Alignment mechanism and method for a bonder

Abstract

The present application provides an alignment mechanism of a bonding machine, in particular, an alignment mechanism of a wafer bonding machine, mainly comprising a stage, three first alignment units and three second alignment units. The bearing surface of the stage has a placement area for placing a first substrate, wherein the first alignment units and the second alignment units are arranged around the placement area of the bearing surface. The first alignment unit comprises a bottom and a protruding portion, wherein the protruding portion protrudes from the bottom towards the placement area. The bottom of the first alignment unit is used to position the first substrate, and the protruding portion of the first alignment unit is used to carry a second substrate, and the second alignment unit is used to position the second substrate placed on the protruding portion of the first alignment unit, so that the second substrate is aligned with the first substrate, facilitating the bonding overlap of the first substrate and the second substrate.

Description

Technical Field

[0001] This invention relates to an alignment mechanism for a bonding machine, which can quickly and accurately align wafers and substrates to facilitate subsequent wafer and substrate bonding. Background Technology

[0002] With advancements in semiconductor technology, wafer thickness has been continuously reduced to facilitate subsequent wafer dicing and packaging processes. Furthermore, wafer thinning offers advantages such as reduced chip size, lower resistance, faster processing speeds, and extended lifespan. However, thinned wafers are structurally more fragile and prone to warping or breakage during subsequent processes, leading to lower product yields.

[0003] To avoid the aforementioned problems, it is generally recommended to temporarily bond the wafer to a carrier substrate and support the thinned wafer with the carrier substrate to prevent the thinned wafer from warping or breaking during the manufacturing process.

[0004] Specifically, adhesive can be applied to the surfaces of the substrate and the wafer. Then, the substrate and the wafer are moved to a bonding machine for alignment, and the temperature of the substrate and the wafer is increased for bonding. After bonding, the wafer can undergo processes such as thinning, etching, and metallization. Finally, the wafer is peeled off from the substrate.

[0005] Although the above steps can complete the bonding between the wafer and the substrate, the alignment mechanism of a typical bonding machine still suffers from poor accuracy and low alignment efficiency, which affects the efficiency and yield of the process. Summary of the Invention

[0006] To address the aforementioned problems, this invention proposes an alignment mechanism for a bonding machine, which effectively improves the accuracy and efficiency of alignment between the wafer and the substrate, thereby enhancing process efficiency and yield. Furthermore, the alignment mechanism described in this invention eliminates the cost of installing multiple detectors on the machine.

[0007] One objective of this invention is to provide an alignment mechanism for a bonding machine, which mainly consists of three first alignment units and three second alignment units arranged on a platform. The first alignment units and the second alignment units can be displaced along the bearing surface parallel to the platform and move closer to or further away from the substrate on the platform to align the substrate.

[0008] During the alignment process of the substrate, the first alignment unit and the second alignment unit only need to move along the direction of the bearing surface of the parallel stage, without needing to rise or fall relative to the bearing surface of the stage, which helps to simplify the alignment steps and the mechanism of the machine.

[0009] One objective of this invention is to provide an alignment mechanism for a bonding machine, which mainly consists of three alignment units and three support units arranged on a platform, wherein the alignment units and support units can be displaced along the support surface parallel to the platform.

[0010] When the alignment unit approaches the substrate, it contacts and pushes the substrate to complete the alignment of the substrate. When the carrier unit approaches the substrate, it is used to carry the substrate, and the alignment unit can align the substrate carried by the carrier unit.

[0011] To achieve the above objectives, the present invention provides an alignment mechanism for a bonding machine, comprising: a stage including a bearing surface for supporting a first substrate, wherein the bearing surface has a placement area; three first alignment units disposed around the placement area of ​​the bearing surface for moving closer to or away from the placement area to position a first substrate and support a second substrate, wherein each first alignment unit includes a protrusion and a bottom, the protrusion protruding beyond the bottom in the direction of the placement area, the bottom being closer to the bearing surface of the stage than the protrusion, and the bottom of the first alignment unit being used to position the first substrate; and three second alignment units disposed around the placement area of ​​the bearing surface for moving closer to or away from the placement area to position the second substrate supported by the first alignment units, wherein the first alignment units are displaced in the direction away from the placement area and place the supported second substrate onto the first substrate.

