Substrate liquid processing apparatus and substrate liquid processing method

Abstract

The present invention provides a substrate liquid processing apparatus and a substrate liquid processing method that are advantageous in suppressing adhesion of particles to a substrate. A liquid supply nozzle is moved along a nozzle movement path that includes a first movement position, which is a position at which the liquid supply nozzle releases a processing liquid to a first release site in a processing surface of the substrate, which is located at a peripheral edge portion, and a second movement position, which is a position at which the liquid supply nozzle releases the processing liquid to a second release site in the processing surface, which is closer to a rotation axis than the first release site. A first liquid receiving surface of a first liquid receiving portion receives at least a portion of the processing liquid that is released from the liquid supply nozzle disposed at the second movement position and scatters from the processing surface. A second liquid receiving surface of a second liquid receiving portion receives at least a portion of the processing liquid that is released from the liquid supply nozzle disposed at the first movement position and scatters from the processing surface.

Description

Technical Field

[0001] This invention relates to a substrate liquid treatment apparatus and a substrate liquid treatment method. Background Technology

[0002] In the processing apparatus disclosed in Patent Document 1, a processing liquid is supplied to the surface of a substrate, such as a semiconductor wafer, while the substrate is rotated about a vertical axis. The processing liquid expands outward from the substrate surface due to centrifugal force. The processing liquid that has dispersed from the substrate is captured by the inner wall of a cup-shaped body surrounding the substrate and is recovered through a drain pipe from a drain port provided at the bottom of the cup-shaped body.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2006-147672 Summary of the Invention

[0006] The technical problem that the invention aims to solve

[0007] This invention provides a technique that helps to suppress the adhesion of particles to the substrate.

[0008] Technical solutions for solving technical problems

[0009] According to one aspect of the present invention, a substrate liquid treatment apparatus is disclosed, comprising: a substrate holding portion for holding a substrate; a substrate rotating portion for rotating the substrate about a rotation axis; a liquid supply nozzle for discharging treatment liquid onto a treatment surface of the substrate; a nozzle moving mechanism for moving the liquid supply nozzle along a nozzle moving path including a first moving position and a second moving position, wherein the first moving position is a position where the liquid supply nozzle discharges treatment liquid to a first release portion located at the periphery of the treatment surface, and the second moving position is a position where the liquid supply nozzle discharges treatment liquid to a second release portion of the treatment surface closer to the rotation axis than the first release portion; a first liquid receiving portion disposed at a position horizontally spaced from the substrate, having a first liquid receiving surface, the first liquid receiving surface receiving at least a portion of the treatment liquid discharged from the liquid supply nozzle disposed at the second moving position and scattered from the treatment surface; and a second liquid receiving portion disposed between the substrate and the first liquid receiving portion, having a second liquid receiving surface, the second liquid receiving surface receiving at least a portion of the treatment liquid discharged from the liquid supply nozzle disposed at the first moving position and scattered from the treatment surface.

[0010] Invention Effects

[0011] According to the present invention, it is beneficial to suppress the adhesion of particles to the substrate. Attached Figure Description

[0012] Figure 1This is a top view showing a structural example of the substrate liquid treatment apparatus according to the first embodiment.

[0013] Figure 2 This is a longitudinal sectional view showing a structural example of the substrate liquid treatment apparatus of the first embodiment.

[0014] Figure 3 This is a cross-sectional view illustrating the outline structure of the liquid supply nozzle, substrate, first liquid receiving cup, and second liquid receiving section.

[0015] Figure 4 This is a cross-sectional view illustrating the outline structure of the liquid supply nozzle, substrate, first liquid receiving cup, and second liquid receiving section.

[0016] Figure 5 This is a flowchart illustrating an example of substrate cleaning processing using a substrate liquid treatment device.

[0017] Figure 6 This is a cross-sectional view illustrating the outline structure of the first liquid receiving cup and the second liquid receiving part in a first modified example.

[0018] Figure 7 This is a cross-sectional view illustrating the outline structure of the first liquid receiving cup and the second liquid receiving part in a first modified example.

[0019] Figure 8 This is a cross-sectional view illustrating the general structure of the first liquid receiving cup and the second liquid receiving part in the second modified example.

[0020] Figure 9 This is a cross-sectional view illustrating the general structure of the first liquid receiving cup and the second liquid receiving part in the second modified example.

[0021] Figure 10 This is a top view showing an example of the configuration of the second liquid receiving section. Detailed Implementation

[0022] Hereinafter, with reference to the accompanying drawings, embodiments of the substrate solution treatment apparatus and the substrate solution treatment method will be described.

[0023] Figure 1 This is a top view showing a structural example of the substrate liquid treatment apparatus according to the first embodiment. Figure 2 This is a longitudinal sectional view showing a structural example of the substrate liquid treatment apparatus according to the first embodiment. For example... Figure 1 and Figure 2 As shown, the X, Y, and Z axes are defined as orthogonal to each other, with the positive direction of the Z-axis being the vertically upward direction. Figure 1 and Figure 2 The same substrate liquid treatment apparatus 1 is shown in the figure, but some elements of the substrate liquid treatment apparatus 1 (e.g., guide rail 82) are shown in only one figure and are omitted in another figure.

[0024] The substrate liquid treatment apparatus 1 includes two adsorption pads 10, a rotary chuck 11, a housing 13, a first cleaning section 17, and a second cleaning section 18. Each adsorption pad 10 and the rotary chuck 11 functions as a substrate holding section for holding a substrate W; in the illustrated example, they horizontally adsorb and hold the lower surface of the substrate W. The substrate W is typically composed of a semiconductor wafer, a glass substrate, etc., but there are no particular limitations. Circuitry is formed on at least one of the upper and lower surfaces of the substrate W (in this example, the upper surface of the substrate W). The housing 13 has an opening at the top. The first cleaning section 17 performs cleaning treatment on the upper surface of the substrate W. The second cleaning section 18 performs cleaning treatment on the lower surface of the substrate W.

