Image capturing module, endoscope, and method for manufacturing the image capturing module

Abstract

The present invention relates to the field of imaging, and discloses an imaging capture module, which includes a flexible circuit board and an image sensor. The flexible circuit board includes a plurality of first pads and a plurality of second pads. The plurality of first pads are disposed on a first surface of the flexible circuit board, and the plurality of second pads are disposed on a second surface of the flexible circuit board, wherein the first surface and the second surface are opposite to each other. The image sensor is disposed on the first surface. The distance between the image sensor and the plurality of first pads is equal to the distance between the image sensor and the plurality of second pads. The flexible circuit board is folded to align and weld the plurality of first pads to the plurality of second pads, such that a light-receiving surface of the image sensor is perpendicular to the surfaces of the plurality of first pads and the plurality of second pads. An endoscope including the foregoing imaging capture module is also proposed.

Description

[0001] Cross - Reference to Related Applications

[0002] This application claims priority to a Chinese patent application filed with the Chinese Patent Office on August 10, 2021, with application number 17 / 399,027 and application title "Image Capture Module, Endoscope, and Manufacturing Method of Image Capture Module", the entire content of which is incorporated herein by reference. Technical Field

[0003] The present invention relates to an image capture module, and more particularly to an image capture module suitable for an endoscope and a manufacturing method of the image capture module. Background Art

[0004] An endoscope is a medical device that enters the human body through various means to observe the internal conditions of the human body. Generally, an endoscope includes a slender tube body for inserting into the human body and an image sensor disposed in the slender tube body for capturing images of the internal part of the human body. The thicker the tube body, the more uncomfortable the human body will feel. In order to reduce the thickness of the tube body, a micro image sensor has been developed. The micro image sensor is disposed in the slender tube body through a flexible circuit board. However, it is very difficult to dispose such a small-sized micro image sensor (e.g., 650μm * 650μm * 1158μm) on a corresponding flexible circuit board. Summary of the Invention

[0005] The present invention provides an image capture module suitable for an endoscope and a manufacturing method of the image capture module to solve the above problems.

[0006] According to an embodiment, the image capture module of the present invention includes a flexible circuit board and an image sensor. The flexible circuit board includes a plurality of first pads and a plurality of second pads. A pad can be a metal exposed area for welding or attaching components. The plurality of first pads are disposed on a first surface of the flexible circuit board, and the plurality of second pads are disposed on a second surface of the flexible circuit board, wherein the first surface and the second surface are opposite to each other. The image sensor is disposed on the first surface. The distance between the image sensor and the plurality of first pads is equal to the distance between the image sensor and the plurality of second pads. The flexible circuit board is folded to align and weld the plurality of first pads to the plurality of second pads, such that the light-receiving surface of the image sensor is perpendicular to the surfaces of the plurality of first pads and the plurality of second pads.

[0007] According to another embodiment, the endoscope of the present invention includes a tube body and an image capture module. The image capture module is disposed in the tube body. The image capture module includes a flexible circuit board and an image sensor. The flexible circuit board includes a plurality of first pads and a plurality of second pads. The plurality of first pads are disposed on a first surface of the flexible circuit board, and the plurality of second pads are disposed on a second surface of the flexible circuit board, wherein the first surface and the second surface are opposite to each other. The image sensor is disposed on the first surface. The distance between the image sensor and the plurality of first pads is equal to the distance between the image sensor and the plurality of second pads. The flexible circuit board is folded to align the plurality of first pads and solder them to the plurality of second pads, such that the light-receiving surface of the image sensor is perpendicular to the surfaces of the plurality of first pads and the plurality of second pads.

