Automated optical inspection equipment for QFN chips

Abstract

The present invention relates to the technical field of QFN chip detection, and specifically, discloses an automatic optical detection device for QFN chips, which includes a detection device body, and the detection device body includes a loading part, a first detection station, a second detection station, and a unloading part; the loading part is used to transport the QFN chip to the first detection station, the first detection station is used to perform preliminary detection on the QFN chip and transport the QFN chip to the second detection station, and the second detection station is used to re-detect the defective QFN chip detected by the first detection station; the second detection station is also used to transport the QFN chip to the unloading part, and the unloading part is used to collect the QFN chips. The present invention avoids performing secondary detection on each QFN chip, thereby preferably improving the detection efficiency of the QFN chip, and also realizes detailed detection of the defective QFN chip, thereby improving the detection effect of the QFN chip.

Description

Technical Field

[0001] The present invention relates to the technical field of QFN chip detection, and in particular to an automatic optical detection device for QFN chips. Background Art

[0002] QFN (Quad Flat No-lead Package) is a newer chip package form. It uses a pinless package in a square or rectangular shape. It uses the middle pad at the bottom of the package for heat conduction. There are conductive pads around the package periphery around the middle pad for electrical connection. The main defects of QFN chip products are concentrated in several aspects such as voids, foreign matter contamination, glue overflow, corner collapse, cutting deviation, scratches, etc. Therefore, QFN chips need to be inspected after they are produced. At present, the commonly used inspection method is optical visual inspection. During the optical inspection process, the current mainstream inspection method is to first conduct a rough inspection of the QFN chip. If an abnormality is found during the inspection process, the QFN chip will be selected and inspected more finely by equipment. Since the selection of QFN takes a lot of time, and the equipment for setting up more fine inspections takes up a lot of space. Summary of the invention

[0003] In order to solve the above technical problems, the present invention is solved by the following technical solutions:

[0004] An automatic optical inspection device for QFN chips, comprising an inspection device body, wherein the inspection device body comprises a loading portion, a first inspection station, a second inspection station and a unloading portion; the loading portion is used to transport the QFN chips to the first inspection station, the first inspection station is used to perform preliminary inspection on the QFN chips and transport the QFN chips to the second inspection station, the second inspection station is used to re-inspect the defective QFN chips detected by the first inspection station; the second inspection station is also used to transport the QFN chips to the unloading portion, and the unloading portion is used to collect the QFN chips.

[0005] The present invention avoids performing secondary inspection on each QFN chip, thereby preferably improving the inspection efficiency of the QFN chip, and also realizes detailed inspection of defective QFN chips, thereby improving the inspection effect of the QFN chip.

[0006] Preferably, the loading part includes a first belt conveying mechanism for conveying the QFN chip box, a first lifting mechanism for lifting the QFN chip box is provided at the end portion of the first belt conveying mechanism along its conveying direction, the first lifting mechanism includes a first placement rack for receiving the QFN chip box, the first placement rack is provided with a first screw drive module for driving the first placement rack to move in a vertical direction, the loading part is also provided with an ejection mechanism for ejecting the QFN chip in the QFN chip box at the first placement rack; the ejection mechanism includes a second pulley group, the second pulley group includes two second pulleys, a second belt is connected between the two second pulleys, and the second belt is provided with a top plate for ejecting the chip in the QFN chip box.

[0007] In the present invention, the chips in the QFN chip box can be pushed out more stably through the cooperation between the first lifting mechanism and the ejecting mechanism.

[0008] Preferably, a third belt conveyor mechanism is provided at the main body of the detection equipment for conveying the QFN chip ejected by the ejection mechanism. The third belt conveyor mechanism includes a third conveying belt. A baffle for blocking the QFN chip is provided at the end of the third belt conveyor mechanism along its conveying direction.

[0009] In the present invention, by transferring the QFN chip to the third conveyor belt, it is convenient to clamp the QFN chip to the first inspection station. The baffle is set to prevent the QFN chip from falling from the third conveyor belt.

[0010] Preferably, the loading part also includes a first placement table arranged at the upper end of the first belt conveyor mechanism and used to place the QFN chip box for taking out the QFN chip; the loading part is provided with a conveying mechanism for conveying the first placement rack to the first placement table, and the conveying mechanism includes a first dual-axis cylinder arranged at the upper end of the first screw drive module.