[0012] The present invention proposes another alignment mechanism for a bonding machine, comprising: a stage including a bearing surface for supporting a first substrate, wherein the bearing surface has a placement area; three alignment units disposed around the placement area of ​​the bearing surface for moving closer to or away from the placement area to position the first substrate and a second substrate; and three bearing units disposed around the placement area of ​​the bearing surface for moving closer to or away from the placement area to support the second substrate, wherein the alignment units are displaced toward the placement area to position the second substrate supported by the bearing units, and then the bearing units are displaced away from the placement area to place the supported second substrate on the first substrate, wherein the bearing unit includes a protrusion and a bottom, the protrusion protruding toward the placement area from the bottom, and the bottom being closer to the bearing surface of the stage than the protrusion.

[0013] The present invention provides a bonding alignment method, comprising: placing a first substrate on a support surface of a stage, wherein the support surface has a placement area; displacing three alignment units toward the placement area of ​​the support surface to position the first substrate placed on the support surface of the stage, such that the first substrate is aligned with the placement area; displacing three support units toward the placement area of ​​the support surface and using them to support a second substrate; displacing three alignment units toward the placement area of ​​the support surface to position the second substrate supported by the support units, such that the second substrate is aligned with the first substrate; and the support units moving away from the placement area of ​​the support surface and placing the supported second substrate on the first substrate.

[0014] The alignment mechanism of the bonding machine includes a first alignment unit and a carrier unit whose protrusions protrude radially along the carrier surface of the stage and are used to carry the second substrate. The first alignment unit, the second alignment unit, the alignment unit and the carrier unit are displaced radially along the carrier surface and move closer to or further away from the placement area.

[0015] The alignment mechanism of the bonding machine, wherein the protrusion of the first alignment unit and the carrier unit includes an inclined surface that is inclined toward the carrier surface or placement area of ​​the stage.

[0016] The alignment mechanism of the bonding machine includes at least six connecting rods located on the bearing surface of the stage and arranged around the placement area of ​​the bearing surface. The first alignment unit, the second alignment unit, the alignment unit and the bearing unit each include a fixing hole for fitting onto the connecting rods.

[0017] In the bonding alignment method described above, one of the three carrier units is first moved away from the placement area, such that the carrier unit obliquely places the second substrate it carries on the first substrate.

[0018] The beneficial effects of this invention are: it can improve the accuracy and efficiency of alignment between the wafer and the substrate, and can save the cost of setting up multiple detectors on the machine. Attached Figure Description

[0019] Figure 1 This is a perspective schematic diagram of an embodiment of the alignment mechanism of the bonding machine of the present invention.

[0020] Figure 2 This is a top view of an embodiment of the alignment mechanism of the bonding machine of the present invention for positioning the first substrate.

[0021] Figure 3 This is a top view of an embodiment of the alignment mechanism of the bonding machine of the present invention carrying a second substrate.

[0022] Figure 4 This is a top view of an embodiment of the alignment mechanism of the bonding machine of the present invention for positioning a second substrate.

[0023] Figure 5 This is a side view of an embodiment of the alignment mechanism of the bonding machine of the present invention, showing the alignment of the first alignment unit with the first substrate.

[0024] Figure 6 This is a side view of an embodiment of the first alignment unit of the alignment mechanism of the bonding machine of the present invention carrying a second substrate.

[0025] Figure 7 A side view of an embodiment in which a second substrate is placed in the first alignment unit of the alignment mechanism of the bonding machine of the present invention.

[0026] Figure 8This is a side view of yet another embodiment of the first alignment unit of the alignment mechanism of the bonding machine of the present invention carrying a second substrate.

[0027] Figure 9 A side view of yet another embodiment of the first alignment unit of the alignment mechanism of the bonding machine of the present invention, in which a second substrate is placed.

