Electronic package and method of making the same

Abstract

An electronic package and a method of manufacturing the same, including a heat dissipation structure arranged on a bearing structure to form a package space, an electronic component accommodated in the package space, and a heat dissipation material completely covering the electronic component to avoid the electronic component exposed outside the heat dissipation material, so as to improve the heat dissipation effect.

Description

Technical Field

[0001] This invention relates to a semiconductor packaging process, and more particularly to an electronic package with a heat dissipation structure and its manufacturing method. Background Technology

[0002] As electronic products demand higher functionality and processing speeds, semiconductor chips, as core components of these products, need to have a higher density of electronic components and circuits. Consequently, semiconductor chips generate significantly more heat during operation. Furthermore, the encapsulating colloids traditionally used to cover these semiconductor chips have a thermal conductivity of only 0.8 W / (m·Kelvin). -1 .k -1 If the material is a poor heat transfer material (i.e., has poor heat dissipation efficiency), the heat generated by the semiconductor chip cannot be effectively dissipated, which will cause damage to the semiconductor chip and product reliability issues.

[0003] Therefore, in order to quickly dissipate heat to the outside, the industry usually equips semiconductor packages with heat sinks or heat spreaders. These heat sinks are typically bonded to the back of the semiconductor chip using thermal adhesive, such as thermal interface material (TIM), so that the heat generated by the semiconductor chip can be dissipated through the thermal adhesive and the heat sink. In addition, the top surface of the heat sink is usually exposed to the encapsulation or directly exposed to the atmosphere to achieve better heat dissipation.

[0004] like Figure 1 As shown, in a conventional semiconductor package 1, a semiconductor wafer 11 is first disposed on a package substrate 10 with its working surface 11a using a flip-chip bonding method (i.e., through conductive bumps 110 and adhesive 111). Then, a heat sink 13 is bonded to the non-working surface 11b of the semiconductor wafer 11 with its top plate 130 via a TIM layer 12. The support feet 131 of the heat sink 13 are mounted on the package substrate 10 via an adhesive layer 14.

[0005] During operation, the heat generated by the semiconductor wafer 11 is conducted through the non-functional surface 11b and the TIM layer 12 to the top plate 130 of the heat sink 13 to dissipate heat to the outside of the semiconductor package 1.

[0006] However, in the existing semiconductor package 1, the TIM layer 12 is only laid on the non-functional surface 11b of the semiconductor wafer 11, resulting in poor heat dissipation.

[0007] Therefore, overcoming the various problems of the existing technologies has become a pressing issue that the industry urgently needs to address. Summary of the Invention

[0008] In view of the various shortcomings of the prior art, the present invention provides an electronic package and its manufacturing method, which can improve heat dissipation.

[0009] The electronic package of the present invention includes: a carrier structure; an electronic component disposed on the carrier structure; a heat dissipation structure including a heat sink covering the electronic component and a support foot erected on the heat sink, such that the support foot engages with the carrier structure, thereby forming a package space between the heat sink and the carrier structure, and the electronic component is located in the package space; and a heat dissipation material disposed in the package space and completely covering the electronic component, such that the electronic component is not exposed to the heat dissipation material.

[0010] The present invention also provides a method for manufacturing an electronic package, comprising: providing a heat dissipation structure and a carrier structure having an electronic component, wherein the heat dissipation structure includes a heat sink covering the electronic component and a support foot erected on the heat sink; combining the support foot with the carrier structure to form a package space between the heat sink and the carrier structure, and placing the electronic component in the package space; and distributing a heat dissipation material in the package space so that the heat dissipation material completely covers the electronic component, so that the electronic component is not exposed to the heat dissipation material.

[0011] In the aforementioned electronic package and its manufacturing method, the electronic component is in a flat package form.

[0012] In the aforementioned electronic package and its manufacturing method, the electronic component is in a vertical package form.

[0013] In the aforementioned electronic package and its manufacturing method, the support foot is fixed to the support structure by means of a bonding material. For example, the support foot has a receiving opening for filling the bonding material.

[0014] In the aforementioned electronic package and its manufacturing method, the support foot and the carrier structure are spaced apart to form an accommodating space. For example, a passive component is accommodated in this accommodating space.

[0015] In the aforementioned electronic package and its manufacturing method, the heat dissipation material does not fill the package space, so that the remaining space of the package space is used as the target space.

