Memory module fixing device, server and memory module installation method

Abstract

An embodiment of the present application provides a memory module fixing device. The device includes: two first positioning plates and two second positioning plates. The two first positioning plates are movably arranged on both sides of the slot of the circuit board in a relatively movable manner along a first preset direction to position the memory module in the first preset direction on the circuit board; the two second positioning plates are movably arranged on both sides of the slot of the circuit board in a relatively movable manner along a second preset direction to position the memory module in the second preset direction on the circuit board, wherein the first preset direction is perpendicular to the second preset direction. By adjusting the distance between the two first positioning plates and the distance between the two second positioning plates in the present application, the problem that different-sized memory modules cannot be fixed in the server is solved, and thus the effect that a memory module fixing device can fix different-sized memory modules is achieved.

Description

Technical Field

[0001] Embodiments of the present application relate to the field of servers. Specifically, the present application relates to a memory module fixing device, a server, and a method for installing a memory module. Background Art

[0002] A server is a type of computer. Servers have high-speed CPU computing capabilities, long-term reliable operation, powerful I / O external data throughput capabilities, and better scalability. The operation of the CPU depends on memory. High-speed CPU computing capabilities are achieved through read and write operations of memory modules inside the server. Any input (from external storage, keyboard, mouse, microphone, scanner, etc.) and any output (display, printing, audio-visual, writing to external storage, etc.) on the server can only be carried out through memory.

[0003] Currently, the memory modules installed inside servers are all stabilized inside the memory slots by rotating the clamping blocks. However, with the development of technology, the electronic components in servers are becoming more and more concentrated, the electronic components on the memory modules are becoming more and more complex, the size of the memory modules has changed, and the sizes of memory modules required by different servers are also different. Currently, the rotating clamping blocks can only be used for memory modules of specific sizes and cannot meet the requirements for installing memory modules of different sizes, which is very inconvenient. Summary of the Invention

[0004] Embodiments of the present application provide a memory module fixing device, a server, and a method for installing a memory module to at least solve the problem in the related art that memory modules of different sizes cannot be fixed inside a server.

[0005] According to an embodiment of the present application, a memory module fixing device is provided, including: two first positioning plates, which are movably arranged on both sides of the slot of the circuit board relative to each other along a first preset direction to position the memory module in the first preset direction on the circuit board; two second positioning plates, which are movably arranged on both sides of the slot of the circuit board relative to each other along a second preset direction to position the memory module in the second preset direction on the circuit board, wherein the first preset direction is perpendicular to the second preset direction.

[0006] In an exemplary embodiment, the memory module fixing device further includes: a first telescopic component, which is arranged between the two first positioning plates and is respectively drivingly connected to the two first positioning plates to pull the two first positioning plates to move closer to each other.

[0007] In an exemplary embodiment, the first telescopic component includes a tension spring.

[0008] In an exemplary embodiment, the memory module fixing device further includes: a limiting frame assembly disposed between two first positioning plates, wherein the limiting frame assembly is used to accommodate the first telescopic assembly and separate the two first positioning plates.

[0009] In an exemplary embodiment, there are two limiting frame assemblies, and the two limiting frame assemblies are spaced apart along a second preset direction on both sides of the slot. There are two first telescopic assemblies, and the two first telescopic assemblies are respectively disposed in the two limiting frame assemblies and extend along a first preset direction. Wherein, the first telescopic assembly includes: a tension spring and two guide rods, and the two guide rods are respectively disposed at both ends of the tension spring and connected to the two first positioning plates.

[0010] In an exemplary embodiment, the memory module fixing device further includes: a second telescopic assembly disposed on the circuit board, wherein both of the two first positioning plates are disposed on the second telescopic assembly to move along a direction perpendicular to the circuit board under the drive of the second telescopic assembly.

[0011] In an exemplary embodiment, the second telescopic assembly includes two support springs, and the two support springs are spaced apart along the first preset direction on both sides of the slot and are disposed perpendicular to the circuit board. The two first positioning plates are correspondingly disposed on the tops of the support springs.

[0012] In an exemplary embodiment, the memory module fixing device further includes: a limiting assembly disposed on the circuit board to stop the first positioning plate from moving in the vertical direction.

[0013] In an exemplary embodiment, the memory module fixing device further includes two limiting frame assemblies, and both of the two limiting frame assemblies are disposed between the two first positioning plates and are spaced apart along the second preset direction; the limiting assembly includes a plurality of limiting rod mechanisms, and the plurality of limiting rod mechanisms are spaced apart on both sides of the two limiting frame assemblies to stop the first positioning plate from moving away from the circuit board.

[0014] In an exemplary embodiment, the limiting rod mechanism includes: a fixed seat fixed on the circuit board; a limiting spring disposed on the fixed seat to telescopically move a T-shaped rod in a direction perpendicular to the circuit board. The T-shaped rod is rotatably disposed on the fixed seat, and the limiting spring is drivingly connected to the T-shaped rod. Wherein, the T-shaped rod has a stopping position and an avoiding position. When the T-shaped rod rotates to the stopping position, the T-shaped rod is connected to the limiting frame assembly and positions the limiting frame assembly in a direction perpendicular to the circuit board. When the T-shaped rod rotates to the avoiding position, the T-shaped rod is separated from the limiting frame assembly and moves in a direction perpendicular to the circuit board under the drive of the limiting spring.