[0025] like Figure 1 As shown, the two suction pads 10 have elongated, generally rectangular planar shapes, and are arranged approximately parallel to each other across the rotating chuck 11 in a top view, in a manner that allows them to be held near the periphery of the lower surface of the substrate W. Each suction pad 10 is supported by a support plate 14. Each support plate 14 has a generally rectangular planar shape that is longer than the corresponding suction pad 10, and its two ends are supported by a frame 15. The frame 15 is configured to be movable horizontally by a drive mechanism (not shown). Figure 1 (X-axis direction) and up and down directions ( Figure 1 The adsorption pad 10 moves along the Z-axis direction. In this way, each adsorption pad 10 functions as a substrate contact portion that contacts the substrate W, and the support plate 14 functions as a contact support portion that supports the corresponding adsorption pad 10.

[0026] A first liquid receiving cup (first liquid receiving part) 16 and a second liquid receiving part 30 are provided on the upper surface of the frame 15. An opening with a diameter larger than that of the substrate W is formed in the upper part of the first liquid receiving cup 16, through which the substrate W of the adsorption pad 10 is transferred.

[0027] like Figure 2 As shown, the rotary chuck 11 is connected to the drive mechanism 21 via the shaft 20, and can rotate around the rotation axis Ar and move up and down along the rotation axis Ar via the drive mechanism 21. In this way, the drive mechanism 21 works as a substrate rotating part that causes the substrate W held by the rotary chuck 11 to rotate around the rotation axis Ar.

[0028] A plurality of (e.g., three) lifting pins 22 are provided around the rotary chuck 11. These lifting pins 22 are configured to be raised and lowered by a lifting mechanism (not shown). Thus, the substrate W can be transferred between the lifting pins 22 and a conveying mechanism (not shown) located outside the substrate liquid treatment apparatus 1, and the substrate W can also be transferred between the lifting pins 22 and the two adsorption pads 10.

[0029] The bottom of the housing 13 is provided with a drain pipe 40 for discharging cleaning fluid and an exhaust pipe 41 for forming a downward airflow in the substrate liquid treatment device 1 and discharging the airflow.

[0030] Next, the structure of the first cleaning unit 17 and the second cleaning unit 18 will be described.

[0031] The first cleaning section 17 has a liquid supply nozzle 50. The liquid supply nozzle 50 has a release port facing downwards (i.e., vertically downwards). When the liquid supply nozzle 50 is positioned above the substrate W (particularly the upper surface) held by the substrate holding section (particularly the rotary chuck 11 in this example), the liquid supply nozzle 50 releases processing liquid from the release port to the processing surface (the upper surface in this example) of the substrate W. Thus, processing liquid is supplied to the upper surface of the substrate W.

[0032] In this embodiment, the liquid supply nozzle 50 operates as a cleaning nozzle for cleaning the substrate W (particularly the upper surface), and the processing liquid released from the liquid supply nozzle 50 is a cleaning liquid (cleaning fluid) such as pure water. However, the liquid supply nozzle 50 can also be used for purposes other than cleaning, and the processing liquid released from the liquid supply nozzle 50 is not limited to a cleaning liquid. For example, a coating solution, a developing solution, other chemicals, or other liquids can be supplied to the processing surface of the substrate W from the liquid supply nozzle 50.

[0033] The liquid supply nozzle 50 can be configured as a single-fluid nozzle that only releases the processing liquid, or as a multi-fluid nozzle that simultaneously releases two or more fluids containing the processing liquid. In this embodiment, the liquid supply nozzle 50 is configured as a two-fluid nozzle, releasing gas (e.g., compressed air) along with the processing liquid. When gas is released from the liquid supply nozzle 50 along with the processing liquid, an upward airflow along the first liquid receiving surface 16a is easily generated, exacerbating concerns about "unintended flight of processing liquid from the first liquid receiving surface 16a and re-adhesion of processing liquid to the substrate W," as described later. Therefore, when the liquid supply nozzle 50 releases gas along with the processing liquid, the effect of preventing "flight of processing liquid from the first liquid receiving surface 16a and re-adhesion of processing liquid to the substrate W," as described later, can be more advantageously enjoyed.

[0034] A liquid supply nozzle 50 is mounted on an arm 70. A portion of a processing liquid supply pipe (not shown) is provided on the arm 70. The processing liquid supply pipe is connected to a processing liquid supply source (not shown) and the liquid supply nozzle 50, supplying cleaning liquid from the processing liquid supply source to the liquid supply nozzle 50. An on / off valve (not shown) driven by the control unit 200 is provided on the processing liquid supply pipe. The flow path of the processing liquid supply pipe is opened by the on / off valve, thereby supplying cleaning liquid to the liquid supply nozzle 50 and releasing it from the release port. On the other hand, the flow path of the processing liquid supply pipe is closed by the on / off valve, thereby stopping the supply of cleaning liquid to the liquid supply nozzle 50 and stopping the release of cleaning liquid.

[0035] Arm 70 is connected to movable part 71. Movable part 71 moves together with arm 70 along guide rail 72 extending in the horizontal direction (here, the X-axis direction), causing arm 70 to move horizontally. In addition, movable part 71 causes arm 70 to move up and down in the vertical direction (Z-axis direction). This combination of movable part 71 and guide rail 72 works as a nozzle moving mechanism that moves liquid supply nozzle 50 along nozzle moving path.

[0036] The nozzle movement path in this embodiment includes a first movement position and a second movement position. The liquid supply nozzle 50 positioned at the first movement position releases cleaning fluid to a first release portion located at the periphery of the upper surface of the substrate W. Conversely, the liquid supply nozzle 50 positioned at the second movement position releases cleaning fluid to a second release portion (i.e., a non-periphery portion) on the upper surface of the substrate W that is closer to the rotation axis Ar than the first release portion. The liquid supply nozzle 50 releases cleaning fluid while moving along the nozzle movement path including the first and second movement positions, thereby enabling the supply of cleaning fluid to different portions of the upper surface of the substrate W in the radial direction.

