Manufacturing apparatus and manufacturing method for semiconductor devices

Abstract

A manufacturing apparatus and a manufacturing method of a semiconductor device, which can appropriately maintain the quality of a bump while detecting the timing of melting of the bump. A manufacturing apparatus (10) of a semiconductor device includes a stage (12), a mounting tool (20), a pressurizing mechanism (22) that moves the mounting tool (20) in a vertical direction and imparts a load to a chip (100), and a controller (16) configured to perform a first process of heating the chip (100) with the mounting tool (20) while constantly updating an instruction position (P*) of the pressurizing mechanism (22) to make a position deviation (ΔP*) constant after the chip (100) lands and before a bump (104) melts, and a detection process of detecting melting of the bump based on a decrease in a pressing load.

Description

TECHNICAL FIELD

[0001] In the present specification, a manufacturing apparatus and a manufacturing method for manufacturing a semiconductor device by joining a chip held by a mounting tool to a substrate are disclosed. BACKGROUND

[0002] From the past, as a technique for mounting a chip to a substrate, a flip chip bonder is known. In the flip chip bonder, a protrusion electrode called a bump is formed on the bottom surface of a chip. Further, by a mounting tool, the chip is pressed to a substrate while the chip is heated to melt the bump, thereby joining the bump of the chip to an electrode of the substrate. In recent years, several techniques for detecting a melting timing of the bump in such a joining process have been proposed.

[0003] For example, in Patent Literature 1, a technique is disclosed in which if a load detection value obtained by a load detection member provided to a thermocompression tool (corresponding to the mounting tool) decreases to a prescribed value or less, it is judged that the bump has been melted, and the thermocompression tool is raised. According to the technique, if the melting of the bump can be detected, it is possible to immediately shift to the next operation, that is, the raising of the thermocompression tool. As a result, compared to a technique of presuming a time until melting and continuing heating until the presumed time elapses, it is possible to shorten the time of thermocompression, and improve productivity.

[0004] PRIOR ART DOCUMENTS

[0005] PATENT LITERATURE

[0006] Patent Literature 1: Japanese Patent Laid-Open No. 11-145197 SUMMARY

[0007] PROBLEMS TO BE SOLVED BY THE INVENTION

[0008] However, in the technique of Patent Literature 1, the position of the mounting tool is kept constant while the chip is heated and pressed. However, the mounting tool extends in the axial direction by thermal expansion during a period until the bump is melted. In the case where the position of the mounting tool is kept constant, the load imparted to the chip is gradually increased by the extension of the mounting tool. Further, by this, the bump can be possibly excessively flattened. If the bump is flattened, it is not possible to keep a gap as a clearance between the chip and the substrate to an appropriate value. In addition, if the bump is flattened and expands in the planar direction, it is also possible that a short-circuit failure occurs between the bump and an adjacent bump.

[0009] That is, in the prior art, it is not possible to appropriately keep the quality of the bump. Therefore, in the present specification, a manufacturing apparatus and a manufacturing method for a semiconductor device which can appropriately keep the quality of the bump while detecting a melting timing of the bump are disclosed.

[0010] Technical means to solve the problem

[0011] The semiconductor device manufacturing apparatus disclosed in this specification includes: a stage for supporting a substrate; a mounting tool capable of heating and holding a chip with bumps on its bottom surface; a pressure mechanism for moving the mounting tool in a vertical direction and applying a load to the chip; and a controller for controlling the driving of the mounting tool and the pressure mechanism, the controller being configured to perform the following processes: a first process in which, after the chip is landed on the substrate and before the bumps melt, the chip is heated using the mounting tool, while the command position of the pressure mechanism in the vertical direction is updated continuously to keep the positional deviation, which is the difference between the command position and the current position of the pressure mechanism, constant; and a detection process performed simultaneously with the first process, which monitors the pressing load applied to the chip by the pressure mechanism and detects the melting of the bumps based on a decrease in the pressing load.

[0012] In this case, the controller may further perform a second process, in which, after the time point at which the melting of the bump is detected in the detection process, the command position of the pressurizing mechanism is updated at any time so that the gap between the bottom surface of the chip and the substrate is maintained at the target value.