[0008] According to another embodiment, a method for manufacturing an image capture module of the present invention includes the following steps: forming a plurality of first pads and a plurality of second pads on a flexible circuit board, wherein the plurality of first pads are disposed on a first surface of the flexible circuit board, the plurality of second pads are disposed on a second surface of the flexible circuit board, and the first surface and the second surface are opposite to each other; disposing an image sensor on the first surface, wherein the distance between the image sensor and the plurality of first pads is equal to the distance between the image sensor and the plurality of second pads; folding the flexible circuit board to align the plurality of first pads with the plurality of second pads, and making the light-receiving surface of the image sensor perpendicular to the surfaces of the plurality of first pads and the plurality of second pads; and soldering the plurality of first pads to the plurality of second pads.

[0009] In summary, in the present invention, the image sensor is first disposed on the flexible circuit board, and then the flexible circuit board is folded to solder the first pads on the flexible circuit board to the second pads. At this time, the light-receiving surface of the image sensor is perpendicular to the surfaces of the first pads and the second pads. Thereby, the folded flexible circuit board provided with the image sensor can be directly inserted into the slender tube body to form an endoscope, so that the manufacturing method of the endoscope can be simplified, and the flexible circuit board of the present invention can be used to mount a small-sized micro image sensor.

[0010] The advantages and spirit of the present invention can be further understood through the following detailed description of the invention and the accompanying drawings. Description of the Drawings

[0011] Figure 1 Is a perspective view of an image capture module before folding according to an embodiment of the present invention;

[0012] Figure 2 Is Figure 1 A partial perspective view of the image capture module in from another perspective;

[0013] Figure 3 Is Figure 1 A schematic diagram of the image capture module in ;

[0014] Figure 4 is Figure 1 a partial perspective view of the image capture module in

[0015] Figure 5 after being folded; Figure 4 is a perspective view of the image capture module installed in an endoscope in

[0016] Figure 6 is Figure 5 a perspective view of the interior of the endoscope in

[0017] Figure 7 is a partial perspective view of the image capture module according to another embodiment of the present invention;

[0018] Figure 8 is Figure 7 a perspective view of the image capture module after being folded in

[0019] Figure 9 is a partial perspective view of the image capture module according to another embodiment of the present invention;

[0020] Figure 10 is Figure 9 a perspective view of the image capture module after being folded in

[0021] Figure 11 is a flowchart of a manufacturing method of an image capture module according to an embodiment of the present invention.

[0022] Reference numerals: 1: Endoscope

[0023] 10: Image capture module

[0024] 12: Tube body

[0025] 14: Light guide structure

[0026] 100: Flexible circuit board

[0027] 102: Image sensor

[0028] 104: Light emitting unit

[0029] 106: Electronic component

[0030] 108: Support member

[0031] 1000: First pad

[0032] 1002: Second pad

[0033] 1004: Third pad

[0034] 1006: First folding section

[0035] 1008: Second folding section

[0036] 1010: Third folding section

[0037] 1012: Joint

[0038] 1014: Arc groove structure

[0039] 1016: Fourth pad

[0040] 1018: Fifth pad

[0041] 1020: Light-receiving surface

[0042] 1022, 1024: Contact points

[0043] D1, D2, D3: Distances

[0044] P1: First part

[0045] P2: Second part

[0046] P3: Third part

[0047] S1: First surface

[0048] S2: Second surface

[0049] W: Width

[0050] Wd: Width difference

[0051] S10~S16: Steps Detailed implementation manners

[0052] Please refer to Figures 1 to 4 , Figure 1 which is a three-dimensional view of the image capturing module 10 before folding according to an embodiment of the present invention, Figure 2 and Figure 1 is a partial three-dimensional view of the image capturing module 10 in the image capturing module 10 from another perspective, Figure 3 and Figure 1 is a schematic diagram of the image capturing module 10 in the image capturing module 10, Figure 4 and Figure 1 is a partial three-dimensional view of the image capturing module 10 after folding.

[0053] As shown in Figures 1 to 3As shown, the image capture module 10 before folding includes a flexible circuit board 100, an image sensor 102, at least one light-emitting unit 104, and at least one electronic component 106. In this embodiment, the flexible circuit board 100 can be a flexible printed circuit board or other flexible circuit board, the image sensor 102 can be a charge coupled device (CCD) image sensor, a complementary metal oxide semiconductor (CMOS) image sensor, or other image sensor, the light-emitting unit 104 can be a light-emitting diode or other light-emitting device, and the electronic component 16 can be a capacitor or other electronic component.

