Radio wave transmission plate and manufacturing method thereof

Abstract

The present application provides a radio wave transmission plate, comprising an inner plate, a first outer plate, a second outer plate, a first electroplated bump, a first conductive bump, a second electroplated bump, and a second conductive bump. The inner plate is provided with a through hole, the hole wall of which is provided with a metal coating. The first electroplated bump and the first conductive bump are both disposed between the first outer plate and the inner plate and surround the through hole. The second electroplated bump and the second conductive bump are both disposed between the second outer plate and the inner plate and surround the through hole. The metal coating, the first electroplated bump, the first conductive bump, the first outer plate, the second outer plate, the second conductive bump, and the second electroplated bump surround a cavity filled with air. The radio wave transmission plate can transmit radio wave signals using the air in the cavity as a conductive medium. The present application also provides a method for manufacturing the above-mentioned radio wave transmission plate.

Description

Technical Field

[0001] The present application relates to the field of composite panels, and in particular to a radio wave transmission panel capable of transmitting radio wave signals and a method for manufacturing the panel. Background Art

[0002] Common composite boards used to transmit radio signals have a cavity formed within them, through which the radio signals are transmitted. These composite boards are typically made by laminating an outer sheet onto both sides of an inner sheet with a through-hole, and then sealing the through-hole. However, during the lamination process, the colloid used to bond the outer and inner sheets tends to flow into the through-hole, and this colloid cannot block the radio signals transmitted through the cavity. Summary of the Invention

[0003] In view of this, it is necessary to provide a radio wave transmission plate and a manufacturing method thereof that can solve the above technical problems.

[0004] On one hand, the present application provides a radio wave transmission board, comprising:

[0005] The inner layer plate is provided with a through hole, and the hole wall of the through hole is provided with a metal plating layer;

[0006] a first outer plate, disposed on one side of the inner plate and covering one end of the through hole;

[0007] a second outer plate, disposed on a side of the inner plate facing away from the first outer plate and covering the other end of the through hole;

[0008] A first electroplating bump is disposed between the inner layer board and the first outer layer board and surrounds the through hole;

[0009] A first conductive bump is sandwiched between the inner layer board and the first outer layer board and is disposed around the first electroplated bump;

[0010] a first adhesive layer, sandwiched between the inner layer board and the first outer layer board and located on a side of the first conductive bump away from the first electroplating bump;

[0011] A second electroplated bump is disposed between the inner layer board and the second outer layer board and surrounds the through hole;

[0012] A second conductive bump is sandwiched between the inner layer board and the second outer layer board and is disposed around the second electroplated bump;

[0013] a second adhesive layer, sandwiched between the inner layer board and the second outer layer board and located on a side of the second conductive bump away from the second electroplated bump;

[0014] Among them, the metal plating layer, the first electroplated bump, the first conductive bump, the first outer layer plate, the second electroplated bump, the second conductive bump and the second outer layer plate surround a cavity filled with air, and the radio wave transmission plate can use the air in the cavity as a conductive medium to transmit radio wave signals.

[0015] Another aspect of the present application provides a method for manufacturing a radio wave transmission plate, comprising the following steps:

[0016] Providing an inner layer board, wherein the inner layer board is provided with through holes penetrating two opposite sides thereof, and the hole walls of the through holes are formed with a metal plating layer;

[0017] Providing a first substrate, forming first electroplating bumps on one of the first substrate and the inner layer board by electroplating, and forming first conductive bumps on the other of the first substrate and the inner layer board by printing;

[0018] Providing a second substrate, forming second electroplating bumps on one of the second substrate and the first inner layer board by electroplating, and forming second conductive bumps on the other of the second substrate and the first inner layer board by printing;

[0019] Providing a first adhesive layer having a first opening and a second adhesive layer having a second opening, wherein the first opening is used for allowing the first conductive bump and the first electroplating bump to pass through, and the second opening is used for allowing the second conductive bump and the second electroplating bump to pass through;

[0020] The first substrate, the first adhesive layer, the inner layer, the second adhesive layer, and the second substrate are pressed together in sequence, wherein the first electroplated bump is located between the first substrate and the inner layer and is arranged around the through hole, the first conductive bump is sandwiched between the first substrate and the inner layer and is arranged around the first electroplated bump, the second electroplated bump is located between the second substrate and the inner layer and is arranged around the through hole, and the second conductive bump is sandwiched between the second substrate and the inner layer and is arranged around the through hole;

[0021] Circuits are fabricated on the first substrate and the second substrate respectively to obtain a first outer layer board and a second outer layer board.