[0015] In an exemplary embodiment, the memory module fixing device further includes: an adjusting component, which is respectively drivingly connected to the two second positioning plates to drive the two second positioning plates to approach each other and clamp the memory module.

[0016] In an exemplary embodiment, the memory module fixing device further includes a mounting cover, which covers the upper part of the slot. Among them, both second positioning plates are arranged inside the mounting cover. The adjusting component includes: two groups of compression springs, which are respectively arranged on the opposite sides of the two second positioning plates. One end of the compression spring abuts against the second positioning plate, and the other end of the compression spring abuts against the mounting cover. The two groups of compression springs jointly drive the two second positioning plates to approach each other and move.

[0017] In an exemplary embodiment, the memory module fixing device further includes a mounting cover, which covers the upper part of the slot. Among them, both second positioning plates are arranged inside the mounting cover. On the opposite sides of the second positioning plates, there are respectively tracks extending along a first preset direction. The track has a slide rail surface inclined relative to a second preset direction. The adjusting component includes: a moving frame, which is movably arranged relative to the track. Among them, the moving frame has two inclined surfaces arranged oppositely, so that when the moving frame slides relative to the track, the two inclined surfaces respectively slide in contact with the two slide rail surfaces; a pushing spring, which is drivingly connected to the moving frame to push the moving frame to move along the first preset direction.

[0018] In an exemplary embodiment, a chute extending along the first preset direction is provided at the top of the mounting cover. The adjusting component includes: a positioning screw, which is arranged on the moving frame. Among them, the moving frame is arranged inside the mounting cover, and the positioning screw is slidably arranged in the chute. The positioning screw has a locked state and a released state. When the positioning screw is tightened and in the locked state, the positioning screw fixes the moving frame and the mounting cover together. When the positioning screw is loosened and in the released state, the pushing spring drives the moving frame to move along the track.

[0019] In an exemplary embodiment, the memory module fixing device further includes: a cleaning component, which is movably arranged along the length direction of the slot to clean the circuit board outside the slot.

[0020] In an exemplary embodiment, the cleaning component includes a brush. The memory module fixing device further includes: a receiving frame, which is arranged on the circuit board; a lead screw, which is rotatably arranged on the receiving frame; among them, the brush is arranged on the lead screw to clean the circuit board under the drive of the lead screw.

[0021] In an exemplary embodiment, a rotary fan is arranged at one end of the lead screw, and the rotary fan rotates under the drive of the lead screw to blow air towards the circuit board.

[0022] According to another embodiment of the present application, a server is provided, including: a housing and a circuit board. The circuit board is disposed on the housing, and a slot for inserting a memory module is provided on the circuit board. The server further includes a memory module fixing device, and the memory module fixing device is the above-mentioned memory module fixing device.

[0023] In an exemplary embodiment, heat dissipation holes are provided on the housing at the bottom of the circuit board, and heat dissipation fans are provided in the heat dissipation holes.

[0024] According to a third embodiment of the present application, a method for installing a memory module is provided. The memory module is installed by using the above-mentioned memory module fixing device. The method for installing a memory module includes:

[0025] Step 1: Move the two first positioning plates away from each other along a first preset direction so that the distance between the two first positioning plates is greater than the length of the memory module. Move the two second positioning plates away from each other along a second preset direction so that the distance between the two first positioning plates is greater than the width of the memory module. Pass the memory module through the space surrounded by the two first positioning plates and the two second positioning plates and insert a part of the structure on the memory module into the slot of the circuit board.

[0026] Step 2: Move the two first positioning plates closer to each other along the first preset direction to clamp the memory module, and move the two second positioning plates closer to each other along the second preset direction to clamp the memory module.

[0027] In an exemplary embodiment, the method for installing a memory module further includes Step 3 executed after Step 2 is completed.

[0028] Step 3: The cleaning component moves along the length direction of the memory module to clean the memory module.

[0029] Through the present application, since two first positioning plates 12 and two second positioning plates 22 are provided, the two first positioning plates are used to position the length direction of the memory module, and can adaptively clamp the memory module in the length direction according to the length of the memory module. The two second positioning plates are used to position the thickness direction of the memory module, and can adaptively clamp the memory module in the thickness direction according to the thickness of the memory module. Since the positions of the first positioning plate and the second positioning plate in this embodiment are adjustable, they can be adjusted and fixed according to memory modules of different sizes, thus solving the problem that memory modules of different sizes cannot be fixed in the server, and having a wider application range. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 is a structural diagram of a server according to an embodiment of the present application;

[0031] Figure 2 is a structural diagram of a limiting rod mechanism of a memory module fixing device according to an embodiment of the present application;

[0032] Figure 3 is a schematic structural diagram of a limit frame assembly and a first positioning plate of a memory bar fixing device according to an embodiment of the present application;

[0033] Figure 4 is a schematic diagram of the structure of the installation mechanism of the memory stick fixing device according to an embodiment of the present application;

[0034] Figure 5 is a structural diagram of a mobile frame of a memory stick fixing device according to an embodiment of the present application;

[0035] Figure 6 is a schematic structural diagram of a cleaning component of a memory stick fixing device according to an embodiment of the present application;

[0036] Figure 7 Schematic diagram of heat dissipation holes of a server according to an embodiment of the present application.

