Grinding disc polishing device

Abstract

The embodiment of the application belongs to the technical field of semiconductor manufacturing, and particularly relates to a grinding disc polishing device. The embodiment of the application is used to solve the problems of less effective production time and low production efficiency in the related art. A first rotating device for receiving the polishing pad is further arranged on the processing table; a grinding disc and a second rotating device are arranged at the end of the grinding arm opposite to the polishing pad, the second rotating device is in transmission connection with the grinding disc; the control device is connected with the first rotating device and the second rotating device, and the control device is used to control the second rotating device to drive the grinding disc to rotate while controlling the first rotating device to drive the polishing pad to rotate, so as to polish the polishing pad. After the new grinding disc is polished by using the grinding disc polishing device, the polished grinding disc is directly replaced and used for production when the chemical mechanical grinding device needs to replace the grinding disc, which is beneficial to improve the production efficiency and increase the effective production time of the equipment.

Description

Technical Field

[0001] This application relates to the field of semiconductor manufacturing technology, and in particular to a grinding disc polishing apparatus. Background Technology

[0002] In the processing and fabrication of wafers or other semiconductor structures, chemical mechanical polishing (CMP) is required to planarize the wafers. A CMP apparatus includes a polishing head, a polishing pad, and a polishing table. The polishing pad is placed on the polishing table, and the wafer to be polished is placed at the end of the polishing head facing the polishing pad. During polishing, the rotating polishing head applies pressure to press the wafer against the rotating polishing pad, achieving a combined chemical and mechanical polishing effect. To maintain the polishing effect of the polishing pad, the CMP apparatus also includes a polishing disc for trimming the polishing pad.

[0003] To ensure processing quality, grinding discs need to be replaced periodically. In related technologies, new grinding discs are usually installed directly on the chemical mechanical polishing unit for polishing before being used in production. This reduces the effective production time of the equipment and lowers production efficiency. Summary of the Invention

[0004] This application provides a grinding disc polishing device that can solve the problems of short effective production time and low production efficiency in related technologies.

[0005] According to some embodiments, this application provides a grinding disc polishing device, including: a processing table, a grinding arm disposed on the processing table, and a control device;

[0006] The processing table is also equipped with a first rotating device for receiving the polishing pad.

[0007] The grinding arm is provided with a grinding disc and a second rotating device at one end facing the polishing pad, and the second rotating device is connected to the grinding disc in a transmission manner.

[0008] The control device is connected to the first rotating device and the second rotating device. The control device is used to control the first rotating device to drive the polishing pad to rotate while simultaneously controlling the second rotating device to drive the grinding disc to rotate, so as to polish the polishing pad.

[0009] In one possible implementation, a measuring device is further included, which is disposed on the processing table and is used to detect the thickness of the polishing pad; the control device is electrically connected to the measuring device and is used to determine the cutting rate of the grinding disc in real time based on the thickness of the polishing pad and the grinding time, and to control the first rotating device and the second rotating device to stop working when the cutting rate reaches a predetermined value.

[0010] In one possible implementation, a measuring device is further included, which is disposed on the processing table and is used to detect the thickness of the polishing pad; the control device is electrically connected to the measuring device and is used to determine the cutting rate of the grinding disc based on the thickness of the polishing pad after a preset time, and to control the first rotating device and the second rotating device to stop working when the cutting rate reaches a predetermined value.

[0011] In one possible implementation, the measuring device includes a thickness sensor having a contact head for contacting the surface of the polishing pad.

[0012] In one possible implementation, the control device is further configured to control the first rotating device and the second rotating device to stop working after the first rotating device and the second rotating device have been running for a preset time.

[0013] In one possible implementation, the grinding arm is provided with a longitudinal moving device, which is connected to the grinding disc to drive the grinding disc to move along a plane perpendicular to the polishing pad; the control device is also connected to the longitudinal moving device, which controls the longitudinal moving device to drive the grinding disc to move along a plane perpendicular to the polishing pad, so that there is a preset pressure between the grinding disc and the polishing pad.

[0014] In one possible implementation, the longitudinal moving device includes a drive cylinder, the piston rod of which is connected to the second rotating device, and the cylinder body of which is connected to the grinding arm.

[0015] In one possible implementation, the second rotating device includes a drive motor, the output of which is connected to the grinding disc.