[0013] In this case, the pressurizing mechanism may also have a drive motor that moves the installation tool in the vertical direction, and the controller monitors the current value of the drive motor as a parameter representing the pressing load during the detection process.

[0014] Alternatively, the controller may calculate, in the first process, the value obtained by subtracting the target value of the position deviation from the current position of the installation tool as the command position of the pressurizing mechanism.

[0015] The method for manufacturing a semiconductor device disclosed in this specification includes: a first step in which, after a chip held by a mounting tool is placed onto a substrate supported by a stage and before the bumps on the bottom surface of the chip melt, the chip is heated using the mounting tool while the command position of a pressure mechanism in the vertical direction is updated continuously to keep the positional deviation between the command position of the pressure mechanism, which moves the mounting tool in the vertical direction, and the current position constant; and a detection step performed simultaneously with the first step in which the pressing load applied to the chip by the pressure mechanism is monitored and the melting of the bumps is detected based on a decrease in the pressing load.

[0016] In this case, a second step can further be included in which the command position of the pressurizing mechanism is updated in real time after the time point at which the bump is detected to be melted in the detecting step, so that the interval amount as the gap amount between the bottom surface of the chip and the substrate is maintained at a target value.

[0017] Effects of the Invention

[0018] According to the technology disclosed in this specification, the quality of the bump can be appropriately maintained while detecting the melting timing of the bump. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 is an image diagram showing the structure of a manufacturing apparatus of a semiconductor device.

[0020] Figure 2 is an image diagram showing the mounting form of a semiconductor chip.

[0021] Figure 3 is a graph showing the temporal change of various parameters at the time of mounting a semiconductor chip.

[0022] Figure 4 is a flowchart showing the flow of a manufacturing method of a semiconductor device.

[0023] Figure 5 is a flowchart showing the flow of a manufacturing method of a semiconductor device.

[0024] [Explanation of Symbols]

[0025] 10: Manufacturing apparatus

[0026] 12: Stage

[0027] 14: Bonding head

[0028] 16: Controller

[0029] 18: XY stage

[0030] 20: Mounting tool

[0031] 22: Pressurizing mechanism

[0032] 24: Lifting mechanism

[0033] 30: Drive motor

[0034] 30a: Stator

[0035] 30b: Mover

[0036] 32: Slide shaft

[0037] 34: Leaf spring

[0038] 36: Guide member

[0039] 38: base member

[0040] 40: lift motor

[0041] 42: lead screw

[0042] 44: moving block

[0043] 46: moving body

[0044] 48: guide rail

[0045] 50: linear scale

[0046] 100: semiconductor chip

[0047] 102: chip body

[0048] 104: bump

[0049] 110: substrate

[0050] 112: electrode DETAILED DESCRIPTION

[0051] Hereinafter, a manufacturing apparatus 10 of a semiconductor device will be described with reference to the drawings. Figure 1 is an image showing the structure of the manufacturing apparatus 10 of a semiconductor device. The manufacturing apparatus 10 is an apparatus that manufactures a semiconductor device by mounting a semiconductor chip 100, which is an electronic component, on a substrate 110 in a face-down state. The manufacturing apparatus 10 includes a bonding head 14 having a mounting tool 20, a chip supply member (not shown) that supplies the semiconductor chip 100 to the mounting tool 20, a stage 12 that supports the substrate 110, an XY stage 18 that moves the stage 12 in an XY direction (horizontal direction), and a controller 16 that controls the drive of these, and the like.

[0052] The substrate 110 is suction-held to the stage 12, and is heated by a stage heater (not shown) provided to the stage 12. In addition, the semiconductor chip 100 is supplied to the mounting tool 20 by the chip supply member. As the structure of the chip supply member, various structures can be considered, for example, a structure in which a semiconductor chip is picked up from a wafer placed on a wafer stage by a transfer arm, and is transferred to a transfer stage can be considered. In this case, the XY stage 18 transfers the transfer stage to directly below the mounting tool 20, and the mounting tool 20 picks up the semiconductor chip from the transfer stage located directly below.

