has a relatively light weight, and is convenient to move when disassembled.

[0073] Based on the foregoing wafer transfer system, the present embodiment also provides a semiconductor process equipment, which includes a plurality of process chambers 500 and the wafer transfer system according to any one of the foregoing embodiments. Thus, the semiconductor process equipment has the beneficial effects of any one of the foregoing embodiments, which will not be described herein again. The plurality of process chambers 500 and the loading cavity 200 are arranged along the circumference of the transfer cavity 300 and are in communication with the transfer cavity 300.

[0074] In the present embodiment, the type of the semiconductor process equipment is not limited, which can be an etching equipment, a vapor deposition equipment, a photolithography equipment, etc.

[0075] In the foregoing embodiments, the differences between the various embodiments are mainly described. The different optimization features between the various embodiments can be combined to form a more optimal embodiment as long as they are not contradictory. In view of the brevity of the writing, the foregoing will not be described herein again.

[0076] The above merely describes the embodiments of the present application and is not intended to limit the present application. The present application can have various modifications and changes for those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the scope of the claims of the present application.

Claims

1. A wafer transfer system for a semiconductor process apparatus, characterized by, The wafer conveying system comprises: a mounting platform provided with a first mounting area and an avoiding space, the first mounting area is arranged on the top surface of the mounting platform, the avoiding space is communicated with the outside and penetrates through the bottom surface of the mounting platform, and in the height direction of the mounting platform, the first mounting area covers the avoiding space; a loading cavity mounted on the first mounting area; a conveying cavity mounted on the first mounting area; an exhaust device comprising a support and a first vacuum module and a second vacuum module integrated on the support, the first vacuum module is used for exhausting the loading cavity, and the second vacuum module is used for exhausting the conveying cavity; the size of the exhaust device matches the size of the avoiding space, and the exhaust device is arranged spaced apart from the mounting platform when it is mounted in the avoiding space.

2. The wafer transport system of claim 1, wherein, The first vacuum module and the second vacuum module are arranged along the height direction of the exhaust device.

3. The wafer transport system of claim 1, wherein, The exhaust device further comprises: a cooling medium circulation pipe group connected with a cooling medium supply source, the cooling medium circulation pipe group is used for supplying cooling medium to the first vacuum module and the second vacuum module, and discharging the cooling medium in the first vacuum module and the second vacuum module; a medium leakage sensor for detecting leakage information of the cooling medium at the connection between the cooling medium circulation pipe group and the first vacuum module and the second vacuum module.

4. The wafer transport system of claim 3, wherein, The exhaust device further comprises a receiving disc connected to the support, the projection of the cooling medium circulation pipe group is located in the receiving disc along the height direction of the exhaust device; the cooling medium is cooling liquid, the medium leakage sensor is a liquid leakage detection belt, and the liquid leakage detection belt is arranged in the receiving disc.

5. The wafer transport system of claim 3, wherein, The wafer conveying system further comprises a controller and a solenoid valve arranged between the cooling medium circulation pipe group and the cooling medium supply source, the controller is in communication connection with the medium leakage sensor and the solenoid valve, and the controller controls the solenoid valve according to the leakage information.

6. The wafer transport system of claim 1, wherein, The first vacuum module and the second vacuum module are both square dry vacuum pumps.

7. The wafer transport system of claim 1, wherein, The exhaust device further comprises a fixing assembly connected to the support, the fixing assembly is configured to fix the exhaust device to a support surface when the exhaust device is arranged in the avoiding space.

8. The wafer transport system of claim 1, wherein, The exhaust device further comprises a walking wheel set arranged at the bottom of the support, and the exhaust device moves on the support surface through the walking wheel set.

9. The wafer transport system of claim 1, wherein, The first vacuum module has a first interface integrated panel, the second vacuum module has a second interface integrated panel, the first interface integrated panel and the second interface integrated panel are arranged on the same side of the exhaust device; the exhaust device is configured such that the first interface integrated panel and the second interface integrated panel are exposed to the mounting platform when the exhaust device is mounted in the avoiding space. The mounting platform has a third interface integrated panel arranged on the end surface of the side of the mounting platform where the avoiding space is opened.

10. The wafer transport system of claim 1, wherein, The mounting platform comprises a base plate and a plurality of support columns arranged on the base plate, and the plurality of support columns define the first mounting area away from one side of the base plate, and one side edge of the base plate is provided with the avoiding space.

11. A semiconductor process apparatus, characterized by comprising: Comprising: a plurality of process chambers; The wafer transfer system of any of claims 1-10, the plurality of process chambers and the load chamber are arranged along a circumference of the transfer chamber and in communication with the transfer chamber.

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