[0011] In the present invention, the first dual-axis cylinder is provided so that the collection of the QFN chip box can be realized more conveniently.

[0012] Preferably, a first transporting mechanism for transporting the QFN chip at the third belt conveyor mechanism to the first inspection station is provided at the detection equipment body, the first transporting mechanism includes a first finger cylinder arranged at the upper end of the third belt conveyor mechanism, the first finger cylinder is provided with a first clamping plate for clamping the QFN chip, a first mounting frame located at the third belt conveyor mechanism is provided at the detection equipment body, a second screw drive module for driving the first finger cylinder to move in a horizontal direction is provided at the first mounting frame, and a second dual-axis cylinder for connecting with the first finger cylinder and driving the first finger cylinder to move in a vertical direction is provided at the slider of the second screw drive module.

[0013] In the present invention, by setting the first transport mechanism structure, the QFN chip can be moved to the first inspection station 220 through the cooperation between the second dual-axis cylinder and the second screw drive module.

[0014] Preferably, the first inspection station includes a first inspection module arranged at the inspection equipment body and used to inspect the QFN chip, the first inspection module includes a line scanning camera unit and a line laser camera unit; the first inspection station also includes a linear motor module, and the linear motor module is provided with a placement platform for placing the QFN chip, and the linear motor module is used to transport the QFN chip on the placement platform to the first inspection module.

[0015] In the present invention, the QFN chip is inspected by the line scanning camera unit and the line laser camera unit in the first inspection module, so that the inspection of the QFN chip can be realized. Preferably, the second inspection station includes a second inspection module arranged at the inspection device body and used to inspect the QFN chip, the second inspection module includes an array camera unit; the second inspection module also includes a fourth belt conveyor mechanism, the fourth belt conveyor mechanism includes two parallel mounting plates, and a fourth conveyor belt for conveying the QFN chip to the array camera unit is arranged between the two parallel mounting plates.

[0016] In the present invention, the second inspection station is provided so as to realize the inspection of defective QFN chips.

[0017] Preferably, the detection equipment body is provided with a second transport mechanism for transporting the QFN chip at the first detection station to the fourth belt conveyor mechanism, the second transport mechanism includes a second finger cylinder arranged at the upper end of the fourth belt conveyor mechanism, the second finger cylinder is provided with a second clamping plate for clamping the QFN chip, the detection equipment body is provided with a second mounting frame located at the fourth belt conveyor mechanism, the second mounting frame is provided with a third screw drive module for driving the second finger cylinder to move in the horizontal direction, and the slider of the third screw drive module is provided with a third dual-axis cylinder for connecting with the second finger cylinder and driving the second finger cylinder to move in the vertical direction.

[0018] In the present invention, by providing the second transport mechanism, the QFN chip at an inspection station can be transported to the fourth belt conveyor mechanism in a better manner.

[0019] Preferably, the unloading part includes a fifth belt conveyor mechanism which is arranged at the main body of the detection equipment and located at the end of the fourth belt conveyor mechanism, and the end of the fifth belt conveyor mechanism is provided with a second placement rack for placing the QFN chip box; the unloading part also includes a sixth pulley group for delivering the QFN chip at the end of the fifth belt conveyor mechanism to the QFN chip box, the sixth pulley group includes two sixth pulleys, a sixth belt is connected between the two sixth pulleys, and the sixth belt is provided with an L-shaped plate for delivering the QFN chip to the QFN chip box.

[0020] In the present invention, by setting the sixth pulley group, the collection of the QFN chips after detection can be better achieved.

[0021] Preferably, the unloading section is provided with a seventh belt conveyor mechanism for conveying the QFN chip box to the second placement rack; the unloading section also includes a second placement table arranged at the upper end of the seventh belt conveyor mechanism and used for placing the QFN chip box; the unloading section is provided with a second lifting mechanism for moving the second placement rack to the second placement table, the second lifting mechanism includes a fourth screw drive module connected to the second placement rack, and the upper end of the fourth screw drive module is provided with a fourth dual-axis cylinder for conveying the QFN chip box at the second placement rack to the second placement table.