[0053] If the semiconductor chip is picked up by the mounting tool 20, the substrate 110 is then moved by the XY stage 18 to be directly below the mounting tool 20. If this state is achieved, the mounting tool 20 is lowered toward the substrate 110, and the semiconductor chip 100 held by suction is pressed and mounted on the substrate 110.

[0054] The mounting tool 20 holds the semiconductor chip 100 by suction while heating the semiconductor chip 100. Therefore, at the mounting tool 20, a suction hole that communicates with a vacuum source, or a tool heater (both not shown) for heating the semiconductor chip 100, and the like are provided. At the bonding head 14, in addition to the mounting tool 20, a pressurizing mechanism 22 and a lifting mechanism 24 are further provided.

[0055] The pressurizing mechanism 22 moves the mounting tool 20 in the Z-axis direction (i.e., the vertical direction), thereby pressing the semiconductor chip 100 against the substrate 110 and applying a pressing load to the semiconductor chip 100. The pressurizing mechanism 22 has a drive motor 30, a slide shaft 32, a plate spring 34, and a guide member 36. The drive motor 30 is a drive source of the pressurizing mechanism 22, and is, for example, a voice coil motor. The drive motor 30 has a stator 30a fixed to a moving body 46, and a rotor 30b movable in the Z-axis direction with respect to the stator 30a. The rotor 30b is mechanically linked to the mounting tool 20 via the slide shaft 32. In addition, the slide shaft 32 is fitted to the moving body 46 via the plate spring 34 that can be deflected in the Z-axis direction. Further, the guide member 36 is fixed to the moving body 46. The slide shaft 32 is inserted into a through-hole formed in the guide member 36 and can slide along the through-hole.

[0056] If a current is applied to the drive motor 30, the rotor 30b moves in the Z-axis direction with respect to the moving body 46. At this time, the slide shaft 32 and the mounting tool 20 fixed to the slide shaft 32 move in the Z-axis direction together with the rotor 30b while elastically deforming the plate spring 34. The displacement amount of the slide shaft 32 with respect to the stator 30a is detected by a position sensor such as a linear scale 50 fixed to the guide member 36, and is sent to the controller 16.

[0057] The lifting mechanism 24 lifts and lowers the mounting tool 20 and the pressing mechanism 22 with respect to the base member 38 in the Z-axis direction. The lifting mechanism 24 has a lifting motor 40 as a driving source. In the lifting motor 40, a lead screw 42 extending in the axial direction is coupled via a coupling, and the lead screw 42 rotates in conjunction with driving of the lifting motor 40. In the lead screw 42, a moving block 44 is screwed, and the moving block 44 is fixed to the upper surface of the stator 30a of the driving motor 30. In addition, a moving body 46 is fixed to the side surface of the stator 30a. The moving body 46 is slidable along a guide rail 48 fixed to the base member 38. If current is applied to the lifting motor 40, the lead screw 42 rotates, and in conjunction therewith, the moving block 44 is lifted and lowered in the Z-axis direction. Also, by the moving block 44 being lifted and lowered, the pressing mechanism 22 and the mounting tool 20 fixed to the moving block 44 are also lifted and lowered. The amount of lifting and lowering of the pressing mechanism 22 by the lifting mechanism 24 is also detected by a sensor (for example, an encoder attached to the lifting motor 40 or the like) and transmitted to the controller 16.

[0058] The controller 16 controls driving of the mounting tool 20, the pressing mechanism 22, the lifting mechanism 24, the stage 12, and the XY stage 18. The controller 16 is a computer that physically has a processor 16a and a memory 16b. In the "computer", a microcontroller in which a computer system is incorporated into one integrated circuit is also included. In addition, the processor 16a refers to a broad processor, and includes a general-purpose processor (for example, a Central Processing Unit (CPU) or the like) or a dedicated processor (for example, a Graphics Processing Unit (GPU), an Application Specific Integrated Circuit (ASIC), a Field Programmable Gate Array (FPGA), a programmable logic device, or the like). In addition, the actions of the processor 16a described below are not only performed by one processor, but also can be cooperatively performed by a plurality of processors existing in physically separate locations. Similarly, the memory 16b does not necessarily have to be one component in the physical aspect, but can be constituted by a plurality of memories existing in physically separate locations. In addition, the memory 16b can include at least one of a semiconductor memory (for example, a Random Access Memory (RAM), a Read Only Memory (ROM), a solid state drive, or the like) and a magnetic disk (for example, a hard disk drive or the like).