[0037] Figure 1 and Figure 2 The liquid supply nozzle 50 shown is movable along the X-axis in the horizontal direction with the arm 70, but not in the Y-axis direction. Therefore, the nozzle movement path, including the first and second movement positions, is contained within the same plane extending in the X-axis direction (i.e., the same plane having a normal extending in the Y-axis direction). Furthermore, Figure 1 and Figure 2 The liquid supply nozzle 50 shown releases cleaning fluid in a vertically downward direction along the Z-axis. Therefore, the first and second release portions on the substrate W are located directly below the first and second moving positions of the liquid supply nozzle 50, respectively, and are contained together with the first and second moving positions in the same plane extending in the X-axis direction.

[0038] The second cleaning unit 18 has a second cleaning body 181, a second support member 182, and a second drive unit 183.

[0039] The second cleaning body 181 is a component that can be pressed onto the lower surface of the substrate W. The second cleaning body 181 is not limited; for example, it can be a brush composed of numerous bristles or a sponge. The upper surface of the second cleaning body 181 functions as a contact surface with the substrate W and has, for example, a circular shape smaller than the upper surface of the substrate W.

[0040] A second support member 182 is provided on the lower surface of the second cleaning body 181. The second support member 182 extends in the vertical direction (Z-axis direction) and supports the second cleaning body 181 at one end.

[0041] A second drive unit 183 is provided at the other end of the second support member 182. The second drive unit 183 is capable of rotating the second support member 182 about a vertical axis, and thereby enabling the second cleaning body 181 supported by the second support member 182 to rotate about a vertical axis.

[0042] The second cleaning section 18 is horizontally supported by the arm 80. The cleaning nozzle 80a is provided on the arm 80 adjacent to the second cleaning body 181. The cleaning nozzle 80a supplies a cleaning fluid (cleaning fluid) such as pure water to the lower surface of the substrate W held by the adsorption pad 10 or the rotary chuck 11.

[0043] Arm 80 is connected to movable part 81. Movable part 81 moves together with arm 80 along guide rail 82 extending in the horizontal direction (here, the Y-axis direction), causing arm 80 to move horizontally. In addition, movable part 81 causes arm 80 to move up and down in the vertical direction (Z-axis direction).

[0044] The arm 80 extends and retracts in the horizontal direction (X-axis direction), for example, via a drive unit not shown. Thus, the arm 80 enables the second cleaning section 18 and the cleaning nozzle 80a to move in the X-axis direction (i.e., the same direction as the movement direction of the first cleaning section 17).

[0045] The arm 80 is provided with a load detection unit 85 for detecting the pressing pressure applied by the second cleaning body 181 to the substrate W. The load detection unit 85 is, for example, a load cell.

[0046] The substrate liquid treatment device 1 described above is equipped with Figure 1 The control unit 200 is shown. The control unit 200 is, for example, a computer, and has a program storage unit (not shown). The program storage unit stores a program for controlling the processing of the substrate W in the substrate liquid treatment apparatus 1. Furthermore, the program storage unit stores programs for controlling the operation of the various drive devices, moving devices, and other drive systems, as well as various nozzles, to achieve the cleaning process in the substrate liquid treatment apparatus 1. These programs can be recorded in a computer-readable storage medium H and installed from that storage medium H into the control unit 200. As the storage medium H, for example, a computer-readable hard disk (HD), floppy disk (FD), optical disk (CD), magneto-optical disk (MO), and memory card can be used.

[0047] Next, the structure of the first liquid receiving cup 16 and the second liquid receiving part 30 will be described.

[0048] The first liquid receiving cup 16 has a cylindrical shape with openings at the top and bottom. A rotating chuck 11 and adsorption pads 10 are positioned inside the first liquid receiving cup 16. Therefore, the substrate W held by the rotating chuck 11 or each adsorption pad 10 is also positioned inside the first liquid receiving cup 16. Thus, the first liquid receiving cup 16 is positioned horizontally separated from the rotating chuck 11, each adsorption pad 10, and the substrate W held by the rotating chuck 11 or each adsorption pad 10.

[0049] The second liquid receiving portion 30 has a wall-like shape and is positioned inside the first liquid receiving cup-shaped body 16, between the substrate W held by the rotating chuck 11 or each adsorption pad 10 and the first liquid receiving cup-shaped body 16. Thus, in this example, the second liquid receiving portion 30 (particularly the second liquid receiving surface 30a formed by the inner wall surface) is only provided around a portion of the peripheral edge of the substrate W held by the substrate holding portion (each adsorption pad 10 or the rotating chuck 11). However, the second liquid receiving portion 30 (particularly the second liquid receiving surface 30a) may also be provided around the entire peripheral edge of the substrate W.

[0050] The first liquid receiving surface 16a, formed by the inner wall of the first liquid receiving cup 16, and the second liquid receiving surface 30a, formed by the inner wall of the second liquid receiving part 30, receive at least a portion of the cleaning liquid released from the liquid supply nozzle 50 and scattered from the upper surface of the substrate W.

[0051] Figure 3 and Figure 4 This is a cross-sectional view showing the outline structure of the liquid supply nozzle 50, the substrate W, the first liquid receiving cup 16, and the second liquid receiving section 30. Figure 3 and Figure 4 In this diagram, elements other than the liquid supply nozzle 50, the substrate W, the first liquid receiving cup 16, and the second liquid receiving section 30 are omitted from the illustration. Furthermore, for ease of understanding, in... Figure 3 and Figure 4 In the diagram, the first liquid receiving cup 16 and the second liquid receiving portion 30 are exaggeratedly depicted, with only a portion shown on the substrate W. Therefore, the shape and size of the first liquid receiving cup 16 and the second liquid receiving portion 30 are shown in an exaggerated manner. Figure 1 and Figure 2 "and" Figure 3 and Figure 4 The inconsistency lies in the shape and size of the first liquid receiving cup 16 and the second liquid receiving part 30. However, the difference in shape and size is merely a matter of representation. Figures 1-4 The text indicates that the same first liquid receiving cup 16 and the same second liquid receiving part 30 are present.