[0022] In the present invention, by setting the second lifting mechanism, it can cooperate with the sixth pulley group to push the QFN into the QFN chip box in sequence; by setting the second placement table and the fourth dual-axis cylinder, the chip box filled with QFN chips can be automatically collected. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a three-dimensional diagram of the automatic optical inspection equipment for QFN chips in Example 1.

[0024] Figure 2 for Figure 1 Schematic diagram of the internal structure of the automatic optical inspection equipment used for QFN chips.

[0025] Figure 3 This is a schematic diagram of the structure of the feeding part in Example 1.

[0026] Figure 4 for Figure 3 Structural explosion diagram of the loading part.

[0027] Figure 5 This is a schematic diagram of the structure of the first detection station and the second detection station in Example 1.

[0028] Figure 6 for Figure 5 Schematic diagram of the structure of the third belt conveyor mechanism.

[0029] Figure 7 for Figure 5 A schematic structural diagram of the first transport mechanism in FIG.

[0030] Figure 8 This is a schematic diagram of the structure of the first detection station in Example 1.

[0031] Fig. 9 for Figure 5 Schematic diagram of the linear motor module structure.

[0032] Fig.10 This is a schematic diagram of the structure of the second detection station in Example 1.

[0033] Fig.11 for Figure 5 Schematic diagram of the structure of the fourth belt conveyor mechanism.

[0034] Fig.12 for Figure 5 Schematic diagram of the structure of the second transport mechanism.

[0035] Fig.13 This is a schematic diagram of the structure of the blanking part in Example 1.

[0036] Fig.14 for Fig.13 Schematic diagram of the structure of the sixth pulley group.

[0037] Fig.15 for Fig.13 Schematic diagram of the structure of the second lifting mechanism. DETAILED DESCRIPTION

[0038] In order to further understand the content of the present invention, the present invention is described in detail in conjunction with the accompanying drawings and embodiments. It should be understood that the embodiments are only for explaining the present invention and are not intended to limit it.

[0039] Example 1

[0040] like Figure 1-2 As shown, the present embodiment provides an automatic optical inspection device for QFN chips, which includes an inspection device body 100, and the inspection device body 100 includes a loading part 210, a first inspection station 220, a second inspection station 230 and a unloading part 240; the loading part 210 is used to transport the QFN chip to the first inspection station 220, the first inspection station 220 is used to perform a preliminary inspection on the QFN chip and transport the QFN chip to the second inspection station 230, and the second inspection station 230 is used to re-inspect the defective QFN chip detected by the first inspection station 220; the second inspection station 230 is also used to transport the QFN chip to the unloading part 240, and the unloading part 240 is used to collect the QFN chips.

[0041] When the automatic optical inspection equipment for QFN chips in this embodiment is used, the chip box containing QFN chips is first placed on the loading part 210, and the loading part 210 conveys the QFN chips in the chip box to the first inspection station 220 in sequence. The first inspection station 220 performs a preliminary inspection on the QFN chips, and then conveys the inspected QFN chips to the second inspection station 230. The second inspection station 230 performs a secondary inspection on the QFN chips detected as defective by the first inspection station 220, so as to determine the specific defects of the QFN chips; if the first inspection station 220 does not detect that the QFN has defects, the second inspection station 230 does not perform a secondary inspection on the QFN chip, but directly conveys the QFN chip to the unloading part 240, and the unloading part 240 collects the QFN chips.

[0042] The automatic optical inspection equipment for QFN chips in this embodiment can avoid secondary inspection of each QFN chip by setting up the first inspection station 220 and the second inspection station 230, thereby preferably improving the inspection efficiency of QFN chips, and also realizing detailed inspection of defective QFN chips, thereby improving the inspection effect of QFN chips. At the same time, compared with QFN optical inspection equipment that can only perform a single inspection, the automatic optical inspection equipment for QFN chips in this embodiment can also preferably reduce the space occupied by combining the first inspection station 220 with the second inspection station 230.