[0016] In the aforementioned electronic package and its manufacturing method, the heat dissipation structure has a first port and a second port communicating with the package space, and the first port and the second port are located at different locations, so that the heat dissipation material is filled into the package space through the first port, and the second port is used for venting. For example, after the heat dissipation material completely covers the electronic component, the first port and the second port are respectively sealed by a plurality of plugging members.

[0017] In the aforementioned electronic package and its manufacturing method, the support foot covers the side of the load-bearing structure.

[0018] The aforementioned electronic packaging components and their manufacturing methods also include clamping the support foot and the load-bearing structure with a fixture.

[0019] As can be seen from the above, the electronic package and its manufacturing method of the present invention mainly rely on the heat dissipation material to completely cover the electronic component, so that the electronic component will not be exposed from the heat dissipation material. Therefore, compared with the prior art, the present invention can greatly improve the heat dissipation effect. Attached Figure Description

[0020] Figure 1 This is a cross-sectional schematic diagram of an existing semiconductor package.

[0021] Figure 2 This is a cross-sectional schematic diagram of a first embodiment of the electronic package of the present invention.

[0022] Figure 2-1 and Figure 2-2 for Figure 2 Schematic diagram of partial cross-sections of different examples.

[0023] Figure 2A for Figure 2 A top view diagram along the cross section AA.

[0024] Figure 2B for Figure 2A Schematic diagram of cross-section along section line BB.

[0025] Figure 2C for Figure 2A A cross-sectional view along the CC section line.

[0026] Figures 3A to 3E This is a cross-sectional schematic diagram of the manufacturing method of a second embodiment of the electronic package of the present invention.

[0027] Figure 4 This is a cross-sectional schematic diagram of a second embodiment of the electronic package of the present invention.

[0028] Figure 4A for Figure 4 A top view diagram along the cross section of DD.

[0029] Figure 4B for Figure 4A A cross-sectional view along the EE section line.

[0030] Figure 4C for Figure 4A A cross-sectional view along section line FF.

[0031] Figure 5 This is a top view schematic diagram of a third embodiment of the electronic package of the present invention.

[0032] Figure 5-1 for Figure 5 Another example is a top view diagram.

[0033] Figure 5A for Figure 5 A cross-sectional view along the GG section line.

[0034] Figure 5B for Figure 5 A cross-sectional view along the HH section line.

[0035] Figure 5C for Figure 5 A sectional view along section line II.

[0036] Figure 5D for Figure 5C A cross-sectional view along section line JJ.

[0037] Figure 5E for Figure 5A Another example of a cross-sectional view.

[0038] Figure 5E-1 for Figure 5E Another example of a cross-sectional view.

[0039] Symbol Explanation

[0040] 1: Semiconductor package

[0041] 10: Packaging substrate

[0042] 11: Semiconductor wafers

[0043] 11a, 25a: Surface of action

[0044] 11b, 25b: Non-acting surfaces

[0045] 110: Conductive bump

[0046] 111: Base Rubber

[0047] 12: TIM layer

[0048] 13: Heat sink

[0049] 130: Top Film

[0050] 131: Support foot

[0051] 14: Adhesive layer

[0052] 2,3,5: Electronic packages

[0053] 2a, 5a: Heat dissipation structure

[0054] 20: Heat sink

[0055] 200: Heat sink

[0056] 201,501: First port

[0057] 202,502: Second port

[0058] 21,51: First supporting leg

[0059] 210, 220: Reception Port

[0060] 22: Second support leg

[0061] 23, 33: Heat dissipation material

[0062] 24: Load-bearing structure

[0063] 24c, 25c: Side view

[0064] 240:convex part

[0065] 25: Electronic Components

[0066] 250: Conductive bump

[0067] 26: Bonding material

[0068] 27: Passive components

[0069] 270: Insulating materials

[0070] 28: Plug-in parts

[0071] 59: Conductive elements

[0072] 500: Detect recesses

[0073] 60: Fixture

[0074] 81, 91: Air valve

[0075] 90: Filler

[0076] A1, A2: Target Space

[0077] H1, H2: Surface height

[0078] S: Packaging space

[0079] S1: Storage space

[0080] S2: Storage space

[0081] Y: Arrow direction. Detailed Implementation

[0082] The following specific embodiments illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.