[0016] In one possible implementation, the processing table is further provided with a third rotating device, which is connected to the grinding arm in a transmission manner. The third rotating device is used to drive the grinding arm to rotate along an axis perpendicular to the plane of the polishing pad.

[0017] In one possible implementation, a cleaning device is also included, which is positioned at the cleaning location on the processing table.

[0018] The third rotating device is used to drive the grinding disc to the cleaning position after the polishing pad is polished, and the cleaning device is used to clean the grinding disc.

[0019] In one possible implementation, the cleaning device includes a brush head and a washing device.

[0020] The brush head is connected to the processing table via a lifting device, which is used to drive the brush head to move until it contacts the grinding disc.

[0021] The cleaning device includes a first nozzle and a cleaning device connected to the first nozzle. The cleaning device is used to deliver cleaning fluid to the first nozzle so as to spray the cleaning fluid onto the grinding disc.

[0022] In one possible implementation, the cleaning device further includes a drying device comprising a second nozzle and a gas delivery device communicating with the second nozzle, the gas delivery device being used to deliver drying gas to the second nozzle so that the drying gas is sprayed onto the grinding disc.

[0023] In one possible implementation, a conveying device is also included, which is disposed on the processing table and is used to convey the polishing slurry to the surface of the polishing pad.

[0024] In one possible implementation, a detection device is also included, which is disposed on the processing table and is used to detect the grinding end of the grinding disc.

[0025] In one possible implementation, the detection device includes a microscope.

[0026] The grinding disc polishing device provided in this application includes a processing table, a grinding arm mounted on the processing table, and a control device. The processing table also has a first rotating device for receiving a polishing pad. A grinding disc and a second rotating device are mounted on the end of the grinding arm facing the polishing pad, and the second rotating device is connected to the grinding disc via a transmission connection. The control device is connected to both the first and second rotating devices, and is used to control the first rotating device to drive the polishing pad to rotate while simultaneously controlling the second rotating device to drive the grinding disc to rotate, thereby polishing the polishing pad. Compared to related technologies where new grinding discs need to be polished on a chemical mechanical polishing (CMP) apparatus before being used in production, this grinding disc polishing device allows for direct replacement of the polished grinding disc when the CMP apparatus needs to be replaced, thus improving production efficiency and increasing the effective production time of the equipment. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1 This is a schematic diagram of the structure of a grinding disc grinding device in the grinding state provided in an embodiment of this application;

[0029] Figure 2 This is a schematic diagram of the structure of a grinding arm in a grinding disc polishing device provided in an embodiment of this application;

[0030] Figure 3 This is a schematic diagram of the structure of a grinding disc polishing device in a clean state, provided in an embodiment of this application. Detailed Implementation

[0031] To clearly understand the technical solution of this application, the solutions of related technologies will be described in detail first.

[0032] A chemical mechanical polishing (CMP) apparatus includes a polishing head, a polishing pad, and a polishing table. The polishing pad is placed on the polishing table, and the wafer to be polished is placed on the end of the polishing head facing the polishing pad. During polishing, the rotating polishing head presses the wafer against the rotating polishing pad with a certain pressure, achieving a chemical-mechanical polishing effect. After the polishing pad has been in operation for a period of time, the surface roughness of the polishing pad decreases. To maintain the polishing effect of the polishing pad, the CMP apparatus also includes a polishing disc. The end face of the polishing disc that contacts the polishing pad is equipped with diamond. The rotating polishing disc can polish the polishing pad with a certain pressure, thereby dressing the polishing pad and giving the polishing pad a certain surface roughness.

[0033] After a period of operation, the diamond on the grinding disc is prone to wear, affecting the grinding quality. To ensure processing quality, the grinding disc needs to be replaced periodically. In related technologies, new grinding discs are usually installed directly on the chemical mechanical polishing unit for grinding, and only after grinding is completed can they be used in production. This results in a reduction in the effective production time of the equipment and a decrease in production efficiency.

