Compression-resistant and fracture-resistant mobile phone motherboard based on modular assembly structure

Abstract

This invention relates to the field of mobile phone motherboard technology, specifically to a pressure-resistant and fracture-resistant mobile phone motherboard based on a modular assembly structure. The motherboard includes a main board, which comprises a base plate and a substrate for fixing the base plate. The base plate includes a core board and a sub-board, which are electrically connected via a ribbon cable. The substrate includes a first bottom liner and a second bottom liner. The first bottom liner is used to fix the sub-board and provide cushioning protection. The second bottom liner has locking fasteners on both ends of its sidewalls for fastening the core board. The core board sidewall has a T-slot, and the locking fasteners are movably engaged within the T-slot. The modular assembly structure of the base plate reduces the stress area of ​​the base plate, thereby increasing its fracture resistance. Furthermore, the substrate at the bottom of the base plate provides cushioning protection, improving the impact resistance of the base plate and preventing the risk of accidental breakage.

Description

Technical Field

[0001] This invention relates to the field of mobile phone motherboard technology, and more specifically, to a pressure-resistant and fracture-resistant mobile phone motherboard based on a modular assembly structure. Background Technology

[0002] The motherboard is the most important functional component of a mobile phone. It contains baseband circuits, radio frequency circuits, power supply circuits, memory, peripheral circuits, and various interfaces.

[0003] Existing L-shaped and other irregularly shaped mobile phone motherboards have a large stress-bearing area, making them prone to bending and breakage when the phone is impacted. Furthermore, existing mobile phone motherboards are usually fixed inside the phone casing with many screws, resulting in poor cushioning performance and easy bending and breakage. Therefore, the purpose of this invention is to provide a pressure-resistant and fracture-resistant mobile phone motherboard based on a modular assembly structure to solve the problems of poor cushioning and easy breakage of existing mobile phone motherboards. Summary of the Invention

[0004] The purpose of this invention is to provide a pressure-resistant and fracture-resistant mobile phone motherboard based on a modular assembly structure to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention aims to provide a pressure-resistant and fracture-resistant mobile phone motherboard based on a modular assembly structure, including a motherboard, wherein the motherboard includes a base plate and a substrate for fixing the base plate;

[0006] The motherboard includes a core board and a sub-board, and the core board and the sub-board are electrically connected by a ribbon cable;

[0007] The substrate includes a first bottom liner and a second bottom liner. The first bottom liner is used to fix the sub-plate and to provide cushioning and protection for the sub-plate.

[0008] The second bottom liner is provided with locking fasteners on both sides for fastening and fixing the core plate. The core plate has a T-slot on its side wall, and the locking fasteners are movably snapped into the T-slots.

[0009] As a further improvement to this technical solution, the locking component includes two cantilever arms, with a bearing seat at the bottom of each cantilever arm, a rotating shaft fixedly mounted on one side of the bearing seat, a torsion spring nested on the rotating shaft, a limit rod fixedly mounted on the side wall of each cantilever arm at the edge of the rotating shaft, a locking arm elastically mounted between the two cantilever arms, and an insertion hole provided on the upper surface of each cantilever arm.

[0010] As a further improvement to this technical solution, the clamping arm is designed in a U-shape. The clamping arm includes two vertical arms and a crossbar between the two vertical arms. Buffer springs are nested on both ends of the vertical arms, and a piston is provided at the bottom of the vertical arm. The piston slides and engages with the insertion hole.

[0011] As a further improvement to this technical solution, the upper surface of the second bottom liner plate is provided with rotating grooves at the four corner edges. The sidewall of the rotating groove is provided with a limiting shaft hole. The sidewall of the limiting shaft hole is provided with an arc-shaped notch for limiting the rotation angle of the locking element. The upper surface of the rotating groove is provided with an arc groove that matches the shaft seat.

[0012] As a further improvement to this technical solution, the locking element is rotatably installed in the limiting shaft hole via a rotating shaft, the limiting rod is movably inserted into the arc-shaped notch, the torsion spring is embedded in the limiting shaft hole, and the other end of the torsion spring is fixedly connected to the inner wall of the limiting shaft hole.

[0013] As a further improvement to this technical solution, a number of positioning blocks are provided near the upper edge of the second bottom liner plate. The positioning blocks are provided with anti-slip ridges on both sides. A buffer groove adapted to the positioning blocks is opened through the surface of the core plate. The positioning blocks are slidably inserted into the buffer groove.