[0083] It should be understood that the structures, proportions, sizes, etc., illustrated in the accompanying drawings of this specification are only for the purpose of assisting those skilled in the art in understanding and reading the content disclosed herein, and are not intended to limit the conditions under which the present invention can be implemented. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportional relationships, or adjustments to the size, without affecting the effects and objectives that the present invention can produce, should still fall within the scope of the technical content disclosed herein. Furthermore, the terms such as "above," "first," "second," and "a" used in this specification are only for clarity of description and are not intended to limit the scope of the present invention. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of the present invention.

[0084] Figure 2 This is a cross-sectional schematic diagram of the first embodiment of the electronic package 2 of the present invention.

[0085] like Figure 2 As shown, the electronic package 2 includes: a support structure 24, at least one electronic component 25 disposed on the support structure 24, a heat dissipation structure 2a disposed on the support structure 24 to cover the electronic component 25, and a heat dissipation material 23 covering the electronic component 25. The heat dissipation structure 2a includes a sheet-shaped heat sink 20 and a plurality of first support legs 21 and second support legs 22 erected on the heat sink 20.

[0086] A protruding heat sink 200 is integrally formed on a local surface of the heat sink 20.

[0087] In this embodiment, the heat sink 200 is cone-shaped or hill-shaped, with its tip closest to the electronic component 25.

[0088] The first supporting leg 21 serves as a wall-like outer leg, such as Figure 2A As shown, it is erected on the load-bearing structure 24 by means of a bonding material 26, such as an adhesive.

[0089] In this embodiment, the first support foot 21 may be formed with at least one receiving opening 210 for filling with colloid (such as the bonding material 26) as required.

[0090] The second support leg 22 is a column-shaped or wall-shaped inner leg, such as... Figure 2AAs shown, it is spaced apart from the support structure 24 to form an accommodating space S1 for accommodating at least one passive element 27 (e.g., resistor, capacitor and inductor) on the support structure 24, wherein the passive element 27 is electrically connected to the circuit layer of the support structure 24 and is covered with an insulating material 270.

[0091] In another embodiment, such as Figure 2-1 As shown, the second support leg 22 may be formed with at least one receiving opening 220 for applying a coating adhesive (such as the bonding material 26) to engage the protrusion 240 of the support structure 24, thus omitting the first support leg 21. The passive element 27 may be disposed on the support structure 24 surrounding the second support leg 22. Alternatively, as... Figure 2-2 As shown, the first support leg 21 and the second support leg 22 are both erected on the support structure 24, so that the first support leg 21 and the second support leg 22 form another accommodating space S2 for arranging at least one passive element 27 on the support structure 24, wherein the passive element 27 is electrically connected to the circuit layer of the support structure 24.

[0092] Therefore, the heat sink 20 is mounted on the support structure 24 by the first support foot 21 and / or the second support foot 22, so that a package space S (which may include the accommodating spaces S1, S2 as required) is formed between the heat sink 20 and the support structure 24, for the electronic component 25 (and passive component 27) to be accommodated in the package space S (and accommodating spaces S1, S2).

[0093] The heat dissipation material 23 is formed in the packaging space S to cover the electronic component 25, and the heat dissipation material 23 does not completely fill the packaging space S, so that the remaining part of the packaging space S is used as the target space A1, such as... Figure 2 As shown, the target space A1 is formed between the heat dissipation material 23 and the heat sink 20.

[0094] In this embodiment, the heat sink 23 has a high thermal conductivity of approximately 30–80 W / (m·Krvin). -1 K -1 For example, when an adhesive layer (not shown) is formed between the functional surface 25a of the electronic component 25 and the supporting structure 24 to insulate the conductive bump 250 from the outside, the heat sink 23 can be solid indium (In), liquid metal, or any other metallic material that is fluid at room temperature / high temperature, serving as a thermal interface material (TIM), such as a low-temperature melting heat-conducting material. If there is no adhesive layer (not shown) between the functional surface 25a of the electronic component 25 and the supporting structure 24, liquid oil or other liquids without metallic components can be used as the heat sink.