[0028] Explanation of reference numerals in the attached drawings: 10 - Alignment mechanism of the bonding machine; 11 - Stage; 111 - Bearing surface; 113 - Placement area; 121 - First substrate; 123 - Second substrate; 131 - First alignment unit; 1311 - Bottom; 1313 - Protrusion; 1315 - Inclined surface; 133 - Second alignment unit; 135 - Lifting pin; 151 - Connecting rod; 153 - Fixing hole; 231 - Bearing unit; 2311 - Bottom; 2313 - Protrusion; 233 - Alignment unit. Detailed Implementation

[0029] Please see Figure 1 This is a perspective view of an embodiment of the alignment mechanism of the bonding machine of the present invention. As shown in the figure, the alignment mechanism 10 of the bonding machine mainly includes a stage 11, at least three first alignment units 131 and at least three second alignment units 133, wherein the first alignment units 131 and the second alignment units 133 are disposed in the area near the edge or periphery of the stage 11. For example, a placement area 113 can be defined on a bearing surface 111 of the stage 11, wherein the bearing surface 111 and the placement area 113 are used to place the substrate. The first alignment units 131 and the second alignment units 133 are arranged at intervals, such as... Figure 1 The component with the cross-section shown is the first alignment unit 131, which is arranged around the placement area 113, wherein the first and second alignment units 131 / 133 can be close to or far from the placement area 113.

[0030] The alignment mechanism 10 of the bonding machine positions the first substrate 121 and the second substrate 123 located above the stage 11 through the first alignment unit 131 and the second alignment unit 133 respectively, so that the first substrate 121 and the second substrate 123 overlap, wherein the second substrate 123 is aligned with the first substrate 121.

[0031] The minimum spacing between each first alignment unit 131 and the minimum spacing between each second alignment unit 133 can be adjusted according to the dimensions of the first substrate 121 and the second substrate 123, respectively. Specifically, the first substrate 121 and the second substrate 123 are disk-shaped, wherein the circle formed by the first alignment units 131 in the alignment state is similar in size to the first substrate 121, and the circle formed by the second alignment units 133 in the alignment state is similar in size to the second substrate 123.

[0032] The bearing surface 111 of the stage 11 can be used to support the first substrate 121, wherein the first substrate 121 can be placed in or adjacent to the placement area 113 of the bearing surface 111, such as... Figure 2 As shown. The first alignment unit 131 is located on the bearing surface 111 of the stage 11 and can move closer to or further away from the placement area 113 along a direction parallel to the bearing surface 111 to position the first substrate 121 placed on the bearing surface 111 or the placement area 113 of the stage 11. For example, the bearing surface 111 and / or the placement area 113 of the stage 11 can be circular, and the first alignment unit 131 can be radially displaced along the bearing surface 111 and move closer to or further away from the placement area 113 to position the first substrate 121.

[0033] Specifically, after the first substrate 121 is placed in the placement area 113 of the stage 11, the first substrate 121 is not usually accurately positioned within the placement area 113. The three first alignment units 131 can move synchronously or asynchronously toward the placement area 113 and contact the first substrate 121 within the placement area 113 to position the first substrate 121 so that the first substrate 121 is accurately placed within the placement area 113.

[0034] In one embodiment of the present invention, such as Figures 5 to 7 As shown, the first alignment unit 131 includes a bottom 1311 and a protrusion 1313. The bottom 1311 is closer to the bearing surface 111 of the stage 11 than the protrusion 1313. The protrusion 1313 protrudes from the bottom 1311 toward the placement area 113 of the stage 11. For example, the protrusion 1313 may protrude radially along the bearing surface 111 and / or the placement area 113 of the stage 11. When the first alignment unit 131 approaches the placement area 113 and the first substrate 121, the bottom 1311 of the first alignment unit 131 will push against and position the first substrate 121.

[0035] After the first substrate 121 is positioned, the second substrate 123 can be placed above the placement area 113. At this time, the first alignment unit 131 will remain in the position where the first substrate 121 is positioned and will be used to support the second substrate 123, for example, by using the protrusion 1313 of the first alignment unit 131 to support the second substrate 123. Figure 3 , Figure 5 and Figure 6 As shown.