[0037] 1. Shell; 2. Circuit board; 3. Slot board; 4. Limit rod mechanism; 5. Limit frame assembly; 6. Mounting mechanism; 8. Docking frame; 9. First sliding hole; 10. Guide rod; 11. Tension spring; 12. First positioning plate; 13. Second sliding hole; 14. Support rod; 15. Block; 16. Support spring; 17. Mounting cover; 18. Slide groove; 19. Positioning screw; 20. Push spring; 21. Moving frame; 211. Inclined surface; 22. Second positioning plate; 23. Track; 24. Extrusion spring; 25. Support frame; 26. Motor; 27. Screw rod; 28. Cleaning block; 29. ​​Brush; 30. Rotating fan; 31. Heat dissipation hole; 32. Heat dissipation fan; 33. First buffer pad; 34. Second buffer pad; 35. Third buffer pad; 36. Fixed seat; 37. T-bar; 38. Limit spring; 39. Splicing groove. DETAILED DESCRIPTION

[0038] The embodiments of the present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0039] It should be noted that the terms "first", "second", etc. in the specification and claims of this application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence.

[0040] In order to solve the problem that memory bars of different sizes cannot be fixed in a server, an embodiment of the present application provides a memory bar fixing device, a server, and a memory bar installation method.

[0041] Embodiment 1

[0042] like Figure 1 and Figure 3As shown in the figure, a memory module fixing device of the present invention includes two first positioning plates 12 and two second positioning plates 22. The two first positioning plates 12 are movably arranged on both sides of the slot of the circuit board 2 along a first preset direction relatively, so as to position the memory module along the first preset direction on the circuit board 2; the two second positioning plates 22 are movably arranged on both sides of the slot of the circuit board 2 along a second preset direction relatively, so as to position the memory module along the second preset direction on the circuit board 2, wherein the first preset direction is perpendicular to the second preset direction.

[0043] The above-mentioned first preset direction is the length direction of the memory module, and the second preset direction is the thickness direction of the memory module. The two directions are perpendicular. The two first positioning plates are used to position the length direction of the memory module and can clamp the memory module adaptively in the length direction according to the length of the memory module. The two second positioning plates are used to position the thickness direction of the memory module and can clamp the memory module adaptively in the thickness direction according to the thickness of the memory module. Since the positions of the first positioning plate and the second positioning plate in this embodiment are adjustable, they can be adjusted and fixed according to memory modules of different sizes.

[0044] In order to ensure that the position of the above-mentioned first positioning plate can be adjusted, and at the same time, the memory module of different sizes can be clamped elastically or flexibly to prevent damage to the memory module. In this embodiment, the memory module fixing device further includes a first telescopic component. The first telescopic component is arranged between the two first positioning plates 12 and is respectively drivingly connected to the two first positioning plates 12 to pull the two first positioning plates 12 to move closer to each other. The first telescopic component includes a tension spring 11. The tension spring can always give a prestress to the two first positioning plates to move closer to each other after installation, so that the two first positioning plates move closer to the middle to clamp the memory module located between the two first positioning plates. Of course, a driving form of pushing from the outside of the two first positioning plates inward by a spring can also be adopted.

[0045] Since the above-mentioned first telescopic component provides a force for the two first positioning plates to move closer to each other, in order to prevent the two first positioning plates from approaching and fitting together, the memory module fixing device in this embodiment further includes a limit frame component 5. The limit frame component 5 is arranged between the two first positioning plates 12. Among them, the limit frame component 5 is used to accommodate the first telescopic component and separate the two first positioning plates 12 to prevent the two first positioning plates from fitting together.

[0046] There are two limiting frame components 5, and the two limiting frame components 5 are arranged on both sides of the slot at intervals along the second preset direction. There are two first telescopic components, and the two first telescopic components are respectively arranged in the two limiting frame components 5 and extend along the first preset direction. Among them, the limiting frame component includes a docking frame, and both ends of the docking frame are respectively used for fitting with the two first positioning plates. The docking frame is provided with a first sliding hole extending along the first preset direction, and the guide rod is slidably arranged in the first sliding hole. The first telescopic component includes: a tension spring 11 and two guide rods 10. The two guide rods 10 are respectively arranged at both ends of the tension spring 11 and are connected to the two first positioning plates 12. Specifically, guide rods are respectively arranged at both ends of the tension spring, and the guide rods are connected to the first positioning plates.

[0047] As a preferred solution, as Figure 3 , the limiting frame component 5 includes two groups of docking frames 8. First sliding holes 9 are formed on the left and right sides of the two groups of docking frames 8. Guide rods 10 are slidably connected inside the first sliding holes 9. A tension spring 11 is fixedly connected between the corresponding sides of the two groups of guide rods 10. First positioning plates 12 are respectively fixedly connected to the outer parts of the two groups of guide rods 10 on the left and the two groups of guide rods 10 on the right.

