An optical module

Abstract

The present application discloses an optical module, comprising: a circuit board, on which are arranged: a gold finger, a register, an MCU, a first field effect transistor, and a second field effect transistor. The gate of the first field effect transistor is connected to the first power pin of the gold finger, and is connected to the operating voltage of the optical module, the source is connected to the second power pin of the gold finger, and the drain is connected to the start pin of the register. The gate of the second field effect transistor is connected to the MCU power supply pin, the source is grounded, and the drain is connected to the source of the first field effect transistor. When the voltage of the second power pin is a high voltage, the start pin is connected to the second power pin, and the potential of the start pin is close to the high potential of the threshold. At this time, the first communication pin and the second communication pin on the gold finger are used for I2C communication, so that the firmware application is written to the register without having to disassemble the optical module, thereby improving work efficiency. When the voltage of the second power pin is a low voltage, the first communication pin and the second communication pin are not used for I2C communication.

Description

Technical Field

[0001] The present application relates to the field of communication technology, and in particular to an optical module. Background Art

[0002] With the development of new services and applications such as cloud computing, mobile internet, and video, the advancement of optical communication technology has become increasingly important. In optical communication technology, optical modules are tools for converting optical and electrical signals, and are key components in optical communication equipment. Furthermore, the transmission rates of optical modules are constantly increasing as optical communication technology evolves.

[0003] Optical modules contain a circuit board with multiple functional chips installed to implement different functions. Currently, programming or erasing these chips requires first disassembling the module to expose the circuit board, then using external probes or other tools to make electrical connections. This disassembly process can easily damage the module, affecting its communication performance. Summary of the Invention

[0004] The present application provides an optical module to realize burning, erasing or maintenance of firmware application programs in a circuit board.

[0005] In order to solve the above technical problems, the embodiments of the present application disclose the following technical solutions:

[0006] The present application discloses an optical module, including:

[0007] A circuit board with a gold finger at one end;

[0008] The gold finger is provided with a plurality of pins, including: a first power pin, a second power pin, a third communication pin and a fourth communication pin, wherein the first power pin is connected to the working power voltage of the optical module;

[0009] The register is provided on the circuit board and includes: a start pin for receiving a start voltage signal;

[0010] a first field effect transistor, disposed on the circuit board, with a gate connected to the first power pin, a source connected to the second power pin, and a drain connected to the start pin;

[0011] a second field effect transistor, disposed on the circuit board, with a source connected to the ground and a drain connected to the second power pin;

[0012] The MCU is provided on the circuit board and includes: a power supply pin, a first communication pin, and a second communication pin, wherein the power supply pin is connected to the gate of the second field effect transistor, the third communication pin is connected to the first communication pin, and the fourth communication pin is connected to the second communication pin;

[0013] When the voltage of the second power pin is at a high level, the first communication pin and the second communication pin are used for I2C communication; when the voltage of the second power pin is at a low level, the first communication pin and the second communication pin are not used for I2C communication.

[0014] Compared with the prior art, the present invention has the following advantages:

[0015] The present application discloses an optical module, comprising: a circuit board having a gold finger disposed at one end; the gold finger being provided with a first power pin, a second power pin, a third communication pin, and a fourth communication pin, wherein the first power pin is connected to the optical module's operating power supply voltage. A register includes a start pin for receiving a start voltage signal. A first field-effect transistor is disposed on the circuit board, with its gate connected to the first power pin, its source connected to the second power pin, and its drain connected to the start pin. A second field-effect transistor is disposed on the circuit board, with its source connected to ground and its drain connected to the second power pin. An MCU includes a power pin, a first communication pin, and a second communication pin, wherein the power pin is connected to the gate of the second field-effect transistor, the third communication pin is connected to the first communication pin, and the fourth communication pin is connected to the second communication pin. When the voltage of the second power pin is high, the first and second communication pins are used for I2C communication; when the voltage of the second power pin is low, the first and second communication pins are not used for I2C communication. When the power voltage connected to the second power pin of the gold finger is greater than the threshold range, the first field effect transistor is in the on state, the register start pin and the second power line are also fully conductive, and the potential of the register start pin is pulled to a high potential close to the threshold, starting the register. At this time, by connecting the relevant pins of the gold finger to the communication line of the tool for firmware burning and maintenance, the register firmware application can be burned, erased, etc., and the firmware application can be written to the register without having to disassemble the optical module. The operation is convenient and the work efficiency is improved. It avoids the use of probes to connect with external tools, resulting in low work efficiency, and improves the production yield of the optical module. The setting of the second field effect transistor is such that when the power voltage connected to the second power pin is too high, the gate output voltage of the second field effect transistor is low voltage, which avoids damage to other functional chips on the circuit board due to excessively high voltage being loaded on the second power pin.