[0059] Here, the driving control of the driving motor 30 by the controller 16 will be explained simply. When driving the driving motor 30, the controller 16 first acquires the detection value of the linear scale 50 as the detected position Pd in the Z-axis direction of the mounting tool 20, and acquires the differential value of the detection value of the linear scale 50 as the speed detection value. Then, the controller 16 calculates the speed command value based on the positional deviation of the detected position in the Z-axis direction of the mounting tool 20 from the command position, and calculates the torque command value based on the deviation of the speed command value from the speed detection value, and applies the current corresponding to the torque command value to the driving motor 30. Here, in this example, the driving motor 30 is a voice coil motor, and outputs the torque in proportion to the applied current. Therefore, the current value applied to the driving motor 30 is approximately proportional to the press load applied to the semiconductor chip 100. Therefore, in this example, the controller 16 acquires the current value of the driving motor 30 as a parameter indicating the press load. In addition, the controller 16 updates the command position used in the control of the driving motor 30 in accordance with the flow of the mounting process, and this will be described later.

[0060] Next, the mounting method of the semiconductor chip 100 using such a manufacturing apparatus 10 will be explained. Figure 2 is an image showing the mounting state of the semiconductor chip 100. As shown in Figure 2 , a plurality of electrodes 112 are formed on the upper surface of the substrate 110. In addition, the semiconductor chip 100 has a plurality of bumps 104 protruding from the bottom surface of the chip body 102, and containing a conductive metal such as solder. When mounting the semiconductor chip 100, the semiconductor chip 100 is heated in a state where the bumps 104 are in contact with the electrodes 112 of the substrate 110, and the bumps 104 are melted. Then, the bumps 104 are bonded to the electrodes 112 by melting of the bumps 104. Further, although not shown in Figure 2 , a layer of thermosetting resin, a layer of a non-conductive film, or the like can be further provided on the bottom surface of the chip body 102.

[0061] Here, when the semiconductor chip 100 is pressed after the melting of the bumps 104 during the mounting, the melted bumps 104 sometimes deform and are crushed. In this case, the crushed and laterally expanded bumps 104 can cause short-circuit failure between the adjacent other bumps 104.

[0062] Therefore, a technique has been proposed previously that continuously applies a load to the semiconductor chip 100 using a mounting tool 20, and detects the moment when the mounting tool 20 experiences a constant or greater drop as the melting point of the bump 104, after which the load applied to the semiconductor chip 100 is reduced. However, this technique for detecting the drop of the mounting tool 20 cannot accurately determine whether the drop is caused by the melting of the bump 104 or by damage to the bump 104 before melting. Furthermore, in this prior art, because the mounting tool 20 temporarily drops significantly, the molten bump 104 may be flattened and expand laterally.

[0063] Therefore, in Patent Document 1, instead of using the amount of sinking of the installation tool 20, it is determined that the protrusion 104 has melted if the load detection value obtained by the load detection component provided on the installation tool 20 decreases below a predetermined position. According to this technology, the sinking of the installation tool 20 can be suppressed to some extent. However, in Patent Document 1, in order to keep the position of the installation tool 20 in the Z-axis direction constant from the start of heating until the protrusion 104 melts, the installation tool 20 is not raised or lowered, and the thermal expansion of the installation tool 20 accompanying heating is not taken into account.

