Semiconductor package testing apparatus

Abstract

The semiconductor package testing device of the present invention is used for testing package stack type semiconductor packages, which comprises: an upper socket mounted on a pusher, loading an upper package and being coupled with a lower package placed on the lower side; a lower socket loaded on a tester and coupled with the above-mentioned lower package placed on the upper side; and an adsorption pad movably combined with the above-mentioned pusher, capable of adsorbing the above-mentioned lower package and pressurizing the above-mentioned lower package by receiving vacuum pressure through the above-mentioned pusher, the above-mentioned adsorption pad comprising: a main body part made of silicon material, formed with a vacuum hole; and an adsorption part having a diameter larger than the above-mentioned main body part, formed with an adsorption hole at a position corresponding to the above-mentioned vacuum hole, the above-mentioned adsorption part made of one of polyimide film, engineering plastic or synthetic resin, the above-mentioned main body part attached to the center of the upper surface of the above-mentioned adsorption part, an outer side oil-proof part formed on the outer side periphery for blocking silicon oil dissolved from the above-mentioned main body part.

Description

Technical Field

[0001] This invention relates to the testing of semiconductor packages, and more specifically, to a semiconductor package testing apparatus for checking whether a stacked package type (POP) semiconductor package, which is composed of a lower package and a upper package stacked on top of each other, is functioning properly. Background Technology

[0002] Semiconductor packages are composed of densely integrated, tiny electronic circuits. During the manufacturing process, testing procedures are performed to determine whether each electronic circuit is functioning correctly. These testing procedures are used to screen out high-quality and defective semiconductor packages based on their functionality.

[0003] In the testing process of semiconductor packages, a test apparatus is used to electrically connect the terminals of the semiconductor package to a tester used to apply test signals. The test apparatus has various structures depending on the type of semiconductor package being tested.

[0004] Recently, with the increasing use of stacked package (POP) semiconductor packages that minimize component size and enable rapid signal transmission, the demand for test equipment for testing such semiconductor packages has also gradually increased.

[0005] like Figure 1 As shown, a conventional test apparatus 100 for testing multilayer semiconductor packages includes: a lower test port 40 and an upper test port 60 for transmitting electrical signals; and a pusher 50 connected to the upper test port. An adsorption pad 70 is formed on the pusher and is movably connected to it, receiving vacuum pressure from an external vacuum device via the pusher. The lower test port 40 is disposed on the tester 30 to achieve electrical connection with the lower package 10, and the upper package 20 is mounted on top of the upper test port to achieve electrical connection with the upper test port 60. In this testing apparatus, after the suction pad 70 of the pusher 50 is lowered and the lower package 10 to be inspected is placed on the upper part of the lower test socket 40, the lower package 10 is further lowered and pressure is applied to the lower package 10 so that the second conductive part 61 of the upper test socket 60 is connected to the upper terminal 12 of the lower package 10. Thus, the tester 30, the lower test socket 40, the lower package 10, the upper test socket 60 and the upper package 20 are electrically connected to perform an electrical test.

[0006] Typically, in existing semiconductor package testing equipment, after the picker picks up the semiconductor package to be inspected and places it on the test socket, the picker moves to pick up other semiconductor packages, while the pusher performs electrical testing by pushing the semiconductor packages positioned on the test socket. That is, in existing conventional semiconductor package testing equipment, because the picker and pusher operate separately, and the picker only performs the pick and place function, the picker only picks up semiconductor packages for a short period of time.

[0007] In contrast, in test apparatuses used to test stacked semiconductor packages, the pick-up device and the pusher are integrated. The pick-up device's suction pads simultaneously perform the functions of picking up and placing the semiconductor package to be inspected, as well as pushing it. Therefore, the suction pads of the pick-up device have a structure that allows for long-term contact with the semiconductor package. In particular, in the case of reliability testing, the suction pads maintain contact with the lower package for 1 to 2 weeks.

[0008] In test apparatuses used for testing multilayer semiconductor packages, the adsorption pad 70 is made of silicon to protect the semiconductor package and improve vacuum adsorption performance. However, due to the properties of silicon, a sticky adhesion phenomenon occurs where the lower semiconductor package adheres to the adsorption pad. To prevent this sticky adhesion phenomenon, methods have been used to apply an anti-electrostatic coating or a special coating to the surface of the adsorption pad that is in close contact with the semiconductor package; however, these methods have not been able to improve the sticky adhesion phenomenon.