[0048] The memory module fixing device further includes a second telescopic component, and the second telescopic component is arranged on the circuit board 2. Among them, the two first positioning plates 12 are both arranged on the second telescopic component to move in a direction perpendicular to the circuit board 2 under the drive of the second telescopic component. The second telescopic component includes two support springs 16. The two support springs 16 are arranged on both sides of the slot at intervals along the first preset direction and are arranged perpendicular to the circuit board 2. The two first positioning plates 12 are correspondingly arranged on the tops of the support springs 16. Second sliding holes 13 are formed at the bottoms of the two groups of first positioning plates 12. The second sliding holes are arranged in the vertical direction. Guide rods 14 are slidably connected inside the second sliding holes 13. A clamping block 15 is fixedly connected to the bottom of the guide rod 14. A support spring 16 is fixedly connected between the first positioning plate 12 and the clamping block 15 and is located outside the guide rod 14. The support spring is used to support the first positioning plate, and the support spring is sleeved on the outside of the guide rod.

[0049] In order to prevent the first positioning plate from moving in the vertical direction, the memory module fixing device in this embodiment further includes a limiting component, and the limiting component is arranged on the circuit board 2 to stop the first positioning plate 12 from moving in the vertical direction. The memory module fixing device further includes two limiting frame components 5, and the two limiting frame components 5 are both arranged between the two first positioning plates 12 and are arranged at intervals along the second preset direction; the limiting component includes a plurality of limiting rod mechanisms 4, and the plurality of limiting rod mechanisms 4 are arranged at intervals on both sides of the two limiting frame components 5 to stop the first positioning plate 12 from moving away from the circuit board 2.

[0050] According to Figure 1In the illustrated embodiment, the limiting component includes four limiting rod mechanisms, and the four limiting rod mechanisms are respectively located outside the two limiting frame components, and two are arranged along the first preset direction respectively.

[0051] As Figure 2 shown, the limiting rod mechanism 4 includes a T-shaped rod 37, a fixed seat 36 and a limiting spring 38. The fixed seat 36 is fixed on the circuit board 2; the limiting spring 38 is arranged on the fixed seat 36 to telescopically move in a direction perpendicular to the circuit board 2; the T-shaped rod 37 is rotatably arranged on the fixed seat 36, and the limiting spring 38 is drivingly connected to the T-shaped rod 37. Among them, the T-shaped rod 37 has a stop position and an avoidance position. When the T-shaped rod 37 rotates to the stop position, the T-shaped rod 37 is connected to the limiting frame component 5 and positions and limits the limiting frame component 5 in a direction perpendicular to the circuit board 2. When the T-shaped rod 37 rotates to the avoidance position, the T-shaped rod 37 is separated from the limiting frame component 5 and moves in a direction perpendicular to the circuit board 2 under the drive of the limiting spring 38.

[0052] As a preferred solution, the top of the housing 1 is fixedly connected to the circuit board 2 by bolts. A plurality of slot plates 3 are sequentially installed on the top of the circuit board 2 from front to back. The four sides of the outside of the slot plate 3 are all rotatably connected to the limiting rod mechanism 4 through rotating blocks. The outside of the limiting rod mechanism 4 is slidably connected to the limiting frame component 5. The top of the limiting frame component 5 is fixedly connected to the mounting mechanism 6, and the bottom of the limiting frame component 5 is fixedly connected to the cleaning component.

[0053] When disassembling the memory module, the T-shaped rod 37 is rotated out from the inside of the splicing groove 39. The elastic force of the support spring 16 moves the first positioning plate 12 through the second sliding hole 13 and the support rod 14. The first positioning plate 12 moves the docking frame 8 and the mounting cover 17 through the guide rod 10, and the mounting cover 17 takes out the memory module from the inside of the slot plate 3. By moving the first positioning plates 12 on the left and right sides, the length of the limiting frame component 5 is adjusted, so that the limiting frame component 5 can adapt to memory modules of different lengths and improve the adaptability of the limiting frame component 5.

[0054] In order to adjust the distance between the two second positioning plates, the memory module fixing device further includes an adjusting component, and the adjusting component is respectively drivingly connected to the two second positioning plates 22 to clamp the memory module by driving the two second positioning plates 22 to approach each other. The adjusting component can be arranged between the two second positioning plates or on the outside of the two second positioning plates.

[0055] The memory module fixing device further includes a mounting cover 17, and the mounting cover 17 covers the upper part of the slot. Among them, the two second positioning plates 22 are both arranged inside the mounting cover 17. The adjusting component includes: two groups of extrusion springs 24, and the two groups of extrusion springs 24 are respectively arranged on the opposite sides of the two second positioning plates 22, as Figure 4As shown, each group of extrusion springs includes two extrusion springs, and the two extrusion springs are arranged at intervals along a first preset direction. One end of the extrusion spring 24 abuts against the outer side of the second positioning plate 22, and the other end of the extrusion spring 24 abuts against the inner side of the mounting cover 17. The two groups of extrusion springs 24 jointly drive the two second positioning plates 22 to move closer to each other. When it is necessary to insert a memory stick, the two second positioning plates are manually pried apart, and then after the memory stick is inserted, the second positioning plates are released. Under the action of the extrusion springs, the two second positioning plates move closer to each other to clamp the memory stick.