[0014] As a further improvement to this technical solution, the upper surface of the first bottom liner is provided with several buffer members, the buffer members including elastic members, and a limiting post is nested on the elastic member. The surface of the sub-plate is provided with a positioning sliding hole adapted to the elastic member. The upper surface of the first bottom liner is provided with several buckles, which are used to assist in positioning the sub-plate.

[0015] As a further improvement to this technical solution, the lower surface of the sub-plate is provided with a slot adapted to the buckle, and the side wall of the second bottom liner is provided with a through groove adapted to the slot. The buckle is inserted from the slot and snapped into the through groove, and the side wall of the buckle is provided with several anti-slip protrusions.

[0016] As a further improvement to this technical solution, the sub-board is provided with a ribbon cable interface sub-terminal near one side edge, and the core board is provided with a ribbon cable interface female terminal near one side edge. The ribbon cable interface female terminal is electrically connected to the ribbon cable interface sub-terminal via a ribbon cable.

[0017] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0018] 1. In this pressure-resistant and fracture-resistant mobile phone motherboard based on a modular assembly structure, the motherboard adopts a modular assembly structure, which can reduce the stress area of ​​the motherboard and thus increase its fracture resistance. In addition, the base plate at the bottom of the motherboard can buffer and protect the motherboard, improve the impact resistance of the motherboard, and thus prevent the risk of the motherboard breaking due to accident.

[0019] 2. In this pressure-resistant and fracture-resistant mobile phone motherboard based on a modular assembly structure, the motherboard is buffered and protected by the substrate, and the motherboard is fixed by the snap-fit ​​installation structure, which ensures the stability of the motherboard installation and facilitates the disassembly and maintenance of the motherboard. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0021] Figure 2 This is a schematic diagram of the substrate structure of the present invention;

[0022] Figure 3 This is a schematic diagram of the connection structure between the sub-plate and the first bottom liner plate of the present invention;

[0023] Figure 4 In this invention Figure 7 A magnified schematic diagram of the structure A;

[0024] Figure 5 This is a schematic diagram of the snap-fit ​​structure of the present invention;

[0025] Figure 6 This is a schematic diagram of the first bottom liner structure of the present invention;

[0026] Figure 7 This is a schematic diagram of the connection structure between the second bottom liner and the core plate of the present invention;

[0027] Figure 8 In this invention Figure 7 A magnified schematic diagram of structure B;

[0028] Figure 9 This is a schematic diagram of the core board structure of the present invention;

[0029] Figure 10 In this invention Figure 9 A magnified schematic diagram of the structure C;

[0030] Figure 11 This is a partial structural diagram of the second bottom liner of the present invention;

[0031] Figure 12 In this invention Figure 11 A magnified schematic diagram of the structure (D).

[0032] Figure 13 This is a schematic diagram of the connection structure between the second bottom liner and the locking element of the present invention;

[0033] Figure 14 This is a partial structural diagram of the locking element of the present invention;

[0034] Figure 15This is a schematic diagram of a partial connection structure of the locking element of the present invention.

[0035] The meanings of the labels in the diagram are as follows:

[0036] 1. Motherboard;

[0037] 2. Motherboard;

[0038] 201. Core board; 2011. T-slot; 2013. Female connector of ribbon cable; 2014. Buffer slot;

[0039] 202, Sub-board; 2021, Cable connector terminal; 2022, Through slot;

[0040] 3. Substrate;

[0041] 301. First bottom liner; 3011. Buckle; 30111. Anti-slip protrusion; 3012. Buffer; 3013. Limiting post; 3014. Elastic element; 3015. Fixing hole;

[0042] 302. Second bottom liner plate; 3021. Positioning block; 3022. Rotary groove; 3023. Arc groove; 3024. Limiting shaft hole; 3025. Positioning hole;

[0043] 4. Locking fasteners;

[0044] 401, cantilever; 4011, limit rod; 4012, insertion hole; 4013, bearing seat; 402, rotating shaft;

[0045] 403. Torsion spring;

[0046] 404, clamping arm; 4041, buffer spring; 4042, piston. Detailed Implementation

[0047] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0048] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0049] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0050] Example 1

[0051] Please see Figures 1-15 As shown, the purpose of this embodiment is to provide a pressure-resistant and fracture-resistant mobile phone motherboard based on a modular assembly structure, including a motherboard 1. The motherboard 1 includes a motherboard 2 and a base plate 3 for fixing the motherboard 2. The motherboard 2 is movably mounted on the base plate 3, which facilitates the disassembly and maintenance of the motherboard 2.

