Circuit board for lens module anti-shake and manufacturing method thereof

Abstract

The present application proposes a method for manufacturing a circuit board for lens module anti-shake, comprising providing a metal layer; forming a first patterned dry film on one surface of the metal layer; etching the metal layer through the first patterned dry film to form a first conductive circuit layer, wherein the first conductive circuit layer is provided with a plurality of first grooves; forming an insulating layer and a second conductive circuit layer on the surface of the first conductive circuit layer in sequence, wherein the second conductive circuit layer is provided with a plurality of second grooves; and opening a plurality of third grooves in the insulating layer, and connecting the third grooves to the first grooves and the second grooves, thereby obtaining the circuit board, wherein the circuit board includes a hollow area and a non-hollow area connected to the hollow area, and the hollow area is movable. The present application can realize the anti-shake function of the lens module. The present application also provides a circuit board for lens module anti-shake.

Description

Technical Field

[0001] The present application relates to the field of circuit boards, and in particular to a circuit board for lens module anti-shake and a manufacturing method thereof. Background Art

[0002] To meet the high pixel and resolution requirements of lens modules, optical image stabilization (OIS) is required. Because the sensor chip's OIS feedback speed is fast and its adjustment frequency is high, OIS significantly improves the image quality of the lens module. However, the current OIS function of lens modules fails to meet practical needs. Summary of the Invention

[0003] In view of this, the present application provides a method for manufacturing a circuit board that can achieve anti-shake for a lens module.

[0004] In addition, it is also necessary to provide a circuit board manufactured by the above method.

[0005] An embodiment of the present application provides a method for manufacturing a circuit board for lens module anti-shake, comprising the following steps:

[0006] providing a metal layer;

[0007] forming a first dry film on one surface of the metal layer;

[0008] performing exposure and development processing on the first dry film to form a first patterned dry film;

[0009] Etching the metal layer through the first patterned dry film to form a first conductive circuit layer, wherein the first conductive circuit layer is provided with a plurality of first trenches;

[0010] removing the first patterned dry film;

[0011] forming an insulating layer and a second dry film in sequence on the surface of the first conductive circuit layer;

[0012] performing an exposure process on the second dry film through the first groove to form a second patterned dry film;

[0013] performing exposure and development processing on the second patterned dry film to form a third patterned dry film;

[0014] forming a second conductive circuit layer on the surface of the insulating layer by using the third patterned dry film, wherein a plurality of second grooves are provided in the second conductive circuit layer, and the second grooves correspond to the first grooves;

[0015] removing the third patterned dry film; and

[0016] A plurality of third grooves are opened in the insulating layer, and the third grooves are connected to the first groove and the second groove, thereby obtaining the circuit board, wherein the circuit board includes a hollow area and a non-hollow area connected to the hollow area, the hollow area is the area where the first groove, the second groove and the third groove are located, and the hollow area is movable.

[0017] One embodiment of the present application further provides a circuit board for lens module anti-shake, comprising a first conductive circuit layer, an insulating layer, and a second conductive circuit layer stacked in sequence;

[0018] The first conductive circuit layer is provided with a plurality of first grooves, the second conductive circuit layer is provided with a plurality of second grooves, and the second grooves correspond to the first grooves; the insulating layer is provided with a plurality of third grooves, and the third grooves communicate with the first grooves and the second grooves;

[0019] The circuit board includes a hollow area and a non-hollow area connected to the hollow area. The hollow area is the area where the first groove, the second groove and the third groove are located. The hollow area is movable.

[0020] The present application opens multiple first grooves in the first conductive circuit layer, opens multiple second grooves in the second conductive circuit layer, and connects the first grooves and the second grooves to form the hollow area, so that the hollow area is movable, thereby making the circuit board movable. When a photosensitive chip is installed on the circuit board, since the circuit board is movable, the photosensitive chip can be moved to compensate for light, thereby realizing optical image stabilization of the lens module. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 Schematic diagram of the structure of the metal layer provided in one embodiment of the present application.

[0022] Figure 2 is Figure 1 The structure diagram shown is after the first dry films are formed on two opposite surfaces of the metal layer.

[0023] Figure 3 Yes Figure 2 The structure diagram of the first dry film after exposure and development is shown.

[0024] Figure 4 It will Figure 3 The structure diagram shown is after the metal layer is etched and the first patterned dry film is removed.

[0025] Figure 5 is Figure 4The schematic diagram of the structure is shown after an insulating layer and a seed material layer are sequentially formed on the surface of the first conductive circuit layer.

[0026] Figure 6 is Figure 5 The schematic diagram of the structure after the second dry film is formed on the surface of the seed material layer is shown.