[0016] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solution of the present application, the following is a brief introduction to the drawings required for use in the embodiments. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0018] Figure 1 Schematic diagram of the connection relationship of optical communication terminals;

[0019] Figure 2 This is a schematic diagram of the optical network terminal structure;

[0020] Figure 3 A schematic diagram of the structure of an optical module provided in an embodiment of the present application;

[0021] Figure 4 A schematic diagram of the decomposed structure of an optical module provided in an embodiment of the present application;

[0022] Figure 5 This is a schematic diagram of the circuit board structure in the embodiment of this application;

[0023] Figure 6 A circuit diagram provided in an embodiment of the present application;

[0024] Figure 7 A schematic diagram of the internal circuit connections of an optical module provided in an embodiment of the present application. DETAILED DESCRIPTION

[0025] To facilitate the explanation of the technical solution of the application, some concepts involved in this application are first explained below.

[0026] In this specification, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises", "includes" or any other variations thereof are intended to cover non-exclusive inclusion, so that a circuit structure, article or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such circuit structure, article or device. In the absence of further limitations, the phrase "comprises a ..." to define an element does not exclude the presence of other identical elements in the circuit structure, article or device comprising the element.

[0027] In order to enable those skilled in the art to better understand the technical solutions in this application, the technical solutions in the embodiments of this application will be clearly and completely described below in conjunction with the drawings in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts should fall within the scope of protection of this application.

[0028] One of the core aspects of fiber-optic communications is the conversion between optical and electrical signals. Fiber-optic communications uses optical signals, carrying information, to transmit through information transmission equipment such as optical fibers and optical waveguides. Leveraging the passive transmission properties of light within optical fibers and optical waveguides, this technology enables low-cost, low-loss information transmission. Computers and other information processing devices, on the other hand, use electrical signals. Establishing an information connection between optical fibers and optical waveguides requires conversion between electrical and optical signals.

[0029] In the field of fiber-optic communications, optical modules implement the aforementioned conversion between optical and electrical signals. This conversion is the core function of optical modules. Optical modules use gold fingers on their internal circuit boards to achieve electrical connections with external host computers. Key electrical connections include power supply, I2C signals, data information, and grounding. This electrical connection method, achieved using gold fingers, has become the mainstream connection method in the optical module industry, and the definition of the gold finger pins has formed a variety of industry protocols and specifications.

[0030] Figure 1 Figure 1 is a schematic diagram of the connection relationship of optical communication terminals. Figure 1 As shown, the connection of the optical communication terminal mainly includes the mutual connection between the optical network terminal 100, the optical module 200, the optical fiber 101 and the network cable 103.

[0031] One end of the optical fiber 101 is connected to the remote server, and one end of the network cable 103 is connected to the local information processing device. The connection between the local information processing device and the remote server is completed by the connection between the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is completed by the optical network terminal 100 with the optical module 200.

