An Interventional Laser Shock Peening Device and Method for Surface Treatment of Narrow Structures

Abstract

The present application discloses an interventional laser shock peening device and method for surface treatment of narrow structures. The device includes an integrated control unit, a laser, an interventional laser shock peening process treatment unit, and a water supply unit. The interventional laser shock peening process treatment unit includes a telescopic pipeline, a water confinement layer inlet, a nozzle, and a rotating joint. The rotating joint has a rotational degree of freedom relative to the telescopic pipeline. The present application provides an interventional laser shock peening device and method for surface treatment of narrow spaces such as the inner cavity of a pipeline and the inner wall of a hole, which can effectively solve the problem that it is difficult for existing laser shock peening devices to treat narrow spaces such as the inner wall of a pipeline and the surface of an inner hole.

Description

Technical Field

[0001] The present application relates to an intrusive laser shock peening device and method that can be used for surface treatment of narrow structures, and belongs to the field of laser shock peening. Background Art

[0002] Laser shock peening technology uses the plasma shock wave generated by high-intensity laser to impact the surface of parts, improving the fatigue resistance, wear resistance and corrosion resistance of metal materials. The existing laser shock peening process system generally includes a laser generation unit, an absorption protection layer located on the surface of the workpiece, a constraint layer located on the surface of the absorption protection layer, and a workpiece clamping unit. The role of the constraint layer is to allow the laser energy to pass through and act on the absorption protection layer, and at the same time, provide as much reaction force as possible during the expansion of the plasma to improve the efficiency of shock wave coupling. Currently, a water film with a thickness of 0.5 - 2 mm is generally used as the transparent constraint layer at home and abroad. The role of the absorption protection layer is to absorb laser energy, generate plasma, and at the same time avoid damage to the workpiece by the laser and plasma. Currently, paint, flexible tape or metal foil with a certain thickness are generally used as the absorption protection layer. The role of the workpiece clamping unit is to clamp the workpiece and perform a certain degree of freedom movement within a specified stroke during the laser shock process to complete the shock of the corresponding area on the workpiece.

[0003] Since the laser shock peening process head is generally large in size and has to take into account the generation of the water film and the transmission of the light beam, the current laser shock peening equipment is mainly used to impact the outer surface of the workpiece, and it is difficult to process narrow spaces, especially for the inner cavities, inner holes, inner surfaces of complex structures or non-directly visible parts that are common in the engineering field. The laser shock peening process ability is insufficient. Patents such as CN102517423B "A method for small hole strengthening" and CN103014276B "A method for small hole strengthening combining taper pressing and laser shock peening" both adopt the method of strengthening the surface to be drilled first and then drilling to improve the stress distribution of the inner wall and end face of the hole; Patent CN112795772B "A blind hole composite strengthening device and method based on laser shock peening and cold extrusion" uses a hard mandrel to perform cold extrusion strengthening on the inner wall of the hole and uses a laser to perform shock peening treatment on the end face of the hole.

[0004] The in-pipe cladding process provides new inspiration for laser shock peening in narrow spaces such as pipes, but the cladding process is very different from the laser shock peening process, especially laser shock peening requires maintaining sufficient transparent medium constraint, and the process involves very high pulse energy.

[0005] Therefore, there is a need in the industry for new process methods and systems to achieve laser shock peening in narrow spaces. Summary of the Invention

[0006] The object of the present invention is to provide an intrusive laser shock peening device that can be used for surface treatment of narrow spaces such as the inner cavity and inner hole of a pipeline, so as to expand the application of existing laser shock peening devices. This requires solving three major problems at the same time. One is to efficiently transmit laser energy to narrow spaces. The second is to intelligently apply processing techniques in narrow spaces. The third is to achieve sufficient laser shock peening treatment under the constraint of narrow spaces.