[0027] Figure 7 Yes Figure 6 FIG. 4 is a schematic structural diagram of the second dry film after exposure treatment.

[0028] Figure 8 Yes Figure 7 The structure schematic diagram of the second patterned dry film after exposure and development processing is shown.

[0029] Figure 9 is Figure 8 The schematic diagram of the structure after the copper plating layer is formed on the surface of the seed material layer is shown.

[0030] Figure 10 It will Figure 9 Schematic diagram of the structure after the third patterned dry film is removed.

[0031] Figure 11 It will Figure 10 Schematic diagram of the structure after the seed material layer is etched.

[0032] Figure 12 is Figure 11 The schematic diagram shows the structure after a protective layer is formed on part of the second conductive circuit layer.

[0033] Figure 13 It will Figure 12 The schematic diagram of the structure of the circuit board used for lens module anti-shake is shown after the insulating layer is etched.

[0034] Description of main component symbols

[0035] Circuit board 100

[0036] Metal layer 10

[0037] First dry film 20

[0038] First patterned dry film 21

[0039] The first conductive circuit layer 30

[0040] First groove 31

[0041] Insulation layer 40

[0042] Seed material layer 50

[0043] Second dry film 60

[0044] Second patterned dry film 61

[0045] The third patterned dry film 62

[0046] Copper plating layer 70

[0047] Second groove 701

[0048] Fourth groove 702

[0049] Seed layer 71

[0050] The second conductive circuit layer 72

[0051] Protective layer 80

[0052] Hollow area 90

[0053] Non-hollow area 91

[0054] The following specific implementation methods will further illustrate this application in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0055] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments.

[0056] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application pertains. The terms used herein in the specification of this application are for the purpose of describing specific embodiments only and are not intended to limit this application.

[0057] In order to further illustrate the technical means and effects adopted by this application to achieve the intended purpose, the following detailed description of this application is made in conjunction with the accompanying drawings and preferred implementation methods.

[0058] An embodiment of the present application provides a method for manufacturing a circuit board for lens module anti-shake, comprising the following steps:

[0059] Step S11, please refer to Figure 1 , providing a metal layer 10.

[0060] In this embodiment, the thickness of the metal layer 10 is greater than 72 μm. In this embodiment, the material of the metal layer 10 can be copper or other metals. In other embodiments, the material of the metal layer 10 can also be an alloy.

[0061] Step S12, please refer to Figure 2 , first dry films 20 are formed on two opposite surfaces of the metal layer 10 respectively.

[0062] Step S13, please refer to Figure 3 , each of the first dry films 20 is subjected to exposure and development processing to form a first patterned dry film 21 .

[0063] Step S14, please refer to Figure 4 The metal layer 10 is etched through each of the first patterned dry films 21 to form a first conductive circuit layer 30 .

[0064] The first conductive circuit layer 30 is provided with a plurality of first grooves 31. The inner diameter of each first groove 31 decreases from each surface of the first conductive circuit layer 30 to the interior of the first conductive circuit layer 30. Figure 4 As shown, along the thickness direction of the first conductive circuit layer 30 , the first conductive circuit layer 30 between two adjacent first grooves 31 is wide in the middle and narrow at both ends.

[0065] In this embodiment, since the thickness of the metal layer 10 is greater than 72 μm, the thickness of the first conductive circuit layer 30 is also greater than 72 μm.

[0066] In this embodiment, the width of the first conductive circuit layer 30 is 20-80 μm.

[0067] Step S15 , removing the two first patterned dry films 21 .

[0068] Step S16, see Figure 5 , an insulating layer 40 and a seed material layer 50 are sequentially formed on the surface of the first conductive circuit layer 30 .

[0069] The insulating layer 40 may be made of a material selected from epoxy resin, polypropylene (PP), BT resin, polyphenylene oxide (PPO), polyimide (PI), polyethylene terephthalate (PET), and polyethylene naphthalate (PEN). In this embodiment, the insulating layer 40 is made of polyimide.

[0070] The insulating layer 40 is made of a highly light-transmitting material. Specifically, the light transmittance of the insulating layer 40 is greater than 90%.

[0071] The seed material layer 50 is made of metal or carbon. In this embodiment, the thickness of the seed material layer 50 is less than 0.1 μm.

[0072] The seed material layer 50 is made of a highly light-transmitting material. Specifically, the light transmittance of the seed material layer 50 is greater than 90%.

[0073] Step S17, please refer to Figure 6 , forming a second dry film 60 on the surface of the seed material layer 50 .