[0022] In the radio wave transmission plate and its manufacturing method provided in the present application, by arranging the first conductive bump and the first electroplated bump between the inner layer plate and the first outer layer plate, the first adhesive layer can be effectively blocked from flowing into the cavity; by arranging the second conductive bump and the second electroplated bump between the inner layer plate and the second outer layer plate, the second adhesive layer can be effectively blocked from flowing into the cavity; and the first conductive bump, the first electroplated bump, the second conductive bump and the second electroplated bump define a partial cavity, which can effectively block the radio wave signal transmitted through the cavity. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1A This is a schematic cross-sectional view of the radio wave transmission plate provided in the first embodiment of the present application.

[0024] Figure 1B This is a schematic cross-sectional view of a radio wave transmission plate provided in the second embodiment of the present application.

[0025] Figure 2 A schematic cross-sectional view of a stacked structure provided in one embodiment of the present application.

[0026] Figure 3 For Figure 2 Schematic cross-section of the laminate structure after inner layer boards are formed.

[0027] Figure 4 For Figure 3 The cross-sectional view is shown after a first substrate and a second substrate are provided on both sides of the inner layer board respectively.

[0028] Figure 5A For Figure 4 The figure shows a cross-sectional view of the first substrate and the inner layer board after electroplating bumps are formed.

[0029] Figure 5B-1 This is a bottom view of the first substrate of the first embodiment of the present application.

[0030] Figure 5B-2 This is a bottom view of the first substrate according to the second embodiment of the present application.

[0031] Figure 5C For Figure 5A A cross-sectional schematic diagram of grooves formed on the inner layer plate and the second substrate is shown.

[0032] Figure 6 For Figure 5A The figure shows a cross-sectional view of conductive blocks formed by printing on the inner layer board and the second substrate.

[0033] Figure 7 for Figure 6 A top view of the second substrate is shown.

[0034] Figure 8 For the general Figure 6 The figure shows a cross-sectional view of the inner layer plate, the first substrate and the second substrate after being pressed together.

[0035] Figure 9 For Figure 8 Schematic cross-section of the structure after electroplating holes are formed.

[0036] Description of main component symbols

[0037] Radio wave transmission board 100

[0038] Inner board 10

[0039] First outer layer plate 20

[0040] Second outer layer plate 30

[0041] First adhesive layer 41

[0042] Second adhesive layer 42

[0043] First electroplating bump 51

[0044] Second electroplating bump 52

[0045] First conductive bump 61

[0046] Second conductive bump 62

[0047] First conductive layer 11

[0048] Second conductive layer 12

[0049] Insulation layer 13

[0050] The third conductive layer 14

[0051] Through hole 101

[0052] Metal coating 16

[0053] First shielding portion 111

[0054] The second shielding portion 121

[0055] First base 21

[0056] First conductive circuit layer 22

[0057] The second conductive circuit layer 23

[0058] First conductive structure 24

[0059] Second base 31

[0060] The third conductive circuit layer 32

[0061] Fourth conductive circuit layer 33

[0062] Second conductive structure 34

[0063] First groove 221

[0064] Second groove 321

[0065] Through hole 201

[0066] Filler 90

[0067] Plated hole 110

[0068] Active components 70

[0069] Antenna 80

[0070] The third groove 11a

[0071] Fourth grooves 12a, 32a

[0072] stacked structure 210

[0073] First metal layer 211

[0074] Second metal layer 212

[0075] First substrate 220

[0076] Second substrate 230

[0077] The third metal layer 222

[0078] Fourth metal layer 232

[0079] First opening 401

[0080] Second opening 402

[0081] The following specific implementation methods will further illustrate the present application in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0082] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0083] See also Figure 1AThe radio wave transmission plate 100 of one embodiment of the present application includes an inner layer plate 10, a first outer layer plate 20, a second outer layer plate 30, a first adhesive layer 41, a second adhesive layer 42, a first electroplated bump 51, a second electroplated bump 52, a first conductive bump 61, and a second conductive bump 62.