[0007] In one aspect of the present application, an intrusive laser shock peening device for surface treatment of narrow structures is provided, including an integrated control unit, a laser, an intrusive laser shock peening process treatment unit, and a water supply unit;

[0008] The integrated control unit is used to issue instructions to control the laser to emit laser light and control the water supply unit to transport a water confinement layer to the intrusive laser shock peening process treatment unit;

[0009] The laser emits laser light and shoots it into the intrusive laser shock peening process treatment unit;

[0010] The water supply unit is connected to the intrusive laser shock peening process treatment unit through a pipeline;

[0011] The intrusive laser shock peening process treatment unit is used to perform intrusive laser shock peening on the surface to be processed of the workpiece;

[0012] The intrusive laser shock peening process treatment unit includes a telescopic pipeline, a water confinement layer inlet, a nozzle, and a rotating joint;

[0013] The rotating joint has a rotational degree of freedom relative to the telescopic pipeline.

[0014] Optionally, the rotating joint has a rotational degree of freedom relative to the telescopic pipeline it is connected to, whereby the relative position of the nozzle in the circumferential direction of the inner wall of the pipeline can be adjusted.

[0015] The number of rotating joints can be increased as needed, as Figure 8 shown. In addition, the end of the intrusive laser shock peening process treatment unit (abbreviated as the process head) can adjust the telescopic mechanism as needed to adjust the laser focusing position.

[0016] Optionally, the telescopic pipeline includes a telescopic pipeline I and a telescopic pipeline II;

[0017] The telescopic pipeline I and the telescopic pipeline II are connected through the rotating joint;

[0018] The water confinement layer inlet is provided on the pipe wall of the telescopic pipeline II;

[0019] Along the laser direction, the end of the telescopic pipeline II is fixedly connected to the nozzle;

[0020] The nozzle is provided with a window, which serves as the ejection outlet of the laser and the water confinement layer.

[0021] Optionally, the telescopic pipeline preferably consists of a series of assemblable pipelines, and its length, diameter and quantity can be adjusted as required. Its function is to transmit laser energy in a narrow space and protect the optical system from the negative impact of a poor process environment.

[0022] Optionally, the in-situ laser shock peening process treatment unit further includes a 45-degree reflector, a focusing lens, and a window protection sheet;

[0023] Along the laser direction, a focusing lens and a window protection sheet are sequentially arranged in the inner cavity of the telescopic pipeline II.

[0024] A 45-degree reflector is arranged in the inner cavity of the rotating joint.

[0025] The water confinement layer inlet is located on the pipe wall of the telescopic pipeline II between the nozzle and the window protection sheet.

[0026] A water confinement layer cavity is formed in the inner cavity of the telescopic pipeline II between the nozzle and the window protection sheet.

[0027] Optionally, the telescopic pipeline I includes a telescopic pipeline IA and a telescopic pipeline IB. Among them, the outer diameter of the telescopic pipeline IB is smaller than the inner diameter of the telescopic pipeline IA. In the contracted state, the telescopic pipeline IB is received inside the telescopic pipeline IA.

[0028] The telescopic pipeline IB is connected to the rotating joint. The outer diameter of the rotating joint is smaller than the inner diameter of the telescopic pipeline IB. In the contracted state, the rotating joint is received inside the telescopic pipeline IB, ensuring that the pipeline diameter near the inner end of the workpiece is smaller than the pipeline diameter near the outer end of the workpiece.

[0029] Optionally, the telescopic pipeline II includes a telescopic pipeline IIA and a telescopic pipeline IIB. The telescopic pipeline IIA is connected to the rotating joint. Among them, the outer diameter of the telescopic pipeline IIA is smaller than the inner diameter of the rotating joint. In the contracted state, the telescopic pipeline IIA is received inside the rotating joint; the outer diameter of the telescopic pipeline IIA is smaller than the inner diameter of the telescopic pipeline IIB;

[0030] The telescopic pipeline IIB is connected to the nozzle. The outer diameter of the nozzle is smaller than the inner diameter of the telescopic pipeline IIB. In the contracted state, the nozzle is received inside the telescopic pipeline IIB to achieve the purpose of minimizing the pipeline diameter near the surface of the workpiece to be processed.

[0031] The process head is designed and manufactured specifically to make the dimensions of the key parts affecting the intrusive processing smaller than the typical constraint dimensions of the narrow space, so as to realize the intrusive laser shock peening treatment in the narrow space.