[0032] The optical port of optical module 200 connects to optical fiber 101, establishing a bidirectional optical signal connection with optical fiber 101. The electrical port of optical module 200 connects to optical network terminal 100, establishing a bidirectional electrical signal connection with optical network terminal 100. Conversion between optical and electrical signals is achieved within the optical module, thereby establishing an information connection between the optical fiber and the optical network terminal. Specifically, the optical module converts optical signals from the optical fiber into electrical signals before inputting them into optical network terminal 100. Similarly, the optical module converts electrical signals from the optical network terminal 100 into optical signals before inputting them into the optical fiber.

[0033] The optical network terminal has an optical module interface 102 for connecting to an optical module 200 and establishing a bidirectional electrical signal connection with the optical module 200. The optical network terminal also has a network cable interface 104 for connecting to a network cable 103 and establishing a bidirectional electrical signal connection with the network cable 103. The optical module 200 and the network cable 103 are connected via the optical network terminal 100. Specifically, the optical network terminal transmits signals from the optical module to the network cable and vice versa. The optical network terminal acts as a host computer for the optical module, monitoring its operation.

[0034] At this point, a two-way signal transmission channel is established between the remote server and the local information processing device through optical fibers, optical modules, optical network terminals and network cables.

[0035] Common information processing equipment includes routers, switches, and electronic computers. The optical network terminal is the host computer of the optical module, providing data signals to the optical module and receiving data signals from the optical module. Common optical module host computers also include optical line terminals.

[0036] Figure 2 Figure 1 is a schematic diagram of the optical network terminal structure. Figure 2 As shown, the optical network terminal 100 has a circuit board 105, and a cage 106 is set on the surface of the circuit board 105; an electrical connector is set inside the cage 106 for connecting to the electrical port of the optical module such as the gold finger; a heat sink 107 is set on the cage 106, and the heat sink 107 has protrusions such as fins to increase the heat dissipation area.

[0037] The optical module 200 is inserted into the optical network terminal 100 . Specifically, the electrical port of the optical module is inserted into the electrical connector inside the cage 106 , and the optical port of the optical module is connected to the optical fiber 101 .

[0038] The cage 106 is located on the circuit board, enclosing the electrical connector on the circuit board in the cage, so that the electrical connector is provided inside the cage; the optical module is inserted into the cage, and the cage fixes the optical module. The heat generated by the optical module is transferred to the cage 106 and then diffused through the heat sink 107 on the cage.

[0039] Figure 3A schematic diagram of the structure of an optical module provided in an embodiment of the present application is shown. Figure 4 The embodiment of the present application provides a schematic diagram of the optical module decomposition structure. Figure 3 、 Figure 4 As shown, the optical module 200 provided in the embodiment of the present application includes an upper shell 201, a lower shell 202, an unlocking component 203, a circuit board 300 and an optical transceiver assembly.

[0040] The upper shell 201 covers the lower shell 202 to form a package cavity with two openings; the outer contour of the package cavity is generally square. Specifically, the lower shell 202 includes a main board and two side panels located on either side of the main board and arranged perpendicularly to the main board. The upper shell includes a cover plate, which covers the two side panels of the upper shell to form the package cavity. The upper shell may also include two side walls located on either side of the cover plate and arranged perpendicularly to the cover plate. The two side walls and the two side panels are combined to enable the upper shell 201 to cover the lower shell 202.

[0041] The two openings can be two end openings (204, 205) in the same direction, or two openings in different directions; one of the openings is an electrical port 204, and the gold finger of the circuit board extends from the electrical port 204 and is inserted into a host computer such as an optical network terminal; the other opening is an optical port 205, which is used for external optical fiber access to connect to the optical transceiver component inside the optical module; the circuit board 300, the optical transceiver component and other optoelectronic devices are located in the encapsulated cavity.

[0042] The upper shell and the lower shell are combined to facilitate the installation of components such as the circuit board 300 and the optical transceiver assembly into the shell. The upper shell and the lower shell form the outermost packaging protection shell of the module. The upper shell and the lower shell are generally made of metal materials to achieve electromagnetic shielding and heat dissipation. The shell of the optical module is generally not made into an integrated component. In this way, when assembling components such as circuit boards, the positioning components, heat dissipation and electromagnetic shielding components cannot be installed, which is not conducive to production automation.