[0084] The inner layer board 10 includes a first conductive layer 11 and a second conductive layer 12 located on the outside, and an insulating layer 13 located between the first conductive layer 11 and the second conductive layer 12. The first conductive layer 11 and the second conductive layer 12 are arranged opposite each other. In some embodiments, the inner layer board 10 has a multi-layer board structure and may further include multiple third conductive layers 14 located between the first conductive layer 11 and the second conductive layer 12. Adjacent conductive layers in the inner layer board 10 are isolated by the insulating layer 13.

[0085] The inner layer board 10 is provided with a through hole 101, which extends through the first conductive layer 11, the second conductive layer 12, and the insulating layer 13. A metal coating 16 is provided on the sidewalls of the through hole 101. The first conductive layer 11 includes a first shielding portion 111 disposed adjacent to the through hole 101, and the second conductive layer 12 includes a second shielding portion 121 disposed adjacent to the through hole 101. The first shielding portion 111 and the second shielding portion 121 are respectively connected to the ends of the metal coating 16.

[0086] The first outer layer board 20 and the second outer layer board 30 are respectively disposed on the first conductive layer 11 and the second conductive layer 12, and cover opposite ends of the through hole 101. The first outer layer board 20, the second outer layer board 30 and the inner layer board 10 can be combined by stacking and pressing.

[0087] The first outer layer 20 includes a first base layer 21 and a first conductive circuit layer 22 and a second conductive circuit layer 23 disposed on opposite surfaces of the first base layer 21. The first outer layer 20 also includes a first conductive structure 24 that electrically connects the first conductive circuit layer 22 and the second conductive circuit layer 23. In this embodiment, the first conductive structure 24 is a conductive via.

[0088] The second outer layer 30 includes a second base layer 31 and a third conductive circuit layer 32 and a fourth conductive circuit layer disposed on opposite surfaces of the second base layer 31. The second outer layer 30 also includes a second conductive structure 34 that electrically connects the third conductive circuit layer 32 and the fourth conductive circuit layer 33. In this embodiment, the second conductive structure 34 is a conductive via.

[0089] The insulating layer 13, the first base layer 21, and the second base layer 31 can all be made of rigid materials, such as glass fiber prepreg, carbon fiber prepreg, epoxy resin, etc. The insulating layer 13, the first base layer 21, and the second base layer 31 can also be made of flexible materials, such as polyester, polyimide, etc.

[0090] The first electroplating bump 51 is disposed between the first conductive layer 11 and the first conductive circuit layer 22 and surrounds the through hole 101. The first electroplating bump 51 is formed on the first conductive circuit layer 22 by electroplating so that the first electroplating bump 51 is tightly bonded to the first conductive circuit layer 22, and the end of the first electroplating bump 51 away from the first conductive circuit layer 22 is in contact with or not in contact with the first conductive layer 11. The first conductive bump 61 surrounds the first electroplating bump 51 and is sandwiched between the first conductive layer 11 and the first conductive circuit layer 22. The first conductive bump 61 and the first electroplating bump 51 can be spaced apart or connected. The first conductive bump 61 is formed on the first conductive layer 11 by a printing process so that the first conductive bump 61 is tightly bonded to the first conductive layer 11, and a lamination process is performed so that the end of the first conductive bump 61 away from the first conductive layer 11 is in contact with the first conductive circuit layer 22. In this embodiment, the first conductive bump 61 is disposed on the first shielding portion 111 .