[0095] Furthermore, the heat sink 23 is formed using a filling method during the manufacturing process. For example, at the junction of the heat sink 20 and the first support leg 21 (or as... Figure 2-1 As shown, the second support leg 22) forms a first port 201 and a second port 202 located at different locations, as... Figure 2 As shown, it connects to the encapsulation space S so that after the heat dissipation structure 2a is fixed to the support structure 24, the heat dissipation material 23 is injected into the encapsulation space S through the first port 201, which serves as the filling end, so that the heat dissipation material 23 completely covers the electronic component 25. After the heat dissipation material 23 is filled, the first port 201 is sealed with the plug 28. Figure 2 and Figure 2A As shown. It should be understood that the second port 202 serves as an exhaust port to facilitate the flow of air through the heat sink 23 and expel a large amount of air from the package space S. After the heat sink 23 is filled, the second port 202 is sealed with a plug 28, as shown. Figure 2 and Figure 2A As shown, this leaves some air remaining in the target space A1.

[0096] The carrier structure 24 is a rectangular body, such as a packaging substrate with a core layer and circuit structure, a packaging substrate with a coreless circuit structure, a silicon interposer (TSI) with through-silicon vias (TSVs), or other board types. It includes at least one insulating layer and at least one circuit layer bonded to the insulating layer, such as at least one fan-out redistribution layer (RDL). It should be understood that the carrier structure 24 can also be other board materials for carrying wafers, such as lead frames, wafers, or other boards with metal routing, and is not limited to the above.

[0097] In this embodiment, the supporting structure 24 is placed flat on the process machine, with the first port 201 and the second port 202 of the heat dissipation structure 2a facing left and right.

[0098] The electronic component 25 is an active component, a passive component, a chip module, or a combination thereof, wherein the active component is, for example, a semiconductor chip, and the passive component is, for example, a resistor, a capacitor, and an inductor.

[0099] In this embodiment, the electronic component 25 is a flat-packaged semiconductor wafer with an opposing active surface 25a (or lower surface) and a non-active surface 25b (or upper surface). The active surface 25a is disposed on the circuit layer of the carrier structure 24 via multiple conductive bumps 250, such as solder, metal pillars, or other materials, in a flip-chip manner and electrically connected to the circuit layer. Each conductive bump 250 is covered by the heat sink 23 or a base adhesive (not shown). Alternatively, the electronic component 25 can be electrically connected to the circuit layer of the carrier structure 24 via multiple wire bonding wires (not shown). Or, the electronic component 25 can directly contact the circuit layer of the carrier structure 24. It should be understood that there are many ways in which the electronic component 25 is electrically connected to the carrier structure 24, and the required type and number of electronic components can be placed on the carrier structure 24, and it is not limited to the above.

[0100] Therefore, in the electronic package 2 of the present invention, the surface height H1 (i.e., liquid level position) of the heat sink 23 relative to the support structure 24 is higher than the surface height H2 (i.e., the height position of the non-functional surface 25b) of the electronic component 25 relative to the support structure 24, so that the heat sink 23 completely covers the functional surface 25a, non-functional surface 25b and side surface 25c of the electronic component 25 (e.g., ...). Figure 2B and Figure 2C As shown along Figure 2A (See the cross-sectional view of the BB and CC sections). Therefore, the electronic component 25 will not be exposed from the heat sink 23, and thus the electronic component 25 can effectively dissipate heat through the heat sink 23.

[0101] Furthermore, the heat sink 200 is designed to bring the heat dissipation structure 2a closer to the heat source of the electronic component 25, thereby increasing the heat dissipation effect. The heat sink 200 is also embedded in the heat dissipation material 23 to further enhance the heat dissipation effect.

[0102] In addition, the first support leg 21 is wall-shaped to prevent the liquid heat dissipation material 23 from overflowing.

[0103] Additionally, the gap between the first support leg 21 and the second support leg 22 serves as a channel, such as... Figure 2A As shown, the liquid heat sink 23 is contained therein, and since the heat source is a specific area (i.e. the electronic component 25), the liquid heat sink 23 can be induced to generate convection activity.

[0104] Figures 3A to 3E This is a cross-sectional schematic diagram of the manufacturing method of the electronic package 3 according to a second embodiment of the present invention. The difference between this embodiment and the first embodiment lies in the process configuration, so the similarities will not be described again below.

[0105] like Figure 3AAs shown, after the heat dissipation structure 2a is fixed on the support structure 24, it is rotated 90 degrees to make the heat dissipation structure 2a and the support structure 24 stand upright, so that the first port 201 and the second port 202 of the heat dissipation structure 2a face up and down. Therefore, the electronic component 25 is in an upright package form.