[0043] The unlocking component 203 is used to realize a fixed connection between the optical module and the host computer, or to release the fixed connection between the optical module and the host computer.

[0044] The unlocking component 203 has a locking component that matches the cage of the host computer; pulling the end of the unlocking component can make the unlocking component move relative to the surface of the outer wall; the optical module is inserted into the cage of the host computer, and the locking component of the unlocking component fixes the optical module in the cage of the host computer; by pulling the unlocking component, the locking component of the unlocking component moves accordingly, thereby changing the connection relationship between the locking component and the host computer, thereby releasing the locking relationship between the optical module and the host computer, so that the optical module can be pulled out of the cage of the host computer.

[0045] The circuit board 300 is provided with circuit traces, electronic components (such as capacitors, resistors, transistors, MOS tubes) and chips (such as MCU, laser driver chip, limiting amplifier chip, clock data recovery CDR, power management chip, data processing chip DSP), etc.

[0046] The circuit board 300 connects the electrical components in the optical module according to the circuit design through circuit routing to achieve electrical functions such as power supply, electrical signal transmission and grounding.

[0047] Circuit boards are generally rigid circuit boards. Due to their relatively hard material, rigid circuit boards can also perform load-bearing functions. For example, rigid circuit boards can stably carry chips. When optical transceiver components are located on the circuit board, the rigid circuit board can also provide stable load-bearing. The rigid circuit board can also be inserted into the electrical connector in the host computer cage. Specifically, metal pins / gold fingers are formed on the end surface of one side of the rigid circuit board for connection to the electrical connector. These are not easy to achieve with flexible circuit boards.

[0048] The gold finger end of the circuit board is located at the electrical port, which is connected to the host computer to achieve communication. The gold finger is connected to each functional chip on the circuit board through circuit traces.

[0049] Flexible circuit boards are also used in some optical modules as a supplement to rigid circuit boards. Flexible circuit boards are generally used in conjunction with rigid circuit boards. For example, flexible circuit boards can be used to connect rigid circuit boards to optical transceiver components.

[0050] The optical transceiver assembly includes two parts: an optical transmitter 400 and an optical receiver, which are used to transmit and receive optical signals, respectively. An optical transmitter generally includes an optical transmitter, a lens, and a photodetector, with the lens and photodetector located on different sides of the optical transmitter. Light beams are emitted from the front and back sides of the optical transmitter. The lens is used to converge the light beam emitted from the front of the optical transmitter, making the light beam emitted by the optical transmitter convergent to facilitate coupling to an external optical fiber. The photodetector is used to receive the light beam emitted from the back of the optical transmitter to detect the optical power of the optical transmitter. Specifically, the light emitted by the optical transmitter is converged by the lens and then enters the optical fiber. At the same time, the photodetector detects the luminous power of the optical transmitter to ensure the constancy of the light power emitted by the optical transmitter.

[0051] In the field of fiber-optic communications, optical modules convert optical and electrical signals. This conversion is the core function of optical modules. Optical modules use gold fingers on their internal circuit boards to establish electrical connections with external host computers. These connections primarily include power supply, I2C signals, data transmission, and grounding. This electrical connection method, achieved using gold fingers, has become the mainstream in the optical module industry, and the pin definitions for these gold fingers have led to various industry protocols and specifications.

[0052] The MCU 301 is arranged on a circuit board, and its different functional pins are connected to the gold fingers 302 through circuit traces to realize functions.