[0052] The upper end of the first liquid receiving cup 16 is formed by an inwardly inclined first liquid receiving inclined portion 16b, and the first liquid receiving vertical portion 16c extends from the lower end of the first liquid receiving inclined portion 16b in a vertically downward direction. Similarly, the upper end of the second liquid receiving portion 30 is formed by an inwardly inclined second liquid receiving inclined portion 30b, and the second liquid receiving vertical portion 30c extends from the lower end of the second liquid receiving inclined portion 30b in a vertically downward direction.

[0053] The first liquid receiving surface 16a of the first liquid receiving cup 16 is configured to receive liquid from the liquid disposed at the second movable position (see above). Figure 3 The first liquid receiving surface 16a receives at least a portion of the processing liquid L released from the liquid supply nozzle 50 and scattered from the upper surface of the substrate W. Specifically, the first liquid receiving surface 16a receives at least a portion of the processing liquid L that "landed on the upper surface of the substrate W closer to the rotation axis Ar than the periphery (i.e., the second release location) and was subsequently ejected from the substrate W." The term "second release location" here does not refer to a specific location, but rather to the range from the liquid supply nozzle 50 where the processing liquid L is released from the upper surface of the substrate W towards the side closer to the rotation axis Ar than the periphery.

[0054] On the other hand, the second liquid receiving surface 30a of the second liquid receiving section 30 is configured to receive liquid from the liquid disposed at the first moving position (see reference). Figure 4 At least a portion of the processing liquid L released by the liquid supply nozzle 50 and scattered from the upper surface of the substrate W. That is, the second liquid receiving surface 30a receives at least a portion of the processing liquid L that "landed on the periphery of the upper surface of the substrate W (i.e., the first release location) and was subsequently ejected from the substrate W". The term "first moving location" here is not limited to referring to only one specific location.

[0055] In this way, not only is a first liquid receiving cup 16 provided, but a second liquid receiving section 30 is also provided, thereby properly receiving and recovering the processing liquid L ejected from the substrate W, and effectively preventing the processing liquid L flying from the substrate W from re-adhering to the substrate W. Processing liquid L re-adhering to the substrate W may introduce particles (e.g., blocky particles) into the substrate W. Therefore, by providing the first liquid receiving cup 16 and the second liquid receiving section 30, the adhesion of particles to the substrate W can be suppressed.

[0056] For example, consider a case where a first liquid receiving cup 16 is provided, but a second liquid receiving section 30 is not provided. In this case, the processing liquid L ejected from the substrate W is basically caught by the first liquid receiving surface 16a and then flows along the first liquid receiving surface 16a. The first liquid receiving surface 16a has a structure that promotes the downward flow of the processing liquid L, but due to the specific shape of the first liquid receiving surface 16a, some of the processing liquid L sometimes flows upward along the first liquid receiving surface 16a. For example, when the airflow flowing upward along the first liquid receiving surface 16a is small, the concern that the processing liquid L flowing upward along the first liquid receiving surface 16a will re-adhere to the substrate W after leaving the first liquid receiving surface 16a is very small. On the other hand, when the airflow flowing upward along the first liquid receiving surface 16a is large, the processing liquid L adhering to the first liquid receiving surface 16a gradually grows (increases) while flowing upward along the first liquid receiving surface 16a, and the concern that it will fly from the first liquid receiving surface 16a and re-adhere to the substrate W is aggravated.

[0057] In particular, when the processing liquid L is released from the liquid supply nozzle 50 to the periphery of the upper surface of the substrate W (see reference). Figure 4 The tendency of the processing liquid L to fly in directions other than the horizontal direction increases, and the flight direction of the processing liquid L after landing on the substrate W also tends to become unstable. For example, at the protrusion of the first liquid receiving cup 16 (see reference) where the processing liquid L flows into the substrate W... Figure 3 and Figure 4 When the "first liquid receiving protrusion 16d" shown is in flight, a strong airflow may be generated from the protrusion and flow upward along the first liquid receiving surface 16a. In this case, the processing liquid L flowing upward along the first liquid receiving surface 16a may be carried by the rising airflow and fly from the first liquid receiving surface 16a to adhere to the substrate W.

[0058] On the other hand, according to this embodiment, such as Figure 4 As shown, the processing liquid L released from the liquid supply nozzle 50 to the periphery of the upper surface of the substrate W is properly received by the second liquid receiving surface 30a of the second liquid receiving part 30, which is separately provided from the first liquid receiving cup 16. Therefore, it is possible to prevent the processing liquid L ejected from the substrate W from re-adhering to the substrate W (especially the upper surface) by an unwanted upward airflow.

[0059] Therefore, the second liquid receiving section 30 preferably has the property of being suitable for receiving the processing liquid L released from the liquid supply nozzle 50 to the periphery of the upper surface of the substrate W. Furthermore, the second liquid receiving section 30 preferably has the property of not generating or being unlikely to generate a large upward airflow.

[0060] Therefore, the upper end of the first liquid receiving surface 16a of the first liquid receiving cup 16 is located above the substrate W held by each adsorption pad 10 or the rotary chuck 11, and the upper end of the second liquid receiving surface 30a of the second liquid receiving part 30 is located below the substrate W (particularly the upper surface). Thus, the upper end of the second liquid receiving surface 30a of the second liquid receiving part 30 is located below the upper end of the first liquid receiving surface 16a of the first liquid receiving cup 16. As a result, the liquid supply nozzle 50 (see reference 1) from the second moving position can be efficiently recovered via the first liquid receiving surface 16a. Figure 3 The released processing liquid L is efficiently recovered from the liquid supply nozzle 50 at the first moving position via the second liquid receiving surface 30a (see reference). Figure 4 The released treatment liquid L.