[0036] Then, the second alignment unit 133 moves closer to the placement area 113 and the second substrate 123, and pushes and positions the second substrate 123 carried by the first alignment unit 131. For example, the second alignment unit 133 can be radially displaced along the bearing surface 111. Figure 4 and Figure 6As shown. In practical applications, the second alignment unit 133 is not used to support the substrate, so the second alignment unit 133 can be a columnar body of any geometric shape, wherein the second alignment unit 133 does not need to be provided to the protrusion 1313 of the first alignment unit 131.

[0037] After the alignment steps described above, the second substrate 123 will be aligned with the first substrate 121, wherein the second substrate 123 will still be placed on the first alignment unit 131. Then, the first alignment unit 131 will move away from the first substrate 121, the second substrate 123, and / or the placement area 113, for example, radially away from the stage 11, wherein the second substrate 123 will fall from the first alignment unit 131 and be placed on the first substrate 121, as... Figure 7 As shown.

[0038] In practical applications, the three first alignment units 131 can move away from the second substrate 123 asynchronously. For example, one of the first alignment units 131 can move away from the second substrate 123 firstly, while the other two first alignment units 131 remain stationary, so that the second substrate 123 is placed obliquely on the first substrate 121. Then the other two first alignment units 131 will move away from the second substrate 123 to place the second substrate 123 flat on the first substrate 121.

[0039] In one embodiment of the present invention, when the first alignment unit 131 moves away from the second substrate 123, the second alignment unit 133 can remain stationary, which can prevent the second substrate 123 from shifting relative to the first substrate 121 when the first alignment unit 131 shifts relative to the second substrate 123.

[0040] like Figure 8 and Figure 9 As shown, the protrusion 1313 of the first alignment unit 131 may include an inclined surface 1315, wherein the inclined surface 1315 is inclined toward the bearing surface 111 and / or the placement area 113 of the stage 11, and the second substrate 123 is placed on the inclined surface 1315 of the protrusion 1313 of the three first alignment units 131. By providing the inclined surface 1315 on the protrusion 1313, the second substrate 123 carried by the protrusion 1313 can be guided to slide down along the inclined surface 1315 onto the first substrate 121, and the displacement of the second substrate 123 relative to the first substrate 121 when the first alignment unit 131 is displaced relative to the carried second substrate 123 can be avoided.

[0041] In one embodiment of the present invention, the alignment mechanism 10 of the bonding machine may include at least three lifting pins 135 disposed on the bearing surface 111 of the stage 11, wherein a first alignment unit 131 and a second alignment unit 133 are arranged around the lifting pins 135, for example, the lifting pins 135 may be disposed within the placement area 113 of the stage 11. The lifting pins 135 may rise and fall relative to the bearing surface 111 of the stage 11. When the lifting pins 135 are raised, they can be used to receive and carry the first substrate 121, and when the lifting pins 135 are lowered, they can place the carried first substrate 121 onto the bearing surface 111 of the stage 11. Furthermore, each lifting pin 135 may descend synchronously or asynchronously, placing the first substrate 121 on the bearing surface 111 of the stage 11 in a flat or oblique manner. The lifting pins 135 are not essential components of the present invention, and in different embodiments, the first substrate 121 may also be directly placed in the placement area 113 of the stage 11.

[0042] In another embodiment of the present invention, Figures 1 to 9 The first alignment unit 131 can be a carrier unit 231, and the second alignment unit 133 can be an alignment unit 233, wherein the number, location and structure of the carrier unit 231 and the alignment unit 233 can be the same as the first and second alignment units 131 / 133.

[0043] Three carrier units 231 and three alignment units 233 are arranged around the placement area 113 of the carrier surface 111 and are used to move closer to or further away from the placement area 113. In this embodiment of the invention, the first substrate 121 and the second substrate 123 are aligned by the alignment units 233, and the second substrate 123 is carried by the carrier unit 231.

[0044] In practical applications, the first substrate 121 can be placed in the placement area 113 of the bearing surface 111 of the stage 11. Then, the three alignment units 233 will move closer to the first substrate 121 and the placement area 113. For example, the alignment units 233 can be moved radially along the stage 11. The three alignment units 233 will contact and position the first substrate 121, so that the first substrate 121 is aligned with the placement area 113 of the stage 11.