[0056] The memory stick fixing device also includes a mounting cover 17, which is arranged above the slot, wherein two second positioning plates 22 are arranged in the mounting cover 17, and the second positioning plates 22 are respectively provided with rails 23 extending along the first preset direction on the sides facing away from each other, and the rails 23 have a slide rail surface inclined relative to the second preset direction, such as Figure 4 and Figure 5 As shown, the adjustment component includes a moving frame 21 and a pushing spring 20, wherein the moving frame 21 is movably arranged relative to the track 23, wherein the moving frame 21 has two inclined surfaces 211 arranged relatively to each other, so that when the moving frame 21 slides relative to the track 23, the two inclined surfaces 211 are respectively in sliding contact with the two slide rail surfaces, the inclined surfaces are located on the outside of the slide rail surfaces, and the inclined directions and angles of the inclined surfaces are consistent with those of the slide rail surfaces; the pushing spring 20 is drivingly connected to the moving frame 21 to push the moving frame 21 to move along the first preset direction.

[0057] The movable frame 21 is moved inside the slide slot 18 by the elastic force of the push spring 20 , and the movable frame 21 moves the second positioning plate 22 through the track 23 , so that the memory bar is fixed inside the mounting cover 17 and the memory bar is protected.

[0058] A slide groove 18 extending along a first preset direction is provided at the top of the mounting cover 17, and the adjustment component includes a positioning screw 19, the head of the positioning screw is located on the outside of the mounting cover, and the other end of the positioning screw is arranged in the screw hole on the top of the movable frame 21, wherein the movable frame 21 is arranged in the mounting cover 17, and the positioning screw 19 is slidably arranged in the slide groove 18, and the positioning screw 19 has a locking state and a loosening state. When the positioning screw 19 is tightened and is in the locking state, the positioning screw 19 fixes the movable frame 21 and the mounting cover 17 together, and when the positioning screw 19 is loosened and is in the loosening state, the push spring 20 drives the movable frame 21 to move along the track 23.

[0059] As a preferred solution, Figure 4-5, the installation mechanism 6 includes an installation cover 17. A chute 18 is opened at the top of the installation cover 17. A positioning screw 19 is slidably connected inside the chute 18. A pushing spring 20 is fixedly connected between the outside of the positioning screw 19 and the left side of the inner surface of the chute 18. At the bottom of the positioning screw 19 and inside the installation cover 17, a moving frame 21 is fixedly connected. Second positioning plates 22 are slidably connected to the front and rear sides inside the moving frame 21. On the opposite sides of the two groups of second positioning plates 22, tracks 23 are fixedly connected. On the opposite sides of the two groups of second positioning plates 22, compression springs 24 are fixedly connected between the left and right sides of the front and rear sides of the inner surface of the installation cover 17.

[0060] As a preferred solution, as Figure 2-3 , the limiting rod mechanism 4 includes a fixed seat 36. A T-shaped rod 37 is slidably connected inside the fixed seat 36. A limiting spring 38 is sleeved outside the vertical rod of the T-shaped rod 37 and inside the fixed seat 36. Splicing grooves 39 are opened on the left and right sides of the opposite sides of the two docking frames 8. The outside of the T-shaped rod 37 is slidably connected to the inside of the splicing groove.

[0061] Pull the T-shaped rod 37 out of the fixed seat 36, and then flip the fixed seat 36 so that the outside of the T-shaped rod 37 is placed inside the splicing groove 39, and the pulling force of the limiting spring 38 fixes the positions of the two docking frames 8 through the T-shaped rod 37.

[0062] The bottom of the installation cover 17 is fixedly connected to the tops of the two docking frames 8. The rear side of the inner surface of the moving frame 21 is set as an inclined surface, and the inclined surface of the moving frame 21 is slidably connected to the inclined surface of the track 23. By pushing the positioning screw 19, the positioning screw 19 drives the moving frame 21 to move, compresses the spring 24, and pulls the moving frame 21 into the installation cover 17. Then insert the memory module into the installation cover 17 and release it. Release the positioning screw 19, and the elastic force of the pushing spring 20 moves the moving frame 21 inside the chute 18. The moving frame 21 moves the second positioning plate 22 through the track 23, so that the memory module is fixed inside the installation cover 17. In this way, the positioning screw 19 can drive the track 23 and the two groups of second positioning plates 22 to move through the moving frame 21, clamp the memory module in the installation cover 17, and protect the memory module.

[0063] As Figure 6 As shown, the memory module fixing device further includes a cleaning component. The cleaning component is movably arranged along the length direction of the slot to clean the circuit board 2 outside the slot. The cleaning component includes a brush 29. The memory module fixing device further includes a receiving frame 25 and a lead screw 27. The receiving frame 25 is arranged on the circuit board 2; the lead screw 27 is rotatably arranged on the receiving frame 25; wherein, the brush 29 is arranged on the lead screw 27 to clean the circuit board 2 under the drive of the lead screw 27.