[0061] Furthermore, the upper end of the second liquid receiving section 30 is formed by the second liquid receiving inclined section 30b, and the portion of the second liquid receiving surface 30a including the upper end (i.e., the second liquid receiving surface 30a of the second liquid receiving inclined section 30b) becomes increasingly horizontally distant from the rotation axis Ar as it moves downward. This promotes the downward flow of the processing liquid L received by the second liquid receiving surface 30a, preventing the processing liquid L from re-adhering to the substrate W. The tilting angle and other tilting method of the second liquid receiving inclined section 30b are not limited, but it is preferable that the second liquid receiving inclined section 30b has a tilting method that facilitates the downward guidance of the processing liquid L released from the liquid supply nozzle 50 to the periphery of the substrate W and flying outwards from the substrate W.

[0062] Furthermore, at least a portion (preferably all) of the second liquid receiving surface 30a of the second liquid receiving portion 30 is hydrophilic. For example, the second liquid receiving portion 30 can be made hydrophilic by using a material with excellent hydrophilicity. Alternatively, the second liquid receiving surface 30a can be made hydrophilic by performing a hydrophilization treatment.

[0063] Furthermore, the horizontal cross-sectional shape of the second liquid receiving surface 30a of the second liquid receiving section 30 is arc-shaped. This allows for control of the overall size of the second liquid receiving section 30 and ensures that the second liquid receiving surface 30a is sufficiently large, effectively receiving the liquid supply nozzle 50 (see reference 50) from the first moving position. Figure 4 The released treatment liquid L.

[0064] As described above, the second liquid receiving surface 30a of the second liquid receiving section 30 is configured to receive the processing liquid L released from the liquid supply nozzle 50 to the periphery of the substrate W. Therefore, the second liquid receiving surface 30a is preferably provided at least in the range that the processing liquid L released from the liquid supply nozzle 50 to the periphery of the substrate W may fly away from the substrate W. Figures 1-4The second liquid receiving section 30 (including the second liquid receiving surface 30a) shown is positioned horizontally in the first movable position of the liquid supply nozzle 50 for discharging the processing liquid L to the periphery of the substrate W (see reference). Figure 4 Between the first liquid receiving cup 16 and the first liquid receiving cup.

[0065] Next, a method for cleaning substrate W using the substrate solution treatment apparatus 1 (i.e., a substrate solution treatment method) will be described. The substrate W cleaning method described below is performed by driving the various components constituting the substrate solution treatment apparatus 1 under the control of the control unit 200.

[0066] Figure 5 This is a flowchart illustrating an example of a cleaning process for substrate W performed using substrate liquid treatment apparatus 1.

[0067] In the substrate liquid treatment apparatus 1, the first step is to perform a feeding process ( Figure 5 Step S1). During the feeding process, with the substrate W, conveyed by the conveying mechanism (not shown), positioned above the upper opening of the first liquid receiving cup 16 and above each lifting pin 22, the lifting pins 22 rise, with their tips passing through the upper opening of the first liquid receiving cup 16. Thus, above the first liquid receiving cup 16, the substrate W is transferred from the conveying mechanism to the lifting pins 22. At this time, the upper surface of the adsorption pad 10 is positioned higher than the upper surface of the second cleaning body 181, and the upper surface of the rotary chuck 11 is positioned lower than the upper surface of the second cleaning body 181. Afterwards, the lifting pins 22 descend, and the substrate W is transferred from the lifting pins 22 to the adsorption pad 10 inside the first liquid receiving cup 16, where it is adsorbed and held by the adsorption pad 10.

[0068] Next, a lower surface cleaning process is performed (step S2). In this lower surface cleaning process, firstly, the adsorption pad 10 holding the substrate W, together with the support plate 14, the first liquid receiving cup 16, and the second liquid receiving part 30, is moved in the horizontal direction (here, the X-axis direction). As a result, the rotary chuck 11 is positioned near the outer periphery of the substrate W, and the second cleaning part 18 is positioned near the center of the substrate W.

[0069] Next, for example, the second cleaning section 18 is raised using the moving part 81, pressing the second cleaning body 181 against the lower surface of the substrate W. At this time, the moving part 81 raises the second cleaning section 18 such that the pressing force of the second cleaning body 181 against the substrate W is a desired value. The distance by which the second cleaning section 18 is raised can be determined, for example, based on the detection result of the load detection unit 85. Here, although the second cleaning section 18 is raised, the lower surface of the substrate W can also be pressed against the second cleaning body 181 by lowering the adsorption pad 10. Alternatively, the second cleaning section 18 can be raised while the adsorption pad 10 is lowered simultaneously.

[0070] Then, cleaning fluid is supplied to the lower surface of the substrate W from the cleaning nozzle 80a. In addition, the rotation of the second cleaning body 181 is started.

[0071] The cleaning of the lower surface of the substrate W using the second cleaning unit 18 is performed by a combination of moving the substrate W using the adsorption pad 10 and moving the second cleaning unit 18 using the moving part 81. As a result, the central region of the lower surface of the substrate W, including the area held by the rotating chuck 11, is cleaned by the second cleaning body 181. Afterwards, the rotation of the second cleaning body 181 is stopped, and the supply of cleaning fluid from the cleaning nozzle 80a is stopped.

[0072] Next, a two-sided cleaning process is performed (step S3). In the two-sided cleaning process, firstly, the adsorption pad 10 is moved together with the substrate W, and the central part of the substrate W is placed above the rotating chuck 11. Then, by releasing the adsorption pad 10 from the substrate W, the rotating chuck 11 is raised, thereby transferring the substrate W from the adsorption pad 10 to the rotating chuck 11.

[0073] In addition, the liquid supply nozzle 50 of the first cleaning unit 17 is positioned above the center of the substrate W using the moving part 71.

[0074] Next, the rotary chuck 11 is rotated using the drive mechanism 21, thereby causing the substrate W to rotate around the rotation axis Ar. Then, the step of releasing cleaning fluid from the liquid supply nozzle 50 onto the upper surface of the substrate W begins. Next, the liquid supply nozzle 50 is moved horizontally (positive X-axis direction) using the moving part 71. As a result, the central region of the upper surface of the substrate W is cleaned.