[0034] In view of this, this application provides a grinding disc polishing device, including a grinding arm and a control device mounted on a processing table; a first rotating device for receiving a polishing pad is also mounted on the processing table; a grinding disc and a second rotating device are mounted on the end of the grinding arm facing the polishing pad, the second rotating device being kinetically connected to the grinding disc; the control device is connected to the first rotating device and the second rotating device, and the control device is used to control the first rotating device to drive the polishing pad to rotate while simultaneously controlling the second rotating device to drive the grinding disc to rotate, so as to polish the polishing pad. Compared with related technologies, where new grinding discs need to be polished on a chemical mechanical polishing apparatus before being used in production, this grinding disc polishing device allows for direct replacement of the polished grinding disc when the chemical mechanical polishing apparatus needs to be replaced, thus improving production efficiency and increasing the effective production time of the equipment.

[0035] To make the above-mentioned objectives, features, and advantages of the embodiments of this application more apparent and understandable, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0036] like Figure 1 , Figure 2 and Figure 3 As shown, the grinding device of the grinding disc 21 includes a processing table 10, a grinding arm 20 disposed on the processing table 10 and a control device. The processing table 10 is also provided with a first rotating device for receiving the polishing pad 11. The grinding arm 20 is provided with a grinding disc 21 and a second rotating device 22 at one end facing the polishing pad 11. The second rotating device 22 is connected to the grinding disc 21 in a transmission manner.

[0037] For example, the processing table 10 can be a platform structure, which facilitates placing the processing table 10 on a horizontal ground. The polishing pad 11 can be set on the processing table 10, and the plane of the polishing pad 11 is parallel to the plane of the processing table 10. Correspondingly, the end of the grinding arm 20 facing the polishing pad 11 is provided with a grinding disc 21. The end face of the grinding disc 21 facing the polishing pad 11 is parallel to the plane of the polishing pad 11, so that the polishing pad 11 can evenly grind the grinding disc 21 and prevent uneven grinding.

[0038] The first rotating device is located at the end of the polishing pad 11 away from the grinding disk 21. The first rotating device is connected to the polishing pad 11 in a transmission manner so that the first rotating device drives the polishing pad 11 to rotate.

[0039] In some examples, the first rotating device can be a motor, the output shaft of which is connected to the polishing pad 11, allowing the polishing pad 11 to rotate about the output shaft of the motor. In other examples, the first rotating device can also be a rotating gear, which includes a driving gear and a driven gear. The driven gear is connected to the polishing pad 11, and the driving gear meshes with the driven gear. The driving gear can be driven to rotate by a motor, thereby causing the polishing pad 11 to rotate following the driven gear.

[0040] The second rotating device 22 is located at the end of the grinding disc 21 away from the polishing pad 11. The second rotating device 22 is connected to the grinding disc 21 in a transmission manner so that the second rotating device 22 drives the grinding disc 21 to rotate.

[0041] Optionally, the second rotating device 22 includes a drive motor, the output end of which is connected to the grinding disc 21, allowing the grinding disc 21 to rotate about the output shaft of the motor. Alternatively, in other examples, the second rotating device 22 can be a rotating gear, comprising a driving gear and a driven gear. The driven gear is connected to the grinding disc 21, and the driving gear meshes with the driven gear. The driving gear can be driven by a motor to rotate, thereby causing the grinding disc 21 to rotate following the driven gear.

[0042] The control device is connected to the first rotating device and the second rotating device 22. The control device is used to control the first rotating device to drive the polishing pad 11 to rotate while controlling the second rotating device 22 to drive the grinding disc 21 to rotate, so as to polish the polishing pad 11.

[0043] In one feasible approach, the control device can be a microcontroller or a programmable logic controller (PLC) or other device capable of performing control functions.

[0044] The grinding disc polishing device provided in this application includes a processing table 10, a grinding arm 20 disposed on the processing table 10, and a control device. The processing table 10 also has a first rotating device for receiving a polishing pad 11. The grinding arm 20 has a grinding disc 21 and a second rotating device 22 disposed at one end facing the polishing pad 11, and the second rotating device 22 is connected to the grinding disc 21 via a transmission connection. The control device is connected to the first rotating device and the second rotating device 22, and is used to control the first rotating device to drive the polishing pad 11 to rotate while simultaneously controlling the second rotating device 22 to drive the grinding disc 21 to rotate, so as to polish the polishing pad 11. Compared to related technologies where a new grinding disc 21 needs to be polished on a chemical mechanical polishing apparatus before it can be used in production, this method allows for the direct replacement of the polished grinding disc 21 when the chemical mechanical polishing apparatus needs to replace it, thus improving production efficiency and increasing the effective production time of the equipment.