[0052] To improve the structural strength of the motherboard 2, the motherboard 2 adopts an assembly structure. The motherboard 2 includes a core board 201 and a sub-board 202. The core board 201 and the sub-board 202 are electrically connected by a ribbon cable. Since the existing L-shaped mobile phone motherboard has poor pressure resistance and fracture resistance, and the irregular structure has a high risk of fracture, the motherboard 2 is disassembled into multiple modules to reduce the stress area of ​​the motherboard 2 and reduce the risk of fracture. The sub-board 202 is provided with a ribbon cable interface sub-terminal 2021 near one edge, and the core board 201 is provided with a ribbon cable interface female terminal 2013 near one edge. The ribbon cable interface female terminal 2013 is electrically connected to the ribbon cable interface sub-terminal 2021 through a ribbon cable.

[0053] To fix the mother plate 2 via the substrate 3, the substrate 3 includes a first bottom liner 301 and a second bottom liner 302. The first bottom liner 301 is used to fix the sub-plate 202 and to provide buffer protection for the sub-plate 202. The second bottom liner 302 has locking fasteners 4 on both sides for fastening and fixing the core plate 201. The side wall of the core plate 201 has a T-slot 2011. The locking fasteners 4 are movably snapped into the T-slot 2011 to facilitate the disassembly of the core plate 201. The substrate 3 and the mother plate 2 are assembled by modular splicing, which can improve the fracture resistance of the mother plate 2.

[0054] Furthermore, the locking component 4 includes two cantilever arms 401. A bearing seat 4013 is provided at the bottom of the cantilever arm 401. The bearing seat 4013 is preferably designed as a columnar structure to facilitate the rotation of the bearing seat 4013 at the rotating groove 3022. A rotating shaft 402 is fixedly provided on one side of the bearing seat 4013. A torsion spring 403 is nested on the rotating shaft 402. A limit rod 4011 is fixedly provided on the side wall of the cantilever arm 401 at the edge of the rotating shaft 402. One end of the torsion spring 403 is fixedly installed on the limit rod 4011. A locking arm 404 is elastically installed between the two cantilever arms 401. An insertion hole 4012 is provided on the upper surface of the cantilever arm 401.

[0055] To secure the core plate 201 via the locking fastener 4, the locking arm 404 is designed in a U-shape. The locking arm 404 includes two vertical arms and a crossbar between them. Buffer springs 4041 are nested on both ends of the vertical arms. A piston 4042 is located at the bottom of each vertical arm. The piston 4042 slides into the insertion hole 4012. The insertion hole 4012 has a limiting slide hole to restrict its sliding range. The inner diameter of the limiting slide hole is larger than the inner diameter of the insertion hole 4012 to prevent the locking arm 404 from sliding out of the insertion hole 4012. The piston 4042 is adapted to the limiting slide hole. When the locking arm 404 is engaged in the T-slot 2011, the piston 4042 moves to the top of the limiting slide hole, and the buffer springs 4041 lose force and rebound, locking the arm. Arm 404 rises along the insertion hole 4012, and clamping arm 404 is pressed against the top of T-slot 2011, leaving a buffer gap between core plate 201 and second bottom liner 302. The buffer gap provides space for core plate 201 to move downward, thereby reducing some impact resistance during the downward movement of core plate 201 and improving the fracture resistance of core plate 201. Furthermore, when core plate 201 is impacted, core plate 201 moves towards second bottom liner 302, and core plate 201 pushes clamping arm 404 downward. Buffer spring 4041 is compressed, and buffer spring 4041 reduces the impact force of core plate 201 moving towards second bottom liner 302, thereby reducing the risk of core plate 201 breaking due to impact.

[0056] The upper surface of the second bottom liner 302 has rotating grooves 3022 at each of the four corner edges. Each rotating groove 3022 has a limiting shaft hole 3024 on its sidewall. The limiting shaft hole 3024 has an arc-shaped notch on its sidewall to limit the rotation angle of the locking element 4. The upper surface of the rotating groove 3022 has an arc-shaped groove 3023 that matches the shaft seat 4013. When the locking element 4 needs to fasten and fix the core plate 201, rotate the locking element 4 and press down on the locking arm 404 until it engages. Arm 404 is aligned with T-slot 2011. Arm 404 is inserted into T-slot 2011 from the opening of T-slot 2011. At this time, buffer spring 4041 loses force and rebounds, pushing arm 404 to move up and down. Arm 404 lifts core plate 201 upward, fixing core plate 201 periodically. Positioning block 3021 helps to improve the stability of the connection between core plate 201 and second bottom liner 302, which can prevent core plate 201 from shaking during daily use.

