Detector matrix with interleaved columns

Abstract

In one example, there is provided a detector matrix configured to be used in a system for inspecting cargo using inspection radiation, the matrix comprising a plurality of columns of detector modules, the detector modules of each column extending along a substantially longitudinal direction, each detector module comprising a surface configured to receive inspection radiation, and the plurality of columns of detector modules being adjacent to each other in a lateral direction substantially perpendicular to the longitudinal direction and substantially parallel to the surface of the detector modules, wherein the plurality of columns of detector modules comprises at least two columns of detector modules that are offset relative to each other in a depth direction substantially perpendicular to both the lateral direction and the longitudinal direction.

Description

Technical Field

[0001] This invention relates to, but is not limited to, a detector matrix configured for use in a system for inspecting cargo using inspection radiation. The invention also relates to a method of manufacturing such a detector matrix. Background Technology

[0002] The optimal number of columns in the detector matrix depends on the type of cargo inspection system on which the matrix will be mounted (e.g., a portal, moving system, or gantry) and the desired scanning speed.

[0003] The detector matrix can be made of a scintillation crystal matrix bonded to a corresponding photodiode matrix.

[0004] For matrices with different numbers of columns, the individual photodiode matrices are different. Similarly, for matrices with different numbers of columns, the individual scintillation crystal matrices are different. Each different photodiode matrix and each different scintillation crystal matrix is ​​manufactured for different types of detector matrices, depending on the required number of columns. Summary of the Invention

[0005] Aspects and embodiments of the invention are set forth in the appended claims. These and other aspects and embodiments of the invention are also described herein. Attached Figure Description

[0006] Embodiments of this disclosure will now be described by way of example with reference to the accompanying drawings, in which:

[0007] Figure 1A A schematic front view of an exemplary detector matrix according to this disclosure, observed in the depth direction (OZ) of the inspection radiation propagation, is shown.

[0008] Figure 1B The diagram schematically illustrates a structure with a first offset. Figure 1A A top view of an exemplary detector matrix;

[0009] Figure 2 A top view of another exemplary detector matrix with a second offset is schematically shown;

[0010] Figure 3 A top view schematically illustrates another example detector matrix comprising four columns with a symmetric plane;

[0011] Figure 4A A top view of another example detector matrix, comprising four columns, is schematically shown, with each column offset relative to its adjacent columns;

[0012] Figure 4BA top view of another example matrix of detectors comprising five columns is schematically shown, with each column offset relative to its adjacent columns;

[0013] Figure 5 A top view of another example detector matrix, comprising three columns, is schematically shown, where two columns are not offset relative to each other;

[0014] Figure 6 A top view schematically illustrates another example detector matrix comprising four columns with a symmetric plane, wherein the detector module comprises multiple stacked detectors; and

[0015] Figure 7 A flowchart illustrating an example method for manufacturing a detector matrix according to any aspect of this disclosure is shown schematically.

[0016] In the accompanying drawings, similar elements have the same reference numerals. Detailed Implementation

[0017] Overview

[0018] Embodiments of this disclosure provide a detector matrix for an inspection system that uses inspection radiation to inspect goods. The detector matrix may include multiple columns extending in a longitudinal direction substantially perpendicular to the scanning direction. Each column includes multiple modules for receiving inspection radiation. The multiple columns are adjacent to each other in a transverse direction substantially parallel to the scanning direction to form the detector matrix. At least two columns are offset relative to each other in a depth direction substantially perpendicular to both the transverse and longitudinal directions.

[0019] In embodiments of this disclosure, the offset enables the use of a scalable architecture for the detector matrix. In embodiments of this disclosure, regardless of the number of columns, the offset enables the use of the same or similar columns and / or the same or similar detector modules to increase or decrease the number of columns. In embodiments of this disclosure, the offset enables the increase or decrease of the number of columns without using a photodiode matrix or scintillation crystal matrix specifically designed for a given number of columns.