[0045] Optionally, a conveying device 30 is also included, which is disposed on the processing table 10 and is used to convey the polishing slurry to the surface of the polishing pad 11.

[0046] For example, the delivery device 30 may include a delivery pipe and a metering pump connected to the delivery pipe. One end of the delivery pipe faces the polishing pad 11, and the inlet of the metering pump is connected to a storage tank containing polishing slurry, thereby delivering the polishing slurry to the polishing pad 11 via the metering pump. The polishing slurry may be made of materials such as hydrogen peroxide, nano-sized silica (SiO2), nano-sized aluminum oxide (Al2O3), or nano-sized cerium oxide (CeO2). By adding polishing slurry during the grinding process between the grinding disc 21 and the polishing pad 11, the grinding efficiency of the grinding disc 21 and the polishing pad 11 can be further improved, thereby further shortening the grinding time.

[0047] Optionally, a measuring device 40 is also included. The measuring device 40 is set on the processing table 10 and is used to detect the thickness of the polishing pad 11. The control device is electrically connected to the measuring device 40 and is used to determine the cutting rate of the grinding disc 21 in real time according to the thickness of the polishing pad 11 and the grinding time. When the cutting rate reaches a predetermined value, the control device controls the first rotating device and the second rotating device 22 to stop working.

[0048] In one possible implementation, the measuring device 40 can be an ultrasonic thickness gauge or a laser thickness gauge to detect the thickness of the polishing pad 11. It should be noted that the control device may include a data processing unit, which can be used to determine the cutting rate of the grinding disc 21 in real time based on the thickness of the polishing pad 11 and the grinding time. When the cutting rate of the grinding disc 21 reaches a predetermined value, it indicates that the grinding disc 21 has been polished and can be used in production. At this time, the control device controls the first rotating device and the second rotating device 22 to stop polishing the grinding disc 21.

[0049] For example, the data processing unit can use a window algorithm to set a unit grinding time. Based on the real-time thickness of the polishing pad 11 at the start and end of the unit grinding time, the cutting amount of the polishing pad 11 within the unit grinding time can be calculated. That is, the cutting amount of the polishing pad 11 within the unit grinding time is equal to the real-time thickness of the polishing pad 11 at the end time minus the real-time thickness of the polishing pad 11 at the start time. The cutting rate of the grinding disc 21 is equal to the cutting amount of the polishing pad 11 within the unit grinding time divided by the unit grinding time. Thus, the cutting rate of the grinding disc 21 can be calculated in real time.

[0050] In another possible implementation, a measuring device 40 is also included, which is disposed on the processing table 10 and is used to detect the thickness of the polishing pad 11. A control device is electrically connected to the measuring device 40 and is used to determine the cutting rate of the grinding disc 21 based on the thickness of the polishing pad 11 after a preset time, and to control the first rotating device and the second rotating device 22 to stop working when the cutting rate reaches a predetermined value.

[0051] For example, the measuring device 40 can be an ultrasonic thickness gauge or a laser thickness gauge to detect the thickness of the polishing pad 11. The cutting amount of the polishing pad 11 is equal to the original thickness of the polishing pad 11 minus the thickness of the polishing pad 11 after a preset polishing time, and the cutting rate of the grinding disc 21 is equal to the cutting amount of the polishing pad 11 divided by the preset time. Thus, the average cutting rate of the grinding disc 21 within the preset time can be calculated. When the cutting rate of the grinding disc 21 reaches a predetermined value, it indicates that the grinding disc 21 has been polished and can be applied to production. At this time, the control device controls the first rotating device and the second rotating device 22 to stop polishing the grinding disc 21.

[0052] Optionally, the measuring device 40 includes a thickness sensor having a contact head 41 for contacting the surface of the polishing pad 11.

[0053] In the above two embodiments of the polishing device 21, the thickness sensor can be a contact thickness sensor. The end of the thickness sensor facing the polishing pad 11 has a contact head 41. The contact head 41 can be a roller so that the contact head 41 can roll on the surface of the polishing pad 11. By measuring the distance and height of the polishing pad 11 in the vertical direction that is in contact with the contact head 41, the thickness of each part of the polishing pad 11 can be obtained.

[0054] Optionally, the control device is also used to control the first rotating device and the second rotating device 22 to stop working after the first rotating device and the second rotating device 22 have been running for a preset time.