[0054] Flexible printed circuit board 100 includes a plurality of first solder pads 1000, a plurality of second solder pads 1002, and a plurality of third solder pads 1004. In this embodiment, flexible printed circuit board 100 may include four first solder pads 1000, four second solder pads 1002, and four third solder pads 1004, but the present invention is not limited thereto. The number of first solder pads 1000, second solder pads 1002, and third solder pads 1004 may be determined based on actual application.

[0055] A plurality of first solder pads 1000 may be disposed on the first surface S1 of the flexible printed circuit board 100, and a plurality of second solder pads 1002 may be disposed on the second surface S2 of the flexible printed circuit board 100, wherein the first surface S1 and the second surface S2 are opposite each other. Specifically, one of the first surface S1 and the second surface S2 may be the top surface of the flexible printed circuit board 100, and the other of the first surface S1 and the second surface S2 may be the bottom surface of the flexible printed circuit board 100.

[0056] In this embodiment, a plurality of first solder pads 1000 may be located on a first portion P1 of the flexible printed circuit board 100, a plurality of second solder pads 1002 may be located on a second portion P2 of the flexible printed circuit board 100, and a plurality of third solder pads 1004 may be located on a third portion P3 of the flexible printed circuit board 100. The second portion P2 is connected to the first portion P1, and the third portion P3 is connected to the second portion P2. In other words, the second portion P2 is connected to the first portion P1 and the third portion P3, and is located between the first portion P1 and the third portion P3.

[0057] In this embodiment, the plurality of first pads 1000 are wider than the plurality of second pads 1002. Figure 3As shown, the second part P2 can be wider than the first part P1, and the width W of the second pad 1002 can be equal to the width difference Wd between the first part P1 and the second part P2. In addition, the third part P3 can be wider than the second part P2. A plurality of third pads 1004 are used to connect a cable (not shown in the figure). Therefore, the wider the third part P3 is, the easier it is to solder the cable to the third pads 1004.

[0058] The image sensor 102 is disposed on the first surface S1 of the flexible circuit board 100, wherein the distance D1 between the image sensor 102 and the plurality of first pads 1000 is equal to the distance D2 between the image sensor 102 and the plurality of second pads 1002, as Figure 3 shown. In other words, before the flexible circuit board 100 is folded, the image sensor 102 is located at the middle position between the plurality of first pads 1000 and the plurality of second pads 1002. In this embodiment, the image sensor 102 can be connected to the first surface S1 of the flexible circuit board 100 by surface mount technology (SMT), but it is not limited thereto.

[0059] In this embodiment, the image capturing module 10 can include two light emitting units 104, but it is not limited thereto. The light emitting unit 014 is disposed on the first surface S1 of the flexible circuit board 100, wherein the distance D3 between the image sensor 102 and each light emitting unit 104 is less than the distance D1 or D2 between the image sensor 102 and the plurality of first pads 1000 or the plurality of second pads 1002, as Figure 3 shown. In other words, the light emitting unit 104 is closer to the image sensor 102 than the first pad 1000 or the second pad 1002.

[0060] In this embodiment, the image capturing module 10 can include an electronic component 106, but it is not limited thereto. The electronic component 106 can be disposed on the second surface S2 of the flexible circuit board 100 relative to the image sensor 102. In other words, the image sensor 102 and the electronic component 106 are disposed on opposite surfaces of the flexible circuit board 100.