[0043] Combination Figure 3 , 4 As shown, the loading part 210 in this embodiment includes a first belt conveying mechanism 310 for conveying the QFN chip box, and the first belt conveying mechanism 310 is provided with a first lifting mechanism 330 for lifting the QFN chip box at the end portion thereof along the conveying direction, and the first lifting mechanism 330 includes a first placement rack 410 for receiving the QFN chip box, and the first placement rack 410 is provided with a first screw drive module 420 for driving the first placement rack 410 to move in the vertical direction, and the loading part 210 is also provided with a first placement rack 410 for moving the first placement rack 410 in the vertical direction. The ejection mechanism comprises a second pulley group 320, the second pulley group 320 comprises two second pulleys 430, a second belt 440 is connected between the two second pulleys 430, the ejection mechanism also comprises a second pulley motor 460 connected to one of the two second pulleys 430 and driving the second belt 440 to move back and forth, and a top plate 450 for ejecting the chip in the QFN chip box is provided at the second belt 440.

[0044] When the loading part 210 in this embodiment is in use, the QFN chip box containing QFN chips is placed on the first belt conveyor mechanism 310, and the first belt conveyor mechanism 310 conveys the QFN chip box to the first placement rack 410, and the top plate 450 is reciprocated by the second pulley motor 460. After the top plate 450 ejects the QFN chips of one layer of the QFN chip box, the first screw drive module 420 in the first lifting mechanism 330 drives the first placement rack 410 to move upward, so that the top plate 450 can continue to push out the QFN chips in the lower layer of the QFN chip box. In this embodiment, through the cooperation between the first lifting mechanism 330 and the ejection mechanism, the chips in the QFN chip box can be pushed out more stably.

[0045] Combination Figure 5 as well as Figure 6 As shown, a third belt conveyor mechanism 510 for conveying the QFN chip ejected by the ejection mechanism is provided at the detection device body 100, the third belt conveyor mechanism 510 includes a third conveyor belt 580, the third belt conveyor mechanism 510 includes a third conveyor belt motor 590 for driving the third conveyor belt 580 to rotate, and a baffle 5100 for blocking the QFN chip is provided at the end of the third belt conveyor mechanism 510 along its conveying direction.

[0046] The QFN chip pushed out by the top plate 450 falls on the third conveyor belt 580 and is blocked by the baffle 5100, thereby preventing the QFN chip from falling from the third conveyor belt 580, thereby greatly improving the stability of the detection equipment during use; by transferring the QFN chip to the third conveyor belt 580, it is convenient to clamp the QFN chip to the first detection station 220.

[0047] Combination Figure 4 As shown, the loading part 210 also includes a first placement table 480 which is arranged at the upper end of the first belt conveyor mechanism 310 and is used to place the QFN chip box for taking out the QFN chip; the loading part 210 is provided with a pushing mechanism for pushing the first placement rack 410 to the first placement table 480, and the pushing mechanism includes a first double-axis cylinder 470 which is arranged at the upper end of the first screw drive module 420, and the first placement rack 410 is provided with a first placement rack through hole (not shown in the figure) for the first double-axis cylinder 470 to push the upper push plate through.

[0048] In this embodiment, by setting the first dual-axis cylinder 470, the QFN chip box with the QFN chip taken out can be pushed to the first placement table 480, so that the collection of the QFN chip box can be realized more conveniently, and the automation of the automatic optical detection equipment of the QFN chip is preferably improved.

[0049] Combination Figure 7As shown, a first transport mechanism 520 for transporting the QFN chip at the third belt conveyor mechanism 510 to the first inspection station 220 is provided at the detection device body 100, and the first transport mechanism 520 includes a first finger cylinder 610 arranged at the upper end of the third belt conveyor mechanism 510, and a first clamping plate 620 for clamping the QFN chip is provided at the first finger cylinder 610. A first mounting frame located at the third belt conveyor mechanism 510 is provided at the detection device body 100, and a second screw drive module 630 for driving the first finger cylinder 610 to move in a horizontal direction is provided at the first mounting frame, and a second dual-axis cylinder 640 for connecting with the first finger cylinder 610 and driving the first finger cylinder 610 to move in a vertical direction is provided at the slider of the second screw drive module 630.

[0050] When the QFN chip is transmitted to the third belt conveyor mechanism 510, the second double-axis cylinder 640 is moved to the upper end of the QFN chip through the second screw drive module 630, and then the first finger cylinder 610 is driven to open the first clamping plate 620, and finally the second double-axis cylinder 640 is driven to move the first clamping plate 620 on the first finger cylinder 610 to the QFN chip, and then the QFN chip is clamped by the first clamping plate 620, and then the QFN chip is moved to the first inspection station 220 through the cooperation between the second double-axis cylinder 640 and the second screw drive module 630.