[0075] Then, the liquid supply nozzle 50 and the second cleaning unit 18 are moved toward the periphery of the substrate W to clean the areas outside the central regions of the upper and lower surfaces of the substrate W. Specifically, the processing liquid L is released from the liquid supply nozzle 50 while it is moved above the upper surface of the substrate W. Furthermore, the rotation of the second cleaning body 181 is started while cleaning liquid is supplied to the lower surface of the substrate W from the cleaning nozzle 80a.

[0076] After the liquid supply nozzle 50 and the second cleaning body 181 each reach the peripheral edge of the outer periphery of the substrate W, and the cleaning of the entire upper and lower surfaces of the substrate W is completed, the rotation of the second cleaning body 181 is stopped, and the release of cleaning liquid from the liquid supply nozzle 50 and the cleaning nozzle 80a is stopped. Then, the liquid supply nozzle 50 and the second cleaning body 181 are moved away from the substrate W.

[0077] As described above, before the liquid supply nozzle 50 reaches directly above the periphery of the substrate W, the cleaning fluid ejected from the substrate W is primarily caught by the first liquid receiving surface 16a of the first liquid receiving cup 16. Conversely, when the liquid supply nozzle 50 is directly above the periphery of the substrate W, the cleaning fluid released is primarily caught by the second liquid receiving surface 30a of the second liquid receiving section 30. This effectively prevents the processing fluid L ejected from the substrate W from re-adhering to the substrate W. After being caught by the first liquid receiving surface 16a and the second liquid receiving surface 30a, the processing fluid L flows downwards along both surfaces and is ultimately discharged through the drain pipe 40.

[0078] Furthermore, from the viewpoint of suppressing the spread of cleaning fluid from the lower surface to the upper surface of the substrate W, it is preferable to stop releasing cleaning fluid from the liquid supply nozzle 50 after stopping the release of cleaning fluid from the cleaning nozzle 80a. However, this is not a limitation; it is permissible to stop both the release of cleaning fluid from the liquid supply nozzle 50 and the release of cleaning fluid from the cleaning nozzle 80a simultaneously, or to stop the release of cleaning fluid from the liquid supply nozzle 50 before stopping the release of cleaning fluid from the cleaning nozzle 80a.

[0079] Next, a drying process is performed (step S4). During the drying process, the substrate W is rotated at high speed via a rotating chuck 11. As a result, the liquid adhering to the substrate W is thrown off the substrate W, and the drying of the substrate W is promoted.

[0080] Next, the delivery process is performed (step S5). In the delivery process, the substrate W is handed over to the conveying mechanism in the reverse order of the delivery process (step S1) described above. By going through the above series of processes (steps S1 to S5), the cleaning process of one substrate W is completed. When cleaning other substrates W, the above series of processes (steps S1 to S5) is repeated.

[0081] As explained above, the substrate liquid treatment apparatus 1 and substrate liquid treatment method according to this embodiment can properly receive and guide the treatment liquid L that flies outward from the substrate W using the first liquid receiving cup 16 and the second liquid receiving part 30, preventing the treatment liquid L from re-adhering to the substrate W. Therefore, it is possible to suppress the "particle adhesion to the substrate W" caused by such treatment liquid L.

[0082] The inventors of this invention have actually verified the substrate liquid treatment apparatus 1 and substrate liquid treatment method described above. As a result, the inventors of this invention confirmed that by providing the first liquid receiving cup 16 and the second liquid receiving part 30, the re-attachment of the treatment liquid L ejected from the substrate W to the substrate W is suppressed, and the number of particles on the substrate W is necessarily reduced.

[0083] [First Variation]

[0084] Figure 6 and Figure 7 This is a cross-sectional view illustrating the schematic structure of the first liquid receiving cup 16 and the second liquid receiving section 30, which is an example of a first modified embodiment. Figure 3 and Figure 4 Similarly, in Figure 6 and Figure 7 The illustration omits some elements; the first liquid receiving cup 16 and the second liquid receiving part 30 are exaggerated, and only a portion of the substrate W is shown.

[0085] The substrate liquid processing apparatus 1 of this modification includes a liquid receiving moving mechanism 35 that moves the second liquid receiving section 30. Although in Figure 6 and Figure 7 The liquid receiving moving mechanism 35 is simplified in the diagram, but it can be implemented by any driving device such as a motor and can be arranged in any form in the substrate liquid processing apparatus 1. The liquid receiving moving mechanism 35 can move the second liquid receiving part 30 as a whole, or it can move the second liquid receiving part 30 (especially the upper end) by extending or retracting a part of the second liquid receiving part 30 (for example, the second liquid receiving vertical part 30c extending in the vertical direction) in the vertical direction.

[0086] The second liquid receiving unit 30 is disposed at the first liquid receiving position by the liquid receiving moving mechanism 35 (see reference). Figure 7 ) and a second liquid receiving position different from the first liquid receiving position (refer to Figure 6 ).like Figure 7 As shown, the second liquid receiving surface 30a of the second liquid receiving section 30 disposed at the first liquid receiving position receives at least a portion of the processing liquid L released from the liquid supply nozzle 50 and scattered from the upper surface (particularly the peripheral portion) of the substrate W at the aforementioned first moving position. On the other hand, as Figure 6 As shown, the second liquid receiving surface 30a of the second liquid receiving part 30 disposed at the second liquid receiving position receives at least a portion of the processing liquid L released from the liquid supply nozzle 50 disposed at the second moving position and scattered from the upper surface of the substrate W.