[0055] Unlike the two embodiments of the above-mentioned grinding disc 21 grinding device which also include a measuring device 40, the control device can also set a preset time based on practical experience. After the grinding disc 21 is ground for the preset time, it can usually reach the required cutting speed and can be applied to production. At this time, the control device controls the first rotating device and the second rotating device 22 to stop grinding the grinding disc 21.

[0056] Optionally, the grinding arm 20 is provided with a longitudinal moving device 23, which is connected to the grinding disc 21 to drive the grinding disc 21 to move along a plane perpendicular to the polishing pad 11; the control device is also connected to the longitudinal moving device 23, which is used to control the longitudinal moving device 23 to drive the grinding disc 21 to move along a plane perpendicular to the polishing pad 11 so that there is a preset pressure between the grinding disc 21 and the polishing pad 11.

[0057] In one possible implementation, the longitudinal moving device 23 may include a motor, the output shaft of which is equipped with a screw, and a nut that mates with the screw is provided on the screw. A second rotating device 22 is connected and fastened to the nut. The rotation of the motor drives the second rotating device 22 to move along a plane perpendicular to the polishing pad 11, thereby enabling the second rotating device 22 to drive the grinding disc 21 to move along a plane perpendicular to the polishing pad 11. By setting the position of the nut on the screw, a preset pressure can be created between the grinding disc 21 and the polishing pad 11, thereby improving the polishing efficiency of the polishing pad 11 and shortening the polishing time.

[0058] Optionally, the longitudinal moving device 23 includes a driving cylinder, the piston rod of which is connected to the second rotating device 22, and the cylinder body of which is connected to the grinding arm 20.

[0059] In this embodiment, the driving cylinder drives the second rotating device 22 to move along the plane perpendicular to the polishing pad 11 via the driving piston rod, thereby enabling the grinding disc 21 to follow the second rotating device 22 to move along the plane perpendicular to the polishing pad 11. By setting the moving distance of the driving piston rod, a preset pressure is achieved between the grinding disc 21 and the polishing pad 11.

[0060] Optionally, a third rotating device is also provided on the processing table 10. The third rotating device is connected to the grinding arm 20 in a transmission manner. The third rotating device is used to drive the grinding arm 20 to rotate along an axis perpendicular to the plane of the polishing pad 11.

[0061] It also includes a cleaning device 50 set at the cleaning position on the processing table 10. The third rotating device is used to drive the grinding disc 21 to rotate to the cleaning position after the polishing pad 11 is polished. The cleaning device 50 is used to clean the grinding disc 21.

[0062] The third rotating device (not shown in the figure) includes a drive motor, the output end of which is connected to the grinding arm 20 and is perpendicular to the plane of the grinding disc 21, allowing the grinding disc 21 to rotate about the output shaft of the motor. Alternatively, in other examples, the second rotating device 22 can be a rotating gear, comprising a driving gear and a driven gear. The driven gear is connected to the grinding arm 20, and the driving gear meshes with the driven gear. The driving gear can be driven by a motor, thereby causing the grinding arm 20 to rotate following the driven gear.

[0063] It should be noted that the cleaning device 50 is used to clean the end of the grinding disc 21 facing the polishing pad 11, in order to remove foreign objects from the grinding disc 21. This prevents foreign objects from falling onto the polishing pad 11 during the grinding process after the grinding disc 21 is mounted on the chemical mechanical polishing apparatus, thus preventing wafer scratches. Therefore, the grinding disc polishing device provided in this embodiment also helps to reduce the scrap rate of wafers due to scratches, thereby reducing production costs.

[0064] Optionally, the cleaning device 50 includes a brush head 51 and a cleaning device. The brush head 51 is connected to the processing table 10 via a lifting device. The lifting device is used to drive the brush head 51 to move to contact the grinding disc 21. The cleaning device includes a first nozzle 52 and a cleaning device connected to the first nozzle 52. The cleaning device is used to deliver cleaning fluid to the first nozzle 52 so as to spray the cleaning fluid onto the grinding disc 21.

[0065] For example, a brush head 51 is provided at the end of the cleaning device 50 away from the processing table 10. The brush head 51 is used to brush away foreign objects on the grinding disc 21. The material of the brush head 51 can be, for example, polyester fiber. The fibers of the brush head 51 are not easy to shed, so that the brush head 51 has good water absorption and cleaning properties. A lifting device is provided at the end of the cleaning device 50 near the processing table 10. The lifting device is used to drive the brush head 51 to move along a plane perpendicular to the processing table 10.