[0009] Recently, such as Figure 3 As shown in part (a), an adsorption part 720 is formed on the lower part of the main body 710 of the adsorption pad 70 attached to the semiconductor package 10 by an anti-adhesion member made of a material selected from polyimide film, engineering plastic or synthetic resin. Adhesive positioning phenomenon is prevented by attaching the adsorption part 720 formed by the anti-adhesion member to the main body 710.

[0010] However, in test apparatuses used to test the long-term connection between the adsorption pad 70 and the lower package in stacked semiconductor packages, such as Figure 3As shown in the (b) part of FIG. 1, since the main body part 710 of the adsorption pad 70 is in a state of being compressed by the vacuum pressure for a long time, silicon oil dissolved from the main body part made of silicon will flow along the side of the main body part 710 and the vacuum hole 711 as shown by the arrow A, and the flowed silicon oil will flow into between the adsorption pad and the lower semiconductor package, so that the silicon oil will be accumulated between the adsorption part 720 of the adsorption pad 70 and the lower semiconductor package 10 (S indicates an example of silicon oil accumulation), and further, the phenomenon of the adsorption pad 70 and the lower semiconductor package 10 being adhered to each other will frequently occur.

[0011] Prior Art Documents

[0012] Patent Documents

[0013] Patent Document 0001: Japanese Patent Laid-Open Publication No. 2015-0106848 (September 22, 2015)

[0014] Patent Document 0002: Korean Patent Registration No. 10-1555965 (September 25, 2015) SUMMARY

[0015] The present invention has been made in consideration of the above-mentioned problems, and the object of the present invention is to provide a semiconductor package testing apparatus capable of precisely testing a package-on-package (POP) semiconductor package operating at a high speed.

[0016] Further, another object of the present invention is to provide a semiconductor package testing apparatus capable of completely preventing the phenomenon of the semiconductor package being adhered to the adsorption pad.

[0017] In order to achieve the above-mentioned object, the semiconductor package testing apparatus of the present invention for testing a package-on-package (POP) semiconductor package can include: an upper socket mounted to a pusher, loading an upper package and coupled with a lower package placed on a lower side; a lower socket loaded to a tester and coupled with the lower package placed on an upper side; and an adsorption pad coupled with the pusher in a movable manner, adsorbing the lower package by receiving a vacuum pressure from the pusher and pressurizing the lower package, the adsorption pad including: a main body part made of a silicon material, formed with a vacuum hole; and an adsorption part having a diameter greater than that of the main body part, formed with an adsorption hole at a position corresponding to the vacuum hole, the adsorption part made of one of a polyimide film, an engineering plastic, or a synthetic resin, the main body part attached to a center of an upper surface of the adsorption part, an outer side oil blocking part formed around an outer side of the adsorption part for blocking silicon oil dissolved from the main body part.

[0018] The adsorption hole has a diameter smaller than that of the vacuum hole, and an inner side oil blocking part surrounding the adsorption hole is formed around an inner side of the upper surface of the adsorption part.

[0019] The outer oil-proof portion or the inner oil-proof portion can have a fence shape.

[0020] The outer oil-proof portion or the inner oil-proof portion can be made of one of silicon, polyimide film, engineering plastic, or synthetic resin.

[0021] The outer oil-proof portion or the inner oil-proof portion can have a thickness less than that of the adsorption portion.

[0022] The outer oil-proof portion or the inner oil-proof portion can have a groove shape formed by etching a portion of the adsorption portion.

[0023] The upper portion can have a plurality of conductive portions formed therein, and the conductive portions can include a plurality of conductive particles in an elastic insulating material.

[0024] The conductive portions can be supported by a non-elastic insulating pad made of a non-elastic insulating material.

[0025] In the semiconductor package testing apparatus, an adsorption portion of an adsorption pad for adsorbing a lower package is formed using an anti-adhesion material, and an oil-proof portion is additionally formed along an outer side or an inner side of the adsorption portion to block silicon oil dissolved from a main body portion, thereby completely preventing a tacky positioning phenomenon of a lower package that has completed inspection from being adhered to the adsorption pad.