[0074] Step S18, please refer to Figure 7 , the second dry film 60 is exposed through the first groove 31 to form a second patterned dry film 61 .

[0075] Step S19, please refer to Figure 8 , the second patterned dry film 61 is exposed and developed to form a third patterned dry film 62 .

[0076] Specifically, the second patterned dry film 61 is irradiated from a side of the seed material layer 50 away from the insulating layer 40 to form the third patterned dry film 62 .

[0077] Step S20, see Figure 9 A copper plating layer 70 is formed on the surface of the seed material layer 50 through the third patterned dry film 62 .

[0078] Specifically, the copper plating layer 70 can be formed by electroplating.

[0079] Step S21, please refer to Figure 10 , remove the third patterned dry film 62.

[0080] The copper plating layer 70 is provided with a plurality of second grooves 701 and a plurality of fourth grooves 702 , wherein the second grooves 701 correspond to the first grooves 31 .

[0081] In this embodiment, the inner diameter of the fourth trench 702 is less than 40 μm.

[0082] Step S22, see Figure 11 , the seed material layer 50 is etched through the second trench 701 and the fourth trench 702 to form a seed layer 71 .

[0083] The copper plating layer 70 and the seed layer 71 form a second conductive circuit layer 72. In this embodiment, the thickness of the second conductive circuit layer is 10-20 μm.

[0084] In this embodiment, since the thickness of the seed material layer 50 is less than 0.1 μm, the thickness of the seed layer 71 is also less than 0.1 μm. The seed layer 71 is used to improve the bonding force between the copper plating layer 70 and the insulating layer 40 .

[0085] In the area where the second groove 701 is located, the second conductive circuit layer 72 and the first conductive circuit layer 30 roughly overlap without any deviation. At the same time, since the thickness of the first conductive circuit layer 30 is greater than 72 μm, the first conductive circuit layer 30 can reinforce and dissipate heat for the second conductive circuit layer 72.

[0086] In this embodiment, the width of the second conductive circuit layer 72 is 20-80 μm.

[0087] Step S23, please refer to Figure 12 , forming a protection layer 80 on a portion of the second conductive circuit layer 72 .

[0088] Specifically, the protective layer 80 is formed on the second conductive circuit layer 72 except the second grooves 701 , that is, the protective layer 80 does not cover the second grooves 701 and the portion of the second conductive circuit layer 72 between any two second grooves 701 .

[0089] The protection layer 80 is also filled in the fourth trench 702 .

[0090] In one embodiment, the protective layer 80 may be solder resist ink, coverlay film (CVL), or resin glue, etc. The protective layer 80 is used to protect the second conductive circuit layer 72 .

[0091] Step S24, please refer to Figure 13 , a plurality of third trenches 41 are opened in the insulating layer 40 , and the third trenches 41 are connected to the first trench 31 and the second trench 701 , thereby obtaining the circuit board 100 .

[0092] Specifically, the insulating layer 40 is etched to form the third trench 41 .

[0093] The circuit board 100 includes a hollow area 90 and a non-hollow area 91 connected to the hollow area 90. The hollow area 90 is the area where the first groove 31, the second groove 701 and the third groove 41 are located. The non-hollow area 91 is the area other than the hollow area 90. Figure 13As shown, a hollow area 90 and two non-hollow areas 91 on either side of the hollow area 90 can be seen. Because the hollow area 90 is provided with multiple first grooves 31, multiple second grooves 701, and multiple third grooves 41, the hollow area 90 is movable, thereby enabling the circuit board 100 to move. Furthermore, because the first conductive circuit layer 30 between two adjacent first grooves 31 is wide in the middle and narrow at both ends, this prevents the hollow area 90 from contacting the second conductive circuit layer 72 when moving.

[0094] In other embodiments, connecting ribs (not shown) may be added to a local area of ​​the first conductive circuit layer 30 to enhance the structural stability of the first conductive circuit layer 30 .

[0095] In actual application, a photosensitive chip (not shown) and a lens (not shown) can be mounted on the circuit board 100 and positioned opposite the photosensitive chip to form a lens module. Since the circuit board 100 is movable, the photosensitive chip can also be moved, thereby achieving optical image stabilization of the lens module.

[0096] See also Figure 13 An embodiment of the present application further provides a circuit board 100 for lens module anti-shake, wherein the circuit board 100 includes a first conductive circuit layer 30, an insulating layer 40, a second conductive circuit layer 72 and a protective layer 80 stacked in sequence.