[0087] Thus, in this modified example, the second liquid receiving section 30 rises and falls vertically depending on the position of the liquid supply nozzle 50. Therefore, regardless of the position of the liquid supply nozzle 50, the second liquid receiving section 30 can continuously receive at least a portion of the processing liquid L flying from the substrate W. During the period when the processing liquid L from the liquid supply nozzle 50 lands on the non-peripheral portion (second release portion) of the upper surface of the substrate W, the second liquid receiving section 30 is positioned in the raised position, with its upper end positioned above the substrate W (see reference). Figure 6On the other hand, during the period when the processing liquid L from the liquid supply nozzle 50 falls onto the periphery (first release portion) of the upper surface of the substrate W, the second liquid receiving portion 30 is configured in a descending position, and the upper end of the second liquid receiving portion 30 is positioned below the substrate W (particularly the upper surface) (see reference). Figure 7 In this way, the second liquid receiving section 30 is raised and lowered in such a way that the second liquid receiving surface 30a is configured at an optimal position corresponding to the flight direction of the substrate W, so as to prevent the processing liquid L thrown off the substrate W from re-attaching to the substrate W.

[0088] Furthermore, according to this modified example, it is possible to prevent the processing liquid L flying from the substrate W from colliding with the upper surface of the second liquid receiving section 30 and splashing. That is, by adjusting the vertical position of the second liquid receiving section 30 so that the processing liquid L ejected from the substrate W does not cross the second liquid receiving section 30, it is possible to prevent the processing liquid L from colliding with the upper surface of the second liquid receiving section 30. Collision of the processing liquid L with the upper surface of the second liquid receiving section 30 will cause the processing liquid L to splash in an unexpected direction, which may result in the adhering of the processing liquid L droplets to the substrate W. On the other hand, by adjusting the vertical position of the second liquid receiving section 30 to avoid collision of the processing liquid L with the upper surface of the second liquid receiving section 30, it is possible to prevent such processing liquid L droplets from adhering to the substrate W.

[0089] Furthermore, the liquid receiving moving mechanism 35 can, under the control of the control unit 200, change the position of the second liquid receiving unit 30, for example, based on the configuration position information of the liquid supply nozzle 50. Strictly speaking, the main flight direction and flight range of the processing liquid L from the substrate W may vary depending on the relative position of the liquid supply nozzle 50 with respect to the substrate W. However, in reality, during the period when the processing liquid L released from the liquid supply nozzle 50 is directed towards the non-peripheral portion of the substrate W, the main flight direction and flight range of the processing liquid L from the substrate W do not change much. Therefore, the liquid receiving moving mechanism 35 can move the second liquid receiving unit 30 from the rising position (refer to the first moving position) at the same time as, or just after, the liquid supply nozzle 50 reaches the first moving position. Figure 6 Move to the descending position (refer to) Figure 7 The liquid receiving moving mechanism 35 can basically keep the second liquid receiving part 30 in a common rising position while the liquid supply nozzle 50 is in a position other than the first moving position, and keep the second liquid receiving part 30 in a falling position while the liquid supply nozzle 50 is in the first moving position.

[0090] Furthermore, the substrate liquid treatment apparatus 1 in this modified example may include a liquid scattering information acquisition unit 36, which acquires liquid scattering information indicating the state of the treatment liquid L scattering from the upper surface of the substrate W. The liquid scattering information is not limited, as long as it directly or indirectly indicates the state of the treatment liquid L scattering from the upper surface of the substrate W. In this case, the second liquid receiving unit 30 is moved using a liquid receiving moving mechanism 35 driven under the control of the control unit 200 based on the liquid scattering information acquired by the liquid scattering information acquisition unit 36.

[0091] For example, a camera can be used to construct the liquid scattering information acquisition unit 36. In this case, the image data acquired by the liquid scattering information acquisition unit 36, including the liquid supply nozzle 50, the processing liquid L flowing from the liquid supply nozzle 50 to the substrate W, and / or the processing liquid L flying outside the substrate W, can be used as liquid scattering information. The control unit 200 can receive this image data from the liquid scattering information acquisition unit (camera) 36, perform image analysis to obtain analysis data that directly or indirectly represents the flight state of the processing liquid L, and control the liquid receiving moving mechanism 35 based on this analysis data.

[0092] [Second variation]

[0093] Figure 8 and Figure 9 This is a cross-sectional view illustrating the general structure of the first liquid receiving cup 16 and the second liquid receiving section 30, as exemplified in the second modified example. Figure 3 and Figure 4 Similarly, in Figure 8 and Figure 9 The illustration omits some elements; the first liquid receiving cup 16 and the second liquid receiving portion 30 are exaggerated, and only a portion of the substrate W is shown.

[0094] In the first variation mentioned above (refer to...) Figure 6 and Figure 7 In this modified example, the second liquid receiving section 30 moves only in the vertical direction, but the direction of movement of the second liquid receiving section 30 is not limited. The second liquid receiving section 30 rotates and moves around the rotating shaft section 38.

[0095] Figure 8 and Figure 9The second liquid receiving section 30 shown is configured to move around a rotating shaft 38. The rotating shaft 38 is driven by a liquid receiving moving mechanism 35 under the control of the control unit 200. By rotating the second liquid receiving section 30 around the rotating shaft 38, the vertical position of the upper end of the second liquid receiving section 30 changes. In particular, in this modified example, the second liquid receiving section 30 (especially the second liquid receiving surface 30a) is adjusted not only in its vertical position but also in its distance from the substrate W (especially the peripheral portion) and its tilt (or attitude) according to the position of the liquid supply nozzle 50 and the landing position of the processing liquid L on the upper surface of the substrate W.

[0096] Compared with the first variation above (refer to) Figure 6 and Figure 7 Similarly, in this modified example, the second liquid receiving unit 30 is also arranged at the first liquid receiving position by the liquid receiving moving mechanism 35 (see reference). Figure 9 ) and a second liquid receiving position different from the first liquid receiving position (refer to Figure 8 Therefore, by moving the second liquid receiving section 30 according to the position of the liquid supply nozzle 50, the second liquid receiving surface 30a can continuously receive at least a portion of the processing liquid L flying from the substrate W, regardless of the position of the liquid supply nozzle 50.