[0045] After the first substrate 121 is positioned, the three carrier units 231 move closer to the first substrate 121 and the placement area 113, while the three alignment units 233 move away from the first substrate 121. The alignment units 233 can leave the first substrate 121 only after the carrier units 231 have reached their positioning, or they can be driven to leave the first substrate 121 before they have reached their positioning. Theoretically, it is better to leave the first substrate 121 only after the carrier units 231 have reached their positioning, as this can better avoid displacement of the first substrate 121 caused by the displacement of the alignment units 233 relative to the first substrate 121.

[0046] After the alignment unit 233 leaves the first substrate 121, the second substrate 123 can be placed on the support unit 231, wherein the second substrate 123 is supported by the support unit 231 and does not contact the first substrate 121. Specifically, the structure of the support unit 231 is similar to that of the first alignment unit 131, and includes a bottom 2311 and a protrusion 2313, wherein the protrusion 2313 is used to support the second substrate 123.

[0047] The alignment unit 233 then moves closer to the second substrate 123, for example, the alignment unit 233 can be radially displaced along the bearing surface 111 of the stage 11. The three alignment units 233 contact and position the second substrate 123 carried by the bearing unit 231, so that the second substrate 123 is aligned with the first substrate 121 and / or the placement area 113 of the stage 11.

[0048] After the alignment of the first substrate 121 and the second substrate 123 is completed, the carrier unit 231 will leave the placement area 113, the first substrate 121 and / or the second substrate 123. The second substrate 123 will fall off the protrusion 2313 of the carrier unit 231 and be placed on the first substrate 121. When the carrier unit 231 leaves the second substrate 123, the alignment unit 233 can remain stationary and continue to contact the second substrate 123 to avoid displacement of the second substrate 123 during the displacement of the carrier unit 231 relative to the second substrate 123.

[0049] Furthermore, the three carrier units 231 can leave the second substrate 123 asynchronously. For example, one carrier unit 231 may leave the second substrate 123 first, while the other two carrier units 231 remain stationary, so that the second substrate 123 is placed obliquely on the first substrate 121. Then, the other two carrier units 231 will leave the second substrate 123 and place the second substrate 123 flat on the first substrate 121, so that the second substrate 123 overlaps and aligns with the first substrate 121.

[0050] In the process of aligning or positioning the first substrate 121 and the second substrate 123, the alignment mechanism 10 of the bonding machine of the present invention only needs to move along the direction of the bearing surface 111 of the parallel stage 11, and does not need to rise or fall relative to the bearing surface 111 of the stage 11. This simplifies the steps and structure of aligning the first substrate 121 and the second substrate 123. In one embodiment of the present invention, in addition to being able to move along the direction of the bearing surface 111 of the parallel stage 11, the first alignment unit 131, the second alignment unit 133, the bearing unit 231 and / or the alignment unit 233 can also rise or fall along the direction perpendicular to the bearing surface 111.

[0051] In one embodiment of the present invention, such as Figure 1 As shown, the bearing surface 111 of the stage 11 can be provided with six or more connecting rods 151, which are arranged around the placement area 113 of the bearing surface 111. The first and second alignment units 131 / 133, the bearing unit 231 and the alignment unit 233 each include a fixing hole 153 and are sleeved on the connecting rods 151 through the fixing hole 153. In practical applications, depending on the size of the first substrate 121 and the second substrate 123, different forms or sizes of the first and second alignment units 131 / 133, the bearing unit 231 and the alignment unit 233 can be selected and fixed on the connecting rods 151, so that the alignment mechanism 10 of the bonding machine described in this invention can be used to align two or more substrates.

[0052] In one embodiment of the present invention, the first substrate 121 includes, but is not limited to, a wafer or a chip, while the second substrate 123 includes, but is not limited to, a sapphire substrate.

[0053] Advantages of this invention:

[0054] It can effectively improve the accuracy and efficiency of alignment between the wafer and the substrate, which is beneficial to improving the efficiency and yield of the process.