[0091] The second electroplated bump 52 is disposed between the second conductive layer 12 and the third conductive circuit layer 32 and surrounds the through hole 101. The second electroplated bump 52 is formed on the second conductive layer 12 by electroplating, tightly bonding the second electroplated bump 52 to the second conductive layer 12. The end of the second electroplated bump 52 facing away from the second conductive layer 12 may or may not contact the third conductive circuit layer 32. The second conductive bump 62 surrounds the second electroplated bump 52 and is sandwiched between the second conductive layer 12 and the third conductive circuit layer 32. The second conductive bump 62 and the second electroplated bump 52 may be spaced apart or connected. The second conductive bump 62 is formed on the third conductive circuit layer 32 by printing, tightly bonding the second conductive bump 62 to the third conductive circuit layer 32. The end of the second conductive bump 62 facing away from the third conductive circuit layer 32 contacts the second conductive layer 12 through a lamination process. In this embodiment, the second conductive bump 70 is disposed on the second shielding portion 121 .

[0092] In some embodiments, the radio wave transmission plate 100 may further include a plurality of first electroplated bumps 51, a plurality of second electroplated bumps 52, a plurality of first conductive bumps 61, and a plurality of second conductive bumps 62. The plurality of first electroplated bumps 51 are spaced apart from each other and arranged around the through-hole 101, the plurality of second electroplated bumps 52 are spaced apart from each other and arranged around the through-hole 101, the plurality of first conductive bumps 61 are spaced apart from each other and arranged around the plurality of first electroplated bumps 51, and the plurality of second conductive bumps 62 are spaced apart from each other and arranged around the plurality of second electroplated bumps 52.

[0093] In some embodiments, the thickness of the first electroplated bump 51 and the second electroplated bump 52 are both 30 μm to 80 μm, and the width is both 0.2 mm to 0.5 mm; the thickness of the first conductive bump 61 and the second conductive bump 62 are both 0.008 mm to 0.125 mm, and the width is 0.25 mm to 0.35 mm.

[0094] In some embodiments, the first conductive bump 61 and the second conductive bump 62 are made of conductive paste.

[0095] The first conductive circuit layer 22 of the first outer layer board 20, the first electroplated bumps 51, the first conductive bumps 61, the first shielding portion 111 of the first conductive layer 11, the metal plating layer 16, the second shielding portion 121 of the second conductive layer 12, the second electroplated bumps 52, the second conductive bumps 62, and the third conductive circuit layer 32 of the second outer layer board 30 surround and form a cavity 102. The medium contained in the cavity 102 is air, and the radio wave transmission board 10 can use the air in the cavity 102 as a conductive medium to transmit radio wave signals. The first electroplated bumps 51, the first conductive bumps 61, the first shielding portion 111, the metal plating layer 16, the second shielding portion 121, the second electroplated bumps 52, and the second conductive bumps 62 can block radio wave signals in the cavity 102, providing an electromagnetic shielding effect.

[0096] Since the first electroplated bump 51 is formed by electroplating on the first conductive circuit layer 22 of the first outer layer board 20, and the first conductive bump 61 is printed on the first conductive layer 11 of the inner layer board 10, the radio wave signal transmitted in the cavity 102 is not easily leaked from the joint between the first electroplated bump 51 and the first outer layer board 20 and the joint between the first conductive bump 61 and the inner layer board 10, thereby reducing the phenomenon of radio wave signal leakage from the space between the first outer layer board 20 and the inner layer board 10. Since the second electroplated bump 52 is formed by electroplating on the second conductive layer 12 of the inner layer board 10, and the second conductive bump 62 is printed on the third conductive circuit layer 32 of the second outer layer board 30, the radio wave signal transmitted in the cavity 102 is not easily leaked from the joint between the second electroplated bump 52 and the inner layer board 10 and the joint between the second conductive bump 62 and the second outer layer board 30, thereby reducing the phenomenon of radio wave signal leakage from the space between the second outer layer board 30 and the inner layer board 10.