[0057] To limit the rotation angle of the locking element 4 and ensure its stability when fixing the core plate 201, the locking element 4 is rotatably installed in the limiting shaft hole 3024 via the rotating shaft 402. The limiting rod 4011 is movably inserted into the arc-shaped notch. Preferably, the central angle of the arc-shaped notch is 90°. One end of the arc-shaped notch is aligned vertically with the T-slot 2011. When the torsion spring 403 is in the initial state, the locking arm 404 is engaged in the T-slot 2011. One end of the arc-shaped notch is used to limit the position of the limiting rod 4011. The torsion spring 403 is embedded in the limiting shaft hole 3024, and the other end of the torsion spring 403 is fixedly connected to the inner wall of the limiting shaft hole 3024.

[0058] The upper surface of the first bottom liner 301 is provided with several buffer members 3012. The buffer members 3012 are used to provide buffer for the sub-plate 202. The buffer members 3012 include elastic members 3014. A limiting post 3013 is nested on the elastic member 3014. A positioning sliding hole adapted to the elastic member 3014 is opened through the surface of the sub-plate 202. The limiting post 3013 is located between the first bottom liner 301 and the sub-plate 202, so that the first bottom liner 301 and the sub-plate 202 have a buffer gap. The buffer gap provides space for the sub-plate 202 to move downward. During the downward movement, the sub-plate 202 consumes part of the impact force, thereby improving the fracture resistance of the sub-plate 202. The elastic member 3014 is slidably installed in the positioning sliding hole.

[0059] Example 2

[0060] To improve the stability of motherboard 2 and prevent it from shaking under normal conditions, which would affect the use of the mobile phone, the following improvements are made based on embodiment 1:

[0061] To improve the stability of the sub-plate 202 during installation, the upper surface of the first base plate 301 is provided with several clips 3011, which are used to assist in positioning the sub-plate 202. The lower surface of the sub-plate 202 is provided with a slot that matches the clips 3011. The side wall of the second base plate 302 is provided with a through groove 2022 that matches the slot. The clips 3011 are inserted from the slot and snapped into the through groove 2022. The side wall of the clips 3011 is provided with several anti-slip protrusions 30111, which can increase the friction of the clips 3011 in the slot, thereby reducing the impact force when the sub-plate 202 moves downward under impact, and thus improving the compressive strength and anti-breakage performance of the sub-plate 202. The first base plate 301 is fastened to the sub-plate 202 through the clips 3011, which are used to position and fix the sub-plate 202.

[0062] To improve the stability of the connection between the core plate 201 and the second bottom liner 302, a number of positioning blocks 3021 are provided near the edge of the upper surface of the second bottom liner 302. The positioning blocks 3021 have anti-slip ridges on both sides. A buffer groove 2014 adapted to the positioning blocks 3021 is opened through the surface of the core plate 201. The positioning blocks 3021 are slidably inserted into the buffer groove 2014. The anti-slip ridges on the positioning blocks 3021 are used to increase the friction of the positioning blocks 3021 sliding in the buffer groove 2014. By increasing the sliding friction, some of the impact potential energy of the core plate 201 is consumed, further reducing the impact force of the core plate 201 moving towards the second bottom liner 302 and reducing the risk of the core plate 201 breaking.

[0063] Furthermore, in order to fix the first base plate 301 and the second base plate 302 and ensure the stability of the installation of the first base plate 301 and the second base plate 302, a fixing hole 3015 is provided through the surface of the first base plate 301, and bolts are passed through the fixing hole 3015 to fix the first base plate 301. A positioning hole 3025 is provided through the surface of the second base plate 302, and bolts are passed through the positioning hole 3025 to fix the second base plate 302.

[0064] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely preferred examples and are not intended to limit the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of protection of the present invention is defined by the appended claims and their equivalents.