[0055] The above description is merely a preferred embodiment of the present invention and is not intended to limit the scope of the present invention. All equivalent variations and modifications made in accordance with the shape, structure, features and spirit described in the claims of the present invention should be included within the scope of the claims of the present invention.

Claims

1. A bonding alignment method, characterized in that, include: A first substrate is placed on a support surface of a stage, wherein the support surface has a placement area; Three alignment units are displaced toward the placement area of ​​the bearing surface to position the first substrate placed on the bearing surface of the stage, so that the first substrate is aligned with the placement area; The three support units are displaced toward the placement area of ​​the support surface and used to support a second substrate; The three alignment units are displaced toward the placement area of ​​the bearing surface to position the second substrate carried by the bearing unit, so that the second substrate is aligned with the first substrate. and The carrier unit is located away from the placement area of ​​the carrier surface and places the second substrate it carries on the first substrate.

2. The bonding alignment method according to claim 1, characterized in that, One of the three carrier units is moved away from the placement area, so that the carrier unit places the second substrate it carries obliquely on the first substrate.

3. An alignment mechanism for a bonding machine applied to the bonding alignment method of claim 1, characterized in that, include: A stage includes a support surface for supporting a first substrate, wherein the support surface has a placement area; Three first alignment units are arranged around the placement area on the support surface to move closer to or further away from the placement area to position the first substrate and support a second substrate. Each first alignment unit includes a protrusion and a bottom. The protrusion protrudes from the bottom in the direction of the placement area. The bottom is closer to the support surface of the stage than the protrusion, and the first substrate is positioned by the bottom of the first alignment unit. and Three second alignment units are arranged around the placement area on the bearing surface and are used to move closer to or further away from the placement area to position the second substrate carried by the first alignment unit, wherein the first alignment unit is displaced in a direction away from the placement area and places the second substrate carried on the first substrate.

4. The alignment mechanism of the bonding machine according to claim 3, characterized in that, The protrusion of the first alignment unit protrudes radially along the bearing surface of the stage and is used to support the second substrate. The first alignment unit and the second alignment unit are displaced radially along the bearing surface and move closer to or further away from the placement area.

5. The alignment mechanism of the bonding machine according to claim 4, characterized in that, The protrusion of the first alignment unit includes an inclined surface that is inclined toward the bearing surface of the platform or the placement area.

6. The alignment mechanism of the bonding machine according to claim 3, characterized in that, The platform includes at least six connecting rods located on the bearing surface of the platform and surrounding the placement area on the bearing surface, while the first alignment unit and the second alignment unit include a fixing hole for fitting onto the connecting rods.

7. An alignment mechanism for a bonding machine applied to the bonding alignment method of claim 1, characterized in that, include: A stage includes a support surface for supporting a first substrate, wherein the support surface has a placement area; Three alignment units are arranged around the placement area on the bearing surface to move closer to or further away from the placement area to position the first substrate and a second substrate. and Three support units are arranged around the placement area on the support surface to move closer to or further away from the placement area. Each support unit carries the second substrate. The alignment unit is displaced toward the placement area to position the second substrate carried by the support unit. Then, the support unit is displaced away from the placement area to place the second substrate on the first substrate. Each support unit includes a protrusion and a bottom. The protrusion protrudes from the bottom toward the placement area, and the bottom is closer to the support surface of the stage than the protrusion.

8. The alignment mechanism of the bonding machine according to claim 7, characterized in that, The protrusion of the carrier unit protrudes radially along the carrier surface of the stage and is used to carry the second substrate. The alignment unit and the carrier unit are displaced radially along the carrier surface and move closer to or further away from the placement area.

9. The alignment mechanism of the bonding machine according to claim 8, characterized in that, The protrusion of the bearing unit includes an inclined surface that is inclined toward the bearing surface of the platform or the placement area.

10. The alignment mechanism of the bonding machine according to claim 7, characterized in that, The platform includes at least six connecting rods located on the bearing surface of the platform and surrounding the placement area on the bearing surface, while the alignment unit and the bearing unit include a fixing hole for fitting onto the connecting rods.

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