[0053] Currently, a typical gold finger definition for optical modules is to define the communication ports as P11 (SCL) and P12 (SDA). P49 and P50 are undefined. In principle, module manufacturers can define P49 and P50 for communication functions required during module development and production, such as reading, writing, and modifying the module's internal program. However, in actual optical module applications, when the module is plugged into a host computer, the status of P49 and P50 can interfere with SCL (P11) and SDA (P12) communications, thereby disrupting the status of other optical modules operating normally on the host computer and causing bit errors in the normal communication channels. To avoid this problem, the use of P49 and P50 should be avoided as much as possible. A common method is to use a metal probe to connect the required circuit nodes. However, a major drawback of this method is that it requires the module cover to be opened, which is complex, requires high equipment requirements, and is inefficient. The above P11, P12, P49, and P50 are only an exemplary description of the gold finger pins on the circuit board, and are defined according to the commonly used position definition method. For example, P11 represents the eleventh pin of the gold finger from a certain end.

[0054] Figure 5 This is a schematic diagram of the circuit board structure in an embodiment of the present application. Figure 6 A circuit diagram provided in an embodiment of the present application. Figure 5 and Figure 6 As shown, to solve the above problems, the present application provides an optical module, including: a first field-effect transistor 303, arranged on a circuit board, with its gate connected to a first power line for receiving a constant first power supply voltage; a source connected to a second power line; and a drain connected to a register enable pin. A second field-effect transistor 304, arranged on a circuit board, with its gate connected to an MCU power supply pin; a source connected to ground; and a drain connected to the source of the first field-effect transistor. The first power line is connected to the first power pin, and the second power line is connected to the second power pin of the gold finger.

[0055] The MCU is provided with a first communication pin and a second communication pin, which are respectively connected to the third communication pin and the fourth communication pin of the gold finger.

[0056] As in the embodiment of the present application: first communication pin: FB6, LPMode;

[0057] Second communication pin: FB7, ResetL;

[0058] The third communication pin: P31, LPMode;

[0059] Fourth communication pin: P9, ResetL.

[0060] The connection between the first field effect transistor 303, the second field effect transistor 304 and the register, the MCU, the gold finger pins, and other functional chips is achieved through circuit traces in the circuit board.

[0061] In the optical module provided by the present application, the power supply voltage connected to the first power pin of the gold finger is the power supply voltage of the optical module, which is a constant voltage, usually 3.3V. When the power supply voltage connected to the second power pin of the gold finger is greater than the threshold range, the first field effect tube is in the on state, the register start pin and the second power line are also fully conductive, and the potential of the register start pin is pulled to a high potential close to the threshold to start the register. At this time, the third communication pin and the fourth communication pin of the gold finger are connected to the communication connection with the firmware burning and maintenance tools, so that the burning, erasing, etc. of the register firmware application can be realized. When the voltage connected to the second power pin of the gold finger is the normal operating voltage of the optical module, such as 3.3V or less than 3.3V, the first field effect tube is in the off state and the register is not written. At the same time, the MCU enters the normal working state.

[0062] Therefore, the optical module provided by the embodiment of the present application only needs to connect the second power pin of the circuit board gold finger to the external power supply during the production and maintenance stage, and connect the third communication pin and the fourth communication pin to the I2C bus of the external tool respectively, so as to realize writing the firmware application into the register, without having to disassemble the optical module, which is convenient for operation and improves work efficiency. It avoids the need to disassemble the optical module and use a probe to connect it to the external tool when the firmware application needs to be burned or erased, resulting in low work efficiency and affecting the service life of the optical module. The setting of the second field effect transistor is such that when the power supply voltage connected to the second power pin is too high, the gate output voltage of the second field effect transistor is low voltage, which avoids damage to other functional chips on the circuit board due to excessive voltage being loaded on the second power pin.

[0063] In the embodiment provided herein, a second resistor is further provided, one end of which is connected to the drain of the first field-effect transistor and the other end of which is connected to the register enable pin. Specifically, the second resistor is a variable resistor for adjusting the voltage output to the register enable pin to a specific value.