[0066] The cleaning equipment may include a storage tank containing cleaning fluid, and a delivery pump is installed inside the storage tank to deliver the cleaning fluid into the first nozzle 52. The cleaning fluid may be, for example, alcohol or clean water.

[0067] When the cleaning device 50 is used to clean the grinding disc 21, the cleaning device delivers cleaning fluid to the first nozzle 52. The first nozzle 52 sprays the cleaning fluid onto the surface of the grinding disc 21 to be cleaned. Then, the lifting device can drive the brush head 51 to move away from the processing table 10 until the brush head 51 contacts the grinding disc 21. The control device controls the second rotating device 22 to drive the grinding disc 21 to rotate, so that the brush head 51 can remove foreign objects on the grinding disc 21. When the grinding disc 21 is cleaned, the control device controls the second rotating device 22 to stop working. Then, the lifting device drives the brush head 51 to move closer to the processing table 10 until the brush head 51 separates from the grinding disc 21.

[0068] Optionally, the cleaning device 50 also includes a drying device, which includes a second nozzle 53 and a gas delivery device 30 connected to the second nozzle 53. The gas delivery device 30 is used to deliver drying gas to the second nozzle 53 so that the drying gas is sprayed onto the grinding disc 21.

[0069] For example, the gas delivery device 30 may include a delivery pump, the inlet of which may be connected to a gas source so that the gas source is delivered into the second nozzle 53 by the delivery pump.

[0070] After cleaning the grinding disc 21 with the brush head 51, the gas delivery device 30 can be used to deliver dry gas into the second nozzle 53, and the second nozzle 53 can spray dry gas onto the cleaned surface of the grinding disc 21, so that the cleaned surface of the grinding disc 21 can be dried and then directly applied to production.

[0071] Optionally, a detection device is also included, which is set on the processing table 10 and is used to detect the grinding end of the grinding disc 21.

[0072] The detection device (not shown in the figure) can be used to detect the morphology of the surface of the polishing pad 21 in order to check whether the diamond on the surface of the polishing pad 21 has fallen off. If the detection device finds that the diamond has fallen off or fallen off, the polishing pad 21 can be replaced in time to prevent foreign objects on the polishing pad 21 from falling onto the polishing pad 11 and causing wafer scratches.

[0073] Optionally, the detection device includes a microscope that can observe the surface of the polishing disc 21 to check whether diamond has fallen off the surface of the polishing disc 21. In other examples, the detection device may also be an optical camera that can check whether diamond has fallen off the surface of the polishing disc 21 by taking pictures and analyzing them.

[0074] The following is a brief description of the operation process of the grinding device using the grinding disc 21 provided in the embodiments of this application:

[0075] First, the control device controls the third rotating device to drive the grinding disc 21 to face the polishing pad 11. The control device then controls the longitudinal moving device 23 to drive the grinding disc 21 to move closer to the polishing pad 11 until the grinding disc 21 contacts the polishing pad 11 and a preset pressure is established between them. The control device then controls the first and second rotating devices 22 to drive the grinding disc 21 and the polishing pad 11 to rotate. While the grinding disc 21 and the polishing pad 11 are grinding, the conveying device 30 delivers the grinding fluid to the polishing pad 11.

[0076] After the grinding disc 21 has finished grinding, the control device controls the longitudinal moving device 23 to drive the grinding disc 21 away from the polishing pad 11. The control device then controls the third rotating device to drive the grinding disc 21 to rotate to the cleaning position. Cleaning fluid is sprayed onto the grinding disc 21 using the first nozzle 52, causing the lifting device to drive the brush head 51 to contact the grinding disc 21. Then, the control device controls the second rotating device 22 to drive the grinding disc 21 to rotate, thereby removing foreign matter from the surface of the grinding disc 21. After cleaning the surface of the grinding disc 21, the control device controls the lifting device to drive the brush head 51 to move away from the grinding disc 21. Then, the second nozzle 53 sprays drying gas onto the surface of the grinding disc 21 to dry it.

[0077] After the grinding disc 21 has dried, it is removed and placed under a microscope. The polished surface of the grinding disc 21 is then observed under the microscope to check whether the diamond on the surface of the grinding disc 21 has fallen off.