[0061] In this embodiment, the flexible circuit board 100 may include a first folding segment 1006, a second folding segment 1008, and a third folding segment 1010. The first folding segment 1006 is connected to the second folding segment 1008 and the third folding segment 1010, and the first folding segment 1006 is located between the second folding segment 1008 and the third folding segment 1010. The image sensor 102 and the electronic component 106 are located on opposite surfaces of the first folding segment 1006, and the two light-emitting units 104 are respectively located on the second folding segment 1008 and the third folding segment 1010. It should be noted that, in another embodiment, the image capturing module 10 may include one light-emitting unit 104, and this light-emitting unit 104 is located on one of the second folding segment 1008 and the third folding segment 1010. Therefore, the image capturing module 10 may include at least one light-emitting unit 104, and at least one light-emitting unit 104 may be located on at least one of the second folding segment 1008 and the third folding segment 1010.

[0062] In this embodiment, the image sensor 102, the light-emitting unit 104, and the electronic component 106 can be connected to the flexible circuit board 100 by surface mounting technology in a single process. Then, as Figure 4 shown, the flexible circuit board 100 is folded to align and weld a plurality of first pads 1000 to a plurality of second pads 1002, so that the light-receiving surface 1020 of the image sensor 102 is perpendicular to the surfaces of the plurality of first pads 1000 and the plurality of second pads 1002. After the flexible circuit board 100 is folded, the first part P1 is stacked on the second part P2, the first folding segment 1006 is perpendicular to the second folding segment 1008 and the third folding segment 1010, and the second folding segment 1008 and the third folding segment 1010 are parallel to each other. In addition, the joint 1012 of the first folding segment 1006, the second folding segment 1008, and the third folding segment 1010 has an arc groove structure 1014. Thereby, the first folding segment 1006, the second folding segment 1008, and the third folding segment 1010 can be folded at the joint 1012 according to the arc groove structure 1014.

[0063] Please refer to Figure 5 and Figure 6 , Figure 5 is a perspective view of the image capturing module 10 installed in the endoscope 1 in Figure 4 , Figure 6 is Figure 5 the internal perspective view of the endoscope 1 in

[0064] Figure 5As shown, the endoscope 1 includes the above-mentioned image capturing module 10 and the tube body 12, wherein the image capturing module 10 is disposed in the tube body 12. Further, after the flexible circuit board 100 is folded and the first pad 1000 is soldered to the second pad 1002, the folded flexible circuit board 100 provided with the image sensor 102 can be directly inserted into the slender tube body 12 to form the endoscope 1. As Figure 6 shown, the endoscope 1 may further include a light guiding structure 14 disposed in the tube body 12. In this embodiment, the endoscope 1 may include two light guiding structures 14 corresponding to the two light emitting units 104, but is not limited thereto. After the image capturing module 10 is inserted into the tube body 12, each light emitting unit 104 is disposed adjacent to the corresponding light guiding structure 14, so that the light guiding structure 14 can guide the light emitted by the light emitting unit 104 out of the tube body 12.

[0065] Please refer to Figure 7 and Figure 8 , Figure 7 is a partial perspective view of the image capturing module 10 according to another embodiment of the present invention, Figure 8 is Figure 7 the perspective view of the folded image capturing module 10 in

[0066] Figure 7 shown, the image capturing module 10 may further include two support members 108, wherein the two support members 108 are disposed on the second surface S2 of the flexible circuit board 100 and are respectively located on the second folding section 1008 and the third folding section 1010. As Figure 8 shown, after the flexible circuit board 100 is folded, the two support members 108 will abut against each other, so that the light emitting unit 104 can be maintained in a fixed position and avoid deviation. In addition, in this embodiment, the image capturing module 10 may include two electronic components 106, wherein the two electronic components 106 are disposed on the second surface S2 of the flexible circuit board 100 opposite to the two light emitting units 104. In other words, the two light emitting units 104 and the two electronic components 106 are disposed on opposite surfaces of the flexible circuit board 100. In another embodiment, the electronic component 106 may also be disposed on the first surface S1 of the flexible circuit board 100 relative to the two light emitting units 104, and the electronic component 106 is disposed away from the image sensor 102 to prevent the electronic component 106 from blocking the light emitted by the light emitting unit 104 from projecting out of the tube body 12. Therefore, the electronic component 106 can be disposed relative to the light emitting unit 104 on at least one of the first surface S1 and the second surface S2.