[0064] Figure 7 This is a schematic diagram of the internal circuit connection of an optical module provided in an embodiment of the present application. Figure 7As shown, in some embodiments provided in the present application, the register may be an independent memory external to the MCU, or a memory built into the MCU. In the present application, the register is a memory built into the MCU, and the MCU can read and write to the register. In some embodiments provided in the present application, when the optical module is connected to an external power supply and a special tool, the electrical signal input from the second power pin of the gold finger is output to the register start pin through the drain of the first field effect transistor, the register is started, and the firmware application written to the register by the special tool via the I2C data bus and the MCU is received. After the optical module is reconnected to the host computer, the MCU can execute the firmware application.

[0065] In some embodiments provided herein, the gate of the second field-effect transistor is also connected to the power pin of other functional chips, such as the limiting amplifier chip and the laser driver chip, to supply power to the other functional chips. The specific voltage can be determined based on the operating voltage of each chip in the actual optical module.

[0066] To achieve I2C communication under normal working conditions, the MCU sets other communication pins, such as the fifth communication pin: PB8, SCL and the sixth communication pin PB9, SDA. The gold finger sets the seventh communication pin and the eighth communication pin, which are respectively connected to the fifth communication pin and the sixth communication pin to achieve the I2C communication function. In the embodiment provided in this application, the input voltage of the first power pin is 3.3V, and the first field effect transistor and the second field effect transistor are both MOS tubes, and their models and specifications are different. Specifically, the first field effect transistor can be DMP32D4SFB, and the second field effect transistor can be DMN21D2UFB.

[0067] In the embodiments provided herein, a first resistor is further provided, one end of which is connected to the gate of the second field-effect transistor and the other end is grounded. The first resistor is provided to limit current, preventing damage to the functional chips caused by excessive current, thereby improving the service life of the optical module. Specifically, in the embodiments of the present application, the first resistor is a fixed-value resistor with a resistance of 10K.

[0068] In some embodiments provided herein, the MCU model is SMT32. To achieve current limiting for the register, the register enable pin is further connected to a third resistor, wherein the other end of the third resistor is grounded.

[0069] The working principle of the circuit design provided in the embodiment of the present application is as follows:

[0070] a: When the potential of the second power pin on the gold finger is lower than 3.3V, the first field effect transistor is in the disconnected state, and the register enable pin and the second power pin are also completely disconnected. The register enable pin maintains its original low level and is not affected by the voltage of the second power pin.

[0071] b: When the second power pin on the gold finger is connected to a power supply with a voltage of 5.8V or above, the first field effect transistor is in the on state, the register enable pin and the second power pin are also fully conductive, and the potential of the register enable pin is pulled to a high potential close to 5.8V.

[0072] c) Inside the optical module's circuit board, the second FET is an inverter. The inverted signal from the second power pin is connected to the gate of the second FET, which is then connected to the corresponding port of each functional chip for control. When the second power pin is connected to a power source of 5.8V or higher, the gate of the second FET outputs a low level. When the second power pin is low, the gate of the second FET outputs a high level, less than 3.3V. This prevents damage to other chips caused by excessive voltage on the second power pin.

[0073] Based on the above, the practical application scenarios of this design are:

[0074] During module development, production, and repair and diagnosis, connect the second power pin of the gold finger to 5.8V and the MCU's communication pin LPMode / Reset to the clock and data lines of the I2C device. Upon power-up, the circuit operates in state b, with the register enable pin high, and the system enters system memory boot mode. Use dedicated tool software to burn the firmware application into the MCU's internal memory.

[0075] 2. Turn off the power and disconnect the second power pin from the 5.8V power supply. Then power on normally. At this time, the register start pin is low, the system will boot from the internal memory and execute the application written to the MCU.

[0076] 3. When the module needs to be repaired or the problem needs to be diagnosed, just repeat the operation in Scenario 1.

[0077] When the optical module is inserted into the optical transmission communication system, that is, the optical module is normally connected to the host computer, since the level of the second power pin is always less than 3.3V, the state of the register start pin will not be affected by the second power pin. The first communication pin and the second communication pin (LPMode / Reset) resume their level detection functions, and the optical module will work normally.