[0020] The scalability achieved by the embodiments of this disclosure results in relatively low manufacturing costs.

[0021] Detailed description of exemplary embodiments

[0022] Figure 1A and Figure 1B An example detector matrix 1 is schematically shown, configured for use in a system for inspecting goods using inspection radiation.

[0023] exist Figure 1A and Figure 1BIn the matrix, detector matrix 1 includes multiple (n) detectors (n≥2). Figure 1A and Figure 1B In n=2), column 2 of detector module 3.

[0024] like Figure 1A and Figure 1B As shown, the detector modules 3 in each column 2 extend LONG along the basic longitudinal direction. Figure 1A and Figure 1B In the middle, the longitudinal direction LONG is basically parallel to the direction (OY).

[0025] Each detector module 3 includes an inspection surface 4 configured to receive inspection radiation 5. Figure 1A and Figure 1B In the middle, surface 4 is basically parallel to the plane (XOY).

[0026] Multiple (n) columns 2 of detector module 3 are adjacent to each other in a transverse direction LAT that is substantially perpendicular to the longitudinal direction LONG and substantially parallel to the inspection surface 4 of detector module 3. Figure 1A and Figure 1B In the middle, the lateral direction LAT is basically perpendicular to the direction (OY) and basically parallel to the plane (XOY). Figure 1A and Figure 1B In the middle, the lateral direction LAT is basically parallel to the direction (OX).

[0027] like Figure 1A and Figure 1B As shown, the plurality of (n) columns 2 include at least two columns 2 that are offset relative to each other in the depth direction DEPTH, which is substantially perpendicular to both the lateral direction LAT and the longitudinal direction LONG.

[0028] exist Figure 1A and Figure 1B In the diagram, the two columns 2 are offset from each other by an offset δ in a direction substantially perpendicular to the horizontal direction LAT and the vertical direction LONG. Figure 1A and Figure 1B In the process, the offset δ is measured between inspection surface 4 of column 2 and another offset inspection surface 4 of column 2.

[0029] As explained in more detail below, the offset δ in the depth direction (DEPTH) enables at least partial overlap of columns in the lateral direction (LAT). This at least partial overlap of columns in the lateral direction (LAT) allows the use of the same or similar columns and / or the same or similar detector modules in a scalable architecture for the detector matrix.

[0030] As shown in the figure, in some embodiments, each column 2 includes at least one printed circuit board 6.

[0031] exist Figure 1A and Figure 1B In the example, at least one printed circuit board 6 is adjacent to the detector module 3 of column 2 and extends in a plane substantially perpendicular to the inspection surface 4 of the detector module 3 of column 2. Figure 1A and Figure 1B In one example, at least one printed circuit board 6 extends in a plane substantially parallel to a plane (YOZ) perpendicular to the inspection surface 4 of the detector module 3 of column 2.

[0032] exist Figure 4A In the example, at least one printed circuit board 6 is at least partially adjacent to the detector module 3 of column 2 and extends in a plane substantially parallel to the inspection surface 4 of the detector module 3 of column 2. Figure 4A In the example, at least one printed circuit board 6 extends in a plane of basic plane (YOZ) that is perpendicular to the inspection surface 4 of the detector module 3 of column 2.

[0033] exist Figure 4B In the example, one printed circuit board 6 extends in a plane substantially parallel to the inspection surface 4 of the detector module 3 of column 2 (in a plane substantially perpendicular to the plane (YOZ), and two printed circuit boards 6 extend in a plane substantially perpendicular to the inspection surface 4 of the detector module 3 of column 2 (in a plane substantially parallel to the plane (YOZ).

[0034] Other configurations and combinations of the position of circuit board 6 can be envisioned.

[0035] As shown in the figure, each detector module 3 includes at least one detector 30 configured to interact with the inspection radiation 5. As shown in the figure, each detector module 3 includes at least one sensor 7 configured to detect the response of the detector 30 to the interaction with the inspection radiation 5. As shown in the figure, at least one sensor 7 may be located between at least one printed circuit board 6 and at least one detector 30.