[0026] In the semiconductor package testing apparatus according to an embodiment of the present application, when testing a package-on-package semiconductor package, since the semiconductor package is not adhered to the adsorption pad, the semiconductor package that has completed inspection can be easily positioned in a loading device after testing, thereby effectively performing an overall testing process. BRIEF DESCRIPTION OF DRAWINGS

[0027] Figure 1 A package-on-package semiconductor package testing apparatus is briefly shown.

[0028] Figure 2 An effect of a package-on-package semiconductor package testing apparatus is explained.

[0029] Figure 3 A diagram showing a tacky positioning phenomenon caused by silicon dissolved from an adsorption pad in a package-on-package semiconductor package testing apparatus.

[0030] Figure 4 An adsorption pad according to an embodiment of the present application having an oil-proof portion for blocking oil flow is shown.

[0031] Figure 5 Various modified examples of an adsorption pad according to an embodiment of the present application having an oil-proof portion are shown. DETAILED DESCRIPTION

[0032] Hereinafter, a semiconductor package testing device according to the present application will be described in detail with reference to the accompanying drawings.

[0033] Figure 1 Briefly illustrating a package-on-package semiconductor package testing device, Figure 2 for explaining the role of a package-on-package semiconductor package testing device, Figure 3 for showing a package-on-package semiconductor package testing device in which a sticky positioning phenomenon occurs due to silicon elution from an adsorption pad, Figure 4 illustrating an adsorption pad according to an embodiment of the present application, which is formed with an oil blocking portion for blocking oil flow, Figure 5 illustrating various modified examples of an adsorption pad according to an embodiment of the present application, which is formed with an oil blocking portion.

[0034] As Figure 1 shown, a package-on-package semiconductor package testing device 100 is a device for testing a package-on-package (POP) semiconductor package in which a lower package 10 is inspected using an upper package 20 that is pre-selected as a high-quality product, and can function as a dielectric between a tester 30 that generates a test signal and the package-on-package semiconductor package.

[0035] The semiconductor package testing device 100 includes a lower socket 40 installed in the tester 30, a socket housing 111 and a guide housing 120 in which the lower socket 40 is installed, a pusher 50 loaded with an upper socket 60 and capable of moving by receiving a moving force from a driving portion (not shown), the upper socket 60 combined with the pusher 50, and an adsorption pad 70 movably combined with the pusher 50 and capable of adsorbing the lower package 10.

[0036] The lower socket 40 is loaded in the tester 30 so that the tester 30 and the lower package 10 located on the upper side are electrically connected. The lower socket 40 is disposed in the socket housing 111 and includes a first conductive portion 41 and an insulating portion 42.

[0037] In the first conductive portion 41, conductive particles can be arranged in an elastic insulating material, or the first conductive portion 41 can be a spring pin type in which a spring is built in.

[0038] The pusher 50 can move by receiving a moving force from a driving portion to approach or move away from the lower socket 40. The pusher 50 includes a cavity 52 for receiving the upper package 20 and a vacuum passage 51 for transmitting vacuum pressure on the inner side. The vacuum passage 51 is connected to an external vacuum pressure generating device (not shown) and can transmit vacuum pressure generated from the vacuum pressure generating device to the adsorption pad 70.

[0039] The upper socket 60 is coupled to one side of the pusher 50 in a sealable cavity 52. ​​The upper socket 60 houses an upper package 20 (which may be a pre-selected high-quality package) placed in the cavity 52, which is electrically connected to the lower package 10 placed below during testing. The upper socket 60 includes an insulating pad 62 for covering the cavity 52; and a plurality of second conductive portions 61 supported by the insulating pad 62.

[0040] The insulating pad 62 can be made of a non-elastic insulating material. When the upper socket 60 is connected to the lower package 10, the non-elastic insulating pad 62 facilitates pressure application to the lower package 10 towards the lower socket 40. If the non-elastic insulating pad 62 stably applies pressure to the lower package 10, the lower terminal 11 of the lower package 10 can be stably connected to the first conductive portion 41 of the lower socket 40. Polyimide, engineering plastics, or various other non-elastic insulating materials can be used as this non-elastic insulating material.

[0041] An insulating pad hole 63 is formed in the insulating pad 62. The insulating pad hole 63 is connected to the vacuum passage 51 of the cavity 52 so as to transmit the vacuum pressure of the cavity 52.

[0042] The second conductive portion 61 extends through the insulating pad 62 along its thickness direction and is supported by the non-elastic insulating pad 62. The second conductive portion 61 may include multiple conductive particles within the elastic insulating material.