[0078] In summary, an embodiment of the present application provides an optical module, comprising: a first field-effect transistor, disposed on a circuit board, with its gate connected to a first power line for receiving a constant first power supply voltage; a source connected to a second power line; and a drain connected to a register enable pin. A second field-effect transistor, disposed on a circuit board, with its gate connected to an MCU power supply pin; a source connected to ground; and a drain connected to the source of the first field-effect transistor. The first power line is connected to the first power pin, and the second power line is connected to the second power pin of the gold finger. The MCU is provided with a first communication pin and a second communication pin, which are respectively connected to the third and fourth communication pins of the gold finger. The MCU can read and write registers. The power supply voltage connected to the first power pin of the gold finger is the power supply voltage of the optical module, which is a constant voltage, typically 3.3V. When the power supply voltage connected to the second power pin of the gold finger is greater than a threshold range, the first field-effect transistor is in an on state, the register enable pin and the second power line are also fully conductive, and the potential of the register enable pin is pulled to a high potential close to the threshold, thereby enabling the register. At this time, by connecting the third and fourth communication pins of the gold finger to the communication connection with the firmware burning and maintenance tools, the register firmware application can be burned, erased, etc. The firmware application can be written to the register without having to disassemble the optical module, which is convenient to operate and improves work efficiency. It avoids the use of probes to connect with external tools, resulting in lower work efficiency and increasing the service life of the optical module. The second field effect transistor is set so that when the power supply voltage connected to the second power pin is too high, the gate output voltage of the second field effect transistor is low voltage, avoiding damage to other functional chips on the circuit board due to excessively high voltage being loaded on the second power pin.

Claims

1. An optical module, characterized in that: include: A circuit board with a gold finger at one end; The gold finger is provided with a plurality of pins, including: a first power pin, a second power pin, a third communication pin and a fourth communication pin, wherein the first power pin is connected to the working power voltage of the optical module; The register is provided on the circuit board and includes: a start pin for receiving a start voltage signal; a first field effect transistor, disposed on the circuit board, with a gate connected to the first power pin, a source connected to the second power pin, and a drain connected to the start pin; a second field effect transistor, disposed on the circuit board, with a source connected to the ground and a drain connected to the second power pin; The MCU is provided on the circuit board and includes: a power supply pin, a first communication pin, and a second communication pin, wherein the power supply pin is connected to the gate of the second field effect transistor, the third communication pin is connected to the first communication pin, and the fourth communication pin is connected to the second communication pin; When the voltage of the second power pin is at a high level, the first communication pin and the second communication pin are used for I2C communication, and the start pin is connected to the second power line; when the voltage of the second power pin is at a low level, the first communication pin and the second communication pin are not used for I2C communication.

2. The optical module according to claim 1, wherein Also includes: A first resistor has one end connected to the gate of the second field effect transistor and the other end grounded.

3. The optical module according to claim 1, wherein: Also includes: The second resistor is arranged between the drain of the first field effect transistor and the register.

4. The optical module according to claim 3, wherein: The second resistor is a zero-ohm resistor.

5. The optical module according to claim 1, wherein: The register is built into the MCU.

6. The optical module according to claim 1, wherein: The MCU can read and write the register.

7. The optical module according to claim 1, wherein: The first field effect transistor is a P-channel enhancement type field effect transistor and the second field effect transistor is an N-channel enhancement type field effect transistor.

8. The optical module according to claim 1, wherein: The gate of the second field effect transistor is also connected to other functional chips for supplying power to the functional chips.

9. The optical module according to claim 1, wherein: The MCU further includes: The fifth communication pin is used for SCL communication; The sixth communication pin is used for SDA communication.

10. The optical module according to claim 9, wherein: The gold finger further includes: a seventh communication pin connected to the fifth communication pin; The eighth communication pin is connected to the sixth communication pin.

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