[0064] That is, when mounting the semiconductor chip 100, the mounting tool 20 heats up its built-in tool heater to heat the semiconductor chip 100. Accompanying this heating, the mounting tool 20... Figure 2 As shown by the double-dotted line, it expands thermally along its long axis. Therefore, even if the mounting tool 20 is kept stationary instead of raised or lowered, the end face of the mounting tool 20 will shift downwards due to thermal expansion, increasing the pressing load. As a result, in Patent Document 1, as thermal expansion intensifies and the pressing load increases, the unmelted bump 104 may be damaged, or the molten bump 104 may be excessively flattened. Furthermore, the technology in Patent Document 1 does not take into account the effect of thermal expansion, so the gap G between the bottom surface of the chip body 102 and the upper surface of the substrate 110 may not be the desired value.

[0065] In this specification, in order to properly detect the melting of the bump 104, the pressing load applied to the semiconductor chip 100 is monitored, and the moment when the pressing load decreases sharply is detected as the melting moment of the bump 104. Furthermore, to prevent damage to the bump 104 before melting, the command position is sequentially updated during the period before the bump 104 melts, so that even if the mounting tool 20 thermally expands, the deviation between the current position and the command position of the mounting tool 20, i.e., the positional deviation, remains constant. Hereinafter, refer to... Figures 3 to 5 This describes the installation process of semiconductor chip 100.

[0066] Figure 3is a graph showing the temporal change of various parameters at the time of mounting the semiconductor chip 100, the upper section shows the detection value of the linear scale 50, the middle section shows the current value of the drive motor 30, and the lower section shows the drive state of the tool heater. Also, Figure 4 , Figure 5 is a flowchart showing the flow of the manufacturing method of the semiconductor device.

[0067] At the time of mounting the semiconductor chip 100 to the substrate 110, the stage 12 and the mounting tool 20 are aligned in the horizontal direction in such a manner that the bump 104 of the semiconductor chip 100 is positioned directly above the electrode 112 of the substrate 110. Figure 4 The flowchart of Fig. 10 is started from the state. Thereafter, the controller 16 drives the lift motor 40 to lower the mounting tool 20 at high speed together with the pressurizing mechanism 22 (S10). If the semiconductor chip 100 approaches the substrate 110 until a state where a gap of several micrometers remains between the semiconductor chip 100 and the substrate 110 (Yes in S12), the controller 16 stops the drive of the lift motor 40. Figure 3 The timing tl in Fig. 10 indicates the timing at which the semiconductor chip 100 approaches the substrate 110.

[0068] If the semiconductor chip 100 approaches the substrate 110, the controller 16 drives the drive motor 30 to lower the mounting tool 20 at low speed until the bump 104 lands on the electrode 112 (S14). Specifically, the controller 16 gradually updates the command position P* input to the drive motor 30 to gradually bring the mounting tool 20 closer to the substrate 110 before detecting the landing. The landing timing of the bump 104 can be judged based on the detection position or based on the current value of the drive motor 30. That is, if the bump 104 lands on the electrode 112, the detection position Pd does not change even if the command position P* is updated. Therefore, the timing at which the change of the detection position Pd is indicated can be judged as the landing timing. Also, if the bump 104 comes into contact with the electrode 112, the semiconductor chip 100 and the mounting tool 20 receive a reaction force from the substrate 110. The drive motor 30 outputs a torque corresponding to the reaction force, and therefore the current value of the drive motor 30 sharply increases. The timing at which the current value sharply increases can also be judged as the landing timing. In the present embodiment, the landing timing is judged based on the current value of the drive motor 30. Figure 3 In Fig. 10, the landing is detected at timing t2.

[0069] If landing of the bump 104 is detected (Yes in S16), a first process is executed (S18, S20) in which the heating of the semiconductor chip 100 is started using the tool heater while the command position P* of the drive motor 30 is updated every time to keep the position deviation ΔP constant. That is, the controller 16 starts the heating of the semiconductor chip 100 by turning on the tool heater mounted on the mounting tool 20 at the time t2 at which landing is detected (S18). Also, the controller 16 updates the command position P* of the drive motor 30 every time according to the equation P* = Pd + σa - ΔP*. Here, Pd is the detected position of the mounting tool 20. σa is the amount of thermal expansion of the mounting tool 20 at each sampling. The amount of thermal expansion σa at each sampling is obtained in advance through experiments or the like. Also, the amount of thermal expansion σa at each sampling can be a fixed value or a variable value that changes with the passage of time or the change in temperature of the tool heater. Pd + σa is the current position of the mounting tool 20. ΔP* is the target value of the position deviation ΔP and is a fixed value whose value is constant. Figure 3 The broken line in FIG. 16 indicates the command position P* used in the first process.