[0032] Optionally, a laser transmission optical path is formed between the laser and the intrusive laser shock peening process unit through a reflector, which is a transmission method composed of a multi-joint optical tube and a reflector;

[0033] Or the laser is connected to the intrusive laser shock peening process unit through an optical fiber to form a laser transmission optical path, which is a flexible optical fiber transmission method.

[0034] Optionally, the optical fiber is a liquid-core optical fiber. Since the laser energy for laser shock peening is very high, it is generally difficult for ordinary optical fibers to reliably transmit energy. In this application, a liquid-core optical fiber is preferably used, that is, the center is high-purity water and the tube wall is made of a substance with a refractive index less than that of water, such as Teflon.

[0035] Optionally, the wavelength of the laser includes the infrared band and the green visible light band

[0036] Optionally, the intrusive laser shock peening device further includes a measurement and control unit and a motion control unit;

[0037] The measurement and control unit is installed at the nozzle and is used to obtain and transmit local position information;

[0038] The measurement and control unit includes an optical imaging module and / or a displacement sensing module;

[0039] The motion control unit is used to receive the position information transmitted by the measurement and control unit.

[0040] Optionally, the above-mentioned process head can not only intervene in the narrow space, transmit the transparent medium and the high-power laser, but also transmit the local position information in time. The position information is provided by the measurement and control unit, such as an optical imaging unit or a displacement sensing unit, and is fed back to the motion control system to solve the problem of intelligent processing in the narrow space.

[0041] As a specific implementation manner, an intrusive laser shock peening device that can be used for the surface treatment of narrow structures includes a master control unit, a laser, a process head, a motion system, a water supply system, a measurement and control system, a workpiece, and a workpiece clamping unit. The master control unit controls the laser to emit laser light, and through the relative movement of the process head relative to the workpiece, the laser shock peening treatment under the constraint of the narrow space is realized. The relative movement includes three categories: mainly the movement of the workpiece, mainly the movement of the process head, and the coordinated movement of both.

[0042] Another aspect of the present application provides an interventional laser shock peening method based on narrow spaces, utilizing the above-mentioned interventional laser shock peening device that can be used for surface treatment of narrow structures, through the relative movement of the interventional laser shock peening process unit and the workpiece, based on the coaxial output of the water confinement layer and the laser, interventional laser shock peening in narrow spaces is performed.

[0043] This application uses a process head that can intervene in narrow spaces. Through the relative movement of the process head and the workpiece, based on the coaxial water supply laser shock strengthening technology, laser shock strengthening treatment of narrow parts including inner pipes and engine integral blade disc blade roots is achieved.

[0044] Optionally, the interventional laser shock peening method comprises:

[0045] (1) using a rotating joint and a retractable pipeline of an interventional laser shock peening process unit to adjust the relative position of a nozzle and a surface to be processed of the workpiece;

[0046] The relative position between the nozzle and the surface to be processed of the workpiece specifically refers to a position at which the nozzle and the surface to be processed of the workpiece have a certain distance and angle;

[0047] (2) outputting laser light and a water confinement layer through an integrated control unit, wherein the laser light enters through a retractable pipe and is ejected from a nozzle to act on the surface to be processed of the workpiece;

[0048] The water constraint layer enters from the water constraint layer inlet and is sprayed out from the nozzle to act on the surface to be processed of the workpiece.

[0049] Optionally, step (2) includes:

[0050] The laser is injected from the port of the telescopic pipeline, passes through the telescopic pipeline I and the rotating joint in sequence, and then enters the focusing mirror, the window protection sheet, and the water constraint layer cavity after being reflected by the 45-degree reflector at the rotating joint, and then is emitted through the nozzle. The laser acts on the surface to be processed of the workpiece;

[0051] The water constraint layer is outputted from the water supply unit, enters the water constraint layer cavity through the pipeline and the water constraint layer inlet, and is sprayed out through the nozzle. The water constraint layer acts on the surface to be processed of the workpiece.

[0052] As a specific implementation method, the laser is injected from the retractable pipeline port, passes through the retractable pipeline, the rotating joint, and enters the focusing mirror and the window piece after being reflected by the reflector, and then enters the water confinement layer cavity. The cavity sprays a steady-state water flow through the nozzle, stably transmits the focused laser energy, acts on the workpiece, and realizes laser shock strengthening in a narrow space. Through relative motion, large-area and large-stroke processing is achieved.