[0064] As a preferred solution, as Figure 6, the cleaning component includes a receiving frame 25. A motor 26 is fixedly connected to the bottom of the receiving frame 25. The motor 26 is electrically connected to an external power supply (not shown in the figure) and is controlled by a control switch. The output shaft of the motor 26 is fixedly connected to a lead screw 27. A cleaning block 28 is threadedly connected to the outside of the lead screw 27. A brush 29 is fixedly connected to the outside of the cleaning block 28. A rotary fan 30 is fixedly connected to the right side of the outside of the lead screw 27.

[0065] The motor 26 drives the lead screw 27 to rotate. The lead screw 27 drives the cleaning block 28 to move through the thread. The cleaning block 28 drives the brush 29 to move, so that the brush 29 cleans the dust outside the memory module. At the same time, the lead screw 27 drives the rotary fan 30 to rotate, blowing the dust cleaned by the brush 29 away from the memory module, preventing the dust from falling on the connection between the memory module and the slot board 3, and reducing the probability of memory module failure.

[0066] The bottom of the docking frame 8 is fixedly connected to the top of the receiving frame 25.

[0067] By starting the motor 26, the motor 26 drives the lead screw 27 to rotate. The lead screw 27 drives the cleaning block 28 to move through the thread. The cleaning block 28 drives the brush 29 to move, so that the brush 29 cleans the dust outside the memory module. At the same time, the lead screw 27 drives the rotary fan 30 to rotate, blowing the dust cleaned by the brush 29 away from the memory module. In this way, the dust outside the memory module can be removed by the brush 29, preventing the dust from falling on the connection between the memory module and the slot board 3, and reducing the probability of memory module failure.

[0068] One end of the lead screw 27 is provided with a rotary fan 30. The rotary fan 30 rotates under the drive of the lead screw 27 to blow towards the circuit board 2.

[0069] The present invention is further configured as follows: First buffer pads 33 are fixedly connected to the interiors of the two groups of first positioning plates 12. Second buffer pads 34 are fixedly connected to the opposite sides of the two groups of second positioning plates 22. Third buffer pads 35 are fixedly connected to the bottoms of the two groups of clamping blocks 15.

[0070] Furthermore: The outside of the memory module is protected from damage by the first buffer pads 33, the second buffer pads 34, and the third buffer pads 35.

[0071] Embodiment Two

[0072] The present invention also provides a server, which includes a housing 1 and a circuit board 2. The circuit board 2 is arranged on the housing 1. A slot for inserting a memory module is provided on the circuit board 2. The server further includes a memory module fixing device, and the memory module fixing device is the above-mentioned memory module fixing device.

[0073] When there are multiple slots on the circuit board, the server includes multiple memory module fixing devices, and the multiple memory module fixing devices are arranged in one-to-one correspondence with the multiple slots.

[0074] As shown Figure 7 in the figure, heat dissipation holes 31 are provided on the housing 1 at the bottom of the circuit board 2, and a heat dissipation fan 32 is provided in the heat dissipation holes 31. As a preferred solution, as shown Figure 1 , heat dissipation holes 31 are opened at the top of the housing 1 and below the circuit board 2, and a heat dissipation fan 32 is fixedly connected to the inside of the heat dissipation holes 31 through a fixing block.

[0075] Embodiment 3:

[0076] The present invention also provides a method for installing a memory module. The above memory module fixing device is used to install the memory module. The method for installing the memory module includes:

[0077] Step 1: Move the two first positioning plates 12 away from each other along a first preset direction so that the distance between the two first positioning plates 12 is greater than the length of the memory module. Move the two second positioning plates 22 away from each other along a second preset direction so that the distance between the two first positioning plates 12 is greater than the width of the memory module. Pass the memory module through the space surrounded by the two first positioning plates 12 and the two second positioning plates 22 and insert a part of the structure on the memory module into the slot of the circuit board 2;

[0078] Step 2: Move the two first positioning plates 12 closer to each other along the first preset direction to clamp the memory module, and move the two second positioning plates 22 closer to each other along the second preset direction to clamp the memory module.

[0079] In this solution, the two first positioning plates and the two second positioning plates can be manually separated by an operator. After the memory module is inserted into the slot, release the hand. Then, the two first positioning plates are close to each other under the action of the first telescopic component to clamp the memory module, and the two second positioning plates are close to each other under the action of the compression spring 24 to clamp the memory module.

[0080] The method for installing the memory module further includes Step 3 executed after Step 2. Step 3: The cleaning component moves along the length direction of the memory module to clean the memory module.