[0070] Thus, by updating the command position P* every time according to the equation P* = Pd + σa - ΔP*, the position deviation ΔP can be kept constant all the time even if the mounting tool 20 or the semiconductor chip 100 thermally expands. Also, by keeping the position deviation ΔP constant, the output torque from the drive motor 30 and further the pressing load of the semiconductor chip 100 can be kept substantially constant. Thus, it is possible to effectively prevent the bump 104 from being broken and crushed before melting.

[0071] Simultaneously with the first process, the controller 16 also performs monitoring of the pressing load applied to the semiconductor chip 100 (S22). Since the pressing load is substantially proportional to the current value Id of the drive motor 30, the controller 16 monitors the current value Id of the drive motor 30 as a parameter indicative of the pressing load. If the bump 104 melts as a result of continued heating, the reaction force received by the mounting tool 20 from the semiconductor chip 100 sharply decreases, and the pressing load and further the current value Id sharply decrease. If such a sharp decrease in the current value Id occurs, the controller 16 determines that melting of the bump 104 has occurred.

[0072] Specifically, the controller 16 calculates the difference ΔId = Id[i-N] - Id[i] between the current current value Id[i] and the current value Id[i-N] before N samplings. Then, the controller 16 compares the difference ΔId with a prescribed reference value ΔId_def, and if ΔId ≥ ΔId_def, determines that the bump 104 has melted. Further, N is an integer of 1 or more. In Figure 3 In FIG. 16, at the time t3, it is determined that melting has occurred.

[0073] Further, in the present example, since the command position P* of the mounting tool 20 is set below the current position (Pd+σa) by the amount of the positional deviation ΔP*, the mounting tool 20 sometimes moves downward from the current position (Pd+σa) by the amount of the positional deviation ΔP* to reach the command position P* in a case where the melting of the bump 104 occurs and the reaction force from the semiconductor chip 100 decreases. In the movement at the time of melting of the bump 104, the amount of the positional deviation ΔP* is set to a sufficiently small value so as not to greatly crush the bump 104.

[0074] In a case where it is determined that the bump 104 has melted (Yes in S22), the controller 16 executes a second process of controlling the position of the mounting tool 20 so that the separation amount G becomes a desired value (S24). That is, the controller 16 updates the command position P* of the drive motor 30 to P*=Pg+σg at all times. Here, Pg is the position of the mounting tool 20 when the mounting tool 20 lands on the semiconductor chip 100 in a normal temperature state and the separation amount G is the desired value. Hereinafter, the Pg is referred to as a "standard position". The standard position Pg is a fixed value that is calculated in advance from the value of the separation amount G or the size value of the semiconductor chip 100, or the like. Further, σg is the amount of thermal expansion of the mounting tool 20 and the semiconductor chip 100. The σg is a variable value that varies depending on time or the temperature of the heater. By controlling the position of the mounting tool 20 using the command position P*=Pg+σg, it is possible to maintain the separation amount G at the desired value. Further, the controller 16 turns off the tool heater at an appropriate timing (S26). Thereafter, if a sufficient cooling time for hardening the bump 104 elapses (Yes in S28), the controller 16 drives the pressurizing mechanism 22 and the lifting mechanism 24 to raise the mounting tool 20 after the suction of the semiconductor chip 100 is released (S30).

[0075] As is clear from the above description, in the present example, the timing at which the current value of the drive motor 30, and further the pressing load, sharply decreases is detected as the melting timing of the bump 104. By providing the structure, it is possible to correctly detect the melting timing of the bump 104 without crushing the melted bump 104. Further, in the first process, the command position P* is updated at all times so that the positional deviation ΔP is constant, so it is possible to maintain the pressing load constant even if thermal expansion occurs. As a result, it is possible to effectively prevent the bump 104 before melting from being damaged by an excessive load.