[0097] The first conductive circuit layer 30 is provided with a plurality of first grooves 31. The inner diameter of each first groove 31 decreases from each surface of the first conductive circuit layer 30 to the interior of the first conductive circuit layer 30. Figure 13 As shown, along the thickness direction of the first conductive circuit layer 30 , the first conductive circuit layer 30 between two adjacent first grooves 31 is wide in the middle and narrow at both ends.

[0098] In this embodiment, the thickness of the first conductive circuit layer 30 is greater than 72 μm. In this embodiment, the material of the first conductive circuit layer 30 can be copper or other metals. In other embodiments, the material of the first conductive circuit layer 30 can also be an alloy.

[0099] In this embodiment, the width of the first conductive circuit layer 30 is 20-80 μm.

[0100] The insulating layer 40 may be made of a material selected from epoxy resin, polypropylene (PP), BT resin, polyphenylene oxide (PPO), polyimide (PI), polyethylene terephthalate (PET), and polyethylene naphthalate (PEN). In this embodiment, the insulating layer 40 is made of polyimide.

[0101] The insulating layer 40 is made of a highly light-transmitting material. Specifically, the light transmittance of the insulating layer 40 is greater than 90%.

[0102] In this embodiment, the second conductive circuit layer 72 includes a copper plating layer 70 and a seed layer 71 , wherein the seed layer 71 is located between the insulating layer 40 and the copper plating layer 70 .

[0103] The seed layer 71 is made of metal or carbon. In this embodiment, the thickness of the seed layer 71 is less than 0.1 μm. The seed layer 71 is made of a highly transparent material. Specifically, the transmittance of the seed layer 71 is greater than 90%. The seed layer 71 is used to improve the bonding strength between the copper-plated layer 70 and the insulating layer 40.

[0104] The second conductive circuit layer 72 is provided with a plurality of second grooves 701 and a plurality of fourth grooves 702. The second grooves 701 correspond to the first grooves 31. In this embodiment, the inner diameter of the fourth grooves 702 is less than 40 μm. In this embodiment, the thickness of the second conductive circuit layer is 10-20 μm.

[0105] In the area where the second groove 701 is located, the second conductive circuit layer 72 and the first conductive circuit layer 30 roughly overlap without any deviation. At the same time, since the thickness of the first conductive circuit layer 30 is greater than 72 μm, the first conductive circuit layer 30 can reinforce and dissipate heat for the second conductive circuit layer 72.

[0106] In this embodiment, the width of the second conductive circuit layer 72 is 20-80 μm.

[0107] A plurality of third trenches 41 are defined in the insulating layer 40 , and the third trenches 41 communicate with the first trench 31 and the second trench 701 .

[0108] The protective layer 80 is located on a portion of the surface of the second conductive circuit layer 72. Specifically, the protective layer 80 is located in the area of ​​the second conductive circuit layer 72 excluding the second grooves 701. That is, the protective layer 80 does not cover the second grooves 701 and the portion of the second conductive circuit layer 72 between any two second grooves 701. The protective layer 80 also fills the fourth groove 702.

[0109] In one embodiment, the protective layer 80 may be solder resist ink, coverlay film (CVL), or resin glue, etc. The protective layer 80 is used to protect the second conductive circuit layer 72 .

[0110] The circuit board 100 includes a hollow area 90 and a non-hollow area 91 connected to the hollow area 90. The hollow area 90 is the area where the first groove 31, the second groove 701 and the third groove 41 are located. The non-hollow area 91 is the area other than the hollow area 90. Figure 13 As shown, a hollow area 90 and two non-hollow areas 91 on either side of the hollow area 90 can be seen. Because the hollow area 90 is provided with multiple first grooves 31, multiple second grooves 701, and multiple third grooves 41, the hollow area 90 is movable, thereby enabling the circuit board 100 to move. Furthermore, because the first conductive circuit layer 30 between two adjacent first grooves 31 is wide in the middle and narrow at both ends, this prevents the hollow area 90 from contacting the second conductive circuit layer 72 when moving.

[0111] In other embodiments, the circuit board 100 may further include connecting ribs (not shown), wherein the connecting ribs are located in a local area of ​​the first conductive circuit layer 30 to enhance the structural stability of the first conductive circuit layer 30 .

[0112] In actual application, a photosensitive chip (not shown) and a lens (not shown) can be mounted on the circuit board 100 and positioned opposite the photosensitive chip to form a lens module. Since the circuit board 100 is movable, the photosensitive chip can also be moved, thereby achieving optical image stabilization of the lens module.