[0043] As the vacuum pressure generating device operates, the vacuum pressure or release pressure is transmitted to the adsorption pad 70 through the vacuum passage 51, the cavity 52, and the insulating pad hole 63. While maintaining the vacuum state, the adsorption pad 70 descends and adsorbs the lower package 10, which is the object to be inspected. The lower package 10, which has completed the inspection, can be positioned on the loading device (not shown) by further descending and pressurizing or releasing the vacuum state.

[0044] Figure 2 This is used to illustrate the function of a test device for stacked semiconductor packages.

[0045] like Figure 2 As shown in part (a), as the pusher 50 moves through the drive unit, the adsorption pad 70 descends and adsorbs the lower package 10. The adsorption pad 70 then moves the adsorbed lower package 10 above the lower socket 40 so that the lower terminal 11 of the lower package 10 comes into contact with the first conductive part 41 of the lower socket 40.

[0046] Next, as Figure 2When the pusher 50 is moved to the lower socket 40 side, the lower terminal 11 of the lower package 10 is coupled to the first conductive part 41 of the lower socket 40 due to the further lowering of the suction pad 70 and the pressure applied to the lower package 10, and the second conductive part 61 of the upper socket 60 is coupled to the upper terminal 12 of the lower package 10 as the pusher 50 is moved. In this case, the test signal generated from the tester 30 is transmitted to the lower package 10 and the upper package 20 as the pressure of the pusher 50 is transmitted to the lower package 10 through the upper socket 60, thereby performing an electrical test on whether the lower package 10 normally operates or the lower package 10 and the upper package 20 are normally integrated.

[0047] After the test is completed, the suction pad 70 of the vacuum pick-up is raised, and the lower package 10 sucked by the suction pad 70 is unloaded from the lower socket 40 and transferred to a loading device (not shown) as the pusher 50 is moved.

[0048] As described above, in a package-on-package (POP) semiconductor package test device for testing an upper package and a lower package, the suction pad 70 can perform a function of pushing the semiconductor package to the silicone socket in addition to a function of picking and placing the semiconductor package, and thus has a structure of contacting the lower semiconductor package for a long time. In particular, in the case of a reliability test, the present application has been developed to solve a problem in which the lower semiconductor package is adhered to the suction pad 70 due to silicone oil dissolved from the suction pad 70 during a time in which the suction pad 70 and the lower package maintain a contact state for 1 to 2 weeks, thereby failing to normally place the semiconductor package, for which the inspection is completed, to a loading device.

[0049] Figure 4 An embodiment of the present application in which a suction pad in which an oil preventing part is formed is shown. Figure 5 Various modifications of a suction pad in which an oil preventing part is formed according to an embodiment of the present application are shown. The suction pad of the present application is indicated by reference numeral 700.

[0050] As shown in the drawing, the adsorption pad 700 of one embodiment of the present application includes a main body 710 made of silicon material and formed with a vacuum hole 711, and an adsorption portion 720 having a diameter greater than that of the main body 710 and formed with an adsorption hole 721 at a position corresponding to the vacuum hole 711, the adsorption portion being made of one of polyimide film, engineering plastic or synthetic resin, and the main body 710 being attached to the center of the upper surface of the adsorption portion 720, and an outer oil-proof portion 730 being formed around the outer periphery of the upper surface of the adsorption portion 720 not attached with the main body 710 for blocking silicon oil S dissolved from the main body 710.

[0051] The main body 710 forms the main body of the adsorption pad 700 and is formed with the vacuum hole 711 in the center. Vacuum pressure or release pressure provided by the operation of the vacuum pressure generating device is transmitted to the vacuum hole 711 through the vacuum passage 51 of the pusher, the cavity 52 and the insulating pad 63. The main body 710 is made of silicon material to improve the vacuum adsorption performance.

[0052] The adsorption portion 720 is formed in a portion directly contacting the semiconductor package and can be made of hard anti-adhesion material such as polyimide film, engineering plastic or synthetic resin. Since the portion of the adsorption pad 700 directly contacting the semiconductor package is made of anti-adhesion material, the semiconductor package can be prevented from being adhered to the adsorption pad 700 to some extent.

[0053] The adsorption hole 721 is formed in the adsorption portion 720 at a position corresponding to the vacuum hole 711 of the main body 710. The semiconductor package is adsorbed by vacuum pressure transmitted through the adsorption hole 721 in communication with the vacuum hole 711.