[0097] In other embodiments, the first electroplated bump 51 may be formed by electroplating on the inner layer board 10, with the end thereof away from the inner layer board 10 being in contact or not in contact with the first outer layer board 20. Simultaneously, the first conductive bump 61 may be printed on the first outer layer board 20, with the end thereof away from the first outer layer board 20 being in contact with the inner layer board 10 via a lamination process. The second electroplated bump 52 may be formed by electroplating on the second outer layer board 30, with the end thereof away from the second outer layer board 30 being in contact or not in contact with the inner layer board 10. Simultaneously, the second conductive bump 62 may be printed on the inner layer board 10, with the end thereof away from the inner layer board 10 being in contact with the second outer layer board 30 via a lamination process.

[0098] The first conductive circuit layer 22 is provided with a first groove 221. A portion of the first base layer 21 is exposed through the first groove 221. The third conductive circuit layer 32 is provided with a second groove 321, which exposes a portion of the second base layer 31. Both the first groove 221 and the second groove 321 are connected to the cavity 102. The cavity 102 can receive and output a radio wave signal through the first groove 221 and the second groove 321, respectively.

[0099] The first adhesive layer 41 is disposed between the first outer layer board 20 and the inner layer board 10, and is located on the side of the first conductive bump 61 facing away from the first electroplated bump 51. The first adhesive layer 41 bonds the first outer layer board 20 and the inner layer board 10. The first adhesive layer 41 is blocked by the first conductive bump 50, preventing it from flowing into the cavity 102.

[0100] The second adhesive layer 42 is disposed between the second outer plate 30 and the inner plate 10 and is located on the side of the second conductive bump 62 facing away from the second plated bump 52. The second adhesive layer 42 bonds the second outer plate 30 and the inner plate 10. The second adhesive layer 42 is blocked by the second conductive bump 62 so as not to flow into the cavity 102.

[0101] The first outer plate 20 also defines a through-hole 201, which connects the cavity 102 to the external environment. During assembly of the radio wave transmission plate 100, air in the cavity 102 that expands due to high temperatures escapes through the through-hole 201 to the external environment. In this embodiment, the through-hole 201 communicates with the first groove 221.

[0102] The radio wave transmission plate 100 further includes a filling member 90 . The filling member 90 is filled in the through hole 201 to seal the cavity 102 .

[0103] The radio wave transmission plate 100 further includes a plated hole 110. The plated hole 110 sequentially passes through the first outer plate 20, the first adhesive layer 41, the inner plate 10, the second adhesive layer 42, and the second outer plate 30, and electrically connects the first outer plate 20, the inner plate 10, and the second outer plate 30.

[0104] The radio wave transmission board 100 also includes an active element 70 and an antenna 80. The active element 70 is disposed on the second conductive circuit layer 23. The antenna 80 is disposed on the surface of the second base layer 31 facing away from the inner layer board 10 and is electrically connected to the fourth conductive circuit layer 33. External radio wave signals received by the antenna 80 are transmitted to the active element 70 through the cavity 102, and radio wave signals emitted by the active element 70 are transmitted to the antenna 80 through the cavity 102. In some embodiments, the positions of the active element 70 and the antenna 80 both correspond to the positions of the cavity 102. The antenna 80 may be a patch antenna.

[0105] See also Figure 1BIn some embodiments, a third groove 11a is provided on the first conductive layer 11, and a fourth groove 12a is provided on the second conductive layer 12. Both the third groove 11a and the fourth groove 12a can expose a portion of the insulating layer 13. The first conductive bump 61 and the second conductive bump 62 are printed on the first conductive layer 11 and the second conductive layer 12, respectively. The first electroplated bump 51 is electroplated on the first conductive circuit layer 22, with its end facing away from the first outer layer 20 accommodated in the third groove 11a to further prevent the first adhesive layer 41 from flowing into the cavity 102. The second electroplated bump 52 is electroplated on the third conductive circuit layer 32, with its end facing away from the second outer layer 30 accommodated in the fourth groove 12a to further prevent the second adhesive layer 42 from flowing into the cavity 102. The widths of the first and second electroplated bumps 51, 52 may be greater than 0.15 mm to 0.25 mm.