[0051] In this embodiment, by providing the first transport mechanism 520 , the QFN chip at the third belt conveyor mechanism 510 can be better transported to the first inspection station 220 .

[0052] Combination Figure 8 , 9 As shown, the first inspection station 220 includes a first inspection module 530 which is arranged at the inspection equipment body 100 and is used to inspect the QFN chip. The first inspection module 530 includes a line scanning camera unit 710 and a line laser camera unit 720. The first inspection station 220 also includes a linear motor module 540. The linear motor module 540 is provided with a placement platform 810 for placing the QFN chip. The linear motor module 540 is used to transport the QFN chip at the placement platform 810 to the first inspection module 530.

[0053] After the first transport mechanism 520 transports the QFN chip to the linear motor module 540 at the first inspection station 220, the linear motor module 540 moves the QFN chip to the first inspection module 530, and the QFN chip is inspected by the line scanning camera unit 710 and the line laser camera unit 720 in the first inspection module 530, thereby realizing the inspection of the QFN chip.

[0054] Combination Fig.10 , 11 As shown, the second inspection station 230 includes a second inspection module 550 arranged at the inspection equipment body 100 and used to inspect the QFN chip, and the second inspection module 550 includes an area array camera unit 910; the second inspection module 550 also includes a fourth belt conveyor mechanism 560, and the fourth belt conveyor mechanism 560 includes two parallel mounting plates 1010, and a fourth conveying belt 1020 for conveying the QFN chip to the area array camera unit 910 is provided between the two parallel mounting plates 1010.

[0055] After the first inspection station 220 completes the inspection of the QFN chip, the second inspection module 550 at the second inspection station 230 can perform detailed inspection on the defective QFN chip, and the non-defective QFN chip is directly conveyed to the unloading part 240 through the fourth conveyor belt 1020, so that the defective QFN chip can be inspected.

[0056] Combination Fig.12 , 13 As shown, the detection device body 100 is provided with a second transport mechanism 570 for transporting the QFN chip at the first detection station 220 to the fourth belt conveyor mechanism 560, the second transport mechanism 570 includes a second finger cylinder 1110 arranged at the upper end of the fourth belt conveyor mechanism 560, the second finger cylinder 1110 is provided with a second clamping plate 1120 for clamping the QFN chip, the detection device body 100 is provided with a second mounting frame 1130 located at the fourth belt conveyor mechanism 560, the second mounting frame 1130 is provided with a third screw drive module 1140 for driving the second finger cylinder 1110 to move in a horizontal direction, and the slider of the third screw drive module 1140 is provided with a third dual-axis cylinder 1150 for connecting with the second finger cylinder 1110 and driving the second finger cylinder 1110 to move in a vertical direction.

[0057] After the first inspection station 220 completes the inspection of the QFN chip, the third screw drive module 1140 is moved to the upper end of the linear motor module 540 by the third screw drive module 1140, and then the third double-axis cylinder 1150 is driven to open the second clamping plate 1120, and finally the third double-axis cylinder 1150 is driven to move the second clamping plate 1120 on the second finger cylinder 1110 to the QFN chip, and then the QFN chip is clamped by the second clamping plate 1120, and then the QFN chip is moved to the second inspection station 230 by the cooperation between the third double-axis cylinder 1150 and the third screw drive module 1140. In this embodiment, through the setting of the second transport mechanism 570, the QFN chip at the first inspection station 220 can be better transported to the fourth belt conveyor mechanism 560.

[0058] Combination Fig.14 As shown, the unloading part 240 includes a fifth belt conveyor mechanism 250 which is arranged at the detection equipment body 100 and is located at the end of the fourth belt conveyor mechanism 560, and the end of the fifth belt conveyor mechanism 250 is provided with a second placement rack 1210 for placing the QFN chip box; the unloading part 240 also includes a sixth pulley group 1220 for delivering the QFN chip at the end of the fifth belt conveyor mechanism 250 to the QFN chip box, the sixth pulley group 1220 includes two sixth pulleys 1310, and a sixth belt 1320 is connected between the two sixth pulleys 1310, and the sixth pulley group 1220 also includes a sixth pulley motor 1340 for driving one of the two sixth pulleys 1310 to rotate so that the sixth belt 1320 moves; the sixth belt 1320 is provided with an L-shaped plate 1330 for delivering the QFN chip to the QFN chip box.