[0054] The adsorption portion 720 can have a diameter greater than that of the main body 710 and the main body 710 is attached to the center of the upper surface of the adsorption portion 720, and the outer oil-proof portion 730 is formed around the outer periphery of the upper surface of the adsorption portion 720 not attached with the main body 710 for blocking silicon oil dissolved from the outer side of the main body 710.

[0055] The main body 710 is made of silicon material and has a structure such that when the semiconductor package is adsorbed and pressurized, the main body 710 of the adsorption pad 700 is in a compressed state due to vacuum pressure, and in this compressed state, silicon oil can be dissolved only due to the characteristics of silicon material.

[0056] Further, in the case of the encapsulation stack type semiconductor package testing device, in the case where the adsorption pad 700 is in a squeezed state due to long time adsorption and pressure applied to the semiconductor package, although the amount of silicon oil dissolved from the main body part 710 of the adsorption pad 700 increases, in the present application, since the outer side oil blocking part 730 for blocking silicon oil is formed around the outer side of the adsorption part 720, the problem that the semiconductor package is adhered to the adsorption pad 700 due to the movement of silicon oil to the lower surface of the adsorption part 720, thereby failing to unload the semiconductor package which has completed inspection, can be solved.

[0057] Further, as shown in (c) of FIG. 7, the adsorption hole 721 has a diameter smaller than that of the vacuum hole 711, and a part of the upper surface of the adsorption part 720 is left at the boundary surface of the vacuum hole 711 and the adsorption hole 721, and an inner side oil blocking part 731 surrounding the adsorption hole can be formed around the inner side of the left part of the upper surface of the adsorption part 720. Figure 4

[0058] The inner side oil blocking part 731 blocks silicon oil dissolved along the inner side of the main body part 710, i.e., silicon oil dissolved from the vacuum hole 711.

[0059] The outer side oil blocking part 730 and the inner side oil blocking part 731 are formed along the outer side edge and the inner side edge of the upper surface of the adsorption part 720, and have a structure capable of blocking silicon oil dissolved from the outer side and the inner side of the main body part 710.

[0060] The outer side oil blocking part 730 or the inner side oil blocking part 731 can have a fence shape. As shown in (a) of FIG. 7, (c) of FIG. 7, it can have a shape surrounded by a fence having a triangular cross section, or as shown in (a) of FIG. 7, it can have a shape surrounded by a fence having a quadrangular cross section, or as shown in (b) of FIG. 7, it can have a shape surrounded by a fence having a circular cross section, in addition to the fence shape having various cross sectional shapes. Figure 4 Figure 5 Figure 5 Figure 4 (b) of FIG. 7 is a perspective view of (a) of FIG. 7. Figure 4

[0061] Further, preferably, the thickness of the outer side oil blocking part 730 and the inner side oil blocking part 731 should be smaller than the thickness of the adsorption part 720.

[0062] Further, the outer side oil blocking part 730 or the inner side oil blocking part 731 can be made of one material selected from silicon, polyimide film, engineering plastic, and synthetic resin. The outer side oil blocking part 730 or the inner side oil blocking part 731 is not a part to be squeezed by vacuum pressure, and thus does not dissolve silicon oil, and thus the outer side oil blocking part 730 or the inner side oil blocking part 731 can also be made of a silicon material.

[0063] ​​​​​Also, the outer oil-proof portion 730 and the inner oil-proof portion 731 can be a groove shape etched as a part of the adsorption portion 720. As shown in (c) of FIG. 7, the cross section of the groove shape can be a quadrangle, or, as shown in (d) of FIG. 7, the cross section can be a triangle, and in addition thereto, various cross-sectional shapes can be possible. The groove shape can be etched by a laser or a cutting tool. Figure 5 Figure 5

[0064] Figure 4 (d) of FIG. 7 is an explanatory diagram showing an embodiment of the present application in which the outer oil-proof portion 730 and the inner oil-proof portion 731 are formed in the adsorption pad 700 to prevent the outflow of the silicone oil dissolved from the main body portion 710 to the outside of the adsorption portion 720. "A" shown in the drawing indicates the flow direction of the silicone oil.