[0106] The embodiment of the present application further provides a method for manufacturing the radio wave transmission plate 100 , which includes the following steps.

[0107] Step S1, see Figure 2 , providing a stacked structure 210. The stacked structure 210 includes a first metal layer 211, a second metal layer 212, and a plurality of third conductive layers 14 and a plurality of insulating layers 13 located between the first metal layer 211 and the second metal layer 212. The insulating layers 13 isolate the third conductive layers 14 from each other and isolate the third conductive layers 14 from the first metal layer 211 and the second metal layer 212.

[0108] Step S2, see Figure 3 A through hole 101 is formed in the stacked structure, circuits are fabricated on the first and second metal layers to form a first conductive layer 11 and a second conductive layer 12, and the hole walls of the through hole 101 are electroplated to form a metal plating layer 16, thereby obtaining an inner layer board 10. The first conductive layer 11 includes a first shielding portion 111 disposed adjacent to the through hole 101, and the second conductive layer 12 includes a second shielding portion 121 disposed adjacent to the through hole 101.

[0109] Step S3, see Figure 4 A first substrate 220 and a second substrate 230 are provided on opposite sides of the inner layer board 10 .

[0110] The first substrate 220 includes a first base layer 21, a first conductive circuit layer 22 disposed on one side of the first base layer 21, and a third metal layer 222 disposed on the other side of the first base layer 21. A first groove 221 is formed on the first conductive circuit layer 22, exposing a portion of the first base layer 21.

[0111] The second substrate 230 includes a second base layer 31, a third conductive circuit layer 32 disposed on one side of the second base layer 31, and a fourth metal layer 232 disposed on the other side of the second base layer 31. A second groove 321 is formed on the third conductive circuit layer 32, exposing a portion of the second base layer 31.

[0112] Step S4, see Figure 5A , a first electroplating bump 51 is formed on the first conductive circuit layer 22 by electroplating, and a second electroplating bump 52 is formed on the second conductive layer 12 by electroplating.

[0113] See also Figure 5B-1 The first electroplating bump 51 is arranged in a ring shape on the first conductive circuit layer 22. The second electroplating bump is also arranged in a ring shape on the second conductive layer.

[0114] See also Figure 5B-2 The first conductive circuit layer 22 is electroplated to form a plurality of first electroplated bumps 51 arranged in a ring shape. The second conductive layer is also electroplated to form a plurality of second electroplated bumps arranged in a ring shape.

[0115] See also Figure 5C A third groove 11a is formed on the first conductive layer 11, and a fourth groove 32a is formed on the third conductive circuit layer 32. The third groove 11a is used to accommodate a portion of the first electroplated bump 51, and the fourth groove 32a is used to accommodate a portion of the second electroplated bump 52.

[0116] Step S5, see Figure 6 , a first conductive bump 61 and a second conductive bump 62 are printed on the first conductive layer 11 and the third conductive circuit layer 32 respectively. The first conductive bump 61 and the second conductive bump 62 are ring-shaped. Figure 7 A plurality of second conductive bumps 62 are printed on the third conductive circuit layer 32. The plurality of second conductive bumps 62 are spaced apart and arranged in a ring. The first conductive layer can also be electroplated to form a plurality of first conductive bumps 61 spaced apart and arranged in a ring.

[0117] Step S6, see Figure 8A first adhesive layer 41 and a second adhesive layer 42 are provided, and the first substrate 220, the first adhesive layer 41, the inner layer 10, the second adhesive layer 42, and the second substrate 230 are sequentially pressed together. The first adhesive layer 41 has a first opening 401 to allow the first conductive bump 61 and the first electroplated bump 51 to pass through during pressing. The second adhesive layer 42 has a second opening 402 to allow the second conductive bump 62 and the second electroplated bump 52 to pass through during pressing.