[0059] In this embodiment, the sixth pulley motor 1340 is started, so that the sixth belt 1320 drives the L-shaped plate 1330 to move back and forth, thereby delivering the QFN chip at the end of the fifth belt conveying mechanism 250 to the QFN chip box. In this embodiment, through the setting of the sixth pulley group 1220, it is possible to better collect the QFN chips after detection.

[0060] Combination Fig.15 As shown, the unloading portion 240 is provided with a seventh belt conveyor mechanism 1230 for conveying the QFN chip box to the second placement rack 1210; the unloading portion 240 also includes a second placement table 1240 arranged at the upper end of the seventh belt conveyor mechanism 1230 and used for placing the QFN chip box; the unloading portion 240 is provided with a second lifting mechanism 1250 for moving the second placement rack 1210 to the second placement table 1240, the second lifting mechanism 1250 includes a fourth screw drive module 1410 connected to the second placement rack 1210, and the upper end of the fourth screw drive module 1410 is provided with a fourth dual-axis cylinder 1420 for conveying the QFN chip box at the second placement rack 1210 to the second placement table 1240.

[0061] In this embodiment, through the setting of the second lifting mechanism 1250, it can cooperate with the sixth pulley group 1220 to push the QFN into the QFN chip box one by one; through the setting of the second placement table 1240 and the fourth dual-axis cylinder 1420, after the QFN chip box at the second placement rack 1210 is full of QFN chips, the second lifting mechanism 1250 is started to move the second placement rack 1210 to the second placement table 1240, and then the QFN chip box is pushed to the second placement table 1240 through the fourth dual-axis cylinder 1420, so that the chip box full of QFN chips can be automatically collected, thereby preferably improving the degree of automation of the automatic optical detection equipment for QFN chips.

[0062] In conclusion, the above is only a preferred embodiment of the present invention, and all equivalent changes and modifications made according to the scope of the patent application of the present invention should fall within the scope of the patent of the present invention.

Claims

1. Automatic optical inspection equipment for QFN chips, characterized by: The device comprises a testing device body (100), wherein the testing device body (100) comprises a loading portion (210), a first testing station (220), a second testing station (230) and a unloading portion (240); the loading portion (210) is used to transport QFN chips to the first testing station (220); the first testing station (220) is used to perform a preliminary test on the QFN chips and transport the QFN chips to the second testing station (230); the second testing station (230) is used to retest defective QFN chips detected by the first testing station (220); the second testing station (230) is also used to transport the QFN chips to the unloading portion (240); the unloading portion (240) is used to collect the QFN chips; The first inspection station (220) comprises a first inspection module (530) disposed at the inspection device body (100) and used for inspecting the QFN chip, the first inspection module (530) comprising a line scanning camera unit (710) and a line laser camera unit (720); the first inspection station (220) further comprises a linear motor module (540), a placement platform (810) for placing the QFN chip is provided at the linear motor module (540), and the linear motor module (540) is used to transport the QFN chip at the placement platform (810) to the first inspection module (530); The second inspection station (230) comprises a second inspection module (550) disposed at the inspection device body (100) and used for inspecting the QFN chip, the second inspection module (550) comprising an array camera unit (910); the second inspection module (550) further comprises a fourth belt conveying mechanism (560), the fourth belt conveying mechanism (560) comprising two parallel mounting plates (1010), a fourth conveying belt (1020) being provided between the two parallel mounting plates (1010) for conveying the QFN chip to the array camera unit (910); The detection device body (100) is provided with a second transport mechanism (570) for transporting the QFN chip at the first detection station (220) to the fourth belt conveyor mechanism (560); the second transport mechanism (570) comprises a second finger cylinder (1110) arranged at the upper end of the fourth belt conveyor mechanism (560); the second finger cylinder (1110) is provided with a second clamping plate (1120) for clamping the QFN chip; the detection device body (100) is provided with a second mounting frame (1130) located at the fourth belt conveyor mechanism (560); the second mounting frame (1130) is provided with a third screw drive module (1140) for driving the second finger cylinder (1110) to move in a horizontal direction; and a third double-axis cylinder (1150) for connecting with the second finger cylinder (1110) and for driving the second finger cylinder (1110) to move in a vertical direction is provided at a slider of the third screw drive module (1140).