[0106] like Figure 3B As shown, the first port 201 located below the heat dissipation structure 2a is used as the filling end, so that the heat dissipation material 33 is filled into the encapsulation space S from bottom to top by the filler 90, and the second port 202 located above the heat dissipation structure 2a is used as the exhaust end, so that the air nozzle 91 is provided on the second port 202 for exhaust operation (as shown by the arrow direction Y).

[0107] like Figure 3C As shown, after the heat sink 33 overflows (or completely covers) the electronic component 25, the air nozzle 91 is removed, and the second port 202 is sealed with the plug 28.

[0108] In this embodiment, the surface height H2 of the heat sink 33 relative to the first port 201 (i.e., the liquid level position) is higher than the surface height H1 of the electronic component 25 relative to the first port 201 (i.e., the height position of the side 25c furthest from the first port 201), so that the heat sink 33 completely covers the active surface 25a, non-active surface 25b and side 25c of the electronic component 25, so that the electronic component 25 can effectively dissipate heat through the heat sink 33.

[0109] like Figure 3D As shown, the electronic package 3 is inverted so that the first port 201 is located above the heat dissipation structure 2a, serving as an exhaust end, so that another air nozzle 81 is provided on the first port 201 for exhaust operation (as shown by arrow Y). After the air in the package space S is exhausted, the first port 201 is sealed with another plug 28, so that the target space A2 is formed between the upper first support foot 21 and the heat dissipation material 23.

[0110] like Figure 3E As shown, another air nozzle 81 is removed to form the electronic package 3.

[0111] Therefore, the electronic package 3 of the present invention utilizes the surface height H1 of the heat sink 33 relative to the second port 202 (e.g., Figure 4 and Figure 4A The liquid level position shown is higher than the surface height H2 of the electronic component 25 relative to the second port 202 (e.g., Figure 4 and Figure 4A (as shown in the height position of the side 25c furthest from the second port 202), so that the heat sink 33 completely covers the active surface 25a, non-active surface 25b and side 25c of the electronic component 25 (as shown in the height position of the side 25c furthest from the second port 202), so that the heat sink 33 completely covers the active surface 25a, non-active surface 25b and side 25c of the electronic component Figure 4 , Figure 4B and Figure 4C As shown in the figure, the electronic component 25 will not be exposed from the heat sink 33, and thus the electronic component 25 can effectively dissipate heat through the heat sink 33.

[0112] Figure 5 and Figure 5A This is a cross-sectional schematic diagram of a third embodiment of the electronic package 5 of the present invention. The difference between this embodiment and the above embodiments lies in the design of the heat dissipation structure 5a, so the similarities will not be repeated below.

[0113] like Figure 5A As shown, in a flat package configuration, the first support foot 51 of the heat dissipation structure 5a is attached to the side 24c of the support structure 24 via the bonding material 26, and a plurality of conductive elements 59 containing solder can be disposed at the bottom of the support structure 24. It should be understood that in a vertical package configuration (such as...) Figure 5E As shown), the first support leg 51 of the heat dissipation structure 5b can also be connected to the side 24c of the support structure 24 by means of the bonding material 26.

[0114] In this embodiment, the first port 501 and the second port 502 are formed through the heat sink 20, such as... Figure 5 and Figure 5C As shown.

[0115] Furthermore, at least one detection recess 500 may be formed on the inner side of the heat sink 20, such as... Figure 5 The four shown are for detecting whether the surface height of the heat sink 23 relative to the supporting structure 24 (i.e., the liquid level position) is higher than the surface height of the electronic component 25 relative to the supporting structure 24 (i.e., the height position of the non-functional surface 25b), thus effectively ensuring that the heat sink 23 completely covers the electronic component 25. Figure 5B , Figure 5C and Figure 5D As shown.

[0116] Therefore, when the detection instrument (illustration omitted) detects a predetermined height (such as...) Figure 5C When the detection recess 500 shown is filled with the heat sink 23, it can be determined that the heat sink 23 has completely covered the electronic component 25.

[0117] Furthermore, after the exhaust process, the encapsulation space S will be under negative pressure. Therefore, the heat sink 23 will not fill the encapsulation space S and will form target spaces A1 and A2. In the subsequent thermal process, the heat sink 23 can fill the target spaces A1 and A2 when it expands due to heat, thus avoiding the problem of board explosion.