[0118] After lamination, the first electroplated bump 51 is disposed around the through-hole 101, the first conductive bump 61 is disposed around the first electroplated bump 51, and the end of the first conductive bump 61 away from the inner layer board 10 contacts the first conductive circuit layer 22. The second electroplated bump 52 is disposed around the through-hole 101, the second conductive bump 62 is disposed around the second electroplated bump 61, and the end of the second conductive bump 62 away from the second substrate 230 contacts the second conductive layer 12. The first conductive circuit layer 22, the first electroplated bump 51, the first conductive bump 61, the first shielding portion 111 of the first conductive layer 11, the metal plating layer 16, the second shielding portion 121 of the second conductive layer 12, the second electroplated bump 52, the second conductive bump 62, and the third conductive circuit layer 32 surround and form a cavity 102.

[0119] Step S7, see Figure 9 , the third metal layer of the first substrate and the fourth metal layer of the second substrate are circuit-made to form a second conductive circuit layer 23 and a fourth conductive circuit layer 33 respectively, to obtain a first outer layer board 20 and a second outer layer board 30; and electroplated holes 110 are formed that sequentially pass through the first outer layer board 20, the first adhesive layer 41, the inner layer board 10, the second adhesive layer 42, and the second outer layer board 30.

[0120] Step S8, see Figure 1A A through hole 201 is formed on the first outer layer board 20 , and the active element 70 and the antenna 80 are assembled on the first outer layer board 20 and the second outer layer board 30 respectively, to obtain the radio wave transmission board 100 .

[0121] In the radio wave transmission plate 100 and its manufacturing method provided in the embodiment of the present application, the first conductive bumps 61 and the first electroplated bumps 51 are provided to effectively prevent the first adhesive layer 41 from flowing into the cavity 102. The second conductive bumps 62 and the second electroplated bumps 52 are provided to effectively prevent the second adhesive layer 42 from flowing into the cavity 102. One of the first conductive bump 61 and the first electroplated bump 51 is directly formed on one of the inner layer board 10 and the first outer layer board 20, and the other is directly formed on the other of the inner layer board 10 and the first outer layer board 20; one of the second conductive bump 62 and the second electroplated bump 52 is directly formed on one of the inner layer board 10 and the second outer layer board 30, and the other is directly formed on the other of the inner layer board 10 and the second outer layer board 30, which can reduce the risk of the radio wave signal transmitted in the cavity 102 leaking from the space between the inner layer board 10 and the first outer layer board 20 / the second outer layer board 30.

[0122] The above disclosure is only a preferred embodiment of the present application and certainly cannot be used to limit the present application. Therefore, equivalent changes made based on the present application are still within the scope covered by the present application.

Claims

1. A radio wave transmission plate, characterized in that: include: The inner layer plate is provided with a through hole, and the hole wall of the through hole is provided with a metal plating layer; a first outer plate, disposed on one side of the inner plate and covering one end of the through hole; a second outer plate, disposed on a side of the inner plate facing away from the first outer plate and covering the other end of the through hole; A first electroplating bump is disposed between the inner layer board and the first outer layer board and surrounds the through hole; A first conductive bump is sandwiched between the inner layer board and the first outer layer board and is disposed around the first electroplated bump; a first adhesive layer, sandwiched between the inner layer board and the first outer layer board and located on a side of the first conductive bump away from the first electroplating bump; A second electroplated bump is disposed between the inner layer board and the second outer layer board and surrounds the through hole; A second conductive bump is sandwiched between the inner layer board and the second outer layer board and is disposed around the second electroplated bump; a second adhesive layer, sandwiched between the inner layer board and the second outer layer board and located on a side of the second conductive bump away from the second electroplated bump; Among them, the metal plating layer, the first electroplated bump, the first conductive bump, the first outer layer plate, the second electroplated bump, the second conductive bump and the second outer layer plate surround a cavity filled with air, and the radio wave transmission plate can use the air in the cavity as a conductive medium to transmit radio wave signals.