2. The automatic optical inspection device for QFN chips according to claim 1, characterized in that: The loading part (210) comprises a first belt conveying mechanism (310) for conveying a QFN chip box. The first belt conveying mechanism (310) is provided with a first lifting mechanism (330) for lifting the QFN chip box at the end portion along the conveying direction thereof. The first lifting mechanism (330) comprises a first placement rack (410) for receiving the QFN chip box. The first placement rack (410) is provided with a first screw drive module (420) for driving the first placement rack (410) to move in a vertical direction. The loading part (210) is also provided with an ejection mechanism for ejecting the QFN chip in the QFN chip box at the first placement rack (410). The ejection mechanism comprises a second pulley group (320). The second pulley group (320) comprises two second pulleys (430). A second belt (440) is connected between the two second pulleys (430). The second belt (440) is provided with a top plate (450) for ejecting the chip in the QFN chip box.

3. The automatic optical inspection device for QFN chips according to claim 2, characterized in that: A third belt conveying mechanism (510) for conveying the QFN chip ejected by the ejection mechanism is provided at the detection device body (100); the third belt conveying mechanism (510) comprises a third conveying belt (580); and a baffle (5100) for blocking the QFN chip is provided at the end of the third belt conveying mechanism (510) along its conveying direction.

4. The automatic optical inspection device for QFN chips according to claim 2, characterized in that: The loading section (210) further comprises a first placement table (480) arranged at the upper end of the first belt conveyor mechanism (310) and used for placing the QFN chip box from which the QFN chip is taken out; the loading section (210) is provided with a conveying mechanism for conveying the first placement rack (410) to the first placement table (480), and the conveying mechanism comprises a first double-axis cylinder (470) arranged at the upper end of the first screw drive module (420).

5. The automatic optical inspection device for QFN chips according to claim 3, characterized in that: A first transport mechanism (520) for transporting a QFN chip at a third belt conveyor mechanism (510) to a first inspection station (220) is provided at a detection device body (100); the first transport mechanism (520) comprises a first finger cylinder (610) arranged at an upper end of the third belt conveyor mechanism (510); a first clamping plate (620) for clamping the QFN chip is provided at the first finger cylinder (610); a first mounting frame located at the third belt conveyor mechanism (510) is provided at the detection device body (100); a second screw drive module (630) for driving the first finger cylinder (610) to move in a horizontal direction is provided at the first mounting frame; and a second double-axis cylinder (640) for connecting with the first finger cylinder (610) and for driving the first finger cylinder (610) to move in a vertical direction is provided at a slider of the second screw drive module (630).

6. The automatic optical inspection device for QFN chips according to claim 1, characterized in that: The unloading section (240) comprises a fifth belt conveying mechanism (250) which is arranged at the detection device body (100) and located at the end of the fourth belt conveying mechanism (560); the end of the fifth belt conveying mechanism (250) is provided with a second placement rack (1210) for placing a QFN chip box; the unloading section (240) further comprises a sixth belt pulley group (1220) for delivering the QFN chip at the end of the fifth belt conveying mechanism (250) to the QFN chip box; the sixth belt pulley group (1220) comprises two sixth belt pulleys (1310); a sixth belt (1320) is connected between the two sixth belt pulleys (1310); and an L-shaped plate (1330) for delivering the QFN chip to the QFN chip box is provided at the sixth belt (1320).

7. The automatic optical inspection device for QFN chips according to claim 6, characterized in that: The unloading portion (240) is provided with a seventh belt conveying mechanism (1230) for conveying the QFN chip box to the second placement rack (1210); the unloading portion (240) further comprises a second placement table (1240) arranged at the upper end of the seventh belt conveying mechanism (1230) and used for placing the QFN chip box; the unloading portion (240) is provided with a second lifting mechanism (1250) for moving the second placement rack (1210) to the second placement table (1240), the second lifting mechanism (1250) comprises a fourth screw drive module (1410) connected to the second placement rack (1210), and the upper end of the fourth screw drive module (1410) is provided with a fourth dual-axis cylinder (1420) for conveying the QFN chip box at the second placement rack (1210) to the second placement table (1240).

Images