[0036] like Figure 1A and Figure 1B As shown, the offset δ in the depth direction (DEPTH) enables partial overlap λ of column 2 in the lateral direction (LAT), allowing the use of the same columns and / or the same detector modules in a scalable architecture for the detector matrix. For example... Figure 1A and Figure 1B As shown, the partial overlap λ of columns 2 in the lateral direction LAT causes the rear surface 8 of the detector 30 of one column 2, opposite the inspection surface 4, to at least partially or completely cover at least one printed circuit 6 and at least one sensor 7 of the other column 2 in the lateral direction LAT. Figure 1A and Figure 1BIn the middle, the offset δ and the overlap λ make the detector 30 of one column 2 not overlap with the detector 30 of another column 2 in the lateral direction LAT.

[0037] Figure 1B and 2 An example of offset δ is shown, where δ can be like this:

[0038] 0 < δ ≤ D,

[0039] Where D is the size of detector module 3 in the depth direction (DEPTH).

[0040] Figure 6 An example of offset δ is shown, where δ can be like this:

[0041] D<δ.

[0042] A typical detector module for a high-energy cargo inspection system can be made of high-density crystals with a diameter (D) of less than 5 cm. The typical distance L between the inspection radiation source and the detector matrix ranges from approximately 5 m to approximately 15 m. For the range of δ, the size D of the detector module is negligible compared to the distance L, and in some examples, the offset δ can be as follows:

[0043] 0 < ≤ 5D,

[0044] Where D is the size of detector module 3 in the depth direction (DEPTH).

[0045] Figure 1B and Figure 2 It is also shown that matrix 1 may include an even number of columns 2.

[0046] As explained in more detail below, regardless of the number of columns, the offset δ makes it possible to increase or decrease the number of columns by using the same or similar columns and / or the same or similar detector modules.

[0047] like Figure 3 As shown, matrix 1 can include an even number (n) of columns 2 ( Figure 3 (where n=4) and can have a centrally symmetric plane P. Figure 3 In this context, the centrally symmetric plane P can be substantially parallel to the depth direction DEPTH. Figure 3 In this context, multiple (n) columns include four columns, but other numbers of columns can be envisioned, such as six, eight, or ten columns as non-restrictive examples.

[0048] Figure 4A and 4B An example of matrix 1 is illustrated schematically, where each column 2 in the multi-column 2 is offset relative to its adjacent column in the multi-column 2.

[0049] Figure 4B and Figure 5An example of matrix 1 with an odd number of columns is shown schematically. Figure 4B There are five columns in the middle. Figure 5 The middle column is three columns – other numbers can be imagined).

[0050] like Figure 5 As shown, when the multi-column detector module includes at least three columns, the multi-column 2 may include at least two columns of detectors p1 and p2 that are not offset from each other in the depth direction, while p2 and p3 are offset from each other in the depth direction.

[0051] exist Figure 1A , Figure 1B , Figure 2 , Figure 3 , Figure 4A , Figure 4B and Figure 5 In this configuration, each detector module 3 includes a single detector 30 positioned substantially parallel to the depth direction (DEPTH).

[0052] like Figure 6 As shown, in some examples, each detector module 3 may include a plurality of detectors 30 stacked in a direction substantially parallel to the depth direction DEPTH. Such detector modules can be advantageously used, for example, for material identification.

[0053] exist Figure 1B and Figure 2 In this configuration, each detector 30 includes, for example, two sensors 7. Figure 3 and 5 In this configuration, each detector 30 includes, for example, four sensors 7. Figure 4A , Figure 4B and Figure 6 In this configuration, each detector 30 includes, for example, one sensor 7. Other numbers of sensors are conceivable.

[0054] In some examples, each detector 30 includes a scintillator configured to re-emit light in response to interaction with the inspected radiation, and at least one sensor 7 includes at least one photodiode configured to detect the re-emitted light.