2. The radio wave transmission plate according to claim 1, wherein: The inner layer board includes a first conductive layer, a second conductive layer and an insulating layer located between the first conductive layer and the second conductive layer; the first outer layer board includes a first base layer and a first conductive circuit layer and a second conductive circuit layer arranged on two opposite surfaces of the first base layer; the two ends of the first conductive bump are respectively connected to the first conductive layer and the first conductive circuit layer.

3. The radio wave transmission plate according to claim 2, wherein: The second outer layer includes a second base layer and a third conductive circuit layer and a fourth conductive circuit layer provided on two opposite surfaces of the second base layer. Two ends of the second conductive bump are respectively connected to the second conductive layer and the third conductive circuit layer.

4. The radio wave transmission plate according to claim 3, wherein: The first conductive circuit layer is provided with a first groove exposing a portion of the first base layer, and the first groove is connected to the cavity; the third conductive circuit layer is provided with a second groove exposing a portion of the second base layer, and the second groove is connected to the cavity.

5. The radio wave transmission plate according to claim 3, wherein: A third groove is provided on the first conductive layer or the first conductive circuit layer, and one end of the first electroplated bump is accommodated in the third groove; a fourth groove is provided on the second conductive layer or the third conductive circuit layer, and one end of the second electroplated bump is accommodated in the fourth groove.

6. The radio wave transmission plate according to claim 1, wherein: The radio wave transmission plate includes a plurality of first electroplated bumps, which are arranged at intervals around the through holes; or, the radio wave transmission plate includes a plurality of first conductive bumps, which are arranged at intervals around the first electroplated bumps; or, the radio wave transmission plate includes a plurality of second electroplated bumps, which are arranged at intervals around the through holes; or, the radio wave transmission plate includes a plurality of second conductive bumps, which are arranged at intervals around the second electroplated bumps.

7. The radio wave transmission plate according to claim 1, wherein: A through hole is formed on the first outer plate, the through hole connects the cavity with the external environment, and a filling piece is provided in the through hole to seal the cavity.

8. The radio wave transmission plate according to claim 1, wherein: The radio wave transmission plate further includes an active element and an antenna, which are respectively arranged on the side of the first outer plate and the second outer plate facing away from the inner plate, and the positions of the active element and the antenna correspond to the position of the cavity.

9. A method for manufacturing a radio wave transmission plate, characterized in that: The following steps are involved: Providing an inner layer board, wherein the inner layer board is provided with through holes penetrating two opposite sides thereof, and the hole walls of the through holes are formed with a metal plating layer; Providing a first substrate, forming first electroplating bumps on one of the first substrate and the inner layer board by electroplating, and forming first conductive bumps on the other of the first substrate and the inner layer board by printing; Providing a second substrate, forming second electroplating bumps on one of the second substrate and the inner layer board by electroplating, and forming second conductive bumps on the other of the second substrate and the inner layer board by printing; Providing a first adhesive layer having a first opening and a second adhesive layer having a second opening, wherein the first opening is used for allowing the first conductive bump and the first electroplating bump to pass through, and the second opening is used for allowing the second conductive bump and the second electroplating bump to pass through; The first substrate, the first adhesive layer, the inner layer, the second adhesive layer, and the second substrate are pressed together in sequence, wherein the first electroplated bump is located between the first substrate and the inner layer and is arranged around the through hole, the first conductive bump is sandwiched between the first substrate and the inner layer and is arranged around the first electroplated bump, the second electroplated bump is located between the second substrate and the inner layer and is arranged around the through hole, and the second conductive bump is sandwiched between the second substrate and the inner layer and is arranged around the through hole; Circuits are fabricated on the first substrate and the second substrate respectively to obtain a first outer layer board and a second outer layer board.

10. The method for manufacturing the radio wave transmission plate according to claim 9, wherein: Also includes: forming a first groove on one of the first substrate and the inner layer board where the first electroplated bump is not formed, wherein one end of the first electroplated bump is accommodated in the first groove; A second groove is formed on one of the second substrate and the inner layer board where the second electroplating bump is not formed, and one end of the second electroplating bump is accommodated in the second groove.

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