[0067] Please refer to Figure 9 and Figure 10 , Figure 9 is a partial perspective view of the image capturing module 10 according to another embodiment of the present invention, Figure 10 is Figure 9The perspective view of the image capturing module 10 after folding.

[0068] As Figure 9 shown, the flexible circuit board 100 of the image capturing module 10 may further include a plurality of fourth pads 1016 and a plurality of fifth pads 1018, wherein the plurality of fourth pads 1016 and the plurality of fifth pads 1018 are used to connect the image sensor 102. In this embodiment, the flexible circuit board 100 may include two fourth pads 1016 and two fifth pads 1018, but is not limited thereto. The two fifth pads 1018 are longer than the two fourth pads 1016. In addition, the two fourth pads 1016 are located on the first folding section 1006, and the two fifth pads 1018 extend from the first folding section 1006 to the second folding section 1008.

[0069] In this embodiment, before the flexible circuit board 100 is folded, two contacts 1022 of the image sensor 102 may be connected to the two fourth pads 1016 by surface mount technology first. Then, the flexible circuit board 100 is folded to align the plurality of first pads 1000 with the plurality of second pads 1002, and the light receiving surface 1020 of the image sensor 102 is perpendicular to the surfaces of the plurality of first pads 1000 and the plurality of second pads 1002. Then, the plurality of first pads 1000 are soldered to the plurality of second pads 1002, and the other two contacts 1024 of the image sensor 102 are soldered to the two fifth pads 1018 on the first surface S1 of the flexible circuit board 100. Since the two contacts 1024 of the image sensor 102 are soldered to the flexible circuit board 100 after the flexible circuit board 100 is folded, the second folding section 1008 can be folded closer to the third folding section 1010 to further reduce the thickness of the flexible circuit board 100 after folding.

[0070] Please refer to Figure 11 , Figure 11 which is a flowchart of a manufacturing method of the image capturing module 10 according to an embodiment of the present invention.

[0071] As Figure 11As shown, first, step S10 is performed to form a plurality of first pads 1000 and a plurality of second pads 1002 on the flexible printed circuit board 100. Among them, the plurality of first pads 1000 are disposed on the first surface S1 of the flexible printed circuit board 100, and the plurality of second pads 1002 are disposed on the second surface S2 of the flexible printed circuit board 100, and the first surface S1 and the second surface S2 are opposite to each other. Then, step S12 is performed to dispose an image sensor 102 on the first surface S1, where the distance D1 between the image sensor 102 and the plurality of first pads 1000 is equal to the distance D2 between the image sensor 102 and the plurality of second pads 1002. Then, step S14 is performed to fold the flexible printed circuit board 100 to align the plurality of first pads 1000 with the plurality of second pads 1002, and to make the light-receiving surface 1020 of the image sensor 102 perpendicular to the surfaces of the plurality of first pads 1000 and the plurality of second pads 1002. Then, step S16 is performed to weld the plurality of first pads 1000 to the plurality of second pads 1002.

[0072] In this embodiment, step S12 may further include the following steps: disposing at least one light-emitting unit 104 on the first surface S1, where the distance D3 between the image sensor 102 and the at least one light-emitting unit 104 is less than the distance D1 or D2 between the image sensor 102 and the plurality of first pads 1000 or the plurality of second pads 1002.

[0073] According to Figures 1 to 4 、 Figure 7 and Figure 8 the embodiment shown, step S12 may further include the following steps: connecting the image sensor 102 to the first surface S1 of the flexible printed circuit board 100 by surface mount technology.

[0074] According to Figure 9 and Figure 10 the embodiment shown, step S12 may further include the following steps: connecting a plurality of contacts 1022 of the image sensor 102 to the first surface S1 of the flexible printed circuit board 100, and step S16 may further include the following steps: welding a plurality of contacts 1024 of the image sensor 102 to the first surface S1 of the flexible printed circuit board 100.