[0113] In the present application, a plurality of first grooves 31 are opened in the first conductive circuit layer 30, a plurality of second grooves 701 are opened in the second conductive circuit layer 72, and the third groove 41 is connected to the first groove 31 and the second groove 701 to form the hollow area 90, so that the hollow area 90 is movable, thereby making the circuit board 100 movable. When a photosensitive chip is installed on the circuit board 100, since the circuit board 100 is movable, the photosensitive chip can be moved to compensate for light, thereby realizing optical image stabilization of the lens module.

[0114] In addition, in the present application, along the thickness direction of the first conductive circuit layer 30, since the first conductive circuit layer 30 between two adjacent first grooves 31 is wide in the middle and narrow at both ends, it is possible to prevent the hollow area 90 from touching the second conductive circuit layer 72 when moving.

[0115] The above description is merely an optimized specific implementation of the present application, but in actual application, it cannot be limited to this implementation.

Claims

1. A method for manufacturing a circuit board for lens module anti-shake, characterized in that: The following steps are involved: providing a metal layer; forming a first dry film on one surface of the metal layer; performing exposure and development processing on the first dry film to form a first patterned dry film; Etching the metal layer through the first patterned dry film to form a first conductive circuit layer, wherein the first conductive circuit layer is provided with a plurality of first trenches; removing the first patterned dry film; forming an insulating layer and a second dry film in sequence on the surface of the first conductive circuit layer; performing an exposure process on the second dry film through the first groove to form a second patterned dry film; performing exposure and development processing on the second patterned dry film to form a third patterned dry film; forming a second conductive circuit layer on the surface of the insulating layer by using the third patterned dry film, wherein a plurality of second grooves are provided in the second conductive circuit layer, and the second grooves correspond to the first grooves; removing the third patterned dry film; and A plurality of third grooves are opened in the insulating layer, and the third grooves are connected to the first groove and the second groove, thereby obtaining the circuit board, wherein the circuit board includes a hollow area and a non-hollow area connected to the hollow area, the hollow area is the area where the first groove, the second groove and the third groove are located, and the hollow area is movable.

2. The method for manufacturing a circuit board according to claim 1, wherein: Also includes: forming another first dry film on the other surface of the metal layer; performing exposure and development processing on the another first dry film to form another first patterned dry film; Etching the metal layer through the other first patterned dry film to form the first conductive circuit layer; as well as removing the other first patterned dry film; Wherein, the inner diameter of each first groove decreases in a direction from each surface of the first conductive circuit layer to the interior of the first conductive circuit layer.

3. The method for manufacturing a circuit board according to claim 1, wherein: After forming the insulating layer on the surface of the first conductive circuit layer, the manufacturing method further includes: forming a seed material layer on a surface of the insulating layer; Wherein, the second dry film is formed on the surface of the seed material layer; After removing the third patterned dry film, the manufacturing method further includes: A fourth trench is formed in the second conductive circuit layer in a non-hollowed area, and the seed material layer is etched through the second trench and the fourth trench to form a seed layer; Wherein, the second conductive circuit layer includes the seed layer.

4. The method for manufacturing a circuit board according to claim 3, wherein: The light transmittance of the insulating layer and the seed layer is greater than 90%.

5. The method for manufacturing a circuit board according to claim 1, wherein: The thickness of the first conductive circuit layer is greater than 72 μm, and the thickness of the second conductive circuit layer is 10-20 μm.

6. The method for manufacturing a circuit board according to claim 1, wherein: A fourth groove is further provided in the second conductive circuit layer, and the manufacturing method further includes: forming a protective layer on a portion of the second conductive circuit layer; Wherein, the protection layer is also filled in the fourth trench.

7. A circuit board for lens module anti-shake, characterized in that: It comprises a first conductive circuit layer, an insulating layer and a second conductive circuit layer which are stacked in sequence; The first conductive circuit layer is provided with a plurality of first grooves, the second conductive circuit layer is provided with a plurality of second grooves, and the second grooves correspond to the first grooves; the insulating layer is provided with a plurality of third grooves, and the third grooves communicate with the first grooves and the second grooves; The circuit board includes a hollow area and a non-hollow area connected to the hollow area. The hollow area is the area where the first groove, the second groove and the third groove are located. The hollow area is movable.

8. The circuit board according to claim 7, wherein: The inner diameter of each first groove decreases in a direction from each surface of the first conductive circuit layer to the interior of the first conductive circuit layer.

9. The circuit board according to claim 7, wherein: The second conductive circuit layer includes a seed layer and a copper plating layer, and the seed layer is located between the copper plating layer and the insulating layer.

10. The circuit board according to claim 7, wherein: The thickness of the first conductive circuit layer is greater than 72 μm, and the thickness of the second conductive circuit layer is 10-20 μm.

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