[0055] like Figure 7 As shown, this disclosure also relates to a method 100 for manufacturing a detector matrix according to any aspect of this disclosure.

[0056] The method 100 includes:

[0057] In S1, multiple rows of detector modules are provided, each row extending along a generally longitudinal direction, and each detector module includes an inspection surface configured to receive inspection radiation; and

[0058] In S2, the provided multiple columns are placed adjacent to each other in a transverse direction that is substantially perpendicular to the longitudinal direction and substantially parallel to the inspection surface of the detector module, such that the multiple detector modules include at least two columns of detector modules that are offset relative to each other in a depth direction that is substantially perpendicular to both the transverse and longitudinal directions.

Claims

1. A detector matrix configured for use in a system for inspecting goods using inspection radiation, the detector matrix comprising multiple columns of detector modules. The detector modules in each column extend along a generally longitudinal direction. Each detector module includes an inspection surface configured to receive the inspection radiation, and The multi-row detector modules are adjacent to each other in a transverse direction that is substantially perpendicular to the longitudinal direction and substantially parallel to the surface of the detector modules. in, The multi-column detector module includes at least two columns of detector modules offset relative to each other in a depth direction substantially perpendicular to both the lateral and longitudinal directions. At least one column includes at least one printed circuit board. The at least one printed circuit board is adjacent to the detector module of the column and extends in a plane substantially perpendicular to the surface of the detector module of the column that is configured to receive the inspection radiation.

2. The matrix as claimed in claim 1, wherein the offset δ between the inspection surface of one column and the inspection surface of the other offset column is such that: ， Where D is the dimension of the detector module in the depth direction.

3. The matrix as described in claim 1, comprising an even number of columns.

4. The matrix as claimed in claim 3, having a centrally symmetric plane, the centrally symmetric plane being substantially parallel to the depth direction and substantially parallel to the longitudinal direction.

5. The matrix as described in claim 1, comprising an odd number of columns.

6. The matrix of claim 1, wherein each of the plurality of columns is offset relative to its adjacent columns.

7. The matrix of claim 1, wherein the multi-column detector module comprises at least three columns of detectors and at least two columns of detectors that are not offset from each other in the depth direction.

8. The matrix of claim 1, wherein at least one column comprises at least another printed circuit board. The at least one other printed circuit board is at least partially adjacent to the detector module of the column and extends in a plane substantially parallel to the surface of the detector module of the column that is configured to receive the inspection radiation.

9. The matrix of claim 1, wherein each detector module comprises: A single detector in a direction substantially parallel to the depth direction, the detector being configured to interact with the inspection radiation, or Multiple detectors are stacked in a direction substantially parallel to the depth direction.

10. The matrix as claimed in claim 9, wherein each detector module includes at least one sensor configured to detect the detector’s response to interaction with the inspection radiation.

11. The matrix as described in claim 9, wherein each detector comprises: A scintillator is configured to re-emit light in response to interaction with the inspected radiation.

12. The matrix of claim 10, wherein the at least one sensor comprises at least one photodiode configured to detect the re-emitted light.

13. The matrix of claim 10, wherein the at least one sensor is located between the at least one printed circuit board and the at least one detector.

14. A method for manufacturing a detector matrix, comprising: A multi-column detector module is provided, each column of the detector module extending along a generally longitudinal direction, each detector module including an inspection surface configured to receive inspection radiation; as well as The provided multiple columns are placed adjacent to each other in a lateral direction substantially perpendicular to the longitudinal direction and substantially parallel to the surface of the detector module, such that the multiple columns of detector modules include at least two columns of detector modules offset relative to each other in a depth direction substantially perpendicular to both the lateral and longitudinal directions. At least one column includes at least one printed circuit board. The at least one printed circuit board is adjacent to the detector module of the column and extends in a plane substantially perpendicular to the surface of the detector module of the column that is configured to receive the inspection radiation.

15. The method of claim 14, wherein it is performed for manufacturing the matrix of any one of claims 2-13.

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