[0081] The above method for automatically adapting a server memory module is specifically explained as follows:

[0082] Step 1. Memory module fixation: Move the first positioning plates 12 on the left and right sides so that the distance between the first positioning plates 12 on the left and right sides is greater than the length of the memory module. Place the memory module between the first positioning plates 12 on the left and right sides, and release the first positioning plates 12 on the left and right sides. At the same time, the elastic force of the tension spring 11 moves the support rods 14 on the left and right sides. The support rods 14 on the left and right sides drive the first positioning plates 12 on the left and right sides to clamp the left and right sides of the memory module, and clamp the memory module between the first positioning plates 12 on the left and right sides. Push the positioning screw 19, and the positioning screw 19 drives the moving frame 21 to move, compressing the spring 24 to pull the moving frame 21 into the interior of the mounting cover 17. Then, extend the memory module into the interior of the mounting cover 17 and release it. Release the positioning screw 19, and the elastic force of the spring 20 moves the moving frame 21 inside the chute 18. The moving frame 21 moves the second positioning plate 22 through the track 23 to fix the memory module inside the mounting cover 17. After the memory module is fixed, insert the memory module into the interior of the slot board 3;

[0083] Step 2. Memory installation: After the memory module is inserted into the interior of the slot board 3, pull out the T-shaped rod 37 from the interior of the fixed seat 36 and flip the fixed seat 36 so that the outside of the T-shaped rod 37 is placed inside the splicing groove 39, and the pulling force of the limit spring 38 fixes the positions of the two docking frames 8 through the T-shaped rod 37;

[0084] Step 3. Memory cleaning: After the memory module is installed, start the motor 26. The motor 26 drives the lead screw 27 to rotate. The lead screw 27 drives the cleaning block 28 to move through the thread. The cleaning block 28 drives the brush 29 to move, so that the brush 29 cleans the dust on the outside of the memory module. At the same time, the lead screw 27 drives the rotary fan 30 to rotate, and blows the dust cleaned by the brush 29 away from the memory module.

[0085] The above are only the preferred embodiments of the present application and are not used to limit the present application. For those skilled in the art, various changes and modifications can be made to the present application. Any modification, equivalent replacement, improvement, etc. made within the principle of the present application shall be included in the protection scope of the present application.

Claims

1. A memory module fixing device, characterized in that, it includes: Two first positioning plates (12), the two first positioning plates (12) are movably arranged on both sides of the slot of the circuit board (2) relatively along a first preset direction to position the memory module in the circuit board (2) along the first preset direction; Two second positioning plates (22), the two second positioning plates (22) are movably arranged on both sides of the slot of the circuit board (2) relatively along a second preset direction to position the memory module in the circuit board (2) along the second preset direction, wherein the first preset direction is perpendicular to the second preset direction; A first telescopic component, the first telescopic component is arranged between the two first positioning plates (12) and is respectively drivingly connected to the two first positioning plates (12) to pull the two first positioning plates (12) to move closer to each other; A second telescopic component, the second telescopic component is arranged on the circuit board (2), wherein the two first positioning plates (12) are both arranged on the second telescopic component to move along a direction perpendicular to the circuit board (2) under the drive of the second telescopic component; A limiting component, the limiting component is arranged on the circuit board (2) to stop the first positioning plate (12) from moving in the vertical direction; An adjusting component, the adjusting component is respectively drivingly connected to the two second positioning plates (22) to clamp the memory module by driving the two second positioning plates (22) to move closer to each other.

2. The memory module fixing device according to claim 1, characterized in that, the first telescopic component includes a tension spring (11).

3. The memory module fixing device according to claim 1, characterized in that, the memory module fixing device further includes: A limiting frame component (5), the limiting frame component (5) is arranged between the two first positioning plates (12), wherein the limiting frame component (5) is used to accommodate the first telescopic component and separate the two first positioning plates (12).

4. The memory module fixing device according to claim 3, characterized in that, there are two limiting frame components (5), the two limiting frame components (5) are arranged on both sides of the slot at intervals along the second preset direction, there are two first telescopic components, the two first telescopic components are respectively arranged in the two limiting frame components (5) and extend along the first preset direction, wherein the first telescopic component includes: a tension spring (11) and two guide rods (10), the two guide rods (10) are respectively arranged at both ends of the tension spring (11) and are connected to the two first positioning plates (12).

5. The memory module fixing device according to claim 1, characterized in that, the second telescopic component includes two support springs (16), the two support springs (16) are arranged on both sides of the slot at intervals along the first preset direction and are perpendicular to the circuit board (2), and the two first positioning plates (12) are correspondingly arranged on the tops of the support springs (16).

6. The memory module fixing device according to claim 1, characterized in that, the memory module fixing device further includes two limiting frame assemblies (5), and the two limiting frame assemblies (5) are both arranged between the two first positioning plates (12) and are spaced along the second preset direction; the limiting component includes a plurality of limiting rod mechanisms (4), and the plurality of limiting rod mechanisms (4) are spaced on both sides of the two limiting frame assemblies (5) to stop the first positioning plate (12) from moving away from the circuit board (2).