[0075] It should be noted that the detailed embodiments of the manufacturing method of the image capturing module 10 of the present invention are as described above and will not be elaborated here.

[0076] In summary, in the present invention, an image sensor is first disposed on a flexible circuit board, and then the flexible circuit board is folded to weld a first pad on the flexible circuit board to a second pad. At this time, the light-receiving surface of the image sensor is perpendicular to the surfaces of the first pad and the second pad. Thereby, the folded flexible circuit board provided with the image sensor can be directly inserted into the slender tube body to form an endoscope, so that the manufacturing method of the endoscope can be simplified, and the flexible circuit board of the present invention can be used to install a small-sized micro image sensor.

[0077] The above are only the preferred embodiments of the present invention, and all equivalent changes and modifications made according to the scope of the patent application of the present invention shall fall within the scope of the present invention.

Claims

1. An image capturing module, characterized in that, Comprising: A flexible printed circuit board, comprising a plurality of first pads and a plurality of second pads. The plurality of first pads are disposed on a first surface of the flexible printed circuit board, and the plurality of second pads are disposed on a second surface of the flexible printed circuit board. The first surface and the second surface are opposite to each other; and An image sensor, disposed on the first surface. The distance between the image sensor and the plurality of first pads is equal to the distance between the image sensor and the plurality of second pads; Wherein, the flexible printed circuit board is folded to align and weld the plurality of first pads to the plurality of second pads, such that the light-receiving surface of the image sensor is perpendicular to the surfaces of the plurality of first pads and the plurality of second pads.

2. The image capturing module according to claim 1, wherein Wherein the plurality of first pads are located on a first portion of the flexible printed circuit board, the plurality of second pads are located on a second portion of the flexible printed circuit board. The second portion is connected to the first portion, and the plurality of first pads are wider than the plurality of second pads.

3. The image capturing module according to claim 2, wherein Wherein the flexible printed circuit board further comprises a plurality of third pads for connecting a cable. The plurality of third pads are located on a third portion of the flexible printed circuit board, and the third portion is connected to the second portion.

4. The image capturing module according to claim 3, wherein Wherein the third portion is wider than the second portion.

5. The image capturing module according to claim 1, wherein Further comprising at least one light-emitting unit, disposed on the first surface. The distance between the image sensor and the at least one light-emitting unit is less than the distance between the image sensor and the plurality of first pads or the plurality of second pads.

6. The image capturing module according to claim 5, characterized in that, Wherein the flexible printed circuit board comprises a first folding section, a second folding section and a third folding section. The first folding section is connected to the second folding section and the third folding section, and the first folding section is located between the second folding section and the third folding section. The image sensor is located on the first folding section, and the at least one light-emitting unit is located on at least one of the second folding section and the third folding section. The first folding section is perpendicular to the second folding section and the third folding section.

7. The image capturing module according to claim 6, wherein Further comprising two support members, respectively located on the second folding section and the third folding section. The two support members are disposed on the second surface and abut against each other.

8. The image capturing module according to claim 6, wherein Wherein the joint of the first folding section, the second folding section and the third folding section has an arc-shaped groove structure.

9. The image capturing module according to claim 6, wherein Wherein the flexible printed circuit board further comprises a plurality of fourth pads and a plurality of fifth pads for connecting the image sensor. The plurality of fifth pads are longer than the plurality of fourth pads. The plurality of fourth pads are located on the first folding section, and the plurality of fifth pads extend from the first folding section to the second folding section.

10. The image capturing module according to claim 1, characterized in that, Further comprising at least one electronic component, disposed on the second surface opposite to the image sensor.

11. The image capturing module according to claim 5, wherein Further comprising at least one electronic component, disposed on at least one of the first surface and the second surface opposite to the at least one light-emitting unit.