[0078] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the above-described division of functional modules is merely an example. In practical applications, the above functions can be assigned to different functional modules as needed, that is, the internal structure of the device can be divided into different functional modules to complete all or part of the functions described above. The specific working process of the device described above can be referred to the corresponding process in the foregoing method embodiments, and will not be repeated here.

[0079] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A grinding disc polishing device, characterized in that, include: A processing table, a grinding arm mounted on the processing table, and a control device; The processing table is also equipped with a first rotating device for receiving the polishing pad. The grinding arm is provided with a new grinding disc and a second rotating device at one end facing the polishing pad, and the second rotating device is connected to the grinding disc in a transmission manner. The control device is connected to the first rotating device and the second rotating device. The control device is used to control the first rotating device to drive the polishing pad to rotate while controlling the second rotating device to drive the grinding disc to rotate, so as to polish the polishing pad. The grinding arm is equipped with a longitudinal moving device, which is connected to the grinding disc to drive the grinding disc to move along a plane perpendicular to the polishing pad. The control device is also connected to the longitudinal moving device and is used to control the longitudinal moving device to drive the grinding disc to move along a plane perpendicular to the polishing pad, so that there is a preset pressure between the grinding disc and the polishing pad. It also includes a measuring device, which is set on the processing table and is used to detect the thickness of the polishing pad; the control device is electrically connected to the measuring device and is used to determine the cutting rate of the grinding disc in real time based on the thickness of the polishing pad and the grinding time, and to control the first rotating device and the second rotating device to stop working when the cutting rate reaches a predetermined value.

2. The grinding disc polishing device according to claim 1, characterized in that, It also includes a measuring device, which is disposed on the processing table and is used to detect the thickness of the polishing pad; the control device is electrically connected to the measuring device and is used to determine the cutting rate of the grinding disc based on the thickness of the polishing pad after a preset time, and to control the first rotating device and the second rotating device to stop working when the cutting rate reaches a predetermined value.

3. The grinding disc polishing device according to claim 1 or 2, characterized in that, The measuring device includes a thickness sensor with a contact head for contacting the surface of the polishing pad.

4. The grinding disc polishing device according to claim 1, characterized in that, The control device is also used to control the first rotating device and the second rotating device to stop working after the first rotating device and the second rotating device have been running for a preset time.

5. The grinding disc polishing device according to claim 1, characterized in that, The longitudinal moving device includes a drive cylinder, the piston rod of which is connected to the second rotating device, and the cylinder body of which is connected to the grinding arm.

6. The grinding disc polishing device according to claim 1, characterized in that, The second rotating device includes a drive motor, the output end of which is connected to the grinding disc.

7. The grinding disc polishing device according to claim 1, characterized in that, The processing table is also equipped with a third rotating device, which is connected to the grinding arm in a transmission manner. The third rotating device is used to drive the grinding arm to rotate along an axis perpendicular to the plane where the polishing pad is located.

8. The grinding disc polishing device according to claim 7, characterized in that, It also includes a cleaning device located at the cleaning position on the processing table; The third rotating device is used to drive the grinding disc to the cleaning position after the polishing pad is polished, and the cleaning device is used to clean the grinding disc.

9. The grinding disc polishing device according to claim 8, characterized in that, The cleaning device includes a brush head and a washing device. The brush head is connected to the processing table via a lifting device, which is used to drive the brush head to move until it contacts the grinding disc. The cleaning device includes a first nozzle and a cleaning device connected to the first nozzle. The cleaning device is used to deliver cleaning fluid to the first nozzle so as to spray the cleaning fluid onto the grinding disc.

10. The grinding disc polishing device according to claim 9, characterized in that, The cleaning device further includes a drying device, which includes a second nozzle and a gas delivery device communicating with the second nozzle. The gas delivery device is used to deliver drying gas to the second nozzle so that the drying gas is sprayed onto the grinding disc.

11. The grinding disc polishing device according to claim 1, characterized in that, It also includes a conveying device, which is disposed on the processing table and is used to convey the polishing slurry to the surface of the polishing pad.

12. The grinding disc polishing device according to claim 1, characterized in that, It also includes a detection device, which is set on the processing table and is used to detect the grinding end of the grinding disc.

13. The grinding disc polishing device according to claim 12, characterized in that, The detection device includes a microscope.

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