Claims

1. A pressure-resistant and fracture-resistant mobile phone motherboard based on a modular assembly structure, comprising a motherboard (1), characterized in that: The motherboard (1) includes a motherboard (2) and a base plate (3) for fixing the motherboard (2); The motherboard (2) includes a core board (201) and a sub-board (202), and the core board (201) and the sub-board (202) are electrically connected by a ribbon cable; The substrate (3) includes a first bottom plate (301) and a second bottom plate (302). The first bottom plate (301) is used to fix the sub-plate (202) and to provide buffer protection for the sub-plate (202). The second bottom liner (302) has locking fasteners (4) on both sides for fastening and fixing the core plate (201). The core plate (201) has a T-slot (2011) on its side wall, and the locking fasteners (4) are movably snapped into the T-slot (2011). The locking component (4) includes two cantilever arms (401). A bearing seat (4013) is provided at the bottom of the cantilever arm (401). A rotating shaft (402) is fixedly provided on one side of the bearing seat (4013). A torsion spring (403) is nested on the rotating shaft (402). A limit rod (4011) is fixedly provided on the side wall of the cantilever arm (401) at the edge of the rotating shaft (402). A locking arm (404) is elastically installed between the two cantilever arms (401). An insertion hole (4012) is provided on the upper surface of the cantilever arm (401). The clamping arm (404) has a U-shaped structure design. The clamping arm (404) includes two vertical arms and a crossbar between the two vertical arms. Buffer springs (4041) are nested on both ends of the vertical arms. A piston (4042) is provided at the bottom of the vertical arm. The piston (4042) slides and engages with the insertion hole (4012).

2. The pressure-resistant and fracture-resistant mobile phone motherboard based on a modular assembly structure according to claim 1, characterized in that: The upper surface of the second bottom liner (302) is provided with a rotating groove (3022) at each of the four corner edges. The side wall of the rotating groove (3022) is provided with a limiting shaft hole (3024). The side wall of the limiting shaft hole (3024) is provided with an arc-shaped notch for limiting the rotation angle of the locking member (4). The upper surface of the rotating groove (3022) is provided with an arc groove (3023) that is compatible with the shaft seat (4013).

3. The pressure-resistant and fracture-resistant mobile phone motherboard based on a modular assembly structure according to claim 2, characterized in that: The locking element (4) is rotatably installed in the limiting shaft hole (3024) via the rotating shaft (402), the limiting rod (4011) is movably inserted into the arc-shaped notch, the torsion spring (403) is embedded in the limiting shaft hole (3024), and the other end of the torsion spring (403) is fixedly connected to the inner wall of the limiting shaft hole (3024).

4. The pressure-resistant and fracture-resistant mobile phone motherboard based on a modular assembly structure according to claim 1, characterized in that: Several positioning blocks (3021) are provided near the edge of the upper surface of the second bottom liner (302). Anti-slip ridges are provided on both sides of the positioning blocks (3021). A buffer groove (2014) adapted to the positioning blocks (3021) is provided through the surface of the core plate (201). The positioning blocks (3021) are slidably inserted into the buffer groove (2014).

5. The pressure-resistant and fracture-resistant mobile phone motherboard based on a modular assembly structure according to claim 1, characterized in that: The upper surface of the first base plate (301) is provided with a plurality of buffer members (3012), the buffer members (3012) include elastic members (3014), the elastic members (3014) are nested and installed with limit posts (3013), the surface of the sub-plate (202) is provided with positioning sliding holes adapted to the elastic members (3014), and the upper surface of the first base plate (301) is provided with a plurality of buckles (3011), the buckles (3011) are used to assist in positioning the sub-plate (202).

6. The pressure-resistant and fracture-resistant mobile phone motherboard based on a modular assembly structure according to claim 1, characterized in that: The lower surface of the sub-plate (202) is provided with a slot adapted to the buckle (3011), and the side wall of the second bottom liner (302) is provided with a through groove (2022) adapted to the slot. The buckle (3011) is inserted from the slot and snapped into the through groove (2022). The side wall of the buckle (3011) is provided with a number of anti-slip protrusions (30111).

7. The pressure-resistant and fracture-resistant mobile phone motherboard based on a modular assembly structure according to claim 1, characterized in that: The sub-board (202) is provided with a ribbon cable interface sub-terminal (2021) near one side edge, and the core board (201) is provided with a ribbon cable interface female terminal (2013) near one side edge. The ribbon cable interface female terminal (2013) is electrically connected to the ribbon cable interface sub-terminal (2021) via a ribbon cable.

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