[0097] [Other variations]

[0098] Although the first liquid receiving cup 16 and the second liquid receiving part 30 are disposed in the housing 15 (see above) in the above embodiments and modifications, Figure 1 The upper surface of ), but can be set in any way. For example, such as Figure 10 As shown, the second liquid receiving portion 30 can also be mounted on the support plate (contact support portion) 14 that supports the adsorption pad 10. Similarly, the first liquid receiving cup-shaped body 16 can also be mounted on the support plate 14. In the above embodiments and modifications, the support plate 14 extends in the same direction as the adsorption pad 10, but the second liquid receiving portion 30 can be mounted on the support plate 14 that extends in a different direction from the adsorption pad 10.

[0099] In the above embodiments and modifications, the liquid supply nozzle 50 supplies the processing liquid to the entire processing surface (upper surface) of the substrate W. The above-described substrate liquid processing apparatus 1 and substrate liquid processing method can also be applied when the liquid supply nozzle 50 supplies the processing liquid only to the "peripheral portion" or "only the peripheral portion and the vicinity of the peripheral portion" of the processing surface of the substrate W.

[0100] It should be noted that the embodiments and modifications disclosed in this specification are merely illustrative in all respects and are not to be construed as limiting. The above embodiments and modifications may be omitted, substituted, and changed in various ways without departing from the appended claims (the scope of the invention) and their spirit. For example, the above embodiments and modifications may be combined, or embodiments other than those described may be combined with the above embodiments or modifications.

[0101] Furthermore, there is no limitation on the type of technology used to realize the above-described technical concept. For example, the aforementioned substrate liquid treatment apparatus can also be applied to other apparatuses. Additionally, the above-described technical concept can be realized using a computer program that causes a computer to execute one or more steps included in the aforementioned substrate liquid treatment method (including a cleaning method for substrate W). Furthermore, the above-described technical concept can also be realized using a computer-readable non-transitory recording medium on which such a computer program is recorded.

Claims

1. A substrate liquid treatment apparatus, characterized in that, include: Maintain the substrate holding portion of the substrate; A substrate rotating part that allows the substrate to rotate about a rotation axis; A liquid supply nozzle is used to release the processing liquid onto the processing surface of the substrate; A nozzle moving mechanism that moves the liquid supply nozzle along a nozzle moving path including a first moving position and a second moving position, wherein the first moving position is a position from the liquid supply nozzle to a first release portion located at the periphery of the processing surface, and the second moving position is a position from the liquid supply nozzle to a second release portion of the processing surface that is closer to the rotation axis than the first release portion. A first liquid receiving section is disposed at a position horizontally spaced from the substrate and has a first liquid receiving surface, the first liquid receiving surface receiving at least a portion of the processing liquid released from the liquid supply nozzle disposed at the second movable position and scattered from the processing surface. A second liquid receiving section, disposed between the substrate and the first liquid receiving section, has a second liquid receiving surface that receives at least a portion of the processing liquid released from the liquid supply nozzle positioned at the first movable position and dispersed from the processing surface; and A liquid receiving moving mechanism moves the second liquid receiving part to position it at a first liquid receiving position and a second liquid receiving position different from the first liquid receiving position. The first liquid receiving position is the position that receives at least a portion of the processing liquid released from the liquid supply nozzle and dispersed from the processing surface at the first moving position. The second liquid receiving surface of the second liquid receiving part, which is disposed at the second liquid receiving position, receives at least a portion of the processing liquid that is released from the liquid supply nozzle disposed at the second moving position and dispersed from the processing surface.

2. The substrate liquid treatment apparatus according to claim 1, characterized in that: The upper end of the second liquid receiving surface is located below the upper end of the first liquid receiving surface.

3. The substrate liquid treatment apparatus according to claim 1 or 2, characterized in that: The portion of the second liquid receiving surface, including the upper end, becomes increasingly farther away from the horizontal direction of the rotation axis as it moves downwards.

4. The substrate liquid treatment apparatus according to claim 1 or 2, characterized in that: At least a portion of the second liquid receiving surface is hydrophilic.

5. The substrate liquid treatment apparatus according to claim 1 or 2, characterized in that: The horizontal cross-section of the second liquid receiving surface is arc-shaped.

6. The substrate liquid treatment apparatus according to claim 1 or 2, characterized in that: The substrate holding portion has a substrate contact portion that contacts the substrate and a contact support portion that supports the substrate contact portion. The second liquid receiving part is mounted on the contact support part.

7. The substrate liquid treatment apparatus according to claim 1, characterized in that: The system includes a liquid dispersion information acquisition unit, which acquires liquid dispersion information indicating the state of the processed liquid dispersing from the processed surface. The second liquid receiving unit is moved by the liquid receiving moving mechanism based on the liquid scattering information.

8. The substrate liquid treatment apparatus according to claim 1 or 2, characterized in that: The liquid supply nozzle releases the gas along with the treatment liquid.

9. A method for treating a substrate solution, characterized in that, include: The steps to rotate the substrate around the rotation axis; The step of releasing the treatment liquid from the liquid supply nozzle onto the treatment surface of the substrate; and The step of moving the liquid supply nozzle At least a portion of the processing liquid, which is released from the liquid supply nozzle located in the first movable position to the first release portion located at the periphery of the processing surface and dispersed from the processing surface, is received by the second liquid receiving surface of the second liquid receiving portion. At least a portion of the processing liquid released from the liquid supply nozzle positioned in the second movable position to a second release portion closer to the rotation axis on the processing surface than the first release portion and scattered from the processing surface is received by the first liquid receiving surface of the first liquid receiving portion. The second liquid receiving unit is moved using a liquid receiving moving mechanism, such that the second liquid receiving unit is positioned at a first liquid receiving position and a second liquid receiving position different from the first liquid receiving position. The first liquid receiving position is the position that receives at least a portion of the processing liquid released from the liquid supply nozzle and dispersed from the processing surface at the first moving position. The second liquid receiving surface of the second liquid receiving part, which is disposed at the second liquid receiving position, receives at least a portion of the processing liquid that is released from the liquid supply nozzle disposed at the second moving position and dispersed from the processing surface.

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