[0053] Optionally, the surface to be machined of the workpiece includes at least one of a pipe inner cavity, an inner hole surface of the workpiece, a blisk surface, and a blade root in the blisk structure.

[0054] The beneficial effects that can be produced by this application include:

[0055] (1) The length and quantity of the telescopic pipeline can be adjusted according to the length of the workpiece, expanding the application scope of this device.

[0056] (2) In the direction perpendicular to the inner cavity surface, telescopic pipelines and nozzles are provided, and the length and quantity of the telescopic pipelines can be adjusted according to the diameter of the inner cavity.

[0057] (3) The rotating joint equipped with a mirror has a rotational degree of freedom relative to the connected telescopic pipeline. When the workpiece is large and not easy to rotate, the relative position between the nozzle and the circumferential direction of the workpiece can be adjusted.

[0058] (4) This device adopts the coaxial water supply method, eliminating the difficult problem of controlling the water film thickness that must be solved in side water supply, saving space and being stable and reliable.

[0059] (5) The quantity of the telescopic pipelines and rotating joints can be adjusted intelligently according to needs to meet the requirements of different complex-structured spaces.

[0060] (6) This application provides an intrusive laser shock peening device and method for surface treatment of narrow spaces such as pipe inner cavities and hole inner walls, effectively solving the problem that it is difficult for existing laser shock peening devices to process narrow spaces such as pipe inner walls and inner hole surfaces. Description of the Drawings

[0061] Figure 1 It is a schematic diagram of the state 1 of the intrusive laser shock peening process treatment unit of this application;

[0062] Figure 2 It is a schematic diagram of the state 2 of the intrusive laser shock peening process treatment unit of this application;

[0063] Figure 3 It is an overall schematic diagram of the system for transmitting laser by using a light guide tube in this application;

[0064] Figure 4 It is an overall schematic diagram of the system for transmitting laser by using an optical fiber in this application;

[0065] Figure 5 It is a schematic diagram of the application of the intrusive laser shock peening device of this application to an inner cavity structure;

[0066] Figure 6 It is a schematic diagram of the application of the intrusive laser shock peening device of this application to the outer surface of a specimen;

[0067] Figure 7 Schematic diagram of the application of the intrusive laser shock peening device of the present application to a narrow space;

[0068] Figure 8 Schematic diagram of the deformation device of the present application for a complex inner cavity.

[0069] Wherein:

[0070] 1. Telescopic pipeline IA; 2. Telescopic pipeline IB; 3. Telescopic pipeline IIA; 4. Telescopic pipeline IIB; 5. Water confinement layer inlet; 6. Nozzle; 7. Window protection sheet; 8. Focusing mirror; 9. 45-degree reflecting mirror; 10. Rotating joint; 11. Laser; 12. Water confinement layer;

[0071] a. Integrated control system; b. Laser; c. Water tank; d. Water confinement layer transmission pipeline; e. Water confinement layer pressurizing device; f. Intrusive laser shock peening unit; g. Workpiece; h. Manipulator; k. Reflecting mirror; m. Liquid core optical fiber. Specific implementation mode

[0072] The present application will be described in detail below in conjunction with embodiments, but the present application is not limited to these embodiments.

[0073] Embodiment 1

[0074] As Figure 1 shown, the intrusive laser shock peening process treatment unit of the present application includes a telescopic pipeline IA 1, a telescopic pipeline IB 2, a telescopic pipeline IIA 3, a telescopic pipeline IIB 4, a nozzle 6 and a rotating joint 10. The telescopic pipeline IA 1 and the telescopic pipeline IB 2 are telescopically connected, and the telescopic pipeline IIA 3 and the telescopic pipeline IIB 4 are telescopically connected; the telescopic pipeline IB 2 and the telescopic pipeline IIB 4 are connected through the rotating joint 10, and the nozzle 6 is connected to the telescopic pipeline IIB 4 and can be retracted into the telescopic pipeline IIB 4;

[0075] The telescopic pipeline IIA 3 is internally provided with a focusing mirror 8 and a window protection sheet 7, and can be retracted into the straight part of the rotating joint 10. Adjusting the retractable pipeline 3 can not only adjust the overall radial length of the device, but also adjust the position of the focusing mirror, thereby adjusting the position of the laser focus.

