Laser-induced surface metallization glass fiber reinforced polyether-ether-ketone modified material and preparation method thereof
By adding Cu-Ni coordination compounds to PEEK materials and embedding a conductive layer using laser-induced technology, the problem of insufficient adhesion of metallized coatings on the surface of PEEK materials is solved, achieving electromagnetic shielding effects with high adhesion and low dielectric loss, which is suitable for lightweight communication equipment.
Patent Information
- Application Number
- CN202510830366.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-06-20
- Publication Date
- 2025-11-11
AI Technical Summary
The adhesion of the metallized coating on the surface of existing PEEK materials is weak, and it is easy to peel off, especially in extreme environments, which affects the electromagnetic shielding effect and communication signal transmission.
Cu+ and Ni+ ions are generated in PEEK material by laser-induced generation of Cu-Ni coordination compounds, and embedded into the PEEK substrate through electroplating to form an embedded conductive layer. Combined with low dielectric filler and antioxidant, the coating adhesion is improved and the material properties are maintained.
It significantly improves the adhesion of metal coatings, maintains the lightweight and high performance of materials, reduces signal transmission loss, and ensures stability and electromagnetic shielding effect in extreme environments.