[0076] Furthermore, the structure explained thus far is an example, and other structures can be appropriately changed as long as the first process of updating the command position P* in the vertical direction of the pressurizing mechanism 22 at any time after grounding and before the melting of the bump 104 so that the position deviation ΔP is constant, and the detection process of detecting the timing at which the pressing load is sharply reduced as the melting timing of the bump 104 are performed. For example, in the explanation thus far, the current value of the drive motor 30 is monitored as a parameter indicating the pressing load, but a load sensor can be provided to the pressurizing mechanism 22, and the detection value of the load sensor can be monitored. In addition, in the explanation, the value of the detection position Pd of the mounting tool 20 to which the thermal expansion amount σa at each sampling time is added is treated as the current position of the mounting tool 20, but other values can be used as the current position if thermal expansion is taken into consideration. For example, a profile of the displacement of the mounting tool 20 accompanying thermal expansion can be obtained in advance through experiments or the like, and the current position of the mounting tool 20 can be calculated from the profile. In addition, in the explanation, the drive motor 30 is used as the drive source of the pressurizing mechanism 22, but other drive sources, such as a battery cylinder or an oil hydraulic cylinder, can be used.

Claims

1. A semiconductor device manufacturing apparatus, characterized in that, include: Stage, supporting the substrate; The installation tool is capable of heating and holding a chip with bumps on its bottom surface; The pressure mechanism moves the mounting tool vertically and applies a load to the chip; and A controller controls the driving of the installation tool and the pressurizing mechanism, and the controller is configured to perform the following processing: The first process involves heating the chip using the mounting tool after it has landed on the substrate and before the bumps have melted, while simultaneously updating the command position of the pressure mechanism in the vertical direction to keep the positional deviation (the difference between the command position and the current position of the pressure mechanism) constant; and The detection process, performed simultaneously with the first process, monitors the pressing load applied to the chip by the pressurizing mechanism and detects the melting of the bump based on the reduction of the pressing load. The controller updates the value obtained by subtracting the target value of the position deviation greater than 0 from the sum of the detection position of the installation tool detected by the sensor and the thermal expansion at each sampling time, and uses this value as the command position. The pressurizing mechanism includes a voice coil motor that moves the installation tool in the vertical direction. The controller monitors the current value of the voice coil motor as a parameter representing the pressing load during the detection process.

2. The semiconductor device manufacturing apparatus according to claim 1, characterized in that, The controller then performs a second process, in which, after the time point at which the melting of the bump is detected in the detection process, the command position of the pressurizing mechanism is updated at any time so that the gap between the bottom surface of the chip and the substrate is maintained at the target value.

3. A method for manufacturing a semiconductor device, wherein the method for manufacturing the semiconductor device is characterized by comprising: The first step involves heating the chip, held by the mounting tool, onto a substrate supported by a stage after the chip has been placed onto the substrate and before the bumps on the bottom surface of the chip melt. Simultaneously, the command position of the pressure mechanism in the vertical direction is continuously updated to ensure that the positional deviation between the command position of the pressure mechanism (which moves the mounting tool in the vertical direction) and the current position remains constant. The detection step, performed simultaneously with the first step, monitors the pressing load applied to the chip by the pressurizing mechanism, and detects the melting of the bump based on the reduction of the pressing load. In the first step, the value obtained by subtracting the target value of the position deviation greater than 0 from the sum of the detection position of the installation tool detected by the sensor and the thermal expansion at each sampling time is updated and used as the command position. The pressurizing mechanism includes a voice coil motor that moves the installation tool in the vertical direction. In the detection step, the current value of the voice coil motor is monitored as a parameter representing the pressing load.

4. The method for manufacturing a semiconductor device according to claim 3, characterized in that, This further includes a second step, in which... After the time point at which the bump melts is detected in the detection step, the command position of the pressurizing mechanism is updated at any time to keep the gap between the bottom surface of the chip and the substrate at the target value.

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