[0076] A 45-degree reflecting mirror 9 is provided on the rotating joint 10, which can guide the laser direction from the direction parallel to the inner cavity surface to the direction perpendicular to the inner cavity surface.

[0077] A water confinement layer inlet 5 is provided on the telescopic pipeline IIB 4, and a window is provided on the nozzle 6 as the injection outlet of the laser 11 and the water confinement layer 12.

[0078] The telescopic pipeline IB 2 can be retracted into / extended from the pipeline IA1. The lengths or combined quantities of the telescopic pipeline IA 1 and the telescopic pipeline IB 2 can be increased or decreased according to the length of the inner cavity, such as Figure 1 , 2 shown; the outer diameter of the telescopic pipeline IB2 is smaller than the inner diameter of the telescopic pipeline IA1. In the retracted state, the telescopic pipeline IB2 is received inside the telescopic pipeline IA1;

[0079] The telescopic pipeline IB2 is connected to the rotating joint 10. The outer diameter of the rotating joint 10 is smaller than the inner diameter of the telescopic pipeline IB2. In the retracted state, the rotating joint 10 is received inside the telescopic pipeline IB2, ensuring that the diameter of the pipeline near the inner end of the workpiece is smaller than the diameter of the pipeline near the outer end of the workpiece.

[0080] The telescopic pipeline IIB 4 can extend and retract in the direction of the telescopic pipeline IIA3, and the telescopic pipeline IIA3 is received into the telescopic pipeline IIB 4. The telescopic pipeline IIA3 is connected to the rotating joint 10. Among them, the outer diameter of the telescopic pipeline IIA3 is smaller than the inner diameter of the rotating joint 10. In the retracted state, the telescopic pipeline IIA3 is received inside the rotating joint 10; the outer diameter of the telescopic pipeline IIA3 is smaller than the inner diameter of the telescopic pipeline IIB4.

[0081] The telescopic pipeline IIB4 is connected to the nozzle 6. The outer diameter of the nozzle 6 is smaller than the inner diameter of the telescopic pipeline IIB4. In the retracted state, the nozzle 6 is received inside the telescopic pipeline IIB4 to achieve the purpose of minimizing the diameter of the pipeline near the surface of the workpiece to be processed.

[0082] The rotating joint 10 has a rotational freedom relative to the telescopic pipeline IB 2. By adjusting the rotation angle, the relative position of the nozzle 6 in the circumferential direction of the inner cavity can be controlled, which is more suitable for the case where large pipelines are not easy to rotate.

[0083] Such as Figure 1 shown, according to the length of the inner cavity surface, the lengths and quantities of the telescopic pipeline IA 1 and the telescopic pipeline IB 2. Similarly, according to the inner diameter of the inner cavity surface, the lengths of the telescopic pipeline IIA3, the telescopic pipeline IIB 4 and the nozzle 6 can be adjusted.

[0084] Embodiment 2

[0085] Such as Figure 3As shown in the figure, an intrusive laser shock peening device for narrow structure surface treatment includes an integrated control system a, a laser b, a mirror k, an intrusive laser shock peening process treatment unit f, a water tank c, a water confinement layer transmission pipeline d, and a water confinement layer pressurizing device e; the integrated control system a is respectively connected to the laser b and the water tank c, sends out instructions, controls the laser b to emit shock laser, and controls the water tank c to convey the water confinement layer to the intrusive laser shock peening process treatment unit f.

[0086] The water tank c is connected to the intrusive laser shock peening process treatment unit f through the water confinement layer transmission pipeline d and the water confinement layer pressurizing device e to convey the water confinement layer.

[0087] The laser b and the intrusive laser shock peening process treatment unit f form a laser transmission optical path through the mirror k.

[0088] The movement of the workpiece g is controlled through the rotating joint and the telescopic pipeline of the intrusive laser shock peening process treatment unit f, as well as the manipulator h, so that the intrusive laser shock peening process treatment unit f and the workpiece g form a relative movement.