12. An endoscope, characterized in that, Comprising: A tube body; and An image capturing module, disposed in the tube body. The image capturing module comprises: A flexible printed circuit board, comprising a plurality of first pads and a plurality of second pads. The plurality of first pads are disposed on a first surface of the flexible printed circuit board, and the plurality of second pads are disposed on a second surface of the flexible printed circuit board. The first surface and the second surface are opposite to each other; and An image sensor is disposed on the first surface, and the distance between the image sensor and the plurality of first pads is equal to the distance between the image sensor and the plurality of second pads; Wherein, the flexible circuit board is folded to align and weld the plurality of first pads to the plurality of second pads, such that the light-receiving surface of the image sensor is perpendicular to the surfaces of the plurality of first pads and the plurality of second pads.

13. The endoscope according to claim 12, characterized in that, It further includes a light guide structure disposed in the tube body, and at least one light-emitting unit is disposed adjacent to the light guide structure.

14. The endoscope according to claim 12, characterized in that, Wherein the plurality of first pads are located on a first portion of the flexible circuit board, the plurality of second pads are located on a second portion of the flexible circuit board, the second portion is connected to the first portion, and the plurality of first pads are wider than the plurality of second pads.

15. The endoscope according to claim 12, characterized in that, Wherein the image capturing module further includes at least one light-emitting unit disposed on the first surface, and the distance between the image sensor and the at least one light-emitting unit is less than the distance between the image sensor and the plurality of first pads or the plurality of second pads.

16. The endoscope according to claim 15, characterized in that, Wherein the flexible circuit board includes a first folding section, a second folding section, and a third folding section. The first folding section is connected to the second folding section and the third folding section, and the first folding section is located between the second folding section and the third folding section. The image sensor is located on the first folding section, and the at least one light-emitting unit is located on at least one of the second folding section and the third folding section. The first folding section is perpendicular to the second folding section and the third folding section.

17. The endoscope according to claim 16, characterized in that, Wherein the image capturing module further includes two support members respectively located on the second folding section and the third folding section. The two support members are disposed on the second surface and are in contact with each other.

18. The endoscope according to claim 16, characterized in that, Wherein the joints of the first folding section, the second folding section, and the third folding section have arc groove structures.

19. The endoscope according to claim 16, characterized in that, Wherein the flexible circuit board further includes a plurality of fourth pads and a plurality of fifth pads for connecting the image sensor. The plurality of fifth pads are longer than the plurality of fourth pads. The plurality of fourth pads are located on the first folding section, and the plurality of fifth pads extend from the first folding section to the second folding section.

20. A manufacturing method of an image capturing module, characterized in that It includes the following steps: Forming a plurality of first pads and a plurality of second pads on a flexible circuit board, wherein the plurality of first pads are disposed on a first surface of the flexible circuit board, the plurality of second pads are disposed on a second surface of the flexible circuit board, and the first surface and the second surface are opposite to each other; Disposing an image sensor on the first surface, wherein the distance between the image sensor and the plurality of first pads is equal to the distance between the image sensor and the plurality of second pads; Folding the flexible circuit board to align the plurality of first pads with the plurality of second pads, and making a light-receiving surface of the image sensor perpendicular to the surfaces of the plurality of first pads and the plurality of second pads; and Welding the plurality of first pads to the plurality of second pads.

21. The manufacturing method of the image capturing module according to claim 20, characterized in that, It further includes the following steps: Disposing at least one light-emitting unit on the first surface, wherein the distance between the image sensor and the at least one light-emitting unit is less than the distance between the image sensor and the plurality of first pads or the plurality of second pads.

22. The manufacturing method of the image capturing module according to claim 20, wherein, The step of disposing an image sensor on the first surface further includes: Connecting the image sensor to the first surface of the flexible circuit board by surface mount technology.

23. The manufacturing method of the image capturing module according to claim 20, wherein, The step of soldering the plurality of first pads to the plurality of second pads further includes: Soldering a plurality of contacts of the image sensor to the first surface of the flexible circuit board.

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