[0118] In addition, such as Figure 5-1As shown, in a flat package configuration, after the first support leg 21 of the heat dissipation structure 2a is connected to the support structure 24 via the bonding material 26, the first support leg 51 and the side surface 24c of the support structure 24 can be clamped by the clamp 60 to facilitate subsequent operations. For example, the clamp 60 is located outside the four edges of the heat sink 20. It should be understood that in a vertical package configuration (such as...) Figure 5E-1 As shown), the first support leg 21 and the side 24c of the bearing structure 24 can also be clamped by the clamp 60.

[0119] In summary, the electronic package and its manufacturing method of the present invention mainly rely on the heat dissipation material 23, 33 to completely cover the electronic component 25 in order to effectively dissipate heat from the electronic component 25. Therefore, regardless of whether the electronic component 25 is in a flat package or a vertical package, the heat dissipation material 23, 33 must completely cover the electronic component 25.

[0120] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the invention. Any person skilled in the art can make modifications to the above embodiments without departing from the spirit and scope of the invention. Therefore, the scope of protection of the present invention should be as set forth in the claims.

Claims

1. An electronic package, characterized by Including: a carrier structure; an electronic component disposed on the carrier structure; a heat dissipation structure including a heat sink covering the electronic component and a support leg erected on the heat sink, and the heat dissipation structure is combined with the carrier structure through the support leg, so that a packaging space is formed between the heat sink and the carrier structure, and the electronic component is located in the packaging space; and a heat dissipation material disposed in the packaging space and completely covering the electronic component, so that the electronic component is not exposed outside the heat dissipation material, wherein the heat dissipation structure is formed with a first port and a second port communicating with the packaging space, and the first port and the second port are located at different positions. The electronic component is in a flat package form.

2. The electronic package of claim 1, wherein, The electronic component is in a vertical package form.

3. The electronic package of claim 1, wherein, The support leg is fixed to the carrier structure by a bonding material.

4. The electronic package of claim 1, wherein, The support leg is formed with a receiving opening filled with the bonding material.

5. The electronic package of claim 4, wherein, The support leg and the carrier structure are arranged in a spaced manner to form a receiving space.

6. The electronic package of claim 1, wherein, The receiving space contains a passive component.

7. The electronic package of claim 6, wherein, The heat dissipation material does not fill the packaging space.

8. The electronic package of claim 1, wherein, The electronic package further includes a plurality of plug members respectively covering the first port and the second port.

9. The electronic package of claim 1, wherein, The support leg covers the side surface of the carrier structure.

10. The electronic package of claim 1, wherein, The electronic package further includes a clamp clamping the support leg and the carrier structure.

11. The electronic package of claim 1, wherein, Including:

12. A method of fabricating an electronic package, comprising: providing a heat dissipation structure and a carrier structure provided with an electronic component, wherein the heat dissipation structure includes a heat sink covering the electronic component and a support leg erected on the heat sink; combining the support leg with the carrier structure, so that a packaging space is formed between the heat sink and the carrier structure, so that the electronic component is located in the packaging space; and providing a heat dissipation material in the packaging space, so that the heat dissipation material completely covers the electronic component, so that the electronic component is not exposed outside the heat dissipation material, wherein the heat dissipation structure is formed with a first port and a second port communicating with the packaging space, and the first port and the second port are located at different positions, so that the heat dissipation material is filled into the packaging space through the first port, and exhausts through the second port. The electronic component is in a flat package form.

13. The method of making an electronic package of claim 12, wherein, The electronic component is in a vertical package form.

14. The method of making an electronic package of claim 12, wherein, The support leg is fixed to the carrier structure by a bonding material.

15. The method of claim 12, wherein the electronic package is a flip-chip package. The support leg is formed with a receiving opening filled with the bonding material.

16. The method of making an electronic package of claim 15, wherein, The support leg and the carrier structure are arranged in a spaced manner to form a receiving space.

17. The method of making an electronic package of claim 12, wherein, The receiving space contains a passive component.

18. The method of making an electronic package of claim 17, wherein, The heat dissipation material does not fill the packaging space.

19. The method of making an electronic package of claim 12, wherein, The method further includes covering the first port and the second port with a plurality of plug members after the heat dissipation material completely covers the electronic component.

20. The method of making an electronic package of claim 12, wherein, The support leg covers the side surface of the carrier structure.

21. The method of making an electronic package of claim 12, wherein, The method further includes clamping the support leg and the carrier structure with a clamp.

22. The method of making an electronic package of claim 12, wherein, ​

Images