[0089] Embodiment 3

[0090] As Figure 4 shown in the figure, an intrusive laser shock peening device for narrow structure surface treatment includes an integrated control system a, a laser b, a liquid-core optical fiber m, an intrusive laser shock peening process treatment unit f, a water tank c, a water confinement layer transmission pipeline d, and a water confinement layer pressurizing device e;

[0091] Except that the laser b and the intrusive laser shock peening process treatment unit f are connected through the liquid-core optical fiber m to form a laser transmission optical path, the connection relationships of other components are the same as those in Embodiment 2.

[0092] Embodiment 4

[0093] A method for intrusive laser shock peening in a narrow space using the intrusive laser shock peening device of Embodiment 2 or Embodiment 3 specifically includes:

[0094] The integrated control system issues an instruction, the laser emits laser, the laser is transmitted through the mirror or the liquid-core optical fiber, enters the device through the telescopic pipeline 1, and then passes through the telescopic pipeline 2, the rotating joint 10, the mirror 9, the focusing mirror 8, the telescopic pipeline 3, the window protection sheet 7, and the telescopic pipeline 4 in sequence, and finally is emitted from the nozzle 6.

[0095] The integrated control system issues an instruction, the water tank outputs the water confinement layer, which passes through the water confinement layer transmission pipeline and the water confinement layer pressurizing device, enters the intrusive laser shock peening process treatment unit through the water confinement layer inlet 5, and is emitted from the nozzle 6. The laser and the water confinement layer are emitted coaxially.

[0096] Application Example

[0097] The intrusive laser shock peening device of Example 2 or Example 3 can be used for surface shock peening treatment of the inner cavity of a pipeline (as shown in Figure 3 , 4 ), and can also be used for surface shock peening treatment of the outer surface.

[0098] The intrusive laser shock peening device of Example 2 or Example 3 can be used for surface shock peening treatment in typical narrow spaces, such as the inner wall of the pipeline shown in Figure 5 , the outer wall shown in Figure 6 , and the root part of the complex blisk structure shown in Figure 7 .

[0099] The intrusive laser shock peening device of Example 2 or Example 3 can be used for surface shock peening treatment of a complex inner cavity (as shown in Figure 8 ). Since the relevant process head can rotate and extend, it is possible to process the concave parts of the pipeline that are generally difficult to process.

[0100] As described above, only several embodiments of the present application are shown, and the present application is not limited in any form. Although the present application is disclosed with preferred embodiments, it is not intended to limit the present application. Any person skilled in the art, without departing from the scope of the technical solution of the present application, makes some changes or modifications using the disclosed technical content, which are equivalent to equivalent implementation cases and all fall within the scope of the technical solution.