7. The memory module fixing device according to claim 6, characterized in that, the limiting rod mechanism (4) includes: a fixed seat (36), and the fixed seat (36) is fixed on the circuit board (2); a limiting spring (38), and the limiting spring (38) is arranged on the fixed seat (36) to move telescopically in a direction perpendicular to the circuit board (2); a T-shaped rod (37), the T-shaped rod (37) is rotatably arranged on the fixed seat (36), and the limiting spring (38) is drivingly connected to the T-shaped rod (37), wherein the T-shaped rod (37) has a stop position and an avoidance position. When the T-shaped rod (37) rotates to the stop position, the T-shaped rod (37) is connected to the limiting frame assembly (5) and positions the limiting frame assembly (5) in a direction perpendicular to the circuit board (2). When the T-shaped rod (37) rotates to the avoidance position, the T-shaped rod (37) is separated from the limiting frame assembly (5) and moves in a direction perpendicular to the circuit board (2) under the drive of the limiting spring (38).

8. The memory module fixing device according to claim 1, characterized in that, the memory module fixing device further includes an installation cover (17), and the installation cover (17) covers the upper part of the slot. Among them, the two second positioning plates (22) are both arranged in the installation cover (17), and the adjusting component includes: two groups of extrusion springs (24), and the two groups of extrusion springs (24) are respectively arranged on the opposite sides of the two second positioning plates (22). Among them, one end of the extrusion spring (24) abuts against the second positioning plate (22), and the other end of the extrusion spring (24) abuts against the installation cover (17). The two groups of extrusion springs (24) jointly drive the two second positioning plates (22) to move closer to each other.

9. The memory module fixing device according to claim 1, characterized in that, the memory module fixing device further includes an installation cover (17), and the installation cover (17) covers the upper part of the slot. Among them, the two second positioning plates (22) are both arranged in the installation cover (17), and tracks (23) extending along the first preset direction are respectively arranged on the opposite sides of the second positioning plates (22). The tracks (23) have sliding rail surfaces inclined relative to the second preset direction, and the adjusting component includes: A moving frame (21), the moving frame (21) is movably arranged relative to the track (23), wherein the moving frame (21) has two inclined surfaces (211) arranged oppositely, so that when the moving frame (21) slides relative to the track (23), the two inclined surfaces (211) are respectively in sliding contact with the two slide rail surfaces; A pushing spring (20), the pushing spring (20) is drivingly connected to the moving frame (21) to push the moving frame (21) to move along the first preset direction.

10. The memory module fixing device according to claim 9, wherein, a chute (18) extending along the first preset direction is provided at the top of the mounting cover (17), and the adjusting assembly includes: a positioning screw (19), the positioning screw (19) is arranged on the moving frame (21), wherein the moving frame (21) is arranged in the mounting cover (17), the positioning screw (19) is slidably arranged in the chute (18), the positioning screw (19) has a locking state and a loosening state, when the positioning screw (19) is tightened to be in the locking state, the positioning screw (19) fixes the moving frame (21) and the mounting cover (17) together, when the positioning screw (19) is loosened to be in the loosening state, the pushing spring (20) drives the moving frame (21) to move along the track (23).

11. The memory module fixing device according to claim 1, wherein, the memory module fixing device further includes: a cleaning assembly, the cleaning assembly is movably arranged along the length direction of the slot to clean the circuit board (2) outside the slot.

12. The memory module fixing device according to claim 11, wherein, the cleaning assembly includes a brush (29), and the memory module fixing device further includes: a receiving frame (25), the receiving frame (25) is arranged on the circuit board (2); a lead screw (27), the lead screw (27) is rotatably arranged on the receiving frame (25); wherein, the brush (29) is arranged on the lead screw (27) to clean the circuit board (2) under the drive of the lead screw (27).

13. The memory module fixing device according to claim 12, wherein, a rotary fan (30) is arranged at one end of the lead screw (27), and the rotary fan (30) rotates under the drive of the lead screw (27) to blow air towards the circuit board (2).

14. A server, including: a housing (1) and a circuit board (2), the circuit board (2) is arranged on the housing (1), and a slot for inserting a memory module is provided on the circuit board (2), wherein the server further includes a memory module fixing device, and the memory module fixing device is the memory module fixing device according to any one of claims 1 to 13.

15. The server according to claim 14, wherein, The housing (1) at the bottom of the circuit board (2) is provided with heat dissipation holes (31), and a heat dissipation fan (32) is arranged in the heat dissipation holes (31).

16. A method for installing a memory module, characterized in that, the memory module is installed by using the memory module fixing device according to any one of claims 1 to 13, and the method for installing the memory module includes: Step 1: Move the two first positioning plates (12) away from each other along a first preset direction so that the distance between the two first positioning plates (12) is greater than the length of the memory module, move the two second positioning plates (22) away from each other along a second preset direction so that the distance between the two first positioning plates (12) is greater than the width of the memory module, pass the memory module through the space surrounded by the two first positioning plates (12) and the two second positioning plates (22), and insert a part of the structure on the memory module into the slot of the circuit board (2); Step 2: Move the two first positioning plates (12) closer to each other along the first preset direction to clamp the memory module, and move the two second positioning plates (22) closer to each other along the second preset direction to clamp the memory module.

17. The method for installing a memory module according to claim 16, characterized in that, the method for installing the memory module further includes Step 3 executed after the execution of Step 2, Step 3: The cleaning component moves along the length direction of the memory module to clean the memory module.

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