[0065] The silicone oil dissolved from the outside of the main body portion 710 of the adsorption pad 700 is blocked by the outer oil-proof portion 730, and the silicone oil dissolved from the inside of the main body portion 710 is blocked by the inner oil-proof portion 731.

[0066] In a package-on-package (POP) semiconductor package test device for testing an upper package and a lower package, the adsorption pad 700 can perform the function of pushing the semiconductor package into the silicone rubber socket in addition to the function of picking up and placing the semiconductor package, and has a structure of pressing the semiconductor package for a long time when the test is performed, and thus, even in the adsorption pad 700 in which the adsorption portion 720 formed of an anti-adhesion member is attached to the lower end of the main body portion 710 having an elastic material such as silicone, it is possible that the phenomenon of sticky positioning in which the semiconductor package is adhered to the adsorption portion 720 of the adsorption pad 700 occurs due to the silicone oil dissolved from the main body portion 710 of the adsorption pad 700 being accumulated at the lower end of the adsorption portion 720, but, in the present application, the oil dissolved from the main body portion 710 of the adsorption pad 700 can be blocked by additionally forming the oil-proof portion, and thus, the phenomenon of sticky positioning in which the semiconductor package is adhered to the adsorption pad 700 can be completely prevented.

[0067] As described above, the semiconductor package test device 100 of an embodiment of the present application forms the adsorption portion 720 of the adsorption pad 700 for adsorbing the lower package 10 using an anti-adhesion material, and additionally forms the oil-proof portion along the outside or the inside of the adsorption portion 720 to block the silicone oil dissolved from the main body portion 710, and thus, the phenomenon of sticky positioning in which the lower package 10, which has completed the inspection, is adhered to the adsorption pad 700 can be completely prevented.

[0068] ​​Also, the semiconductor package testing apparatus 100 of one embodiment of the present application has the effect that, when testing a package-on-package semiconductor package, since the semiconductor package is not adhered to the suction pad, the semiconductor package that has completed the test can be easily positioned in the loading device after the test is completed, so that the overall testing process can be efficiently performed.

[0069] While the present application has been shown and described in connection with the preferred embodiments thereof, it will be apparent to those skilled in the art that modifications can be made thereto without departing from the intended scope of the application.

Claims

1. A semiconductor package testing apparatus for testing a package-on-package semiconductor package, comprising: The semiconductor package testing apparatus includes an upper socket mounted on a pusher to load an upper package and coupled with a lower package placed on a lower side, a lower socket loaded on a tester to be coupled with the lower package placed on an upper side, and an adsorption pad coupled with the pusher in a movable manner to adsorb and pressurize the lower package by receiving a vacuum pressure of the pusher, wherein the semiconductor package testing apparatus is characterized in that The adsorption pad includes: a main body part made of a silicon material and formed with a vacuum hole; and an adsorption part having a diameter greater than that of the main body part and formed with an adsorption hole at a position corresponding to the vacuum hole, the adsorption part being made of one of a polyimide film, an engineering plastic, or a synthetic resin, a center of an upper surface of the adsorption part is attached with the main body part, and an outer side oil-proof part is formed around an outer side of the adsorption part to block silicon oil dissolved from the main body part.

2. The semiconductor package testing apparatus of claim 1, wherein The adsorption hole has a diameter smaller than that of the vacuum hole, and an inner side oil-proof part surrounding the adsorption hole is formed around an inner side of the upper surface of the adsorption part.

3. The semiconductor package testing apparatus according to claim 1 or 2, wherein The outer side oil-proof part or the inner side oil-proof part has a fence shape.

4. The semiconductor package testing apparatus of claim 3, wherein The outer side oil-proof part or the inner side oil-proof part is made of one of silicon, a polyimide film, an engineering plastic, or a synthetic resin.

5. The semiconductor package testing apparatus of claim 3, wherein A thickness of the outer side oil-proof part or the inner side oil-proof part is smaller than a thickness of the adsorption part.

6. The semiconductor package testing apparatus according to claim 1 or 2, wherein The outer side oil-proof part or the inner side oil-proof part has a groove shape in which a portion of the adsorption part is etched.

7. The semiconductor package testing apparatus of claim 1, wherein A plurality of conductive parts are formed in the upper socket, and the conductive parts include a plurality of conductive particles in an elastic insulating material.

8. The semiconductor package testing apparatus of claim 7, wherein The conductive parts are supported by a non-elastic insulating pad made of a non-elastic insulating material.

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