Claims

1. An intrusive laser shock peening device that can be used for surface treatment of narrow structures, characterized in that, It includes an integrated control unit, a laser, an in-situ laser shock peening process treatment unit, and a water supply unit; The integrated control unit is used to issue instructions to control the laser to emit laser light and control the water supply unit to deliver a water confinement layer to the in-situ laser shock peening process treatment unit; The laser emits laser light and injects it into the in-situ laser shock peening process treatment unit; The water supply unit is connected to the in-situ laser shock peening process treatment unit through a pipeline; The in-situ laser shock peening process treatment unit is used to perform in-situ laser shock peening on the surface to be processed of the workpiece; The in-situ laser shock peening process treatment unit includes a telescopic pipeline, a water confinement layer inlet, a nozzle, and a rotating joint; the length, diameter, and quantity of the telescopic pipeline and the quantity of the rotating joints are adjusted according to needs; the rotating joint has a rotational degree of freedom relative to the telescopic pipeline; The telescopic pipeline includes telescopic pipeline IA, telescopic pipeline IB, telescopic pipeline IIA, and telescopic pipeline IIB; wherein, telescopic pipeline IA and telescopic pipeline IB are telescopically connected, and telescopic pipeline IIA and telescopic pipeline IIB are telescopically connected; telescopic pipeline IB and telescopic pipeline IIA are connected through a rotating joint. In the contracted state, telescopic pipeline IIA is retracted inside the rotating joint; the nozzle is connected to telescopic pipeline IIB and can be retracted into telescopic pipeline IIB. The nozzle is provided with a window, which serves as the ejection outlet for the laser and the water confinement layer; Along the laser direction, a focusing mirror and a window protection sheet are sequentially arranged in the inner cavity of telescopic pipeline IIA; A 45-degree reflecting mirror is arranged in the inner cavity of the rotating joint; The water confinement layer inlet is located on the pipe wall of telescopic pipeline IIB between the nozzle and the window protection sheet; A water confinement layer cavity is formed in the inner cavity of telescopic pipeline IIB between the nozzle and the window protection sheet; 2. The intrusive laser shock peening device according to claim 1, characterized in that, The outer diameter of telescopic pipeline IB is smaller than the inner diameter of telescopic pipeline IA; Telescopic pipeline IB is connected to the rotating joint, and the outer diameter of the rotating joint is smaller than the inner diameter of telescopic pipeline IB; Telescopic pipeline IIA is connected to the rotating joint, wherein the outer diameter of telescopic pipeline IIA is smaller than the inner diameter of the rotating joint; the outer diameter of telescopic pipeline IIA is smaller than the inner diameter of telescopic pipeline IIB; Telescopic pipeline IIB is connected to the nozzle, and the outer diameter of the nozzle is smaller than the inner diameter of telescopic pipeline IIB; 3. The intrusive laser shock peening device according to claim 1, characterized in that, The laser and the in-situ laser shock peening process treatment unit form a laser transmission optical path through a reflecting mirror; Or the laser and the in-situ laser shock peening process treatment unit are connected through an optical fiber to form a laser transmission optical path; 4. The intrusive laser shock peening device according to claim 3, characterized in that, The optical fiber is a liquid-core optical fiber; 5. The intrusive laser shock peening device according to claim 1, characterized in that, The wavelength of the laser includes the infrared band and the green visible light band; 6. The intrusive laser shock peening device according to claim 1, characterized in that, The in-situ laser shock peening device further includes a measurement and control unit and a motion control unit; The measurement and control unit is installed at the nozzle and is used to obtain and transmit local position information; The measurement and control unit includes an optical imaging module and / or a displacement induction module; The motion control unit is used to receive the position information transmitted by the measurement and control unit.

7. An intrusive laser shock peening method based on a narrow space, characterized in that, Using the in-situ laser shock peening device for narrow structure surface treatment according to any one of claims 1 to 6, through the relative movement of the in-situ laser shock peening process unit and the workpiece, based on the coaxial output of the water confinement layer and the laser, in-situ laser shock peening of the narrow space is carried out.

8. The intrusive laser shock peening method according to claim 7, characterized in that, The in-situ laser shock peening method includes: (1) Using the rotating joint and the telescopic pipeline of the in-situ laser shock peening process unit to adjust the relative position of the nozzle and the surface to be processed of the workpiece; (2) Through the integrated control unit, output the laser and the water confinement layer, the laser enters through the telescopic pipeline and is emitted from the nozzle to act on the surface to be processed of the workpiece; The water confinement layer enters from the water confinement layer inlet and is ejected from the nozzle to act on the surface to be processed of the workpiece.

9. The intrusive laser shock strengthening method according to claim 8, wherein, Step (2) includes: The laser enters from the port of the telescopic pipeline, passes through the telescopic pipeline IB and the rotating joint in sequence, is reflected by the 45-degree mirror at the rotating joint and then enters the focusing mirror, the window protection sheet, and the water confinement layer cavity, and the laser is emitted from the nozzle, and the laser acts on the surface to be processed of the workpiece; The water confinement layer is output by the water supply unit, enters the water confinement layer cavity through the pipeline and the water confinement layer inlet, and is ejected from the nozzle, and the water confinement layer acts on the surface to be processed of the workpiece.

10. The intrusive laser shock strengthening method according to claim 8, wherein, The surface to be processed of the workpiece includes at least one of the inner cavity of the pipeline, the inner hole surface of the workpiece, the surface of the blisk, and the blade root in the blisk structure.

Images